| 10th week of 2009 patent applcation highlights part 20 |
| Patent application number | Title | Published |
|---|
| 20090057889 | Semiconductor Device Having Wafer Level Chip Scale Packaging Substrate Decoupling - One aspect of the invention provides a semiconductor device that includes a microchip having an outermost surface. First and second bond pads are located on the microchip and near the outermost surface. A first UBM contact is located on the outermost surface and between the first and second bond pads. The first UBM contact is offset from the first bond pad. A second UBM contact is located on the outermost surface and between the first and second bond pads. The second UBM contact is offset from the second bond pad, and a capacitor supported by the microchip is located between the first and second UBM contacts. | 2009-03-05 |
| 20090057890 | SEMICONDUCTOR DEVICE - In this semiconductor device, connection parts between wafers are electrically insulated from each other, and a junction face shape of second electrical signal connection parts is larger than the shape of a positioning margin face that is formed by an outer shape when the periphery of a minimum junction face, which has half the area of a junction area of the first electrical signal connection part, is enclosed by a same width dimension as a positioning margin dimension between the first wafer and the second wafer. | 2009-03-05 |
| 20090057891 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a supporting base whereupon an electrode terminal is placed; an intermediate member mounted on said supporting base; a semiconductor element, a portion thereof being supported with said intermediate member, and placed on said supporting base; and a convex-shaped member which corresponds to the electrode terminal of said semiconductor element and placed on said supporting base or said intermediate member; wherein the electrode terminal of said semiconductor element and the electrode terminal of said supporting base are connected with a bonding wire. | 2009-03-05 |
| 20090057892 | ELECTRODE STRUCTURE IN SEMICONDUCTOR DEVICE AND RELATED TECHNOLOGY - A first insulation film having a first opening is provided on an electrode pad of a semiconductor chip. A second insulation film having a second opening is provided on the first insulation film. A ground metallic layer which is to be in contact with the electrode pad via the first opening is provided on the first insulation film. A bump which is to be mechanically and electrically connected to the ground metallic layer is provided. Further, the above placement is made in a way that the ground metallic layer is provided in the second opening, and the ground metallic layer is provided on an inner side than an outer periphery of the electrode pad, covering the first opening. | 2009-03-05 |
| 20090057893 | Semiconductor apparatus - In order to solve a problem of occurrence of delamination of interlayer film due to occurrence of a crack in an LSI wiring layer in a UBM lower layer immediately under a solder bump in an outer periphery of an LSI chip, a semiconductor apparatus of the present invention includes a stress boundary between compressive stress and tensile stress in an LSI wiring layer of a bump lower layer and in order to alleviate the stress present in the bump lower layer tensile stress material is arranged on a compressive stress side or compressive stress material is arranged on a tensile stress side with a stress boundary of the LSI wiring layer as a boundary. | 2009-03-05 |
| 20090057894 | Structure of Gold Bumps and Gold Conductors on one IC Die and Methods of Manufacturing the Structures - A method for fabricating multiple metal layers includes the following steps. An electronic component is provided with multiple contact points. A first metal layer is deposited over said electronic component. A first mask layer is deposited over said first metal layer. A second metal layer is deposited over said first metal layer exposed by an opening in said first mask layer. Said first mask layer is removed. A second mask layer is deposited over said second metal layer. A third metal layer is deposited over said second metal layer exposed by an opening in said second mask layer. Said second mask layer is removed. Said first metal layer not covered by said second metal layer is removed. | 2009-03-05 |
| 20090057895 | POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING PROCESS FOR SAME - A post passivation rerouting support structure comprises a relatively thin support layer above the passivation layer to support the RDL, and a relatively thick support layer for fine pitch interconnects extending from the RDL and terminating as contact structures at the surface of the thick support layer, for a next level packaging structure. The thick support layer is planarized before defining the contact structures. The thick support layer may be formed after the conducting posts have been formed, or the thick support layer is formed before forming the conducting posts in vias formed in the thick support layer. An encapsulating layer may be provided above the thick support layer, which top surface is planarized before defining the contact structures. The encapsulating layer and the further support layer may be the same layer. | 2009-03-05 |
| 20090057896 | Nail-Shaped Pillar for Wafer-Level Chip-Scale Packaging - A wafer-level chip-scale packaging feature for a semiconductor device is disclosed which has a substrate, a plurality of nail-shaped conducting posts extending from a surface of the substrate, and a plurality of solder balls, where each of the solder balls is connected to one of the nail-shaped conducting posts. When a different-sized solder ball is desired for use, the device can be re-processed by only removing and replacing the cross-members of the nail-shaped conducting posts, which cuts down on the re-processing expense. | 2009-03-05 |
| 20090057897 | High strength solder joint formation method for wafer level packages and flip applications - A Micro SMDxt package is provided that configured for mounting to a circuit board. The SMDxt package includes a silicon-based IC having an array of contact pads on one side of thereof, and a die electrically attached to the silicon-based IC. A plurality of solder balls is included, each of which has a polymeric core surrounded by a metallic shell that in turn is surrounded by a layer of solder material. Further, each solder ball is positioned in contact with a corresponding contact pad of the package. An intertwined intermetallic fusion layer is formed through the fusion between material components of the contact pads and the solder material, via heat treatment. The intermetallic fusion extends between and from an outer surface of the metallic shell of each solder to an outer surface of a corresponding contact pad to form a high strength intermetallic solder joint therebetween. | 2009-03-05 |
| 20090057898 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - An insulating layer having an opening from which an electrode pad of a device is exposed is formed on the surface of a semiconductor substrate having the device fabricated therein, and an external terminal pad defined by a portion of a conductor layer formed on the insulating layer is connected to the electrode pad by means of a bonding wire. Further, a conductor post is formed on the external terminal pad, and an encapsulation resin layer is formed to coat a region on the semiconductor substrate in which the conductor post is formed, and to expose a top portion of the conductor post. An external connecting terminal is bonded to the top portion of the conductor post. | 2009-03-05 |
| 20090057899 | Semiconductor integrated circuit device and method of fabricating the same - A semiconductor integrated circuit device includes a semiconductor substrate including a main chip region and a pad region, a multi-layer pad structure on the pad region of the semiconductor substrate, a redistribution pad through the semiconductor substrate and in contact with a bottom surface of the multi-layer pad structure, the redistribution pad being electrically connected to the multi-layer pad structure, a trench belt through the semiconductor substrate and surrounding the redistribution pad, the trench belt electrically isolating the redistribution pad and a portion of the semiconductor substrate adjacent to the redistribution pad, and a connection terminal on the redistribution pad, the connection terminal electrically connecting the redistribution pad to an external source. | 2009-03-05 |
| 20090057900 | Stacked Chip Package With Redistribution Lines - A chip package comprises a first chip having a first side and a second side, wherein said first chip comprises a first pad, a first trace, a second pad and a first passivation layer at said first side thereof, an opening in said first passivation layer exposing said first pad, said first trace being over said first passivation layer, said first trace connecting said first pad to said second pad; a second chip having a first side and a second side, wherein said second chip comprises a first pad at said first side thereof, wherein said second side of said second chip is joined with said second side of side first chip; a substrate joined with said first side of said first chip or with said first side of said second chip; a first wirebonding wire connecting said second pad of said first chip and said substrate; and a second wirebonding wire connecting said first pad of said second chip and said substrate. | 2009-03-05 |
