06th week of 2010 patent applcation highlights part 15 |
Patent application number | Title | Published |
20100032809 | METAL WIRING STRUCTURE FOR INTEGRATION WITH THROUGH SUBSTRATE VIAS - An array of through substrate vias (TSVs) is formed through a semiconductor substrate and a contact-via-level dielectric layer thereupon. A metal-wire-level dielectric layer and a line-level metal wiring structure embedded therein are formed directly on the contact-via-level dielectric layer. The line-level metal wiring structure includes cheesing holes that are filled with isolated portions of the metal-wire-level dielectric layer. In one embodiment, the entirety of the cheesing holes is located outside the area of the array of the TSVs to maximize the contact area between the TSVs and the line-level metal wiring structure. In another embodiment, a set of cheesing holes overlying an entirety of seams in the array of TSVs is formed to prevent trapping of any plating solution in the seams of the TSVs during plating to prevent corrosion of the TSVs at the seams. | 2010-02-11 |
20100032810 | THROUGH WAFER VIAS AND METHOD OF MAKING SAME - A method of forming and structure for through wafer vias and signal transmission lines formed of through wafer vias. The method of forming through wafer vias includes forming an array of through wafer vias comprising at least one electrically conductive through wafer via and at least one electrically non-conductive through wafer via through a semiconductor substrate having a top surface and an opposite bottom surface, each through wafer via of the array of through wafer vias extending from the top surface of the substrate to the bottom surface of the substrate. | 2010-02-11 |
20100032811 | THROUGH WAFER VIAS AND METHOD OF MAKING SAME - A method of forming and structure for through wafer vias and signal transmission lines formed of through wafer vias. The structure includes, a semiconductor substrate having a top surface and an opposite bottom surface; and an array of through wafer vias comprising at least one electrically conductive through wafer via and at least one electrically non-conductive through wafer via, each through wafer via of the array of through wafer vias extending from the top surface of to the bottom surface of the substrate, the at least one electrically conductive via electrically isolated from the substrate. | 2010-02-11 |
20100032812 | Method for forming silicon germanium layers at low temperatures, layers formed therewith and structures comprising such layers - A method is provided for controlling the average stress and the strain gradient in structural silicon germanium layers as used in micromachined devices. The method comprises depositing a single silicon germanium layer on a substrate and annealing a predetermined part of the deposited silicon germanium layer. The process parameters of the depositing and/or annealing steps are selected such that a predetermined average stress and a predetermined strain gradient are obtained in the predetermined part of the silicon germanium layer. Preferably a plasma assisted deposition technique is used for depositing the silicon germanium layer, and a pulsed excimer laser is used for local annealing, with a limited thermal penetration depth. Structural silicon germanium layers for surface micromachined structures can be formed at temperatures substantially below 400° C., which offers the possibility of post-processing micromachined structures on top of a substrate comprising electronic circuitry such as CMOS circuitry. Such structural silicon germanium layers may be also be formed at temperatures not exceeding 210° C., which allows the integration of silicon germanium based micromachined structures on substrates such as polymer films. | 2010-02-11 |
20100032813 | IC FORMED WITH DENSIFIED CHEMICAL OXIDE LAYER - A semiconductor device, such as an integrated circuit, has an oxide chemically grown on a silicon surface, and densified by annealing at, e.g., 950° C. for 4 to 5 seconds in an N | 2010-02-11 |
20100032814 | CIRCUIT STRUCTURES AND METHODS WITH BEOL LAYERS CONFIGURED TO BLOCK ELECTROMAGNETIC EDGE INTERFERENCE - Back-end-of-line (BEOL) circuit structures and methods are provided for blocking externally-originating or internally-originating electromagnetic edge interference. One such BEOL circuit structure includes a semiconductor substrate supporting one or more integrated circuits, and multiple BEOL layers disposed over the semiconductor substrate. The multiple BEOL layers extend to an edge of the circuit structure and include at least one vertically-extending conductive pattern disposed adjacent to the edge of the circuit structure. The vertically-extending conductive pattern is defined, at least partially, by a plurality of elements disposed in the multiple BEOL layers. The plurality of elements are uniformly arrayed at the edge of the circuit structure in a first direction or a second direction throughout at least a portion thereof. The plurality of elements are sized and positioned in the first direction or the second direction to block electromagnetic interference of a particular wavelength from passing therethrough. | 2010-02-11 |
20100032815 | SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING - Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element disposed adjacent to a periphery of the substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit; (2) a semiconductor device disposed adjacent to the upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body. A periphery of the package body is laterally recessed, such that a connection surface of the grounding element is electrically exposed and electrically connected to the EMI shield. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield. | 2010-02-11 |
20100032816 | Electronic Device and Method of Manufacturing Same - This application relates to a semiconductor device, the semiconductor device comprising a metal carrier, an insulating foil partially covering the metal carrier, a first chip attached to the metal carrier over the insulating foil, and a second chip attached to the metal carrier over a region not covered by the insulating foil. | 2010-02-11 |
20100032817 | SEMICONDUCTOR DEVICE WITH PLASTIC PACKAGE MOLDING COMPOUND, SEMICONDUCTOR CHIP AND LEADFRAME AND METHOD FOR PRODUCING THE SAME - A semiconductor device with a plastic package molding compound, a semiconductor chip and a leadframe is disclosed. In one embodiment, the semiconductor chip is embedded in a plastic package molding compound. The upper side of the semiconductor chip and the plastic package molding compound are arranged on a leadframe. Arranged between the leadframe and the plastic package molding compound with the semiconductor chip is an elastic adhesive layer for the mechanical decoupling of an upper region from a lower region of the semiconductor device. | 2010-02-11 |
20100032818 | LEAD FRAME PACKAGE - A lead frame package is disclosed where transmission signals are coupled into a die from a pair of lead frames through bonding wires that are separated by no more than three times a diameter of one of the bonding wires. In some embodiments, pairs of lead frames carrying differential transmission signals can be shielded by adjacent pairs of ground and power leads that are coupled into the die through bonding wires that are also separated by no more than three times a diameter of one of the bonding wires. | 2010-02-11 |
20100032819 | Compact Co-packaged Semiconductor Dies with Elevation-adaptive Interconnection Plates - A semiconductor package is disclosed for packaging two adjacent semiconductor dies atop a circuit substrate. The dies are separated from each other along their longitudinal edges with an inter-die distance. An elevation-adaptive electrical connection connects a top metalized contact of die two to the bottom surface of die one while accommodating for elevation difference between the surfaces. The elevation-adaptive electrical connection includes:
| 2010-02-11 |
20100032820 | Stacked Memory Module - Memory modules, computing systems, and methods of manufacturing memory modules are disclosed. In one embodiment, a memory module includes a substrate having a first side and a second side opposed to the first side. A plurality of pins is disposed on the first side of the substrate. A first plurality of memory chips are arranged in a first chip layer, the first chip layer overlying the second side of the substrate. Electrical contacts of the first plurality of memory chips are electrically coupled to the pins. A second plurality of memory chips is arranged in a second chip layer, the second chip layer overlying the first chip layer. Electrical contacts of the second plurality of memory chips are electrically coupled to the pins. | 2010-02-11 |
