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06th week of 2014 patent applcation highlights part 31
Patent application numberTitlePublished
20140036396INTEGRATED PASSIVE DEVICE FILTER WITH FULLY ON-CHIP ESD PROTECTION - The present disclosure relates to an on-chip electrostatic discharge (ESD) protection circuit that may be reused for a variety of integrated circuit (IC) applications. Both inductor-capacitor (LC) parallel resonator and shunt inductor (connected to ground) are used as ESD protection circuits and also as a part of an impedance matching network for a given IC application. The ESD LC resonator can be designed with a variety of band pass filter (BPF) topologies. On-chip ESD protection circuit allows for co-optimization ESD and BPF performance simultaneously, a fully on-chip ESD solution for integrated passive device (IPD) processes, eliminates a need for active ESD device protection, additional processes to support off-chip ESD protection, reduces power consumption, and creates a reusable BPF topology.2014-02-06
20140036397ESD Clamp for Multiple Power Rails - An Electrostatic Discharge (ESD) clamp includes first power rail, a second power rail separate from the first power rail, and an ESD discharging circuit including a plurality of cascaded MOS transistors coupled between the second power rail and an electrical ground. A bias circuit is configured to turn on the ESD discharging circuit in response to an ESD event on the second power rail, and to turn off the ESD discharging circuit during a normal operation of the ESD clamp.2014-02-06
20140036398ESD PROTECTION CIRCUIT WITH HIGH IMMUNITY TO VOLTAGE SLEW - A protection circuit (FIG. 2014-02-06
20140036399DEVICE FOR PROTECTING AN INTEGRATED CIRCUIT AGAINST OVERVOLTAGES - A device for protecting an integrated circuit against overvoltages, the device being formed inside and on top of a semiconductor substrate of a first conductivity type and including: a capacitor including a well of the second conductivity type penetrating into the substrate and trenches with insulated walls formed in the well and filled with a conductive material; and a zener diode formed by the junction between the substrate and the well.2014-02-06
20140036400PROTECTION CIRCUIT OF POWER OVER ETHERNET PORT AND ETHERNET POWER-SOURCING EQUIPMENT - The present invention discloses a protection circuit of Power Over Ethernet (POE) port and an Ethernet power-sourcing equipment. The port protection circuit includes: a first common mode suppression component, a second common mode suppression component, and a rectifier bridge. A first input end and a second input end of the rectifier bridge are connected to a first direct current output end and a second direct current output end of a PoE control chip, respectively. A first output end or a second output end of the rectifier bridge is connected to an uncharged signal line of a PoE port. An end of the first common mode suppression component is connected to the first output end of the rectifier bridge, and another end thereof is grounded. An end of the second common mode suppression component is connected to the second output end of the rectifier bridge, and another end thereof is grounded.2014-02-06
20140036401SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF TESTING THE SEMICONDUCTOR DEVICE - A semiconductor device includes a supply terminal that receives a supply voltage from an outside and supplies the supply voltage to a power supply line, a ground terminal that receives a ground voltage from the outside, a first I/O terminal that conducts a logical input signal from the outside, a first diode that is disposed between the supply terminal and the first I/O terminal so that the supply terminal is located on a cathode side and the first I/O terminal is located on an anode side, and a determination unit that compares voltages of the power supply line and the first I/O terminal, and outputs an abnormal signal when the voltage of the supply terminal is less than the voltage of the first I/O terminal.2014-02-06
20140036402FIXING ELEMENT FOR PREVENTING ESD AND ELECTRONIC DEVICE USING THE SAME - A fixing element for preventing electrostatic discharge (ESD) and an electronic device using the same are provided. The electronic device includes a substrate, an ESD shield, and a plurality of the fixing elements. The ESD shield disposed on the substrate has an assembling portion. Each of the fixing elements has a body portion, a fixing portion, and a cantilever portion. The body portion leans against the ESD shield and has a cutting opening. The fixing portion is disposed on the substrate and extends and bends from the body portion, wherein the fixing portion is perpendicular to the body portion. The cantilever portion is disposed in the cutting opening, wherein one end of the cantilever portion connects to the body portion and the other end is a free end. The cantilever portion passes through the assembling portion of the ESD shield.2014-02-06
20140036403SUBSTRATE HOLDER, SUBSTRATE HOLDER UNIT, SUBSTRATE TRANSPORT APPARATUS, AND SUBSTRATE BONDING APPARATUS - A substrate holder is reliably transported in a state of holding a substrate. There is provided a substrate holder for holding a substrate by means of electrostatic force generated by power supplied from an external source. The substrate holder is to be transported in a state of holding the substrate. The substrate holder includes a holder body that is to have the substrate placed thereon, and a connector terminal that is externally exposed through the holder body, where the connector terminal is attachable to and detachable from an external power supply terminal. There is also provided a substrate transport apparatus for transporting a substrate holder holding a substrate by means of electrostatic force generated by power supplied from an external source. The substrate transport apparatus includes a placement section that has a placement surface on which the substrate holder is placed, where the placement section holds the substrate holder, and a power supply terminal that supplies power to the substrate holder placed on the placement surface.2014-02-06
20140036404Vacuum Augmented Electroadhesive Device - An electroadhesive gripping system includes a vacuum-augmented gripper. The gripper can include an electroadhesive surface associated with one or more electrodes and a load-bearing backing structure coupled to the electroadhesive surface. The backing couples to the backside of the electroadhesive surface so as to at least partially define a shape of the electroadhesive surface. The backing is configured to flex between a curled shape and an uncurled shape. A spreading arm is configured to apply force to the backing so as to flex the backing from the curled shape to the uncurled shape. When positioned next to a substrate, the uncurling motion of the backing can cause the electroadhesive surface to become vacuum sealed to the substrate. A power supply can be configured to apply voltage to the electroadhesive surface.2014-02-06
20140036405METALIZED FILM CAPACITOR - A metalized film capacitor includes metalized films, each of which is formed of an insulating film made of dielectric, and a vapor deposited metal electrode formed on an upper surface of the insulating film. An end of the vapor deposited metal electrode extends together with an end of the insulating film, and both the ends are connected to an electrode terminal. The vapor deposited metal electrode of the metalized film includes a center region and a low resistance section that is made of Al—Zn—Mg alloy. The low resistance section is disposed at an end of the electrode and is thicker than the center region. This metalized film capacitor has high humidity resistance.2014-02-06