| 20090057901 | STRUCTURE OF HIGH PERFORMANCE COMBO CHIP AND PROCESSING METHOD - A method for fabricating a chip package is achieved. A seed layer is formed over a silicon wafer. A photoresist layer is formed on the seed layer, an opening in the photoresist layer exposing the seed layer. A first solder bump is formed on the seed layer exposed by the opening. The photoresist layer is removed. The seed layer not under the first solder bump is removed. A second solder bump on a chip is joined to the first solder bump. | 2009-03-05 |
| 20090057902 | METHOD AND STRUCTURE FOR INCREASED WIRE BOND DENSITY IN PACKAGES FOR SEMICONDUCTOR CHIPS - A semiconductor package provides an IC chip on at least one package substrate and including signal bond pads, ground bond pads and power bond pads. The package substrate includes signal contact pads, ground contact pads and power contact pads which are respectively coupled to signal bond pads, ground bond pads and power bond pads formed on the IC chip. The contact pads are coupled to the associated bond pads by a bonding wire. The bonding wires that connect the power and ground pads have a thickness that is greater than the thickness of the bonding wires that couple the signal pads. The various bond pads on the IC chip may be staggered to provide for enhanced compactness and integration. The package substrates may be a plurality of stacked package substrates. | 2009-03-05 |
| 20090057903 | Semiconductor module, method for manufacturing semiconductor modules, semiconductor apparatus, method for manufacturing semiconductor apparatuses, and portable device - Cost is suppressed and a semiconductor module is made thinner. The semiconductor is of a structure where a semiconductor element is embedded in a recess formed in a wiring substrate. A substrate electrode provided around the recess and an element electrode are electrically connected through a wiring formed integrally with bumps. | 2009-03-05 |
| 20090057904 | COPPER METAL LINE IN SEMICONDCUTOR DEVICE AND METHOD OF FORMING SAME - A Cu line in a semiconductor device and method of forming same are disclosed. The method may include forming an insulating interlayer on a semiconductor substrate, forming a contact hole and a trench in the insulating interlayer in sequence, forming a short-circuit preventing layer on the insulating interlayer including the contact hole and the trench, forming a spacer on a sidewall of the trench by etching the short-circuit preventing layer, forming a Cu line layer over the semiconductor substrate including the contact hole and the trench, planarizing the Cu line layer by CMP, and forming a Cu-diffusion preventing capping layer over the semiconductor substrate including the Cu line layer. | 2009-03-05 |
| 20090057905 | Semiconductor Device and Method of Manufacturing the Same - A metal interconnection layout for a semiconductor device and a method of manufacturing the semiconductor device are disclosed. The semiconductor device can maintain a minimum design rule and secure a distance between via holes to inhibit a metal bridge phenomenon from being generated. The semiconductor device comprises a substrate, an interlayer dielectric, a first metal interconnection, and a second metal interconnection parallel to the first metal interconnection. The interlayer dielectric can be disposed on the substrate. The first metal interconnection is connected to the substrate or lower interconnect through at least one first via hole in the interlayer dielectric. The second metal interconnection is adjacent to the first metal interconnection and can be connected to the substrate or another lower interconnect through at least one second via hole in the interlayer dielectric. The first via hole and the second via hole are staggered from each other along the first metal interconnection and the second metal interconnection, respectively. | 2009-03-05 |
| 20090057906 | Encapsulated silicidation for improved SiC processing and device yield - A method for producing a silicide contact. The method comprises the steps of depositing a metal on a SiC substrate; forming an encapsulating layer on deposited metal; and annealing said deposited metal to form a suicide contact. The encapsulating layer prevents agglomeration and formation of stringers during the annealing process. | 2009-03-05 |
| 20090057907 | INTERCONNECTION STRUCTURE - An interconnection structure includes an inter-layer dielectric; a topmost copper metal layer inlaid into the inter-layer dielectric; an insulating layer disposed on the inter-layer dielectric and the topmost copper metal layer; a via opening in the insulating layer for exposing a top surface of the topmost copper metal layer, wherein the via opening consists of an inwardly tapered upper via portion and a lower via portion having a substantially vertical sidewall profile; and an aluminum layer filling into the via opening. | 2009-03-05 |
| 20090057908 | WIRE BOND PADS - A wire bond pad and method of fabricating the wire bond pad. The method including: providing a substrate; forming an electrically conductive layer on a top surface of the substrate; patterning the conductive layer into a plurality of wire bond pads spaced apart; and forming a protective dielectric layer on the top surface of the substrate in spaces between adjacent wire bond pads, top surfaces of the dielectric layer in the spaces coplanar with coplanar top surfaces of the wire bond pads. | 2009-03-05 |
| 20090057909 | UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION - Structures and methods for fabrication of an under bump metallization (UBM) structure having a metal seed layer and electroless nickel deposition layer are disclosed involving a UBM structure comprising a semiconductor substrate, at least one final metal layer, a passivation layer, a metal seed layer, and a metallization layer. The at least one final metal layer is formed over at least a portion of the semiconductor substrate. Also, the passivation layer is formed over at least a portion of the semiconductor substrate. In addition, the passivation layer includes a plurality of openings. Additionally, the passivation layer is formed of a non-conductive material. The at least one final metal layer is exposed through the plurality of openings. The metal seed layer is formed over the passivation layer and covers the plurality of openings. The metallization layer is formed over the metal seed layer. The metallization layer is formed from electroless deposition. | 2009-03-05 |
| 20090057910 | METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA - A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein. | 2009-03-05 |
| 20090057911 | METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT, USE OF A TRENCH STRUCTURE, AND SEMICONDUCTOR ARRANGEMENT - A method for manufacturing a semiconductor arrangement, use of a trench structure, and a semiconductor arrangement is provided that includes a single-crystal semiconductor layer, a conductive substrate region and a buried insulator layer, which isolates the single-crystal semiconductor layer from the conductive substrate region, whereby the conductive substrate region is contacted. A trench structure is formed to separate the single-crystal semiconductor layer into a first semiconductor region outside the trench structure and a second semiconductor region within the trench structure, an opening is formed in the single-crystal semiconductor layer within the second semiconductor region, the buried insulator layer is removed within the opening, and a conductor, which contacts the conductive substrate region and adjoins the second semiconductor region, is introduced into the opening. | 2009-03-05 |
| 20090057912 | PARTITIONED THROUGH-LAYER VIA AND ASSOCIATED SYSTEMS AND METHODS - Partitioned vias, interconnects, and substrates that include such vias and interconnects are disclosed herein. In one embodiment, a substrate has a non-conductive layer and a partitioned via formed in a portion of the non-conductive layer. The non-conductive layer includes a top side, a bottom side, and a via hole extending between the top and bottom sides and including a sidewall having a first section a second section. The partitioned via includes a first metal interconnect within the via on the first section of the sidewall and a second metal interconnect within the via hole on the second section of the sidewall and electrically isolated from the first metal interconnect. In another embodiment, the first metal interconnect is separated from the second metal interconnect by a gap within the via hole. | 2009-03-05 |
| 20090057913 | Packaging substrate structure with electronic components embedded therein and method for fabricating the same - A packaging substrate structure with electronic components embedded therein and a method for fabricating the same are disclosed. The packaging substrate structure comprises a core board with a wiring layer on the two opposite surfaces thereof; a first built-up structure disposed on at least one surface of the core board and having a cavity to expose the surface of the core board; an electronic component disposed in the cavity and having an active surface and an inactive surface, where the active surface has pluralities of electrode pads and the inactive surface faces the surface of the core board; and a solder mask disposed on the surfaces of the first built-up structure and the electronic component, where the solder mask has pluralities of first openings to expose the electrode pads of the electronic component. Accordingly, the packaging substrate disclosed by the present invention can efficiently enhance electrical performance and product reliability. | 2009-03-05 |
