| 06th week of 2015 patent applcation highlights part 18 |
| Patent application number | Title | Published |
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| 20150035131 | CHIP PACKAGE - According to an embodiment of the present invention, a chip package is provided. The chip package includes a substrate. A chip is disposed on the substrate. A stiffener is disposed on the substrate. The thermal conductivity of the stiffener is higher than the thermal conductivity of the substrate. | 2015-02-05 |
| 20150035132 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - In a method for manufacturing a semiconductor device according to the present invention, as shown in FIG. | 2015-02-05 |
| 20150035133 | ELECTRONIC MODULES AND METHODS OF MAKING ELECTRONIC MODULES - A method is described for making electronic modules includes molding onto a substrate panel a matrix panel defining a plurality of cavities, attaching semiconductor die to the substrate panel in respective cavities of the molded matrix panel, electrically connecting the semiconductor die to the substrate panel, affixing a cover to the molded matrix panel to form an electronic module assembly, mounting the electronic module assembly on a carrier tape, and separating the electronic module assembly into individual electronic modules. An electronic module is described which includes a substrate, a wall member molded onto the substrate, the molded wall member defining a cavity, at least one semiconductor die attached to the substrate in the cavity and electrically connected to the substrate, and a cover affixed to the molded wall member over the cavity. | 2015-02-05 |
| 20150035134 | 3DIC PACKAGES WITH HEAT DISSIPATION STRUCTURES - A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion not overlapped by the first die. A first Thermal Interface Material (TIM) is over and contacting a top surface of the first die. A heat dissipating lid has a first bottom surface contacting the first TIM. A second TIM is over and contacting the second portion of the second die. A heat dissipating ring is over and contacting the second TIM. | 2015-02-05 |
| 20150035135 | 3DIC Packages with Heat Sinks Attached to Heat Dissipating Rings - A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion extending beyond edges of the first die. A first Thermal Interface Material (TIM) is overlying and contacting a top surface of the first die. A heat sink has a first bottom surface over and contacting the first TIM. A second TIM is overlying and contacting the second portion of the second die. A heat dissipating ring is overlying and contacting the second TIM. | 2015-02-05 |
| 20150035136 | SEMICONDUCTOR DEVICE TO BE ATTACHED TO HEAT RADIATION MEMBER - A semiconductor device includes a semiconductor module and a pressing member pressing the semiconductor module to a heat radiation member. The semiconductor module includes heat generation elements generating heat by energization, three or more conductive members each of which mounted with at least one of the heat generation elements, and a molding part integrally molding the heat generation elements and the conductive members. The semiconductor module has a heat radiation possible region in which a forcing pressure by the pressing member is equal to or greater than a predetermined pressure. The conductive member mounted with the heat generation element disposed outside the heat radiation possible region has such a shape that at least a part of the conductive member is included in the heat radiation possible region. | 2015-02-05 |
| 20150035137 | SOLDER JOINT STRUCTURE, POWER MODULE, POWER MODULE SUBSTRATE WITH HEAT SINK AND METHOD OF MANUFACTURING THE SAME, AND PASTE FOR FORMING SOLDER BASE LAYER - There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member. | 2015-02-05 |
| 20150035138 | SEMICONDUCTOR DEVICE - A circuit pattern is bonded to a top surface of a ceramic substrate. A cooling body is bonded to an undersurface of the ceramic substrate. An IGBT and a FWD are provided on the circuit pattern. A coating film covers a junction between the ceramic substrate and the circuit pattern, and a junction between the ceramic substrate and the cooling body. A mold resin seals the ceramic substrate, the circuit pattern, the IGBT, the FWD, the cooling body, and the coating film etc. The ceramic substrate has higher thermal conductivity than the coating film. The coating film has lower hardness than the mold resin and alleviates stress applied from the mold resin to the ceramic substrate. The circuit pattern and the cooling body includes a groove contacting the mold resin without being covered with the coating film. | 2015-02-05 |
| 20150035139 | Copper Post Structure for Wafer Level Chip Scale Package - In a method for forming a packaging structure, a metal pad is formed on a semiconductor substrate, and a first polymer insulating layer is formed over the semiconductor substrate. An opening passing through the first polymer insulating layer is formed to expose a portion of the metal pad. A copper-containing material is deposited in the opening and over the first polymer insulating layer, thereby forming a copper-containing layer having a first thickness and a first width over the first polymer insulating layer. A conductive bump having a second width is formed over the copper-containing layer, in which the second width is smaller than the first width. An exposed portion of the copper-containing layer is etched using the conductive bump as a mask until the exposed portion is reduced to a second thickness, thereby forming a monolithic copper-containing structure. | 2015-02-05 |
| 20150035140 | WAFER SUPPORT SYSTEM FOR 3D PACKAGING - A method for handling and supporting a device wafer during a wafer thinning process and the resulting device are provided. Embodiments include forming a plurality of solder bumps on a first surface of a substrate having a first and a second surface; removing a portion from a periphery of the first surface of the substrate; forming a temporary bonding material on a first carrier; bonding the first surface of the substrate with the temporary bonding material of the first carrier; affixing the second surface of the substrate to a second carrier; and removing the temporary bonding material. | 2015-02-05 |
| 20150035141 | SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUFACTURING METHOD THEREOF - A semiconductor die package includes a semiconductor die, a film for improving die warpage bonded to a first face of the semiconductor die, a plurality of electrically conductive bumps formed on a second face of the semiconductor die, a substrate onto which the electrically conductive bumps of the second face of the semiconductor die are bonded to electrically connect the semiconductor die and the substrate, and a mold compound applied these components to form an exposed surface of the semiconductor die package that is coplanar with an exposed surface of the film. | 2015-02-05 |
| 20150035142 | MULTI-CHIP PACKAGE - A multi-chip package may include a package substrate, a connecting substrate, a plurality of semiconductor chips and a logic chip. The package substrate may have an opening. The connecting substrate may be arranged on an upper surface of the package substrate. The semiconductor chips may be stacked on an upper surface of the connecting substrate. The semiconductor chips may be electrically connected with the connecting substrate. The logic chip may be arranged in the opening. The logic chip may be electrically connected between the connecting substrate and the package substrate. Thus, the logic chip may not act as to increase a width of the multi-chip package. | 2015-02-05 |
| 20150035143 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package is disclosed. The package includes a semiconductor chip having a first surface and a second surface opposite thereto, at least one conductive pad adjacent to the first surface, and an opening extending toward the first surface from the second surface to expose the conductive pad. The caliber adjacent to the first surface is greater than that of the opening adjacent to the second surface. An insulating layer and a redistribution layer (RDL) are successively disposed on the second surface and extend to a sidewall and a bottom of the opening, in which the RDL is electrically connected to the conductive pad through the opening. A passivation layer covers the RDL and partially fills the opening to form a void between the passivation layer and the conductive pad in the opening. A fabrication method of the chip package is also disclosed. | 2015-02-05 |
