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06th week of 2014 patent applcation highlights part 51
Patent application numberTitlePublished
20140038397MANUFACTURING METHOD OF SILICON CARBIDE SEMICONDUCTOR DEVICE - A silicon oxide film is formed on an epitaxial layer by dry thermal oxidation, an ohmic electrode is formed on a back surface of a SiC substrate, an ohmic junction is formed between the ohmic electrode and the back surface of the SiC substrate by annealing the SiC substrate, the silicon oxide film is removed, and a Schottky electrode is formed on the epitaxial layer. Then, a sintering treatment is performed to form a Schottky junction between the Schottky electrode and the epitaxial layer.2014-02-06
20140038398SUBSTRATE TREATING METHODS AND APPARATUSES EMPLOYING THE SAME - In a method of treating a substrate according to the inventive concept, the substrate is treated using a buffer solution including carbon dioxide (CO2014-02-06
20140038399METHOD FOR FABRICATING AN APERTURE - A method for fabricating an aperture is disclosed. The method includes the steps of: forming a hard mask containing carbon on a surface of a semiconductor substrate; and using a non-oxygen element containing gas to perform a first etching process for forming a first aperture in the hard mask. Before forming the hard mask, a gate which includes a contact etch stop layer and a dielectric layer is formed on the semiconductor substrate.2014-02-06
201400384003D SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SAME - A three dimensional (3D) semiconductor device includes; a vertical channel extending from a lower end proximate a substrate to an upper end and connecting a plurality of memory cells, and a cell array comprising the plurality of cells, wherein the cell array is arranged in a gate stack of layers having a stair-stepped structure disposed on the substrate. The gate stack includes a lower layer including a lower select line coupled to a lower non-memory transistor proximate the lower end, upper layers including conductive lines respectively coupled to an upper non-memory transistor proximate the upper end and connected as a single conductive piece to form an upper select line, and intermediate layers respectively including a word line and coupled to a cell transistor, wherein the intermediate layers are disposed between the lower select line and the upper select line.2014-02-06
20140038401RUTHENIUM FOR A DIELECTRIC CONTAINING A LANTHANIDE - A gate containing ruthenium for a dielectric having an oxide containing a lanthanide and a method of fabricating such a combination gate and dielectric produce a reliable structure for use in a variety of electronic devices. A ruthenium or a conductive ruthenium oxide gate may be formed on a lanthanide oxide. A ruthenium-based gate on a lanthanide oxide provides a gate structure that can effectively prevent a reaction between the gate and the lanthanide oxide.2014-02-06
20140038402DUAL WORK FUNCTION FINFET STRUCTURES AND METHODS FOR FABRICATING THE SAME - A method for fabricating a dual-workfunction FinFET structure includes depositing a first workfunction material in a layer in a plurality of trenches of the FinFET structure, depositing a low-resistance material layer over the first workfunction material layer, and etching the low-resistance material layer and the first workfunction material layer from a portion of the FinFET structure. The method further includes depositing a second workfunction material in a layer in a plurality of trenches of the portion and depositing a stress material layer over the second workfunction material layer.2014-02-06
20140038403HIGH-K TRANSISTORS WITH LOW THRESHOLD VOLTAGE - An apparatus includes a wafer annealing tool and a plurality of electrodes coupled to the wafer annealing tool, wherein the electrodes are configured to be in physical contact with a wafer so that, when the wafer is annealed, a negative electrical bias is formed across one or more gate stacks of the wafer.2014-02-06
20140038404Flash Memory Utilizing a High-K Metal Gate - According to one exemplary embodiment, a method for fabricating a flash memory cell in a semiconductor die includes forming a control gate stack overlying a floating gate stack in a memory region of a substrate, where the floating gate stack includes a floating gate overlying a portion of a dielectric one layer. The floating gate includes a portion of a metal one layer and the dielectric o one layer includes a first high-k dielectric material. The control gate stack can include a control gate including a portion of a metal two layer, where the metal one layer can include a different metal than the metal two layer.2014-02-06
20140038405Packaging Structures and Methods with a Metal Pillar - A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.2014-02-06
20140038406METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMICONDUCTOR SUBSTRATE HAVING A BONDED CONNECTION AND AN ENCAPSULATING POLYMER LAYER - A method for fabricating a through wire interconnect for a semiconductor substrate having a substrate contact includes the steps of: forming a via through the semiconductor substrate from a first side to a second side thereof; placing a wire in the via having a first end with a bonded connection to the substrate contact and a second end proximate to the second side; forming a first contact on the wire proximate to the first side; forming a second contact on the second end of the wire; and forming a polymer layer on the first side at least partially encapsulating the wire while leaving the first contact exposed.2014-02-06
20140038407FLUORINE DEPLETED ADHESION LAYER FOR METAL INTERCONNECT STRUCTURE - A line trough and a via cavity are formed within a dielectric layer comprising a fluorosilicate glass (FSG) layer. A fluorine depleted adhesion layer is formed within the line trough and the via cavity either by a plasma treatment that removes fluorine from exposed surfaces of the FSG layer, or by deposition of a substantially fluorine-free dielectric layer. Metal is deposited within the line trough and the via cavity to form a metal line and a metal via. The fluorine depleted adhesion layer provides enhanced adhesion to the metal line compared with prior art structures in which a metal line directly contacts a FSG layer. The enhanced adhesion of metal with an underlying dielectric layer provides higher resistance to delamination for a semiconductor package employing lead-free C4 balls on a metal interconnect structure.2014-02-06
20140038408FLUORINE DEPLETED ADHESION LAYER FOR METAL INTERCONNECT STRUCTURE - A line trough and a via cavity are formed within a dielectric layer comprising a fluorosilicate glass (FSG) layer. A fluorine depleted adhesion layer is formed within the line trough and the via cavity either by a plasma treatment that removes fluorine from exposed surfaces of the FSG layer, or by deposition of a substantially fluorine-free dielectric layer. Metal is deposited within the line trough and the via cavity to form a metal line and a metal via. The fluorine depleted adhesion layer provides enhanced adhesion to the metal line compared with prior art structures in which a metal line directly contacts a FSG layer. The enhanced adhesion of metal with an underlying dielectric layer provides higher resistance to delamination for a semiconductor package employing lead-free C4 balls on a metal interconnect structure.2014-02-06
20140038409SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - For simplifying the dual-damascene formation steps of a multilevel Cu interconnect, a formation step of an antireflective film below a photoresist film is omitted. Described specifically, an interlayer insulating film is dry etched with a photoresist film formed thereover as a mask, and interconnect trenches are formed by terminating etching at the surface of a stopper film formed in the interlayer insulating film. The stopper film is made of an SiCN film having a low optical reflectance, thereby causing it to serve as an antireflective film when the photoresist film is exposed.2014-02-06
20140038410METHOD OF PRODUCING A SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT THROUGH THE SUBSTRATE - A semiconductor substrate (2014-02-06
