| 06th week of 2012 patent applcation highlights part 40 |
| Patent application number | Title | Published |
|---|
| 20120034757 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING VARIOUS ISOLATION REGIONS - A method of fabricating a semiconductor device includes forming a first trench and a second trench in a semiconductor substrate, forming a first insulator to completely fill the first trench, the first insulator covering a bottom surface and lower sidewalls of the second trench and exposing upper sidewalls of the second trench, and forming a second insulator on the first insulator in the second trench. | 2012-02-09 |
| 20120034758 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE - A cap film which can prevent diffusion of hydrogen from the embrittled region and supply hydrogen to a region between the embrittled region and the surface of the semiconductor substrate is formed over the semiconductor substrate, and the semiconductor layer is transferred from the semiconductor substrate to the base substrate. In particular, the amount of hydrogen contained in the cap film formed over the semiconductor substrate is preferably greater than or equal to the irradiation amount of hydrogen ions. | 2012-02-09 |
| 20120034759 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes the steps of forming a plurality of first integrated circuits on the surface side of a first semiconductor substrate; forming a plurality of second integrated circuits in a semiconductor layer that is formed on a release layer provided on a second semiconductor substrate; bonding the two semiconductor substrates so that electrically bonding portions are bonded to each other to form a bonded structure; separating the second semiconductor substrate from the bonded structure at the release layer to transfer, to the first semiconductor substrate, the semiconductor layer in which the plurality of second integrated circuits are formed; and dicing the first semiconductor substrate to obtain stacked chips each including the first integrated circuit and the second integrated circuit. | 2012-02-09 |
| 20120034760 | Metallization for Chip Scale Packages in Wafer Level Packaging - In one embodiment, a method for forming the semiconductor device includes forming a first trench from a front side of a substrate. The substrate has a front side and an opposite back side, and the first trench having sidewalls and a bottom surface. A insulator layer is formed over the sidewalls and the bottom surface. A first conductive layer is formed over a top portion of the sidewalls of the first trench. The substrate is separated along the first trench. | 2012-02-09 |
| 20120034761 | METHOD OF REMOVING CONTAMINANTS AND NATIVE OXIDES FROM A SUBSTRATE SURFACE - Embodiments of the present invention generally relate to methods for removing contaminants and native oxides from substrate surfaces. The methods generally include exposing a substrate having an oxide layer thereon to an oxidizing source. The oxidizing source oxidizes an upper portion of the substrate beneath the oxide layer to form an oxide layer having an increased thickness. The oxide layer with the increased thickness is then removed to expose a clean surface of the substrate. The removal of the oxide layer generally includes removal of contaminants present in and on the oxide layer, especially those contaminants present at the interface of the oxide layer and the substrate. An epitaxial layer may then be formed on the clean surface of the substrate. | 2012-02-09 |
| 20120034762 | Method for Selective Deposition of a Semiconductor Material - A method is disclosed comprising providing a substrate comprising an insulating material and a second semiconductor material and pre-treating the substrate with a plasma produced from a gas selected from the group consisting of a carbon-containing gas, a halogen-containing gas, and a carbon-and-halogen containing gas. The method further comprises depositing a first semiconductor material on the pre-treated substrate by chemical vapor deposition, where the first semiconductor material is selectively deposited on the second semiconductor material. The method may be used to manufacture a semiconducting device, such as a microelectromechanical system device, or to manufacture a semiconducting device feature, such as an interconnect. | 2012-02-09 |
| 20120034763 | Method of Manufacturing Nitride Semiconductor Substrate - The present invention provides a method of manufacturing a nitride semiconductor substrate capable of efficiently manufacturing a nitride semiconductor substrate having a nonpolar plane as a major surface in which polycrystalline growth is minimized. A method of manufacturing a GaN substrate, which is a nitride semiconductor substrate, includes steps (S | 2012-02-09 |
| 20120034764 | SYSTEM AND METHOD FOR FABRICATING THIN-FILM PHOTOVOLTAIC DEVICES - Described are an apparatus and a method for depositing a thin film on a web. The method includes depositing a first layer of a composite metal onto a web. A first selenium layer is deposited onto the first layer and the web is heated to selenize the first layer. Subsequently, a second layer of the composite metal is deposited onto the selenized first layer and a second selenium layer is deposited onto the second layer. The web is then heated to selenize the second layer. The composition of each composite metal layer can be varied to achieve desired bandgap gradients and other film properties. Segregation of gallium and indium is substantially reduced or eliminated because each incremental layer is selenized before the next incremental layer is deposited. The method can be implemented in production systems to deposit CIGS films on metal and plastic foils. | 2012-02-09 |
| 20120034765 | MANUFACTURING METHOD OF MICROCRYSTALLINE SILICON FILM AND MANUFACTURING METHOD OF THIN FILM TRANSISTOR - An object is to provide a manufacturing method of a microcrystalline silicon film with improved adhesion between an insulating film and the microcrystalline silicon film. The microcrystalline silicon film is formed in the following manner. Over an insulating film, a microcrystalline silicon grain having a height that allows the microcrystalline silicon grain to be completely oxidized by later plasma oxidation (e.g., a height greater than 0 nm and less than or equal to 5 nm), or a microcrystalline silicon film or an amorphous silicon film having a thickness that allows the microcrystalline silicon film or the amorphous silicon film to be completely oxidized by later plasma oxidation (e.g., a thickness greater than 0 nm and less than or equal to 5 nm) is formed. Plasma treatment in an atmosphere including oxygen or plasma oxidation is performed on the microcrystalline silicon grain, the microcrystalline silicon film, or the amorphous silicon film, so that a silicon oxide grain or a silicon oxide film is formed over the insulating film. A microcrystalline silicon film is formed over the silicon oxide grain or the silicon oxide film. | 2012-02-09 |
| 20120034766 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A process for fabricating a highly stable and reliable semiconductor, comprising: coating the surface of an amorphous silicon film with a solution containing a catalyst element capable of accelerating the crystallization of the amorphous silicon film, and heat treating the amorphous silicon film thereafter to crystallize the film. | 2012-02-09 |