| 20150035144 | HIGH DENSITY INTERCONNECT DEVICE AND METHOD - Embodiments that allow both high density and low density interconnection between microelectronic die and motherboard via Direct Chip Attach (DCA) are described. In some embodiments, microelectronic die have a high density interconnect with a small bump pitch located along one edge and a lower density connection region with a larger bump pitch located in other regions of the die. The high density interconnect regions between die are interconnected using an interconnecting bridge made out of a material that can support high density interconnect manufactured into it, such as silicon. The lower density connection regions are used to attach interconnected die directly to a board using DCA. The high density interconnect can utilize current Controlled Collapsed Chip Connection (C4) spacing when interconnecting die with an interconnecting bridge, while allowing much larger spacing on circuit boards. | 2015-02-05 |
| 20150035145 | MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE - Various embodiments include wafer level chip scale package (WLCSP) structures and methods of tuning such structures. In some embodiments, the WLCSP structure includes: a printed circuit board (PCB) trace connection including at least one PCB ground connection connected with a PCB ground plane; a set of ground solder balls each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground solder balls in the set of ground solder balls; a chip ground plane connecting the set of chip pads; and a signal interconnect interposed between two of the set of ground solder balls, the signal interconnect including: a signal trace connection electrically isolated from the PCB ground plane; a signal ball contacting the signal PCB trace connection; a chip pad contacting the signal ball, and a signal trace connection on a chip contacting the chip pad. | 2015-02-05 |
| 20150035146 | Through Package Via (TPV) - A through package vias (TPV), a package including a plurality of the TPVs, and a method of forming the through package via are provided. Embodiments of a through package via (TPV) for a package include a build-up film layer, a metal pad disposed over the build-up film layer, a polymer ring disposed over the metal pad, and a solder feature electrically coupled with the metal pad. | 2015-02-05 |
| 20150035147 | Fine Pitch stud POP Structure and Method - A fine pitch stud POP structure and method is disclosed. The studs are made in bonding pads on the top surface of a lower substrate, which greatly increase the height of the interconnection such as solder balls. In addition, the lower substrate and the upper substrate are connected by reflowing two solder balls on them separately. The two features make the diameter of the bonding balls greatly reduce and further make the pitch between two bonding balls on the lower substrate or the upper substrate greatly reduce, and then the fine pitch POP is achieved. | 2015-02-05 |
| 20150035148 | SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME - A semiconductor package including a lower package including a lower package substrate and a lower semiconductor chip, the lower package substrate including an interconnection part and a core part, the core part including connection vias exposed by openings, the lower semiconductor chip buried in the core part, an upper package including an upper package substrate, an upper semiconductor chip provided on the upper package substrate, and solder balls provided on a bottom surface of the upper package substrate, and an intermetallic compound layer at an interface between the connection vias and the solder balls in the openings may be provided. | 2015-02-05 |
| 20150035149 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - According to one embodiment, a semiconductor device includes a semiconductor substrate provided with a lower interconnect layer formed thereon, and having a device region and a mark formation region, a CNT via structure formed in the device region such that it contacts the lower interconnect layer, a first mark formed in the mark formation region, formed by embedding carbon nanotubes, and formed in the same layer as the CNT via structure, a second mark formed in the mark formation region of the semiconductor substrate, formed with no carbon nanotubes, and formed in the same layer as the CNT via structure and the first mark, and an interconnect layer formed on the CNT via structure and the first and second marks, and electrically connected to the CNT via structure. | 2015-02-05 |
| 20150035150 | CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL EXPANSION MATERIALS AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS - Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device includes a substrate having an opening that extends at least partially through the substrate. A conductive material having a positive coefficient of thermal expansion (CTE) partially fills the opening. A negative thermal expansion (NTE) having a negative CTE also partially fills the opening. In one embodiment, the conductive material includes copper and the NTE material includes zirconium tungstate. | 2015-02-05 |
| 20150035151 | Capping Layer Interface Interruption for Stress Migration Mitigation - A semiconductor device includes a substrate, a dielectric layer supported by the substrate, an interconnect adjacent the dielectric layer, the interconnect including a conduction material and a barrier material disposed along sidewalls of the interconnect between the conduction material and the dielectric layer, and a layer disposed over the interconnect to establish an interface between the conduction material, the barrier material, and the layer. A plate is disposed along a section of the interconnect to interrupt the interface. | 2015-02-05 |
| 20150035152 | Interconnection structures for semiconductor devices and fabrication methods of forming interconnection structures for semiconductor devices utilizing to-be-etched layer made of porous low-K dielectric material and a first hard mask layer made of nitrogen-doped silicon oxycarbide (SiOC(N)) - A method is provided for fabricating a semiconductor structure. The method includes providing a substrate; and forming a to-be-etched layer made of porous low dielectric constant material on one surface of the semiconductor substrate. The method also includes forming a first hard mask layer made of nitrogen-doped silicon oxycarbide (SiOC(N)) on the to-be-etched layer; and etching the first hard mask layer to have patterns corresponding to positions of subsequently formed openings. Further, the method includes forming the plurality of openings without substantial undercut between the to-be-etched layer and the first hard mask layer in the to-be-etched layer using the first hard mask layer as an etching mask; and forming a conductive structure in each of the openings. | 2015-02-05 |
| 20150035153 | REMOVING METAL FILLS IN A WIRING LAYER - The present invention relates to a semiconductor manufacturing method, a mask forming method and a semiconductor structure. According to one aspect of the invention, a semiconductor manufacturing method is provided, comprising: forming a metal wiring layer on a semiconductor substrate, the metal wiring layer comprising dielectrics and metal wires and metal FILLs within the dielectrics; removing the metal FILLs in the metal wiring layer completely to form the metal wiring layer without the metal FILLs. With the technical solution according to embodiments of the invention, undesirable influences due to metal FILLs will be eliminated. | 2015-02-05 |
| 20150035154 | PROFILE CONTROL IN INTERCONNECT STRUCTURES - The profile of a via can be controlled by forming a profile control liner within each via opening that is formed into a dielectric material prior to forming a line opening within the dielectric material. The presence of the profile control liner within each via opening during the formation of the line opening prevents rounding of the corners of a dielectric material portion that is present beneath the line opening and adjacent the via opening. | 2015-02-05 |
| 20150035155 | DUAL DAMASCENE STRUCTURE WITH LINER - A dual damascene structure with an embedded liner and methods of manufacture are disclosed. The method includes forming a dual damascene structure in a substrate. The method further includes reflowing a seed layer such that material of the seed layer flows into a via of the dual damascene structure. The method further includes forming a liner material on the material over or within the via of the dual damascene structure. The method further includes filling any remaining portions of the via and a trench of the dual damascene structure with additional material. | 2015-02-05 |
