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05th week of 2021 patent applcation highlights part 79
Patent application numberTitlePublished
20210037678COOLER AND COOLER BODY - The invention relates to a cooler or cooler body which in particular is adapted for cooling electronic structural units or assemblies.2021-02-04
20210037679TUBULAR HEAT SPREADERS FOR MEMORY MODULES AND MEMORY MODULES INCORPORATING THE SAME - Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.2021-02-04
20210037680SCALABLE UNIVERSAL SENSOR DATA ACQUISITION WITH PREDICTABLE TIMING - A device that is communicating with other devices via a common bus discovers addresses of the other devices. The device transmits data to the other devices at a transmit time determined based on the addresses of the other devices. The device predicts receive times at which data will be received from the other devices and determines the transmit time based on predicted receive times, avoiding data collisions. The devices may include universal sensor data acquisition devices (“USDADs”) that are each connectable to different types of sensors arranged within a server rack. Each USDAD determines a type of a connected sensor that is within a server rack and collects sensor data from the connected sensor.2021-02-04
20210037681PLATE COOLER FOR AIRCRAFT ELECTRONIC COMPONENTS - A heat exchanger for aircraft electronic components includes a first plate having channels arranged with side-by-side channel inlets fed from a common fluid supply manifold extending to the channel inlets from a manifold inlet. The channel inlets include a first set of inlets spaced further away from the manifold inlet than a second set of inlets. The fluid supply manifold has a flow divider positioned fluidly between the manifold inlet and the channel inlets. The flow divider is configured in use to direct heat exchange fluid entering the manifold from the manifold inlet preferentially toward the first set of inlets. A second plate is coupled with the first plate to seal the channels and the fluid supply manifold.2021-02-04
20210037682COOLING SYSTEM WITH PARALLEL COOLING CHANNELS - A cooling system for a power converter includes a first cooling channel configured to form an air channel, and a second cooling channel configured to form an air channel. The first and second cooling channels have at least one section in which the first and second cooling channels extend in a parallel arrangement in which the first cooling channel cools semiconductors of the power converter and the second cooling channel cools intermediate circuit capacitors of the power converter An air distributor is provided to divide an air stream between the first cooling channel and the second cooling channel in a ratio in a range of 80:20 to 95:5 as a function of a measurement value generated by a temperature sensor.2021-02-04
20210037683HEAT DISSIPATING DEVICE FOR DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE - The present disclosure provides a heat dissipating device for a display panel, a manufacturing method thereof, and a display device. The heat dissipating device may include: a first heat conductor layer located on a side of the display panel away from its display surface, and provided with at least one through hole; and a second heat conductor layer located on a side of the first heat conductor layer away from the display panel, and connected to the display panel through the at least one through hole. A thermal conductivity of the first heat conductor layer in a direction parallel to the display surface and a thermal conductivity of the second heat conductor layer in a direction perpendicular to the display surface are greater than that of the first heat conductor layer in a direction perpendicular to the display surface, respectively.2021-02-04
20210037684ELECTRONIC DEVICE COMPRISING CONNECTOR - According to various embodiments of the present invention, an electronic device comprises: a connector comprising a conductive shell and at least one terminal arranged inside the conductive shell; a capacitor; and a circuit board comprising a first board layer at least partially facing the connector, a second board layer formed beneath the first board layer, and at least one third board layer formed between the first board layer and the second board layer. The circuit substrate comprises: a ground area made of a conductor formed at least one of the first board layer, the second board layer, or the at least one third board layer and electrically connected to the conductive shell through the capacitor while being connected to a ground portion of the electronic device; a first conductive area which is a partial area of the first board layer facing the connector, the first conductive area being made of a conductor having a first size and electrically connected to the conductive shell; and a second conductive area which is an area of the second board layer at least partially facing the first conductive area with the at least one third substrate layer interposed therebetween, the second conductive area being made of a conductor having a second size wider than the first size and electrically connected to the first conductive area. At least one of the first conductive area and the second conductive area may be arranged adjacent to the ground area such that the first conductive area and the second conductive area are electrically separated from the ground area.2021-02-04
20210037685SOLID STATE DRIVE DEVICE INCLUDING A GASKET - A solid state drive device is provided. The solid state drive device includes a lower plate which includes a lower flat part, and a lower side wall protruding from the lower flat part primarily in a first direction, an upper plate which includes an upper flat part facing the lower flat part, and an upper side wall protruding from the upper flat part primarily in a second direction opposite to the first direction. The solid state drive device further includes a gasket including a metal material formed in at least a part of a region in which the lower side wall and the upper side wall overlap each other.2021-02-04
20210037686CONSTITUTIVE DEVICE QUALITY DETERMINATION SERVER, INSPECTION SYSTEM, INSPECTION SYSTEM TERMINAL DEVICE, AND INSPECTION DEVICE - A constitutive device quality determination server is communicably connected to an inspection device via the internet, the inspection device performing an inspection on a constitutive device configuring a board work machine by operating the constitutive device in accordance with to a type of the inspection, and includes an inspection data acquisition section that designates a predetermined type of the inspection for the inspection device and acquires inspection data obtained by the inspection by the inspection device, a determination section that determines quality of the constitutive device based on the acquired inspection data, and a transmission section that transmits a quality determination result determined by the determination section to a terminal device communicably connected over the internet.2021-02-04
20210037687COMPONENT MOUNTING MACHINE - A component mounting machine includes a tool station and a determination section. The tool station detachably accommodates a holding member including a main body section which can hold a component to be mounted on a board and multiple identification sections which can identify multiple accommodation angles. The determination section determines an angle difference in which the accommodation angle of the holding member differs from a predetermined accommodation angle. At least one identification section of the multiple identification sections is defined as a first identification section, the at least one identification section being exposed when the accommodation angle of the holding member is the predetermined accommodation angle in a close state in which the multiple identification sections are partially covered by a shielding member. When the determination section cannot recognize the first identification section in the close state, the determination section attempts to recognize a second identification section.2021-02-04
20210037688DIANTHUS PLANT NAMED 'KLEDG18273'2021-02-04
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