20140038411MANUFACTURING METHOD OF DEVICE - A device manufacturing method includes: sequentially forming a first sacrificial film, a first support film, a second sacrificial film, and a second support film on a semiconductor substrate; forming a hole to pass through these films; forming a crown-shaped electrode covering an inner surface of the hole and connected to the second support film and the first support film; forming a first opening in the second support film into a first pattern designed such that the connection between the crown-shaped electrode and the second support film is at least partially maintained; removing at least a part of the second sacrificial film through the first opening; forming a second opening in the first support film with use of the first opening; and removing the first sacrificial film through the second opening. This method is able to prevent misalignment of openings between the support films.2014-02-06
20140038412INTERCONNECT FORMATION USING A SIDEWALL MASK LAYER - Embodiments described herein provide approaches for interconnect formation in a semiconductor device using a sidewall mask layer. Specifically, a sidewall mask layer is deposited on a hard mask in a merged via region of the semiconductor device following removal of a planarization layer previously formed on the hard mask. The sidewall mask layer is conformally deposited on the hard mask, and acts like a sacrificial layer to protect the hard mask during a subsequent via etch. This reduces the via critical dimension (CD) and reduces the CD elongation along the hard mask line direction during the via etch.2014-02-06
20140038413Method of Manufacturing a Semiconductor Device including a Dielectric Structure - A dielectric layer is deposited on a working surface of a substrate, wherein the dielectric layer contains or consists of a dielectric polymer. The dielectric layer is partially cured. A portion of the partially cured dielectric layer is removed using a chemical mechanical polishing process. Then the curing of remnant portions of the partially cured dielectric layer is continued to form a dielectric structure. The partially cured dielectric layer shows high removal rates during chemical mechanical polishing. With remnant portions of the dielectric layer provided in cavities, high volume insulating structures can be provided in an efficient manner.2014-02-06
20140038414Process of planarizing a wafer with a large step height and/or surface area features - A blanket stop layer is conformally formed on a layer with a large step height. A first chemical mechanical polishing process is performed to remove the blanket stop layer atop the layer in the raised region. A second chemical mechanical polishing process is performed to planarize the wafer using the blanket stop layer as a stop layer when the layer is lower than or at a same level as the blanket stop layer or using the layer as a stop layer when the blanket stop layer is lower than or at a same level as the layer, or a selective dry etch is performed to remove the layer in the raised region. Thus, the layer in the raised region can be easily removed without occurrence of dishing in the non-raised region which is protected by the blanket stop layer.2014-02-06
20140038415POLYMER-CONTAINING DEVELOPER - Disclosed is a developer, one that does not cause pattern collapse during the formation process, for the formation of a fine pattern and a method for pattern formation using the developer. A developer used in a lithography process includes a polymer for forming a dry-etching mask and an organic solvent. The polymer is preferably a curable resin different from a curable resin forming a resist film. The developer is preferably used after exposure of the resist film. The organic solvent in the developer is preferably butyl acetate or a mixed solvent of butyl acetate and an alcohol, or 2-pentanone or a mixed solvent of 2-pentanone and an alcohol. Also disclosed is a method for producing a semiconductor device.2014-02-06
20140038416SINGLE SPACER PROCESS FOR MULTIPLYING PITCH BY A FACTOR GREATER THAN TWO AND RELATED INTERMEDIATE IC STRUCTURES - Single spacer processes for multiplying pitch by a factor greater than two are provided. In one embodiment, n, where n≧2, tiers of stacked mandrels are formed over a substrate, each of the n tiers comprising a plurality of mandrels substantially parallel to one another. Mandrels at tier n are over and parallel to mandrels at tier n−1, and the distance between adjoining mandrels at tier n is greater than the distance between adjoining mandrels at tier n−1. Spacers are simultaneously formed on sidewalls of the mandrels. Exposed portions of the mandrels are etched away and a pattern of lines defined by the spacers is transferred to the substrate.2014-02-06
20140038417SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF - A semiconductor structure includes a substrate, a recess and a material. The recess is located in the substrate, wherein the recess has an upper part and a lower part. The minimum width of the upper part is larger than the maximum width of the lower part. The material is located in the recess.2014-02-06
20140038418BEVEL ETCHER WITH VACUUM CHUCK - A bevel etcher incorporating a vacuum chuck used for cleaning the bevel edge and for reducing the bending curvature of a semiconductor substrate. The bevel etcher includes a vacuum chuck and a plasma generation unit which energizes process gas into a plasma state. The vacuum chuck includes a chuck body and a support ring. The top surface of the chuck body and inner periphery of the support ring form a vacuum region enclosed by the bottom surface of a substrate mounted on the support ring. A vacuum pump evacuates the vacuum region during operation. The vacuum chuck is operative to hold the substrate in place by the pressure difference between the top and bottom surfaces of the substrate. The pressure difference also generates a bending force to reduce the bending curvature of the substrate.2014-02-06
20140038419METHOD FOR PROVIDING VIAS - A method for forming via holes in an etch layer disposed below a patterned organic mask with a plurality of patterned via holes is provided. The patterned organic mask is treated by flowing a treatment gas comprising H2014-02-06
20140038420COMPOSITION AND PROCESS FOR SELECTIVELY ETCHING METAL NITRIDES - A removal composition and process for selectively removing a first metal gate material (e.g., titanium nitride) relative to a second metal gate material (e.g., tantalum nitride) from a microelectronic device having said material thereon. The removal composition can include fluoride or alternatively be substantially devoid of fluoride. The substrate preferably comprises a high-k/metal gate integration scheme.2014-02-06
20140038421Deposition Chamber and Injector - A system and method are disclosed for processing semiconductors. An embodiment comprises a reaction chamber for processing wafers and having walls tapering at an angle that is greater than 0 degrees and less than about 35 degrees from a first end optionally having a diameter of 341 to 380 millimeters to a second end optionally having a diameter of 300 to 340 millimeters at a second end, with gas flow from the first end to the second end, and having at least one deposition injector near the first end of the reaction chamber and having a plurality of injector openings that disperse injection material across a cross section of the reaction chamber for forming a deposition layer.2014-02-06
20140038422CONTROL SYSTEM FOR NON-CONTACT EDGE COATING APPARATUS FOR SOLAR CELL SUBSTRATES - A non-contact edge coating apparatus includes an applicator for applying a coating material on an edge of a solar cell substrate and a control system configured to drive the applicator. The control system may drive the applicator along an axis to maintain a distance with an edge of the substrate as the substrate is rotated to have the edge coated with a coating material. The applicator may include a recessed portion into which the edge of the substrate is received for edge coating. For example, the applicator may be a roller with a groove. Coating material may be introduced into the groove for application onto the edge of the substrate. A variety of coating materials may be employed with the apparatus including hot melt ink and UV curable plating resist.2014-02-06