20140036406INTEGRATED CIRCUIT BASED VARACTOR - A varactor comprises a substrate having sets of gate units each having parallel gate strips. The gate units are located such that the gate strips of neighbouring gate units are oriented transverse to each other. An electrically conducting gate connection layer comprises gate connection units comprising parallel gate connection strips located over the gate strips, and a cathode connection frame around each of the gate connection units. A first electrically conductive anode layer comprises first layer anode strips located parallel to the gate connection strips and connected to alternate gate connection strips, and a first anode connection frame connected to the anode strips. A second electrically conductive anode layer comprises anode strips located parallel to the gate connection strips and connected to opposite alternate gate connection strips, and a second anode connection frame connected to the second layer anode strips.2014-02-06
20140036407DIELECTRIC CERAMIC, MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A dielectric ceramic is formed with sintered grains constituting the dielectric have an average grain size of 0.2 to 1.0 gm and an oxygen defect concentration of 0.2 to 0.5%. An acceptor element is added to the dielectric ceramic by no more than 0.5 mol per 100 mol of the primary component of BaTiO2014-02-06
20140036408CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a ceramic electronic component and a method of manufacturing the same. The ceramic electronic component includes: a ceramic element; and an internal electrode layer formed within the ceramic element, having a thickness of 0.5 μm or less, and including a non-electrode region formed therein, wherein an area ratio of the non-electrode region to an electrode region of the internal electrode layer, in a cross section of the internal electrode layer is between 0.1% and 10%, and the non-electrode region includes a ceramic component.2014-02-06
20140036409EMI Filtered Co-Connected Hermetic Feedthrough, Feedthrough Capacitor and Leadwire Assembly for an Active Implantable Medical Device - A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.2014-02-06
20140036410DIELECTRIC THIN FILM, DIELECTRIC THIN FILM ELEMENT AND THIN FILM CAPACITOR - A thin film capacitor includes a substrate and a dielectric thin film element formed on the substrate. The substrate can include an Si plate, an SiO2014-02-06
20140036411STORAGE UNIT FOR STORING ELECTRICAL ENERGY HAVING A LOW-RESISTANCE CONTACTED ENERGY STORE - The invention relates to a storage unit. The storage unit has at least one energy store, wherein the energy store has a positive and a negative electrical connecting terminal. The energy store is designed to be charged and discharged with electrical energy via the positive and the negative electrical connecting terminal. According to the invention, the storage unit has an electrically conductive contact rail which is at least indirectly connected to the positive connecting terminal, and an electrically conductive contact rail which is at least indirectly connected to the negative connecting terminal. The contact rails are each connected to at least one external electrical connecting terminal of the storage unit. The contact rails are each electrically connected to the respective connecting terminal of the energy store by means of an electrically conductive fibrous web or a strand comprising a plurality of individual lines.2014-02-06
20140036412OVERCOMING VARIANCE IN STACKED CAPACITORS - In one embodiment of the invention, a method of forming an energy storage device is described in which a porous structure of an electrically conductive substrate is measured in-situ while being electrochemically etched in an electrochemical etching bath until a predetermined value is obtained, at which point the electrically conductive substrate may be removed from the electrochemical etching bath. In another embodiment, a method of forming an energy storage device is described in which an electrically conductive porous structure is measured to determine the energy storage capacity of the electrically conductive porous structure. The energy storage capacity of the electrically conductive porous structure is then reduced until a predetermined energy storage capacity value is obtained.2014-02-06
20140036413ELECTROCHEMICAL CAPACITOR - An electrochemical capacitor includes a casing, an electrolyte, a storage element, a wiring and an adhesive layer. The casing forms a liquid chamber. The electrolyte is housed in the liquid chamber. The storage element is a storage element in which a positive electrode sheet, a separator sheet and a negative electrode sheet are laminated, being housed in the liquid chamber. A capacitance formed between a positive electrode active material in the positive electrode sheet and the electrolyte is greater than a capacitance formed between a negative electrode active material in the negative electrode sheet and the electrolyte. The wiring is connected to the liquid chamber. The adhesive layer is made of a conductive adhesive made with a synthetic resin including conductive particles. The adhesive layer covers the wiring, causes the positive electrode sheet to adhere to the casing, and electrically connects the wiring with the positive electrode sheet.2014-02-06
20140036414CAPACITOR - A capacitor includes a positive foil, an electrolyte layer, a negative foil, a plurality of positive guide needles and a plurality of negative guide needles. The electrolyte layer has a first surface and a second surface opposite to each other. The first surface overlaps the positive foil, and the second surface overlaps the negative foil. The positive guide needles are disposed at the positive foil. The negative guide needles are disposed at the negative foil. The positive foil, the electrolyte layer and the negative foil are wound to make the capacitor be a cylinder, and the positive guide needles and the negative guide needles protrude from the cylinder, respectively.2014-02-06
20140036415CONDUCTIVE POLYMER COMPOSITE AND PREPARATION AND USE THEREOF - The invention pertains to a conductive polymer composite comprising: 2014-02-06
20140036416ELECTRODE FOIL AND METHOD FOR MANUFACTURING SAME, AND CAPACITOR - An electrode foil including a substrate made of metal material, a first layer made of metal oxide and formed on the substrate, a second layer made of TiNxOy (x>y>0) and formed on the first layer, and a third layer made of TiNxOy (02014-02-06
20140036417SOLID-STATE ELECTROLYTIC CAPACITOR MANUFACTURING METHOD AND SOLID-STATE ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor having grooves provided in a valve-acting metal substrate that includes a porous surface part and a non-porous body part, the bottoms of the grooves being non-porous. The valve-acting metal substrate is divided into a plurality of unit regions by the grooves, and define cathode layer formation parts in the porous surface parts for each unit region. A dielectric layer covers the surfaces of the cathode layer formation parts of the valve-acting metal substrate and the grooves between the cathode layer formation parts. A solid electrolyte layer and a cathode extraction layer cover the surface of the dielectric layer, thereby providing a sheet in which a plurality of solid electrolytic capacitor elements are prepared integrally with the grooves interposed therebetween. The sheet is cut at the grooves, and a dielectric layer is formed on the cut surfaces located around the cathode layer formation parts.2014-02-06
20140036418Power switchgear cabinet of a device for producing electric energy - The invention relates to a power switch cabinet of a device for producing electric energy. The technical object of obtaining optimum scalability and cooling of a power switch cabinet despite little space being required is achieved according to the invention in that the power switch cabinet has a machine connection, a power module and a mains connection, wherein the power module has a machine converter, a mains converter, a direct voltage intermediate circuit and a chopper, and the arrangement of the components substantially corresponds to the direction of the power flow.2014-02-06
