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05th week of 2018 patent applcation highlights part 61
Patent application numberTitlePublished
20180033742SENSOR AND HEATER FOR STIMULUS-INITIATED SELF-DESTRUCTING SUBSTRATE2018-02-01
20180033743SEMICONDUCTOR DEVICE2018-02-01
20180033744MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) AND METHOD FOR FORMING SUCH MMIC HAVING RAPID THERMAL ANNEALING COMPENSATION ELEMENTS2018-02-01
20180033745SEMICONDUCTOR DEVICE HAVING A DUAL MATERIAL REDISTRIBUTION LINE AND METHOD OF FORMING THE SAME2018-02-01
20180033746ELECTRONIC COMPONENT PACKAGE2018-02-01
20180033747Fan-Out Package and Methods of Forming Thereof2018-02-01
20180033748RESURFACEABLE CONTACT PAD FOR SILICON or ORGANIC REDISTRIBUTION INTERPOSER FOR SEMICONDUCTOR PROBING2018-02-01
20180033749SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF2018-02-01
20180033750METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE2018-02-01
20180033751FAN-OUT SEMICONDUCTOR PACKAGE2018-02-01
20180033752Molded Semiconductor Package Having an Optical Inspection Feature2018-02-01
20180033753HETEROGENEOUS BALL PATTERN PACKAGE2018-02-01
20180033754TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS2018-02-01
20180033755INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE INCLUDING THE SAME2018-02-01
20180033756METHOD FOR FORMING BUMP STRUCTURE2018-02-01
20180033757SEMICONDUCTOR DEVICE2018-02-01
20180033758METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES2018-02-01
20180033759SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES2018-02-01
20180033760CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH USE METAL PARTICLES AND CONDUCTIVE MATERIAL PARTICLES2018-02-01
20180033761SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE2018-02-01
20180033762ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF2018-02-01
20180033763PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PACKAGE2018-02-01
20180033764Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding2018-02-01
20180033765ELECTRONIC DEVICE HAVING AN UNDER-FILL ELEMENT, A MOUNTING METHOD OF THE SAME, AND A METHOD OF MANUFACTURING A DISPLAY APPARATUS HAVING THE ELECTRONIC DEVICE2018-02-01
20180033766DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARATUS UTILIZING DEHT2018-02-01
20180033767Device Package with Reduced Thickness and Method for Forming Same2018-02-01
20180033768Flat panel display formed by self aligned assembly2018-02-01
20180033769STACKED PHOTODETECTORS2018-02-01
20180033770SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME2018-02-01
20180033771PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME2018-02-01
20180033772SEMICONDUCTOR DEVICE HAVING A RIB STRUCTURE AND MANUFACTURING METHOD OF THE SAME2018-02-01
20180033773PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME2018-02-01
20180033774SEMICONDUCTOR PACKAGE ASSEMBLY WITH PASSIVE DEVICE2018-02-01
20180033775Packages with Die Stack Including Exposed Molding Underfill2018-02-01
20180033776STRUCTURES AND METHODS FOR PROVIDING ELECTRICAL ISOLATION IN SEMICONDUCTOR DEVICES2018-02-01
20180033777EMBEDDED STACKED DIE PACKAGES AND RELATED METHODS2018-02-01
20180033778LIGHT-EMITTING DEVICE2018-02-01
20180033779CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES2018-02-01
20180033780SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATED METHODS2018-02-01
20180033781METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AND RELATED ASSEMBLIES2018-02-01
20180033782USING METAL-CONTAINING LAYER TO REDUCE CARRIER SHOCK IN PACKAGE FORMATION2018-02-01
20180033783Avalanche Diode Having an Enhanced Defect Concentration Level and Method of Making the Same2018-02-01
20180033784VARIABLE HOLDING VOLTAGE SILICON CONTROLLED RECTIFIER USING SEPARATE AND DISTINCT BIPOLARS2018-02-01
20180033785SEMICONDUCTOR DEVICE2018-02-01
20180033786LATERALLY DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE INTEGRATED WITH VERTICAL FIELD EFFECT TRANSISTOR2018-02-01
20180033787METHODS OF FABRICATING INTEGRATED CIRCUITS AND DEVICES WITH INTERLEAVED TRANSISTOR ELEMENTS2018-02-01
