09th week of 2009 patent applcation highlights part 44 |
Patent application number | Title | Published |
20090053881 | METHOD OF FORMING DIELECTRIC LAYER OF SEMICONDUCTOR MEMORY DEVICE - A method of forming a dielectric layer of a semiconductor memory device is provided. The method includes forming a first insulating layer over a semiconductor substrate, performing a first plasma treatment process in order to densify a film of the first insulating layer, and forming a high-k insulating layer, which has a dielectric constant higher than that of the first insulating layer, on the first insulating layer. After second insulating layer is formed on the high-k insulating layer. A second plasma treatment process is performed in order to densify a film of the second insulating layer. | 2009-02-26 |
20090053882 | KRYPTON SPUTTERING OF THIN TUNGSTEN LAYER FOR INTEGRATED CIRCUITS - A method of depositing a bilayer of tungsten over tungsten nitride by a plasma sputtering process in which krypton is used as the sputter working gas during the tungsten deposition. Argon may be used as the sputtering working gas during the reactive sputtering deposition of tungsten nitride. The beneficial effect of reduction of tungsten resistivity is increased when the thickness of the tungsten layer is less than 50 nm and further increased when less than 35 nm. The method may be used in forming a gate stack including a polysilicon layer over a gate oxide layer over a silicon gate region of a MOS transistor in which the tungsten nitride acts as a barrier. A plasma sputter chamber in which the invention may be practiced includes gas sources of krypton, argon, and nitrogen. | 2009-02-26 |
20090053883 | METHOD OF SETTING A WORK FUNCTION OF A FULLY SILICIDED SEMICONDUCTOR DEVICE, AND RELATED DEVICE - A method of setting a work function of a fully silicided semiconductor device, and related device. At least some of the illustrative embodiments are methods comprising forming a gate stack over a semiconductor substrate (the gate stack comprising a dielectric layer, a silicide layer on the dielectric layer that defines a metal-dielectric layer interface, and a polysilicon layer on the silicide layer), depositing a metal layer over the gate stack, annealing to induce a reaction between the polysilicon layer and the metal layer, and delivering a work function-setting dopant to the metal-dielectric layer interface by way of the reaction. | 2009-02-26 |
20090053884 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - An active region is provided which includes a plurality of active region columns extending in a first direction and a plurality of active region rows extending in a second direction substantially orthogonal to the first direction and having concave portions. Floating electrodes and control electrodes are provided on the active region columns. An interlayer insulating film formed as a layer below an upper wiring is provided on the active region and the control electrodes. Conductive sections that electrically connect the upper wiring and the active region are respectively provided on the concave portions on the active region rows. | 2009-02-26 |
20090053885 | MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE USING INSULATING FILM AS CHARGE STORAGE LAYER - A manufacturing method of a semiconductor memory device includes forming a first gate electrode having a charge storage layer, a block layer, and a control gate electrode on a first region of a semiconductor substrate, forming a second gate electrode on a second region of the semiconductor substrate, forming a protective insulating film on a side surface of the block layer, exposing the first region while covering the second region on the semiconductor substrate with a photoresist, using the photoresist, the first gate electrode, and the protective insulating film as masks to implant an impurity into the first region of the semiconductor substrate, and removing the photoresist by wet etching which uses a mixed solution containing H | 2009-02-26 |
20090053886 | High density chalcogenide memory cells - A non-volatile memory cell is constructed from a chalcogenide alloy structure and an associated electrode side wall. The electrode is manufactured with a predetermined thickness and juxtaposed against a side wall of the chalcogenide alloy structure, wherein at least one of the side walls is substantially perpendicular to a planar surface of the substrate. The thickness of the electrode is used to control the size of the active region created within the chalcogenide alloy structure. Additional memory cells can be created along rows and columns to form a memory matrix. The individual memory cells are accessed through address lines and address circuitry created during the formation of the memory cells. A computer can thus read and write data to particular non-volatile memory cells within the memory matrix. | 2009-02-26 |
20090053887 | WIREBOND PAD FOR SEMICONDUCTOR CHIP OR WAFER - In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps. | 2009-02-26 |
20090053888 | Method of depositing a diffusion barrier layer which provides an improved interconnect - A method of depositing a duffusion barrier layer with overlying conductive layer or fill which lowers resistivity of a semiconductor device interconnect. The lower resistivity is achieved by inducing the formation of alpha tantalum within a tantalum-comprising barrier layer. | 2009-02-26 |
20090053889 | METHOD FOR FORMING A METAL LINE IN A SEMICONDUCTOR DEVICE - A semiconductor device includes contact plugs formed in contact holes defined in an interlayer dielectric. Upper portions of the contact plugs are etched. A first barrier layer is formed on a surface of the interlayer dielectric including the contact plugs. A second barrier layer is formed on the first barrier layer over the interlayer dielectric. The second barrier layer has lower compatibility with a metallic material than the first barrier layer. A first metal layer is formed over the first and second barrier layers. The first metal layer, the first barrier layer and the second barrier layer are then patterned. | 2009-02-26 |
20090053890 | SELECTIVE THIN METAL CAP PROCESS - A method of creating metal caps on copper lines within an inter-line dielectric (ILD) deposits a thin (e.g., 5 nm) metal blanket film (e.g., Ta/TaN) on top the copper lines and dielectric, after the wafer has been planarized. Further a thin dielectric cap is formed over the metal blanket film. A photoresist coating is deposited over the thin dielectric cap and a lithographic exposure process is performed, but without a lithographic mask. A mask is not needed in this situation, because due to the reflectivity difference between copper and the ILD lying under the two thin layers, a mask pattern is automatically formed for etching away the Ta/TaN metal cap between copper lines. Thus, this mask pattern is self-aligned above the copper lines. | 2009-02-26 |
20090053891 | Method for fabricating a semiconductor device - A method for fabricating a semiconductor device for preventing a poisoned via is provided. A substrate with a conductive layer formed thereon is provided. A composite layer is formed over the substrate and the conductive layer, wherein the composite layer comprises a dielectric layer and a spin-on-glass layer. A via hole is formed through the composite layer, wherein the via hole exposes a surface of the conductive layer. A protection layer is formed on a sidewall of the via hole so as to prevent out-gassing from the spin-on-glass layer. A barrier layer is formed on the protection layer and the conductive layer within the via hole. And a metal layer is deposited on the barrier layer within the via hole to fill the via hole. | 2009-02-26 |
20090053892 | Method of Fabricating an Integrated Circuit - A method of fabricating an integrated circuit, including the steps of forming a first mask layer in the form of a hard mask layer including a plurality of first openings and a second mask layer with at least one second opening which at least partially overlaps with one of the first openings, wherein the at least one second opening is generated lithographically; and at least two neighboring first openings are distanced from each other with a center to center pitch smaller than the resolution limit of the lithography used for generating the second opening. | 2009-02-26 |