| 20120034767 | Method of Making a Multicomponent Film - Described herein is a method and liquid-based precursor composition for depositing a multicomponent film. In one embodiment, the method and compositions described herein are used to deposit Germanium Tellurium (GeTe), Antimony Tellurium (SbTe), Antimony Germanium (SbGe), Germanium Antimony Tellurium (GST), Indium Antimony Tellurium (IST), Silver Indium Antimony Tellurium (AIST), Cadmium Telluride (CdTe), Cadmium Selenide (CdSe), Zinc Telluride (ZnTe), Zinc Selenide (ZnSe), Copper indium gallium selenide (CIGS) films or other tellurium and selenium based metal compounds for phase change memory and photovoltaic devices. | 2012-02-09 |
| 20120034768 | METHOD OF MANUFACTURING SEMICONDUCTOR WAFER - A method of manufacturing a semiconductor wafer, which includes: a semiconductor substrate made of silicon and having both a central area and an outer periphery area; and a compound semiconductor layer made of a nitride-based semiconductor and formed on the semiconductor substrate, the method comprising: forming a growth inhibition layer to inhibit the compound semiconductor layer from growing on a tapered part provided in the outer periphery area of the semiconductor substrate; and growing the compound semiconductor layer on at least the central area of the semiconductor substrate, after the growth inhibition layer has been formed. | 2012-02-09 |
| 20120034769 | LOW TEMPERATURE MICROWAVE ACTIVATION OF HEAVY BODY IMPLANTS - Semiconductor devices and methods for making such devices are described. The semiconductor devices contain dopant regions that have been formed by low temperature, microwave activation of implanted dopants. In some configurations, the low temperature microwave activation can be used to control the final location of the implant, with or without additional drive-in or implant processes. In some configurations, this control can be used to create heavy body implants. Microwave activation of source regions and well regions in the semiconductor devices can also be used to optimize the implants where supplemental drive-in processes may be necessary to get the required final implant depth. By activating the implanted dopants using lower temperatures, many of the unwanted features introduced into the semiconductor devices by high temperature Rapid Thermal Process (RTP) can be avoided. Other embodiments are described. | 2012-02-09 |
| 20120034770 | LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A liquid crystal display device includes a plurality of gate lines and data lines crossing each other to define a plurality of pixel regions, a plurality of thin film transistors, each disposed in one of the pixel regions, and a plurality of pixel electrodes, each disposed in one of the pixel regions, wherein the thin film transistor includes at least one Ti layer. | 2012-02-09 |
| 20120034771 | BOND PAD FOR LOW K DIELECTRIC MATERIALS AND METHOD FOR MANUFACTURE FOR SEMICONDUCTOR DEVICES - A method for manufacturing a semiconductor device having improved contact structure includes providing a semiconductor substrate, forming a plurality of gate structures formed on a portion of the substrate, forming an interlayer dielectric layer overlying the gate structures, and forming a first copper interconnect layer overlying the substantially flat surface region of the interlayer dielectric layer. The method further includes forming a dielectric layer overlying the first copper interconnect layer, forming a second copper interconnect layer overlying the dielectric layer, and providing a copper ring structure enclosing an entirety of an inner region of the dielectric layer, the copper ring structure being provided between the first copper interconnect layer and the second copper interconnect layer to maintain the inner region of the dielectric layer. In addition, the method includes forming a bonding pad structure overlying a region within the inner region of the dielectric layer. | 2012-02-09 |
| 20120034772 | Nonvolatile Semiconductor Memory Device Having Multi-Layered Oxide/(OXY) Nitride Film as Inter-Electrode Insulating Film and Manufacturing Method Thereof - A nonvolatile semiconductor memory device includes a first insulator, first conductor, element isolation insulator, second insulator and second conductor. The first insulator is formed on the main surface of a substrate and the first conductor is formed on the first insulator. The element isolation insulator is filled into at least part of both side surfaces of the first insulator in a gate width direction thereof and both side surfaces of the first conductor in a gate width direction thereof and is so formed that the upper surface thereof will be set with height between those of the upper and bottom surfaces of the first conductor. The second insulator includes a three-layered insulating film formed of a silicon oxide film, a silicon oxynitride film and a silicon oxide film formed on the first conductor and element isolation insulator. The second conductor is formed on the second insulator. | 2012-02-09 |
| 20120034773 | TRANSISTOR HAVING AN ETCH STOP LAYER INCLUDING A METAL COMPOUND THAT IS SELECTIVELY FORMED OVER A METAL GATE, AND METHOD THEREFOR - In one aspect, an apparatus may include a metal gate of a transistor. An etch stop layer may be selectively formed over the metal gate. The etch stop layer may include a metal compound. An insulating layer may be over the etch stop layer. A conductive structure may be included through the insulating layer to the metal gate. Methods of making such transistors are also disclosed. | 2012-02-09 |
| 20120034774 | Energy Conditioning Circuit Arrangement for Integrated Circuit - The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed. | 2012-02-09 |
| 20120034775 | Method for Forming a Patterned Thick Metallization atop a Power Semiconductor Chip - A method is disclosed for forming a patterned thick metallization atop a semiconductor chip wafer. The method includes fabricating a nearly complete semiconductor chip wafer ready for metallization; depositing a bottom metal layer of sub-thickness TK | 2012-02-09 |
| 20120034776 | DEVICE OF FILLING METAL IN THROUGH-VIA-HOLE OF SEMICONDUCTOR WAFER AND METHOD USING THE SAME - A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole. | 2012-02-09 |
| 20120034777 | Through Hole Vias at Saw Streets Including Protrusions or Recesses for Interconnection - A semiconductor package includes a semiconductor wafer having a plurality of semiconductor die. A contact pad is formed over and electrically connected to an active surface of the semiconductor die. A gap is formed between the semiconductor die. An insulating material is deposited in the gap between the semiconductor die. An adhesive layer is formed over a surface of the semiconductor die and the insulating material. A via is formed in the insulating material and the adhesive layer. A conductive material is deposited in the via to form a through hole via (THV). A conductive layer is formed over the contact pad and the THV to electrically connect the contact pad and the THV. The plurality of semiconductor die is singulated. The insulating material can include an organic material. The active surface of the semiconductor die can include an optical device. | 2012-02-09 |
| 20120034778 | Double Patterning Strategy for Contact Hole and Trench in Photolithography - A method of lithography patterning includes forming a first resist pattern on a substrate, the first resist pattern including a plurality of openings therein on the substrate; forming a second resist pattern on the substrate and within the plurality of openings of the first resist pattern, the second resist pattern including at least one opening therein on the substrate; and removing the first resist pattern to uncover the substrate underlying the first resist pattern. | 2012-02-09 |
| 20120034779 | APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE - In a semiconductor device manufacturing method, an etching mask ( | 2012-02-09 |