20140036419Cart with Cable Management System - A cart with one or more of a power supply system that includes an outlet box and a plurality of flexible receptacles, a bi-layer shelf, a positionable cable routing tray, and a removable cable management module.2014-02-06
20140036420PROTECTIVE COVER STRUCTURE - A protective cover structure includes a main body with an accepting space to form a frame structure. A lid engages with the main body at the bottom of the frame through corresponding buckling elements. A groove is respectively disposed on the peripheries of upper and lower surfaces of the main body, where the groove of the lower surface is used for coupling and securing a decorative bottomplate, and the groove of the upper surface couples with an annular decorative body. In use, a user first removes the lid from the main body, inserts an electronic device, and then tightly covers the lid onto the main body, thereby securely receiving the electronic device in the main body to protect the electronic device, and providing decorative effects through the configurations of the decorative bottom plate and decorative body.2014-02-06
20140036421POWER CONNECTOR - An apparatus may include a conductive wire and a plug. The plug may be electrically and mechanically coupled to the conductive wire. The plug may include a non-conductive overmold, an electrically conductive barrel, and a lip. The non-conductive overmold may surround the conductive wire. The electrically conductive barrel may extend from the overmold, and may have a width that is smaller than a width of the overmold. The lip may extend from the barrel in a direction substantially perpendicular to a direction in which the barrel extends from the overmold. A distance from an outer portion of the lip to an opposite outer portion of the lip may be at least twice a length that the barrel extends from the overmold.2014-02-06
20140036422CASE AND ELECTRONIC DEVICE - A case including a casing body formed with an opening and a cover attached to the opening to be capable of opening and closing. The case further including a first grip tab that extends from the cover towards the opening inner side and a second grip tab that includes an anchor portion that anchors in the cover opening direction to an anchored-to portion provided to the casing body. The second grip tab disposed facing towards the first grip tab and resiliently supported by the first grip tab to be capable of approaching and moving away from the first grip tab such that an insertion portion opened in the opening direction is formed between the first grip tab and the second grip tab and such that an anchored state of the anchor portion to the anchored-to portion is released by the second grip tab moving away from the first grip tab.2014-02-06
20140036423HINGE DEVICE AND ELECTRONIC APPARATUS USING THAT HINGE DEVICE - A hinge device which rotatably connects a display to a keyboard part comprised of a hinge pivot member which attaches the keyboard part and a bracket which is attached to the display and holds the hinge pivot member and of a hinge cover, wherein if making the bracket hold the hinge pivot member, then attaching the hinge cover to the pivot of the hinge pivot member and making it slide in the axial direction to engage it with the housing of the display part and attaching the front cover to the display part in this state, a projecting part which is provided at the front end part of the front cover is inserted in the hinge cover and return of the hinge cover in the axial direction is prevented, so the front cover and hinge cover can be simply removed at the time of maintenance of the display part.2014-02-06
20140036424MOUNTING STRUCTURE OF REMOVABLE UNIT AND ELECTRONIC APPARATUS PROVIDED WITH THAT MOUNTING STRUCTURE - The mounting structure provided with pluralities of guide ribs having a fixed part and a moving part at both sides of a mounting region of an optical disk unit in an electronic apparatus, the fixed part projects out from a bottom surface of the mounting region along a direction of insertion of the optical disk unit into the mounting region and the moving part which swingably extends from the downstream side of the fixed part, the vicinity of a front end part of the moving part of at least one of the plurality of guide ribs which are provided at one side of the mounting region being provided with a projection which engages with a screw hole which is provided in advance in the optical disk unit, so that the optical disk unit is locked by the projection when the optical disk unit is completely housed in the mounting region.2014-02-06
20140036425ELECTRONIC EQUIPMENT - A collapsible electronic equipment is provided, including a first part, a first rotary mechanism, a joint element, and a second part. The first part has a first side and a second side. The first rotary mechanism is disposed on the first part, and the joint element is disposed on the first rotary mechanism. The second part is pivotally connected to the joint element. When the second part is situated on a first side/a second side of the first part, the joint element or the second part contacts the first side/the second side of the first part.2014-02-06
20140036426ELECTRONIC APPARATUS - An electronic apparatus 2014-02-06
20140036427COMPONENT HAVING AN ELECTRODE CORROSION PREVENTING LAYER AND A METHOD FOR MANUFACTURING THE COMPONENT - Provided is a method for manufacturing a component having an electrode corrosion preventing layer by performing the low-cost, high-yield and highly reliable soldering, can be provided. The method for manufacturing a component includes: a step of preparing component 2014-02-06
20140036428METHOD OF MOULDING - A method comprising: patterning one or more electrical layers on a substrate; shaping the patterned substrate into a 3-dimensional contour, wherein the contour including a significant change in gradient in or adjacent to one or more sensing areas of the electrical layer, and over-moulding the shaped substrate, wherein degradation of a trace in the electrical layer at or adjacent to the one or more sensing areas during shaping and/or over-moulding is substantially minimised based on the width of the trace, the thickness or number of layers of the trace, the bending radius of the trace, the material of the trace, and/or a primer over layer on the trace.2014-02-06
20140036429COVER FOR A TABLET COMPUTING DEVICE - A cover for a tablet computing device is provided. The cover includes a first panel extending from the first cover segment, a second panel extending from the first panel, and a third panel extending from the second panel. The panels are structured to pivot relative to the adjacent panels. The cover also includes at least a first magnetic component disposed in the first cover segment and a second magnetic component disposed in the third panel. The first panel, second panel, and third panel are each pivotable relative to the first cover segment to form a first stable position and a second stable position.2014-02-06
20140036430POSITIONABLE STAND FOR COMPUTING DEVICE - A stand assembly for a computing device is provided. The stand assembly includes a stand and a coupling mechanism to couple the stand to a rear face of the computing device. The coupling mechanism is structured to enable the stand to be moved under bias into multiple positions, including a first position in which the stand extends outward from the rear face at a first angle and retains the computing device upright at a first orientation, and a second position in which the stand extends outward from the rear face at a second angle and retains the computing device upright at a second orientation. The coupling mechanism is structured to return the stand, from at least each of the first position and the second position, into a closed position that abuts the rear face of the computing device when the coupling mechanism is relaxed.2014-02-06
20140036431PIEZOELECTRIC ACTUATOR AND ELECTRONIC DEVICE HAVING PIEZOELECTRIC ACTUATOR MOUNTED THEREON - A piezoelectric actuator comprises: a piezoelectric ceramic vibrator (2014-02-06