| 20090057914 | MULTIPLE CHIP SEMICONDUCTOR DEVICE - A semiconductor device has first and second semiconductor chips comprising electronic circuit elements located at an inner part of the chip and first connection terminals located on an upper surface of the inner part of the chip. One of the chips has second connection terminals located at a peripheral part of the chip. The first and second semiconductor chips are mounted one on top of the other to form the device connected together by the first connection terminals of the first and second semiconductor chips, and wherein the second connection terminals of the first semiconductor chip provide external connections to the device. The invention enables SoC resources to be increased based on the System-in-Package (SiP) approach by duplication identical chip components into a single package. | 2009-03-05 |
| 20090057915 | SEMICONDUCTOR DEVICE - The operation stability of a SiP (semiconductor device) using a stacked packaging method for stacking a microcomputer IC chip over a driver IC chip is improved. In the SiP using the stacked packaging method for stacking the microcomputer IC chip over the driver IC chip, circuits sensitive to heat or noise, such as an analog to digital conversion circuit, a digital to analog conversion circuit, a sense amplifier circuit of a memory (RAM or ROM), and a power supply circuit of a microcomputer IC chip are prevented from two-dimensionally overlapping with a driver circuit of the lower-side driver IC chip. Since this can reduce, during the operation, the effect of heat or noise, which the circuits sensitive to heat or noise of the microcomputer IC chip receive from the driver circuit of the lower-side driver IC chip, the operation stability of the SiP (semiconductor device) using the stacked packaging method can be improved. | 2009-03-05 |
| 20090057916 | SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME - A semiconductor package is provided. The semiconductor package comprises a substrate having a top surface and a bottom surface, a first semiconductor chip having a plurality of bonding pad regions electrically connected to the substrate by a plurality of first bonding wires, a spacer tape covering the active surface of the first semiconductor chip excluding the plurality of bonding pad regions, and a second semiconductor chip mounted on the active surface of the first semiconductor chip with the spacer interposed. | 2009-03-05 |
| 20090057917 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device. The semiconductor device includes: a board, a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first front face, a first back face, and first external connection terminals provided on the first front face. The first semiconductor chip is mounted on the board via the first external connection terminals by flip-chip bonding. The second semiconductor chip has a second front face, a second back face, and second external connection terminals. The second semiconductor chip is mounted on the first semiconductor chip. The second front face has a contact region contacting the first back face of the first semiconductor chip. The second external connection terminals are provided on the second front face except the contact region. The second semiconductor chip is mounted on the board via the second external connection terminals by flip-chip bonding. | 2009-03-05 |
| 20090057918 | STACK-TYPE SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME - A method of forming a stack-type semiconductor package includes preparing a lower printed circuit board including a plurality of interconnections and a plurality of ball lands for connection on an upper surface thereof. One or more first chips, which are electrically connected to the plurality of interconnections and sequentially stacked, are mounted on the lower printed circuit board. A lower molded resin compound is formed on the lower printed circuit board to cover the first chips, and is formed to have via holes exposing the ball lands for connection. An upper chip package, under which solder balls are formed, is aligned so that the solder balls correspond to the via holes of the lower molded resin compound, respectively. The solder balls are reflown to form connection conductors filling the via holes. A stack-type semiconductor package structure and an electronic system including the same are also provided. | 2009-03-05 |
| 20090057919 | Multiple chips bonded to packaging structure with low noise and multiple selectable functions - The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first chip and the second chip. The second bumps connect the first chip and the second region of the substrate, wherein the second chip is over the first region of the substrate. The second bumps have a height greater than that of the first bumps plus the second chip. The substrate does not have an opening accommodating the second chip. The first bumps may be gold bumps or solder bumps. The second bumps may be solder bumps. | 2009-03-05 |
| 20090057920 | LOW-NOISE FLIP-CHIP PACKAGES AND FLIP CHIPS THEREOF - A low-noise flip-chip package, comprising: a carrier substrate having first and second opposing main faces; and a flip-chip substrate connected in a face-down manner onto the first main face of the carrier substrate via a connection array, wherein: the flip-chip substrate comprises at least first and second circuitry portions spaced apart from one another; the flip-chip substrate comprises a substrate-contact boundary located between the first and second circuitry portions; and each of the first circuitry portion, the second circuitry portion and the substrate-contact boundary has its own separate signal-reference connection extending via a respective connection of the connection array through the carrier substrate to a respective electrical contact at the second main face of the carrier substrate for connection to a common signal-reference element in an external circuit. | 2009-03-05 |
| 20090057921 | FLIP CHIP FOR ELECTRICAL FUNCTION TEST AND MANUFACTURING METHOD THEREOF - Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost. | 2009-03-05 |
| 20090057922 | Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package - A semiconductor device can include a semiconductor chip, a protective layer pattern, an under bump metallurgy (UBM) layer, and conductive bumps. The semiconductor chip can include a pad and a guard ring. The protective layer pattern can be formed on the semiconductor chip to expose the pad and the guard ring. The UBM layer can be formed on the protective layer and can directly make contact with the pad and the guard ring. The conductive bumps can be formed on a portion of the UBM layer on the pad. Thus, the UBM layer and the guard ring can directly make contact with each other, so that a uniform current can be provided to the UBM layer on the pad regardless of a thick difference of different portions of the UBM layer. | 2009-03-05 |
| 20090057923 | Methods of Fabricating Semiconductor Devices and Structures Thereof - Methods of fabricating semiconductor devices and structures thereof are disclosed. In a preferred embodiment, a method of manufacturing a semiconductor device includes providing a semiconductor wafer, forming a first insulating material over the semiconductor wafer, and forming a plurality of first features and a plurality of second features in the first insulating material. The plurality of first features is removed, leaving an unfilled pattern in the first insulating material. The unfilled pattern in the first insulating material is filled with a second insulating material. | 2009-03-05 |
| 20090057924 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MOUNTING STRUCTURE, AND ELECTRO-OPTICAL DEVICE - A semiconductor device includes a base substrate including an internal circuit, a resin protrusion part that is disposed to protrude on an active face side of the base substrate, and a plurality of terminals that are formed by including an island-shaped conductive film disposed on the resin protrusion part. The plurality of terminals includes a terminal that a conductive state with the internal circuit, and a wiring line that electrically connects at least two terminals among the plurality of terminals is disposed on the active face side. | 2009-03-05 |
| 20090057925 | Semiconductor apparatus - A semiconductor apparatus capable of detecting a crack generated in a semiconductor chip while the design freedom, the layout freedom of a wiring, the layout efficiency of LSI, and the layout efficiency of a package substrate are improved. The semiconductor apparatus according to the invention includes a semiconductor chip having a multilayered wiring structure; plural electrode pads being formed on a top surface along the outer periphery of the semiconductor chip; and a wiring being coupled to a first electrode pad and a second electrode pad selected from the plural electrode pads and formed along the entire outer periphery of the semiconductor chip in plan view. The wiring includes a first wiring and a second wiring that are formed on different layers, and the first wiring and the second wiring are connected in series by a connection plug. | 2009-03-05 |
