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09th week of 2010 patent applcation highlights part 50
Patent application numberTitlePublished
20100052097CAPACITOR OF SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - A method for forming a capacitor of a semiconductor device includes f forming a cylindrical storage node over a semiconductor substrate; depositing a first dielectric layer over the cylindrical storage node; and etching the first dielectric layer to reduce a thickness of a portion of the first dielectric layer on a protruded end of the cylindrical storage node. The method further includes depositing a second dielectric layer over the etched first dielectric layer, wherein the second dielectric layer supplements a thickness of a portion of the first dielectric layer on a bottom corner of the cylindrical storage node. Finally, a cell plate is formed over the second dielectric layer.2010-03-04
20100052109SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor package includes a substrate including a substrate body having a first face and a second face opposing the first face. A first through electrode passes through the substrate body between the first face and the second face. An insulation member is disposed over the first face; and a connection member having a first conductive unit disposed inside of the insulation member is electrically connected to the first through electrode, and 10 a second conductive unit electrically connected to the first conductive unit is exposed at side faces of the insulation member. A semiconductor chip having third and fourth faces is disposed over the first face of the substrate body in a vertical direction. A second through electrode passes through the substrate body between the third and fourth faces and is electrically connected to the second conductive unit.2010-03-04
20100052113EPITAXIAL FILM, PIEZOELECTRIC ELEMENT, FERROELECTRIC ELEMENT, MANUFACTURING METHODS OF THE SAME, AND LIQUID DISCHARGE HEAD - There are disclosed an epitaxial film, comprising: heating an Si substrate provided with an SiO2010-03-04
20100052114CYCLIC SILOXANE COMPOUND, A MATERIAL FOR FORMING SI-CONTAINING FILM, AND ITS USE - The present invention has the objects to provide a novel material for forming Si-containing film, especially a material containing a cyclic siloxane compound suitable to a PECVD equipment for low dielectric constant insulating film, and to provide an Si-containing film using the same, and a semiconductor device containing those films. The present invention relates to a material for forming Si-containing film, containing a cyclic siloxane compound represented by the following general formula (1)2010-03-04
20100052115Volatile Precursors for Deposition of C-Linked SiCOH Dielectrics - Disclosed herein are precursors and methods for their use in the manufacture of semiconductor, photovoltaic, TFT-LCD, or flat panel type devices.2010-03-04
20100052116FABRICATION OF SELF-ASSEMBLED NANOWIRE-TYPE INTERCONNECTS ON A SEMICONDUCTOR DEVICE - The present invention relates to a semiconductor device with nanowire-type interconnect elements and a method for fabricating the same. The device comprises a metal structure with at least one self-assembled metal dendrite and forming an interconnect element (2010-03-04
20100052128DEVICE FOR DETECTING AN ATTACK AGAINST AN INTEGRATED CIRCUIT - An integrated circuit including an intrusion attack detection device. The device includes a single-piece formed of a conductive material and surrounded with an insulating material and includes at least one stretched or compressed elongated conductive track, connected to a mobile element, at least one conductive portion distant from said piece and a circuit for detecting an electric connection between the piece and the conductive portion. A variation in the length of said track in an attack by removal of the insulating material, causes a displacement of the mobile element until it contacts the conductive portion.2010-03-04
20100052132Semiconductor package - Provided is a semiconductor package including a first substrate including a first substrate pad and a second substrate pad spaced apart from each other, first semiconductor chips stacked on the first substrate and having a first side surface and a second side surface, first chip pads disposed on the first substrate pad and adjacent to the first side surface and provided to the respective first semiconductor chips in the peripheral circuit region and electrically connected to the first substrate pad, and a second semiconductor chip disposed toward the second side surface and including a second chip pad spaced apart from the first chip pad and electrically connected to the second substrate pad, and a heat insulation member provided to the first substrate between the at least one first substrate pad and the at least one second substrate pad.2010-03-04
201000521343-D INTEGRATED SEMICONDUCTOR DEVICE COMPRISING INTERMEDIATE HEAT SPREADING CAPABILITIES - In a three-dimensional chip configuration, a heat spreading material may be positioned between adjacent chips and also between a chip and a carrier substrate, thereby significantly enhancing heat dissipation capability. Furthermore, appropriately sized and positioned through holes in the heat spreading material may enable electrical chip-to-chip connections, while responding thermally conductive connectors may extend to the heat sink without actually contacting the corresponding chips.2010-03-04
20100052136Three-Dimensional Package and Method of Making the Same - A package comprises a first unit including a semiconductor body, a hole, an isolation layer, a conductive layer and a solder. The semiconductor body has a first surface having a pad and a protection layer exposing the pad. The hole penetrates the semiconductor body. The isolation layer is disposed on the side wall of the hole. The conductive layer covers the pad, a part of the protection layer, and the isolation layer. The lower end of the conductive layer extends to below a second surface of the semiconductor body. The solder is disposed in the hole, and is electrically connected to the pad via the conductive layer. A second unit similar to the first unit and stacked thereon includes a lower end of a second conductive layer that extends to below a second surface of a second semiconductor body and contacts the upper end of the first solder.2010-03-04
20100052137ENHANCED WIRE BOND STABILITY ON REACTIVE METAL SURFACES OF A SEMICONDUCTOR DEVICE BY ENCAPSULATION OF THE BOND STRUCTURE - The wire bond structure of sophisticated metallization systems, for instance based on copper, may be provided without a terminal aluminum layer and without any passivation layers for exposed copper surfaces by providing a fill material after the wire bonding process in order to encapsulate at least the sensitive metal surfaces and a portion of the bond wire. Hence, significant cost reduction, reduced cycle times and a reduction of the required process steps may be accomplished independently from the wire bond materials used. Thus, integrated circuits requiring a sophisticated metallization system may be connected by wire bonding to the corresponding package or carrier substrate with a required degree of reliability based on a corresponding fill material for encapsulating at least the sensitive metal surfaces.2010-03-04
20100052140PACKAGE STRUCTURE - In the specification and drawing a package structure is described and shown with a first die including a high side driver, a second die including a low side driver and at least one conducting wire, wherein the conducting wire is coupled with the first die and the second die.2010-03-04
20100052141QFN PACKAGE - An improved Quad Flat No-Lead package is described. The package is formed by encapsulating a die mounted on a leadframe with a moulding compound using a mould chase. The mould chase comprises a number of internal projections which form openings in the mould compound to expose regions of the leadframe. These exposed regions of the leadframe may then be used for soldering the package to a substrate. The arrangement of the openings may be designed such that each aperture is the same shape and size and/or that the apertures are arranged in multiple rows on the underside of the package.2010-03-04
20100052144SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES - A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.2010-03-04
