09th week of 2012 patent applcation highlights part 18

Patent application number	Title	Published
09th week of 2012 patent applcation highlights part 18
20120049325	INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING IT	2012-03-01
20120049326	High holding voltage BJT clamp with embedded reverse path protection in BCD process	2012-03-01
20120049327	VERTICAL PARASITIC PNP DEVICE IN A BICMOS PROCESS AND MANUFACTURING METHOD OF THE SAME	2012-03-01
20120049328	Method of manufacturing p-type nitride semiconductor and semiconductor device fabricated by the method	2012-03-01
20120049329	METHOD OF ANALYZING IRON CONCENTRATION OF BORON-DOPED P-TYPE SILICON WAFER AND METHOD OF MANUFACTURING SILICON WAFER	2012-03-01
20120049330	SILICON WAFER AND METHOD FOR PRODUCING THE SAME	2012-03-01
20120049331	SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR APPARATUS	2012-03-01
20120049332	SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME	2012-03-01
20120049333	Hybrid Multilayer Substrate	2012-03-01
20120049334	Semiconductor Device and Method of Forming Leadframe as Vertical Interconnect Structure Between Stacked Semiconductor Die	2012-03-01
20120049335	SINGULATION METHOD FOR SEMICONDUCTOR PACKAGE WITH PLATING ON SIDE OF CONNECTORS	2012-03-01
20120049336	Semiconductor package for forming a leadframe package	2012-03-01
20120049337	SEMICONDUCTOR DEVICE	2012-03-01
20120049338	STACKABLE SEMICONDUCTOR DEVICE PACKAGES	2012-03-01
20120049339	SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING PROCESS THEREOF	2012-03-01
20120049340	Manufacturing Method of Semiconductor Device	2012-03-01
20120049341	Semiconductor Package Structures Having Liquid Cooler Integrated with First Level Chip Package Modules	2012-03-01
20120049342	SEMICONDUCTOR DIE TERMINAL	2012-03-01
20120049343	CONDUCTIVE CONNECTION STRUCTURE WITH STRESS REDUCTION ARRANGEMENT FOR A SEMICONDUCTOR DEVICE, AND RELATED FABRICATION METHOD	2012-03-01
20120049344	Semiconductor Device and Method of Forming FO-WLCSP with Discrete Semiconductor Components Mounted Under and Over Semiconductor Die	2012-03-01
20120049345	SUBSTRATE VIAS FOR HEAT REMOVAL FROM SEMICONDUCTOR DIE	2012-03-01
20120049346	Pillar Bumps and Process for Making Same	2012-03-01
20120049347	SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE VIAS AND METHOD FOR MANUFACTURING THE SAME	2012-03-01
20120049348	PACKAGE HAVING ELASTIC MEMBERS FOR VIAS, PACKAGE ON PACKAGE COMPRISING THE SAME, AND METHODS OF FABRICATING THE SAME	2012-03-01
20120049349	SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME	2012-03-01
20120049350	Stress Reduction in Chip Packaging by Using a Low-Temperature Chip-Package Connection Regime	2012-03-01
20120049351	PACKAGE SUBSTRATE AND FLIP CHIP PACKAGE INCLUDING THE SAME	2012-03-01
20120049352	MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME	2012-03-01
20120049353	LOW-COST 3D FACE-TO-FACE OUT ASSEMBLY	2012-03-01
20120049354	SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME	2012-03-01
20120049355	SEMICONDUCTOR APPARATUS	2012-03-01
20120049356	SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE	2012-03-01
20120049357	Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package	2012-03-01
20120049358	Semiconductor Device and Semiconductor Process for Making the Same	2012-03-01
20120049359	BALL GRID ARRAY PACKAGE	2012-03-01
20120049360	Semiconductor Package And Method For Making The Same	2012-03-01
20120049361	SEMICONDUCTOR INTEGRATED CIRCUIT	2012-03-01
20120049362	SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF	2012-03-01
20120049363	PACKAGE STRUCTURE	2012-03-01
20120049364	EMEBEDDED STRUCTURES AND METHODS OF MANUFACTURE THEREOF	2012-03-01
20120049365	SEMICONDUCTOR PACKAGE	2012-03-01
20120049366	PACKAGE STRUCTURE HAVING THROUGH-SILICON-VIA (TSV) CHIP EMBEDDED THEREIN AND FABRICATION METHOD THEREOF	2012-03-01
20120049367	SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE	2012-03-01
20120049368	SEMICONDUCTOR PACKAGE	2012-03-01
20120049369	SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME	2012-03-01
20120049370	CARBON NANOTUBE INTERCONNECTION AND MANUFACTURING METHOD THEREOF	2012-03-01
20120049371	Interconnect Structure for Semiconductor Devices	2012-03-01
20120049372	TOP TRI-METAL SYSTEM FOR SILICON POWER SEMICONDUCTOR DEVICES	2012-03-01
20120049373	Integrated Circuit Including Interconnect Levels	2012-03-01