20140038423COATING TREATMENT METHOD AND COATING TREATMENT APPARATUS - In the present invention, a masking solution is supplied to an edge portion of a front surface of a substrate rotated around a vertical axis to form a masking film at the edge portion of the substrate, a hard mask solution is supplied to the front surface of the substrate to form a hard mask film on the front surface of the substrate, a hard mask film removing solution dissolving the hard mask film is supplied to the hard mask film formed at the edge portion of the substrate to remove the hard mask film formed at the edge portion of the substrate, and a masking film removing solution dissolving the masking film is supplied to the masking film to remove the masking film at the edge portion of the substrate.2014-02-06
20140038424METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A polyimide film is effectively formed on a complicated surface. The polyimide film is formed by reacting, on the surface, diamine monomer and tetracarboxylic acid dianhydride monomer both of which are dissolved within carbon dioxide in a supercritical states, together with a polyamic acid resulting from a reaction between the diamine monomer and the tetracarboxylic acid dianhydride reached to the surface.2014-02-06
20140038425METHODS OF ELIMINATING PATTERN COLLAPSE ON PHOTORESIST PATTERNS - A stabilizing solution for treating photoresist patterns and methods of preventing profile abnormalities, toppling and resist footing are disclosed. The stabilizing solution comprises a non-volatile component, such as non-volatile particles or polymers, which is applied after the photoresist material has been developed. By treating the photoresist with the solution containing a non-volatile component after developing but before drying, the non-volatile component fills the space between adjacent resist patterns and remains on the substrate during drying. The non-volatile component provides structural and mechanical support for the resist to prevent deformation or collapse by liquid surface tension forces.2014-02-06
20140038426METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES - A method for reducing defects in an active device area of a semiconductor device during fabrication is disclosed. In one aspect, the method comprises providing the active device area adjacent an isolation structure, wherein a substantially planar surface is formed over the isolation structure and the active device area, forming a patterned stress-inducing layer over the substantially planar surface, forming at least one screening layer between the patterned stress-inducing layer and the substantially planar surface, where the screening layer is configured to screen part of the stress field induced by the patterned stress-inducing layer, performing an anneal process after forming the patterned stress-inducing layer on the substantially planar surface, so as to induce a movement of the defects towards a contact interface between the active device area and the isolation structure, and removing the patterned stress-inducing layer from the substantially planar surface.2014-02-06
20140038427Carbosilane Precursors For Low Temperature Film Deposition - Provided are processes for the low temperature deposition of silicon-containing films using carbosilane precursors containing a carbon atom bridging at least two silicon atoms. Certain methods comprise providing a substrate; in a PECVD process, exposing the substrate surface to a carbosilane precursor containing at least one carbon atom bridging at least two silicon atoms; exposing the carbosilane precursor to a low-powered energy sourcedirect plasma to provide a carbosilane at the substrate surface; and densifying the carbosilanestripping away at least some of the hydrogen atoms to provide a film comprising SiC. The SiC film may be exposed to the carbosilane surface to a nitrogen source to provide a film comprising SiCN.2014-02-06
20140038428Self-Assembled Monolayer for Pattern Formation - The present disclosure is directed to a process for the fabrication of a semiconductor device. In some embodiments the semiconductor device comprises a patterned surface. The pattern can be formed from a self-assembled monolayer. The disclosed process provides self-assembled monolayers which can be deposited quickly, thereby increasing production throughput and decreasing cost, as well as providing a pattern having substantially uniform shape.2014-02-06
20140038429METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF PROCESSING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS - In a low-temperature, a silicon nitride film having a low in-film chlorine (Cl) content and a high resistance to hydrogen fluoride (HF) is formed. The formation of the silicon nitride film includes (a) supplying a monochlorosilane (SiH2014-02-06
20140038430METHOD FOR PROCESSING OBJECT - In a method for processing an object by heating the object, microwaves are irradiated to the object. In the microwave irradiation, the object is forcedly cooled.2014-02-06
20140038431APPARATUS AND METHODS FOR MICROWAVE PROCESSING OF SEMICONDUCTOR SUBSTRATES - Methods and apparatus for radiation processing of semiconductor substrates using microwave or millimeter wave energy are provided. The microwave or millimeter wave energy may have a frequency between about 600 MHz and about 1 THz. Alternating current from a magnetron is coupled to a leaky microwave emitter that has an inner conductor and an outer conductor, the outer conductor having openings with a dimension smaller than a wavelength of the emitted radiation. The inner and outer conductors are separated by an insulating material. Interference patterns produced by the microwave emissions may be uniformized by phase modulating the power to the emitter and/or by frequency modulating the frequency of the power itself. Power from a single generator may be divided to two or more emitters by a power divider.2014-02-06
20140038432Vibration-Resistant Slip Ring Device - A slip ring device for the electrical connection of two mutually rotatable parts includes one or more slideways each with at least one V-groove. At least two wire brushes are provided which run in (are configured to extend into) the V-grooves. The wire brushes are electrically connected to each other and are mounted on at least two different brush blocks which are mechanically decoupled from one another. Increased insensitivity to vibrations and mechanical impacts can be achieved in this way.2014-02-06
20140038433Slipring with Integrated Heating Unit - A slipring assembly comprises a slipring module having at least one slipring track which is in electrical contact with at least one slipring brush. The slipring module includes an isolating body holding the at least one slipring track. Furthermore a heating element is embedded in the slipring module to generate heat within the slipring module and to increase the temperature of the at least one slipring track. This allows increasing the temperature of the slipring module to an optimum operation temperature and further to remove humidity from the surface of the slipring track.2014-02-06
20140038434Low Cost Gold Wire Brushes - A slipring brush includes a body of a metal wire or metal band having a contact area for contacting a slipring module. The contact area is selectively coated by a contact material like gold or silver or an alloy thereof. The body preferably includes Copper, Nickel, Iron, or an alloy thereof. Coating may be done by electroplating, physical vapor deposition (PVD) or chemical vapor deposition (CVD).2014-02-06
20140038435BRUSH - An aspect of the present invention provides a brush in which positional accuracy of elastic contact pieces is enhanced while production cost is reduced by simplifying production, whereby the brush includes a support that is connected to a base and a conductive portion that is integral with the support, such that the conductive portion includes plural elastic contact pieces extending in parallel from a side edge of the support.2014-02-06
20140038436DEVICE FOR A PATCH PANEL - There is provided a pluggable modular device for removable connection to a patch panel. The pluggable modular device comprises an electrical connector for mating with a corresponding electrical connector of the patch panel; and at least one of scanning electronics for scanning connection ports of the patch panel and guidance electronics for activating indicators of the patch panel.2014-02-06