20100052145SEMICONDUCTOR PACKAGE AND METHOD THEREFOR - In one embodiment, a semiconductor package is formed to include a tamper barrier that is positioned between at least a portion of the connection terminals of the semiconductor package and an edge of the semiconductor package.2010-03-04
20100052146SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.2010-03-04
20100052147SEMICONDUCTOR DEVICE INCLUDING STRESS RELAXATION GAPS FOR ENHANCING CHIP PACKAGE INTERACTION STABILITY - By dividing a single chip area into individual sub-areas, a thermally induced stress in each of the sub-areas may be reduced during operation of complex integrated circuits, thereby enhancing the overall reliability of complex metallization systems comprising low-k dielectric materials or ULK material. Consequently, a high number of stacked metallization layers in combination with increased lateral dimensions of the semiconductor chip may be used compared to conventional strategies.2010-03-04
20100052158ELECTRONIC DEVICE AND METHOD FOR COPING WITH ELECTROSTATIC DISCHARGE - According to an aspect of the present invention, there is provided an electronic device including: a substrate board; a semiconductor device mounted on the substrate board; a heat sink configured to radiate heat from the semiconductor device; a first conductive portion provided on the substrate board; and a second conductive portion provided on the substrate board, the second conductive portion separated from the first conductive portion by a discharge gap, wherein: the heat sink is electrically connected to the first conductive portion; and the second conductive portion is grounded.2010-03-04
20100052161Semiconductor wafer with adhesive protection layer - A semiconductor wafer with an adhesive protection layer includes: a wafer body having a first surface and an opposing second surface; a plurality of electrical connection pads formed on the second surface of the wafer body; and the adhesive protection layer formed on the second surface of the wafer body and the plurality of electrical connection pads, wherein the protection layer is made of a material including a photosensitive adhesive, a thermal-setting adhesive and a dielectric material. The protection layer not only isolates circuits on the wafer surface from external moisture and contaminant, but also can be patterned and is adhesive, such that the wafer can be mounted to a circuit substrate in a subsequent process by the protection layer, without having to apply an additional adhesive on the wafer, thereby greatly simplifying the wafer-substrate attachment procedure during package fabrication processes.2010-03-04
20100052164Wafer level package and method of manufacturing the same - The present invention relates to a wafer level package and a method of manufacturing the same and provides a wafer level package structure including a wafer having a die pad; a redistribution line formed to be connected on a top surface of the die pad; a metal post connected to a top surface of the redistribution line and formed in a flexure hinge structure; and a molding resin formed between the metal posts.2010-03-04
20100052167METAL LINE HAVING A MOxSiy/Mo DIFFUSION BARRIER OF SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - A metal line having a Mo2010-03-04
20100052178Semiconductor Device and Method for Making Same - One or more embodiments relate to a semiconductor device that includes: a conductive layer including a sidewall; a conductive capping layer disposed over the conductive layer and laterally extending beyond the sidewall of the conductive layer by a lateral overhang; and a conductive via in electrical contact with the conductive capping layer.2010-03-04
20100052180Semiconductor Device for Low-Power Applications and a Method of Manufacturing Thereof - The invention relates to a semiconductor device manufactured in a process technology, the semiconductor device having at least one wire (2010-03-04
20100052183MICROFEATURE WORKPIECE SUBSTRATES HAVING THROUGH-SUBSTRATE VIAS, AND ASSOCIATED METHODS OF FORMATION - Microfeature workpiece substrates having through-substrate vias, and associated methods of formation are disclosed. A method in accordance with one embodiment for forming a support substrate for carrying microfeature dies includes exposing a support substrate to an electrolyte, with the support substrate having a first side with a first conductive layer, a second side opposite the first side with a second conductive layer, and a conductive path extending through the support substrate from the first conductive layer to the second conductive layer. The method can further include forming a bond pad at a bond site of the first conductive layer by disposing at least one conductive bond pad material at the bond site, wherein disposing the at least one conductive bond pad material can include passing an electrical current between the first and second conductive layers via the conductive path, while the substrate is exposed to the electrolyte.2010-03-04
20100052185SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a semiconductor element, a first electrode of the semiconductor chip being configured on a first surface of the semiconductor element, a second electrode of the semiconductor element being configured on a second surface opposed to the first surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, a first hole and a second hole being configured in the encapsulating material, a portion of the first electrode and a portion of the second electrode being exposed, a first conductive material being connected to the first surface of the semiconductor chip via the first hole, a second conductive material being connected to the second surface of the semiconductor chip via the second hole, and a plating film covering five surfaces of the first conductive material other than one surface contacting with the encapsulating material and five surfaces of the second conductive material other than one surface contacting with the encapsulating material.2010-03-04
20100052187STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME - A stacked semiconductor package having a unit package, cover substrates, adhesive members and connection electrodes is presented. The unit package includes a substrate, a first circuit pattern and a second circuit pattern. The first circuit pattern is disposed over an upper face of the substrate. The second circuit pattern is disposed over a lower face of the substrate. The lower and upper faces of the substrate oppose each other. The first and second semiconductor chips are respectively electrically connected to the first and second circuit patterns. The cover substrates are opposed to the first semiconductor chip and the second semiconductor chip. The adhesive members are respectively interposed between the unit package and the cover substrates. The connection electrodes pass through the unit package, the cover substrates and the adhesive members and are electrically connected to the first and second circuit patterns.2010-03-04
20100052190SEMICONDUCTOR DEVICE - A semiconductor device includes: a base plate; a semiconductor element provided on the base plate; a holder provided on an opposite side of the semiconductor element from the base plate and holding terminals electrically connected to the semiconductor element; a casing surrounding the semiconductor element and opposed to a side surface of the holder; and a sealing resin filled among the base plate, the casing, and the holder. The side surface of the holder is provided with a first protrusion protruding toward the casing. The first protrusion is nearer to the base plate than a major surface of the holder on an opposite side from the base plate. A surface of the first protrusion on an opposite side from the base plate is at least partly buried in the sealing resin.2010-03-04
20100052191Metrology Mark with Elements Arranged in a Matrix, Method of Manufacturing Same and Alignment Method - A method of manufacturing an integrated circuit provides a metrology mark (e.g., alignment mark or overlay mark). The method includes forming a first plurality of first structures arranged in a matrix in a substrate. Portions of the matrix are covered with a mask such that first portions of the matrix are left exposed and second portions of the matrix are covered. Signal response properties of exposed ones of the first structures in the matrix are altered to form a metrology mark. The metrology mark includes first and second mark portions with different signal response properties and which are aligned to a virtual grid. The evaluation of precisely positioned metrology marks may be improved with low impact on process complexity.2010-03-04