20140036432COMPOSITE CARD-TYPE STRUCTURE - The present invention relates to a composite card-type structure comprising at least an integrated circuit module and a carrier: the carrier's height exactly matches a card reader's height and a composite connector's metal contacts are securely and electrically connected to a card reader when the carrier with the integrated circuit module mounted is inserted into a card reader; a support pad which is removed out of the carrier and toward the carrier's lower surface has its length exactly matching the height of a USB port in one computer in order to reliably sustain a supporting segment and make the composite connector's metal contacts electrically connected to the USB port when a driven structure is shifted to a default direction under effect of a user's force.2014-02-06
20140036433AIRFLOW GUIDING MEMBER AND ELECTRONIC DEVICE HAVING THE AIRFLOW GUIDING MEMBER - An electronic device includes a circuit board, a number of memory cards installed on the circuit board, and an airflow guiding member installed on the circuit board. The airflow guiding member includes a first side plate and a partition plate. The first side plate and the partition plate cooperatively bound a first airflow channel. The memory cards are received in the first airflow channel. An air inlet is defined in an end of the airflow guiding member and communicating with the first airflow channel. A number of spacing pieces is formed in the air inlet and aligns with the memory cards.2014-02-06
20140036434SERVER AND DRAWER LIFTING DEVICE - A server includes a casing, a bottom plate, a first hard disk module, a second hard disk module, and a lifting device. The bottom plate is disposed in the casing and configured to be sliding relative to the casing. The first hard disk module is movably disposed on the bottom plate. The first hard disk module includes a track. The second hard disk module is fixed on the bottom plate and disposed behind the first hard disk module. The lifting device moves up the first hard disk module when the bottom plate is pulled out of the casing, and the lifting device moves down the first hard disk module when the bottom plate is pushed into the casing. A drawer lifting device is also disclosed.2014-02-06
20140036435STORAGE SYSTEM HAVING A HEATSINK - A storage system sized to fit within a standard magnetic hard disk drive (HDD) form factor. The storage system includes a solid state disk (SSD) and a cooling means thermally coupled to the body of the SSD. The components of the SSD occupy a smaller volume of space than magnetic HDD's. In particular, while the SSD has width and length dimensions matching those of the HDD form factor, the SSD has a height dimension that is less than the HDD form factor. Accordingly, the volume of space between the HDD form factor height and the SSD height is beneficially occupied by the cooling means. The storage system can be then be used as a direct replacement for HDD as it can fit within HDD bays configured for the standardized HDD form factor.2014-02-06
20140036436DOCKING STATION FOR TABLET COMPUTER - An assembly includes a tablet computer and a docking station. The tablet computer includes a first connection hole defined on a bottom edge of the tablet computer. The docking station includes a base and a supporting seat. The base includes a base body and a control module. The supporting seat is pivotally mounted on the base body. The supporting seat includes a supporting portion. A connecting post is formed on the supporting portion. The connecting post is electrically connected to the control module. The supporting portion supports the tablet computer thereon with the connecting post inserted in the first connecting hole. The connecting post is electrically connected to the tablet computer via the first connecting hole, and the control module is configured to control the tablet computer.2014-02-06
20140036437CHARGING DOCKING SYSTEM - Systems and methods provide power to a device via a dock. A mounting base may include a mounting component, including a receiving area configured to removably receive a mating device at a plurality of orientations within a plane, wherein the mounting component comprises one or more indexing members and the mating device comprises one or more indexing elements, or the mating device comprises one or more indexing members and the mounting component comprises one or more indexing elements, the indexing members and elements configured to engage each other to align the mating device with the mounting component in one or more rotational orientations on said plane. A detector, configured to detect the presence of the mating device, and a driver circuit may be included. A device may be configured to control power sourced to the mating device by the driver circuit after the detector detects the mating device.2014-02-06
20140036438COVER FOR A TABLET COMPUTING DEVICE HAVING RETAINING MECHANISMS - A computing device accessory is provided. The computing device accessory includes a first cover segment that has an inner surface and an exterior surface. The interior surface includes a recessed region to receive a base of a tablet computing device. The computing device accessory also includes a magnetic component provided with the first cover segment, where the magnetic component is positioned to actively retain the tablet computing device when the base of the tablet computing device is received in the recessed region.2014-02-06
20140036439ELECTRONIC DEVICE - An electronic device includes two opposite sidewalls, a first end wall, and a second end wall. A first partition plate and a second partition plate are connected between the sidewalls. First fans are installed to a middle of the second partition plate, and Second fans are installed to two opposite ends of the second partition plate. An air duct is installed between the second partition plate and the second end wall, aligning with the first fans. Each second fan blows in a direction opposite to that each first fan does. The first fans generate airflow entering between the first partition plate and the second partition plate from the first end wall, and the first partition plate to exhaust through the second end wall. The second fans generate airflow entering between the first partition plate and the second partition plate from the second end wall.2014-02-06
20140036440ELECTRONIC APPARATUS - Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation.2014-02-06
20140036441Dynamic Compensation of Airflow in Electronics Enclosures with Failed Fans - An approach is provided in which a cooling manager detects a failed fan included in an electronic enclosure. The electronic enclosure includes multiple fans that each cool different component areas in the electronic enclosure. The cooling manager selects an airflow compensator that corresponds to a functioning fan included in the electronic enclosure, which includes a fixed perforated member and a movable perforated member. In turn, the cooling manager adjusts the selected airflow compensator to redirect a portion of airflow generated by the functioning fan to the component area corresponding to the failed fan.2014-02-06
20140036442OUTDOOR STACKABLE TELECOMMUNICATIONS EQUIPMENT CABINET FAMILY WITH FLEXIBLE THERMAL AND INTERFACE MANAGEMENT AND METHOD OF DEPLOYING THE SAME - An outdoor stackable telecommunications equipment cabinet family and a method of deploying an outdoor telecommunications equipment cabinet. In one embodiment, the family includes: (1) a plurality of selectable cabinet modules and (2) a plurality of selectable plinth modules, at least one of the plurality of selectable cabinet modules and one of the plurality of selectable plinth modules configured to be selected and stacked to form an outdoor telecommunications equipment cabinet that includes an air filter and at least one fan.2014-02-06