| 20150035156 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND MOUNTING METHOD OF SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device whose reliability can be improved. The semiconductor device includes: first wiring formed over a semiconductor substrate via a first insulating film; a second insulating film that includes an inorganic film covering the first wiring and that has a flat surface on which CMP processing has been performed; a third insulating film that is formed over the second insulating film and includes an inorganic film having moisture resistance higher than that of the second insulating film; and second wiring formed over the third insulating film. The thickness of the second wiring is 10 times or more larger than that of the first wiring, and the second wiring is located over the third insulating film without an organic insulating film being interposed between itself and the third insulating film. | 2015-02-05 |
| 20150035157 | SPACER FOR ENHANCING VIA PATTERN OVERLAY TOLERENCE - After formation of line openings in a hard mask layer, hard mask level spacers are formed on sidewalls of the hard mask layer. A photoresist is applied and patterned to form a via pattern including a via opening. The overlay tolerance for printing the via pattern is increased by the lateral thickness of the hard mask level spacers. A portion of a dielectric material layer is patterned to form a via cavity pattern by an etch that employs the hard mask layer and the hard mask level spacers as etch masks. The hard mask level spacers are subsequently removed , and the pattern of the line is subsequently transferred into an upper portion of the dielectric material layer, while the via cavity pattern is transferred to a lower portion of the dielectric material layer. | 2015-02-05 |
| 20150035158 | SEMICONDUCTOR DEVICES WITH ENHANCED ELECTROMIGRATION PERFORMANCE - Semiconductor devices with enhanced electromigration performance and methods of manufacture are disclosed. The method includes forming at least one metal line in electrical contact with a device. The method further includes forming at least one staple structure in electrical contact with the at least one metal line. The at least one staple structure is formed such that electrical current passing through the at least one metal line also passes through the at least staple structure to reduce electromigration issues. | 2015-02-05 |
| 20150035159 | SEMICONDUCTOR DEVICE HAVING BACKSIDE INTERCONNECT STRUCTURE ON THROUGH SUBSTRATE VIA AND METHOD OF FORMING THE SAME - A semiconductor device includes a through-substrate via extending from a frontside to a backside of a semiconductor substrate. The through-substrate via includes a concave or a convex portion adjacent to the backside of the semiconductor substrate. An isolation film is formed on the backside of the semiconductor substrate. A conductive layer includes a first portion formed on the concave or convex portion of the through substrate via and a second portion formed on the isolation film. A passivation layer partially covers the conductive layer. | 2015-02-05 |
| 20150035160 | PAD CONFIGURATIONS FOR AN ELECTRONIC PACKAGE ASSEMBLY - Embodiments of the present disclosure provide an electronic package assembly comprising a solder mask layer, the solder mask layer having at least one opening, and a plurality of pads coupled to the solder mask layer, wherein at least one pad of the plurality of pads includes (i) a first side, (ii) a second side, the first side being disposed opposite to the second side, (iii) a terminal portion and (iv) an extended portion, wherein the first side at the terminal portion is configured to receive a package interconnect structure through the at least one opening in the solder mask layer, the package interconnect structure to route electrical signals between a die and another electronic device that is external to the electronic package assembly, and wherein the second side at the extended portion is configured to receive one or more electrical connections from the die. | 2015-02-05 |
| 20150035161 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A singulated semiconductor structure comprises a molding compound; a first conductive post in the molding compound having a first geometric shape in a top view; a second conductive post or an alignment mark in the molding compound having a second geometric shape in a top view, wherein the second geometric shape is different from the first geometric shape. The second conductive post or an alignment mark can be positioned at the corner, the center, the edge, or the periphery of the singulated semiconductor structure. The second geometric shape can be any geometric construct distinguishable from the first geometric shape. The second conductive post or an alignment mark can be placed at an active area or a non-active area of the singulated semiconductor structure. | 2015-02-05 |
| 20150035162 | INDUCTIVE DEVICE THAT INCLUDES CONDUCTIVE VIA AND METAL LAYER - An inductive device that includes a conductive via and a metal layer are disclosed. A particular method of forming an electronic device includes forming a metal layer that contacts a surface of a substrate. The substrate, including the surface, is formed from a substantially uniform dielectric material. The metal layer contacts a conductive via that extends at least partially within the substrate. The metal layer and the conductive via form at least a portion of an inductive device. | 2015-02-05 |
| 20150035163 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same, including: placing a semiconductor element in a groove of a carrier; forming a dielectric layer on the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second of the carrier on a sidewall of the groove intact for the second portion to function as a supporting part. The present invention does not require formation of a silicon interposer, therefore the overall cost of the final product is much reduced. | 2015-02-05 |
| 20150035164 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and around a periphery of the side surfaces of the semiconductor element; forming a dielectric layer on the adhesive material and the active surface of the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second portion of the carrier on a side wall of the groove intact for the second portion to function as a supporting member. The present invention does not require formation of a silicon interposer, and therefore the overall cost of a final product is much reduced. | 2015-02-05 |
| 20150035165 | INTERCONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE - An interconnection structure of a semiconductor device is provided, where the interconnection structure is constructed in a semiconductor substrate. The interconnection structure includes a first through silicon via and a second through silicon via both penetrating the semiconductor substrate, and the first through silicon via is spaced from the second through silicon via by a distance ranged from 2 μm to 40 μm. | 2015-02-05 |
| 20150035166 | METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE - A semiconductor component having wettable leadframe lead surfaces and a method of manufacture. A leadframe having leadframe leads is embedded in a mold compound. The mold compound is separated to form singulated semiconductor components. A portion of at least one leadframe lead is exposed and an electrically conductive material is formed on the exposed portion using one of a vibratory plating device or a spouted bed electroplating device. | 2015-02-05 |
| 20150035167 | TFT ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE - The present invention provides a TFT array substrate, the TFT array substrate includes: a first metal layer including a first common electrode line, a second metal layer including a second common electrode line, and a third common electrode line, wherein the third common electrode line is electrically connected with at least one of the first common electrode line and the second common electrode line. The TFT array substrate provided by the present invention can achieve at least one effect of reducing the delay of a common electrode line signal (common signal), reducing flicker inequality and crosstalk without reducing the aperture ratio, lowering the cost and simplifying the manufacturing process. | 2015-02-05 |
| 20150035168 | SEMICONDUCTOR DEVICE HAVING THROUGH-SUBSTRATE VIAS - A semiconductor device having through-substrate vias is disclosed. In one aspect, the device includes a substrate having at least one front-end-of-line (FEOL) device and a back-end-of-line (BEOL) comprising a metal pad. The device additionally includes at least one first contact plug contacting the at least one FEOL device and at least one second contact plug underneath the metal pad and in electrical contact therewith. At least one second contact plug has one end contacting the metal pad and has other end contacting a material that is not part of a FEOL device. | 2015-02-05 |