| 20120034780 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE - A method for forming a semiconductor device. A substrate having thereon at least one small pattern and at least one large pattern is provided. A sacrificial layer is deposited to cover the small pattern and the large pattern. A chemical mechanical polishing is performed to planarize the sacrificial layer. The sacrificial layer is then dry etched to a thickness that is smaller than a height of the small pattern and the large pattern, thereby revealing an oxide hard mask of the small pattern and the large pattern. The oxide hard mask is then selectively removed. | 2012-02-09 |
| 20120034781 | METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE - A method for fabricating a semiconductor structure is disclosed. The method includes the steps of: providing a substrate; depositing a material layer on the substrate; forming at least one dielectric layer on the material layer; forming a patterned resist on the dielectric layer; performing a first trimming process on at least the patterned resist; performing a second trimming process on at least the dielectric layer; and using the dielectric layer as mask for etching the material layer. | 2012-02-09 |
| 20120034782 | Method of Forming Fine Patterns - A method of forming fine patterns according to an aspect of the present disclosure comprises stacking a hard mask layer and a first auxiliary layer over an underlying layer, removing regions of the first auxiliary layer, thereby forming first auxiliary patterns to expose regions of the hard mask layer, filling between the first auxiliary patterns with a second auxiliary layer, wherein a material of the second auxiliary layer is different from that of the first auxiliary layer, lowering a height of the second auxiliary layer by removing the second auxiliary layer to expose sidewalls of the first auxiliary patterns, forming spacers on the exposed sidewalls of the first auxiliary patterns to expose regions of the second auxiliary layer, wherein a material of the spacers is different from that of the second auxiliary layer, removing the exposed regions of the second auxiliary layer, removing the spacers and the first auxiliary patterns to expose regions of the hard mask layer and removing the exposed regions of the hard mask layer, thereby forming hard mask patterns. | 2012-02-09 |
| 20120034783 | MANUFACTURING INTEGRATED CIRCUIT COMPONENTS HAVING MULTIPLE GATE OXIDATIONS - STI divot formation is minimized and STI field height mismatch between different regions is eliminated. A nitride cover layer ( | 2012-02-09 |
| 20120034784 | Methods of Forming Fine Patterns in Semiconductor Devices - Methods of forming a semiconductor device may include providing a feature layer having a first region and a second region. The methods may also include forming a dual mask layer on the feature layer. The methods may further include forming a variable mask layer on the dual mask layer. The methods may additionally include forming a first structure on the feature layer in the first region and a second structure on the feature layer in the second region by patterning the variable mask layer and the dual mask layer. The methods may also include forming a first spacer on a sidewall of the first structure and a second spacer on a sidewall of the second structure. The methods may further include removing the first structure while maintaining at least a portion of the second structure. | 2012-02-09 |
| 20120034785 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - According to one embodiment, a semiconductor device manufacturing method includes collectively etching layers of a multilayered film including silicon layers and silicon oxide films alternately stacked on a semiconductor substrate. The etching gas of the etching contains at least two types of group-VII elements and one of a group-III element, a group-IV element, a group-V element, and a group-VI element, the energy of ions entering the semiconductor substrate when performing the etching is not less than 100 eV, and an addition ratio of the group-III element, the group-IV element, the group-V element, the group-VI element, and the group-VII element to the group-VII element is 0.5 (inclusive) to 3.0 (inclusive). | 2012-02-09 |
| 20120034786 | Plasma Processing Chamber with Dual Axial Gas Injection and Exhaust - An electrode is exposed to a plasma generation volume and is defined to transmit radiofrequency power to the plasma generation volume, and includes an upper surface for holding a substrate in exposure to the plasma generation volume. A gas distribution unit is disposed above the plasma generation volume and in a substantially parallel orientation to the electrode. The gas distribution unit includes an arrangement of gas supply ports for directing an input flow of a plasma process gas into the plasma generation volume in a direction substantially perpendicular to the upper surface of the electrode. The gas distribution unit also includes an arrangement of through-holes that each extend through the gas distribution unit to fluidly connect the plasma generation volume to an exhaust region. Each of the through-holes directs an exhaust flow from the plasma generation volume in a direction substantially perpendicular to the upper surface of the electrode. | 2012-02-09 |
| 20120034787 | Defect Etching of Germanium - The present invention provides an etching solution for revealing defects in a germanium layer, a method for revealing defects in a germanium layer using such an etching solution and to a method for making such an etching solution. The etching solution according to embodiments of the present invention is able to exhibit an etch rate of between 4 nm·min | 2012-02-09 |
| 20120034788 | SUBSTRATE PROCESSING APPARATUS AND PRODUCING METHOD OF SEMICONDUCTOR DEVICE - A substrate treatment apparatus includes a reaction tube and a heater heating a silicon wafer. Trimethyl aluminum (TMA) and ozone (O | 2012-02-09 |
| 20120034789 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes: performing modifying a surface of a semiconductor wafer including a silanol group on the surface with an alkylsilyl group; and fluorinating an alkyl group of the alkylsilyl group with which the surface was modified. | 2012-02-09 |
| 20120034790 | METHOD OF PRODUCING SEMICONDUCTOR DEVICE - Disclosed is a producing method of a semiconductor device comprising a first step of supplying a first reactant to a substrate to cause a ligand-exchange reaction between a ligand of the first reactant and a ligand as a reactive site existing on a surface of the substrate, a second step of removing a surplus of the first reactant, a third step of supplying a second reactant to the substrate to cause a ligand-exchange reaction to change the ligand after the exchange in the first step into a reactive site, a fourth step of removing a surplus of the second reactant, and a fifth step of supplying a plasma-excited third reactant to the substrate to cause a ligand-exchange reaction to exchange a ligand which has not been exchange-reacted into the reactive site in the third step into the reactive site, wherein the first to fifth steps are repeated predetermined times. | 2012-02-09 |
