06th week of 2019 patent applcation highlights part 61 |
Patent application number | Title | Published |
20190043782 | CONFIGURABLE WICKLESS CAPILLARY-DRIVEN CONSTRAINED VAPOR BUBBLE (CVB) HEAT PIPE STRUCTURES | 2019-02-07 |
20190043783 | HEAT TRANSFER DEVICE WITH FINS DEFINING AIR FLOW CHANNELS | 2019-02-07 |
20190043784 | Series Circuit Arrangement of Power Semiconductors | 2019-02-07 |
20190043785 | COOLANT CONTACT TYPE COOLING SYSTEM FOR HIGH-POWER DEVICE AND OPERATION METHOD THEREOF | 2019-02-07 |
20190043786 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS | 2019-02-07 |
20190043787 | METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC COMPONENT | 2019-02-07 |
20190043788 | SEMICONDUCTOR DEVICE | 2019-02-07 |
20190043789 | FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLICATIONS | 2019-02-07 |
20190043790 | MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES | 2019-02-07 |
20190043791 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-02-07 |
20190043792 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | 2019-02-07 |
20190043793 | SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN EXTENDED SUBSTRATE AND A BOTTOM SUBSTRATE | 2019-02-07 |
20190043794 | ELECTRONICS PACKAGE INCLUDING INTEGRATED STRUCTURE WITH BACKSIDE FUNCTIONALITY AND METHOD OF MANUFACTURING THEREOF | 2019-02-07 |
20190043795 | METHOD FOR FORMING A HOMOGENEOUS BOTTOM ELECTRODE VIA (BEVA) TOP SURFACE FOR MEMORY | 2019-02-07 |
20190043796 | PACKED INTERCONNECT STRUCTURE WITH REDUCED CROSS COUPLED NOISE | 2019-02-07 |
20190043797 | CAVITY WALL STRUCTURE FOR SEMICONDUCTOR PACKAGING | 2019-02-07 |
20190043798 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | 2019-02-07 |
20190043799 | PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF | 2019-02-07 |
20190043800 | SEMICONDUCTOR PACKAGE HAVING A VARIABLE REDISTRIBUTION LAYER THICKNESS | 2019-02-07 |
20190043801 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME | 2019-02-07 |
20190043802 | METHOD OF MANUFACTURING AN ELECTRONICS PACKAGE USING DEVICE-LAST OR DEVICE-ALMOST LAST PLACEMENT | 2019-02-07 |
20190043803 | SEMICONDUCTOR DEVICE | 2019-02-07 |
20190043804 | SEMICONDUCTOR DEVICES | 2019-02-07 |
20190043805 | Etch Stop Layer in Integrated Circuits | 2019-02-07 |
20190043806 | METHOD OF MANUFACTURING CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR | 2019-02-07 |
20190043807 | METAL-NITRIDE-FREE VIA IN STACKED MEMORY | 2019-02-07 |
20190043808 | INTERPOSER FOR AN INTEGRATED SYSTEM AND CORRESPONDING DESIGN METHOD | 2019-02-07 |
20190043809 | METHODS OF FORMING AN ULTRA-LOW-K DIELECTRIC LAYER AND DIELECTRIC LAYERS FORMED THEREBY | 2019-02-07 |
20190043810 | ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFERENCE SHIELD AND METHOD OF MANUFACTURING THEREOF | 2019-02-07 |
20190043811 | SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY | 2019-02-07 |
20190043812 | INTERCHIP BACKSIDE CONNECTION | 2019-02-07 |
20190043813 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | 2019-02-07 |
20190043814 | METHOD FOR DETECTING THINNING OF THE SUBSTRATE OF AN INTEGRATED CIRCUIT FROM ITS BACK SIDE, AND ASSOCIATED INTEGRATED CIRCUIT | 2019-02-07 |