| 20090057926 | Semiconductor apparatus - A semiconductor apparatus capable of simply detecting a crack generated in plural semiconductor chips while the design freedom is improved, includes a first semiconductor chip and a second semiconductor chip that is laminated on the first semiconductor chip, in which a first wiring that is formed along the outer periphery of the first semiconductor chip and a second wiring that is formed along the outer periphery of the second semiconductor chip are connected in series. | 2009-03-05 |
| 20090057927 | METHOD FOR FORMING INTERLAYER INSULATING FILM IN SEMICONDUCTOR DEVICE - A method for forming an interlayer insulating film includes providing a semiconductor substrate having a first substrate region with a plurality of metal wiring and a second substrate region having no metal wiring, and then forming an insulating film dummy pattern in the second substrate region, wherein the insulating film dummy pattern has the same thickness as the metal wiring, and then forming an interlayer insulating film over the semiconductor substrate including the insulating film dummy pattern. | 2009-03-05 |
| 20090057928 | Semiconductor Chip with Stratified Underfill - Various semiconductor chip underfills and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate to leave a gap therebetween, and forming an underfill layer in the gap. The underfill layer includes a first plurality of filler particles that have a first average size and a second plurality of filler particles that have a second average size smaller than the first average size such that the first plurality of filler particles is concentrated proximate the substrate and the second plurality of filler particles is concentrated proximate the semiconductor chip so that a bulk modulus of the underfill layer is larger proximate the substrate than proximate the semiconductor chip. | 2009-03-05 |
| 20090057929 | SEMICONDUCTOR DEVICE - A power module includes: an encapsulation-target portion having at least one semiconductor element; and an encapsulation member that has first and second planes between which the encapsulation-target portion is interposed, and that encapsulates the encapsulation-target portion. The encapsulation member has, on the at least one semiconductor element, at least one opening that exposes part of a surface of the encapsulation-target portion the surface being on a side of the first plane. Thus, a semiconductor device of which size can be reduced can be provided. | 2009-03-05 |
| 20090057930 | CARBURETOR OF A REMOTE CONTROL MODEL - A carburetor of a remote control model has a main body axially bored with an axial hole that is installed with a throttle and a second needle in its one side and provided with a female-threaded section formed at a certain portion of its other side for engaging with a male-threaded section of an adjustment valve. The adjustment valve possesses a fuel entering passage formed axially with a dead end, and an injection nozzle formed at the end corresponding to and for a needle valve of the second needle to move to and fro therein. And, the adjustment valve is directly installed in the axial hole without being accompanied with other components, effective to lower progressive tolerance between the injection nozzle and the needle valve to provide uniform fuel injection. | 2009-03-05 |
| 20090057931 | Tabletop Humidifier - A tabletop humidifier is disclosed which embodies one or more of low voltage operation from a high voltage supply through a current-limited transformer to provide a safely limited shock risk proximate to its water containing areas, tool-free and uncomplicated disassembly to enable end-of-life recycling of its components, and improved humidification efficiency through an inexpensive and reliable by-pass preventing means. | 2009-03-05 |
| 20090057932 | MANUFACTURING METHOD OF KEYPAD PANEL - A manufacturing method of keypad panel includes the steps of preparing a mold formed by assembling a mold base, a transparent mold cavity and a fixed board; coating an ultraviolet curing resin on surfaces of the mold base and the transparent mold cavity of the mold; attaching a transparent or non-transparent plastic thin film onto the ultraviolet curing resin; compressing the ultraviolet curing resin flatly to squeeze the space and eliminate the air remained between the thin film and the ultraviolet curing resin as well as the ultraviolet curing resin and the transparent mold cavity; and performing a light projection to pass light through the transparent mold cavity to cure the ultraviolet curing resin, so as to complete manufacturing the keypad panel. | 2009-03-05 |
| 20090057933 | Optical Member Fabricating Apparatus and Method and Forming Mold Used for the Same - Provided is an apparatus for fabricating an optical member. The apparatus includes a first roll around which a base film is wound, a second roll around which a base film on which a coating liquid is applied in a predetermined pattern is wound, two or more guide rolls disposed between the first and second rolls to convey the base film, an injection unit for injecting the coating liquid, a pattern molding unit engaged with one of the guide rolls to apply the injected coating liquid on the base film in the predetermined pattern, and a hardening unit for hardening the coating liquid applied on the base film. | 2009-03-05 |
| 20090057934 | FORMING SHEET, LENTICULAR LENS SHEET PRODUCTION METHOD, AND THEIR PRODUCTION APPARATUS - A method and an apparatus for producing a pattern forming sheet efficiently. The method and apparatus for producing a sheet having a first pattern formed on at least one side by a first roll forming die and a second pattern formed by a second roll forming die is characterized in that the rotational angular speeds of the first and second roll forming dies are substantially equalized and relative positional variation of the first and second patterns is substantially minimized by synchronizing the phases of the periodic positional variation caused by the rotation of the rolls. | 2009-03-05 |
| 20090057935 | METHOD OF GRANULATING FLEXIBLE POLYOLEFIN RESIN AND GRANULE - A method for granulating a flexible polyolefin resin including: melting a flexible polyolefin resin by volatilization after polymerization; cooling the resin to a temperature in a range of the melting point of the resin (Tm-D) ±50° C.; and granulating the cooled resin by an underwater granulation method; the underwater granulation method using cooling water of 30° C. or less in which an antifusion agent is added. | 2009-03-05 |
| 20090057936 | METHOD FOR PRODUCING NON-STICKING GRANULES FROM A POLYESTER MATERIAL AND FOR THE FURTHER PROCESSING OF GRANULES PRODUCED IN THIS WAY - Disclosed is a method of producing a non-adhering granulate above the glass-transition temperature comprising a polyester material, in which the polyester material is introduced into a cooling water flow as a melt and is separated from the cooling water after passing through a cooling stretch. The dwell time of the polyester material in the cooling stretch is 0.2-5 sec, and the cooling water has a pressure of at least 2 bar along the cooling stretch. For the thus obtained granulate, post-crystallisation is not required, at least not in every case. It has been shown that the granulate does not adhere even without post-crystallisation and mechanical movement if no additional external input of energy takes place. Even during heating under pressure, no adhesion could be observed. | 2009-03-05 |
| 20090057937 | SOLUTION CASTING PROCESS - Solution casting of polymer film ( | 2009-03-05 |
| 20090057938 | Closed Loop Control for an Injection Unit - A method is provided for improving melt quality in an injection unit. A closed loop control system regulates operation of the injection unit in accordance with a reference value for at least one operating parameter. A sensor measures the present value of a load upon the motor which drives an injection screw during operation of the injection unit. A processor compares the present value of the load to a reference value for the load. If the present value of the load deviates from the reference value of the load by more than a predetermined amount, then the processor adjusting the reference value of the at least one operating parameter. Operating parameters can include barrel temperature, back pressure and screw RPMs. | 2009-03-05 |
| 20090057939 | Fugitive Pore Former For Porous Ceramic Articles - Disclosed are ceramic batch compositions for forming porous ceramic articles. The ceramic forming precursor batch compositions include ceramic forming inorganic batch components and a cyclododecane pore forming agent. Also disclosed are methods for manufacturing porous ceramic articles. | 2009-03-05 |
| 20090057940 | Method of producing less anisotropic flexible graphite - This invention provides a method for recompressing expanded or exfoliated graphite to produce a less anisotropic, flexible graphite foil having a thickness-direction electrical conductivity no less than 15 S/cm. In one preferred embodiment, the method comprises: (a) providing a mixture of expanded or exfoliated graphite flakes and particles of non-expandable graphite or carbon, wherein the non-expandable graphite or carbon particles are in the amount of between about 3% and 70% by weight based on the total weight of the particles and the exfoliated graphite; (b) compressing the mixture in at least a first direction to a pressure within the range of from about 0.04 MPa to about 350 MPa into a first cohered mixture; and (c) compressing this first cohered mixture in a second direction, different from the first direction, to a pressure sufficient to produce said flexible graphite foil having a bulk density within the range of from about 0.1 g/cm | 2009-03-05 |