| 20120034791 | METHOD OF FLATTENING A RECESS IN A SUBSTRATE AND FABRICATING A SEMICONDUCTOR STRUCTURE - A recess is usually formed on the sidewall of the trench due to the dry etch. The recess may influence the profile of an element formed in the trench. Therefore, a method of flattening a recess in a substrate is provided. The method includes: first, providing a substrate having a trench therein, wherein the trench has a sidewall comprising a recessed section and an unrecessed section. Then, a recessed section oxidation rate change step is performed to change an oxidation rate of the recessed section. Later, an oxidizing process is performed to the substrate so as to form a first oxide layer on the recessed section, and a second oxide layer on the unrecessed section, wherein the second oxide layer is thicker than the first oxide layer. Finally, the first oxide layer and the second oxide layer are removed to form a flattened sidewall of the trench. | 2012-02-09 |
| 20120034792 | COATING TREATMENT METHOD - The present invention supplies a solvent to a front surface of a substrate while rotating the substrate. The substrate is acceleratingly rotated to a first number of rotations, and a resist solution is supplied to a central portion of the substrate during the accelerating rotation and the rotation at a first number of rotations. The substrate is deceleratingly rotated to a second number of rotations, and after the number of rotations of the substrate reaches the second number of rotations, the resist solution is discharged to the substrate. The substrate is then acceleratingly rotated to a third number of rotations higher than the second number of rotations so that the substrate is rotated at the third number of rotations. According to the present invention, consumption of the resist solution can be suppressed and a high in-plane uniformity can be obtained for the film thickness of the resist film. | 2012-02-09 |
| 20120034793 | METHOD FOR FORMING METAL NITRIDE FILM - A wafer serving as a target substrate to be processed is loaded into a chamber, and an inside of the chamber is maintained under a vacuum level. Then, a TiN film is formed on the wafer by alternately supplying TiCl | 2012-02-09 |
| 20120034794 | ENHANCING THE WIDTH OF POLYCRYSTALLINE GRAINS WITH MASK - A system, method and masking arrangement are provided of enhancing the width of polycrystalline grains produced using sequential lateral solidification using a modified mask pattern is disclosed. One exemplary mask pattern employs rows of diamond or circular shaped areas in order to control the width of the grain perpendicular to the direction of primary crystallization. | 2012-02-09 |
| 20120034795 | Electronic Apparatus and Wrong Insertion Prevention Member - According to one embodiment, an electronic apparatus includes: a plurality of jacks, for which an order of priority in plug insertion is set, including a first jack of low priority and a second jack of high priority; and a wrong insertion prevention member, provided on the periphery of jacks, configured to close at least a part of the first jack when no plug is connected to the second jack, and configured to disclose the first jack when a plug is inserted in the second jack. | 2012-02-09 |
| 20120034796 | Systems, Apparatus, and Related Methods for Weather-Proofed Wire Splicings - Disclosed are systems, apparatus and related methods for making weather, fire, or water-proofed wire-to-wire electrical connections. | 2012-02-09 |
| 20120034797 | VEHICLE CONNECTION SYSTEM - A system for connecting an associated motor vehicle to a utility connection which includes a cable for connection to an associated utility connection having first and | 2012-02-09 |
| 20120034798 | HIGH DENSITY COAXIAL SWITCHING JACK - A coaxial switching jack with a pair of coaxial assemblies mounted within a housing having a pair of front openings. The coaxial assemblies each include a center conductor and a shell conductor. The center conductors are connected by a first spring and the shell conductors are connected by a second spring. Insertion of a coaxial cable connector within one of the front openings deflects the springs from the corresponding coaxial assembly and disconnects the center and shell conductors of the two assemblies. The jack may also be configured to provide an electrical connection between the center and shell conductors of the second coaxial assembly if a coaxial cable connector is inserted within the first coaxial assembly. The connection between the center and shell conductors of the second coaxial assembly may allow for selection of a desired electrical impedance. | 2012-02-09 |
| 20120034799 | ELECTRICAL INTERCONNECTS FOR PHOTOVOLTAIC MODULES AND METHODS THEREOF - System and method for interconnecting photovoltaic modules. The system includes a first photovoltaic module and a second photovoltaic module. The first photovoltaic module includes a first bus bar and a first interconnect tab connected to the first bus bar. The second photovoltaic module includes a second bus bar and a second interconnect tab connected to the second bus bar. The system for interconnecting photovoltaic modules additionally includes a module interconnector configured to interconnect the first and the second photovoltaic modules. The module interconnector includes an interconnection component and an interconnection protector. Additionally, the system for interconnecting photovoltaic modules includes a first connection component connecting the interconnection component to the first interconnect tab of the first photovoltaic module and a second connection component connecting the interconnection component to the second interconnect tab of the second photovoltaic module. | 2012-02-09 |
| 20120034800 | Waterproof Electrical Connector and Waterproof Electrical Connector Assembly Method - The invention is directed to a waterproof electrical connector that can prevent detachment of connector parts and enhance waterproofness. The connector includes a main housing, a cover housing, a contact, and a body. The main housing includes a mating protrusion, a fitting section, and a head portion. The contact includes a contacting portion that is received in the fitting section and an electric wire connection portion that connects to one end of an electric wire. The body covers at least a boundary portion between the main housing and the cover housing. The main housing further includes an outer circumferential wall positioned on an outer circumferential side of the boundary portion between the main housing and the cover housing. | 2012-02-09 |
| 20120034801 | ELECTRICAL OUTLET ASSEMBLY AND MANUFACTURING METHOD THEREOF - An electrical outlet assembly includes: a housing having an upper casing and a bottom casing, the upper casing having a plurality of openings, the upper casing and the bottom casing being assembled with each other to form a receiving room; a switch module, having a switch, a surge arrester and a first casing, the switch being electrically connected with the surge arrester; at least one electrical outlet module, having a second casing; a cable set disposed in the receiving room, the cable set being electrically connected with the switch module and the electrical outlet module; wherein the switch module and the electrical outlet module are respectively disposed in the openings, and the switch module and the electrical outlet module are arranged on the housing. | 2012-02-09 |
| 20120034802 | STRUCTURE OF A COMPONENT MOUNTING PORTION, AND FUNCTIONAL UNIT - A mounting portion is configured to mount thereon a first coupler provided with a pair of engagement arms having an elastic force in a width increasing direction. The mounting portion includes a pair of support members. The pair of support members each have a support portion, an inclined portion, a first engagement portion, and a second engagement portion. A spacing between the second engagement portions is larger than a widthwise dimension of the first coupler which is taken on when the engagement arms are displaced into a position at which the widthwise dimension of the first coupler is minimized. A space allowing the first and second couplers in a state of being coupled to each other to be placed therein is provided on a downstream side of the mounting portion in a removing direction. | 2012-02-09 |