20100032821 | TRIPLE TIER PACKAGE ON PACKAGE SYSTEM - An integrated circuit package system includes: providing a first package having a first interposer mounted over a first integrated circuit and the first integrated circuit encapsulated by a first encapsulation; and connecting a second package over the first interposer and on the first encapsulation, the second package including a second integrated circuit having a wire-in-film adhesive thereover, a second interposer mounted on the wire-in-film adhesive and encapsulated by a second encapsulation encapsulating the second integrated circuit, the second interposer including an interconnection pad for connecting a third package to the top thereof. | 2010-02-11 |
20100032822 | CHIP PACKAGE STRUCTURE - A chip package structure including a first substrate, a chip, a second substrate, a plurality of conductive wires, a plurality of solder balls and a molding compound is provided. The chip is disposed on the first substrate. The second substrate disposed on the chip has an upper surface and a lower surface, in which a distance of the lower surface relative to the chip is smaller than that of the upper surface relative to the chip. The upper surface has a ball mounting surface and a wire bonding surface. A distance between the wire bonding surface and the first substrate is smaller than that between the ball mounting surface and the first substrate. The conductive wires connect the wire bonding surface to the first substrate. The solder balls are disposed on the ball mounting surface. The molding compound is disposed on the first substrate. | 2010-02-11 |
20100032823 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device includes: a semiconductor substrate having an active area formed on a major surface of the semiconductor substrate; an interlayer insulating film and a wiring layer formed on predetermined regions of the active area; and a sealing resin film covering the interlayer insulating film, the wiring layer, and the major surface of the semiconductor substrate and filling a groove surrounding the active area. The sealing resin film | 2010-02-11 |
20100032824 | IC Package Method Capable of Decreasing IR Drop and Associated IC Apparatus - An IC package method capable of decreasing IR drop of a chip and associated IC apparatus is provided. The IC package method comprises forming a lead frame including a die paddle and a plurality of fingers; installing a die on the die paddle, and coupling a plurality of signal terminals of the die to the fingers; forming a power transferring unit coupled to a power supply; coupling power reception terminals of a plurality of logic units in the die to the power transferring unit; and forming a housing for encapsulating the die, the lead frame and the power transferring unit. | 2010-02-11 |
20100032825 | Flange Package For A Semiconductor Device - In accordance with one or more embodiments, a flange package comprises a flange and an interposer having two or more fingers disposed in an interposer trench. The flange has a mold lock formed about a periphery of the interposer trench. A dielectric ring comprising a dielectric material is formed in the interposer trench, and in and around the periphery of the mold lock. A semiconductor die is disposed within the dielectric ring having gate pads and source pads formed on a first side, and having drain pads disposed on a second side of the die. The gate pads are coupled to the interposer and the source pads are coupled to the flange. A gate lead is coupled to the interposer and a drain lead is coupled to the drain pads. Other embodiments are disclosed. | 2010-02-11 |
20100032826 | SEMICONDUCTOR PACKAGE, CORE LAYER MATERIAL, BUILDUP LAYER MATERIAL, AND SEALING RESIN COMPOSITION - A flip-chip semiconductor package includes a circuit board having a core layer and at least one buildup layer, a semiconductor device connected to the circuit board through a metal bump, and a cured member that is made of a sealing resin composition and enclosed between the semiconductor device and the circuit board. The coefficient of linear expansion at 25 to 75° C. of the cured member is 15 to 35 ppm/° C., the glass transition temperature of at least one buildup layer is 170° C. or more, and the coefficient of linear expansion of at 25 to 75° C. of the at least one buildup layer in the planar direction is 25 ppm or less. A highly reliable flip-chip semiconductor package, buildup layer material, core layer material, and sealing resin composition can be provided by preventing cracks and inhibiting delamination. | 2010-02-11 |
20100032827 | PACKAGE STRUCTURE - Disclosed is a package structure including a semiconductor chip disposed in a core board having a first surface and an opposite second surface. The package structure further includes a plurality of first and second electrode pads disposed on an active surface and an opposite inactive surface of the semiconductor chip respectively, the semiconductor chip having a plurality of through-silicon vias for electrically connecting the first and second electrode pads. As a result, the semiconductor chip is electrically connected to the two sides of the package structure via the through-silicon vias instead of conductive through holes, so as to enhance electrical quality and prevent the inactive surface of the semiconductor chip from occupying wiring layout space of the second surface of the core board to thereby increase wiring layout density and enhance electrical performance. | 2010-02-11 |
20100032828 | SEMICONDUCTOR ASSEMBLY WITH COMPONENT ATTACHED ON DIE BACK SIDE - One or more electronic components can be mounted on the back side of a semiconductor die. The components can be passive components, active components, or combinations thereof. The components can be soldered to signal routes on the back side of the die, the signal routes being attached to the die using a metallization layer or using one or more dielectric layer sections. Placing components on the back side of the die can allow for incorporation of the components without necessarily increasing the form factor of the die's package. | 2010-02-11 |
20100032829 | STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES - Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a trench formed in a dielectric layer which has at least a portion thereof devoid of a fluorine boundary layer. The structure further includes a copper wire in the trench having at least a bottom portion thereof in contact with the non-fluoride boundary layer of the trench. A lead free solder bump is in electrical contact with the copper wire. | 2010-02-11 |
20100032830 | THREE-DIMENSIONAL CONDUCTING STRUCTURE AND METHOD OF FABRICATING THE SAME - The three-dimensional conducting structure comprises a substrate, a first redistributed conductor, a second redistributed conductor and an insulator. The substrate has an active surface, a passive surface opposite to the active one, a pad on the active surface and a through hole. The first redistributed conductor comprises a projecting portion and a receiving portion. The projecting portion is projected from the active surface and electrically connected to the pad. The receiving portion is outside the active surface and in contact with the projecting portion, both of which constitute a recess communicating with the through hole. The second redistributed conductor is positioned within the through hole and the recess, in contact with the receiving portion, and extended toward the passive surface along the through hole. The insulator is filled between the second redistributed conductor and the substrate and between the second redistributed conductor and the projecting portion. | 2010-02-11 |
20100032831 | BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE - There is provided a bump structure for a semiconductor device, comprising a first metal layer, and a second metal layer electrically connected to the first metal layer so as to be integrally formed with the first metal layer, and electrically connected to electrode pads of the semi-conductor device, in which the second metal layer is composed of one or more metals or alloys having the melting point higher than the melting point of the first metal layer or the eutectic temperature of the first metal layer and another substance when the first metal layer makes a fusion reaction to the surface of the another substance. Preferably, the second metal layer may have a thickness greater than that of the first metal layer. The bump structure may further comprise a diffusion prevention layer between the first metal layer and the second metal layer. | 2010-02-11 |
20100032832 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE - In this semiconductor chip | 2010-02-11 |