| 20150035169 | VIA STRUCTURE FOR THREE-DIMENSIONAL CIRCUIT INTEGRATION - Circuits incorporating three-dimensional integration and methods of their fabrication are disclosed. One circuit includes a bottom layer and a plurality of upper layers. The bottom layer includes a bottom landing pad connected to functional components in the bottom layer. In addition, the upper layers are stacked above the bottom layer. Each of the upper layers includes a respective upper landing pad that is connected to respective functional components in the respective upper layer. The landing pads are coupled by a single conductive via and are aligned in a stack of the bottom layer and the upper layers such that each of the landing pads is offset from any of the landing pads in an adjacent layer in the stack by at least one pre-determined amount. | 2015-02-05 |
| 20150035170 | MULTICHIP DEVICE INCLUDING A SUBSTRATE - A device includes a substrate including an electrically insulating core, a first electrically conductive material arranged over a first main surface of the substrate, and a second electrically conductive material arranged over a second main surface of the substrate opposite to the first main surface. The device further includes an electrically conductive connection extending from the first main surface to the second main surface and electrically coupling the first electrically conductive material and the second electrically conductive material, a first semiconductor chip arranged over the first main surface and electrically coupled to the first electrically conductive material, and a second semiconductor chip arranged over the second main surface and electrically coupled to the second electrically conductive material. | 2015-02-05 |
| 20150035171 | Segmented Bond Pads and Methods of Fabrication Thereof - In accordance with an embodiment of the present invention, a semiconductor device includes a first bond pad disposed at a first side of a substrate. The first bond pad includes a first plurality of pad segments. At least one pad segment of the first plurality of pad segments is electrically isolated from the remaining pad segments of the first plurality of pad segments. | 2015-02-05 |
| 20150035172 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - To enhance the reliability of a semiconductor device. The semiconductor device includes a wiring substrate having a plurality of bonding fingers (terminal) formed on a chip-mounting surface, a semiconductor chip mounted on the wiring substrate, a plurality of wires having a ball part and a stitch part respectively. The bonding fingers have a first bonding finger to which the stitch part of the first wire is coupled respectively, and the second bonding finger to which a ball part of the second wire is coupled. In addition, in plan view, the second bonding finger is arranged at a position different from the arrangement of a plurality of first bonding fingers, and the width of the second bonding finger is larger than the width of the first bonding finger. | 2015-02-05 |
| 20150035173 | ADHESIVES FOR BONDING HANDLER WAFERS TO DEVICE WAFERS AND ENABLING MID-WAVELENGTH INFRARED LASER ABLATION RELEASE - Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers. | 2015-02-05 |
| 20150035174 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a first component that generates heat when used, a second component, and a sealing portion. The sealing portion includes a first region and a second region. The first region covers the first component. The second region is thermally divided from the first region and covers the second component. | 2015-02-05 |
| 20150035175 | ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - An adhesive for a semiconductor, containing an epoxy resin, a curing agent, and a fluxing agent comprising a compound having a group represented by the following formula (1-1) or (1-2): | 2015-02-05 |
| 20150035176 | DIRECT CONTACT CONDENSER - An apparatus for condensing steam is described including at least two chambers with a first chamber operated as co-current flow condensing chamber and a second chamber operated as counter-current flow condensing chamber with the co-current flow condensing chamber including a cooling liquid distribution system with a plurality of channels arranged above a plurality of film carriers having flat surface areas to carry films of cooling liquid. | 2015-02-05 |
| 20150035177 | FLUE GAS PURIFICATION DEVICE - The invention relates to a flue gas purification device with a scrubber tower ( | 2015-02-05 |
| 20150035178 | MICRO-BUBBLE GENERATOR OF CARBON DIOXIDE - A first object of the present invention is to provide a micro-bubble generator of carbon dioxide which is arranged so as to enhance health promoting effects such as improvement of blood circulation due to carbon dioxide gas generated by dissolving a tablet, thereby exhibiting effects of taking a shower of bicarbonate with appropriate concentrations for a prolonged period of time. And, a second object thereof is to provide a micro-bubble generator of carbon dioxide which is arranged so that a rate of dissolution of a carbonated bath tablet is optimized, by which the tablet is kept longer, exchanged less frequently, resulting in reduction in running costs, and also the generator can be attached to a generally available shower unit, thus making it possible to exchange and load the tablet easily and in a short period of time, and the present invention is characterized that a micro-bubble generator of carbon dioxide which is installed at a water supply channel of hot water to eject carbon dioxide gas/micro-bubbles mixed water, and a micro-bubble generator of carbon dioxide which is disposed between a shower unit and a hose, having an opening/closing mechanism, in which there is installed a carbonated bath tablet accommodating portion for accommodating a carbonated bath tablet. | 2015-02-05 |
| 20150035179 | LIQUID ATOMIZATION DEVICE - A liquid atomization device includes a first gas spray unit and a second gas spray unit; a liquid outflow unit for flowing out liquid; a gas-liquid mixing area where a gas flow sprayed from the first gas spray unit, a gas flow sprayed from the second gas spray unit, and liquid which flows out from the liquid outflow unit are made to collide against each other to atomize the liquid; a projection formed to project out of the device such that its cross section projects in a convex manner, the gas-liquid mixing area being formed in the projection; a spray slit formed in the projection along a wide angle spray direction of mist produced by the gas-liquid mixing area; and a restriction portion formed near a bottom of the spray slit such that the restriction portion inclines in the wide angle spray direction of the mist. | 2015-02-05 |
| 20150035180 | METHOD FOR FABRICATING AN ARRAYED OPTICAL ELEMENT - A method for fabricating an arrayed optical element includes: forming a light blocking frame using a first material that has a heat deflection temperature; placing the light blocking frame into a cavity of a mold; and injecting a second material into the mold to form a lens unit that is integrally connected to the light blocking frame, the second material being an optical plastic material and having a forming temperature lower than the heat deflection temperature of the first material. | 2015-02-05 |
| 20150035181 | PATTERNED SLIT FIXTURES AND SURFACES FOR HIGH THROUGHPUT SLIT-SURFACE ELECTROSPlNNING - The present invention relates generally to the field of electrospinning. In particular, the present invention relates to an electrospinning device that includes a slit-fixture defined by an elongate aperture disposed between opposing elements of an electrically conductive material. These elements include a variety of patterns/shapes that affect the flow of fluid through the aperture and the electrical field across the aperture. | 2015-02-05 |
| 20150035182 | METHOD FOR PREPARING TOBRAMYCIN SULFATE POWDER - A method for preparing tobramycin sulfate powder for injection is provided. The method includes steps of providing a sterile tobramycin sulfate solution; and aseptically spray drying the tobramycin sulfate solution to obtain the tobramycin sulfate powder. | 2015-02-05 |
| 20150035183 | PROCESS OF MELT-SPINNING POLYACRYLONITRILE FIBER - Processes for producing carbon fibre, the filament thereof and pre-oxidized fibre are provided. In one embodiment, the gel spinning of polyacrylonitrile filament is achieved by using small-molecule gelling agent, and the carbon fibre obtained thereby is increased by 15% to 40% in tensile strength and by 20% to 35% in toughness. In another embodiment, the melt spinning process of polyacrylonitrile is conducted by using imidazole type ion liquid as plasticizer, the process reduces environment pollution, is suitable for industrial production and the fibre produced thereby is improved in its strength. In yet another embodiment, polyacrylonitrile pre-oxidized fibre is produced by melt spinning, so low cost and controllable pre-oxidization of polyacrylonitrile can be achieved. In a further embodiment, high strength carbon fibre is manufactured by using polymer thickening agent. In another further embodiment, low cost and controllable pre-oxidization of polyacrylonitrile is achieved by conducting pre-oxidization before spinning, minimizing skin-core structure, so as to produce high performance carbon fibre, and reduce the production cost of carbon fibre greatly. | 2015-02-05 |