20180033788VERTICAL FIELD EFFECT TRANSISTOR WITH UNIFORM GATE LENGTH2018-02-01
20180033789METHOD, APPARATUS, AND SYSTEM FOR REDUCING DOPANT CONCENTRATIONS IN CHANNEL REGIONS OF FINFET DEVICES2018-02-01
20180033790INCREASING THICKNESS OF FUNCTIONAL LAYER ACCORDING TO INCREASING RECESS AREA2018-02-01
20180033791DRAM CELL FOR REDUCING LAYOUT AREA AND FABRICATING METHOD THEREOF2018-02-01
20180033792PILLAR-SHAPED SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR PRODUCING THE SAME2018-02-01
20180033793Thin SRAM Cell Having Vertical Transistors2018-02-01
20180033794Non-Volatile Memory With Reduced Program Speed Variation2018-02-01
20180033795One-Time Programmable Bitcell with Native Anti-Fuse2018-02-01
20180033796SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME2018-02-01
20180033797NON-VOLATILE MEMORY DEVICE HAVING NANOCRYSTAL FLOATING GATE AND METHOD OF FABRICATING SAME2018-02-01
20180033798NON-VOLATILE MEMORY WITH REDUCED VARIATIONS IN GATE RESISTANCE2018-02-01
20180033799VERTICAL MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME2018-02-01
20180033800DISPLAY DEVICE2018-02-01
20180033801DISPLAY DEVICE2018-02-01
20180033802ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, DISPLAY PANEL, AND DISPLAY DEVICE2018-02-01
20180033803DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME2018-02-01
20180033804Thin Film Transistor, Method for Manufacturing the Same, and Display Device Including the Same2018-02-01
20180033805Displays With Silicon and Semiconducting Oxide Thin-Film Transistors2018-02-01
20180033806ARRAY SUBSTRATE AND DISPLAY PANEL2018-02-01
20180033807TRANSISTOR, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE2018-02-01
20180033808MANUFACTURING METHOD FOR LTPS TFT SUBSTRATE2018-02-01
20180033809SOLID-STATE IMAGE SENSING DEVICE AND ELECTRONIC DEVICE2018-02-01
20180033810METHOD FOR FORMING SHALLOW TRENCHES OF THE DUAL ACTIVE REGIONS2018-02-01
20180033811BIASED DEEP TRENCH ISOLATION2018-02-01
20180033812MECHANISMS FOR FORMING IMAGE-SENSOR DEVICE WITH EXPITAXIAL ISOLATION FEATURE2018-02-01
20180033813SEMICONDUCTOR DEVICE, SOLID-STATE IMAGE PICKUP ELEMENT, IMAGING DEVICE, AND ELECTRONIC APPARATUS2018-02-01
20180033814Photo Sensor2018-02-01
20180033815Photo Sensor2018-02-01
20180033816IMAGING ELEMENT, IMAGING DEVICE, AND MANUFACTURING APPARATUS AND METHOD2018-02-01
201800338173DIC Seal Ring Structure and Methods of Forming Same2018-02-01
20180033818Time-Of-Flight Image Sensor and Light Source Driver Having Simulated Distance Capability2018-02-01
20180033819TERAHERTZ CMOS SENSOR2018-02-01
20180033820Semiconductor Image Sensor Device Having Back Side Illuminated Image Sensors with Embedded Color Filters2018-02-01
20180033821ORGANIC LIGHT EMITTING DISPLAY DEVICE2018-02-01
20180033822HIGH-PERFORMANCE RADIATION DETECTORS AND METHODS OF FABRICATING THEREOF2018-02-01
20180033823LIGHT EMITTING DEVICE AND DISPLAY DEVICE2018-02-01
20180033824LIGHT-EMITTING STRUCTURE2018-02-01
20180033825THERMAL MANAGEMENT OF SELECTOR2018-02-01
20180033826VARIABLE RESISTANCE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME2018-02-01
20180033827Quantum dot optical devices with enhanced gain and sensitivity and methods of making same2018-02-01
20180033828DISPLAY DEVICE INCLUDING WHITE LIGHT-EMITTING LAYER2018-02-01
20180033829Organic Light Emitting Display and Method of Fabricating the Same2018-02-01
20180033830DISPLAY DEVICE2018-02-01
20180033831DISPLAY APPARATUS2018-02-01
20180033832DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME2018-02-01
20180033833DISPLAY DEVICE2018-02-01
20180033834DISPLAY DEVICE2018-02-01
20180033835DISPLAY PANEL AND DISPLAY DEVICE2018-02-01
20180033836ELECTROLUMINESCENT DISPLAY DEVICE2018-02-01
20180033837DISPLAY APPARATUS2018-02-01
20180033838METHOD AND APPARATUS FOR IMAGE PROCESSING2018-02-01
20180033839VERY HIGH RESOLUTION STACKED OLED DISPLAY2018-02-01
20180033840DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME2018-02-01
20180033841Organic Light-Emitting Display Device2018-02-01
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