| 20120034803 | Locking Connector and Electronic Apparatus - A locking connector includes: a first head part; a plate-like base covering a plate surface of the first head part, a supporting part one end of which is supported by the base; first and second resilient parts positioned along the plate surface of the base from the supporting part, the first and second resilient part being resiliently deformable in a first direction substantially perpendicular to a direction C from the base end of the first head part to the fore-end of the first head part; first and second arm base end parts extending from end of the first and second resilient parts, respectively; first and second arm parts extending from the first and second arm base end parts, respectively, in the direction C; and first and second latching parts which are protrusions provided on the first and second arm parts, respectively. | 2012-02-09 |
| 20120034804 | DUAL DIRECTIONAL LATCH - The present device, system, and method pertain to locking and/or latching mechanisms that utilize canted coil springs and specific groove geometries in connecting parts to achieve locking and/or latching. In specific locking and/or latching embodiments. built in release features are provided to enable unlatching even after being locked, such as by moving in the opposite direction as when moving the connector to lock. Unlatching can implemented by rotating the spring to permit moving in the opposite direction. | 2012-02-09 |
| 20120034805 | CONNECTOR - A housing ( | 2012-02-09 |
| 20120034806 | METHOD AND SYSTEM FOR ATTACHING THE ELECTRICAL WIRES OF FIXTURE OR APPLIANCE THAT HANGS FROM A CEILING OR WALL - An apparatus for easily connecting the wires of a fixture or appliance to the wires carrying the electrical current of a building or structure comprised of a first piece that secures to an outlet box in a ceiling or wall and a second piece that fits over the first piece. The wires carrying the electrical current are affixed to electrical conductors of the first piece. When the second piece, already a part of the fixture or appliance to be installed, is fitted over the first piece, the electric connections are completed and the electrical current travels to the fixture or appliance. | 2012-02-09 |
| 20120034807 | DETACHMENT-PREVENTING PLUG - A detachment-preventing plug for hooking a socket is provided. The detachment-preventing plug comprises a body unit, two conducting pins, a slider member and two resilient hooking members. The body unit has a compartment for receiving the slider member. Each of the resilient hooking members has a protruding portion and an exposing hooking end. Each of the protruding portions protrudes toward the slider member and is engaged with the slider member, and a hooking portion is formed on each of the exposing hooking ends. The two conducting pins have two slots respectively. When the two conducting pins are inserted into the socket, the two resilient hooking members are adapted to pass through the two slots and hook the socket by the two hooking portions, wherein a user could drive the slider to make the two resilient hooking members establish a releasing configuration or a hooking configuration. | 2012-02-09 |
| 20120034808 | DATA PORT CONNECTOR AND HOUSING - Connector receptacles having a reduced height or z-dimension that are capable of accepting standard sized connector inserts. One example provides a connector having a reduction in the amount of height consumed by the deflection of a number of fingers. Specifically, the amount of deflection is reduced by eliminating one or more of these fingers on one or both sides of the connector receptacle. Instead of fingers, bumps may be used. These bumps fit into the connector insert cutouts or slots when the connector insert is fully inserted in the connector receptacle. Another example uses a rail, which may be referred to as speed rail. This speed rail can be formed along the seam of connector receptacle. The speed rail can run either a portion or the entire depth of the connector receptacle. | 2012-02-09 |
| 20120034809 | ELECTRICAL PLUG-IN CONNECTOR AND ELECTRICAL PLUG-IN CONNECTION - An electrical connector for detachable connection of a multi-core cable to a mating connector with a grip body which surrounds the cable and the cable cores, a contact carrier which holds a plurality of contact elements and a pivotally arranged sleeve-shaped threaded part. The individual contact elements are connected electrically conductively to the individual cores and the sleeve-shaped threaded part can be screwed to a corresponding sleeve-shaped threaded part of the mating connector. The connector contact elements mounted in corresponding open grooves of the contact carrier which run parallel to its longitudinal axis, and a side of the contact carrier facing the mating connector, bordering the grooves, has through holes corresponding to the number of grooves, through which holes the ends of the contact elements that face away from the cores project in the longitudinal direction of the contact elements, being inserted obliquely and pivoted in to a parallel orientation. | 2012-02-09 |
| 20120034810 | ELECTRIC CONNECTOR - An electric connector is described which provides direct contact between an electric conductor and a respective counterpart. The connection is locked in place by means of one or more spring clips, for example associated with a casing. In a variant a single common casing is provided for the direct connection between a plurality of electric conductors and respective counterparts, which may be contact elements which are also associated with respective electric conductors or bump contacts of a PCB. In a further variant the counterpart is also an electric conductor, in such a way that direct contact is produced between two electric conductors held in mutual engagement by one or more spring clips. | 2012-02-09 |
| 20120034811 | DEVICE FOR SECURING A CONNECTOR - In order to secure connectors, particularly USB connectors, in a module housing of a modular connector, the invention proposes to arrange locating springs in the connecting region of the module housing, wherein said locating springs are aligned in the connecting direction and secure the connector inserted therebetween. | 2012-02-09 |
| 20120034812 | LEVER TYPE CONNECTOR - A lever in a lever type connector which is attached to a first housing, is rotated to fit the first housing to a second housing, and has a pair of side walls and an operation potion connecting the side walls. Locking arms are provided on the side walls so as to project toward an opening of the first housing into which the second housing is fitted. Temporary locking releasing portions are provided in the first housing. The locking arms are deformed into a state that a part of each of the locking arms is disposed on each of the temporary locking releasing portions, so that the lever is elastically deformed, when the lever is rotated. Each of the temporary locking releasing portions has an inclined face on which each of the locking arms is moved in a direction which the lever is elastically restored after the locking arms are deformed by the temporary locking releasing portions. | 2012-02-09 |
| 20120034813 | APPARATUS FOR REPAIRING WIRING - A crimp for joining copper wires in a telecommunications exchange, the crimp including a cylindrical wall of material comprising an alloy containing copper, iron, nickel, and manganese, and in an embodiment having a composition conforming to BS CN102. | 2012-02-09 |