20090053893 | ATOMIC LAYER DEPOSITION OF TUNGSTEN MATERIALS - Embodiments of the invention provide an improved process for depositing tungsten-containing materials. The process utilizes soak processes and vapor deposition processes, such as atomic layer deposition (ALD) to provide tungsten films having significantly improved surface uniformity and production level throughput. In one embodiment, a method for forming a tungsten-containing material on a substrate is provided which includes positioning a substrate within a process chamber, wherein the substrate contains an underlayer disposed thereon, exposing the substrate sequentially to a tungsten precursor and a reducing gas to deposit a tungsten nucleation layer on the underlayer during an ALD process, wherein the reducing gas contains a hydrogen/hydride flow rate ratio of about 40:1, 100:1, 500:1, 800:1, 1,000:1, or greater, and depositing a tungsten bulk layer on the tungsten nucleation layer. The reducing gas contains a hydride compound, such as diborane, silane, or disilane. | 2009-02-26 |
20090053894 | Method for Manufacturing Epitaxial Wafer - A method for manufacturing an epitaxial wafer that can reduce occurrence of a surface defect or a slip formed on an epitaxial layer is provided. The manufacturing method is characterized by comprising: a smoothing step of controlling application of an etchant to a wafer surface in accordance with a surface shape of a silicon wafer to smooth the wafer surface; and an epitaxial layer forming step of forming an epitaxial layer formed of a silicon single crystal on the surface of the wafer based on epitaxial growth. | 2009-02-26 |
20090053895 | FILM FORMING METHOD OF POROUS FILM AND COMPUTER-READABLE RECORDING MEDIUM - There is provided a method for forming a porous dielectric film stably by: forming a surface densification layer by processing a surface of an SiOCH film formed by a plasma CVD process while using an organic silicon compound source; and releasing CHx groups or OH group from the SiOCH film underneath the surface densification layer by hydrogen plasma processing through the surface densification layer with a controlled rate. | 2009-02-26 |
20090053896 | Copper polishing slurry - A water-soluble polymer is effective as a removal rate enhancer in a chemical mechanical polishing slurry to polish copper on semiconductor wafers or other copper laid structures, while keeping the etching rate low. The slurry may also include soft particles and certain metal chelating agents, or combinations thereof. The slurry can also comprise an abrasive particle, an organic acid, and an oxidizer. | 2009-02-26 |
20090053897 | Method of fabricating a circuit board - A method of fabricating a circuit board is disclosed. The method includes: forming a trench in a base and forming an electroless plating layer over a surface of the base and an inner surface of the trench; providing a carrier, on one side of which a plating resist is coated; forming a transcribed part on the surface of the base by stacking the carrier onto the base and transcribing the plating resist onto the surface of the base; forming a pattern in the trench by plating, and removing the transcribed part; and removing portions of the electroless plating layer and the pattern. This method makes it possible to form circuit patterns with a uniform thickness and to provide high workability. | 2009-02-26 |
20090053898 | Formation of a slot in a silicon substrate - A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate ( | 2009-02-26 |
20090053899 | METHOD OF PATTERN FORMATION IN SEMICONDUCTOR FABRICATION - Provided is a method of fabricating a semiconductor device. The method includes providing a substrate, forming a photo acid generator (PAG) layer on the substrate, exposing the PAG layer to radiation, and forming a photoresist layer on the exposed PAG layer. The exposed PAG layer generates an acid. The acid decomposes a portion of the formed photoresist layer. In one embodiment, the PAG layer includes organic BARC. The decomposed portion of the photoresist layer may be used as a masking element. | 2009-02-26 |
20090053900 | Processing Apparatus and Processing Method - A processing apparatus includes a process container having a placing table for placing a processing object, an exhaust system having vacuum pumps and a pressure control valve for exhausting atmosphere in the process container. A gas injection unit having a gas ejection hole is provided in the process container, as well as a gas supplying unit for supplying a process gas to the gas injection unit. The entire process apparatus is controlled by a controlling unit. The control unit controls the exhaust system and the gas supplying unit. When starting a predetermined process, the process gas at a flow rate greater than a prescribed flow rate is supplied for a short time while exhausting the atmosphere in the process container by the exhaust system, and then the process gas at a prescribed flow rate is supplied. | 2009-02-26 |
20090053901 | HIGH DOSE IMPLANTATION STRIP (HDIS) IN H2 BASE CHEMISTRY - Plasma is generated using elemental hydrogen, a weak oxidizing agent, and a fluorine containing gas. An inert gas is introduced to the plasma downstream of the plasma source and upstream of a showerhead that directs gas mixture into the reaction chamber where the mixture reacts with the high-dose implant resist. The process removes both the crust and bulk resist layers at a high strip rate, and leaves the work piece surface substantially residue free with low silicon loss. | 2009-02-26 |
20090053902 | LOW DIELECTRIC (LOW K) BARRIER FILMS WITH OXYGEN DOPING BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD) - Methods are provided for depositing a silicon carbide layer having significantly reduced current leakage. The silicon carbide layer may be a barrier layer or part of a barrier bilayer that also includes a barrier layer. Methods for depositing oxygen-doped silicon carbide barrier layers are also provided. The silicon carbide layer may be deposited by reacting a gas mixture comprising an organosilicon compound, an aliphatic hydrocarbon comprising a carbon-carbon double bond or a carbon-carbon triple bond, and optionally, helium in a plasma. Alternatively, the silicon carbide layer may be deposited by reacting a gas mixture comprising hydrogen or argon and an organosilicon compound in a plasma. | 2009-02-26 |
20090053903 | SILICON OXIDE FILM FORMING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND COMPUTER STORAGE MEDIUM - A plasma processing apparatus | 2009-02-26 |
20090053904 | SUBSTRATE PROCESSING METHOD AND COMPUTER STORAGE MEDIUM - In the present invention, a coating solution containing polysilazane is applied to a substrate to form a coating film. Thereafter, an ultraviolet ray is applied to the coating film formed on the substrate to cut a molecular bond of polysilazane in the coating film. Then, the coating film in which the molecular bond of polysilazane has been cut is oxidized while the coating film is being heated. Then, the oxidized coating film is baked at a baking temperature equal to or higher than a heating temperature when the coating film is oxidized. | 2009-02-26 |
20090053905 | METHOD OF FORMING DIELECTRIC LAYER OF SEMICONDUCTOR MEMORY DEVICE - The invention relates to a method of forming a dielectric layer of a semiconductor memory device. According to an aspect of the invention, the method includes forming a high-k layer over a semiconductor substrate, and performing a plasma treating the high-k layer at a temperature less than the temperature in which the high-k layer would crystallize. | 2009-02-26 |