| 20150035184 | SUBSTRATE MANUFACTURING FACILITY AND METHOD OF MANUFACTURING SUBSTRATE - A substrate manufacturing facility includes a lower molding plate and an upper molding plate. A resin supply tray provides resin powder to a top surface of the lower molding plate. The lower and upper molding plates may compress a substrate and the resin powder. The upper molding plate has multiple apertures. The apertures are densely formed on a front side of the upper molding plate. The front side of the upper molding plate contacts the substrate. The apertures have diameters smaller than diameters of the resin powder. The substrate manufacturing facility includes a vacuum pump, a ventilator, a conduit, a controller, and valves. The substrate manufacturing facility can adsorb a circuit board using adsorption pressure from the vacuum pump and clean residue from the upper molding using exhaustion pressure from the ventilator. | 2015-02-05 |
| 20150035185 | SHUTTERING - A shuttering formwork suitable for use as sacrificial shuttering formwork includes an elongate body member having a base portion and a compression portion extending therefrom and presenting a free end that extends in a length direction of the elongate body member. The elongate body member has first and second sides, each comprising a compression portion side face and a base portion upper face. A strip element is releasably attachable to the free end of the compression portion. The compression portion side face and the base portion upper face of at least one side of the elongate body member are each a resiliently deformable surface. The base portion is provided with apertures for receiving mortar material. The shuttering formwork may be fabricated from a plastics material and have a hollow structure. | 2015-02-05 |
| 20150035186 | SYSTEM AND METHOD FOR DEPOSITING LIQUIDS - A printing head for a printing system is disclosed. The printing head comprises a plurality of compartments, each having an outlet port for depositing liquid and an inlet port separately connectable to a separate liquid container. At least two compartments are in controllable fluid communication with each other, and the printing head comprises an arrangement of sensors configured for generating signals indicative of (i) a filling state of each compartment, and (ii) a fluid communication state between the at least two compartments. | 2015-02-05 |
| 20150035187 | METHOD FOR WARMING RUBBER AND WARMING DEVICE - Provided are: a method for warming rubber, whereby the rubber temperature can be continuously measured in a short time, and a production condition of a calender roll can be automatically controlled so that the temperature of kneaded rubber compound is constant, the method for warming rubber including a warming step for warming kneaded rubber compound through use of a calender roll, a kneaded rubber compound temperature measurement step for measuring the temperature of kneaded rubber compound using a non-contacting thermometer, and a production condition adjusting step for automatically adjusting a production condition of the calender roll on the basis of the result of measurement by the non-contacting thermometer; and a rubber warming device for implementing the method for warming rubber. | 2015-02-05 |
| 20150035188 | Injection Molding Machines and Methods for Accounting for Changes in Material Properties During Injection Molding Runs - A method and a machine that account for changes in material properties of molten plastic material during an injection run. If viscosity of the molten plastic material changes during an injection run, a controller alters an injection pressure to ensure that molten plastic material fills a mold cavity within a correct amount of time to prevent part flaws such as short shots or flashing. | 2015-02-05 |
| 20150035189 | Injection Molding Machines and Methods for Accounting for Changes in Material Properties During Injection Molding Runs - A method and a machine that account for changes in material properties of molten plastic material during an injection run. If viscosity of the molten plastic material changes during an injection run, a controller alters a step time of the injection cycle to ensure that molten plastic material completely fills and packs a mold cavity to prevent part flaws such as short shots or flashing. | 2015-02-05 |
| 20150035190 | Injection Molding Machines and Methods for Accounting for Changes in Material Properties During Injection Molding Runs - A method and a machine that account for changes in material properties of molten plastic material during an injection run. If viscosity of the molten plastic material changes during an injection run, a controller alters a step time of the injection cycle to ensure that molten plastic material completely fills and packs a mold cavity to prevent part flaws such as short shots or flashing. | 2015-02-05 |
| 20150035191 | SYSTEMS AND METHODS FOR SEALED CAST METAL MOLDS - The invention relates generally to cast metal molds that are used in the manufacture of polymer parts, and more specifically, to methods tier sealing cast metal molds used in the manufacture of polymer parts. One embodiment of the present technique relates to a cast metal mold having a sealant disposed within the pores on the surface of a mold cavity such that the sealant is configured to seal the surface of the mold cavity to produce a sealed surface. The sealed surface is blocked from absorbing or releasing gases during the production of a polymer part. The mold further includes a surface coating to facilitate the release of a product from the mold cavity. The surface coating includes a fluoropolymer base layer, which configured to adhere to the sealed surface of the mold cavity. | 2015-02-05 |
| 20150035192 | POROUS CERAMIC AND METHOD OF MAKING - A method for forming a porous ceramic includes forming a mixture having at least one ceramic precursor and at least one pore-forming material and heating the mixture to oxidize the ceramic precursor and vaporize the pore-forming material. | 2015-02-05 |
| 20150035193 | Method Of Improving The Appearance Of Injection Molding And Foaming Product - A method of improving the appearance of foaming injection molding product includes closing the moving mold and the fixed mold and setting a clamping force on the closed mold, wherein a mold cavity is formed between the moving mold and the fixed mold. The method proceeds by inflating the mold cavity with high pressure and high temperature gas until the air pressure in the mold cavity reaches 2-25 MPa and the temperature of the high pressure and high temperature gas is between 60-200° C., then injecting molten resin that contains foaming agent into the mold cavity while continuously inflating high pressure and high temperature gas. After injection completed, stopping inflating high pressure and high temperature gas and simultaneously releasing pressure, wherein the step of releasing pressure includes the step of opening the mold. | 2015-02-05 |
| 20150035194 | PREPARATION METHODS OF FILTER ELEMENT FOR SWIFT AND HIGHLY EFFICIENT ADSORPTION OF CS - A preparation method of filter element for swift and highly efficient adsorption of Cs includes the following steps: to a substrate material, adding a coupling agent with 1-3 wt % and ammonium phosphomolybdate with 1-10 wt %, based on the weight of the substrate material; heating to 160˜220° C.; stirring and mixing evenly so that the substrate material is combined with ammonium phosphomolybdate; spining through 5 μm micropore, the spun filament forming adsorbent filter element with a thickness of 5-50 mm in the rotational cylinder framework material; evenly coating ammonium phosphomolybdate on the outer surface of the adsorbent filter element; and stabilizing and implementing an aging process by heating to 80-120° C. for 3-12 h. The filter element prepared by this method provides an excellent water permeability, oxidization resistance, long-term immersion in hot water of below 100° C., radiation decomposition resistance, stable adsorption, swift detection, high efficiency and precision. | 2015-02-05 |
| 20150035195 | COSMETIC TEXTILE FIBER, METHOD FOR OBTAINING IT AND USE THEREOF - The present invention describes a polyamide textile fiber comprising conjugated nanoparticles homogeneously dispersed in the fiber, selected from polyethylene glycol-conjugated platinum nanoparticles, hyaluronic acid-conjugated gold nanoparticles and mixtures thereof. The invention also describes how to obtain it as well as its use in a cosmetic skin treatment as a system for the release of said conjugated nanoparticles. | 2015-02-05 |