20140036443GRAPHIC CARD WITH MULTIPLE FANS AND CONTROLLING METHOD THEREOF - A graphic card with multiple fans and a controlling method thereof are provided. In the controlling method, the temperature of a first component and a second component of the graphic card is detected. A rotating speed of a first fan of the graphic card is adjusted according to the temperature of the first component. The rotating speed of the second fan of the graphic card is adjusted according to the temperature of the second component or the temperature of the first component and the second component.2014-02-06
20140036444ELECTRONIC DEVICE - In an electronic device, a substrate mounting unit is provided at a front side inside a housing, and contains a plurality of electronic substrates under a state where faces of any two mutually adjacent ones of the plurality of electronic substrates are opposite to each other. A power supply unit is provided at a position which is located at a rear side inside the housing and is located behind the substrate mounting unit, and supplies the plurality of electronic substrates with electric power. A power-supply fan unit, which is provided at a rear side of the power supply unit, takes in air outside the housing from the power-supply air intake opening, and discharges the taken-in air to an outside of a rear side of the housing via the substrate mounting unit and the power supply unit.2014-02-06
20140036445HEAT SINK AND ELECTRONIC APPARATUS PROVIDED WITH HEAT SINK - A heat sink for cooling a heat generating member, provided with a first cooling part which cools the peripheral edge part of the heat generating member and a second cooling part which cools the center part of the neat generating member, the first cooling part is equipped with a first base member having first fins on the top surface thereof and a recess at the bottom surface thereof, the second cooling part is equipped with a second base member which can be accommodated in the recess, a slide member which is provided on the top surface of the second base member and which is inserted in a through hole which is provided in the recess, second fins which are provided on the free end of the slide member, and a cooling water passage which is provided inside of the second base member and which is supplied with cooling water.2014-02-06
20140036446ARRANGEMENT FOR COOLING ELECTRONIC COMPONENTS AND/OR ASSEMBLIES - Components and/or assemblies are applied on a substrate. The substrate has a populating side and a heat sink side, to which a heat sink is fitted. The populating side is provided with a cover, which together with a heat sink on the heat sink side of the substrate forms a type of housing for the populated substrate. Between substrate and heat sink, a guide channel for a cooling medium (e.g. air, etc.) is provided and the substrate has an opening. A fan is fitted above the opening in such a way that a cooling flow of the cooling medium generated by the fan is conducted through the guide channel on the heat sink side of the substrate and over the populating side of the substrate and thus over the mounted components and/or assemblies. The heated cooling medium is then conducted away with the aid of the cover.2014-02-06
20140036447DIELECTRIC HEAT-TRANSFER FLUID - Provided is a use of a vegetable oil high in monounsaturates as dielectric and heat-transfer fluid in a device for the generation, storage, conversion and/or distribution of electrical energy.2014-02-06
20140036448DISPLAY APPARATUS - A display apparatus and a method of spreading heat in the display apparatus are provided. The display apparatus includes: a display panel which display an image on a front surface thereof; an intermediate panel disposed on a rear surface, opposite the front surface, of the display panel; and a heat spreader disposed on the rear surface of the intermediate panel and which spreads heat, the heat spreader extending in a longitudinal direction from a first position of the rear surface of the intermediate panel in which the heat is present to a second position of the rear surface of the intermediate panel.2014-02-06
20140036449Method for limiting the variation in the temperature of an electrical component - A method for limiting temperature variation of an electrical component includes detecting a switch from passive to active states and, in response, varying a potential difference between capacitor electrodes from a first value to a second value, the electrodes being mechanically and electrically insulated from each other by a layer of electrocaloric dielectric, and in response to detecting a switch from active to passive states, varying the potential difference between the electrodes from the second to the first value.2014-02-06
20140036450PASSIVE COOLING ENCLOSURE SYSTEM AND METHOD FOR ELECTRONICS DEVICES - An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat sink configured to be thermally coupled to at least one cabinet. When the at least one cabinet is thermally coupled to the at least one heat sink, the at least one heat sink draws heat from the at least one cabinet.2014-02-06
20140036451HEAT SINK ASSEMBLY - A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs.2014-02-06
20140036452MODULAR EQUIPMENT RACK SYSTEM FOR DATA CENTER - Various technologies described herein pertain to racking equipment in a data center. A modular equipment rack system can include an upper track, a lower track, a vertical support, a power and network distribution unit, and a tray. The upper track and the lower track can respectively include incrementally spaced mounting locations at which the vertical support and the power and network distribution unit can be attachable. The tray can be attachable to the vertical support and the power and network distribution unit when the vertical support is attached to the upper track at a first upper mounting location and attached to the lower track at a corresponding first lower mounting location, and the power and network distribution unit is attached to the upper track at a second upper mounting location and attached to the lower track at a corresponding second lower mounting location.2014-02-06
20140036453POWER ELECTRONIC DEVICE AND AN ALIGNMENT DEVICE FOR THE POWER MODULE - An alignment device for a power module of a power electronic device is provided, which may be used for aligning the power module while the power module being plugging to or from a rear mounting part of a cabinet of the power electronic device. The rear mounting part is disposed at an inner side of a back plate of the cabinet, the alignment device comprises a first connector disposed on the power module; guide rail units disposed on inner sides of a left side plate and a right side plate of the cabinet; a second connector disposed on the rear mounting part; and a guide device for limiting an offset of the power module moving along the guide rail unit.2014-02-06
20140036454BVA INTERPOSER - A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.2014-02-06
20140036455SYSTEM AND METHOD FOR ADDITIVE MANUFACTURING OF AN OBJECT - A method of additive manufacturing of a three-dimensional object is disclosed. The method comprises sequentially forming a plurality of layers each patterned according to the shape of a cross section of the object. In some embodiments, the formation of at least one of the layers comprises performing a raster scan to dispense at least a first building material composition, and a vector scan to dispense at least a second building material composition. The vector scan is optionally along a path selected to form at least one structure selected from the group consisting of (i) an elongated structure, (ii) a boundary structure at least partially surrounding an area filled with the first building material, and (iii) an inter-layer connecting structure.2014-02-06