| 20090057941 | Method for manufacturing synthetic leatherette possessing properties of high elasticity, abrasion resistance and environmental friendliness - A method for manufacturing a synthetic leatherette that possesses properties of high elasticity, abrasion resistance and environmental friendliness, comprises following steps: melting grains of Thermoplastic Elastomer (TPE) in a melting pot into a TPE melt with heat; mixing the TPE melt into an even TPE liquid; sheeting the TPE liquid into a TPE layer with a heat pressing roller; laminating the TPE layer with a reinforcement material layer with heat; cooling the TPE layer laminated with the reinforcement material layer with a cooling rooler; and reheating the cooled TPE layer laminated with the reinforcement material layer in a oven for finalize the synthetic leatherette. In industrial applications, the disclosed synthetic leatherette made of TPE is advantaged by being innocuous, without uncomfortable odor, decomposable, completely recyclable, highly elastic, highly wear-resistant, and light. Thereupon, the resultant synthetic leatherette of the present invention is applicable to a more extensive scope of industries as compared with the traditional PU leatherette. | 2009-03-05 |
| 20090057942 | METHOD FOR MANUFACTURING SHEET MOLDED BODY AND INSERT MOLDED BODY - A manufacturing method for a sheet molded body having a desired three dimensional shape and an excellent quality of the design, which has no crease, by uniformly expanding a decorated sheet prior to molding, and closely contacting the decorate sheet to the surface of a male die. In the manufacturing method, the pressure at the front side of the decorated sheet is lowered relative to that at the back side. An arm means is then moved towards the decorated sheet from the back side of the decorated sheet so that the decorated sheet is inverted by increasing the pressure at the front side relative to that at the back side. The decorated sheet is then three dimensionally formed along the surface of the male die by, while pressing the male die from the back side and moving the arm means backwards, increasing the pressure at the front side. | 2009-03-05 |
| 20090057943 | SOLUTION CASTING PROCESS AND APPARATUS - In a solution casting apparatus, polymer dope containing cellulose ester and solvent is cast to form cellulose ester film continuously. A filtration device has a precoat of a filter aid deposited on a filter screen, for filtering polymer dope to be cast. A washer washes the filtration device after discontinuing supply of the polymer dope to the filtration device. A filter regenerating device deposits a precoat of the filter aid in the washed filtration device by use of precoat solution containing the filter aid, the polymer dope and solvent. A drain line drains the precoat solution from the filtration device after depositing the precoat. The filtration device is charged with solvent saturated gas upon draining. A valve mechanism changes over plural filtration devices, to manage the filtration device among the filtration devices in the washer, the filter regenerating device and the drain line. | 2009-03-05 |
| 20090057944 | Micro-Extrusion Printhead Nozzle With Tapered Cross-Section - A micro-extrusion printhead assembly utilized in a micro-extrusion system to form parallel extruded gridlines of material on a substrate includes a nozzle having a tapered (e.g., triangular or trapezoidal) cross-section arranged such that a lower surface of each gridline is substantially wider than its upper edge, and such that side surfaces of the extruded gridlines reflect incident light beams into exposed surface areas of the substrate, thereby minimizing the effective shadowed surface area under the gridline. In one embodiment, the fluidic channels of each nozzle are fabricated by cutting or etching progressively wider channels into a series of rigid layers, and then stacking the rigid layers to form a layered nozzle structure. In another embodiment, a single layer is processed to include a tapered cross-section having the desired triangular or trapezoidal cross-section. | 2009-03-05 |
| 20090057945 | Process for manufacturing a plastic hollow body, device and equipment for the implementation thereof - Process for manufacturing a plastic hollow body, the process comprising the following steps:
| 2009-03-05 |
| 20090057946 | METHOD OF FORMING A HOUSING - The present invention encompasses a method of forming a housing that locates an internal element. This method is instigated by firstly the steps of locating an internal element within a mould, and then introducing a plastic material into the mould. Next the mould is rotated to form a plastic exterior surface of a housing on the internal surface of the mould with said internal element being located inside the exterior surface of the housing formed. | 2009-03-05 |
| 20090057947 | Method and Apparatus for Fabricating Articles having Textured Surfaces - Decorative textured surfaces are formed on articles having curved or contoured surfaces. A reusable, flexible textured blanket is placed in a mold along with a first material charge. A pressurizer is used to both impart the texture of the blanket to the first material charge and consolidate the charge to form a textured shell. The blanket is removed from the mold and a second material charge is introduced into the mold over the shell. The application of heat and pressure consolidates the second material charge and the shell to both form and cure the completed article. | 2009-03-05 |
| 20090057948 | Method and apparatus for manufacturing a curved elongated structural element - A method and an apparatus for manufacturing of a curved elongated structural element of composite material. The curved elongated structural element includes a first elongated portion and a second elongated portion in an angled relation. A substantially flat blank of composite material including a first and second elongated edge is provided. The blank is folded over a first portion forming surface and a second portion forming surface of a forming tool's flexible tool body for forming the first elongated portion and the second elongated portion. The forming tool's tool body is bent such that its bending moment center prevails essentially adjacent the first portion forming surface. | 2009-03-05 |
| 20090057949 | INJECTION MOLDING METHOD - Die assembly ( | 2009-03-05 |
| 20090057950 | Method for converting a multi-ply paper product - A process for manufacturing a multi-ply paper product, the having the steps of: providing a first paper web; providing a second paper web; and providing a converting apparatus. The converting apparatus has a first pressure roll; an embossing roll; a second pressure roll; and a marrying roll. The embossing roll has a plurality of embossing protrusions wherein each embossing protrusion has a distal end. The first pressure roll and the embossing roll are juxtaposed in an axially parallel relationship to form a first nip therebetween. The first nip has a first nip width. The first pressure roll and embossing roll are adapted to receive the first paper web at the first nip. The second pressure roll and the embossing roll are juxtaposed in an axially parallel relationship to form a second nip therebetween. The second nip has a second nip width. The second pressure roll and embossing roll are adapted to receive the first paper web, after the first paper web has traversed the first nip, and the second paper web at the second nip. The marrying roll is juxtaposed in an axially parallel relationship with the embossing roll to form a third nip therebetween. The marrying roll and embossing roll are adapted to receive the first paper web and the second paper web, after the first paper web and the second paper web have traversed the second nip, and provide a marrying load of greater than about 100 pli after the first paper web has traversed the first nip, and marry the first paper web to the second paper web. The process includes the steps of: forwarding the first paper web through the first nip such that portions of the first paper web are embossed at the first nip to provide an embossed first paper web; forwarding the embossed first paper web and the second paper web through the second nip such that that the embossed portions of the first paper web are further embossed and portions of the second paper web are embossed and are registered with the embossed portions of the first paper web to provide a double-embossed first paper web and a embossed second paper web; and forwarding the double-embossed first paper web and the embossed second paper web through the third nip whereby the embossed portions of the first paper web and the embossed portions of the second paper web are married to provide an embossed multi-ply paper product. | 2009-03-05 |