20090053906 | Semiconductor Device Producing Method and Substrate Processing Apparatus - Disclosed is a producing method of a semiconductor device including: loading at least one substrate into a processing chamber; forming a metal oxide film or a silicon oxide film on a surface of the substrate by repeatedly supplying a metal compound or a silicon compound, each of which is a first material, an oxide material which is a second material including an oxygen atom, and a hydride material which is a third material, into the processing chamber predetermined times; and unloading the substrate from the processing chamber. | 2009-02-26 |
20090053907 | Anisotropic Conductive Connector and Anisotropic Conductive Connector Connection Structure - An anisotropic conductive connector includes: a plurality of conducting paths to be brought into contact with a first object of connection provided in an electronic apparatus and with a second object of connection separate from the first object of connection to effect conductive connection between the objects of connection; and a metal portion to be brought into contact with the conducting paths to effect conductive connection between the plurality of conducting paths. | 2009-02-26 |
20090053908 | Metalized Elastomeric Electrical Contacts - Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. | 2009-02-26 |
20090053909 | Electrical connector assembly having improved pick up cap - An electrical connector assembly ( | 2009-02-26 |
20090053910 | PRINTED BOARD WITH COMPONENT MOUNTING PIN - A printed circuit board according to the present invention is a printed circuit board ( | 2009-02-26 |
20090053911 | PRINTED BOARD WITH COMPONENT MOUNTING PIN - A printed circuit board according to the present invention is a printed circuit board ( | 2009-02-26 |
20090053912 | TEST SOCKET - An improved test socket for use in testing integrated circuits. The test socket includes a housing having one or more slots formed therein. Contacts can be received within respective slots and maintained therein with rear ends of the contacts in engagement with traces on a load board. Mounting is accomplished by means of a pair of elastomers, and the elastomers maintain each contact such that, when the front end of a contact is engaged by the lead or pad of the device to be tested and urged into its corresponding slot, an arcuate surface at a rear end of each contact rolls across its corresponding trace with virtually no translational or rotational sliding. | 2009-02-26 |
20090053913 | Low profile electrical connector and assembly - An electrical connector defining a mounting plane adapted to be mounted on a PCB, comprises a dielectric housing and a plurality of socket contacts. The dielectric housing comprises a plurality of passages; each passage defines a mating opening facing the mounting plane. The plurality of socket contacts is respectively secured in the dielectric housing. Each the socket contact comprises a retaining section secured in the passages, a contacting section adapted to engage a contact pin of a complementary connector when the contact pin insert into the passage through the mating opening, and a tail extending out the passage through the mating opening and exposed on the mounting plane. | 2009-02-26 |
20090053914 | Electrical connector - The present invention provides an electrical connector for electrical connecting an IC package having a plurality of pins to a PCB. The electrical connector comprises a base defining a plurality of passageways, a plurality of contacts received in the passageways, and a cover moveable relative to the base from a first position to a second position. The cover defines a plurality of through holes corresponding the passageway. The contacts each have a resilient arm. During movement of the cover from the first position to the second position, pins of the IC package will compress the resilient arms of the contacts along a direction and the resilient will exert a normal force on the pins, thus ensuring proper connection between the resilient arm and the pins; wherein direction of the normal force is opposite to the direction of the pins moving. | 2009-02-26 |
20090053915 | Electrical connector having pick up cap - An electrical connector ( | 2009-02-26 |
20090053916 | CONNECTOR - A connector | 2009-02-26 |
20090053917 | Multi-unit connector - A multi-unit connector is structured by mounting a plurality of unit connectors, in which a terminal is received in a terminal receiving section of a housing, into a connector frame. The housing includes a front opening, and the connector frame includes a wall covering the front opening. The wall has a hole for terminal insertion, and a positioning rib projectingly. The terminal is positioned without rattling by supporting the terminal between the positioning rib and an inner wall at a side opposite to the positioning rib of the terminal receiving section. The positioning rib is provided with a slant surface for supporting the terminal. Furthermore, an additional positioning rib is arranged symmetrically against the positioning rib about a center of the hole and the slant surfaces for supporting a top end of the terminal are formed facing to each other at the positioning rib and the additional positioning rib. | 2009-02-26 |
20090053918 | Electrical card connector having an insulative housing integrally molded with a shell - An electrical card connector ( | 2009-02-26 |
20090053919 | CONNECTOR MOUNTING STRUCTURE - A connector mounting structure is disclosed that includes a connector mounted on a substrate. The connector includes plural connector rows that are arranged into a laminated structure. The connector rows include plural connector units that are arranged into rows. The positions of the connector units of a first connector row of the laminated connector rows are shifted with respect to the positions of the connector units of a second connector row that is arranged above the first connector row. | 2009-02-26 |
20090053920 | ELECTRONIC CARD ARRANGEMENT - An electronic device includes a connector for interfacing with a host device and an electronic card receiving portion. The electronic card receiving portion is configured to inhibit physical removal of an electronic card therein when the connector is interfaced with the host device. | 2009-02-26 |
20090053921 | Device for transmitting signals and current between end points - A device is provided for transmitting signals and current between end points which can be moved relative to one another and between which at least one flat ribbon cable that extends in turns ( | 2009-02-26 |
20090053922 | Connector for jack - A connector for a jack includes four contacts of first, second, third and fourth contacts each having a contact portion and a connection portion, and a housing, to exchange signals and to ascertain whether a plug connector has been inserted into the connector. The third contact substantially U-shaped in cross-section includes a contact piece having a first contact part adapted to contact the plug connector, and a spring piece having an elasticity facing to the contact piece and provided by forming a U-shaped slit in a part of the third contact at a location opposite to the contact piece. When the plug connector is inserted into the connector, the plug connector pushes the first contact part of the contact piece to cause the contact piece to be displaced to the spring piece so that the contact piece pushes the spring piece to cause the spring piece to be displaced toward the housing and at the same time the spring piece pushes the contact piece with each other with the aid of its elasticity. The connector achieves a reliable holding force for the plug connector without scratching it. | 2009-02-26 |
20090053923 | Network Connection Sensing Assembly - A connector assembly or interface cassette ( | 2009-02-26 |