| 20120034814 | RECEPTACLE CONNECTOR - A receptacle connector includes a housing and a cage. The housing comprises a base and two arms that extend integrally from the two sides of the base. A tongue extends from the base. Terminals are mounted on the tongue. The cage includes a deflector and is assembled to the housing so as to form a socket. One arm includes a light channel and the deflector extends into the light channel. The light channel has a light inlet and a light outlet that form an intersection angle and that are in communication with each other and an exit. In operation, light enters the light inlet, is reflected off the deflector and is directed toward the exit. | 2012-02-09 |
| 20120034815 | CONNECTOR - A connector is provided in which the number of components required for connecting operation can be reduced, and the manufacturing cost and weight thereof can be reduced. A connector housing | 2012-02-09 |
| 20120034816 | VEHICULAR RETRACTABLE CABLE SYSTEMS - A vehicular retractable cable system may include a housing and a cable assembly including a retract assembly with associated retractable cable. The cable has extended and retracted positions. A position setting assembly is associated with the cable assembly. The position setting assembly has a retract button, wherein when the cable is in an extended position and upon activation of the retract button, the cable moves toward the retracted position. | 2012-02-09 |
| 20120034817 | Shielded Plug-In Connector Arrangement - A cable assembly includes a coaxial cable and a plug-and-socket (plug-in) connector part. The connector part has a sleeve, a sleeve contact, and a shielding module. The sleeve is connected to the outer conductor of the cable at a free end section of the cable and the sleeve contact is connected to the inner conductor of the cable. The shielding module includes a shielding plate and a chamber insert. The chamber insert is inserted into the shielding plate and receives the sleeve contact. The shielding module is connected to the sleeve such that the sleeve and the shielding plate surround the sleeve contact with the sleeve contact enclosed by the chamber insert up to a side of the sleeve contact intended for connecting along a direction of insertion with a contact pin of a mating plug-in connector. | 2012-02-09 |
| 20120034818 | THIN CARD CONNECTOR ADAPTED FOR THIN CARD - A thin card connector ( | 2012-02-09 |
| 20120034819 | Micro Universal Serial Bus Adapter - A micro universal serial bus adapter to enable a micro universal serial bus connector to be connected to an Apple proprietary connector. The micro universal serial bus adapter comprises of an adapter that has a male proprietary connector at one end to connect to a female Apple proprietary connector and a female micro universal serial bus connector at the other end to connect to a standard male micro universal serial bus plug. | 2012-02-09 |
| 20120034820 | VERTICAL CONNECTOR FOR A PRINTED CIRCUIT BOARD - An connector assembly is provided that may be utilized for vertical applications on a circuit board. The assembly includes a housing that supports a plurality of wafers that in tern support a plurality of terminals. The housing includes a base and a nose and can have two slots in the nose and the terminals extend to both slots. A guide frame can be positioned on the housing to help support the housing. The terminals can be arranged in a row on both sides of the two slots. The tails of the terminals can be configured with respect to the slots so as to provide desirable performance. | 2012-02-09 |
| 20120034821 | AC ADAPTER - There is provided an AC adapter to which an external connection cable is detachable and which can easily preventing intrusion of foreign substances from an external connection connector while the cable is detached and the AC adapter is not in use. The AC adapter including a rotatable AC plug part and having a recess part configured to store the AC plug part while the AC adapter is not in use, and an insertion port of the external connection connector is arranged so as to oppose the recess part. Accordingly, the insertion port of the external connection connector is covered with the AC plug part. Therefore, it is possible to prevent intrusion of foreign substances into the external connection connector. | 2012-02-09 |
| 20120034822 | ELECTRICAL CONNECTORS AND PRINTED CIRCUITS HAVING BROADSIDE-COUPLING REGIONS - An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals. The input and output terminals being configured to communicatively coupled to mating and cable conductors, respectively. Each associated pair of input and output terminals is electrically connected through a corresponding signal trace that has a conductive path extending along the board substrate between the corresponding input and output terminals. At least two signal traces form a broadside-coupling region in which the conductive paths of the at least two signal traces are stacked along the orientation axis and spaced apart through the thickness and extend parallel to each other for a crosstalk-reducing distance. | 2012-02-09 |
| 20120034823 | ELECTRICAL CONNECTOR WITH IMPROVED PEDESTAL FOR MOUNTING A FUSIBLE ELEMENT AND METHOD FOR MAKING THE SAME - An electrical connector includes an insulative housing, at lease one contact mounted to the insulative housing and a fusible element mounted to the contact. The contact includes a body portion and a mounting portion extending from the body portion. The mounting portion includes a support portion and first and second tails bent from the support portion along opposite directions in order to form a discrete receiving slot. The first and the second tails are substantially perpendicular to the body portion. The fusible element is received in the receiving slot and is in line with the body portion of the contact for reliable fixation. | 2012-02-09 |
| 20120034824 | PUSH-TYPE CONNECTOR - Provided is a push-type connector having a structure for preventing an operational error of a lever member of the connector by an operator. A first operating part | 2012-02-09 |
| 20120034825 | CONNECTION TERMINAL FOR HIGH-VOLTAGE CABLE - The present invention discloses a connection terminal of a high-voltage cable comprising a connector; a cable having a conductive core and an insulating layer surrounding the conductive core, with the conductive core being coupled to a free end of the connector; a first plastic layer surrounding at least a part of the free end of the connector and at least a part of the insulating layer; and a second plastic layer surrounding at least a part of the first plastic layer and at least a part of the free end of the connector. | 2012-02-09 |
| 20120034826 | TERMINAL FITTING - A terminal fitting ( | 2012-02-09 |
| 20120034827 | TERMINAL FITTING - A rectangular tubular terminal connecting portion ( | 2012-02-09 |
| 20120034828 | OUTBOARD MOTORS AND METHODS OF MAKING THE SAME - Lightweight and versatile outboard motors and methods for manufacturing the same from existing motorized lawn implements and lawn implement parts. The outboards consisting essentially of a motor for driving a propeller, an elongate housing creating the body of the outboard, a drive shaft disposed within the elongate housing, and a propeller. The methods involving attaching the motor to the elongate housing and the drive shaft and mounting the propeller to a second end of the elongate housing and drive shaft. | 2012-02-09 |