20120049374	METHOD AND APPARATUS FOR MEMORY CELL LAYOUT	2012-03-01
20120049375	METHOD AND SYSTEM FOR ROUTING ELECTRICAL CONNECTIONS OF SEMICONDUCTOR CHIPS	2012-03-01
20120049376	MANUFACTURING FIXTURE FOR A RAMP-STACK CHIP PACKAGE	2012-03-01
20120049377	SEMICONDUCTOR DEVICE AND METHOD OF DOUBLE PHOTOLITHOGRAPHY PROCESS FOR FORMING PATTERNS OF THE SEMICONDUCTOR DEVICE	2012-03-01
20120049378	SEMICONDUCTOR STORAGE DEVICE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR STORAGE DEVICE	2012-03-01
20120049379	Substrate Dicing Technique for Separating Semiconductor Dies with Reduced Area Consumption	2012-03-01
20120049380	SEMICONDUCTOR MEMORY DEVICE HAVING CAPACITOR AND SEMICONDUCTOR DEVICE	2012-03-01
20120049381	SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME	2012-03-01
20120049382	BUMPLESS BUILD-UP LAYER PACKAGE WITH PRE-STACKED MICROELECTRONIC DEVICES	2012-03-01
20120049383	Re-Establishing Surface Characteristics of Sensitive Low-K Dielectrics in Microstructure Devices by Using an In Situ Surface Modification	2012-03-01
20120049384	Buffer Layer to Enhance Photo and/or Laser Sintering	2012-03-01
20120049385	WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME	2012-03-01
20120049386	SEMICONDUCTOR PACKAGE	2012-03-01
20120049387	SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME	2012-03-01
20120049388	Semiconductor Device and Method of Forming Adhesive Material Over Semiconductor Die and Carrier to Reduce Die Shifting During Encapsulation	2012-03-01
20120049389	BOND PAD FOR SEMICONDUCTOR DIE	2012-03-01
20120049390	ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME	2012-03-01
20120049391	PROCESS FOR PREPARING ORGANIC ALKALI METAL COMPOUND AND ORGANIC TRANSITION METAL COMPOUND	2012-03-01
20120049392	Structured Packing with Extended Contact Area	2012-03-01
20120049393	Aerosol generator	2012-03-01
20120049394	METHOD OF MANUFACTURING OPTICAL COMPONENT	2012-03-01
20120049395	MOLD SET AND MANUFACTURING METHOD FOR MANUFACTURING OPTICAL ELEMENT	2012-03-01
20120049396	PATTERN FORMING METHOD AND PATTERN FORMING DEVICE	2012-03-01
20120049397	PRESS MOLDING DIE STRUCTURE AND METHOD OF PRESS MOLDING WORK	2012-03-01
20120049398	METHOD OF MANUFACTURING PNEUMATIC TIRE	2012-03-01
20120049399	EAFD STABILIZER FOR RETURNED CONCRETE AND MIXER DRUM WASH WATER	2012-03-01
20120049400	SEAMLESS FUSER MEMBER PROCESS	2012-03-01
20120049401	COATING COMPOSITIONS, ARTICLES, AND METHODS OF COATING ARTICLES	2012-03-01
20120049402	LOW COST PROCESS FOR MANUFACTURE OF FORM-STABLE PHASE CHANGE MATERIAL	2012-03-01
20120049403	RELEASABLE FASTENING ARRANGEMENT	2012-03-01
20120049404	Method for Making an Apertured Web	2012-03-01
20120049405	METHOD FOR MANUFACTURING COATING ROD	2012-03-01
20120049406	PARA-ARAMID FIBER AND METHOD OF PREPARING THE SAME	2012-03-01
20120049407	System and Method for Forming a Servo Pattern on a Media Master	2012-03-01
20120049408	MULTILAYER MOLDING APPARATUS AND MULTILAYER MOLDING METHOD	2012-03-01
20120049409	Method for manufacturing a gasket with an encapsulated metal band	2012-03-01
20120049410	Apparatus and process for making soft gel capsules	2012-03-01
20120049411	METHOD FOR MANUFACTURING A COMPOSITE MATERIAL CONNECTING ROD	2012-03-01
20120049412	PROCESS TO FORM A TABLET AND APPARATUS SUITABLE FOR APPLYING THIS PROCESS	2012-03-01
20120049413	PROCESS FOR MANUFACTURING A COMPOSITION COMPRISING RECYCLED PET BY CONTROLLED COOLING	2012-03-01
20120049414	METHOD AND APPARATUS FOR MEASURING DEFORMATION OF LAMINATED BODY	2012-03-01
20120049415	METHODS AND APPARATUS FOR DRYING LOGS WITH MICROWAVES USING FEEDBACK AND FEED FORWARD CONTROL	2012-03-01
20120049416	METHODS FOR REPAIR AND PREVENTIVE MAINTENANCE OF RAILROAD TIES USING UV CURABLE POLYMERS	2012-03-01
20120049417	IMPRINT APPARATUS AND IMPRINT METHOD	2012-03-01
20120049418	METHOD OF MANUFACTURING PNEUMATIC TIRE	2012-03-01
20120049419	Process And Apparatus For Manufacturing Ceramic Honeycombs	2012-03-01
20120049420	DUST COLLECTION SYSTEM FOR CALCINE TRANSFER CONTAINER	2012-03-01
20120049421	Vehicle Oscillation Device	2012-03-01
20120049422	SLOTTED SPRING VIBRATION ISOLATOR	2012-03-01
20120049423	FLUID-FILLED TYPE VIBRATION DAMPING DEVICE	2012-03-01
20120049424	ELECTRONICALLY SWITCHABLE BI-STATE ENGINE MOUNT	2012-03-01

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