20100032833 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor chip of a multilayer wiring structure having an insulating film formed on a surface thereof, multiple electrode pads formed at a central part and an outer peripheral part of the insulating film, and multiple protective metal layers formed respectively on the electrode pads. The semiconductor device also includes a substrate having the semiconductor chip mounted thereon and including multiple substrate terminals formed on a surface thereof respectively in positions corresponding to the electrode pads. The semiconductor chip is mounted on the substrate by connecting a stud bump to a solder bump. The stud bump is formed on any one of each of the protective metal layers and each of the substrate terminals and the solder bump is formed on the other one of each of the protective metal layers and each of the substrate terminals. | 2010-02-11 |
20100032834 | METHOD FOR FORMING BUMPS IN SUBSTRATES WITH THROUGH VIAS - A method for manufacturing solder bumps for through vias in a substrate having a first surface and a second surface opposed to each other. The method includes the steps of forming a blind hole extending in the substrate from the first surface for each via and filling each blind hole with a conductive filler; a deepest part of each filler includes a bump portion made of a solder material. The method further includes the step of removing a part of the substrate extending from the second surface to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding bump. | 2010-02-11 |
20100032835 | COMBINATION VIA AND PAD STRUCTURE FOR IMPROVED SOLDER BUMP ELECTROMIGRATION CHARACTERISTICS - The invention generally relates to semiconductor devices, and more particularly to structures and methods for enhancing electromigration (EM) performance in solder bumps and related structures. A semiconductor structure includes a wire comprising first and second wire segments, a pad formed over the wire, and a ball limiting metallization (BLM) layer formed over the pad. The semiconductor structure also includes a solder bump formed over the BLM layer, a terminal via formed over the BLM layer, and at least one peripheral via formed between the second wire segment and the pad. The first and second wire segments are discrete wire segments. | 2010-02-11 |
20100032836 | ENHANCED RELIABILITY FOR SEMICONDUCTOR DEVICES USING DIELECTRIC ENCASEMENT - A method and device for enhanced reliability for semiconductor devices using dielectric encasement is disclosed. The method and device are directed to improving the reliability of the solder joint that connects the integrated circuit (IC) chip to the substrate. The method comprises applying a layer of a photoimageable permanent dielectric material to a top surface of the semiconductor device, and patterning the layer of the photoimageable permanent dielectric material to have an opening over each feature. The method further comprises dispensing or stencil printing fluxing material into the permanent dielectric material openings, and applying solder, which contains no flux, to a top surface of the fluxing material. In one or more embodiments, the method further comprises heating the semiconductor device to a reflow temperature appropriate for the reflow of the solder, thereby causing the solder to conform to sidewalls of the permanent dielectric material openings to form a protective seal. | 2010-02-11 |
20100032837 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A semiconductor device according to the present invention includes: a semiconductor substrate; a first copper interconnection provided on the semiconductor substrate; an insulating layer provided over the first copper interconnection and having a hole extending therethrough to the first copper interconnection; a barrier layer composed of a tantalum-containing material and covering at least a sidewall of the hole and a part of the first copper interconnection exposed in the hole; and a second copper interconnection provided in intimate contact with the barrier layer and electrically connected to the first copper interconnection via the barrier layer; wherein the barrier layer has a nitrogen concentration profile such that the concentration of nitrogen contained in the material varies to be lower in a boundary portion of the barrier layer adjacent to the first copper interconnection and in a boundary portion of the barrier layer adjacent to the second copper interconnection and higher in an intermediate portion of the barrier layer defined between the boundary portions. | 2010-02-11 |
20100032838 | AMORPHOUS CARBON FILM, SEMICONDUCTOR DEVICE, FILM FORMING METHOD, FILM FORMING APPARATUS AND STORAGE MEDIUM - Provided is an amorphous carbon film having a high elastic modulus and a low thermal contraction rate with a suppressed low dielectric constant, a semiconductor device including the amorphous carbon film and a technology for forming the amorphous carbon film. Since the amorphous carbon film is formed by controlling an additive amount of Si (silicon) during film formation, it is possible to form the amorphous carbon film having a high elastic modulus and a low thermal contraction rate with a suppressed dielectric constant as low as 3.3 or less. Accordingly, when the amorphous carbon film is used as a film in the semiconductor device, troubles such as a film peeling can be suppressed. | 2010-02-11 |
20100032839 | ELECTRODE STRUCTURE, SEMICONDUCTOR ELEMENT, AND METHODS OF MANUFACTURING THE SAME - According to the present invention, there is provided an electrode structure which includes: a nitride semiconductor layer; an electrode provided over the nitride semiconductor layer; and an electrode protective film provided over the electrode, wherein the nitride semiconductor layer contains a metal nitride containing Hb, Hf or Zr as a constitutive element, the electrode has a portion having a metal oxide containing Ti or V as a constitutive element formed therein, and the electrode protective film covers at least a portion of the electrode, and contains a protective layer having Au or Pt as a constitutive element. | 2010-02-11 |
20100032840 | Semiconductor Device with an Improved Solder Joint - A semiconductor device with an improved solder joint system is described. The solder system includes two copper contact pads connected by a body of solder and the solder is an alloy including tin, silver, and at least one metal from the transition groups IIIA, IVA, VA, VIA, VIIA, and VIIIA of the Periodic Table of the Elements. The solder joint system also includes, between the pads and the solder, layers of intermetallic compounds, which include grains of copper and tin compounds and copper, silver, and tin compounds. The compounds contain the transition metals. The inclusion of the transition metals in the compound grains reduce the compound grains size and prevent grain size increases after the solder joint undergoes repeated solid/liquid/solid cycles. | 2010-02-11 |
20100032841 | Semiconductor Devices and Structures Thereof - A structure having air gaps between interconnects is disclosed. A first insulating material is deposited over a workpiece, and a second insulating material having a sacrificial portion is deposited over the first insulating material. Conductive lines are formed in the first and second insulating layers. The second insulating material is treated to remove the sacrificial portion, and at least a portion of the first insulating material is removed, forming air gaps between the conductive lines. The second insulating material is impermeable as deposited and permeable after treating it to remove the sacrificial portion. A first region of the workpiece may be masked during the treatment, so that the second insulating material becomes permeable in a second region of the workpiece yet remains impermeable in the first region, thus allowing the formation of the air gaps in the second region, but not the first region. | 2010-02-11 |
20100032842 | MODULATED DEPOSITION PROCESS FOR STRESS CONTROL IN THICK TiN FILMS - A multi-layer TiN film with reduced tensile stress and discontinuous grain structure, and a method of fabricating the TiN film are disclosed. The TiN layers are formed by PVD or IMP in a nitrogen plasma. Tensile stress in a center layer of the film is reduced by increasing N | 2010-02-11 |
20100032843 | Through Silicon Via Layout - A system and method for forming under bump metallization layers that reduces the overall footprint of UBMs, through silicon vias, and trace lines is disclosed. A preferred embodiment comprises forming an under bump metallization layer over a plurality of through silicon vias, whereas the UBM is connected to only a portion of the total number of through silicon vias over which it is located. The trace lines connected to the through silicon vias may additionally be formed beneath the UBM to save even more space on the surface of the die. | 2010-02-11 |