20100052192ELECTRONIC ELEMENT WAFER MODULE AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT WAFER MODULE, ELECTRONIC ELEMENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT MODULE, AND ELECTRONIC INFORMATION DEVICE - An electronic element wafer module is provided, in which a transparent support substrate is disposed facing a plurality of electronic elements formed on a wafer and a plurality of wafer-shaped optical elements are disposed on the transparent support substrate, where a groove is formed along a dicing line between the adjacent electronic elements, penetrating from the optical elements through the transparent support substrate, with a depth reaching a surface of the wafer or with a depth short of the surface of the wafer; and a light shielding material is applied on side surfaces and a bottom surface of the groove or is filled in the groove, and the light shielding material is applied or formed on a peripheral portion of a surface of the optical element, except for on a light opening in a center of the surface.2010-03-04
20100052195Optical film structure and a manufacturing method thereof - An optical film structure and a manufacturing method thereof are disclosed. By using the co-extrusion manufacturing process, the substrate, the first light-transparent material, and the second light-transparent material are combined into one piece to change the light path. By using the rolling way, the surface of the first light-transparent material directly forms a light-guiding micro-structure. Furthermore, at least one layer out of the substrate, the first light-transparent material, and the second light-transparent material are added with the diffusion particles to form the optical film structure that has an anti-scratch effect and high yield rate. Therefore, the present invention provides a uniform optical film structure that is formed into one piece by using the co-extrusion manufacturing process to prevent the structure from being warped due to environmental variations. By adding the diffusion particles on the optical film structure, the improved optical film having anti-scratch effect and high yield rate is formed.2010-03-04
20100052196OPTICALLY DRIVEN ACTUATOR AND METHOD OF MANUFACTURING THE SAME - An optically driven actuator includes a crosslinked polymer obtained by crosslinking at least part of the side chains of a condensation polymer having, on its backbone chain, a photoisomerizable group that undergoes structural change under optical stimulation. The crosslinked polymer deforms reversibly depending on optical stimulation, thereby performing the function of an actuator.2010-03-04
20100052197Method for Manufacturing Ceramic Honeycombs - Methods for making extruded ceramic products meeting set dimensional specifications comprise subjecting a small firing sample taken from a first unfired product preform to a rapid firing treatment to determine a value for firing shrinkage or growth, and then adjusting the dimensions of succeeding unfired preforms based on that value, e.g., by adjusting wet extruded product dimensions, so that the succeeding preforms will meet the set dimensional specifications.2010-03-04
20100052200Method For Porous Ceramic Honeycomb Shrinkage Reduction - A method for reducing shrinkage variability of ceramic honeycombs formed from batch mixtures including inorganic materials and a pore former. X is a cumulative amount of pore former particles having a diameter less than 37 μm. There is a maximum value of X (Xmax) and a minimum value of X (Xmin) during a production period, and ΔX=Xmax−Xmin. The method fixes an amount of pore former fines such that X ranges from 25%-71% by volume, and ΔX is ≦23% throughout the production period.2010-03-04
20100052203YARN LAYER FORMING APPARATUS, YARN LAYER FORMING METHOD, AND METHOD OF MANUFACTURING FIBER-REINFORCED MEMBER - A yarn layer forming apparatus includes: an annular braider that supplies braider yarn; an annular first supply device that supplies first yarn; an annular second supply device that supplies second yarn; and an actuating device that moves a mandrel. At least one of the first supply device and the second supply device is rotatable. A layer structure of yarn layers is formed on a peripheral surface of the mandrel. The layer structure of yarn layers includes at least yarn arrangement layers formed respectively by the first and second supply devices and a woven layer formed by the braider.2010-03-04
20100052204METHOD FOR MANUFACTURING AGGREGATED RESIN PARTICLES - A method for manufacturing aggregated resin particles, includes: preparing a microreactor that includes a first flow channel, a second flow channel, and a confluent flow channel, to which the first flow channel and the second flow channel merge; introducing a first fluid that contains resin particles dispersed therein into the first flow channel; introducing a second fluid that contains an aggregating agent into the second flow channel; feeding the first and second fluids so that a feed amount per unit time of the second fluid is greater than a feed amount per unit time of the first fluid, so as to form a laminar flow, in which the first fluid and the second fluid are merged, in the confluent flow channel; and forming aggregated resin particles by aggregating the resin particles.2010-03-04
20100052207Method of Preparing Microarray by Using Optically Transparent Array Mold with Concave Portion - A method of preparing a microarray includes preparing an array mold having a concave portion comprising a fluidic channel having a fluid inlet and a fluid outlet, wherein the array mold comprises an optically transparent material; adhering a substrate to a surface of the array mold in which the concave portion is formed to form an adhered structure comprising the array mold and the substrate, the adhered structure comprising a chamber defined by a space between the concave portion and the substrate; and introducing a biomaterial into the chamber via the fluid inlet of the adhered structure to immobilize the biomaterial on a surface of the substrate in the chamber.2010-03-04
20100052218Gas Recirculation Heat Exchanger For Casting Silicon - This invention relates to a system and a method of use for a gas recirculation heat exchanger to cast high purity silicon and/or grow crystals. The heat exchanger includes a hot surface for thermal contact with a crucible along with an inlet for flowing a gas to the heat exchanger and an outlet for flowing the gas from the heat exchanger. The exchanger also includes a baffle dividing the inlet from the outlet and for directing at least a portion of the gas over the hot surface, and a recirculation system adapted to cool the gas and return the gas to the heat exchanger. The heat exchanger can be easily tailored to local cooling needs.2010-03-04
20100052220Ceramic Product Made with Glass and High Alumina Cement and Method of Manufacturing Same - A composition of matter incorporating waste glass into a ceramic and cement composite material, comprising: 70 to 95 percent by weight glass; 5 to 35 percent by weight high alumina cement; 0 to 20 percent by weight inert filler; and 0 to 5 percent by weight additives.2010-03-04
20100052222METHOD AND DEVICE FOR CREATING THREE-DIMENSIONAL HOLLOW OBJECTS FROM RADIATION CURABLE RESIN - A device for forming hollow three-dimensional objects from radiation curable resin includes a light container having an interlocking base and a pivotal lid with cooperating interior surfaces forming a light chamber. An interior surface of the pivotal lid has a light source attached thereto directing light toward an interior surface of the interlocking base. A multi-axis rotating mechanism, such as a gyroscope, is positioned within the light container, the gyroscope having moving rings. A translucent three-dimensional mold capsule is removably secured to the multi-axis rotating mechanism, wherein a radiation curable resin is inserted in to the mold capsule. The associated method includes providing a translucent mold capsule with a hollow interior chamber; filling the translucent mold capsule with an amount of radiation curable resin sufficient to coat an interior surface of the hollow interior chamber of the translucent mold capsule; sealing the translucent mold capsule to contain the radiation curable resin within the hollow interior chamber; inserting and attaching the translucent mold capsule into a multi-axis rotating mechanism; positioning the multi-axis rotating mechanism within a light container having an interlocking base and lid and light source; activating the light source; setting the multi-axis rotating mechanism in motion for a period of time; removing the translucent mold capsule from the multi-axis rotating mechanism; and removing the hollow three-dimensional object so formed from the translucent mold capsule.2010-03-04
