05th week of 2020 patent applcation highlights part 62 |
Patent application number | Title | Published |
20200035599 | ADDITIVELY MANUFACTURED PROGRAMMABLE RESISTIVE JUMPERS | 2020-01-30 |
20200035600 | ELECTRIC FUSE STRUCTURE AND MANUFACTURING METHOD THEREFOR | 2020-01-30 |
20200035601 | SEMICONDUCTOR DEVICE HAVING SYMMETRIC CONDUCTIVE INTERCONNECTION PATTERNS | 2020-01-30 |
20200035602 | INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME | 2020-01-30 |
20200035603 | MULTI-CHIP PACKAGE STRUCTURE HAVING CHIP INTERCONNECTION BRIDGE WHICH PROVIDES POWER CONNECTIONS BETWEEN CHIP AND PACKAGE SUBSTRATE | 2020-01-30 |
20200035604 | MULTI-CHIP PACKAGE STRUCTURE HAVING CHIP INTERCONNECTION BRIDGE WHICH PROVIDES POWER CONNECTIONS BETWEEN CHIP AND PACKAGE SUBSTRATE | 2020-01-30 |
20200035605 | INTEGRATED CIRCUIT DEVICES HAVING RAISED VIA CONTACTS AND METHODS OF FABRICATING THE SAME | 2020-01-30 |
20200035606 | MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME | 2020-01-30 |
20200035607 | SEMICONDUCTOR PACKAGE AND ANTENNA MODULE INCLUDING THE SAME | 2020-01-30 |
20200035608 | InFO-POP structures with TIVs Having Cavities | 2020-01-30 |
20200035609 | ELECTRICAL JUNCTION | 2020-01-30 |
20200035610 | Power Metallization Structure for Semiconductor Devices | 2020-01-30 |
20200035611 | INTERCONNECT STRUCTURE HAVING NANOCRYSTALLINE GRAPHENE CAP LAYER AND ELECTRONIC DEVICE INCLUDING THE INTERCONNECT STRUCTURE | 2020-01-30 |
20200035612 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-01-30 |
20200035613 | SEMICONDUCTOR DEVICE | 2020-01-30 |
20200035614 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-01-30 |
20200035615 | MAGNETIC SHIELDING MATERIAL WITH INSULATOR-COATED FERROMAGNETIC PARTICLES | 2020-01-30 |
20200035616 | Semiconductor Package Having an Electromagnetic Shielding Structure and Method for Producing the Same | 2020-01-30 |
20200035617 | CRACK SUPPRESSION STRUCTURE FOR HV ISOLATION COMPONENT | 2020-01-30 |
20200035618 | STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES | 2020-01-30 |
20200035619 | MICRO MODULE WITH A SUPPORT STRUCTURE | 2020-01-30 |
20200035620 | ADVANCED CRACK STOP STRUCTURE | 2020-01-30 |
20200035621 | ADVANCED CRACK STOP STRUCTURE | 2020-01-30 |
20200035622 | THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC) WITH SUPPORT STRUCTURES | 2020-01-30 |
20200035623 | METHOD FOR PROTECTING AN INTEGRATED CIRCUIT, AND CORRESPONDING DEVICE | 2020-01-30 |
20200035624 | METHOD FOR DETECTING AN ATTACK BY MEANS OF A BEAM OF ELECTRICALLY CHARGED PARTICLES ON AN INTEGRATED CIRCUIT, AND CORRESPONDING INTEGRATED CIRCUIT | 2020-01-30 |
20200035625 | PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2020-01-30 |
20200035626 | HIGH-FREQUENCY MODULE | 2020-01-30 |
20200035627 | ADHESIVE SUBSTRATE, TRANSFER DEVICE HAVING ADHESIVE SUBSTRATE, AND METHOD FOR PRODUCING ADHESIVE SUBSTRATE | 2020-01-30 |
20200035628 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD STRUCTURES WITH MULTI-BARRIER FILMS | 2020-01-30 |
20200035629 | PACKAGED SEMICONDUCTOR DEVICE AND METHOD FOR PREPARING THE SAME | 2020-01-30 |
20200035630 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE | 2020-01-30 |
20200035631 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | 2020-01-30 |
20200035632 | FAN-OUT SEMICONDUCTOR PACKAGE | 2020-01-30 |
20200035633 | BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE | 2020-01-30 |
20200035634 | SEMICONDUCTOR DEVICE | 2020-01-30 |
20200035635 | CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FABRICATING THE SAME | 2020-01-30 |
20200035636 | SEMICONDUCTOR DEVICE PRODUCTION METHOD | 2020-01-30 |
20200035637 | BONDING MATERIAL AND BONDED PRODUCT USING SAME | 2020-01-30 |
20200035638 | SEMICONDUCTOR DEVICE | 2020-01-30 |
20200035639 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND POWER CONVERSION APPARATUS | 2020-01-30 |
20200035640 | SEMICONDUCTOR DEVICE | 2020-01-30 |
20200035641 | POST CMP PROCESSING FOR HYBRID BONDING | 2020-01-30 |
20200035642 | ULTRASONIC BONDING APPARATUS, ULTRASONIC BONDING INSPECTION METHOD AND ULTRASONICALLY-BONDED PORTION FABRICATION METHOD | 2020-01-30 |
20200035643 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND SOLID-STATE IMAGING DEVICE | 2020-01-30 |
20200035644 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2020-01-30 |
20200035645 | Chip Assembly and Method of Manufacturing Thereof | 2020-01-30 |
20200035646 | ELECTRONIC DEVICE | 2020-01-30 |