| 20150035196 | PROCESS OF MELT-SPINNING POLYACRYLONITRILE FIBER - Processes for producing carbon fibre, the filament thereof and pre-oxidized fibre are provided. In one embodiment, the gel spinning of polyacrylonitrile filament is achieved by using small-molecule gelling agent, and the carbon fibre obtained thereby is increased by 15% to 40% in tensile strength and by 20% to 35% in toughness. In another embodiment, the melt spinning process of polyacrylonitrile is conducted by using imidazole type ion liquid as plasticizer, the process reduces environment pollution, is suitable for industrial production and the fibre produced thereby is improved in its strength. In yet another embodiment, polyacrylonitrile pre-oxidized fibre is produced by melt spinning, so low cost and controllable pre-oxidization of polyacrylonitrile can be achieved. In a further embodiment, high strength carbon fibre is manufactured by using polymer thickening agent. In another further embodiment, low cost and controllable pre-oxidization of polyacrylonitrile is achieved by conducting pre-oxidization before spinning, minimizing skin-core structure, so as to produce high performance carbon fibre, and reduce the production cost of carbon fibre greatly. | 2015-02-05 |
| 20150035197 | PROCESS OF MELT-SPINNING POLYACRYLONITRILE FIBER - Processes for producing carbon fibre, the filament thereof and pre-oxidized fibre are provided. In one embodiment, the gel spinning of polyacrylonitrile filament is achieved by using small-molecule gelling agent, and the carbon fibre obtained thereby is increased by 15% to 40% in tensile strength and by 20% to 35% in toughness. In another embodiment, the melt spinning process of polyacrylonitrile is conducted by using imidazole type ion liquid as plasticizer, the process reduces environment pollution, is suitable for industrial production and the fibre produced thereby is improved in its strength. In yet another embodiment, polyacrylonitrile pre-oxidized fibre is produced by melt spinning, so low cost and controllable pre-oxidization of polyacrylonitrile can be achieved. In a further embodiment, high strength carbon fibre is manufactured by using polymer thickening agent. In another further embodiment, low cost and controllable pre-oxidization of polyacrylonitrile is achieved by conducting pre-oxidization before spinning, minimizing skin-core structure, so as to produce high performance carbon fibre, and reduce the production cost of carbon fibre greatly. | 2015-02-05 |
| 20150035198 | SYSTEMS AND METHODS FOR THREE-DIMENSIONAL PRINTING - A system and method for controlling filament extrusion comprises receiving extrusion path signals that specify a first extrusion path and a second extrusion path for simultaneous execution by a corresponding first print head and second print head, and simultaneously extruding a first filament from the first print head according to the first extrusion path and a first extrusion rate specification, and a second filament from the second print head according to the second extrusion path and a second extrusion rate specification. The first extrusion path and the second extrusion path are specified according to a target coordinate space. In one embodiment, the target coordinate space comprises a cylindrical coordinate space. The system and method advantageously provides faster printing and greater material flexibility for three-dimensional printers. | 2015-02-05 |
| 20150035199 | METHOD FOR PRODUCING AROMATIC POLYIMIDE FILM WHEREIN LINEAR EXPANSION COEFFICIENT IN TRANSVERSE DIRECTION IS LOWER THAN LINEAR EXPANSION COEFFICIENT IN MACHINE DIRECTION - An aromatic polyimide film having a TD linear expansion coefficient lower than that MD linear expansion coefficient is produced by an industrially advantageous process which is performed under such conditions that a self-supporting aromatic polyimide precursor film having a solvent content 25-45 wt % and an imidation ratio 5-40% is prepared and stretched in the transverse direction under heating initially at 80-240° C. and the stretched self-supporting aromatic polyimide precursor film is subsequently converted to a self-supporting aromatic polyimide film by heating the precursor film at 350-580° C. | 2015-02-05 |
| 20150035200 | SYSTEMS AND METHODS FOR FABRICATING OBJECTS USING INVESTMENT MOLDING TECHNIQUES - Systems and methods in accordance with embodiments of the invention fabricate objects using investment molding techniques. In one embodiment, a method of fabricating an object includes: fabricating a subassembly including a plurality of volumes; where each volume is defined by the homogenous presence or absence of a material; where fabricating the subassembly includes using an additive manufacturing process; where at least one of the plurality of volumes defines a shape that is to exist in the object to be fabricated; where at least a first of the plurality of volumes includes a first dissolvable material; dissolving the first dissolvable material; where the dissolution of the first dissolvable material does not dissolve at least one other material within the subassembly; forming at least one cavity within the subassembly; and introducing an additive material into the at least one cavity. | 2015-02-05 |
| 20150035201 | METHOD OF MANUFACTURING ELECTRONIC PACKAGE MODULE - A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon. | 2015-02-05 |
| 20150035202 | MANUFACTURING METHOD OF MOLDED ARTICLE - The present invention relates to a manufacturing method of a molded article, including: a molded article forming step of forming a molded article by curing a resin composition on a main surface, on the side of a bendable first supporting medium, of a laminated supporting medium obtained by laminating the first supporting medium and a second supporting medium that is harder than the first supporting medium; a second-supporting medium peeling step of peeling the second supporting medium from the first supporting medium after the molded article forming step; and a first-supporting medium peeling step of peeling the first supporting medium from the molded article while bending the first supporting medium after the second-supporting medium peeling step. The shape of the first supporting medium can be maintained at a curing temperature at which the resin composition is cured in the molded article forming step. | 2015-02-05 |
| 20150035203 | COMPOSITION AND METHOD FOR PRODUCING A MATTE FINISH ON THERMOFORMED ACRYLIC SHEETS - A composition for making a cast, thermoformable sheet or slab having a matte surface comprising a syrup comprising about 90% SSI—acrylic pre-polymerized syrup at 20% solids; and about 4-10% particles of about 10-15 microns in diameter of a copolymer of methyl methacrylate and ethylene glycol dimethacrylate or such particles of barium sulfate, calcium carbonate and/or silica. A method for producing a they article having a matte surface comprising mixing a syrup comprising about 90% SSI—acrylic pre-polymerized syrup at 20% solids; and about 4-10% particles of about 10-15 microns in diameter of a copolymer of methyl methacrylate and ethylene glycol dimethacrylate or such particles of barium sulfate, calcium carbonate and/or silica; heating the syrup; casting the syrup into a sheet; and thermoforming the cast sheet against a mold. | 2015-02-05 |
| 20150035204 | SILICONE ADHESIVE TAPES AND METHOD OF MASKING USING SAME - Disclosed is a masking article such as a masking tape, roll of masking tape, masking sheet, etc. that has a substrate or backing with a primer layer on a first major surface thereof and a pressure-sensitive silicone adhesive layer on the primer layer such that the primer layer is positioned between the backing and the adhesive layer. The masking article is able to adhere to a semi-permanent release composition at greater than about 10 oz/in as measured with a 90° peel test to stainless steel with a 4.5 lb roll down. A method of masking a mold having a semi-permanent release applied thereto with the disclosed masking article is disclosed. The method includes the steps of providing a mold having the semi-permanent release agent applied thereto and applying a masking article to an area of the mold with the masking article at least partially adhered to the semi-permanent release agent. | 2015-02-05 |