20100052224HEATING DEVICE FOR PLASTIC BLANKS - The invention relates to a method and a device for heating preforms of a thermoplastic material, the preforms, after having been heated, being subjected to a reshaping operation, and microwaves being applied to the preforms, at least during a portion of the period of heating, in a resonator.2010-03-04
20100052225METHOD OF MANUFACTURING SLABS OF CERAMIC MATERIAL - In the method for manufacturing slabs of ceramic material which envisages preparation of an initial mix comprising ceramic sands with a grain size of less than 2 mm, preferably less than 1.2 mm, a binder and the so-called filler namely mineral powders chosen from feldspars, nephelines, sienites, mixed with clays and/or kaolinites, which powders after firing form a continuous ceramic matrix, deposition of the initial mix on a temporary support for the compaction step by means of vacuum vibrocompression, drying and firing, a binder consisting of an aqueous dispersion of colloidal silica called silicasol is used.2010-03-04
20100052270APPARATUS FOR TRANSPORTING AN INVALID - The transportation apparatus includes a frame a seat portion which slides on the frame. A leg support pivots about the seat portion. At least one middle leg and at least one rear leg depends downwardly from the seat portion. At least one middle wheel is connected to the middle leg and at least one rear wheel is connected to the rear leg. The middle wheel and rear wheel define a middle and rear rotation axes, respectively. At least one front wheel is connected to the leg support. The middle leg is movable to adjust the vertical position of the middle wheel, and the rear leg is movable to adjust the vertical position of the rear wheel.2010-03-04
20100052271Torsionally Flexible Axle with Active Control of the Steering Angle using a Hydroelastic Joint - A suspended axle for a motor vehicle comprising a torsionally flexible beam (2010-03-04
20100052273WHEELED MILITARY VEHICLE - The Invention is a wheeled military vehicle that may be stacked one on top of another for efficient transportation aboard an aircraft such as a helicopter. A tubular frame reinforces the fenders of the military vehicle, allowing a first vehicle to support the weight of a second vehicle and to withstand the load applied by rigging. A pintle hook is connected to the military vehicle by a hinge and has a deployed and a folded position. The hinged pintle hook allows a combination of the military vehicle and a trailer to be shortened selectably so that the combination will occupy a reduced space within the fuselage of an aircraft.2010-03-04
20100052274CART ASSEMBLIES FOR USE WITH BLOOD FILTRATION - Cart assemblies for use with blood filtration are described. An example cart assembly for use with blood filtration includes a base including a recessed portion to receive one or more containers defining compartments each to receive a container of a fluid transfer system. Additionally, the base includes a plurality of transport members coupled to respective portions of the base. A plane on which a surface of the recessed portion lies is below a portion of each of the plurality of transport members. Additionally, the cart assembly includes a hanger assembly comprising a plurality of suspension members from which another container of the fluid transfer system is to be suspended and a pole to couple the base to the hanger assembly.2010-03-04
20100052276ROLLING TOOL CART - A portable containers assembly comprising a base cabinet in the form of a bucket having an upper end and a top case assembly comprising at least one top cabinet. The top cabinet is slidably secured to the base cabinet. The top cabinet is slidable between a closed position in which it substantially covers the upper end of the base cabinet, and an open position in which it exposes the base cabinet. The portable containers assembly further comprising a locomotive assembly having a wheeling assembly and a handle assembly for locomoting the portable containers assembly.2010-03-04
20100052288Modular cart for a gas turbine engine - A modular cart for a gas turbine engine is disclosed. The modular cart may have a first cart with a first connection portion and a first mounting location. The modular cart may further have a second cart with a second connection portion and a second mounting location. The first connection portion of the first cart may be configured to attach to the second connection portion of the second cart. The modular cart may also have a cart component configured to interchangeably mount to either the first mounting location of the first cart or to the second mounting location of the second cart.2010-03-04
20100052290Sway Control Device for Trailers - The present invention relates to an apparatus for reducing sway of a trailer towed by a towing vehicle. The apparatus comprises a draw bar for linking a trailer to a vehicle and means for hitching the trailer to the draw bar and for hitching the draw bar to the vehicle. The apparatus also comprises a body associated with the hitching means such that horizontal angular movement of the draw arm relative to the draw bar causes a substantially equivalent horizontal angular movement of the body relative to the draw bar. The apparatus further comprises means linked to the body for dampening horizontal angular movement of the body and, thereby, dampening horizontal angular movement of the trailer.2010-03-04
20100052293MOBILE MODULAR CART/CASE SYSTEM FOR OXYGEN CONCENTRATORS AND INFUSION PUMP SYSTEMS - An apparatus for operatively carrying and providing ready access to the operation of a portable oxygen concentration module is provided. The apparatus comprises a carrying case having a hollow body portion defining a first inner chamber therein, a lower end configured to stabilize the carrying case in an upright position when the carrying case is rested on a generally planar surface, and an upper end defining a primary opening to the first inner chamber. The primary opening is sized and configured to permit the oxygen concentration module to be deposited into the first inner chamber therethrough. The first inner chamber is sized and configured to receive and operatively retain the oxygen concentration module therein. The apparatus further comprises a plurality of intake vents integrated within the hollow body portion, a plurality of exhaust vents integrated within the hollow body portion, and a first aperture integrated within the carrying case. The intake vents are positioned to align with inlet vents of the oxygen concentration module when the oxygen concentration module is received within the first inner chamber to permit ambient air to be drawn into the oxygen concentration module from a surrounding atmosphere. The exhaust vents are positioned to align with outlet vents of the oxygen concentration module when the oxygen concentration module is received within the first inner chamber to permit exhaust gas to be vented from the oxygen concentration module to the surrounding atmosphere. The first aperture is positioned to align with an outlet port of the oxygen concentration module when the oxygen concentration module is received within the first inner chamber to allow attachment of an oxygen delivery tube to the outlet port of the oxygen concentration module.2010-03-04
20100052294Exterior Airbag for Vehicles - An exterior airbag for vehicles is deployed forwards in the front of a vehicle just before a collision of the vehicle. The exterior airbag may include a plurality of airbag housings mounted to a bumper of the vehicle, a plurality of airbag cushions received in respective airbag housing and configured to at least encircle a front surface of the bumper while forming overlapping portions at adjacent sides of the airbag cushions when the airbag cushions are fully deployed, and at least an inflator providing a deploying force to each of the airbag cushions.2010-03-04