20140038437ELECTRICAL CONNECTOR ASSEMBLY HAVING SHIELDING DEVICE FOR EMI THEREOF - An electrical connector assembly for electrically connecting a central processing unit (CPU) to a printed circuit board (PCB), includes an electrical connector and a shield device. The electrical connector includes an insulative housing, a number of contacts received in the insulative housing, and a load plate mounted upon the insulative housing. The shield device includes an upper section providing a loading force to the load plate, and side sections located on four sides of the electrical connector.2014-02-06
20140038438SHIELDING SOCKET WITH TWO PIECES HOUSING COMPONENTS - An electrical connector for electrically connecting a chip module with a printed circuit board includes an insulative housing and a number of contacts fixed in the insulative housing. The insulative housing includes an upper component and a lower component cooperated with the upper component. The upper component has a protruding portion and the lower component has a hole cooperated with the protruding portion. The protruding portion is in touch with the hole and the contacting area is plated with a metal fillings. It is easy to assemble and it has better shielding effects.2014-02-06
20140038439Safety Plug Adapter - A safety plug adapter comprises a cover, a base plate, a conductive terminal block, a first sliding assembly, a second sliding assembly, two first conductive pins, two second conductive pins, two auxiliary elements, a ground portion, a grounding terminal block, and an attachable conductive pin, wherein the cover defines a first group of slots on a top surface thereof and a second group of slots on a side surface; the first group of slots includes a live slot, a neutral slot, and a ground slot; the second group of slots includes a live slot and a neutral slot. With the plug adapter, the first group of slots or the second group of slots can be inserted by a plug of an electrical device, whereas the first conductive pins or the second conducive pins can insert into a socket, to achieve an electrical connection between the electrical device and the socket.2014-02-06
20140038440ELECTRICAL CONNECTOR WITH CAP FOR COVERING PARTIAL RECEIVING HOLES - An electrical connector includes an insulating housing having a bottom wall defining an upper surface, a lower surface opposite to the upper surface and a number of receiving holes running through the upper and lower surfaces; a number of contacts received in the receiving holes wherein the number of the contacts is less than the number of the receiving holes, partial receiving holes are vacant; and a cap assembled on the upper surface of the bottom wall and covering the vacant receiving holes to form a non-conductive portion.2014-02-06
20140038441PROTECTIVE STRUCTURE FOR COVERING A CONNECTOR AND ELECTRONIC DEVICE THEREWITH - A protective structure includes a covering body, a protective component, a fixing component and a fastening portion. The covering body is for covering the connector. The protective component is connected to the covering body and for plugging into the connector. The fixing component is connected to a side of the covering body and for plugging into an installation hole on a case of the electronic device. The fixing component includes a shaft for pivoting relative to the case so as to drive the covering body to a position where the covering body does not cover the connector when the protective component does not plug into the connector. The fastening portion is installed on the fixing component and is for contacting against the installation hole after the fixing component is plugged into the installation hole so as to prevent the fixing component from separating from the installation hole.2014-02-06
20140038442TIG TORCH CONNECTOR WITH HOSE MANAGEMENT AND TOOLLESS ASSEMBLY - A connector for connecting together a welding torch power cable including a threaded connector, a coolant line and a shielding gas line to a welding power and/or coolant source including a connector receptacle includes an electrically conductive tubular body having a front end and a back end. The tubular body front end is adapted to receive and connect to the power cable threaded connector. The tubular body back end is adapted to connect to the connector receptacle. The tubular body also includes a passageway therein to communicate shielding gas or coolant between the source and the torch. A hose connector is attached at an end of the passageway. A casing including a longitudinally extending tubular side wall terminates in front and back ends. A twist cap is releasably connectable to the back end of the casing. A cable cover adapter is releasably connectable to the front end of the casing.2014-02-06
20140038443ELECTRICAL CONNECTOR SYSTEM WITH REPLACEABLE SEALING ELEMENT - A replaceable sealing element for sealing together two mating electrical connectors includes a sealing body having two opposed ends, a side wall extending between the two opposed ends, a threaded portion that is defined on the side wall for releasably mating with a first electrical connector of the mating electrical connectors, and either a slot or a protrusion at one of the opposed ends of the sealing body that is configured to be accessed by a tool for replacing the sealing element. A first seal is positioned on the side wall for sealing contact with the first electrical connector. A second seal is positioned on the side wall for sealing contact with a second electrical connector of the mating electrical connectors. Also described is an electrical connector having a replaceable sealing element.2014-02-06
20140038444JOINT CONNECTOR - A crimp terminal is inserted in one of terminal accommodating chambers provided for a housing of a joint connector to be electrically connected to another crimp terminal in another one of the terminal accommodating chambers. The crimp terminal includes: a first engagement portion formed at one end in a direction orthogonal to an insertion direction that the crimp terminal is inserted into the terminal accommodating chamber; and a second engagement portion which is provided at the other end which can be engaged with the first engagement portion. The first engagement portion is engaged with the second engagement portion of another crimp terminal for electrical connection of the two or more crimp terminals.2014-02-06
20140038445CHIP CARD HOLDER FOR ELECTRONIC DEVICE - A chip card holder includes a latching member and a housing. The latching member includes a first cover portion, a second cover portion and a connecting portion therebetween the first cover portion and the second cover portion. The housing defines two receiving grooves. The first cover portion and the second cover portion respectively protrude from the two receiving grooves. The receiving grooves with the first cover portion and the second cover portion define a first latching space and a second latching space for receiving two chip cards.2014-02-06
20140038446SPRING PLATE TYPE CONNECTOR FOR USE IN BACKLIGHT MODULE - The present invention discloses a spring plate type connector for use in backlight module, which includes a retention base and a plurality of connection bodies. The plurality of connection bodies is integrally formed on the retention base. The retention base includes a corresponding structure of a component contained in the backlight module. The connection body includes: a connection section, which is connected to the retention base; and an engagement section, which extends from the connection section and is connected to a solder pad inside the backlight module. Practicing the spring plate type connector for use in backlight module simplifies the manufacture process of the connector, realizes expanded range of application, and allows of application to connection with backlight modules of various models, thereby improving sharability of the connector and making the backlight module compact and light-weighted.2014-02-06