20090053924 | CORD WRAP AND POWER PLUG RECEPTACLE ARRANGEMENT FOR INFLATOR - A temporary mobility kit to minimize or prevent the inadvertent outflow of tire sealant is provided. The temporary mobility kit includes a switch-inflator assembly and a removable sealant assembly. The switch-inflator assembly includes a pump motor and an electrical plug assembly having a cord portion and a plug. The plug is adapted for use in the vehicle's power unit. The housing includes a peripheral channel about which the cord portion of the electrical plug assembly is wrapped when the electrical plug assembly is not in use. A plug-receiving aperture is provided to receive and retain the plug when not in use. | 2009-02-26 |
20090053925 | Modular Electrical Receptacle - A modular electrical receptacle wherein more than one of the modular electrical receptacles can be connected to form a larger receptacle connected to a single source of power. The modular electrical receptacle includes a housing having a front surface with a first and a second electrical outlet. The housing further includes a first tab extending from a first end and a second end extending from a second end for securing the modular receptacle to an in-wall electrical box. The housing further includes a power link, such as a conductive extension, for connecting directly to another module and providing the other module with access to the single source of power. The power link can be three links for connecting a positive line, a neutral line and a ground line to the another module. The housing also includes a coupler for connecting the housing to a power link of another module. Again, three couplers can be provided for the positive, neutral and ground lines. The power link(s) and coupler(s) can be on opposing sides of the module. A plurality of modules can be utilized to build a receptacle having four outlets, six outlets and more. | 2009-02-26 |
20090053926 | Modular electrical distribution system for a building - A universal power distribution system is provided for routing electrical circuits within a building structure to comprehensively provide electrical power to the building in ceiling configurations, wall-mounted configurations, raised floor configurations and in office furniture configurations. The system components for all of these configurations have common plug connectors that are engagable with each other so as to be readily usable in a wide variety of applications. The system is readily adaptable to form virtually any conventional circuit configuration found within conventional hard-wired systems yet is formed simply through the routing of the cables through the building cavities and interconnection is accomplished merely by plugging components together rather than through labor-intensive manual wiring. | 2009-02-26 |
20090053927 | INSTALLATION CONTROL UNIT WITH A CONNECTING TERMINAL ARRANGEMENT - An installation switch having a housing and a connecting arrangement for a conductor having a terminal shoe. The connecting arrangement includes a socket having an interior, an insertion opening, and an access opening, and a screw having a screw head and a screw shank disposed in the interior of the socket. The screw is actuatable longitudinally between an open and a clamped state. The arrangement further includes a connection plate having a screw hole with threads for threadably engaging the screw when in the clamped state, and a retaining device preventing the screw from being removed when in the open state. The arrangement is configured so that the open state allows the shoe to be inserted into the insertion opening, the clamped state provides the screw being engaged with the shoe, and access to the screw is provided via the access opening of the socket to actuate the screw. | 2009-02-26 |
20090053928 | COAXIAL INSERTION CONNECTED CONNECTOR HAVING QUICK ACTION LOCKING MECHANISM - In a co-axial insertion-connected connector having quick-action locking mechanism, designed to receive a complementary insertion-connected connector, the connectors capable of connecting together by a coupling member belonging to the locking mechanism, and each having a center-conductor and an outer-conductor, a contact member being arranged in the co-axial insertion-connected connector such that when the connectors are plugged together, the contact member is arranged between the outer-conductor of the connectors, the arrangement made so that the contact member takes the form of a sleeve, the sleeve making electrical contact to give a contact region at the end-face of the outer-conductor of the complementary co-axial insertion-connected connector and the sleeve making electrical contact with the outer-conductor of the co-axial insertion-connected connector, and in such a way that an elastic length-adjusting member abuts against the outer-conductor of the co-axial insertion-connected connector and is situated in an opposite position against the sleeve. | 2009-02-26 |
20090053929 | COAXIAL CABLE CONNECTOR - A coaxial cable connector having a front end for attachment to a terminal and a back end for attachment to a coaxial cable includes a body, a post mounted within the body; and a contact assembly movably mounted within the post. The contact assembly includes a guide, a contact mounted to the guide, and an insulator partially surrounding the contact. The contact assembly moves longitudinally toward the front end of the connector, such that the front end of the contact moves from a first position within the body to a second position proximate the connector interface, as the connector receives the coaxial cable. The guide has an opening for the center conductor, which is viewable to a user during attachment until the center conductor enters the opening. An adapter is also provided that can be shipped with connector for use in securing the coaxial cable connector on a coaxial cable. | 2009-02-26 |
20090053930 | Coaxial cable connector with external clip - A coaxial cable connector is provided with an external clip that can be installed on location rather than in a factory. An adapter is also provided that can be shipped with connector for securing the external clip on the coaxial cable connector and the connector on a coaxial cable. A method for assembling the connector, the clip and the cable is also disclosed. | 2009-02-26 |
20090053931 | Sealed Inner Conductor Contact for Coaxial Cable Connector - A coaxial cable connector inner contact with an interface end and a cable end for coupling with the inner conductor of a coaxial cable, the inner conductor having an outer diameter surface. The inner contact provided with an inner conductor interface at the interface end, an inner conductor socket open to the cable end, a first inner diameter groove in a first sidewall section of the socket, a second inner diameter groove in the first sidewall section proximate the cable end, a first spring contact, dimensioned to engage the outer diameter surface, seated in the first inner diameter groove; and a first inward projecting seal, dimensioned to seal against the outer diameter surface, seated in the second inner diameter groove. | 2009-02-26 |
20090053932 | SLIM USB MALE CONNECTOR - The invention relates to a slim USB male connector. In one embodiment, the USB male connector includes an insulating base portion, a plurality of contact terminals, and a grounding plate. The base portion includes a top surface and a bottom surface and is capable of being inserted into a standard USB female connector. The contact terminals are mounted on the upper surface and are elastically deformed after the base portion is inserted into a standard USB female connector. The grounding plate is mounted on the bottom surface and is capable of contacting tongues of a standard USB female connector to achieve system grounding. | 2009-02-26 |
20090053933 | Electrical connector having an improved housing - An electrical connector ( | 2009-02-26 |
20090053934 | TERMINATION BLOCK WITH FUNCTIONAL MODULE - A termination block comprises a housing with contact elements for connecting electrical conductors therewith and a cap that is pivotally attached to the housing of the termination block and can be swivelled from an open position into a closed position, wherein the cap comprises a functional module. | 2009-02-26 |