20100052296Knee-protecting airbag apparatus - A knee-protecting airbag apparatus is mountable on a door of a glove box that has a box body provided with an opening at the rear and the door. The airbag apparatus includes an airbag, a generally columnar inflator housed in the airbag, a case housing the airbag and inflator, and an airbag cover constituting a rear face of the glove box door and being openable at airbag deployment. The inflator includes a body that discharges inflation gas and a fixing section that secures the body and the airbag to the case. The fixing section includes a projecting portion and the projecting portion extends at an upward or downward angle to the thickness direction of the glove box door.2010-03-04
20100052299INFLATOR FOR AN AIRBAG - An inflator for an airbag is provided. The inflator can include a housing that has a first end and a second end. The inflator can also include a gas generant disposed in the housing that defines a bore. The inflator can include an igniter coupled to the first end of the housing that can detonate the gas generant upon receipt of a signal. The inflator can further include a temporary closure coupled to the second end of the housing that can be opened to provide an exit out of the housing. The ignition of the igniter can generate a shockwave that passes through the bore to open the temporary closure.2010-03-04
20100052300Airbag and airbag device - An airbag for restraining an occupant includes a sheet-shaped web having a predetermined shape and a circumferential edge. The web is folded and arranged such that the circumferential edge is overlapped and gathered substantially in one location of the web and joined together so as to form a substantially sealed inner space inside the airbag.2010-03-04
20100052303PRETENSIONER DEVICE AND METHOD OF MANUFACTURING THE SAME - In a pretensioner device, a boot formed into a cylindrical shape covers a circumference of an elongated member, and a tip end of webbing inserted into an insertion hole of a joint anchor through a pair of through-holes formed on an upper end side of the boot is sewn at portions in front of and behind an insertion portion, whereby the boot is engaged with the elongated member. The insertion hole of the joint anchor is exposed to outside of the boot through the pair of through-holes of the boot even in a state in which the elongated member is covered with the boot. Therefore, positional shift of the boot relative to the webbing is prevented, and sewing operation of the webbing may be performed by inserting the tip end of the webbing into the insertion hole of the joint anchor after covering the elongated member with the boot.2010-03-04
20100052305HOLLOWBACK BOOK AND BACKLINING STICKING APPARATUS - A hollowback book includes: a content constructed by bonding plural leaves into a single body at a spine part; a cover that surrounds the content; and a backlining that is formed in a flattened tube, is disposed between the spine part and the cover, and connects the content and the cover due to an outer surface of a content-side portion being bonded to the spine part and an outer surface of a cover-side portion being bonded to the cover. An IC tag is attached to an inner surface of the cover-side portion of the backlining.2010-03-04
20100052306HYBRID STORAGE OF DOCUMENTS - A hybrid storage apparatus for retaining printed content and storing digital content includes a loose-leaf binder configured to retain printed pages containing printed content, and a storage device that is fixedly attached to the loose-leaf binder. The storage device includes a socket port detachably connect to a cable, and a non-volatile memory coupled to the socket port and configured for storing digital content. The cable is separate from the hybrid storage apparatus and used for communicating with a host. Also provided is a hybrid storage apparatus for holding print media and for storing digital content that includes a plurality of pages containing printed content, a cover for retaining the pages, and a storage device that is fixedly attached to or embedded within the cover. The pages include at least one page that displays a table of contents and refers to the digital content items stored in the non-volatile memory.2010-03-04
20100052328HYBRID WIND TURBINE - COMBUSTION ENGINE ELECTRICAL POWER GENERATOR - A hybrid power generator is characterized by the combination of a wind turbine and a combustion engine to drive a generator. The wind turbine and combustion engine are each connected with the generator via a drive train. Each drive train preferably includes a gearbox and a clutch, with the clutches being operated by a controller to determine which of the wind turbine and combustion engine are connected with the generator. Preferably, under high wind conditions, only the wind turbine is connected with the generator to produce electricity for delivery to a power grid via a converter. During periods of peak demand and low or no wind conditions, the combustion engine is connected with the generator. It is also possible to connect the wind turbine and combustion engine with the generator at the same time. Also, a differential at the input to the generator can compensate for the different rotary speed outputs from the wind turbine and the combustion engine.2010-03-04
20100052332Environment friendly remote control - A remote control is suggested, which comprises an electric signal transmitter being supplied with energy from an electrical energy storage device. The remote control comprises a generator for converting mechanical energy into electrical energy to be stored in the electrical energy storage device. The remote control is provided with a display indicating an empty electrical energy storage device. The display informs the user immediately and unambiguously about the situation that he has to recharge the energy storage of the remote control before he tries to send out a command in vain.2010-03-04
20100052333Wast water energy system and method - A waste water energy system and method for producing electric power using waste water. Waste water from a waste water source is provided to one or more electric power generating devices that utilize waste water in and for the production of electric power.2010-03-04
20100052335RELEASE HANDLE WITH INTEGRATED INERTIA LOCKING MECHANISM - An integrated inertia locking mechanism may be incorporated with a door handle assembly and is particularly beneficial in acceleration events, such as a multiple axis crash, by counteracting the forces of inertia caused by such crash. In an exemplary aspect, the integrated inertia locking mechanism will prevent the door latch mechanism, which releases the door, from releasing and the door opening during a multiple axis crash. After the crash, or when the crash force is removed, the integrated inertia locking mechanism will allow the latch mechanism to function normally, thereby permitting the door to be opened and the occupants to exit from the vehicle.2010-03-04
20100052338GASKET-COMPENSATING LATCH MECHANISM - A latch for an appliance or the like provides a floating bolt assembly spring biasing a door against a sealing gasket in different positions depending on gasket compliance. A lock provides a stop that may adjustably bridge a distance between the latch frame and the floating bolt assembly as the gasket ages thereby providing positive locking of the door over the life of the appliance.2010-03-04
20100052340DOOR RESTRAINING DEVICE - In one aspect, the present invention relates to a door restraining device. In one embodiment, the door restraining device includes a base portion having a first end and an opposite, second end defining therebetween a base body having a base length and extending along a first direction, a first wall portion extending away from the first end of the base portion along a second direction that is different from the first direction, a second wall portion extending away from the second end of the base portion along a third direction that is different from the first direction, and, a rotatable arm portion rotatably connected at its first end to the first wall portion at a fixed rotation point.2010-03-04