| 20120034829 | MARINE ENGINE LUBRICATION - Trunk piston marine engine lubrication, when the engine is fueled by heavy fuel oil, is effected by a composition comprising a major amount of an oil of lubricating viscosity containing at least 50 mass % of a Group II basestock, and respective minor amounts of an overbased metal hydrocarbyl-substituted hydroxybenzoate detergent other than such a detergent having a basicity index of less than two and a degree of carbonation of 80% or greater and 5 to 500 mass %, based on the mass of the detergent, of an oil-soluble alkyl-substituted phenol other than a hindered phenol. Asphaltene precipitation in the lubricant, caused by the presence of contaminant heavy fuel oil, is prevented or inhibited. | 2012-02-09 |
| 20120034830 | TECHNIQUES TO DISCHARGE STATIC ELECTRICITY IN WATER SLIDERS - The present invention provides a water slider that features an electrically insulative body extending along a longitudinal axis and having opposed surfaces with a perimeter edge extending therebetween. An electrical conductor is positioned upon one of the surfaces; and a discharge connector is in electrical communication with the electrical conductor and disposed upon said perimeter edge. The electrical conductor may be one or more of a plurality of configurations. | 2012-02-09 |
| 20120034831 | PERSONAL WATER SAFETY DEVICE - A personal water safety device comprising a strap and a housing secured to the strap. The housing releasably encloses a bladder and an inflation assembly. The bladder completely encloses the inflation assembly. The inflation assembly includes a gas container that provides gas to the bladder to inflate the bladder upon the selective deployment of gas from the gas container. The strap keeps the bladder secured to a user's appendage before and after inflation of the bladder. | 2012-02-09 |
| 20120034832 | LAYERED ART MATERIAL WITH SILK - A layered material including a working surface layer bonded to a material layer wherein the working surface layer is at least partially composed of silk. | 2012-02-09 |
| 20120034833 | COMPOSITE COMPONENTS AND HEAT-CURING RESINS AND ELASTOMERS - A plastic composite component which is formed by a thin hard plastic outer layer, at least one elastomer layer adjoining the former on the inside, and at least one metal and/or plastic carrier layer adjoining said elastomer layer on the inside and made of a fibre reinforced plastic (FRP). A carbon fibre reinforced plastic (CRP) or glass fibre reinforced plastic (GRP), is arranged on the component or at least partly forms the latter, as an impact protection part, as a splinter protection part, as a protective part against sudden total failure or as a protective part against vibrations and vibration damage, against resonance, for the purpose of damping oscillations or for the purpose of acoustic damping. | 2012-02-09 |
| 20120034834 | FUSIBLE BICOMPONENT SPANDEX - Included are multiple component elastic fibers prepared by a solution-spinning process such as dry spinning or wet spinner of spandex fibers including polyurethaneurea and polyurethane compositions. These fibers have a cross-section including at least two separate regions with definable boundaries wherein at least one region defined by the boundaries of the cross-section includes a polyurethaneurea or polyurethane composition. One region of the fiber includes a fusibility improvement additive to enhance adhesion to itself or to a substrate. | 2012-02-09 |
| 20120034835 | TEXTILE FABRIC FOR THE OUTER SHELL OF A FIREFIGHTER'S GARMENT - The present invention is directed to a textile fabric. This fabric is particularly well suited for use as the outer shell fabric of a firefighter's garment. The fabric is a woven or knitted fabric of spun yarns and multi-filament yarns. The spun yarn includes a first staple being a polymer selected from the group consisting of aramid, PBI or PBO or melamine formaldehyde, and a second staple being an aramid polymer. The multi-filament yarn includes an aramid filament. | 2012-02-09 |
| 20120034836 | LIGHTWEIGHT PLASTERBOARD AND PLASTER SLURRY COMPOSITION USED FOR ITS MANUFACTURE - A plaster slurry composition includes plaster, water and starch, the starch having a Brookfield viscosity of less than 60 cps at a temperature below 60° C. and a Brookfield viscosity greater than 10,000 cps at a temperature of 70° C. | 2012-02-09 |
| 20120034837 | BREATHABLE LAMINATE AND METHOD OF MAKING SAME - A breathable laminate has a liquid-resistant backing film layer having varied vapor permeability that includes breathable thinned localized regions and thicker non-breathable regions, wherein the film layer is co-extensively directly joined with a liquid- and vapor-permeable nonwoven fabric. The breathable laminate can have unidirectional air permeability. The present invention also relates to disposable apparel and absorbent products which incorporate the breathable laminate, and methods of making the breathable laminate. | 2012-02-09 |
| 20120034838 | Polymeric Blends for Fiber Applications and Methods of Making the Same - Processes of forming a fiber article and articles formed therefrom are described herein. The processes generally include providing a propylene-based polymer; contacting the propylene-based polymer with polylactic acid in the presence of a reactive modifier, a non-reactive modifier or a combination thereof to form a polymeric blend, wherein the reactive modifier is selected from epoxy-functionalized polyolefins and the non-reactive modifier comprises an elastomer; and forming the polymeric blend into a fiber article. | 2012-02-09 |
| 20120034839 | CONSTRUCTION TOY SYSTEM WITH UNIVERSAL HUB - A connector element for a space structure of a type utilizing a plurality of struts. The connector element includes first and second subparts, at least one strut receiving element having a strut receiving socket emanating from each of the subparts, the subparts being rotatable with respect to one another along a common axis. | 2012-02-09 |
| 20120034840 | Three dimensional toy bath tub city - A portable, lightweight, water-resistant, multi-colored toy for placement in a bathtub, either supernatant or stationary, and which can be used with small toy cars of various models includes a base member having a multi-storied superstructure on which toy cars are placed with the base member having pivotal flip-down and flip-up legs for supporting the toy in the bathtub and the legs having suction cup for adhering to the bathtub bottom and one of the floors—the top floor—including a car wash, a gas station and a convenience store with water for the car wash being provided by a conduit that extends from the water up to the car wash and the upper side of the base member including an island and a boat ramp extending to the water. | 2012-02-09 |
| 20120034841 | System for adjusting the fit of a bra to a wearer's bosom - A system for adjusting the fit of a bra includes a bra having cups, a bridge therebetween, and an underwire channel sewn beneath each cup. The underwire residing in each channel is bendable along at least one axis, can be lengthened, and is capable of retaining its adjusted shape after being adjusted. | 2012-02-09 |
| 20120034842 | BRA POUCH FOR CELL PHONE STORAGE - Storage pouch devices for use with a woman's bra. The storage pouch includes a front panel, a rear panel, and a cavity defined between the front and rear panels. The internal cavity is bounded by portions of the outer perimeters of both the front and rear panels that are attached together. The storage pouch is advantageously shaped and sized so as to be substantially or entirely concealable beneath one of a user's bra cups. The pouch further includes means attached to at least one of the panels (e.g., the front panel) for engaging a bra strap or bra cup so as to secure the storage pouch to a woman's bra strap or cup. The attachment means is specifically configured so that inconspicuous engagement and disengagement (and removal) of the storage pouch is possible by simply sliding the bra strap or cup into or out of engagement with the attachment means. | 2012-02-09 |