20200035647 | Stacked Integrated Circuit Structure and Method of Forming | 2020-01-30 |
20200035648 | INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING AN INTEGRATED FAN-OUT PACKAGE | 2020-01-30 |
20200035649 | SEMICONDUCTOR PACKAGE | 2020-01-30 |
20200035650 | SEMICONDUCTOR DEVICES WITH THROUGH SILICON VIAS AND PACKAGE-LEVEL CONFIGURABILITY | 2020-01-30 |
20200035651 | VERTICAL LIGHT EMITTING DIODE WITH MAGNETIC BACK CONTACT | 2020-01-30 |
20200035652 | DISPLAY MODULE, DISPLAY DEVICE AND METHODS OF ASSEMBLING AND DISASSEMBLING DISPLAY MODULE | 2020-01-30 |
20200035653 | MAKING SEMICONDUCTOR DEVICES BY STACKING STRATA OF MICRO LEDS | 2020-01-30 |
20200035654 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2020-01-30 |
20200035655 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2020-01-30 |
20200035656 | POWER MODULE | 2020-01-30 |
20200035657 | ELECTROLUMINESCENT DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-01-30 |
20200035658 | MICRO-TRENCHING MOLD INTERFACE IN A POP PACKAGE | 2020-01-30 |
20200035659 | METHOD AND APPARATUS FOR STACKING CORE AND UNCORE DIES HAVING LANDING SLOTS | 2020-01-30 |
20200035660 | Multi-Cavity Package Having Single Metal Flange | 2020-01-30 |
20200035661 | Multi-Stack Package-on-Package Structures | 2020-01-30 |
20200035662 | METAL ZERO CONTACT VIA REDUNDANCY ON OUTPUT NODES AND INSET POWER RAIL ARCHITECTURE | 2020-01-30 |
20200035663 | Cell Circuit and Layout with Linear Finfet Structures | 2020-01-30 |
20200035664 | VERTICAL TRANSIENT VOLTAGE SUPPRESSION DEVICE | 2020-01-30 |
20200035665 | LATERAL TRANSIENT VOLTAGE SUPPRESSOR DEVICE | 2020-01-30 |
20200035666 | High Electron Mobility Transistor ESD Protection Structures | 2020-01-30 |
20200035667 | TRENCH DIODE AND METHOD OF FORMING THE SAME | 2020-01-30 |
20200035668 | Devices and Methods to Control Clamping Devices | 2020-01-30 |
20200035669 | SEMICONDUCTOR DEVICE | 2020-01-30 |
20200035670 | ELECTROSTATIC DISCHARGE PROTECTION APPARATUS FOR INTEGRATED CIRCUIT | 2020-01-30 |
20200035671 | METHOD FOR PROTECTING AN INTEGRATED CIRCUIT MODULE AND CORRESPONDING DEVICE | 2020-01-30 |
20200035672 | THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS | 2020-01-30 |
20200035673 | ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR DEVICE AND METHODS FOR FORMATION | 2020-01-30 |
20200035674 | GATE CUT LAST PROCESSING WITH SELF-ALIGNED SPACER | 2020-01-30 |
20200035675 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2020-01-30 |
20200035676 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | 2020-01-30 |
20200035677 | METHOD FOR MANUFACTURING A FINFET DEVICE | 2020-01-30 |
20200035678 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-01-30 |
20200035679 | Differential Layer Formation Processes and Structures Formed Thereby | 2020-01-30 |
20200035680 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2020-01-30 |
20200035681 | CAPACITOR CELL AND STRUCTURE THEREOF | 2020-01-30 |
20200035682 | MEMORY DEVICE COMPRISING ELECTRICALLY FLOATING BODY TRANSISTOR | 2020-01-30 |
20200035683 | STACKED THIN-FILM TRANSISTOR BASED EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY | 2020-01-30 |
20200035684 | SEMICONDUCTOR DEVICE INCLUDING INSULATING ELEMENT | 2020-01-30 |
20200035685 | INSULATING STRUCTURE AND METHOD OF FORMING THE SAME | 2020-01-30 |
20200035686 | TWO PORT SRAM CELL USING COMPLEMENTARY NANO-SHEET/WIRE TRANSISTOR DEVICES | 2020-01-30 |
20200035687 | SECURE FINGERPRINT DATA GENERATING DEVICE | 2020-01-30 |
20200035688 | MEMORY ARRAY AND SEMICONDUCTOR CHIP | 2020-01-30 |
20200035689 | EIGHT-TRANSISTOR STATIC RANDOM ACCESS MEMORY, LAYOUT THEREOF, AND METHOD FOR MANUFACTURING THE SAME | 2020-01-30 |
20200035690 | SRAM Cell and Logic Cell Design | 2020-01-30 |
20200035691 | Stacked Vertical Transistor-Based Mask-Programmable ROM | 2020-01-30 |
20200035692 | NITRIDE-FREE SPACER OR OXIDE SPACER FOR EMBEDDED FLASH MEMORY | 2020-01-30 |
20200035693 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-01-30 |
20200035694 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CONTACT VIA STRUCTURES AND METHOD OF MAKING THE SAME | 2020-01-30 |
20200035695 | SEAL METHOD TO INTEGRATE NON-VOLATILE MEMORY (NVM) INTO LOGIC OR BIPOLAR CMOS DMOS (BCD) TECHNOLOGY | 2020-01-30 |
20200035696 | MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME | 2020-01-30 |
20200035697 | NON-VOLATILE MEMORY DEVICE | 2020-01-30 |
20200035698 | MANUFACTURING METHOD OF NON-VOLATILE MEMORY STRUCTURE | 2020-01-30 |