20190043815 | Body-Mountable Device with a Common Substrate for Electronics and Battery | 2019-02-07 |
20190043816 | HIGH-DENSITY TRIPLE DIAMOND STRIPLINE INTERCONNECTS | 2019-02-07 |
20190043817 | LAND GRID BASED MULTI SIZE PAD PACKAGE | 2019-02-07 |
20190043818 | Semiconductor chip and method of processing a semiconductor chip | 2019-02-07 |
20190043819 | ELECTRONIC PACKAGE HAVING REDISTRIBUTION STRUCTURE | 2019-02-07 |
20190043820 | POWER ELECTRONICS ASSEMBLY HAVING AN ADHESION LAYER, AND METHOD FOR PRODUCING SAID ASSEMBLY | 2019-02-07 |
20190043821 | Fabrication Process and Structure of Fine Pitch Traces for a Solid State Diffusion Bond on Flip Chip Interconnect | 2019-02-07 |
20190043822 | QUBIT DIE ATTACHMENT USING PREFORMS | 2019-02-07 |
20190043823 | NEGATIVE FILLET FOR MOUNTING AN INTEGRATED DEVICE DIE TO A CARRIER | 2019-02-07 |
20190043824 | Thermal Bonding Sheet, Thermal Bonding Sheet with Dicing Tape, Bonded Body Production Method, and Power Semiconductor Device | 2019-02-07 |
20190043825 | SEMICONDUCTOR DEVICE | 2019-02-07 |
20190043826 | SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD | 2019-02-07 |
20190043827 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME | 2019-02-07 |
20190043828 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING WLCSP | 2019-02-07 |
20190043829 | SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH | 2019-02-07 |
20190043830 | THREE-DIMENSIONAL MEMORY DEVICE EMPLOYING DIRECT SOURCE CONTACT AND HOLE CURRENT DETECTION AND METHOD OF MAKING THE SAME | 2019-02-07 |
20190043831 | SEMICONDUCTOR DEVICE PACKAGE | 2019-02-07 |
20190043832 | THREE DIMENSIONAL CHIP STRUCTURE IMPLEMENTING MACHINE TRAINED NETWORK | 2019-02-07 |
20190043833 | SEMICONDUCTOR PACKAGES INCLUDING A PLURALITY OF STACKED DIES | 2019-02-07 |
20190043834 | SEMICONDUCTOR PACKAGES HAVING INDICATION PATTERNS | 2019-02-07 |
20190043835 | CONNECTION SYSTEM OF SEMICONDUCTOR PACKAGES | 2019-02-07 |
20190043836 | THREE-DIMENSIONAL (3D) MEMORY WITH SHARED CONTROL CIRCUITRY USING WAFER-TO-WAFER BONDING | 2019-02-07 |
20190043837 | RADIO FREQUENCY SYSTEM-IN-PACKAGE WITH STACKED CLOCKING CRYSTAL | 2019-02-07 |
20190043838 | FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION ELEMENTS FREE OF SOLDER MASK | 2019-02-07 |
20190043839 | SEMICONDUCTOR CHIP FOR SENSING TEMPERATURE AND SEMICONDUCTOR SYSTEM INCLUDING THE SAME | 2019-02-07 |
20190043840 | STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUBSTRATE EXTENSIONS | 2019-02-07 |
20190043841 | SEMICONDUCTOR CHIP INCLUDING A PLURALITY OF PADS | 2019-02-07 |
20190043842 | BI-DIRECTIONAL OPTICAL MODULE AND TRANSPARENT DISPLAY APPARATUS USING THE SAME | 2019-02-07 |
20190043843 | METHODS FOR MANUFACTURING A DISPLAY DEVICE | 2019-02-07 |
20190043844 | MICRO LIGHT EMITTING DIODE DISPLAY PANEL | 2019-02-07 |
20190043845 | DISPLAY MODULE AND SYSTEM APPLICATIONS | 2019-02-07 |
20190043846 | A PACKAGING DEVICE FOR INTEGRATED POWER SUPPLY SYSTEM AND PACKAGING METHOD THEREOF | 2019-02-07 |
20190043847 | CONNECTION SYSTEM OF SEMICONDUCTOR PACKAGES | 2019-02-07 |