20100032844 | INTERLAYER INSULATING FILM, WIRING STRUCTURE AND ELECTRONIC DEVICE AND METHODS OF MANUFACTURING THE SAME - A wiring structure of a semiconductor device or the like includes an interlayer insulating film having a fluorocarbon film formed on an underlayer, and a conductor buried in the interlayer insulating film. The fluorocarbon film contains nitrogen and is low in dielectric constant, excellent in reproducibility and stable. | 2010-02-11 |
20100032845 | SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT STRUCTURE AND A REINFORCING INSULATING FILM AND METHOD OF MANUFACTURING SUCH DEVICE - A semiconductor device includes in an interconnect structure which includes a first interconnect made of a copper-containing metal, a first Cu silicide layer covering the upper portion of the first interconnect, a conductive first plug provided on the upper portion of the Cu silicide layer and connected to the first interconnect, a Cu silicide layer covering the upper portion of the first plug, a first porous MSQ film provided over the side wall from the first interconnect through the first plug and formed to cover the side wall of the first interconnect, the upper portion of the first interconnect, and the side wall of the first plug, and a first SiCN film disposed under the first porous MSQ film to contact with the lower portion of the side wall of the first interconnect and having the greater film density than the first porous MSQ film. | 2010-02-11 |
20100032846 | IC HAVING VIABAR INTERCONNECTION AND RELATED METHOD - An IC including first metal layer having wiring running in a first direction; a second metal layer having wiring running in a second direction perpendicular to the first direction; and a first via layer between the first metal layer and the second metal layer, the first via layer including a viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer. | 2010-02-11 |
20100032847 | METHOD FOR FORMING A PACKAGE-ON-PACKAGE STRUCTURE - A method for forming a package-on-package structure is disclosed. The method comprises the step of providing a first semiconductor package. The first semiconductor package has at least one encapsulation layer formed on at least one side of the first semiconductor package. The method also involves the step of securing the first semiconductor package to a surface. The surface is adapted for receiving the first semiconductor package. The method further involves the step of reducing the thickness of the at least one encapsulation layer to a predetermined thickness. The at least one encapsulation layer having a portion distal the surface removed. More specifically, the thickness of the at least one encapsulation layer is reduced for providing a predetermined clearance from a second semiconductor package attachable to the first semiconductor package. The clearance is the distance between the at least one encapsulation layer of the first semiconductor package and a side of the second semiconductor package opposing thereto. | 2010-02-11 |
20100032848 | BOND PAD STRUCTURE AND METHOD FOR PRODUCING SAME - It is described a bond pad structure and a method for producing the same, the bond pad structure ( | 2010-02-11 |
20100032849 | MICROWAVE-ASSISTED SYNTHESIS OF CARBON AND CARBON-METAL COMPOSITES FROM LIGNIN, TANNIN AND ASPHALT DERIVATIVES - A process for synthesizing carbon-metal nanocomposites. In one embodiment, the process includes the steps of preparing a metal derivative or a metal chelated derivative of a carbon-containing precursor in solid form, and subjecting the metal derivative or metal chelated derivative of a carbon-containing precursor in solid form to microwave radiation at a frequency in the range of 900 MHz to 5.8 GHz, for a period of time effective to generate a heat flow from inside of the metal derivative or metal chelated derivative of a carbon-containing precursor in solid form to the outside such that the temperature of the metal derivative or metal chelated derivative of a carbon-containing precursor in solid form reaches 1,000° C. in less than 6 minutes with a temperature (T) derivative over time (t), ΔT/Δt, no less than 2.5° C./second to form carbon-metal nanocomposites. | 2010-02-11 |
20100032850 | De-Fouling Tubes for Cooling Tower - A tube in one embodiment is formed with a non-stick coating on its inner outer surface. Preferably, the non-stick coating is fluoropolymer. More preferably the fluoropolymer is PTFE. Another non-stick coating is formed on an inner surface of the tube in another embodiment. The non-stick coating served as a de-fouling layer is capable of preventing impurities in the water flowing through the tubes from precipitating thereonto. Hence, the performance of a cooling tower incorporating the tubes can be increased significantly. | 2010-02-11 |
20100032851 | Fluorinated elastomeric gas diffuser membrane - The present invention relates generally to a structure for a diffused aeration system. More particularly, the invention encompasses a diffuser membrane where at least a portion of the surface has been treated with at least one layer of fluorine, to form a fluorinated elastomeric gas diffuser membrane. The invention also includes the deposition of fluorine atoms on the surface of a non-fluorine containing membrane to create a permanent fluoro-elastomeric surface layer. Tubular and disc diffuser members are also disclosed that have at least a portion of them treated with at least one layer of fluorine. A process of making the inventive diffuser membrane is also disclosed. | 2010-02-11 |
20100032852 | METHOD OF CASTING PLASTIC LENS STARTING MATERIAL LIQUID AND CASTING APPARATUS, AND METHOD OF MANUFACTURING PLASTIC LENS - A method of casting a plastic lens starting material liquid using a casting apparatus comprising at least a mixing and discharging part and a casting part, and casting a plastic lens starting material liquid sequentially into multiple casting molds. Discharge of the plastic lens starting material liquid from the mixing and discharging part is halted based on a discharge halt preparation completion signal transmitted by the casting part, the discharge that has been halted is recommenced (1) at least based on a discharge recommencement preparation completion signal transmitted by the casting part or (2) by reception by the mixing and discharging part of a forced discharge start signal transmitted upon elapsing a predetermined time following halting of the discharge or following reception of the discharge halt preparation completion signal without transmission of a discharge recommencement preparation completion signal by the casting part, and the stirring in the mixing and discharging part is continued during the period when the discharge is halted. | 2010-02-11 |
20100032853 | METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE - A method for manufacturing an optical waveguide includes: step A of forming a first resin layer | 2010-02-11 |
20100032854 | METHOD AND APPARATUS FOR CONTROLLING PRESSURE IN ELECTRIC INJECTION MOLDING MACHINE - A rotational angle of a motor operative to propel forward a screw in an injection molding machine is detected at an encoder. An output from the encoder is employed to obtain an angular velocity ω of the motor. From the obtained angular velocity ω, an estimated melt pressure value δ̂ that contains no differential term is derived using a certain observer theory. The estimated melt pressure value δ̂ is employed to calculate a torque command value T | 2010-02-11 |
20100032855 | PLASTICIZING APPARATUS AND METHOD FOR CONTROLLING THE SAME - An object is to improve the quality of molded articles and enable stable molding to be performed. A plasticizing apparatus includes a cylinder member having a molding material supply opening at a predetermined position, a molding material being supplied into the cylinder member via the molding material supply opening; and a metering member rotatably disposed within the cylinder member and adapted to plasticize the molding material when the metering member is rotated. A gas-flow-forming medium hole is formed in the cylinder member at a predetermined position. An open-close apparatus ( | 2010-02-11 |
20100032856 | COATED FOAM BEADS AND PROCESS FOR PRODUCING HALOGEN-FREE, FIRE-RESISTANT BEAD FOAM MOLDINGS - A process for producing coated foam particles, in which an aqueous polymer dispersion is applied to the foam particles and is subsequently dried to form a water-insoluble polymer film, and also foam moldings produced therefrom and their use. | 2010-02-11 |
20100032857 | Ceramic components, coated structures and methods for making same - Methods of forming ceramic components are disclosed. One method calls for chemical vapor depositing a ceramic material over a substrate having first and second opposite surfaces to define a coated structure, the ceramic material forming a layer overlying both the first and second opposite surfaces. The layer and the substrate have a difference in thermal expansion coefficients of at least 0.5 ppm/K. The substrate is removed, leaving behind the layer. Ceramic components and coated structures are also disclosed. | 2010-02-11 |