20140038447ELECTRICAL CONNECTOR INCLUDING LATCH ASSEMBLY WITH PULL TAB - An electrical connector can includes a connector housing that includes a housing body and further includes at least one fulcrum supported by the housing body. The electrical connector further includes at least one electrical contact supported by the connector housing, the at least one electrical contact configured to mate with a complementary electrical contact of a complementary electrical connector. The electrical connector further includes a latch assembly. The latch assembly can include an actuator and a latch. The actuator can have an actuator portion, an attachment portion, and at least one arm that extends between the actuator portion and the attachment portion. The latch can have a latch body that defines an attachment portion that is configured to be attached to the attachment portion of the actuator, such that movement of the actuator in a predetermined direction causes the pivot member to ride along the fulcrum, thereby pivoting the latch from a latched position to an unlatched position.2014-02-06
20140038448DELATCHING CONNECTOR INCLUDING EXTENSION MEMBER - A connector includes a body configured to latchingly connect to a complementary connector element in a latching direction and an arm projecting from the body at an angle to the axis. The arm is configured to shift from a first position with its distal end a first distance from the axis to a second position with its distal end a second distance from the axis, and the body is removable from the complementary connector element when the arm is in the second position. The connector includes a force redirection element connected to the body and an extension member in contact with the force redirection element. The force redirection element is configured such that when a force is applied to the extension member in a direction opposite the latching direction, the arm is shifted from the first position toward the second position.2014-02-06
20140038449Serial Bus Receptacle With Exterior Socket Clamping - System and method for communicatively coupling a serial communication plug to a serial communication bus. The system may include a housing. The housing may include a receptacle that is configured to communicatively couple to a bus. The receptacle may include one or more internal retention springs situated inside the receptacle. The one or more internal retention springs may be configured to grip a male plug with a retention force, when the male plug is inserted into the receptacle. The housing may include or may be coupled to a clamp where the clamp is external to the receptacle. When the male plug is inserted into the receptacle, the clamp may be adjustable via a clamp adjustment mechanism to constrain the one or more internal retention springs, thus augmenting the retention force and further securing the male plug in the receptacle.2014-02-06
20140038450Docking Station for an Electronic Device with Improved Electrical Interface - Disclosed is a device for attaching a plurality of external connectors to an electronic device including a main body, a first plug on the main body positioned to interface with a first port on the electronic device, a slot in the main body for slidably receiving a second external connector and for positioning the second external connector to interface with a second port of the electronic device. The slot has a first opening on a first surface of the main body to receive the second external connector, a second opening on a second surface of the main body to allow a portion of the second external connector to protrude from the second opening of the main body, a first wall opposite the first surface, a rear wall opposite the second surface, a top wall, and a bottom wall.2014-02-06
20140038451CONNECTORS FOR LANDSCAPE LIGHTING SYSTEMS - A connector includes a cable tray configured to receive and retain a cable in a stable position and couple with a top cap configured to create an electrical connection with the cable as the top cap is manipulated in a predetermined manner while coupled with the cable tray. An upper surface of the cable tray is configured to receive the cable. The cable tray also includes a finger extending beyond the first end for some distance longitudinally. The finger includes a protrusion that protrudes to some extent in a transverse direction so that a cable-accommodating gap is defined between the protrusion and the first end. The protrusion is configured to bear against the cable and retain the cable in the stable position when the cable is inserted between the protrusion and the first end (before, during and/or after an electrical connection is established).2014-02-06
20140038452METER SOCKET HAVING A BREAKABLE TAB FOR RETAINING A SLIDING NUT - An electric meter socket for connecting electrical conductors thereto includes a meter socket block configured to receive at least one lug assembly. The lug assembly is configured to receive an electrical conductor and may include a lug and sliding nut. The lug includes a slide path that allows the sliding nut to be removed from the lug so an electrical conductor can be placed in the lug for connection to the meter socket. To prevent the sliding nut from sliding out of the lug until an electrical conductor is ready to be connected, the meter socket block includes at least one breakable tab that blocks the slide path, thus retaining the sliding nut within the lug. The breakable tab may be removed when an electrical conductor is ready to be connected. Methods of assembling a meter socket and of connecting electrical conductors thereto are also provided, as are other aspects.2014-02-06
20140038453TELECOMMUNICATIONS PATCH PANEL WITH ANGLED CONNECTOR MODULES - A telecommunications patch panel is provided having a plurality of connector modules rotatably mounted to a frame member. Each connector module has a front face and an opposite facing rear face, and each front face includes a plurality of connector jacks. Each rear face includes a plurality of wire termination blocks. The wire termination blocks are electrically connected to the connector jacks. Each connector module is rotatable about a rotation axis relative to the frame member. A lock selectively locks each connector module to the frame member as desired. The connector jacks and the connector modules are arranged in linear arrays perpendicular to the axis of rotation.2014-02-06
20140038454STRUCTURE FOR CONNECTING ELEMENT TO CONDUCTIVE MEMBER - An element connection structure for a conductive member, in which structure an element is connectable to the conductive member without soldering or adhesive. The element connection structure is configured such that a plurality of first conductive members arranged at intervals in the width direction thereof are held by an insulating holding member, such that one end of each of a plurality of elements is brought into conductive contact with each of the first conductive members, and such that a second conductive member, which is brought into conductive contact with the other end of each of the plurality of elements, is mounted to the holding member so that each of the elements is held in conductive contact with the first and second conductive members. Each of the elements is connectable to each of the conductive members and to the conductive member without soldering or adhesive.2014-02-06
20140038455ELECTRONIC ACCESSORIES FOR DIGITAL MUSIC PLAYERS AND RELATED METHODS - Embodiments of electronic accessories for digital music players are disclosed herein. Other examples and related methods are also disclosed herein.2014-02-06
20140038456Photovoltaic Connector - Embodiments of the present invention provide a photovoltaic (PV) connector, comprising a first connecting unit and a second connecting unit detachably connected with the first connecting unit, wherein the first connecting unit includes a first conductor, a first stop ring, a first housing and a first conductor core provided inside and detachably connected to the first housing; the first conductor is electrically connected with a pressing end of the first conductor core; the first stop ring is detachably connected with the first housing; the second connecting unit includes a second conductor, a second housing, a second stop ring and a second conductor core provided inside and detachably connected to the second housing; the second conductor is electrically connected with a pressing end of the second conductor core; the second stop ring is detachably connected with the second housing.2014-02-06
20140038457CABLE CONNECTOR HAVING A SLIDER FOR COMPRESSION. - A coaxial cable connector is attachable to a coaxial cable. The connector, in one embodiment, includes a compressible component, a coupler and a slider. The slider is configured to cause compression of the compressible component.2014-02-06