| 20090057951 | Apparatus for converting a multi-ply paper product - An apparatus for providing a multi-ply embossed paper product having a first pressure roll; embossing roll with a plurality of embossing protrusions, each protrusion having a distal end; a second pressure roll; and a marrying roll. The first pressure roll and the embossing roll are juxtaposed in an axially parallel relationship to form a first nip therebetween. The first nip has a first nip width, and the first pressure roll and embossing rolls are adapted to receive a first paper web at the first nip. The second pressure roll and the embossing roll are juxtaposed in an axially parallel relationship to form a second nip therebetween. The second nip has a second nip width, and the second pressure roll and embossing rolls are adapted to receive the first paper web, after the first paper web has traversed the first nip, and a second paper web at the second nip. The marrying roll is juxtaposed in an axially parallel relationship with the embossing roll to form a third nip therebetween. The marrying roll and embossing roll are adapted to receive the first paper web and the second paper web, after the first and second paper webs have traversed the second nip, at the third nip and marry the second paper web to the first paper web. | 2009-03-05 |
| 20090057952 | MOLDING APPARATUS AND INJECTION MOLDING METHOD USING THE SAME - A molding apparatus and an injection molding method using the same are provided. A plurality of lower mold cores are arranged in a first direction, and a plurality of upper mold cores are arranged in a row in the first direction. At least one of the lower mold cores is movable into contact with the upper mold cores. | 2009-03-05 |
| 20090057953 | Extrusion blow molding machine - An extrusion blow molding machine has a first and a second row of multiple extruded parisons. The device further includes a mold having a first molding block section having a first plurality of cavity portions, a second molding block section having a second plurality of cavity portions and a third molding block section. The third molding block section includes a third plurality of cavity portions that are alignable one each with the cavity portions in the first plurality of cavity portions to thereby define a first row of cavities. The third molding block section also includes a fourth plurality of cavity portions that are alignable one each with the cavity portions in the second plurality of cavity portions to thereby define a second row of cavities. | 2009-03-05 |
| 20090057954 | SOLUTION CASTING METHOD AND APPARATUS - A casting dope is cast onto a moving peripheral surface to form a casting film. The casting film is cooled to be hardened or solidified. The casting film is peeled from the peripheral surface by a peeling roller to form a primary wet film. The primary wet film is transported to a transfer section. The primary wet film is sent from the transfer section to a first drying chamber. Wet gas containing water vapor is applied to the primary wet film in the first drying chamber. Water molecules are absorbed into the primary wet film. The water molecules absorbed into the primary wet film expand meshes of network structure of polymer molecules of the primary wet film. The diffusion of liquid compounds contained in the primary wet film is accelerated. Thus, the elimination of the liquid compounds can be facilitated. | 2009-03-05 |
| 20090057955 | Resin Molding Apparatus and Resin Molding Method - Disclosed is a resin molding apparatus capable of enhancing transfer accuracy, reducing the cost of a molding apparatus, and shortening a molding cycle. The resin molding apparatus includes a first mold; a second mold disposed in opposition to the first mold; a transfer plate ( | 2009-03-05 |
| 20090057956 | SIDE GATE TYPE INJECTION MOLDING DIE AND MOLDED COMPONENT MANUFACTURING METHOD USING THE SAME - A side gate type injection molding die prevents a weld line from being generated on a molded component made of a resin material to which a brightening agent is added, avoiding inferior appearance. The side gate type injection molding die including a product portion | 2009-03-05 |
| 20090057957 | APPARATUS FOR MAKING MAGNESIUM-BASED CARBON NANOTUBE COMPOSITE MATERIAL AND METHOD FOR MAKING THE SAME - An apparatus for fabrication of a magnesium-based carbon nanotube composite material, the apparatus includes a thixomolding machine, and a feeding device. The thixomolding machine includes a heating barrel, a feeding inlet, a nozzle, a heating portion, and a plunger. The heating barrel includes a first end and a second end. The feeding inlet is disposed at the first end. The nozzle is disposed at the second end. The heating portion is disposed around the heating barrel. The plunger is disposed at a center of the heating barrel. The feeding device includes a hopper; an aspirator connected to the hopper, a first container, and a second container. The hopper is in communication with the first container and the second container. A method for fabricating a magnesium-based carbon nanotube composite material is also provided. | 2009-03-05 |
| 20090057958 | COMPRESSION MOULDING FLUFFY CELLULOSIC MATERIAL - A method and related apparatus for producing one or several products starting from a cellulose based material have been worked out. A layer of fluffy material ( | 2009-03-05 |
| 20090057959 | Method for Embellishing Customized Label on Handle via Laser-Engraving - A method for embellishing customized label on a handle via laser-engraving comprises: first step: preparing a body of the handle injected from a mold, with the body provided to be colored; second step: injecting a surface layer surrounding the body, with the surface layer having different color from the body; third step: laser-engraving with a label on the surface layer and removing parts of the surface layer relative to the shape of the label, with parts of the colored body being exposed thereafter, with getting a finished handle. | 2009-03-05 |
| 20090057960 | RESIN MOLD AND PROCESS FOR PRODUCING A MOLDED ARTICLE USING THE MOLD - A resin mold used for replicating a pattern of protrusions and depressions to a molded article in the photo nano imprint lithography for producing a molded article having a pattern of protrusions and depressions on the surface, which comprises a mold material comprising at least one resin selected from thermoplastic resins having a nonpolar alicyclic structure and thermoplastic resins having an alicyclic structure having a halogen atom; and a process for producing a molded article having a pattern of protrusions and depressions on the surface, which comprises replicating the pattern to a layer for replication disposed on a substrate using the resin mold described above in accordance with the photo nano imprint lithography. The resin mold is used for producing a molded article having a pattern of protrusions and depressions of the nanometer level on the surface and exhibits excellent property of releasing the molded article from the mold. | 2009-03-05 |
| 20090057961 | PROCESS FOR PRODUCING CLEAR POLYPROPYLENE BASED STRETCH BLOW MOLDED CONTAINERS WITH IMPROVED INFRARED HEAT-UP RATES - A process for producing clear injection stretch blow molded containers comprising:
| 2009-03-05 |
| 20090057962 | Apparatus For Inflating Tube Film For Manufacturing Packaging Material, And A Method For Inflating Tube Film With Such Apparatus - An apparatus for inflating film for manufacturing packaging material in situ, wherein the apparatus comprises an inflating unit, a film conveying provision, a sealing unit and a film receiving means for receiving a film roll, wherein the apparatus is a compact apparatus with a relatively small footprint and wherein the inflating unit, film conveying provision and the sealing unit are provided in a central unit on the apparatus and are operatively positioned with respect to a center of the film to be inflated and sealed viewed in a direction at right angles to a film conveying direction, wherein the film to be inflated is operatively engaged only in or near the center thereof by the central unit, for inflating the film from or from near the center, then sealing the film tight and conveying it, as well as a method for manufacturing packaging material. | 2009-03-05 |
| 20090057963 | Method for firing ceramic honeycomb bodies in a kiln - A method for fabricating ceramic honeycomb structural bodies that includes conveying at least one green honeycomb structural body of a first type and at least one green honeycomb structural body of a second type through a kiln in a manner which reduces cracking or fissures in the fired objects. | 2009-03-05 |
| 20090057964 | Rotary lance - A process and apparatus for feeding an additive to a molten metal in a vessel to achieve a uniform dispersion of the additive are provided. In one example, the outlet of the lance is positioned below the surface of the molten metal. The lance is moved with a reciprocating motion, so that the outlet of the lance moves below the surface of the molten metal. The additive is dispensed through the outlet of the lance along a path traversed by the outlet in the molten metal while the lance reciprocates. | 2009-03-05 |