20100052341VEHICLE LATCH WITH SECONDARY ENGAGEMENT BETWEEN CAM AND AUXILIARY PAWL - In a first aspect, the invention is directed to a vehicle latch including a ratchet, a main pawl, a cam, and at least one auxiliary pawl, wherein a secondary engagement is provided between the cam and the at least one auxiliary pawl in case a primary engagement between the cam and at least one auxiliary pawl is missed. In a particular embodiment of the first aspect, the ratchet is movable between a ratchet open position wherein the ratchet is positioned to receive a striker and a ratchet locking position wherein the ratchet is positioned to retain the striker. The ratchet is biased towards the ratchet open position. The main pawl is movable between a main pawl locking position wherein the main pawl is positioned to hold the ratchet in the ratchet locking position and a main pawl release position wherein the main pawl permits the movement of the ratchet out of the ratchet locking position. The main pawl is biased towards the main pawl locking position. The cam is operatively connected to the main pawl. The cam is movable between at least two main pawl enabling positions in which the main pawl is enabled to move to the main pawl locking position, and a main pawl disabling position in which the cam positions the main pawl in the main pawl release position. The cam is biased towards the main pawl disabling position. The at least one auxiliary pawl is movable to hold the cam in each of the at least two main pawl enabling positions and movable to permit the cam to move to the main pawl disabling position.2010-03-04
20100052343FITTING, CRANE HOOK, AND CRANE HOOK ASSEMBLY - A method of lifting an aircraft at a lifting location, the method comprising: securing a fitting (2010-03-04
20100052346Pulling Grips for Installing a Fiber Optic Assembly - Pulling grips for installing a fiber optic assembly are disclosed. The pulling grip includes a pulling grip housing for receiving part of a fiber optic assembly therein. The pulling grip may also include a pulling grip sleeve and/or pulling sock. In one embodiment, the pulling grip housing has a friction fit with the pulling grip sleeve when assembled, thereby inhibiting rotation therebetween. Consequently, the friction fit advantageously inhibits twisting of the fiber optic assembly when installing the same using the pulling grip. In this manner, the pulling grip housing can easily be insert into the pulling grip sleeve and removed when pulling of a fiber optic assembly is completed. The pulling grip housing, pulling grip sleeve, and/or pulling sock may also be reused for pulling other fiber optic assemblies.2010-03-04
20100052348GRIPPER WITH SELF-COMPENSATING JAW GUIDES - The present disclosure describes a gripper assembly which in one form includes a body, at least one jaw, a longitudinally extending wedge, and a spring. The body has a slot disposed therein and opposed longitudinally extending walls. The jaw is laterally slideable within the slot. The longitudinally extending wedge is fitted along the longitudinally extending wall. The jaw comprises a surface that is engageable with the wedge. The surface of the jaw is slideable along the wedge. And a spring biases the wedge toward the jaw to reduce the running clearance between the two structures.2010-03-04
20100052350COMFORT GRIP FOR BAG HANDLES - A thin walled tube has a slit though which a bag handle can be inserted to reduce the pressure against the hand of the pressure against the hand of the carrier of the bag. The tube may be a cardboard tube rolled from a flat sheet into a cylinder and may have indentation at its opposite ends to locate the side edges of the handle. The outer surface of the cylinder may be decorated or carry printed advertizing or the like.2010-03-04
20100052351EMERGENCY RESPONSE VEHICLE - The invention relates to a vehicle used in transporting or treating large numbers of victims or patients from a mass-casualty incident to or from a hospital in an evacuation situation. The typical vehicle contains a stacked stretcher system, a loading ramp system, and an oxygen system. This vehicle must have an independent energy source or must be capable of being powered by an outside energy source. The vehicle can be flexible enough to provide facilities for treatment of victims either at the site of a disaster, in route from the disaster, at any remote site, or near a healthcare facility. A variation of the vehicle contains refrigeration or freezer units and is capable of transporting or maintaining casualties until mortuary services can be obtained. Variations of the equipment include trays made of stainless steel, stretchers that can be easily cleaned and that allow for easy drainage of liquids.2010-03-04
20100052354COMPOSITE STAKE RACKS FOR FLATBED TRUCK BODY - A panel for a stake rack assembly for a cargo area of a truck bed includes a first surface and a second surface opposing the first surface. The first and second surfaces include a plurality of openings to define generally horizontal sections and generally vertical sections that form rails and stakes of the panel, wherein the panel is formed of a polymer material.2010-03-04
20100052356Suspension system for a seat assembly including an array of fluid chambers and machine using same - A suspension system for a seat assembly of a machine includes an upper support member and a lower support member. An array of fluid chambers is operatively connected to the upper and lower support members. Each of the fluid chambers includes an electronically controlled valve for controlling an amount of fluid within the fluid chambers. An elastomer is coupled between the upper support member and the lower support member. An electronic controller is in communication with each of the electronically controlled valves and is configured to actuate the valves in response to a movement of the machine.2010-03-04
20100052357Automated cover system for vehicle-mounted containers - A self-contained, vehicle-mounted system for operating a retractable cover with respect to proximate open top containers transported by the vehicle to cover and uncover the containers. The system includes all of the items necessary to accomplish the covering and uncovering of a container and needs only to be mounted on the vehicle and connected to a source of electric power on the vehicle.2010-03-04
20100052380Capacitor Type Seat Sensor - A capacitor seat sensor includes a cushion pad for a vehicle seat, protective panels installed on an upper surface of the cushion pad, including upper, intermediate and lower sheets, and extending a predetermined distance beyond a front end of the cushion pad, conductive panels including a sensor antenna panel and a sensor guard panel which is respectively interposed between the upper and intermediate sheets of the protective panels and between the intermediate and lower sheets of the protective panels to detect the presence of an occupant on the cushion pad, and a fastener for fastening front end portions of the protective panels onto a lower end of the cushion pad so as to prevent the conductive panels from wrinkling.2010-03-04
20100052382TRANSPORT SEATING - Two rows of seats (2010-03-04
20100052385Portable Child Seat - A portable children's child seat for an adult seat such as a chair, church pew, bench, or structure with a seat-like configuration. The child seat has a bottom, a back, a frame, a belt, a tray, a closing strap, a hood and an attachment mechanism for securing the child seat to an adult seat. The child seat has a deployed position where it is ready for occupation by a child, and a compact position where a child seat bottom and a child seat tray are in a raised position.2010-03-04
20100052386LOW MAINTENANCE CONFIGURATION FOR SLIDING SEATS - A vehicle has an area capable of seating ambulatory passengers and alternatively receiving a mobility aid, such as a wheelchair. The area provides tracks for mounting at least two movable seats that can be moved to provide space in the area for the mobility aid. The tracks are provided with track covers that reduce maintenance requirements by preventing entry of debris. One of the seats is configured to move further than the other whereby the spacing between the seats after moving to accommodate a mobility aid is less than the spacing of the seats when used by ambulatory passengers. The seat configured to move further has a longer track cover, but the tracks are laterally spaced to avoid engagement between the track covers of the two seats whereby they can be moved to be spaced from each other by a distance less than the length of either of the track covers.2010-03-04