| 20150035205 | PROCESS FOR PRODUCING FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR MAKING FLEXOGRAPHIC PRINTING PLATE, AND FLEXOGRAPHIC PRINTING PLATE - Objects of the present invention are to provide a process for producing a flexographic printing plate precursor for laser engraving that has excellent rinsing properties for engraving residue and can give a plate having excellent printing durability, to provide a flexographic printing plate precursor obtained by the process, and to provide a flexographic printing plate and a process for making the flexographic printing plate. Disclosed is a process for producing a flexographic printing plate precursor for laser engraving, comprising steps of: forming a relief-forming layer formed of a resin composition for laser engraving; and crosslinking the relief-forming layer by means of heat and/or light to thus obtain a flexographic printing plate precursor having a crosslinked relief-forming layer, wherein the resin composition for laser engraving comprises (Component A) an N-vinyl compound, (Component B) a polymerizable compound, (Component C) an ethylenically unsaturated bond-containing binder polymer, and (Component D) a polymerization initiator. | 2015-02-05 |
| 20150035206 | SINGLE-USE BIOLOGICAL 3 DIMENSIONAL PRINTER - A three dimensional printing device has a sterilizable printer assembly including at least one printing head, a printing platform, and a driving mechanism adapted to perform a movement of the at least one printing head relative to the printing platform along three degrees of freedom; a printer housing enclosing the printer assembly in a sterile manner, at least one aseptic connector fluidly connected to a corresponding one of the at least one printing head. | 2015-02-05 |
| 20150035207 | COMPOSITION AND METHOD FOR PRODUCING A TEXTURED ACRYLIC SURFACE - A composition for making a cast, thermoformable sheet or slab, comprising: a syrup comprising: about 30-40% SSI—acrylic pre-polymerized syrup at 20% solids; about 30-40% MMA—methyl methacrylate; about 2-3% BA—Butyl acrylate; about 1-15% acrylic chips; and about 1-15% rigid particles with a mean diameter of about 0.5-2000 μm. The rigid particles may preferably comprise a polymeric material such as poly allyl diglycol carbonate particles. A method for producing a thermoformed article having a textured surface comprising mixing the syrup as above; swelling the acrylic chips; degassing the syrup; heating the syrup; casting the syrup into a sheet; and thermoforming the cast sheet against a mold. | 2015-02-05 |
| 20150035208 | SEALING MEMBER FOR VACUUM SUSPENSION PROSTHETIC DEVICE - A method for creating an improved sealing member for use with a vacuum suspension prosthetic device, with the sealing member located along the top edge of a stump socket and made of a pliable material to provide an improved seal between the stump and the socket in order to maintain vacuum levels within the socket and to minimize cutting or tearing of the stump liner. | 2015-02-05 |
| 20150035209 | METHODS FOR FABRICATING THREE-DIMENSIONAL METALLIC OBJECTS VIA ADDITIVE MANUFACTURING USING METAL OXIDE PASTES - Methods of forming three-dimensional metallic objects are provided. A metal oxide paste comprising metal oxide particles, a polymeric binder and an organic solvent is extruded through a tip to deposit sequential layers of the metal oxide paste on a substrate to form a three-dimensional metal oxide object. The three-dimensional metal oxide object is exposed to a reducing gas at a temperature and for a period of time sufficient to reduce and to sinter the metal oxide particles to form a three-dimensional metallic object. Depending upon the composition of the metal oxide paste, the three-dimensional metallic object may be composed of a single metal, a simple or complex metal-metal alloy, or a metal-ceramic composite. | 2015-02-05 |
| 20150035210 | Composite Ceramic Material Comprising Zirconia - The invention relates to a composite ceramic material which comprises:
| 2015-02-05 |
| 20150035211 | GAS SPRING AND COMPONENT ASSEMBLY AS WELL AS METHODS OF ASSEMBLY - A gas spring and component assembly includes a flexible wall and an end member secured across an end of the flexible wall. The end member can include an end member wall with a first surface disposed toward the flexible wall and a second surface facing away from the flexible wall. A component can be secured along the the second surface of the end member. An embedded end member and can include a component wall with a first surface disposed along one of the first surface and fastener connection can be formed between the end member and the component and can secure the end member and the component in fixed relation to one another. Methods of assembling a gas spring assembly and methods of assembling a suspension system are also included. | 2015-02-05 |
| 20150035212 | END MEMBER, GAS SPRING ASSEMBLY AND METHOD - An end member for a gas spring assembly includes an end member wall with a first wall portion at least partially defining a substantially-flat surface area in a first plane, a second wall portion at least partially defining an outer peripheral extent of the end member wall and a third wall portion at least partially defining a substantially-flat surface area in a second plane. A valley can extend lengthwise along the third wall portion. A gas spring assembly and method of assembly are also included. | 2015-02-05 |
| 20150035213 | ROLL-OFF PISTON FOR AN AIR SPRING ROLLING-LOBE FLEXIBLE MEMBER - A roll-off piston is made of plastic for an air spring rolling-lobe flexible member. The roll-off piston and the air spring rolling-lobe flexible member are arranged between a sprung mass and an unsprung mass. The roll-off piston includes a first piston part; a second piston part connected to the first piston part; and, the first and second piston parts being made of a layered composite material of alternating layers of plastic and elastomeric material. | 2015-02-05 |
| 20150035214 | HOLDING DEVICE - A holding device includes a main body defining a channel, a supporting assembly coupled to the main body, a plurality of pistons positioned on the main body, and an adjusting assembly positioned in the main body. The substance channel includes a main channel and a plurality of first sub-channels defined from a side of the main channel and communicating with an outside. An end of each piston received in a corresponding first sub-channel, the other end coupling to the supporting assembly. The adjusting assembly is received in an end of the main channel capable of being inserted into the main channel. The plurality of pistons is configured to drive the supporting assembly to move away from the main body. | 2015-02-05 |
| 20150035215 | FIXTURE SYSTEM - The present invention relates to tooling used to facilitate machining of component parts or work-pieces. The present tooling fixture is especially well suited to precision machining on large cast and forged component weighing in rough form approximately 1500 lbs. and overall linear dimensions of approximately 4-9 feet. | 2015-02-05 |
| 20150035216 | ROLL UP CUTTING BOARD - A rollup cutting board that provides instructions on how to butcher game is disclosed. The cutting board is sized for the animal to which it is to be used and provides instructions on properly cutting the animal. Further, the cutting board provides a durable, flexible cutting surface that is easy to clean and transport. | 2015-02-05 |
| 20150035217 | RECORDING APPARATUS - A recording apparatus includes: a recording section that performs recording on a recording medium; a driving roller disposed in a transportation path; a plurality of driven rollers driven to rotate by abutting against the driving roller, and biased to the driving roller; and a frame defining positions of the driven rollers. A biasing member that biases driven rollers applies a biasing force including a first direction component that is in the transportation direction to the frame in a state of being mounted thereon. At least a part of the driven rollers are disposed by being deviated in the position thereof in a second direction opposite to the first direction in a state where the biasing member is not mounted thereon. | 2015-02-05 |
| 20150035218 | RECORDING MEDIUM DISCHARGING APPARATUS AND COMPUTER-READABLE MEDIUM STORING RECORDING MEDIUM DISCHARGING PROGRAM - There is provided a recording medium discharging apparatus including: a support tray; a discharging mechanism configured to discharge the recording media; a detector configured to detect a specific state in which a position of an uppermost surface of the recording media is not lower than a predetermined position; and a controller configured to control the discharging mechanism. When executing a job for continuously discharging the recording media on the support tray at a predetermined discharge interval, the controller is configured to control the discharging mechanism to pause discharge of the recording media on the support tray under a condition that the detector keeps detecting the specific state until a predetermined number of pieces of the recording medium is discharged on the support tray since the detector has detected the specific state, and is configured to set the predetermined number to be greater as the discharge interval is shorter. | 2015-02-05 |