20090053935 | Lamp socket - A lamp socket includes a housing case; a transformer to be housed in a transformer receiving section of the housing case; and a circuit board that is housed in a circuit board receiving section of the housing case and is assembled independently from the transformer. The transformer has a primary member and a secondary member, so that a voltage is applied on the primary member and a high voltage is output from the secondary member. In the lamp socket, an opening portion is provided in a barrier that separates the transformer receiving section and the circuit board receiving section, so that the primary member extends from the transformer receiving section to the circuit board receiving section. The opening portion is closed with a part that holds the primary member. | 2009-02-26 |
20090053936 | Filter Connector - A filter connector includes a dielectric housing having a mounting face. At least one row of terminal-receiving passages are formed in the housing through the mounting face. A row of filter-receiving pockets are formed in the housing through the mounting face respectively in alignment with the passages, and with one side of each pocket communicating with its respective passage. A slot is formed in the mounting face of the housing and extends along the row of pockets in communication with opposite sides thereof. A plurality of terminals are mounted into the passages. A plurality of filters are inserted into the pockets through the mounting face, with one side of the filters respectively engageable with the terminals. A single shorting bar is inserted into the slot in the housing through the mounting face and into engagement with opposite sides of the filters. | 2009-02-26 |
20090053937 | STACKABLE COMPOSITE POWER CONNECTOR - The present invention relates to a composite power connector. The composite power connector includes multiple first connecting units arranged in a stack form, multiple second connecting units arranged in a stack form and a fastening element. Each first connecting unit includes a first end coupled with an electric wire, a second end formed as an insertion terminal to be coupled with a corresponding second connecting unit, a first surface having a first perforation and a second surface having a second perforation corresponding to the first perforation. A channel is defined by the first perforation and the second perforation. The fastening element penetrates through the channels of the multiple first connecting units for combining and fixing the multiple first connecting units with each other. | 2009-02-26 |
20090053938 | PLUG-TYPE CONNECTOR FOR TELECOMMUNICATIONS AND DATA ENGINEERING - The invention relates to a plug-in connector ( | 2009-02-26 |
20090053939 | Electrical connector having improved contacts therein - An electrical connector mounted on a PCB (printed circuit board) includes an insulating housing having a receiving room and a plurality of contacts retained in the insulating housing. Said insulating housing has a tongue portion and a peripheral wall surrounds said tongue portion which defines said receiving room. Each contact includes a U-shaped contacting portion received in said receiving room, a vertical holding portion retained in an inner surface of said peripheral wall and a connecting portion connecting with said contacting portion and said holding portion. Said connecting portion has a linear leading surface which is formed slanted towards said contacting portion downwardly in order to provide a smooth mating process with a mating connector. | 2009-02-26 |
20090053940 | Screw Assembly for Electrical Connectors - A screw assembly for use with an electrical connector securing a conductor includes a threaded body configured to be releasably coupled to a coupling portion of the connector. A contacting structure includes a plate spaced from the threaded body and has a flat contacting surface configured for contacting the conductor. The plate is coupled to the threaded body. The plate is rotatable relative to the threaded body when the threaded body is coupled to the coupling portion of the connector. The plate is restricted from movement away from said threaded body when the threaded body is not coupled to the coupling portion of the connector. A spacer may be positioned between the plate and the threaded body and is configured to urge the plate away from the threaded body. | 2009-02-26 |
20090053941 | Spring contact for an electrical plug connection and plug connection - A spring contact for an electrical plug connection, which at one end has at least two opposing spring-elastic contact legs for receiving a counterpart contact that can be inserted between the two contact legs in an insertion direction along a central longitudinal axis of the spring contact. The outsides of the contact legs oriented away from the central longitudinal axis are each engaged by respective spring legs which press the respective opposing contact legs toward each other perpendicular to the central longitudinal axis and, when a counterpart contact is inserted, exert a respective contact pressure on the latter. A plug connection can be equipped with at least one spring contact of this invention. A plug connection of this invention can be used between a power tool and a rechargeable battery. | 2009-02-26 |
20090053942 | CONDUCTION TERMINAL AND METHOD FOR TIN-DIPPING CONDUCTION TERMINAL - The invention provides a conduction terminal, and the conduction terminal includes a weld part and a solder. The weld part includes an end surface and a side wall adjacent to the end surface. A solder film covers the end surface and the side wall. Compared with prior art, a solder on the weld part of the conduction terminal of the invention forms as a film. Therefore, the conduction terminal of the invention is easily welded on a substrate, and the conduction terminals do not easily have a short circuit and conjoined solders. Additionally, a method for tin-dipping the conduction terminal including the following steps of: providing a fixture having multiple storage troughs, sizes of the storage troughs are the same; disposing equivalent quantity of solder on each of the storage troughs; heating the fixture to melt the solders; inserting the weld parts of the conduction terminals into the corresponding accommodation holes, so as to stick the solder on the conduction terminal, and the solder covers as a solder film on the conduction terminal after cooling. | 2009-02-26 |
20090053943 | Bringing a cable into contact with a flexible strip conductor - The invention relates to a cable for bringing into contact with a contact point of a flexible strip conductor, to a contact strip for one or more cables of this type, and to a system for bringing control electronics, which are situated on a flexible printed circuit board, into contact with at least one electrical and/or electronic component. The component is, particularly, a mechatronic transmission or engine controller of a motor vehicle. A special contact with a welding boss is placed at the end of a cable. A bundle of cables of this type is fixed in a defined position by way of a contact strip. The invention enables, for the first time, one or more cables to be directly brought into contact with the contact point(s) of a flexible strip conductor. This advantageously eliminates additional contact points and parts such as mating connectors, etc. whereby leading to a distinct improvement in quality and reduction in costs. The invention is particularly suited for use in contacting systems in mechatronic transmission or engine controllers, etc. of a motor vehicle. | 2009-02-26 |
20090053944 | PROPULSION SYSTEM FOR A SHIP OR SEAGOING VESSEL - A marine drive is engaged with and is driven by a vessel's engine drive shaft. The drive includes: a universal joint secured to the vessel's hull; a first screw shaft supporting a first screw; a first gear set driven by the first screw shaft; a second screw shaft driven by the first gear set; a second gear set driven by the second screw shaft; a third screw shaft driven by the second gear set and supporting a second screw; and a third screw supported by the second screw shaft at its terminal end. The first and second gear sets are enclosed within a water-tight enclosure enabling rotational speed differentiation between the first and second screw shafts and enabling rotational sense reversal between the second and third screw shafts. An actuator provides changes in angle of attack of the second and third screws. | 2009-02-26 |