20100032858 | METHOD OF MAKING AN ABSORBENT CORE HAVING A PLURALITY OF FIRST REGIONS AND A SECOND REGION SURROUNDING EACH OF THE FIRST REGIONS - The present invention relates to an absorbent article including a absorbent core having a plurality of first regions and a second region, each one of said first regions being arranged in spaced relationship from each of the other first regions and each of the first regions being entirely surrounded by the second region. The present invention also relates to a method of making such a core structure. | 2010-02-11 |
20100032859 | INJECTION MOLDING SUBSTANCE AND MANUFACTURING METHOD THEREOF - A method of manufacturing an injection molding substance and the injection molding substance is provided. The method of manufacturing an injection molding substance including: providing a molding compound including a powder; making an intermediate mold by injection molding using the molding compound; cutting a portion of the intermediate mold; and sintering the cut intermediate mold. | 2010-02-11 |
20100032860 | METHOD FOR MAKING AN ABSORBENT CORE HAVING CONCENTRICALLY ARRANGED ABSORBENT REGIONS - The present invention also relates to a method of making an absorbent core having a first central region and second region concentrically surrounding the first region. | 2010-02-11 |
20100032861 | Exterior Building Material Having a Hollow Thin Wall Profile and an Embossed Low Gloss Surface - A building product which includes a hollow extrudate, unitary reinforcing ribs resisting collapse of the hollow extrudate and, in an embodiment, an exterior surface comprises a low gloss, textured pattern having a gloss level of less than about 50 on a 60° glossmeter, in which the textured pattern extends for about 2-20 feet. Methods and an apparatus for manufacturing such products are also provided by this invention. | 2010-02-11 |
20100032862 | COMPOSITE TOOL FOR MOLDING CYLINDRICAL PARTS - A tool of a composite material for making a cylindrical part of a composite material. The tool is used for forming a mandrel on which the cylindrical part is to be formed. The tool comprises a set of members, each member defining a cylindrical sector of the tool, each member having a bearing structure of a fiber composite and a skin molded on the bearing structure. The tool further includes a seal located at the junctions between the tool members. | 2010-02-11 |
20100032863 | Methods of Manufacturing Molds and Parts - Methods of manufacturing molds and parts include generating a computer representation of a master part, determining an undercut region of the master part, generating a computer representation of a core to fill the undercut region, manufacturing a master part assembly having a master part and an embedded core, manufacturing a master mold core, creating a master mold using the master part assembly, placing the master mold core in the master mold and manufacturing a prototype part. | 2010-02-11 |
20100032864 | Process for Manufacturing a Pneumatic Tyre, Related Manufacturing Line and Assembling Apparatus - A process and a tyre manufacturing line for producing tyres, wherein the process includes the steps of: i) transferring a first toroidal support to a first assembling apparatus; ii) in the first assembling apparatus, sequentially building on the first toroidal support a first toroidal carcass ply and a first pair of annular reinforcing inserts so as to associate each annular reinforcing insert with a respective radially internal edge of the first toroidal carcass ply; iii) transferring the first toroidal support to a second assembling apparatus; iv) in the second assembling apparatus, sequentially building on the first toroidal support, carrying the first toroidal carcass ply associated with the first pair of annular reinforcing inserts, a second toroidal carcass ply and a second pair of annular reinforcing inserts so as to associate each annular reinforcing insert with a respective radially internal edge of the second toroidal carcass ply. | 2010-02-11 |
20100032865 | METHOD FOR MAKING A FOAMED SOLE - A method for making a foamed sole includes the steps of: a) preparing a mold having a lower mold part and an upper mold part removably covering the lower mold part, the lower mold part having a top surface and a lower mold cavity recessed from the top surface, the upper mold part having a bottom surface to contact the top surface of the lower mold part, and an upper mold cavity recessed from the bottom surface; b) filling and molding a first molding material in the upper mold part to form a first sole portion; and c) filling and molding a second molding material in the lower mold part to form a second sole portion having a hardness smaller than that of the first sole portion and bonding directly with the first sole portion. | 2010-02-11 |
20100032866 | METHOD FOR PRODUCING THERMOPLASTIC RESIN FILM - There is provided a method for producing a thermoplastic resin film that can suppress the occurrence of color nonuniformity in the produced thermoplastic resin film even when the film is incorporated into liquid crystal display devices and exposed to high temperature and high humidity over time. Heat treatment is conducted for the thermoplastic resin film at a temperature of Tg−30° C. or higher and Tg+20° C. or lower, Tg representing the glass transition temperature of the thermoplastic resin, for 10 seconds to 600 seconds while conveying the thermoplastic resin film at a tension of 2 N/cm | 2010-02-11 |
20100032867 | Method and apparatus for embossing non woven webs - A method of embossing an air-laid or double recrepe absorbent fabric including: providing a web of fabric; moving the web material along a web material path; providing a rotary embossing roller and a cooperating backing roller, the rotary embossing roller having a hard rubber embossing surface having a laser engraved embossing pattern with a depth of from about 0.010 inches to about 0.040 inches; providing a nip between the rotary embossing roller and backing roller; moving the web material through the nip between the rotary embossing roller and backing roller whereby a predetermined pattern is embossed on the web material. The embossing roller surface is biased toward the surface of the smooth backing roller. The surface of the backing roller being composed of a soft rubber compound having a durometer hardness of between 20 to 60. | 2010-02-11 |
20100032868 | Compression moulding apparatus, methods and item - An apparatus comprises a moulding unit having a punch and a mould cavity movable along a path between an open position in which said punch and said mould cavity are distanced apart from each other to receive a dose of plastics therebetween, and a closed position in which said punch and said mould cavity interact to form an item by pressing said dose, said punch being kept not above said cavity along said path. | 2010-02-11 |
20100032869 | Molded Filter - The invention provides a moulded micro-fibrous filter in which micro-fibres are held together by a binder, wherein the binder is a cured thermosetting acrylate resin. In a further aspect the invention provides an aqueous fibre slurry for use in moulding filter media, wherein said slurry comprises additionally a binder resin in an amount effective, after moulding said filter and curing, to act as binder for the media In a yet further aspect, the invention provides a method of moulding a filter, which comprises the steps of: (a) forming a slurry of fibers as aforesaid; (b) introducing the slurry under pressure into the top of an annular molding space defined between a central core, a vertical cylindrical screen spaced from and outward of said core and a support defining a lower boundary for the molding space so that a mass of fibers becomes compacted on the screen and liquid is discharged from the molding space through the screen; (c) progressively increasing the height of the effective open area of the cylindrical screen by moving upwardly a sleeve in sliding contact with the cylindrical screen at a rate substantially equal to the rate at which the height of the mass of fibers increases above the support; (d) removing the resulting tubular mass of fibers from the molding space; and (e) drying the tubular mass and curing binder resin to form said filter. The acrylate binder resin is compatible with the e.g. acidic conditions needed to stabilize the resin, can form part of the fiber slurry used for molding the filter, and after filter formation and drainage can be cured by heat to complete formation of the molded filter element. | 2010-02-11 |