| 20150035219 | MEDIA ITEM TRANSPORTATION - The present invention provides a method and apparatus for transporting media items along a transport path. The apparatus comprises a first transport member and a further transport member that selectively apply an urging force to at least one media item to urge said media item along a transport path, wherein in a first mode of operation, the urging force is applied to said media item to transport said media item at least partially along the transport path and, in a further mode of operation, the urging force on said media item is released to allow at least one end region of the media item to move freely along the transport path. | 2015-02-05 |
| 20150035220 | PRINTING DEVICE - A printing device includes a printing mechanism configured to print a printing medium fed to a printing area in a device main body, a stacker configured to receive the printing medium discharged from the printing area, a drive device configured to cause a state of the stacker to be a housed state in which the stacker is housed in the device main body and a projecting state in which the stacker is positioned outside the device main body, and a control device configured to change the state of the stacker from the housed state to the projecting state by controlling the drive device. When a housing condition is established while the state of the stacker is the projecting state, the control device is configured to perform an automatic housing process to change the state of the stacker to the housed state by controlling the drive device. | 2015-02-05 |
| 20150035221 | PRINTING SYSTEM AND CONTROL METHOD THEREOF - In a printing system which feeds a sheet from a plurality of sheet storage units and prints an image on the fed sheet, and a control method thereof, when a sheet storage unit selected as a paper feed source does not store sheets of a size designated by a print job, and a sheet storage unit which stores sheets of the size designated by the print job does not exist in a group to which the selected sheet storage unit belongs, the user is notified of a sheet storage unit in the group as a sheet storage unit which should store sheets. | 2015-02-05 |
| 20150035222 | MEDIA ITEM SEPARATION - The present invention provides a method and apparatus for separating a media item from a bunch of media items. The apparatus comprises at least one first roller located on a first side of a transport path along which a media item is transported and at least two further rollers located on a further side of the transport path opposite the first side, said at least two further rollers being spaced apart to receive a portion of said at least one first roller therebetween, wherein in an advance mode of operation said first and further rollers rotate in the same direction and in a reject mode of operation said first and further rollers rotate in opposite directions. | 2015-02-05 |
| 20150035223 | Sheet Feeders - A sheet feeder comprises a feed deck for supporting a stack of sheets ( | 2015-02-05 |
| 20150035224 | IMAGE FORMING APPARATUS - There is provided an image forming apparatus including separating members in a conveyance direction of sheets conveyed from a paper tray, the separating members being configured to separate the sheets one by one. The separating members include an upward regulating member configured to regulate a central part of a sheet in a width direction in a manner that the central part of the sheet points upward, and downward regulating members on both sides of the upward regulating member, the downward regulating members each being configured to regulate both ends of the sheet in the width direction in a manner that both ends of the sheet point downward. A position of an upper end of the upward regulating member is higher than a position of a lower end of each downward regulating member. | 2015-02-05 |
| 20150035225 | Printing Apparatus and Methods - Printing apparatus comprise a printing table, a loader to load sheets of print media to the printing table, and a moveable tray on which at least one row of media sheets can be placed, the tray being moveable between a position in which it is accessible to an operator for placing media sheets thereon and another position in which at least part of the tray is accessible to the loader for picking the print media sheets but inaccessible to the operator. | 2015-02-05 |
| 20150035226 | SHEET POST-PROCESSING APPARATUS AND IMAGE FORMING SYSTEM HAVING THE SAME - The purpose of the present invention is to provide a sheet post-processing apparatus which facilitates eliminating of a jammed sheet occurring in the path when sheets discharged from an image forming apparatus are stored as being sorted into two directions. The present invention comprises a sheet post-processing apparatus including a first conveying path through which a sheet introduced from a first introducing port is conveyed, a second conveying path through which a sheet introduced from a second introducing port is conveyed, and a stack portion which stacks sheets conveyed through the second conveying path and which is configured to have at least a part of the stack portion be swingable about an axis intersecting with a sheet conveyance direction of a sheet conveyed to the second conveying path between a stack position where sheets are stacked and an open position where the first introducing port of the first conveying path is opened. | 2015-02-05 |
| 20150035227 | SHEET CONVEYING UNIT AND IMAGE FORMING APPARATUS - A sheet conveying unit includes a shutter portion including an abutting portion correcting a skew of a sheet by abutting against a front end of the sheet at a standby position upstream in a sheet conveying direction of a nip of the conveying roller pair, and a bias portion biasing the shutter portion such that the abutting portion is positioned at the standby position. The bias portion is configured such that a rate of increase of a bias force applied from the bias portion to the shutter portion during when the abutting portion is turned from the standby position to a nip position where the sheet is nipped by the conveying roller pair is smaller than a rate of increase of the bias force during when the abutting portion turns by being pushed by the sheet nipped by the conveying roller pair from the nip position. | 2015-02-05 |
| 20150035228 | METHOD OF HANDLING A WEB-LIKE LABELLING MATERIAL IN AN AUTOMATED LABELLING PROCESS, LABELLING MACHINE VACUUM DRUM AND LABELLING MACHINE - A method of handling a web-like labelling material in an automated labelling process is disclosed. The method comprises feeding a succession of labels at an input station; and conveying the labels along a circular label path from the input station to an application station located at a first angular distance from the input station as measured about an axis, at the application station means being provided for applying the labels onto respective articles fed, in succession, to the application station. The method further comprises selectively conveying the labels along the circular label path past the application station and to a discarding station located at a second angular distance from the input station as measured about an axis, the second angular distance being greater than the first angular distance. | 2015-02-05 |
| 20150035229 | Bingo Game Card Stencil - Disclosed is a stencil for bingo game boards. The stencil includes a front and rear side and a plurality of cutouts therethrough. The cutouts on the stencil form various bingo formations that are commonly played. The rear side of the stencil includes a pocket that is adapted to hold a bingo game board therein. The pocket is constructed to hold the bingo game board securely, thereby eliminating the need for additional fasteners. In use, a bingo game board is placed behind the stencil and inserted into the pocket so that the numbers disposed on the board are shown through the cutouts. The stencil allows users to see the numbers that are shown through the cutouts while blocking the rest of the numbers from view. In this way, the present invention assists users in identifying numbers on a bingo game board that form a winning bingo formation. | 2015-02-05 |
| 20150035230 | SORTING DEVICE FOR SORTING PLAYING CARDS - A sorting device for sorting a stack of playing cards laid in an input bin in four stacks and removing them at the four cardinal points of the sorting device includes two receiving bins disposed on top of each other, of which the upper receiving bins are adjustable in height in order to selectively deposit playing cards in the lower receiving bins or upper receiving bins. The upper receiving bins are disposed on a rotatable subframe that, after sorting, is rotatable for a quarter of a turn in order to bring the upper receiving bins into a removal position in which the playing cards can be removed at the four cardinal points. At the four removal positions, doors are present that open automatically and through which ejector pins then move the playing cards outside. | 2015-02-05 |