20140036456TAPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME - A tape package includes a base substrate, an input lead line disposed on the base substrate, the input lead line including a main input lead line and a sub input lead line, the sub input lead line branching off and extending from the main input lead line, an integrated circuit chip electrically connected to the sub input lead line, and a sealing part fixing the integrated circuit chip on the base substrate and overlapping a portion of the main input lead line.2014-02-06
20140036457ARRANGEMENT HAVING BUSBARS - An arrangement includes at least one flexible circuit carrier having at least one conducting track. At least one busbar forms a composite with the flexible circuit carrier. The conducting track is welded to the busbar.2014-02-06
20140036458ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a sheet display, a circuit board, and a touch sensor. The housing includes a wall opposite an opening. The sheet display includes a first surface and a second surface. The first surface includes a display screen configured to expose through the opening. The circuit board is configured to connect to the sheet display via a flexible wiring board. The circuit board is between the sheet display and the wall, and configured to control the sheet display. The touch sensor includes a portion between the sheet display and the circuit board. The touch sensor faces the second surface of the sheet display, and is configured to detect an operation on the display screen.2014-02-06
20140036459MODULAR ELECTRONIC HEADER ASSEMBLY AND METHODS OF MANUFACTURE - A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.2014-02-06
20140036460LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD - A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.2014-02-06
20140036461FLEXIBLE LED DEVICE FOR THERMAL MANAGEMENT AND METHOD OF MAKING - Provided is a flexible light emitting semiconductor device (2014-02-06
20140036462Multiple Surface Integrated Devices on Low Resistivity Substrates - The present invention relates to a device with portions of the device on plural substrate surfaces. The device includes a low resistivity substrate having first and second surfaces with a first electrically-conductive device component disposed over a first surface. An intermediate electrically-insulating layer may be disposed between the electrically-conductive component and the low resistivity substrate. A second electrically-conductive component is disposed over the second surface of the low resistivity substrate. A cavity formed in the low resistivity substrate is at least partially filled with a high resistivity material. One or more electrically-conducting pathways are formed in the high resistivity material electrically connecting the first electrically conductive component and the second electrically-conductive component to form a device. Exemplary devices include inductors, capacitors, antennas and active or passive devices incorporating such devices. Vertically integrated device systems can be formed using the device.2014-02-06
20140036463ELECTRONIC CIRCUIT BOARD, ASSEMBLY AND A RELATED METHOD THEREOF - An apparatus includes a substrate and a plurality of conductive traces formed on the substrate. The conductive traces are doped with a concentration of an aluminum material forming a protective layer as a portion of the plurality of conductive traces to inhibit oxidation. A set of first metal contact pads are formed in contact with the plurality of conductive traces. The substrate, the plurality of conductive traces and the set of first metal contact pads define an electronic circuit board configured to operate at a temperature greater than 200 degrees Celsius. A high operating temperature electronic device is configured in electrical communication with the conductive traces defining an assembly configured to operate at a temperature greater than 200 degrees Celsius.2014-02-06
20140036464Integrated System and Method of Making the Integrated System - A system and method of manufacturing a system are disclosed. An embodiment of the system includes a first packaged component comprising a first component and a first redistribution layer (RDL) disposed on a first main surface of the first packaged component, wherein the first RDL includes first pads. The system further includes a second packaged component having a second component disposed at a first main surface of the second packaged component, the first main surface having second pads and a connection layer between the first packaged component and the second packaged component, wherein the connection layer connects a first plurality of the first pads with the second pads.2014-02-06
20140036465PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME - A packaging substrate includes a copper foil substrate, a sputtering copper layer, a dielectric layer, a plurality of electrically conductive connection points, and an electrically conductive pattern layer. The sputtering copper layer is formed on the copper foil substrate. The electrically conductive connection points are formed on a surface of the sputtering copper layer, which is away from the copper foil substrate. The dielectric layer is sandwiched between the electrically conductive pattern layer and the sputtering copper layer. A plurality of first blind via are formed in the first dielectric layer. The electrically conductive pattern layer includes a plurality of electrically conductive traces and a plurality of connection pads. Each electrically conductive connection point is electrically connected to the electrically conductive trace by the first blind via.2014-02-06
20140036466CASED ELECTRICAL COMPONENT - The invention relates to a cased electrical component comprising a carrier substrate (2014-02-06
20140036467CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A ceramic multilayer substrate includes stacked ceramic layers; internal conductors which are stacked with one of the ceramic layers therebetween, and are arranged such that at least a portion of the internal conductors overlap each other in a stacking direction; and a constraining layer which is arranged on a layer different from layers on which the internal conductors are located. The constraining layer overlaps, in the stacking direction, an internal conductor-overlapping region where at least two of the internal conductors overlapping each other in the stacking direction, has a planar area not more than twice the planar area of the internal conductor-overlapping region, and contains an unsintered inorganic material powder. The constraining layer has a planar area not more than one-half the planar area of the ceramic layers. The constraining layer is arranged so as to entirely cover the internal conductor-overlapping region.2014-02-06
20140036468DISPLAY DEVICE, AND METHOD AND APPARATUS FOR MOUNTING DRIVER IC - A display device includes an upper substrate on a lower substrate, a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate, a plurality of bumper units along edges of the driver IC, and a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed.2014-02-06
20140036469Protection Device for Mobile Apparatus with Bluetooth Earphone - A protection device includes a frame unit for protecting a mobile apparatus, a support seat mounted on the frame unit, a bluetooth earphone unit mounted on the support seat, and a mobile power unit mounted on the frame unit. The frame unit includes a main frame for mounting the mobile apparatus, and a mounting board mounted on the main frame for mounting the support seat and the mobile power unit. Thus, the mobile apparatus is received in the main frame of the frame unit, the bluetooth earphone unit is mounted on the support seat, and the mobile power unit and the support seat are mounted on the mounting board of the frame unit, so that the mobile apparatus, the mobile power unit and the bluetooth earphone unit are supported and carried by the frame unit.2014-02-06