20100032870 | METHOD FOR THE PRODUCTION OF FIBER-REINFORCED POLYPROPYLENE MOLDED PARTS CONTAINING PORES - Low density and acoustically absorbing panels are produced by consolidation in a mold of a heated part of a pre-cut, lofty, semi-finished product containing polypropylene fibers and reinforcing fibers and having an air pore content of 20 to 80 vol.-% wherein overlapping with the periphery of the pre-cut part are heated strips of polypropylene optionally containing up to 60 wt.-% reinforcing fibers, but containing 5 vol.-% or less of air pores. | 2010-02-11 |
20100032871 | METHOD FOR MOLDING THERMOPLASTIC RESIN - In press molding or embossing a thermoplastic resin for producing a molded product excellent in transferability of microscopic surface asperities and having high quality with high productivity, a preform of a thermoplastic resin is heated to about the hardening temperature of the thermoplastic resin constituting the preform. The preform is embedded between an upper half and a lower half of a mold which are maintained at a temperature of about the hardening temperature of the thermoplastic resin, and then the mold is closed at a low pressure. Carbon dioxide is dissolved in a surface of the preform by charging carbon dioxide between a surface of the mold and the surface of the preform in order to reduce the viscosity of the preform surface. The surface of the mold is brought into contact with the preform having the reduced surface viscosity by increasing a pressing pressure. Then, carbon dioxide is discharged, and a molded product is extracted. Thus, the molded product excellent in transferability of microscopic surface asperities and having high quality can be produced with high productivity. | 2010-02-11 |
20100032872 | SOLUTION SPUN FIBER PROCESS - The invention relates to a process for forming fibers from a spinning solution utilizing a high speed rotary sprayer. The fibers can be collected into a uniform web for selective barrier end uses. Fibers with an average fiber diameter of less that 1,000 nm can be produced. | 2010-02-11 |
20100032873 | Method and Apparatus for Manufacturing Pneumatic Tyres - A green pneumatic tyre is built on a rigid toroidal support externally having a forming surface of a conformation corresponding to the inner shape of a tyre. The green tyre engaged on the expandable toroidal support is introduced into a vulcanisation mould and submitted to a vulcanisation cycle. During vulcanisation, axial moving apart of side portions of the toroidal support is caused so as to press the beads and sidewalls of the tyre against the vulcanisation mould. | 2010-02-11 |
20100032874 | PROCESSES AND METHODS OF MAKING BORON CARBIDE AND BORON CARBIDE COMPONENTS - High-density components and products as well as processes for making high-density components and products are disclosed. One exemplary component, among others, includes a boron carbide component comprised of a homogeneous boron carbide powder. The component has at least a 93% relative density (RD) and a Vickers hardness of at least 2000 kg/mm | 2010-02-11 |
20100032875 | Processing method for solid core ceramic matrix composite airfoil - A method of processing solid core ceramic matrix composite articles. The method improves the physical characteristics of the article by forming the airfoil using a co-processing method wherein a refractory ceramic is cast against a preformed ceramic matrix composite (CMC) shell. In one aspect, the shell is continuous to help prevent delaminations. In another aspect, the shell is open. In one embodiment, the article includes a split line. The split line helps the article to be less susceptible to damage caused from internal strain. | 2010-02-11 |
20100032876 | VIBRATION ISOLATOR SYSTEM - A vibration isolator system for attaching a payload to a supporting base is provided, the payload having a center of mass and the system consisting of at least three vibration isolating pods. Each pod has two associated, non-parallel, elastic struts. A first end of each strut is attached to the supporting base and a second end of each strut is attached to the payload at a respective mounting point, and the a projected elastic center of the system is substantially co-located with said center of mass. The vibration isoloator system is operable to substantially prevent translational vibration of the supporting base from inducing angular rotation of the payload. | 2010-02-11 |
20100032877 | Cord Reinforced Resilient Membrane - A cord reinforced resilient membrane (or diaphragm) having a high radial (transverse) stiffness and a relatively low axial stiffness, wherein the cord reinforced resilient membrane has adapatability for use in both hydraulic and conventional strut mounts, as well as other applications, and wherein the radial stiffness provided by the cords is directionally tunable for utilization in a particular application. | 2010-02-11 |
20100032878 | Synchronous positioning frame assembly machine - A Synchronous Positioning Frame Assembly Machine having a plurality of extension wings ( | 2010-02-11 |
20100032879 | MACHINE TOOL - The invention relates to a machine tool, wherein the machine tool has a workpiece clamping device ( | 2010-02-11 |
20100032880 | Adjustable track mount beam securing device - An adjustable clamping device to secure a tube to a track system. | 2010-02-11 |
20100032881 | Transfer Device for Mail Items - A transfer device for mail items with a transfer unit which has an ejection point for transferring individualized mail items to an item carrier is provided. Further, the transfer device includes a transport device for transporting the mail items to the ejection point in a direction of transport. The transport device includes two belts for holding the mail items on both sides and for transporting the mail items and further has means for adapting a space between the belts to the thickness of a mail item. The means for adapting is a belt tilt means which is pivotal about an axis of rotation, the pivotal movement pivoting one of the belts and therefore a distance between the belts is variable. | 2010-02-11 |
20100032882 | DEVICE FOR SUPPLYING PRINTED PRODUCTS TO A PROCESSING SECTION - An apparatus for separating and removing a flexible flat object, such as a printed product, from an underside of a stack of flexible flat objects, and for supplying the objects to a processing section, includes a conveying rotor having a central axis, a shaft arranged concentrically with the central axis and at least one separating element located in a circumferential region of the conveying rotor to respectively lift at least partially one of the flexible flat objects from the stack and deposit the object in a region of the circumference of the conveying rotor. The separating element includes a suction mount pivotally arranged on the conveying rotor and positioned at a distance from and parallel to the shaft; a suction head attached to the suction mount to pivot with the suction head and to grip the flexible flat object with a suction force; an activation mechanism to control a pivoting movement of the suction mount when an object is partially lifted from an end of the stack; a joint coupled to the suction mount; and a control device connected to the joint to effect a further pivoting movement of the suction mount. | 2010-02-11 |
20100032883 | Kiosk-Installable Printer with Duplex Path Utilized to Deliver Printed Media Sheets to Lower Front Exterior of Printer - An image forming device includes an image formation path extending from an entrance end adjacent to a source of supply of media sheets, past an image forming station, to an exit end adjacent to a top collection site adapted to receive media sheets, a duplex path extending from an inlet end adjacent the top collection site to an outlet end adjacent a lower front opening in the device, a media sheet directing mechanism disposed between the exit end of the image formation path, top collection site and inlet end of the duplex path and selectively operable to deliver printed media sheets to the top collection site or the inlet end of the duplex path, and a deflector mechanism between the lower front opening and the outlet end of the duplex path and operable to divert printed media sheets from the duplex path through the lower front opening to exterior of the device. | 2010-02-11 |
20100032884 | SYSTEM AND METHOD FOR SLIP SHEET EVACUATION - A system and method for slip sheet disposal from a plate imaging device or printing device comprises a slip sheet dispensing means configured for dispensing the slip sheets from the plate imaging device and an air release module configured to apply air flow between the slip sheets and the slip sheet sliding tray during the slip sheets dispensing from the plate imaging device or printing device. | 2010-02-11 |