20100052387Infant Care Apparatus - An infant care apparatus includes a base; a drive mechanism disposed on the base; a controller electronically coupled to the drive mechanism; and a support device coupled to the drive mechanism. The support device is configured to be moved in both a horizontal and vertical direction relative to the base by the drive mechanism. The drive mechanism is controlled by the controller to move the support device in a plurality of motion profiles relative to the base.2010-03-04
20100052409TRANSPORTATION VEHICLE - An outside diameter of a rim spacer of a vehicle wheel is formed with an equal outside diameter dimension to those of fringe portions and of an outer rim making it possible to prevent a step from being produced between the fringe portion of the outer rim and the rim spacer. An abutment portion of an inner rim has an outside diameter formed with an equivalent diameter to the outside diameter of the rim spacer to prevent a step from being produced therebetween. This prevents an inner tire from being inclined diagonally between the inner rim and the rim spacer and also prevents a bead seat band and the like of the inner tire from being caught between the outer rim and the rim spacer.2010-03-04
20100052413Vehicle Wheel and Method for Manufacturing It - The invention relates to a vehicle wheel, in particular a hybrid vehicle wheel, composed of a wheel disc, which is fabricated from lightweight metal as a cast part, and a rim ring, which is made from steel, is connected to the wheel disc in a rotationally fixed fashion and has at least one rim horn and a drop base edge, and a method for manufacturing such a hybrid vehicle wheel. In order to be able to manufacture the hybrid vehicle wheel at low cost and to ensure sufficient force flow between the rim ring and the wheel disc, the wheel disc has, on the disc edge, a contour which is matched to the profile of the rim horn and drop base edge and extends over the distance between them and on which the rim ring bears in the mounted state of the wheel disc and rim ring while clamping the wheel disc between a first pressure zone on the drop base edge and a second pressure zone on the rim horn. Fitting is carried out by folding over or rolling over a rim ring blank onto the edge of the disc.2010-03-04
20100052414Bearing Seal Assembly - A wheel bearing assembly for motorcycles comprising a hub, a bearing, a bearing seal, a collar, and an axle. A sealing element such as an o-ring, rubber seal or sleeve is provided between the inside surface of the collar and the axle, in a substantially watertight static relationship therewith, so as to prevent moisture from seeping between the collar and the axle disposed therein. The sealing element is preferably retained in a groove machined into the interior surface of the collar, but may be frictionally retained thereby or in a press fit relationship therewith.2010-03-04
20100052415HYDRAULIC PUMP - A hydraulic pump comprising a containment body (2010-03-04
20100052416SYNCHRONIZING BRAKE DEVICE FOR VEHICLE - A synchronizing brake device for a vehicle is provided with a first brake, a second brake, a synchronizing brake operating lever that synchronizes and operates the first and second brakes, an equalizer that distributes the control force of the synchronizing brake operating lever to the first brake and the second brake, a hydraulic master cylinder that generates hydraulic pressure for operating the first brake and first brake control force transmitting member which transmits control force from the equalizer to the hydraulic master cylinder and which is configured by a synchronizing member operated by the equalizer and a knocker that presses the hydraulic master cylinder by the operation of the synchronizing member. The knocker is provided with a knocker operating lever that can press the hydraulic master cylinder by being directly operated without depending upon the synchronizing member.2010-03-04
20100052418Sprocketed idler assembly - A sprocketed idler for a machine comprises a plurality of teeth radially disposed about an idler having a substantially circular cross section. Each of the plurality of teeth includes at least one tooth flank having a substantially uniform slope, wherein a distance between adjacent peaks of the plurality of teeth is between 30% and 90% of the distance between central axes of adjacent pin members of a track link that is engageable by the idler.2010-03-04
20100052420METHOD FOR SELECTING AN ELECTRIC POWER SUPPLY, A CIRCUIT AND AN APPARATUS THEREOF - A method for selecting an electric power supply and a circuit thereof are provided. The method includes detecting whether there is an output signal from a high electric power source, connecting a low electric power source with input of a transformer if there is no output signal from the high electric power source, disconnecting output of the transformer with a general circuit if there is no output signal from the high electric power source, transforming a voltage received from the low electric power source, and outputting the transformed voltage to a control unit. By disconnecting the output of the transformer with the general circuit, the low power source may reduce waste of an electric power.2010-03-04
20100052421NETWORK-CENTRIC SCHEDULED POWER PROVISIONING METHOD - A particular technique provides power to a plurality of Power over Ethernet powered devices. The technique involves operating, during a first time interval, an initial set of Power over Ethernet powered devices (i.e., one or more powered devices) in a higher power consuming mode and the remaining Power over Ethernet powered devices of the plurality of Power over Ethernet powered devices that are not in the initial set in a lower power consuming mode to maintain total power consumption below a predetermined total power threshold. The technique further involves operating, during a second time interval after the first time interval, a different set of the Power over Ethernet powered devices in a higher power consuming mode and the remaining Power over Ethernet powered devices of the plurality of Power over Ethernet powered devices that are not in the different set in a lower power consuming mode to maintain total power consumption below the predetermined total power threshold.2010-03-04
20100052423BIDIRECTIONAL DC-DC CONVERTER AND CONTROL METHOD THEREOF - Disclosed is a small-size, high-efficiency, isolated, bidirectional DC-DC converter. The bidirectional DC-DC converter includes a transformer in which windings are magnetically coupled, switching circuits, a diode which is connected in parallel with a switch, smoothing capacitors, and a control section. First and second DC power supplies, which are connected in parallel with the smoothing capacitors, respectively, provide bidirectional electrical power transfer. When electrical power is to be transferred from the first DC power supply to the second DC power supply, the switch is maintained in the ON state. When, on the other hand, electrical power is to be transferred from the second DC power supply to the first DC power supply, the switch is maintained in the OFF state to prevent a reverse electrical power flow from the first DC power supply.2010-03-04
20100052425Networked multi-inverter maximum power point tracking - A group of solar power stations with inverters are adjusted in order to achieve optimum power output in accordance with maximum power-point tracking (MPPT). The MPPT data is used to perform adjustments. Power measurement factors, including Maximum Power Points (MPPs) are established to represent a bus-voltage setting that produces the maximum power output from an individual photovoltaic panel. These settings are established for the group so as to optimize power output under a variety of operating conditions.2010-03-04
20100052427SYSTEM FOR SPORADIC SUPPLY AND TAPPING OF ELECTRICAL ENERGY ESPECIALLY FOR AN URBAN VEHICLE USED FOR PUBLIC TRANSPORT - A system of localized tapping sections (2010-03-04