20140038458ELECTRICAL CONNECTOR - Systems and methods (2014-02-06
20140038459SHIELDED CONNECTOR - The male shielded connector (2014-02-06
20140038460ACCESSORY DETECTION CIRCUIT WITH IMPROVED FUNCTIONALITY - An apparatus comprises a first connector, a second connector, a detection circuit and a logic circuit. The first connector and the second connector are configured for electrical communication with first and second conducting terminals, respectively, of an audio jack plug. The detection circuit is configured to apply a first value of current to the first connector, and apply a second value of current to the second connector. The logic circuit is configured to generate an indication that the audio jack plug is fully inserted according to a logic level detected at the second connector when electrical ground is detected at the first connector.2014-02-06
20140038461Methods and Apparatus for Reducing Crosstalk in Electrical Connectors - A communication jack having crosstalk compensation features for overall crosstalk interference reduction is disclosed. In one embodiment, the jack is configured to receive a plug to form a communication connection, and comprises jack contacts disposed in the jack, with each contact having at least a first surface and a second surface. Upon the plug being received by the jack, the plug contacts interface with the first surface of the jack contacts. The jack further includes a first capacitive coupling connected between two pairs of jack contacts to compensate for near end crosstalk, with the first capacitive coupling being connected to the pairs of jack contacts along the second surface adjacent to where the plug contacts interface with the jack contacts. A far end crosstalk compensation scheme is also set forth.2014-02-06
20140038462MANAGED FIBER CONNECTIVITY SYSTEMS - A connectorized media cable includes at least one primary media segment; a first plug connector coupled to a first end of the media segment; and a second plug connector coupled to the second end of the media segment. Each plug connector includes a storage device having memory configured to store physical layer information pertaining to the cable. The storage device also includes at least four contacts that are electrically connected to the memory and isolated from the primary media segment. Certain types of cables include an electrical conductor extending along the media cable between a fourth one of the contacts of the first plug connector and a fourth one of the contacts of the second plug connector. The plug connectors of other types of cables have two data contacts coupled to the memory.2014-02-06
20140038463SUBMERGIBLE FUSED RECEPTACLE ASSEMBLY FOR A VEHICLE CHARGING INLET - A receptacle assembly for a vehicle charging inlet is provided having a base with apertures formed through, an external receptacle extending from the base in a first direction for receiving a charging cable connector, and an internal receptacle extending from the base in a second direction, opposite the first direction, for receiving a plurality of wires from a wire harness. The internal receptacle defines an internal cavity having at least one terminal receptacle formed about one of the apertures and at least one fuse receptacle. The internal receptacle includes wire channels for routing a wire having an inline fuse from the terminal receptacle to the fuse receptacle and from the fuse receptacle to a wire outlet. The inline fuse is received by the fuse receptacle.2014-02-06
20140038464CABLE CONNECTOR AND MANUFACTURING METHOD THEREOF - A cable connector and a manufacturing method thereof. The method includes: providing an insulation body, putting a terminal that has a receiving portion into the insulation body, preparing at least one groove on a cable, in which the cable has a first part inserted in the insulation body and a second part extending out of the insulation body, and the groove is provided on the first part, pressing the cable, so that a side edge of the receiving portion pierces the cable at the groove, thereby electrically connecting the terminal and an inner conductor of the cable. The groove enables the terminal to pierce the cable easily, implementing desirable electrical connection between the inner conductor and the terminal, and also stops the cable in the extending direction of the cable, preventing the cable from escaping.2014-02-06
20140038465SHIELDING SOCKET WITH TWO PIECES CONTACTS AND TWO PIECES HOUSING COMPONENTS - An electrical connector for electrically connecting a chip module with a printed circuit board includes an upper component, a lower component assembled on the upper component and a number of terminals, the upper component includes a number of upper tabs and the lower component includes a number of lower tabs. The terminals include a number of upper terminals and a number of lower terminals matched with the upper terminals. The upper terminals received in the upper component and the lower terminals received in the lower component; wherein the pressing of the terminal can transform the vertical movement of the upper terminal to the horizontal movement of the lower terminal.2014-02-06
20140038466MODULE CONNECTOR FOR UNINTERRUPTED COMMUNICATION - A module connector (2014-02-06
20140038467AUDIO JACK CONNECTOR - An audio jack connector (2014-02-06
20140038468ELECTRICAL CONNECTOR WITH A SPACER FOR RETAINING CONTACTS THEREON - An electrical connector includes an insulative housing a front opening cavity a front-to-back direction, a plurality of contacts retained in the insulative housing and a spacer attached to the insulative housing. Each of the contacts incudes a contacting portion exposed in the cavity, a soldering portion protruding from the insulative housing and a bridge portion connecting with the contacting portion and the soldering portion. A first row of the solder portions of the contacts extend rearward and a second row of soldering portions of the contacts extend forwards. The spacer comprises a horizontal section under the insulative housing and a vertical section at back of the insulative housing to press against the bridge portions of the second contacts.2014-02-06
20140038469CONNECTION TERMINAL AND CONNECTOR PROVIDED THEREWITH - A connection terminal includes a movable contact portion protruding out of a contact hole of a housing of the connection terminal, and is adapted to be pressed; a first curved portion continuously formed, the first curved portion including a free end portion having a fixed portion; a second curved portion continuously formed, the second curved portion including a free end portion having the movable contact portion; a rigid coupling portion interposed between the first curved portion and the second curved portion, and an abutment portion disposed on an opposite side to the second curved portion with respect to the movable contact portion, and adapted to be displaced toward the rigid coupling portion2014-02-06
20140038470PROTECTIVE COVERS FOR CABLE CONNECTORS - Sleeves for protecting electrical connectors are disclosed. In various embodiments, a protective sleeve includes an elongate body configured to house a male or female electrical connector component. In various embodiments, a protective sleeve is configured with a streamlined exterior that reduces the likelihood of becoming snagged or trapped as it is being pulled from one location to another via a cable attached to the electrical connector. In various embodiments, a protective sleeve can be formed from two halves that can be disengaged from the electrical connector without requiring disconnection of the connector itself.2014-02-06
20140038471CONNECTING ELEMENT FOR SECONDARY BATTERY, AND BATTERY MODULE AND BATTERY PACK INCLUDING THE SAME - A connecting element for a secondary battery is installed on a path of current flowing through a secondary battery to electrically connect components and includes a first metal plate having a first protrusion formed to protrude at one side end thereof from the center portion of the thickness direction thereof, a second metal plate located spaced apart from the first metal plate with a gap being formed therebetween and having a second protrusion formed to protrude at one side end thereof from the center portion of the thickness direction thereof and face the first protrusion, and an alloy bridge made of alloy material having a melting point lower than those of the first metal plate and the second metal plate and formed to fill the gap. The connecting element may ensure the safety of the secondary battery in use, minimize the increase of resistance caused by applying the connecting element, and be rapidly broken even though the connecting element is applied as a part with a relatively great thickness.2014-02-06