20100032885 | Bidirectional-to-unidirectional transmission system and sheet feeding apparatus using the same - A transmission system includes a rotatable main gear, first and second transmission gears rotatably and movably disposed and respectively in constant mesh with the main gear, and first and second power output components rotatably disposed and in constant mesh with each other. The first and second transmission gears detachably mesh with the first and second power output components respectively. The main gear is rotated counterclockwise to drive the second transmission gear away from the second power output component, and to drive the first transmission gear to mesh with the first power output component to rotate the first and second power output components. The main gear is rotated clockwise to drive the first transmission gear away from the first power output component, and to drive the second transmission gear to mesh with the second power output component to rotate the second and first power output components. | 2010-02-11 |
20100032886 | Composite Substrate Feeding Mechanism - Embodiments described herein include a composite feeding mechanism configured to process one or more jobs using a stack of feeder trays. The composite feeding mechanism can include the stack of feeder trays, a base unit, and a feeder unit. The feeder trays can hold substrate media to satisfy jobs and the base unit can support the stack of feeder trays. The feeder unit can remove the substrate media from a feeder tray located at the top of the stack to satisfy a job requirement. | 2010-02-11 |
20100032887 | DRIVE SWITCHING MECHANISM AND FEEDING DEVICE - A drive switching mechanism includes a transmission gear and a planetary gear configured to transmit a drive from an input gear to an output gear. The drive switching mechanism further includes a swinging member configured to hold the planetary gear such that the planetary gear can swing around the input gear, a retaining unit configured to retain the swinging member in a swing enabled or disabled state, and a releasing unit configured to disengage the planetary gear from the output gear and cause them to be spaced apart. The output gear includes a toothless part that does not engage with a gear section engaging with the transmission gear. | 2010-02-11 |
20100032888 | PICKOFF MECHANISM FOR MAIL FEEDER - A pickoff system for removal of mail pieces one at a time from the end of a stack includes a pickoff belt mechanism positioned to frictionally engage an outer surface of a mail piece at the end of the stack and transport it transversely to a thickness direction of the stack, which mechanism includes one or more belts mounted on rollers and driven by a drive motor. A sensor is positioned to determine mail piece movement speed as it is being transported by the pickoff belt mechanism, and a measurement device determines belt movement speed during operation of the pickoff belt mechanism. A system is provided for reducing or stopping slipping of the mail piece relative to the belt during transport by the belt pickoff mechanism. A controller is connected to the sensor and the belt movement speed measurement device. The controller is configured to compare the belt movement speed and the mail piece movement speed during operation, and when mail piece movement speed is slower than belt movement speed, indicating slipping of the mail piece relative to the belt of the pickoff belt mechanism, the controller actuates the means for stopping slipping of the mail piece relative to the belt. | 2010-02-11 |
20100032889 | PICKOFF MECHANISM FOR MAIL FEEDER - A pickoff system for removal of mail pieces one at a time from the end of a stack includes a pickoff belt mechanism positioned to frictionally engage an outer surface of a mail piece at the end of the stack and transport it transversely, which mechanism includes one or more belts mounted on a drive roller at one end driven by a drive motor and a follower roller at a trailing end. A pivot mechanism permits the trailing end to swing towards and away from the stack. A drive is connected to the pivot mechanism to move the trailing end towards and away from the stack, and a controller is connected to the drive to cause the drive to swing the trailing end towards the stack and swing the trailing end away from the stack in a manner effective to improve operation of the pickoff system. | 2010-02-11 |
20100032890 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING SHEET FEEDING DEVICE - A sheet feeding device has a sheet accommodating portion for accommodating a sheet stack, a sheet carrying plate for carrying the sheet stack and a pickup roller that dispatches the uppermost sheet of the stack. An elevator displaces the sheet carrying plate between a sheet feeding position where an upper face of the sheet stack contacts the pickup roller and a separating position where the upper face of the sheet stack is separated from the pickup roller. A first warm air mechanism blows warm air toward a side face of the sheet stack. A controller causes the first warm air mechanism to blow warm air to the side face of the sheet stack and causes the elevator to displace the sheet carrying plate between the sheet feeding position and the separating position. | 2010-02-11 |
20100032891 | Sheet feeding device and image forming apparatus - A sheet feeding device including a belt including a dielectric material seamlessly wound about rollers and disposed opposite a top surface of a stack of multiple sheets placed on a sheet storage stand to attract a sheet from the stack of multiple sheets and convey the sheet, and a charger to form a predetermined charge pattern on a surface of the belt. A shaft of one of the rollers provided downstream from the other roller in a direction of sheet feed serves as a pivot of the belt about which the belt swings, and the belt swings around the pivot such that the surface of the belt facing the top surface of the stack of multiple sheets and a surface of the sheet storage stand facing the surface of the belt are substantially parallel to each other. | 2010-02-11 |
20100032892 | METHOD AND APPARATUS FOR FLUFF MANAGEMENT IN AN IMAGE PRODUCTION DEVICE - A method and apparatus for fluff management in an image production device is disclosed. The method may include fluffing a stack of media with a predetermined amount of air flow, sensing sheet separation in the media stack, determining if the sheet separation meets predetermined criteria, wherein if the sheet separation does not meet the predetermined criteria, adjusting the air flow used for fluffing the media stack. | 2010-02-11 |
20100032893 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - The present invention provides a sheet feeding apparatus and an image forming apparatus in which generation of a hollow at a separation roller can be prevented. | 2010-02-11 |
20100032894 | RIGHT ANGLE TURN (RAT) MODULE FOR CONVEYING MAILPIECE COLLATIONS - A Right Angle Turn (RAT) module for processing multi-sheet collations includes opposed belt segments defining a conveyance channel for capturing multi-sheet collations therebetween and for conveying multi-sheet collations from an input and to an output end of the conveyance channel. The opposed belt segments define a first re-directing bend, a second re-directing bend, and a twist section disposed therebetween. The first re-directing bend includes a rolling element for re-directing the opposed belt segments about a first axis of rotation while the second re-directing bend includes a rolling element for re-directing the opposed belt segments about a second axis of rotation. The first and second axes of rotation are orthogonal to each other so as to effect a twist section therebetween. The RAT module additionally includes a mechanism for driving the opposed belt segments about the first and second re-directing bends to convey the multi-sheet collations from the input to output ends and effect a right angle turn of the multi-sheet collations. | 2010-02-11 |
20100032895 | SHEET DISCHARGING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SHEET DISCHARGING DEVICE - In a sheet discharging unit including a pair of sheet discharge rollers which discharges a sheet P, the outer diameter of a sheet discharge drive roller included in the pair of sheet discharge rollers is set so that the outer diameter of a straight portion which is a central portion in the width direction perpendicular to the discharging direction of the sheet P is larger than the outer diameters of both end portions in the width direction. Further, in the sheet discharging unit, the pair of sheet discharge rollers respectively include metal shafts extending in the width direction and elastic layers respectively wound around the metal shafts and continuously formed to be longer in the width direction than the width of a sheet P with a passable maximum size. Further, at least one elastic layer of the pair of sheet discharge rollers is formed of a foamed material. | 2010-02-11 |