20090053945 | Underwater Propulsion Apparatus Performance Enhancement Device and Associated Methods - A device that when fitted to a motor vessel's existing propulsion gear improves the performance and reduces potential damage and wear of underwater propeller shaft bearings, commonly referred to as “cutlass bearings” that are used on boats, ships, etc. Designed with radially mounted impeller blades around the periphery of the propeller shaft, the device creates a forced flow of water by centrifugal pumping action, which creates suction along the shaft abaft the cutlass bearing, thereby increasing the flow of water through the cutlass bearing. The device also greatly diminishes the probability that fouling around a propeller shaft will severely restrict water flow through the cutlass bearing. | 2009-02-26 |
20090053946 | Method and apparatus for self-illuminating sports, entertainment, emergency, and safety devices - A method and apparatus for the self-illumination of various objects designed for use in sports, entertainment, safety, and emergency related activities. The objects are caused to self-illuminate by chemiluminescence to facilitate usage of the objects during non-daylight hours or in areas that are otherwise surrounded by darkness. Chemiluminescence may be activated through a variety of injection, acceleration, or tactile manipulation that are utilized to cause emission of visible light from within one or more cavities of the objects, from exterior portions of the objects, or from various inserts of the objects. Subcutaneous layers are also provided that may be caused to emanate visible light through chemiluminescence. | 2009-02-26 |
20090053947 | SWIMMING AID DEVICE - A swimming aid device comprising of a convertible bi/mono swim fin containing a first fin, a second fin and coupling means. The present invention can be used as traditional independent swim fins or combined together to form a bi-swim fin in which both swim fins are held together to aid the swimmer in performing feet unison-style swim kicks such as a dolphin kick. | 2009-02-26 |
20090053948 | BASE FOR SYNTHETIC LEATHER AND SYNTHETIC LEATHERS MADE BY USING THE SAME - A substrate for artificial leathers, comprising a nonwoven fabric body made of microfine fiber bundles and an elastic polymer impregnated therein. The substrate for artificial leathers simultaneously satisfies the following requirements 1 to 4: (1) each of the microfine fiber bundles contains 6 to 150 bundled microfine long fibers in average; (2) a cross-sectional area of the microfine long fibers constituting the microfine fiber bundles is 27 μm | 2009-02-26 |
20090053949 | LOW-VISCOSITY AQUEOUS ADHESIVE POLYMER DISPERSIONS - The invention relates to low-viscosity, low-monomer aqueous polymer dispersions based on polychloroprene, and a process for the preparation thereof and the use thereof as a contact adhesive. | 2009-02-26 |
20090053950 | Deposition of Electronic Circuits on Fibers and Other Materials - Fibers, such as textile fibers, having electrical components deposited thereon. More particularly, one or more electrical components are formed directly onto the surface of at least one fiber. The fiber having the electrical component formed thereon may then be interlaced with other fibers to form a larger piece of fabric, which can be employed to produce an article of clothing. A group of transistors and piezoelectric components forming an accelerometer may be woven onto one or more natural or synthetic fibers. The fibers may then be employed as the warp, weft, or both, of a woven piece of fabric, or used to form a knitted piece of fabric. The fabric piece can then be cut and sewn to form a wearable item, such as a shirt, a pair of pants, a hat, or the upper piece of a shoe that includes the accelerometer. | 2009-02-26 |
20090053951 | Flame resistant spun staple yarns made from blends of fibers derived from diamino diphenyl sulfone and textile fibers and fabrics and garments made therefrom and methods for making same - This invention relates to a flame-resistant spun staple yarns and fabrics and garments comprising these yarns and methods of making the same. The yarns have 25 to 90 parts by weight of a polymeric staple fiber containing a structure derived from a monomer selected from the group consisting of 4,4′diaminodiphenyl sulfone, 3,3′diaminodiphenyl sulfone, and mixtures thereof; and 10 to 75 parts by weight of a textile staple fiber having limiting oxygen index of 21 or greater, based on 100 parts by weight of the polymeric fiber and the textile fiber in the yarn. | 2009-02-26 |
20090053952 | Spun staple yarns made from blends of rigid-rod fibers and fibers derived from diamino diphenyl sulfone and fabrics and garments made therefrom and methods for making same - This invention relates to a flame-resistant spun staple yarns and fabrics and garments comprising these yarns and methods of making the same. The yarns have 20 to 50 parts by weight of a polymeric staple fiber containing a structure derived from a monomer selected from the group consisting of 4,4′diaminodiphenyl sulfone, 3,3′diaminodiphenyl sulfone, and mixtures thereof; and 50 to 80 parts by weight of a rigid-rod staple fiber, based on 100 parts by weight of the polymeric fiber and the rigid-rod fiber in the yarn. | 2009-02-26 |
20090053953 | PROCESS FOR THE PRODUCTION OF ACRYLIC FIBRE FOR FABRICS WITH A LOW PILLING FORMATION AND ACRYLIC FIBRES THUS OBTAINED - Process for the production of acrylic fibre, for fabrics with a low pilling formation, having a titer within the range of 1.0 to 5.6 dtex, which comprises the wet spinning in a solvent of a copolymer essentially consisting of acrylonitrile, in a quantity within the range of 97 to 99.99% by weight, and a comonomer with a strong acid group of the sulfonic type having the general formula: CH | 2009-02-26 |
20090053954 | Flame resistant spun staple yarns made from blends of fibers derived from diamino diphenyl sulfone and high modulus fibers and fabrics and garments made therefrom and methods for making same - This invention relates to a flame-resistant spun staple yarns and fabrics and garments comprising these yarns and methods of making the same. The yarns have 50 to 95 parts by weight of a polymeric staple fiber containing a structure derived from a monomer selected from the group consisting of 4,4′diaminodiphenyl sulfone, 3,3′diaminodiphenyl sulfone, and mixtures thereof; and 5 to 50 parts by weight of a high modulus staple fiber having a tensile modulus of 200 grams per denier (180 grams per dtex) or greater or greater, based on 100 parts by weight of the polymeric fiber and the high modulus fiber in the yarn. | 2009-02-26 |
20090053955 | Flame resistant spun staple yarns made from blends of fibers derived from diamino diphenyl sulfone and modacrylic fibers and fabrics and garments made therefrom and methods for making same - This invention relates to a flame-resistant spun staple yarns and fabrics and garments comprising these yarns and methods of making the same. The yarns have 50 to 95 parts by weight of a polymeric staple fiber containing a structure derived from a monomer selected from the group consisting of 4,4′diaminodiphenyl sulfone, 3,3′diaminodiphenyl sulfone, and mixtures thereof; and 5 to 50 parts by weight of a polyoxadiazole fiber or greater, based on the total amount of the polymeric fiber and the polyoxadiazole fiber in the yarn. | 2009-02-26 |