20140036470MULTI CONNECTOR INTERCONNECT SYSTEM - The subject invention is directed to a new and useful line replaceable unit (LRU) including an LRU case defining an interior compartment for housing critical function circuit card assemblies and including a back plane wall and opposed interface wall. At least one critical function circuit card assembly (CCA) is housed within the LRU case. The critical function CCA includes an input output connector mounted in proximity to the interface wall, as well as a backplane connector. The LRU includes a backplane CCA operatively connected to each backplane connector of the at least one critical function CCA. The backplane CCA is configured and adapted to provide operative communication among multiple critical function CCA's. The critical function CCA's can be mounted to the LRU case proximate the interface wall and the backplane wall to be mechanically and electrically isolated from one another except for connections provided by the backplane CCA.2014-02-06
20140036471Thin Leadframe QFN Package Design of RF Front-Ends for Mobile Wireless Communication - Systems and methods are disclosed herein for a low cost, compact size, and thin half-etched leadframe quad-flat no-leads (QFN) package that integrates RF passive elements in the QFN leadframe for linearized PA design and RF FEMs. The integrated RF passive elements in the QFN leadframe may include RF inductors (e.g., meanders lines or spirals) for amplifier bias or RF matching, extension bar of the ground paddle for inter-stage matching or jumper pads for connection. The integrated RF passive elements may also include transmission lines for output power matching, coupled line structures such as RF couplers, RF divider or combiner realized using transmission lines with proper impedance and length, jumper pads for adjusting the bond wire length, etc. The RF parameters of the integrated passive elements are adjustable using different length and number of wire bond for fine tuning the performance of the PAM or the RF FEM.2014-02-06
20140036472INDICATING INSTRUMENT DIAL PLATE - An indicating instrument dial plate includes a substrate that is formed in a plate shape, made of a transparent or semi-transparent material, has a front face including a hairline-treated surface and has a rear face which is irradiated with a dial plate illumination light from a light source inside an indicating instrument, and a half-mirror layer that is formed in a shape of a thin film covering the hairline-treated surface by sputtering and adapted to allow a portion of external light incident to the front face of the substrate from the outside of the indicating instrument to be transmitted into the substrate and to allow a portion of the external light to be reflected. The hairline-treated surface is made by forming fine line-shaped grooves on the front face of the substrate. The hairline-treated surface includes hairline-patterned unevenness which diffuses the external light.2014-02-06
20140036473Streetlight Controllers - The subject matter included in this disclosure can be embodied in an apparatus that includes a computing device having memory and a processor. The processor can be configured to establish a wireless connection with a streetlight controller that communicates with a streetlight, initiate transmission of a set of parameters related to commissioning the streetlight, and receive, from the controller, status and identification information associated with the streetlight.2014-02-06
20140036474Lighting assembly and socket - A lighting assembly (2014-02-06
20140036475FRAGRANCE DIFFUSER - The present disclosure generally relates to a decorative fragrance diffuser and methods of use thereof. The decorative fragrance diffuser may be comprised of a base and a light source mounted to the base. The decorative fragrance diffuser may further comprise an inner glass surrounding the light source and an interchangeable outer glass surrounding the inner glass, whereby an annular area is formed between the inner and outer glass. The decorative fragrance diffuser may further comprise a custom insert located between the inner glass and the outer glass. The decorative fragrance diffuser may further comprise a top disposed above the inner glass, the top including a basin for holding a fragrant element. The method of using the decorative fragrance diffuser may comprise following instructions or a template to create the custom insert with suitable dimensions.2014-02-06
20140036476Backlightmodule, Assembly Method and Assembly Fixture for Backlightmodule - The present invention provides a backlight module, assembly method and assembly fixture for backlight module. The backlight module comprises an optical component set and a back plate. Optical component set is disposed in a stacked manner, the back plate comprises at least two independent back plate elements for clamping respectively at least a side wall of the optical component set. Each back plate element comprises a top wall, a bottom wall and a side wall connecting the top wall and the bottom wall. Each back plate element is assembled onto an optical component set from a side and clamping the optical component set with the top wall and the bottom wall of the back plate element. The assembly of the back plate can be performed on an assembly fixture to improve the assembly efficiency of backlight module.2014-02-06
20140036477BACKLIGHT UNIT AND DISPLAY APPARATUS USING THE SAME - A backlight unit and a display apparatus using the same are disclosed. The backlight unit includes a first reflector, a second reflector partially having an inclined surface, a plurality of light sources disposed between the first reflector and the second reflector, and a third reflector disposed between adjacent light sources.2014-02-06
20140036478VIEWING ANGLE SYSTEM FOR BACKLIGHTED DISPLAYS - An apparatus to widen the light dispersion pattern of a light source shining through an overlay window from the viewing side of an electrical computer system. The overlay window is coupled to a panel of the system. The overlay window includes a transparent material, which has a first surface facing the light source and a second surface facing away from the light source to define a viewing side. An opaque material can be disposed on the first surface to partially cover the first surface to form a viewing window. A first diffusing mechanism is disposed on the first surface, and a second diffusing mechanism is disposed on the second surface. In response to the passage of the light output through the viewing window, the light dispersion pattern of the light output from the viewing side of the overlay window has a viewing angle of up to about 180 degrees.2014-02-06
20140036479BACKLIGHT ASSEMBLY WITH A REFLECTIVE MEMBER COVERING INTERFACE BETWEEN SUBSTRATE UNITS - A backlight assembly capable of reducing light loss is presented. The backlight assembly includes a plurality of substrate units and a plurality of reflective members on the substrate units arranged to form an adjacent area where two reflective members are closest to each other. The adjacent area is on one of the substrate units. A display device incorporating the backlight assembly is also presented.2014-02-06
20140036480LIGHTING UNIT AND DISPLAY DEVICE HAVING THE SAME - Provided are a lighting unit and a display device including the same. The lighting unit includes a bottom cover having a plurality of sidewalls, light emitting modules each including a board disposed on the bottom cover and a plurality of light emitting diodes mounted on the board, and a light-transmitting resin layer covering the bottom cover and the board.2014-02-06
20140036481HANDY RIVETER DEVICE - A handy riveter device includes a fastening screw, a casing, a handlebar and a pulling member. The casing has a left cover and a right cover connecting to each other. The casing has a receiving space, an attaching face and a top face. A hole is opened on the casing and communicating with the receiving space. The pulling member is slidably assembled into the receiving space. The pulling member has an engaging groove and a resisting block. An elastomer abuts against the pulling member and the receiving space. The handlebar is assembled into the casing partially and a pivoting rod passes through the casing and the handlebar. Under this arrangement, a user assembles the fastening screw into an articles and the handle bar and sets the handy riveter device on the articles and pushes the handlebar to fasten the articles via the fastening screw.2014-02-06