| 20090057965 | FURNACE FILTRATION SYSTEM FOR MOLTEN METAL - A furnace filtration system for improving the speed and efficiency of a molten metal centrifugal impeller pump contained within a non-ferrous molten metal furnace. The system includes a filtration well located upstream of the pump well. The filtration well includes a filter having a plurality of through filter passages that are sized to prevent any solid contaminants that are larger than the pump's impeller openings from passing therethrough. By preventing any contaminants that cannot pass through the pump, the pump can be run at a higher speed. A furnaces efficiency increases with the centrifugal pump's efficiency increases with its centrifugal pump's speed along with the flow and pressure. Increased flow and pressure increases a furnace's efficiency by a) increasing the melting rate; b) decreasing the energy lost by reducing the metal temperature stratification; and c) reducing the contaminants increases the quality of the metal produced while reducing the amount of nitrogen and chlorine needed to clean the metal. | 2009-03-05 |
| 20090057966 | SPRING BODY FOR GAS SPRING ASSEMBLY AND METHOD OF FORMING SAME - A spring body includes a filament structure formed from at least one length of filament material. An elastomeric wall at least partially defines a spring chamber and includes a first portion of the filament structure. A comparatively-rigid wall includes a second portion of the filament structure. A gas spring assembly that includes such a spring body, as well as a method making a spring body and a method of making a gas spring assembly are also included. | 2009-03-05 |
| 20090057967 | GAS SPRING ASSEMBLY AND METHOD OF MANUFACTURE - A flexible wall and end structure assembly includes a flexible wall and an end structure. The flexible wall is formed from an elastomeric material and a filament structure. A bead wire is formed into an open end of the flexible wall. The end structure is received along the open end of the flexible wall and forms a substantially fluid-tight seal therewith. A portion of the filament structure is compressed between the bead wire and the end structure and extends therefrom in radially-outwardly spaced relation to said end structure. A gas spring assembly including such a flexible wall and end structure assembly is included. A method of manufacture is also included. | 2009-03-05 |
| 20090057968 | Controllable Hydraulic Bearing - A controllable hydraulic bearing for damping vibrations in a defined frequency band is proposed, which includes an elastomeric body ( | 2009-03-05 |
| 20090057969 | Strut for a Wheel Suspension of Motor Vehicles - The invention relates to a strut for a wheel suspension of motor vehicles, comprising a telescoping shock absorber and a support spring which surrounds it, as well as with a vertical adjustment means with a driven driving spindle which is pivoted by way of a body-mounted bearing on the engine housing side, which interacts with a vertically adjustable lifting element which is arranged to be non-rotatable and which bears the spring plate of the support spring. According to the invention, the driving spindle, in addition to the body-mounted bearing, is supported directly or indirectly on the cylinder tube of the shock absorber to be able to pivot and move axially relative to it. | 2009-03-05 |
| 20090057970 | Rigid jounce bumper and gas spring assembly including same - A rigid jounce bumper includes a body and at least one support segment projecting axially from an end of the body. The rigid jounce bumper is formed from a substantially non-elastic material such that the rigid jounce bumper can support axially-applied loads without undergoing substantial axial deflection. The at least one support segment is capable of displacement relative to the body when under laterally-applied loads. A gas spring assembly having such a rigid jounce bumper is also included. | 2009-03-05 |
| 20090057971 | Universal holding fixture - A universal holding fixture assembly includes a plurality of linear actuators supported by the fixture and adapted to engage and support a workpiece relative to the fixture. A linear displacement member is supported by a housing and adapted to move between retracted and extended positions. An end effector assembly is operatively supported by the linear actuator and adapted to engage the workpiece when the linear displacement member is in its extended position. A sensor is operatively supported by the end effector assembly and is responsive to contact with the workpiece to establish a datum of the position of the linear actuator relative to the workpiece. | 2009-03-05 |
| 20090057972 | Bracing means - Bracing means for supporting a moveably mounted or flexible component during a machining operation that has an expandable member adapted to fit between a component and a support surface. When the expandable member is expanded a bracing member will resist movement and/or flexing of the component caused by forces arising during the machining operation. The expandable member is deformable to substantially conform to the shape of the component and the support surface. | 2009-03-05 |
| 20090057973 | PORTABLE CLAMP - A portable clamp has a hinged, two piece arm that folds for storage within a hollow stem. A first arm hingedly connects to a second arm where each has a curved shell sized for gripping the frame of a bicycle. The first arm and second arm have cooperating holes to admit pins for securing the first arm to the second arm. Opposite the hinge, the second arm fits perpendicularly into the stem. A buckle secures a strap that passes around an object. In use, a cyclist releases the clamp from the stem. The cyclist places the strap around the upright object at a desirable height. The cyclist places the end of the strap in the buckle and cinches the strap. Using a pin, the cyclist secures the clamp within the stem. The cyclist places the arm around a bicycle frame member then secures a pin through the arm and into the stem. The bike is then supported at a convenient height. | 2009-03-05 |
| 20090057974 | SHEET/PAGE BUFFER FOR SHEET HANDLING APPARATUS - A page buffer for receiving and holding, in queue, pages prepared by a printer and subsequently processed by mailpiece inserter. The page buffer includes pairs of vertically-aligned rollers defining a plurality of page stations therebetween. Each pair of rollers is spaced-apart and defines a nip for driving printed pages along a feed path. Furthermore, each page station is defined by and between a first pair of rollers disposed downstream of an adjacent second pair of rollers. A drive means is also provided for independently driving the pairs of vertically-aligned rollers. The drive means is controlled such that, in a first operating mode, the pairs cooperate to drive printed pages along the feed path. In a second operating mode, the drive means is controlled such that at least one of the page stations causes its respective first pair of rollers to retain and hold a leading edge portion of a printed page while the adjacent second pair drives and releases a trailing edge portion of the printed page. The printed page is, therefore, held within the page station such that the trailing edge droops below the feed path in a predominantly vertical orientation. | 2009-03-05 |
| 20090057975 | IMAGE FORMING APPARATUS - The inclination in the sliding direction to an inner rail of the sheet cassette is limited by a swing lever which is provided at a roller bearing support member so as to be protruded through the side of the upper guide surface of the inner rail when the sheet cassette is moved and the limitation of the inclination of the sheet cassette by the swing lever is released when the sheet cassette is pulled out. | 2009-03-05 |
| 20090057976 | SHEET POST-PROCESS APPARATUS INCLUDING MOVABLE STACK TRAY, AND SHEET POST-PROCESS METHOD - A sheet post-process apparatus according to one example of the present invention includes a movable stack tray for stacking a sheet that is elevated in a vertical direction; a movable tray position detection unit that detects a vertical position of the movable stack tray while a request command for post-processing of the sheet is not received; an upper surface sensor that senses either an upper surface of the movable stack tray or an upper surface of the sheet stacked on the movable stack tray when a first position of the movable stack tray detected by the movable tray position detection unit is lower than or equal to a predetermined first height; and a movable tray moving unit that moves the movable stack tray upward when either the upper surface of the movable stack tray or the upper surface of the sheet stacked on the movable stack tray is not sensed by the upper surface sensor. | 2009-03-05 |
| 20090057977 | SHEET FINISHER, IMAGE FORMING APPARATUS USING THE SAME, AND SHEET FINISHING METHOD - A sheet finisher of the invention includes a saddle-stitching unit to stitch a center of a sheet bundle, a folding unit to fold the center and to form a fold, a first and a second rollers that move along a direction of the fold while nipping and pressing the fold of the sheet bundle and reinforce the fold, and a drive section to move the first and the second rollers along the fold from a standby position apart from an edge of the sheet bundle, and the first and the second rollers are separate from each other in a thickness direction of the sheet bundle at the standby position, and after the first and the second rollers reach to a position where they pass the edge of the sheet bundle of a processable maximum size, they come close to each other in the thickness direction and nip the fold. | 2009-03-05 |