20090053956 | Flame resistant spun staple yarns made from blends of fibers derived from diamino diphenyl sulfone, low thermal shrinkage fibers, flame resistant fibers, and antitstatic fibers and fabrics and garments made therefrom and methods for making same - The invention concerns a flame-resistant spun staple yarns and fabrics and garments comprising these yarns and methods of making the same. The yarns have at least 25 parts by weight of a polymeric staple fiber containing a polymer or copolymer derived from a monomer selected from the group consisting of 4,4′diaminodiphenyl sulfone, 3,3′diaminodiphenyl sulfone, and mixtures thereof; 2 to 15 parts by weight of a fiber having low thermal shrinkage; 1 to 5 parts by weight of an antistatic fiber; and the remainder being flame resistant fibers having a limiting oxygen index of 21 or greater, based on 100 total parts by weight of the polymeric fiber, the low thermal shrinkage fiber, the antistatic fiber, and the flame resistant fibers in the yarn. | 2009-02-26 |
20090053957 | Flame resistant spun staple yarns made from blends of fibers derived from diamino diphenyl sulfone and modacrylic fibers and fabrics and garments made therefrom and methods for making same - The invention concerns a flame-resistant spun staple yarns and fabrics and garments comprising these yarns and methods of making the same. The yarns have 25 to 80 parts by weight of a polymeric staple fiber containing a polymer or copolymer derived from a monomer selected from the group consisting of 4,4′diaminodiphenyl sulfone, 3,3′diaminodiphenyl sulfone, and mixtures thereof; and 20 to 75 parts by weight of a modacrylic fiber, based on 100 parts by weight of the polymeric fiber and the modacrylic fiber in the yarn. | 2009-02-26 |
20090053958 | INSULATION PRODUCT FROM ROTARY AND TEXTILE INORGANIC FIBERS WITH IMPROVED BINDER COMPONENT AND METHOD OF MAKING SAME - An insulation product includes a fibrous web of first fibers, rotary glass fibers, and textile glass fibers. A binder is blended with the fibrous web. The binder bonds the fibers together to form the insulation product. The binder includes a thermoplastic binder component and a powdered binder component. | 2009-02-26 |
20090053959 | Soft and Elastic Nonwoven Polypropylene Compositions - This invention relates to a nonwoven fabric having a first component of from 5% to 99% by weight based on the total weight of the composition wherein the first component is selected from the group consisting of homopolymers of propylene and random copolymers of propylene, the first component having a heat of fusion as determined by DSC of less than 50 J/g and stereoregular propylene crystallinity; and a second component having from 95% to 1% by weight based on the total weight of the composition of a propylene polymer or blends of propylene polymers; wherein the nonwoven fabric has a permanent set of less than 60%. | 2009-02-26 |
20090053960 | Roof Liner for Vehicle and Manufacturing Method of Same - The present disclosure is directed to a roof lining for a vehicle and a manufacturing method thereof, and in particular, to the roof lining for a vehicle using a composite material having basalt fibers mixed into a thermoplastic resin as a substrate. The resulting roof lining can be lightweight, have enhanced sound absorbency and increased heat insulating properties. Due to the use of basalt fibers, which do not coat incinerator walls like glass fibers do, the roof lining is more easily recycled. | 2009-02-26 |
20090053961 | Fibers comprising copolymers containing structures derived from 4,4' diamino diphenyl sulfone and a plurality of acid monomers and methods of making same - The invention concerns a fiber derived from 4,4′diaminodiphenyl sulfone amine monomer and a plurality of acid monomers; and yarns, fabrics and garments comprising this fiber, and methods of making the same. This fiber has use in heat-resistant protective apparel fabrics and garments. | 2009-02-26 |
20090053962 | Field emission display (FED) and method of manufacture thereof - A Field Emission Display (FED) includes: a first substrate; a first insulating layer arranged on the first substrate; a cathode arranged on the first substrate to cover the first insulating layer, the cathode having a first concave opening arranged between portions thereof covering the first insulating layer: a second insulating layer arranged on the first substrate and the cathode, the second insulating layer having a second opening connected to the first opening to expose a portion of the cathode; a gate electrode arranged on the second insulating layer, the gate electrode having a third opening connected to the second opening; a plurality of emitters arranged on the cathode in the first opening and along both edges of the first opening and spaced apart from each other; and a second substrate facing the first substrate and spaced apart therefrom and having an anode and a fluorescent layer arranged on a surface thereof. | 2009-02-26 |
20090053963 | ORGANIC EL PANEL AND METHOD OF MANUFACTURING THE SAME - The present invention is to ensure that when it has been judged that film-formation areas of a plurality of layers laminated on the same luminescent areas of organic EL devices involve a defect, it is possible to exactly find which layer of the multi-laminated layers is a defective layer. The film formation areas of layers to be laminated on luminescent area are formed in a manner such that overlap deviations e | 2009-02-26 |
20090053964 | Method of and apparatus for manufacturing liquid crystal display device - A seal agent D and liquid crystal C are clamped to a lower substrate | 2009-02-26 |
20090053965 | METHOD FOR MANUFACTURING DISPLAY DEVICE AND COMPOSITION OF SEALANT THEREFOR - A method for manufacturing a display device is disclosed, which includes forming a main sealant which surrounds a display region on a first substrate and an auxiliary sealant which is disposed along and outside the main sealant and has an epoxy resin and a diazonaphthoquinone type initiator, disposing a second substrate on the first substrate and aligning the first and second substrates, and adhering the first and second substrates by curing the auxiliary sealant with UV radiation. | 2009-02-26 |
20090053966 | Fabrication method of liquid crystal display panel and heating apparatus used therein - A fabricating method of a liquid crystal display panel provides a first substrate and a second substrate in a chamber. Liquid crystal with a predetermined weight is dropped on the first substrate at a predetermined temperature higher than room temperature. The first substrate and the second substrate are assembled at the predetermined temperature to seal the liquid crystal with the predetermined weight within a liquid crystal cavity formed between the first substrate and the second substrate. | 2009-02-26 |
20090053967 | SET OF BUILDING COMPONENTS FOR BUILDING A PLURALITY OF PREDEFINED STRUCTURES - A building set includes a plurality of building components. The components may be configured so that one or more predefined structures may be constructed with a set of the components. For example, the set of components may be configured any number of predefined structures may be constructed, such as a table and chairs, a boat, a plane, and so on. The components may be made from a composition including polyolefin. The polyolefin may have a density in the range of about 1 pound per cubic foot (lb/ft | 2009-02-26 |
20090053968 | Toy with Retractable Figure - A toy includes a telescoping member, the telescoping member having a first member and a second member slidably disposed over the first member, a handle portion coupled to one end of the first member, a head portion coupled to the distal end of the second member, an enclosure device slidably disposed over the telescoping member, the enclosure device having an interior surface and an exterior surface, and a layer of fabric secured to the perimeter of the interior surface of the enclosure device and to the head portion. The layer of fabric has at least two appendages extending therefrom. When the head portion is fully retracted within the enclosure device, the layer of fabric and appendages are fully contained within the enclosure device. When the head portion is fully extended outside of the enclosure device, the layer of fabric and appendages are substantially located outside of the enclosure device. | 2009-02-26 |