20140038472POWER CIRCUIT ELECTRICAL CONNECTION SYSTEM AND METHOD - A connector system is provided for use in power applications, such as for conveying three phase power in electrical enclosures. The system comprises plug assemblies in which a power conductor is mounted in a floating arrangement with elastically deformable conductive structures extending from either side thereof. A mating receptacle may be mounted on a bus conductor. Three such arrangements may be provided for conveying three phase power. The structures allow for plug-in mating of the system components while accommodating considerable translational and angular misalignment between the connector parts.2014-02-06
20140038473TERMINAL FITTING - The present invention provides a terminal fitting that ensures constant contact load of an inserter that is inserted into an electrical contact by making uniform the amounts of displacement among a plurality of resilient pieces constituting the electrical contact. A terminal fitting includes a cylindrical electrical contact portion obtained by making the both ends of the conductive metal plate close to each other and joined to each other. The electrical contact portion includes a plurality of slits extending in a cylinder-length direction N and provided at intervals in the circumferential direction of the electrical contact portion. The slits provided farthest away from the joining portion at the both ends of the metal plate have a size in the cylinder-length direction N larger than those of the other slits.2014-02-06
20140038474ELECTRICAL CONNECTING SYSTEM - In an electrical connecting system for contacting an electronic module with multiple printed conductors that are of a flexible printed circuit and enclosed between a lower and an upper cover film, the electronic module includes at least one circuit board embedded in a plastic housing and a connecting piece connected in an electrically conductive manner to the circuit board, a printed conductor being situated between the connecting piece and a spring clip.2014-02-06
20140038475Electrical Terminal - An electrical terminal is provided and includes a first member and a second member. The first member includes a pair of connecting face portions, a coupling portion, and a plurality of serrations. The pair of connecting face portions face each other in a substantially V shape such that a gap between inner faces of the pair of connecting face portions gradually becomes smaller from a wider-gap side to a narrower-gap side. The coupling portion connects the pair of connecting face portions at ends of the narrower-gap side of the inner faces. The plurality of serrations are disposed on the pair of inner faces and extend along intersecting directions. The second member has a substantially U shape that mates with the pair of connecting face portions and can displace outer side faces of the pair of connecting face portions inward to urge the inner faces closer to each other.2014-02-06
20140038476CONNECTOR - A connector includes a first and a second terminals and a fixing member that fixes the first and the second terminals by covering periphery thereof in a state where the first and the second terminals are aligned in the direction extending into the rod-shape and overlap with each other in a direction perpendicular to the direction in which the first and the second terminals are aligned, wherein a cut-out portion of the first terminal faces a peripheral portion or a cut-out portion of the second terminal in the overlapping state, and at least parts of outer edges of a facing part have a same shape on the section along the direction perpendicular to the direction extending into the rod-shape.2014-02-06
20140038477Wave Power - A wave-powered water vehicle includes a surface float, a submerged swimmer, and a tether which connects the float and the swimmer, so that the swimmer moves up and down as a result of wave motion. The swimmer includes one or more fins which interact with the water as the swimmer moves up and down, and generate forces which propel the vehicle forward. The vehicle, which need not be manned, can carry communication and control equipment so that it can follow a course directed by signals sent to it, and so that it can record or transmit data from sensors on the vehicle.2014-02-06
20140038478Outboard Marine Drive - An outboard marine drive with an engine is described. The marine drive can include a drive housing with an upper drive housing and lower drive housing. The drive housing can be attached to a transom of a marine craft. An upper gear drive assembly can be located in the upper drive housing. A transmission can be provided with the upper gear drive assembly in the upper drive housing. In addition, a lower gear drive assembly can be located in the lower drive housing and coupled to the upper gear drive assembly. A propeller shaft may also be coupled to the lower gear drive assembly.2014-02-06
20140038479Mooring System - A mooring system (2014-02-06
20140038480SPORTS BOARD HAVING DEFORMABLE BASE FEATURE - Described herein is a sports board for gliding over a surface. The board includes an upper structural layer having an outer surface, a lower structural layer, a core having an upper surface substantially covered by the upper structural layer and a lower surface substantially covered by the lower structural layer. The board also includes a deformable element covered by the core on an upper surface. A first portion of the deformable element protrudes a distance beneath the lower structural layer towards a horizontal plane of the surface underlying the sports board. The board also includes a base element substantially covering the lower structural layer and the deformable element and an edge component positioned at least in part around a perimeter of the base element. At least a portion of the deformable element can deform upon application of an amount of pressure against the base element.2014-02-06
20140038481FIBERGLASS REINFORCED COMPOSITES - A fiberglass reinforced composite is provided with improved physical properties. The fiberglass reinforced composite incorporates core-shell rubber nanoparticles within the resinous binder of the composite and/or within a sizing composition coated directly onto the individual glass fibers.2014-02-06
20140038482Surface-Treated Non-Woven Fabrics - This disclosure relates to non-woven fabrics that include a plurality of continuous fibers and a composition containing a surface-modifying agent disposed on a surface of at least some of the fibers. At least some of the fibers are bonded to each other by one or more bonds. This disclosure also relates to methods and machines of making such a non-woven fabric, as well as laminates and products containing such a non-woven fabric.2014-02-06
20140038483CLOTH AND TEXTILE PRODUCT - An object is to provide a cloth containing an organic fiber, which is excellent in the oil repellency, dirt-removal property by washing and water-absorbing property, and a textile product produced using the cloth. A means for solution is attaching a specific fluorine-containing polymer to a cloth containing an organic fiber, with a quaternary ammonium salt if desired, and thus making the water-absorbing property in accordance with JIS L1018A method (the instillation method) 60 seconds or less and the oil repellency in accordance with AATCC118-1992 grade 4 or higher.2014-02-06
20140038484COMPOSITE MATERIAL COMPRISING A LAYER OF POLYMERIC PIEZOELECTRIC MATERIAL MATCHED WITH A TEXTILE SUBSTRATE AND METHOD FOR MAKING SUCH A COMPOSITE MATERIAL - A composite material is described. The composite material has a layer of polymeric piezoelectric material, where such polymeric piezoelectric layer has a first surface and a second surface, a textile substrate, and a first electrode disposed on the first surface of the polymeric piezoelectric layer. Conductors are provided on a surface of the textile substrate turned towards the second surface of the layer of polymeric piezoelectric material.2014-02-06