20190043848 | SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME | 2019-02-07 |
20190043849 | SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2019-02-07 |
20190043850 | DESIGN FOR MANUFACTURABILITY (DFM) CELLS IN EXTREME ULTRA VIOLET (EUV) TECHNOLOGY | 2019-02-07 |
20190043851 | SEMICONDUCTOR DEVICE | 2019-02-07 |
20190043852 | MONOLITHICALLY INTEGRATED SEMICONDUCTOR SWITCH, IN PARTICULAR A POWER CIRCUIT BREAKER | 2019-02-07 |
20190043853 | SEMICONDUCTOR DEVICE | 2019-02-07 |
20190043854 | ESD DEVICE WITH FAST RESPONSE AND HIGH TRANSIENT CURRENT | 2019-02-07 |
20190043855 | LINEARITY AND LATERAL ISOLATION IN A BiCMOS PROCESS THROUGH COUNTER-DOPING OF EPITAXIAL SILICON REGION | 2019-02-07 |
20190043856 | ISOLATION STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING SELF-BIASING BURIED LAYER AND METHOD THEREFOR | 2019-02-07 |
20190043857 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | 2019-02-07 |
20190043858 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2019-02-07 |
20190043859 | POWER TRANSISTOR DEVICE | 2019-02-07 |
20190043860 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2019-02-07 |
20190043861 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2019-02-07 |
20190043862 | HETEROGENEOUSLY INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-02-07 |
20190043863 | SEMICONDUCTOR DEVICE HAVING THYRISTOR AND METAL-OXIDE SEMICONDUCTOR TRANSISTOR | 2019-02-07 |
20190043864 | DYNAMIC RANDOM ACCESS MEMORY AND METHOD OF FABRICATING THE SAME | 2019-02-07 |
20190043865 | SEMICONDUCTOR STRUCTURE WITH CAPACITOR LANDING PAD AND METHOD OF MAKE THE SAME | 2019-02-07 |
20190043866 | METHOD FOR FORMING SEMICONDUCTOR INTEGRATED CIRCUIT STRUCTURE | 2019-02-07 |
20190043867 | STATIC RANDOM ACCESS MEMORY AND FABRICATION METHODS THEREOF | 2019-02-07 |
20190043868 | THREE-DIMENSIONAL (3D) MEMORY WITH CONTROL CIRCUITRY AND ARRAY IN SEPARATELY PROCESSED AND BONDED WAFERS | 2019-02-07 |
20190043869 | METHOD FOR PRODUCING PILLAR-SHAPED SEMICONDUCTOR MEMORY DEVICE | 2019-02-07 |
20190043870 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING | 2019-02-07 |
20190043871 | FLASH MEMORY CELLS | 2019-02-07 |
20190043872 | SEMICONDUCTOR MEMORY DEVICE OF THREE-DIMENSIONAL STRUCTURE | 2019-02-07 |
20190043873 | MEMORY DEVICE WITH VERTICAL STRING DRIVERS | 2019-02-07 |
20190043874 | WORDLINE BRIDGE IN A 3D MEMORY ARRAY | 2019-02-07 |
20190043875 | FLASH MEMORY COMPONENTS AND METHODS | 2019-02-07 |
20190043876 | SELECTIVE DEPOSITION OF SiN ON HORIZONTAL SURFACES | 2019-02-07 |
20190043877 | NON-VOLATILE MEMORY DEVICE WITH REDUCED DISTANCE BETWEEN CONTROL GATE ELECTRODE AND SELECTING GATE ELECTRODE AND MANUFACTURING METHOD THEREOF | 2019-02-07 |
20190043878 | METHOD TO FABRICATE UNIFORM TUNNELING DIELECTRIC OF EMBEDDED FLASH MEMORY CELL | 2019-02-07 |
20190043879 | THROUGH ARRAY CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE | 2019-02-07 |
20190043880 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | 2019-02-07 |
20190043881 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES INCLUDING VERTICAL STRUCTURES WITH VARIED SPACING AND METHODS OF FORMING THE SAME | 2019-02-07 |