| 09th week of 2021 patent applcation highlights part 71 |
| Patent application number | Title | Published |
|---|
| 20210066116 | Contact Isolation in Semiconductor Devices | 2021-03-04 |
| 20210066117 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 2021-03-04 |
| 20210066118 | SEMICONDUCTOR STRUCTURES INCLUDING STACKED DEPLETED AND HIGH RESISTIVITY REGIONS | 2021-03-04 |
| 20210066119 | Isolation Structures | 2021-03-04 |
| 20210066120 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | 2021-03-04 |
| 20210066121 | Patterning Methods for Semiconductor Devices and Structures Resulting Therefrom | 2021-03-04 |
| 20210066122 | Amorphous Layers for Reducing Copper Diffusion and Method Forming Same | 2021-03-04 |
| 20210066123 | SEMICONDUCTOR DEVICE | 2021-03-04 |
| 20210066124 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 2021-03-04 |
| 20210066125 | STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT FEATURE | 2021-03-04 |
| 20210066126 | CONDUCTIVE STRUCTURES FOR CONTACTING A TOP ELECTRODE OF AN EMBEDDED MEMORY DEVICE AND METHODS OF MAKING SUCH CONTACT STRUCTURES ON AN IC PRODUCT | 2021-03-04 |
| 20210066127 | METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE | 2021-03-04 |
| 20210066128 | METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | 2021-03-04 |
| 20210066129 | RECOGNITION METHOD OF KERF | 2021-03-04 |
| 20210066130 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | 2021-03-04 |
| 20210066131 | THREE-DIMENSIONAL ELECTRONIC DEVICE THROUGH ORGANIC SOLVENT PLASTICIZATION PROCESS OF POLYMER FRAME, AND METHOD FOR MANUFACTURING SAME | 2021-03-04 |
| 20210066132 | MULTI-DEPTH ETCHING IN SEMICONDUCTOR ARRANGEMENT | 2021-03-04 |
| 20210066133 | PROCESS FOR MANUFACTURING MICRO-ELECTRONIC COMPONENTS | 2021-03-04 |
| 20210066134 | SEMICONDUCTOR DEVICE HAVING DEEP TRENCH STRUCTURE AND METHOD OF MANUFACTURING THEREOF | 2021-03-04 |
| 20210066135 | Array Of Vertical Transistors And Method Of Forming An Array Of Vertical Transistors | 2021-03-04 |
| 20210066136 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES WITH MIXED THRESHOLD VOLTAGES BOUNDARY ISOLATION OF MULTIPLE GATES AND STRUCTURES FORMED THEREBY | 2021-03-04 |
| 20210066137 | Gate-All-Around Device with Trimmed Channel and Dipoled Dielectric Layer and Methods of Forming the Same | 2021-03-04 |
| 20210066138 | CRYSTALLIZATION MONITORING METHOD, LASER ANNEALING APPARATUS, AND LASER ANNEALING METHOD | 2021-03-04 |
| 20210066139 | THIN-FILM NON-UNIFORM STRESS EVALUATION | 2021-03-04 |
| 20210066140 | SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM, SEMICONDUCTOR DEVICE INSPECTION DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2021-03-04 |
| 20210066141 | Anomaly Detection and Remedial Recommendation | 2021-03-04 |
| 20210066142 | Asymmetry Correction Via Oriented Wafer Loading | 2021-03-04 |
| 20210066143 | SEMICONDUCTOR MEMORY DEVICE HAVING CHIP-TO-CHIP BONDING STRUCTURE | 2021-03-04 |
| 20210066144 | SEMICONDUCTOR CHIP WITH SOLDER CAP PROBE TEST PADS | 2021-03-04 |
| 20210066145 | SEMICONDUCTOR DIE, SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE INCLUDING THE SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | 2021-03-04 |
| 20210066146 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2021-03-04 |
| 20210066147 | POWER MODULE | 2021-03-04 |
| 20210066148 | SEMICONDUCTOR PACKAGE | 2021-03-04 |
| 20210066149 | METHODS OF FABRICATING SEMICONDUCTOR PACKAGE | 2021-03-04 |
| 20210066150 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ELEMENT | 2021-03-04 |
| 20210066151 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2021-03-04 |
| 20210066152 | SEMICONDUCTOR DIE PACKAGE WITH WARPAGE MANAGEMENT AND PROCESS FOR FORMING SUCH | 2021-03-04 |
| 20210066153 | NITROGEN-RICH SILICON NITRIDE FILMS FOR THIN FILM TRANSISTORS | 2021-03-04 |
| 20210066154 | SEMICONDUCTOR PACKAGE | 2021-03-04 |
| 20210066155 | MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE | 2021-03-04 |
| 20210066156 | STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-03-04 |
| 20210066157 | POWER ELECTRONICS MODULE AND A METHOD OF PRODUCING A POWER ELECTRONICS MODULE | 2021-03-04 |
| 20210066158 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2021-03-04 |
| 20210066159 | HEAT DISSIPATION BOARD AND ELECTRONIC APPARATUS | 2021-03-04 |
| 20210066160 | COATING METHOD FOR LIQUID METAL THERMAL GREASE AND HEAT DISSIPATION MODULE | 2021-03-04 |
| 20210066161 | FASTENING STRUCTURE AND POWER CONVERSION APPARATUS USING FASTENING STRUCTURE | 2021-03-04 |