20100052462Armature and electric motor having the same - Winding guide portions of an insulator are received in slots, respectively, of a core. Each of windings is electrically insulated from the core by a winding guide wall of a corresponding one of the winding guide portions in each of corresponding two of slots of the core. The winding guide wall of at least one of the winding guide portions is configured differently from the winding guide wall of each of the rest of the winding guide portions and includes a radial bottom wall section, which is radially outwardly spaced from a radial bottom wall section of a corresponding one of the slots by a predetermined distance and contacts a corresponding one of the windings.2010-03-04
20100052463DEVICE FOR PRODUCING RING CORE, METHOD FOR PRODUCING RING CORE AND RING CORE PRODUCED BY THAT METHOD - In the device for producing a ring core, a drop-through blanking die (2010-03-04
20100052464AC-INDUCTION-MOTOR ROTOR LAMINATION HAVING ROTOR SLOTS - An AC-induction-motor rotor lamination has a longitudinal axis and circumferentially spaced apart and closed rotor slots. Each rotor slot includes first through fifth corners, a straight slot base, straight first and second slot sides, and first and second curved sides. The slot base extends from the first corner to the second corner, the first slot side extends substantially radially inward from the second corner to the third corner, and the second slot side extends substantially radially inward from the first corner to the fourth corner. The first and second curved sides extend from a corresponding one of the third and fourth corners to the fifth corner. A rotor lamination having slot sides extending substantially radially outwardly from the second and first corners, and rotor laminations having open rotor slots (with slot sides extending substantially radially inward or outward) are also described.2010-03-04
20100052465STATOR OF ELECTRIC ROTATING MACHINE - The stator of an electric rotating machine includes a stator core constituted of a plurality of core pieces joined to one another in a ring, a plurality of phase windings wound around the stator core, the stator core and the phase windings constituting a core assembly body, and an outer casing into which the core assembly body is fitted. Gaps are provided between an outer periphery of the core assembly body and an inner periphery of the outer casing.2010-03-04
20100052469ELECTROSTATIC ACTING DEVICE - An electrostatic acting device in which leakage of charge from an electret film is suppressed. The electrostatic acting device comprises a movable electrode section (2010-03-04
20100052470Asymmetric Composite Acoustic Wave Sensor - A composite acoustic wave device provides improved protection from environmental factors while maintaining high electrical characteristics and dynamic range is provided. The device comprises a rigid protector plate having high quality acoustical characteristics and a thickness which is a multiple of half wavelength of the resonant frequency. A piezoelectric plate is coupled to the protector plate, is supported therefrom, and forms an energy interface therewith. The piezoelectric and protector plates are dimensioned such that a wave of resonant frequency traveling between the excitation face and the loaded/sensing face, forms a substantially continuous-phase wave, at substantially peak amplitude, at the energy interface. By doing so the device decouples the electrical thickness of the wave device from the mechanical thickness thereof.2010-03-04
20100052473ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME - An acoustic wave device includes: a piezoelectric substrate on which an acoustic wave element and an electrode pad connected to the acoustic wave element are formed; a first resin part having a first opening located above a function area in which an acoustic wave is excited by the acoustic wave element and a second opening located above the electrode pad; a second resin part that covers the first opening and has a third opening located above the second opening; and a metal layer formed on the electrode pad in the second opening, the first opening and the second opening being inversely tapered.2010-03-04
20100052474METHOD OF DRIVING A DRIVING APPARATUS CAPABLE OF SMOOTHLY MOVING A MOVING MEMBER - A driving method is for a driving apparatus including an electro-mechanical transducer having first and second end surfaces opposite to each other in an expansion/contraction direction, a vibration friction portion mounted to the second end surface of the electro-mechanical transducer, a moving member frictionally coupled to the vibration friction portion, and a vibration transfer member disposed between the second end surface of said electro-mechanical transducer and an end surface of said vibration friction portion, whereby moving the moving member in the expansion/contraction direction of the electro-mechanical transducer. The driving method includes subjecting the electro-mechanical transducer to reciprocating displacement in a sawtooth waveform and transferring the reciprocating displacement of the electro-mechanical transducer to the vibration friction portion through the vibration transfer member, thereby linearly driving the moving member in a predetermined direction.2010-03-04
20100052476PIEZOELECTRIC FILTER AND METHOD FOR MANUFACTURING THE SAME - A piezoelectric filter of the present invention is provided with first and second piezoelectric vibrators, each having a substrate, a lower load film formed on the substrate, a lower electrode formed on the lower load film, a piezoelectric element formed on the lower electrode, an upper electrode formed on the piezoelectric element and an upper load film formed on the upper electrode, and the piezoelectric filter is configured by electrically connecting the first and second piezoelectric vibrators to each other, and the piezoelectric element of the first piezoelectric vibrator and the piezoelectric element of the second piezoelectric vibrator correspond to respectively different areas of the same piezoelectric element; thus, the resonance frequencies of the first and second piezoelectric vibrators are adjusted by the respective lower load films and upper load films of the first piezoelectric vibrator and the second piezoelectric vibrator so that the resonance frequencies of the first and second piezoelectric vibrators are made different from each other.2010-03-04
20100052499COMPOSITE CERAMIC ELECTRODE, IGNITION DEVICE THEREWITH AND METHODS OF CONSTRUCTION THEREOF - A spark plug, center electrode and method of construction is provided. The spark plug has a generally annular ceramic insulator and a conductive shell surrounding at least a portion of the ceramic insulator. A ground electrode is operatively attached to the shell, with the ground electrode having a ground electrode sparking surface. A center electrode has an elongate body with a center electrode sparking surface. The center electrode sparking surface and the ground electrode sparking surface provide a spark gap. The center electrode body is constructed of a composite material including at least one ceramic material.2010-03-04
20100052501BRAZING MATERIAL, ELECTRON TUBES, MAGNETRON AND METHOD FOR BRAZING - To obtain a brazing material where the major components thereof is Mo and Ru of the rare metal is not used.2010-03-04
20100052503ELECTRO-OPTICAL DEVICE, METHOD OF MANUFACTURING ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS - Provided is an electro-optical device including: a pair of substrates which is held to face each other with a predetermined gap therebetween; and an electro-optical material interposed between the pair of substrates, wherein a hard coat layer is formed on surfaces of the pair of substrates opposite to the electro-optical material.2010-03-04
20100052504LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS - A light emitting device, includes: a light source; a first wavelength conversion unit absorbing a light-source light radiated by the light source and radiating a first light, a wavelength of the first light being different from a wavelength of the light-source light; and a second wavelength conversion unit dispersedly provided in the first wavelength conversion unit, the second wavelength conversion unit absorbing the light-source light and radiating a second light. An absorptance of the light-source light in the second wavelength conversion unit is higher than an absorptance of the light-source light in the first wavelength conversion unit. A wavelength of the second light is different from the wavelength of the light-source light and different from the wavelength of the first light.2010-03-04
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