20140038485BIO-BASED BINDERS INCLUDING CARBOHYDRATES AND A PRE-REACTED PRODUCT OF AN ALCOHOL OR POLYOL AND A MONOMERIC OR POLYMERIC POLYCARBOXYLIC ACID - An environmentally friendly, formaldehyde-free, aqueous binder composition that includes a carbohydrate, a crosslinking agent, and a pre-reacted product of an alcohol or polyol and monomeric or polymeric polycarboxylic acid or polyglycerol is provided. The pre-reacted product may include glycerol and esters of citric acid such a monoglyceryl citrate, diglyceryl citrate, and triglyceryl citrate as well as other higher molecular weight citric acid-based esters. The inclusion of the pre-reacted product in the binder composition helps to speed the crosslinking reaction, induces faster water evaporation, decreases the viscosity of the binder, helps to reduce the amount of water needed for application of the binder, decreases tackiness, and helps to achieve a maximum vertical expansion of the insulation pack in the transfer zone. The binder composition may be used in the formation of insulation materials and non-woven chopped strand mats.2014-02-06
20140038486Catalyst System, Process For Olefin Polymerization, And Polymer Compositions Produced Therefrom - Provided are catalyst systems, processes for polymerizing one or more olefins, polymers resulting therefrom, and articles prepared from such polymers. The processes comprise contacting under polymerization conditions one or more olefin monomers, preferably propylene, with a catalyst system comprising a transition metal compound and an activator of the formula (1) or (2) as described herein. The polymer compositions described herein exhibit advantageously narrow composition distributions and high melting points in comparison to conventional polymers having the same comonomer content. The polymers described herein exhibit improved properties, e.g., pellet stability, impact properties, heat seal properties, and structural integrity in film and fabricated parts applications.2014-02-06
20140038487NONWOVEN MATERIALS CONTAINING POLYLACTIC ACID - Non-woven textile products for various applications such as household use and personal and hygienic care are provided. Methods for making and using nonwoven products such as wipes and cleaning cloths are also provided.2014-02-06
20140038488PIVOTING FRAME ADJUSTABLY SUPPORTING A FLEXIBLE RAMP AND METHODS THEREOF - A toy which simply yet uniquely varies the height and curvature of a flexible ramp uniquely supported on a pivoting ramp frame. The toy includes a frame for resting on a horizontal surface, spaced apart horizontally and extending upwardly from the frame defining an open area therebetween above the frame, and first and second pivoting assemblies at the frame engaging first and second arm members for adjustably pivoting the arm members between varying angles with respect to the frame. A bendable ramp is adjustably supported at the frame, secured to the arm members and sitting in the open area defined by the arm members.2014-02-06
20140038489INTERACTIVE PLUSH TOY - A system is presented for controlling an interactive electronic plush toy using a macro computer program created on a mobile electronic device using a mobile application. The plush toy is provided with an electronic wireless network interface for communicating wirelessly with the smartphone via a network. The macro provides computer programming for instructing the plush toy to perform an Internet search query, receive results of the query, and perform predetermined actions based on the query results. The actions may include producing sound or motion to make the toy seem life-like.2014-02-06
20140038490DECORATIVE BALLOON DISPLAY DEVICE - A decorative balloon display device includes a first large outer elastic envelope and a second small inner elastic envelope. A mechanism is for centrally retaining the second small inner elastic envelope within the first large outer elastic envelope. Another mechanism is for filling the first large outer elastic envelope and the second small inner elastic envelope with a lifting gas.2014-02-06
20140038491Toy Ball - A toy ball includes a stack of elastic corolla-like units, each having a central portion and a plurality of petal-like portions extending radially outwards therefrom. The central portions are formed with one or more through-holes. A connector is configured to pass through the through-holes and hold the corolla-like units together. The connector squeezes the central portions inwards thereby bending the petal-like portions outwards around the squeezed central portions and turns the petal-like portions from a stacked configuration to a substantially spherical configuration. The connector may be a cable tie or a plug-and-socket fastener.2014-02-06
20140038492Bra Top - A bra top that can be worn between a wearer's regular bra and their outer garment. The bra top is designed so that the wearer can choose to appropriately cover their cleavage when wearing a low-cut top. The bra top includes a front portion having a generally convex lower border, and a back portion attached to or integral with the front portion and having a generally concave lower border. The bra top is comprised of a material having 80% or more natural fibers and 20% or less stretchable synthetic fibers. The convex lower border of the front portion extends lower than the concave lower border of the back portion such that additional material is available to comfortably cover a wearer's breasts.2014-02-06
20140038493TANK AND METHOD FOR PRODUCING POLISHING PAD USING TANK - It is an object of the invention to provide a tank for use in making high-quality, air void-less, polishing pads, to provide a method for producing a polishing pad using the tank, and to provide a polishing pad obtained by such a production method. A tank for holding a resin composition, the tank comprising two or more body components and joint parts, wherein the two or more body components are joined by the joint parts to form a frame-shaped body, at least one of the joint parts includes an opening and closing member that joins adjacent ones of the body components in such a way that the adjacent body components can swing open, and at least another one of the joint parts includes a joint member that joins adjacent ones of the body components in such a way that the adjacent body components can swing about the joint member.2014-02-06
20140038494DEVICE AND METHOD FOR MACHINING OF AN OPTICAL LENS - A device and a method for polishing of an optical lens by means of rotary tool are proposed, a fixture for the lens being pivotable around a pivoting axis transversely to the axis of rotation by means of a push-rod adjustment and being pivotable up out of a machining position such that the lens can be changed from overhead. This allows a compact structure and easy changing of the lens.2014-02-06
20140038495DEVICES, SYSTEMS, AND METHODS FOR REFURBISHING ONE OR MORE LACROSSE BALLS - A method and system for resurfacing one or more lacrosse balls is provided. The system includes a container, a rotatable member, and a motor. The container is configured to hold the one or more lacrosse balls. The rotatable member includes an abrasive surface configured to scuff the lacrosse balls while in the container, The motor includes a drive shaft coupled to the rotatable member and configured to facilitate rotation of the rotatable member. With this arrangement, the lacrosse balls are positioned over the abrasive surface such that, upon rotation of the rotatable member the abrasive surface scuffs the lacrosse balls to, thereby, resurface the balls.2014-02-06
20140038496ACTIVE COOLANT FLOW CONTROL FOR MACHINING PROCESSES - A method for operating a machining tool, comprising: setting a flow rate and a pressure of a flow of coolant to a target flow rate and a pressure target, respectively, the coolant flow being provided to the machining tool; machining a work-piece using the machining tool; measuring the flow rate and the pressure of the flow of coolant; and detecting an anomaly with respect to the coolant flow; and taking a corrective action depending on the type of the detected anomaly.2014-02-06
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