| 20090057978 | Sheet processing device, image forming apparatus, and image forming system - A sheet processing device includes a sheet aligning unit that aligns a sheet recording medium. The sheet aligning unit is configured to be pulled out from a main body of the sheet processing device, and includes a sheet conveying member for conveying the sheet recording medium. | 2009-03-05 |
| 20090057979 | MAILPIECE FEED DEVICE HAVING AN INTEGRATED IMAGE SENSOR - In a mailpiece feed device comprising a mailpiece-receiving deck for receiving a stack of mailpieces for printing, selector means for extracting the mailpieces for printing one-by-one from said stack, and superposed conveyor rollers including movable upper rollers for conveying downstream the mailpieces extracted one-by-one in this way, there are further provided movable optical read means that are placed downstream from said selector means and that move synchronously with said movable upper conveyor rollers for conveying the mailpieces, so that, in cooperation with processor means, said optical read means scan and recognize automatically the data printed on said mailpieces. | 2009-03-05 |
| 20090057980 | SHEET FEEDER - The invention concerns an apparatus for forward transferring sheet-like objects from a stack, said apparatus including separate lifting elements gripping by suction to the upper surface of the sheet-like object situated top-most on the stack. The gripping elements are positioned in a row extending over the stack of the sheet-like objects in transversal direction with respect to the forward direction of the sheet-like object. The suction effect of the lifting elements is individually controlled by means of a control device including a light source creating a substantially line-shaped illumination pattern over the top of the stack. The illumination of the light source is focused substantially parallel to the lifting element row, at an inclined angle to the surface plane of the sheet stack. Camera means for observing the illumination pattern forwards information about the uniformity of the uppermost layer of the stack for controlling the gripping elements. | 2009-03-05 |
| 20090057981 | Serial recording apparatus and method of feeding recording medium - Provided is a serial recording apparatus including: a feed unit which feeds a recording medium; a recording unit which performs recording with respect to the fed recording medium; a movement unit which moves the recording unit in order to performing recording; a transporting unit which transports the recording medium in a direction crossing the movement direction of the recording unit; a controller which controls the recording unit, the movement unit, the transporting unit and the feed unit; and a determination unit which determines whether a target stop position of the recording unit satisfies a target position condition, during the movement of the recording unit, wherein the controller starts a feed operation of the subsequent medium using the feed unit at a timing before the movement of the recording unit is stopped, if the target stop position satisfies the target position condition. | 2009-03-05 |
| 20090057982 | SHEET TAKE-OUT APPARATUS - A sheet take-out apparatus includes a supplying structure configured to move a plurality of sheets supplied in a stacking state in a stacking direction and supply a sheet at a leading edge thereof in a movement direction to a take-out position, a take-out structure configured to make contact with the sheet supplied to the take-out position and rotate, thereby taking out the sheet in a direction almost orthogonal to the stacking direction, and move the sheet to a conveying route, a suction structure configured to generate an air current to suck the sheet at the leading edge in the movement direction to the take-out position on an upstream side of a position where the take-out structure makes contact with the sheet in the sheet take-out direction by the take-out structure, and a controller configured to control an operation of the suction structure so as to decrease suction force by the suction structure when the sheet at the leading edge in the movement direction is not taken out by the take-out structure. | 2009-03-05 |
| 20090057983 | SHEET STACKING APPARATUS AND SHEET STACKING METHOD - In a sheet stacking apparatus, a pair of side members includes a pair of lower side members which is provided with an approximately same distance therebetween as a width of a planographic printing plate and limits a movement in the planographic printing plate width direction; and a pair of upper side members which are provided above the pair of lower side members, each of which is provided with a movable section movable in the planographic printing plate width direction, and on which tapered surfaces are formed facing each other in a generally V shape. The distance between the pair of upper side members is controlled by driving the movable sections of the pair of upper side members so as to prevent quality degradation caused by a thrown-in sheet scratching a stacked sheet. | 2009-03-05 |
| 20090057984 | SHEET CARRYING DEVICE, DOCUMENT CARRYING DEVICE, IMAGE FORMING APPARATUS, AND SHEET CARRYING METHOD - A sheet carrying device includes: a pickup roller sending out a sheet on a sheet mounting tray into a carrying path one sheet at a time; a sheet carrying device rotating the pickup roller; a control section controlling a roller first driving motor; and a carrying delay detecting section detecting delay in sheet carrying carried out by the pickup roller. The control section controls the roller first driving motor, in a case where the delay in the sheet carrying is detected by the carrying delay detecting section, so that (i) the pickup roller once stops and then restarts rotating and (ii) a start-up acceleration of the pickup roller, which start-up acceleration is an acceleration from the restart of rotation to arrival at a predetermined speed, becomes lower than a first start-up acceleration from start of rotation of the pickup roller to arrival at the predetermined speed in a case where there is no delay in the sheet carrying. This makes it possible to prevent process efficiency from deteriorating due to retry, in an arrangement in which a feeding operation of a sheet from the sheet mounting try is retried. | 2009-03-05 |
| 20090057985 | Paper pick-up mechanism and feeder using the same - A paper pick-up mechanism for a feeder includes a pick-up roller, a pick-up roller shaft, a separation roller, a transmission shaft, a gear set and a transmission gear shaft. Two one-way clutches are respectively coupled to the transmission shaft and the transmission gear shaft in parallel. When the transmission shaft is rotated in a direction opposite to a sheet-feeding direction, the gear set, through the cooperation of the two one-way clutches are used as a planetary gear set to lift up the pick-up roller. | 2009-03-05 |
| 20090057986 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A sheet feeding apparatus which feeds each of sheets lifted by blowing air, wherein the amount of movement of a tray from the detection of the tray which stacks a plurality of sheets by a lower position detecting sensor to the detection of the uppermost position of the sheets on the tray by a sheet surface detecting sensor is m, wherein the amount of movement of the tray until the sheet on the tray is positioned within a predetermined range when the sheet on the tray is outside from between the lifting lower limit sensor and the lifting upper limit sensor (the predetermined range) is q, wherein the amount of the sheets stacked on the tray is calculated from the amount of movement m+q of the tray and is then displayed on a remaining amount displaying portion. | 2009-03-05 |
| 20090057987 | SHEET CARRYING DEVICE, DOCUMENT CARRYING DEVICE, IMAGE FORMING APPARATUS, AND SHEET CARRYING METHOD - A sheet carrying device includes a pickup roller sending out a sheet to a carrying path one by one from a document mounting tray, a roller first driving motor rotating the pickup roller, a control section controlling the roller first driving motor, and a slip detecting device detecting whether the pickup roller slips in an amount not less than a predetermined amount in carrying the sheet. Detecting that the pickup roller slips, the control section controls the roller first driving motor to perform a slip-settling operation for decreasing a start-up acceleration of the pickup roller from a time when starting to rotate to a time when reaching a predetermined speed. This allows reliably carrying a sheet and suppressing a decrease in a carrying speed of the sheet in order to prevent a decrease in a speed of a process including sheet carrying, even when the pickup roller slips in feeding the sheet from the sheet mounting tray. | 2009-03-05 |
| 20090057988 | FEEDING APPARATUS AND RECORDING APPARATUS - A feeding apparatus includes a cassette unit and a feeding-apparatus main body. The cassette unit can be mounted and dismounted to/from the feeding apparatus. The cassette unit includes a casing which is the base member of the cassette unit; a movable cassette hopper on which a housed recording medium is to be placed; and a locking section that holds the attitude of the cassette hopper. The feeding-apparatus main body includes a contact portion that comes into contact with the locking section to release the holding state when the cassette unit is mounted to the feeding-apparatus main body. | 2009-03-05 |