20090053969 | Interactive Toy Unicorn - An interactive toy unicorn is disclosed, where the unicorn can emit sounds and flap its wings. Pressing a button on the unicorn's head, where this button also doubles as the unicorn's horn, will trigger this functionality. Alternatively, the unicorn will emit sound and flap its wings if a magnet is placed over a magnetic switch located in the nose of the unicorn. This magnet can be placed inside of a toy wand, to give a magical effect to the toy unicorn. Lights can be placed inside the wings and light up when the wings flap. | 2009-02-26 |
20090053970 | INTERACTIVE ACTION FIGURES FOR GAMING SCHEMES - An action figure is provided with a serial number that provides an access code which allows owners to engage in enjoyable games or other activities via the Internet or other gaming systems. The interactive action figure system comprises a toy, statue, or other three-dimensional figurine with a serial number, and preferably a computer network accessible over the internet and a particular gaming framework managed by a network device. Owners of action figure toys may “log onto” the network using the action figure serial number as an access code to activate a particular computer character identity and participate in games such as hand-to-hand combat games, action-adventure series, or learning games. The action figure may be, for example, a warrior, sports figure, doll or teddy bear to appeal to a wide range of users. Once a particular character is activated, game play proceeds according to preset rules. The game character's traits, powers, and other features may be enhanced or otherwise modified by purchasing preferably-three-dimensional accessories and inputting serial numbers into the gaming system that are also supplied with the accessories. | 2009-02-26 |
20090053971 | Interactive Doll - An interactive doll is disclosed where the doll can exhibit symptoms of being sick or healthy. When the user turns the doll on, the doll is healthy. After a period of time, the doll becomes sick. The user can observe different parts of the doll to determine whether the doll is sick or healthy. If the doll is sick, the user can take corrective measures to return the doll to full health. | 2009-02-26 |
20090053972 | Toy Doll - An interactive toy doll is described for performing and displaying realistic facial expressions and ordered sequences of visual and aural effects upon activation. A head shell is provided having a flexible, elastic sheath layer overlaying its surface and configured for fluid skin-like movement in response to movement of eyelid and jaw pieces to emulate realistic human facial skin movement and expressions. The doll includes at least one sensor disposed thereon and a position orientation switch. Upon initial activation of a sensor, the doll is responsive to subsequent re-orientation thereafter for a pre-determined amount of time. | 2009-02-26 |
20090053973 | Game call striker shaping retainer - A means of directly attaching one or more strikers of a slate type turkey call to that call. The attachment keeps the strikers and call as a unit for ready access and eliminates one rattling against the other when the call is not in use. The attachment is accomplished by diametral engagement of the strikers by an extension of the call body. The extension is an integral part of the call body or added as an accessary to an existing slate turkey call. Providing accurate diametral location, the invention is also used, with abrasive material, to effectively shape or resurface the sound producing end of the striker. | 2009-02-26 |
20090053974 | System and Method for Building, Registering and Racing Remotely Controlled Miniature Vehicles - A retail store providing a customer with the opportunity to design, build and assemble your own customized vehicle and then race it on an in-store race track. | 2009-02-26 |
20090053975 | Brassiere having support bands in back and/or side panels - A brassiere has a pair of breast receiving cups and a first back panel connected to one of the pair of breast receiving cups and a second back panel connected to the other of the pair of breast receiving cups. The first back panel and the second back panel each have a band affixed thereto that is capable of modifying a property of the panel. The bands limit the elongation of each of the pair of back panels during wear. | 2009-02-26 |
20090053976 | Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof - The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection. | 2009-02-26 |
20090053977 | Tool and method for discontinuous profile grinding - A gear grinding tool can be trued and re-profiled. The geometry of the individual profiles in the direction of the tool axis is designed so that at least more than two, preferably all, flanks of the tool are used for rough machining of the work piece flanks, and that during finishing the re-profiled flanks provided only for roughing are set back far enough so that during finishing they do not come into contact with the work piece flanks. | 2009-02-26 |
20090053978 | Double-Disc Grinding Machine, Static Pressure Pad, and Double-Disc Grinding Method Using the Same for Semiconductor Wafer - The present invention is a static pressure pad for supporting both sides of a raw wafer without contact by a static pressure of a fluid supplied to the both sides of the raw wafer in a double-disc grinding machine for a semiconductor wafer, wherein in patterns of lands to be banks of surrounding pockets formed on a surface side of supporting the raw wafer of the static pressure pad, an outer circumferential land pattern required to support the raw wafer is a concentric circle with respect to a rotation center of the raw wafer, and a land pattern inside the outer circumferential land pattern is a non-concentric circle with respect to the rotation center of the raw wafer and asymmetrical with respect to all the straight lines which bisect the static pressure pad. With this static pressure pad, there is provided the double-disc grinding machine and a double-disc grinding method for the semiconductor wafer, which can minimize a “middle ring” of average components obtained by averaging a nanotopography of the wafers after the double-disc grinding. | 2009-02-26 |
20090053979 | Jig - A jig intended in use to hold a set of blanks of rod-like or wire-like form during machining, said jig having a body adapted to be mounted to a drive shaft for rotation of the body about an axis of rotation, the body having an outer portion and an inner portion wherein the inner and outer portions are capable of angular displacement relative to each other, the portions having opposed faces which are concentric and which define clamping faces which in use are intended to support the set of blanks such that their central axes are substantially parallel to the axis of rotation and at least one end extends axially beyond the body. | 2009-02-26 |
20090053980 | Optimized CMP Conditioner Design for Next Generation Oxide/Metal CMP - A study of several key conditioner design parameters has been conducted. The purpose was to improve conditioner performance by considering factors such as wafer defects, pad life, and conditioner life. For this study, several key conditioner design parameters such as diamond type, diamond size, diamond shape, diamond concentration and distribution, were selected to determine their effect on CMP performance and process stability. Experimental validations were conducted. Conditioner specifications were matched to each specific CMP environment (intended application) in order to improve process stability and CMP performance particularly for emerging technology nodes. Several conditioner designs were developed and run successfully in the field. Significant planarity improvement for a 300 mm CMP process was achieved in accordance with one embodiment, and an increase of pad life and wafer polish rate was simultaneously achieved with another embodiment. | 2009-02-26 |