20140036482LIGHTED POWER TOOL - A power tool system includes a tool body with a motor having an output member that drives an accessory. The output member defines an output member axis. An end effector is coupled for rotation with the output member relative to the tool body. The end effector is configured to retain the accessory. A light source is disposed on the end effector. A consumable tool, such as a holesaw, is removably attachable to the end effector, and has an illumination opening configured to be substantially aligned with the light source. The holesaw may have a generally cylindrical side wall and a base wall that defines a central opening for receiving an arbor, an aperture spaced radially outward by a first distance for receiving a projection on an arbor and an illumination opening spaced radially a second greater distance2014-02-06
20140036483DECORATIVE LIGHT STRING FOR ARTIFICIAL LIGHTED TREE - A decorative light string including a first group of light elements electrically connected in parallel to each other, a second plurality of light elements electrically connected in parallel to each other, and a third plurality of light elements electrically connected in parallel to each other. The first, second, and third groups of lights are electrically connected in series. A first wire stabilizer is located between the first group of lights and the second group of lights, and a second wire stabilizer is located between the second group of lights and the third group of lights. The first and second wire stabilizers secure wire ends forming first and second gaps in the wiring of the light string.2014-02-06
20140036484Combination planter box and saucer with internal lighting - An illumination system is provided for illuminating a planter box used to provide lighting for walkways, stairs, decks and the like. Indirect lighting is provided for illuminating the planter box with up-lighting and the supporting surface for the planter box with down-lighting. In a preferred embodiment, each LED is solar powered and provides both indirect up-lighting and indirect down-lighting simultaneously.2014-02-06
20140036485FLASHLIGHT WITH USB CHARGER - A flashlight is provided. The flashlight includes a frame defined by a rail that extends around a central opening predominantly within a single plane, a mounting loop extending outboard of the frame on a first end, a planar circuit board disposed within the central opening. The plane of the circuit board coincident with the plane of the frame, an LED light disposed on the circuit board, where a light emitting end of the LED light extending through the frame on a second end of the frame opposite the first end. A rechargeable battery is disposed on the circuit board, a switch is provided that couples the battery to the LED light. An actuator of the switch extends through the frame between the first and second ends, a USB connector is disposed on the circuit board, the USB connector extends through the frame between the first and second ends and a battery charger is disposed on the circuit board that charges the battery via energy received through the USB connector.2014-02-06
20140036486SOLAR LIGHTING SYSTEM - The present invention discloses a solar lighting system comprising a solar cell assembly and a LED lighting assembly, so that solar energy utilization is more efficient.2014-02-06
20140036487Anchor device for securing blankets to the ground - A device for anchoring an object to a surface includes an elongated shaft having opposed distal and proximal end portions and a surface engagement member operatively associated with the distal end portion of the elongated shaft. The surface engagement member is adapted and configured for radial engagement with the surface. The device further includes an object engagement member operatively associated with the proximal end portion of the elongated shaft whereby the object engagement member adapted and configured for releasably engaging the object.2014-02-06
20140036488UNIVERSAL LIGHT EMITTING DIODE ILLUMINATION DEVICE AND METHOD - Disclosed is a method and apparatus for providing a light emitting diode and driving circuitry integrated into a component module that will retrofit common incandescent lightbulb applications. The disclosed embodiments will perform with high efficiency at a wide operating voltage range with a very small size allowing for the incorporation within the envelope and form of existing lightbulb bases. Therefore, a single universal LED light bulb module can be used to replace the dozens of conventional LED and incandescent lights currently being used. The electronic circuitries used to drive the LEDs are extremely compact and consequently can be incorporated in nearly any standard bulb base.2014-02-06
20140036489UNIVERSAL LIGHT EMITTING DIODE ILLUMINATION DEVICE AND METHOD - Disclosed is a method and apparatus for providing a light emitting diode and driving circuitry integrated into a component module that will retrofit common incandescent lightbulb applications. The disclosed embodiments will perform with high efficiency at a wide operating voltage range with a very small size allowing for the incorporation within the envelope and form of existing lightbulb bases. Therefore, a single universal LED light bulb module can be used to replace the dozens of conventional LED and incandescent lights currently being used. The electronic circuitries used to drive the LEDs are extremely compact and consequently can be incorporated in nearly any standard bulb base.2014-02-06
20140036490LIGHT ASSEMBLY - A light assembly (2014-02-06
20140036491END CAP AND A MANUFACTURING METHOD THEREOF - An end cap includes a body and a conductive terminal formed integrally with the body by injection molding. The body includes an inner annular wall to assemble with a lamp tube, the conductive terminal includes two electric connecting units and a pole-like conducting unit being in the inner annular wall and containing a longitudinal through-hole. Each electric connecting unit and the pole-like conducting unit are connected together by a joining unit and each electric connecting unit is extended out of the body from a joining unit. By inserting the end cap terminal, electricity is conducted by contact to transmit electric energy, forming a structure that can be assembled easily, parts thereof can be replaced and repaired by an ordinary person, and an electric connector thereof can rotate by 360 degrees to adjust an angle of irradiation. Moreover, the end cap is formed integrally and directly to simplify the manufacturing process.2014-02-06
20140036492LED LENS - A light modifier for an LED producing light about a central axis can reduce the appearance of a bright spot created by the LED. The light modifier comprises a lens defining an indentation at its outer surface, with the indentation having an angled side wall and an outer edge joining the side wall to the outer surface. The side wall is spaced from the LED and angled relative to the central axis such that light produced by the LED and striking the side wall is at least substantially internally reflected to pass through a light transmitting portion of the outer surface directly bordering the outer edge, forming a line of light around the indentation.2014-02-06
20140036493FIXTURES FOR LARGE AREA DIRECTIONAL AND ISOTROPIC SOLID STATE LIGHTING PANELS - Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.2014-02-06
20140036494Luminaire and illumination system - Disclosed is a luminaire having a light exit window (2014-02-06
20140036495Laser Luminaire - The laser luminaire consisting of one or more laser light sources (2014-02-06
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