| 20120034843 | CLOTHES HAVING A WAIST PORTION - An object of the present invention is to provide clothes that are capable of adjusting the body shape with wearing of the clothes without a strong pressing force to the abdomen and further modifying the body shape itself gradually. The clothes has a waist provided with a body front side fabric consisting of a single ply piece of waist front side fabric and a single ply piece of abdomen fabric and a body back side fabric consisting of a single ply piece of waist back side fabric and a single ply piece of lower back fabric, including a function in which the horizontal contraction distance of the body front side fabric is longer than that of the body back side fabric, with wearing of the clothes. | 2012-02-09 |
| 20120034844 | SPECTROGRAPHIC MONITORING USING INDEX TRACKING AFTER DETECTION OF LAYER CLEARING - A method of controlling polishing includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, polishing a substrate having a second layer overlying a first layer, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, detecting exposure of the first layer, fitting a function to a portion of the sequence of index values corresponding to spectra measured after detection of exposure of the first layer, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function. | 2012-02-09 |
| 20120034845 | TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING - A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum. | 2012-02-09 |
| 20120034846 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - According to one embodiment, a semiconductor device manufacturing method is disclosed. The method can include polishing a film on a semiconductor substrate by pressing the film against a polishing pad. Polishing the film comprises performing first polishing in which an entrance temperature of the polishing pad is adjusted to 40° C. (inclusive) to 50° C. (inclusive), and an exit temperature of the polishing pad is adjusted to be higher by 5° C. or more than the entrance temperature. Polishing the film comprises performing second polishing in which the entrance temperature is adjusted to 30° C. or less, and the exit temperature is adjusted to be higher by 5° C. or more than the entrance temperature. | 2012-02-09 |
| 20120034847 | ABRASIVE TOOL AND A METHOD FOR FINISHING COMPLEX SHAPES IN WORKPIECES - An abrasive tool includes a bonded abrasive body having abrasive grains contained within a bonding material, wherein the bonded abrasive body comprises a complex shape having a form depth (FD) of at least about 0.3. The form depth is described by the equation [(Rl−Rs)/Rl], wherein Rs is a smallest radius (Rs) at a point along the longitudinal axis of the bonded abrasive body and Rl is a largest radius (Rl) at a point along the longitudinal axis of the bonded abrasive body. The abrasive tool can be used to finish complex shapes in workpieces. | 2012-02-09 |
| 20120034848 | SUBSTRATE EDGE TUNING WITH RETAINING RING - A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. | 2012-02-09 |
| 20120034849 | CARRIER HEAD WITH NARROW INNER RING AND WIDE OUTER RING - A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width. | 2012-02-09 |
| 20120034850 | METHOD FOR PRODUCING SILICON EPITAXIAL WAFER - The method for producing a silicon epitaxial wafer according to the present invention has: a growth step F at which an epitaxial layer is grown on a silicon single crystal substrate; a first polishing step D at which, before the growth step, at least a front surface of the silicon single crystal substrate is polished without using abrasive grains; and a second polishing step G at which at least the front surface of the silicon single crystal substrate is subjected to finish polishing after the growth step. | 2012-02-09 |
| 20120034851 | Easy Rinsing Polishing Composition For Polymer-Based Surfaces - A polishing composition and method for polishing polymer-based surfaces that can be rinsed from the polished polymer-based surface using water so as to leave substantially less polishing residue behind as compared to conventional polishing compositions. Polishing compositions according to the invention include abrasive particles and a rinsing agent dispersed in water. Polishing compositions according to the invention can be used to polish all types of polymer-based surfaces including, for example, organic polymer-based ophthalmic substrates and clear-coat automotive finishes. | 2012-02-09 |
| 20120034852 | MULTI-PURPOSE MACHINE FOR WALL PROCESSING - A multi-purpose machine for wall processing includes a base, a working member and a sliding device that drives the working member slide up and down relative to the base. The base includes a bottom board with moving wheels therebelow, a top board, and several parallel upright posts therebetween. The working member includes a cover and a roller set inside the cover. A built-in motor is set inside the roller. Wall processing tools are releasably fixed on the outside of the roller. A feeding hole is provided on the upper part of the cover and connected with a supply system or an absorbing system. The multi-purpose machine may perform operations including putty scraping, grinding and polishing, painting, cleaning and wall paper removing on the wall to replace human labour, thus realizing multiple purposes, reducing the labour strength, and improving the working efficiency. | 2012-02-09 |
| 20120034853 | METHOD, SYSTEM, AND APPARATUS FOR MODIFYING SURFACES - The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management. | 2012-02-09 |
| 20120034854 | THUMB-OPERATED DETACHABLE LIQUID POLISH DISPENSER FOR A HAND-HELD SURFACE FINISHING POWER TOOL - An elongated liquid polish dispenser is described that can be secured to and released from a bracket that stays on a hand-held rotary buffer such that a switch on the polisher is in a convenient position for an operator to press while gripping the polisher. A portion of the dispenser can be inserted through a hole in the bracket, and the entire dispenser can be rotated so that tabs securely attach the dispenser to the bracket and tool. The switch activates an electric pump which pumps liquid polish through a nozzle and onto a work surface. | 2012-02-09 |
| 20120034855 | Hand-held power tool system - A hand-held power tool system has a hand-held power tool, a guard unit, and a guard anti-rotation lock unit preventing rotation between the guard unit and the hand-held power tool during breakdown of a tool of the hand-held power tool and configured to prevent rotation between the guard unit and the hand-held power tool at a same time as the guard unit is being attached to the hand-held power unit when the guard unit is in a working position, the guard anti-rotation lock unit is at least partially located on a closing unit which includes a clamping band and a pivotable lever, and the anti-rotation lock unit includes at least one anti-rotation lock element provided on the lever. | 2012-02-09 |
| 20120034856 | DUST BOX AND ELECTRIC TOOL WITH THE DUST BOX - A dust box includes: an attachment portion configured to be attached to a dust-discharging nozzle extending from a housing of an electric tool; and a dust-collecting portion connected to the attachment portion and configured to store dust particles to be discharged from the nozzle. The dust-collecting portion mainly consists of a box which is made of synthetic resin and configured to be detachably connected to the attachment portion, and a paper bag received in the box and configured to store the dust particles to be discharged from the nozzle | 2012-02-09 |