20100032896 | Gaming System and Game Controller - A result generator for a gaming system comprising: one or more dice, each die having a plurality of facets each facet provided with an identification circuit having a readable identification code which is unique within the random number generator; a support platform having an upper surface for supporting the dice while at rest; an agitator adapted to cause mechanical movement of the dice to generate a random dice roll result; a dice reader disposed below the upper surface of the support platform comprising a plurality of electronic detectors adapted to read the identification code of each dice facet resting against the upper surface of the dice support platform to determine the dice roll result. | 2010-02-11 |
20100032897 | Three dimensional puzzle - A multiple dimensional puzzle configuration having interlocking puzzle components defining a fixed geometric shape upon proper assembly. Each of the multiple puzzle elements has multiple surfaces that engage corresponding interlocking surfaces of adjacent puzzle component elements within a display formation for commercial indicia or other so designated messages when assembled. | 2010-02-11 |
20100032898 | Color By Symbol Picture Puzzle Kit - Disclosed herein is a picture puzzle kit for enabling a user to color a picture puzzle using symbols representing different colors. The picture puzzle kit comprises puzzle pieces and a color chart. The puzzle pieces, made of plastic, cardboard, or a wooden material, comprise portions of a picture and symbols corresponding to different colors. The picture may be of different designs. The color chart displays different colors with corresponding symbols for the colors. The picture puzzle kit may further comprise a base for supporting the puzzle pieces. The puzzle pieces may be linked to assemble the picture. The puzzle pieces may be linked by interlocking the puzzle pieces or by placing the puzzle pieces adjacent to one another. The picture puzzle kit may further comprise coloring tools to enable the user to color the puzzle pieces using symbols representing the different colors displayed on the color chart. | 2010-02-11 |
20100032899 | Color By Symbol Picture Puzzle Kit - A picture puzzle kit is provided for coloring a picture puzzle marked with indicia corresponding to multiple colors. The picture puzzle kit comprises puzzle pieces, color charts, and coloring tools. The puzzle pieces comprise parts of a picture and are marked with indicia corresponding to different colors. The color charts display colors corresponding to the indicia marked on the puzzle pieces. In an embodiment, multiple removable layers are stacked one above the other on each of the puzzle pieces. In another embodiment, an embedded audio assembly is provided in each of the puzzle pieces and the color charts for audibly indicating characteristics of the puzzle pieces and the color charts respectively. The puzzle pieces are linked to assemble the picture puzzle. The coloring tools enable the user to color the puzzle pieces using the colors displayed on the color charts corresponding to the indicia marked on the puzzle pieces. | 2010-02-11 |
20100032900 | ARRANGEMENT FOR ELECTRONICALLY CARRYING OUT BOARD ROLE-PLAY AND CARD GAMES - The invention relates to an assembly for electronically performing board-, role-, or collection card games through data transmission from and to a game console and RFID elements, for reading out and/or changing game status or game course representing data and data characterizing player features. | 2010-02-11 |
20100032901 | BOARD GAME WITH TOWER AND COLLAPSING STAIRS - An Indiana Jones theme board game having a tower supporting a plurality of collapsible stairs mounted in a spiral fashion, a deck of chance cards, dice, and pawns for the players. A tower top is mounted to the upper portion of the tower for rotation and downward vertical movement. A tube is mounted within the tower, and a number of pegs are mounted in the tower wall, one peg supporting a corresponding stair. The tube and pegs cooperate to transmit the rotational and vertical movement of the tower top to the collapsible stairs. The player picks a card and follows instructions printed on the card. During the game, certain cards instruct the players to rotate the tower top, causing openings in the outer wall of the tube to be located adjacent different combination of pegs, the combination being hidden and unknown to the players, such that the next vertical movement of the tower top and the tube results in an unknown combination of stairs to collapse. Certain stairs include hooks for engaging the pawns and preventing their fall should the stairs collapse. The tower also includes several small openings spaced from certain other stairs that allow pawns moved to particular spaces on those stairs to engage the tower to also ensure that the pawns do not fall should the stairs collapse. | 2010-02-11 |
20100032902 | GAME WITH PLANNING, MOVEMENT AND CONFLICT, AND REPLENISHMENT MECHANICS - A game in which players move game pieces across a field in order to occupy objective regions. During each turn of play, players first plot movements. Subsequently, the players execute their plotted movements one at a time, thereby attempting to move one or more of their game pieces to occupy particular regions of the field. Game pieces are eliminated from the field when one player's game pieces enter a region containing another player's game pieces. The elimination of game pieces is based upon a comparison of the amount of the game pieces in each player's grouping in the region. A player wins the game when he has at least one game piece on a sufficient amount of his objective regions. | 2010-02-11 |
20100032903 | BOARD GAME WITH SCISSORS, ROCK, AND PAPER PIECES WHICH ARE FACED DOWN AT THE START OF GAME - A board game includes a chessboard having squares arranged in a pattern on the chessboard; and pieces adapted to place on the squares respectively, each piece having a no-mark face-up side and a face-down side with either of diagonal lines or a grid of lines being printed thereon. The pieces with the diagonal lines are identified as one side and the pieces with the grid of lines are identified as the opposing side. Either side has one half the number of the pieces. The face-down side of each piece is marked with a scissors, a rock, or a paper. The pieces belonging to either side are grouped as the scissors pieces, the rock pieces, and the paper pieces, all being equal in numbers. The board game is particularly intended to be played by two individuals such as children or non-Chinese adults who cannot read Chinese characters. | 2010-02-11 |
20100032904 | INFORMATION PROCESSING SYSTEM - An information processing system includes an input section that inputs movement information of an object on which a user performed an operation in an operation environment, and an output section that holds another object in a remote site remote from the operation environment and reproduces a movement of the object on which the user performed the operation on the basis of the movement information received from the input section. | 2010-02-11 |
20100032905 | SHOOTING GALLERY DEVICES AND METHODS - Shooting gallery devices and methods are disclosed herein. In one embodiment, a shooting gallery includes a plurality of targets rotatably connected to a plurality of target connectors. The targets rotate between an extended position and a fallen position. The target and target connector assembly at least partially retains the targets in the extended position and/or prevents the targets from rotating from the extended position to the fallen position. Furthermore, the targets and target connector assemblies are configured to reset from the fallen position to the extended position without a rail guide or reset cam. | 2010-02-11 |
20100032906 | PNEUMATIC STEEL TARGET SYSTEM - Disclosed is a pneumatically operated steel target system that incorporates a polymer-like mannequin molded to an AR500 abrasive resistant material with a 500 Brinell (460-540) rating, which can be clothed for any event, allowing users to practice on human-like targets as opposed to a target with no features where the user's real-life training would be reduced. The target system has a protective chest plate proportionately angled at approximately 12 degrees from center to deflect bullet fragmentations downward and away from the shooter. | 2010-02-11 |
20100032907 | SEAL ASSEMBLY - A seal assembly ( | 2010-02-11 |
20100032908 | SEAL - This invention relates to a seal for sealing between a stator and rotor, including a generally annular carrier ( | 2010-02-11 |