| 20210066162 | SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES | 2021-03-04 |
| 20210066163 | COOLING APPARATUS FOR POWER SEMICONDUCTOR AND A METHOD OF MANUFACTURING THE SAME | 2021-03-04 |
| 20210066164 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2021-03-04 |
| 20210066165 | POWER UNIT, IN PARTICULAR FOR AN AIRCRAFT | 2021-03-04 |
| 20210066166 | LIQUID-COOLING-TYPE COOLER | 2021-03-04 |
| 20210066167 | THROUGH MOLD INTERCONNECT DRILL FEATURE | 2021-03-04 |
| 20210066168 | PACKAGE AND MANUFACTURING METHOD THEREOF | 2021-03-04 |
| 20210066169 | Semiconductor devices having a serial power system | 2021-03-04 |
| 20210066170 | POWER MODULE AND METHOD FOR MANUFACTURING THE SAME | 2021-03-04 |
| 20210066171 | SEMICONDUCTOR DIE, SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE INCLUDING THE SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | 2021-03-04 |
| 20210066172 | Semiconductor Package with Leadframe Interconnection Structure | 2021-03-04 |
| 20210066173 | METHOD FOR FABRICATING PACKAGE STRUCTURE | 2021-03-04 |
| 20210066174 | SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE | 2021-03-04 |
| 20210066175 | SEMICONDUCTOR MODULE | 2021-03-04 |
| 20210066176 | SEMICONDUCTOR DEVICE | 2021-03-04 |
| 20210066177 | DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIRECTION AND SECOND SOLDER INTERCONNECTS ALIGNED IN A SECOND DIRECTION | 2021-03-04 |
| 20210066178 | MULTIPLE BALL GRID ARRAY (BGA) CONFIGURATIONS FOR A SINGLE INTEGRATED CIRCUIT (IC) PACKAGE | 2021-03-04 |
| 20210066179 | STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH THROUGH VIAS | 2021-03-04 |
| 20210066180 | ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | 2021-03-04 |
| 20210066181 | CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | 2021-03-04 |
| 20210066182 | Advanced Metal Connection With Metal Cut | 2021-03-04 |
| 20210066183 | INTEGRATED CIRCUIT WITH OPTICAL TUNNEL | 2021-03-04 |
| 20210066184 | CAPACITOR-WIREBOND PAD STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES | 2021-03-04 |
| 20210066185 | FRAME-ARRAY INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES | 2021-03-04 |
| 20210066186 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2021-03-04 |
| 20210066187 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | 2021-03-04 |
| 20210066188 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-03-04 |
| 20210066189 | PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME | 2021-03-04 |
| 20210066190 | MOLDED EMBEDDED BRIDGE FOR ENHANCED EMIB APPLICATIONS | 2021-03-04 |
| 20210066191 | SEMICONDCUTOR PACKAGES | 2021-03-04 |
| 20210066192 | PACKAGE AND MANUFACTURING METHOD THEREOF | 2021-03-04 |
| 20210066193 | SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME | 2021-03-04 |
| 20210066194 | DUAL THICKNESS FUSE STRUCTURES | 2021-03-04 |
| 20210066195 | ELECTRICAL CHIP AND OPTICAL MODULE | 2021-03-04 |
| 20210066196 | MEMORY DEVICE HAVING 2-TRANSISTOR VERTICAL MEMORY CELL AND A COMMON PLATE | 2021-03-04 |
| 20210066197 | THROUGH-PACKAGE PARTIAL VIA ON PACKAGE EDGE | 2021-03-04 |
| 20210066198 | PACKAGE WITH ELECTRICAL INTERCONNECTION BRIDGE | 2021-03-04 |
| 20210066199 | Electronic Device | 2021-03-04 |
| 20210066200 | INTEGRATED CIRCUIT DEVICE | 2021-03-04 |
| 20210066201 | DISPLAY DEVICE | 2021-03-04 |
| 20210066202 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR CHIP | 2021-03-04 |
| 20210066203 | DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY PANEL | 2021-03-04 |
| 20210066204 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2021-03-04 |
| 20210066205 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | 2021-03-04 |
| 20210066206 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2021-03-04 |
| 20210066207 | APPARATUS EXHIBITING ENHANCED STRESS RESISTANCE AND PLANARITY, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND METHODS | 2021-03-04 |
| 20210066208 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2021-03-04 |
| 20210066209 | Method and Apparatus for improved Circuit Structure Thermal Reliability on Printed Circuit Board Materials | 2021-03-04 |
| 20210066210 | PACKAGE SUBSTRATE | 2021-03-04 |
| 20210066211 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2021-03-04 |
| 20210066212 | Electrically or Temperature Activated Shape-Memory Materials for Warpage Control | 2021-03-04 |
| 20210066213 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2021-03-04 |
| 20210066214 | INTEGRATED CIRCUIT DEVICES WITH CAPACITORS | 2021-03-04 |
| 20210066215 | SEMICONDUCTOR CHIP | 2021-03-04 |
