| 05th week of 2014 patent applcation highlights part 17 |
| Patent application number | Title | Published |
|---|
| 20140027881 | ELECTRIC CHARGE FLOW ELEMENT - An electric charge flow element including, on an insulating support, a stack of a first electrode, of a dielectric layer having at least one portion capable of letting charges flow by tunnel effect, and of a second electrode, wherein at least one of the electrodes is made of undoped polysilicon. | 2014-01-30 |
| 20140027882 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In a semiconductor device including a digital circuit portion and an analog circuit portion having a capacitor portion provided over a substrate, the capacitor portion is provided with a first wiring, a second wiring and a plurality of blocks each having a plurality of capacitor elements. Further, each the plurality of capacitor elements provided in each block has a semiconductor film having a first impurity region and a plurality of second impurity regions provided apart with the first impurity region interposed therebetween, and a conductive film provided over the first impurity region with an insulating film therebetween. A capacitor is formed from the first impurity region, the insulating film, and the conductive film. | 2014-01-30 |
| 20140027883 | INTERCONNECTS AND SEMICONDUCTOR DEVICES INCLUDING AT LEAST TWO PORTIONS OF A METAL NITRIDE MATERIAL AND METHODS OF FABRICATION - Metal-insulator-metal capacitors with a bottom electrode including at least two portions of a metal nitride material. At least one of the portions of the metal nitride material includes a different material than another portion. Interconnects including at least two portions of a metal nitride material are also disclosed, at least one of the portions of the metal nitride material are formed from a different material than another portion of the metal nitride material. Methods for fabricating such MIM capacitors and interconnects are also disclosed, as are semiconductor devices including such MIM capacitors and interconnects. | 2014-01-30 |
| 20140027884 | SYSTEM AND METHOD FOR GAS-PHASE SULFUR PASSIVATION OF A SEMICONDUCTOR SURFACE - Improved methods and systems for passivating a surface of a high-mobility semiconductor and structures and devices formed using the methods are disclosed. The method includes providing a high-mobility semiconductor surface to a chamber of a reactor and exposing the high-mobility semiconductor surface to a gas-phase sulfur precursor to passivate the high-mobility semiconductor surface. | 2014-01-30 |
| 20140027885 | THREE-DIMENSIONAL INTEGRATED CIRCUIT LAMINATE, AND INTERLAYER FILLER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT LAMINATE - To provide a three-dimensional integrated circuit laminate filled in with an interlayer filler composition having both high thermal conductivity and low linear expansion property. | 2014-01-30 |
| 20140027886 | METHOD OF FABRICATING A DEVICE WITH A CONCENTRATION GRADIENT AND THE CORRESPONDING DEVICE - A semiconductive device is fabricated by forming, within a semiconductive substrate, at least one continuous region formed of a material having a non-uniform composition in a direction substantially perpendicular to the thickness of the substrate. | 2014-01-30 |
| 20140027887 | WAFER BACKSIDE DOPING FOR THERMAL NEUTRON SHIELDING - A semiconductor device includes a semiconductor substrate and at least one integrated circuit formed on a frontside of the semiconductor substrate. A shielding layer is formed on a backside of the semiconductor substrate. The shielding layer includes one or more elements having a high thermal neutron absorption cross section. | 2014-01-30 |
| 20140027888 | SYSTEM AND METHOD TO MANUFACTURE AN IMPLANTABLE ELECTRODE - The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason. | 2014-01-30 |
| 20140027889 | RECONSTITUTED WAFER PACKAGE WITH HIGH VOLTAGE DISCRETE ACTIVE DICE AND INTEGRATED FIELD PLATE FOR HIGH TEMPERATURE LEAKAGE CURRENT STABILITY - A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of ball bumps formed on an exterior facing portion of the dielectric layer. Further, a field plate is disposed within the dielectric material and interposed between the first face of the dice and the ball bump array. The field plate may be spaced from the dice by a predetermined distance to prevent dielectric breakdown of the material of the dielectric layer. | 2014-01-30 |
| 20140027890 | Low Stress Package For an Integrated Circuit - A package that electrically connects an integrated circuit to a printed circuit board includes a frame and a package body that encases a portion of the frame and the integrated circuit. The frame includes a mounting region that is connected to the printed circuit board, and a cantilevering region that cantilevers away from the mounting region. The cantilevering region retains the integrated circuit in a flexible fashion. | 2014-01-30 |
| 20140027891 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed | 2014-01-30 |
| 20140027892 | Electric Device Package Comprising a Laminate and Method of Making an Electric Device Package Comprising a Laminate - A system and method for manufacturing an electric device package are disclosed. An embodiment comprises comprising a first carrier contact, a first electric component, the first electric component having a first top surface and a first bottom surface, the first electric component comprising a first component contact disposed on the first top surface, the first bottom surface being connected to the carrier and an connection element comprising a second electric component and an interconnect element, the connection element having a connection element top surface and a connection element bottom surface, wherein the connection element bottom surface comprises a first connection element contact and a second connection element contact, and wherein the first connection element contact is connected to the first component contact and the second connection element contact is connected to the first carrier contact. The packaged device further comprises an encapsulant encapsulating the first electric component. | 2014-01-30 |
| 20140027893 | CIRCUIT SUBSTRATE FOR MOUNTING CHIP, METHOD FOR MANUFACTURING SAME AND CHIP PACKAGE HAVING SAME - A circuit board includes an insulation layer, an electrically conductive layer, and a solder mask layer. The insulation layer has a plurality of through holes passing through. The electrically conductive layer is formed on a surface of the insulation layer and covers the through holes. The electrically conductive layer has a plurality of portions exposed in the through holes to serve as a plurality of first conductive pads. The solder mask layer covers the electrically conductive layer and defines a plurality of openings to expose parts of the electrically conductive layer. Parts of the electrically conductive layer are exposed to the solder mask layer to serve as a plurality of second conductive pads. The second conductive pads are electrically connected to the first conductive pads respectively. This disclosure further relates to a chip package and a method of manufacturing the same. | 2014-01-30 |
| 20140027894 | RESIN MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame. | 2014-01-30 |
| 20140027895 | THREE-DIMENSIONAL MOUNTING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THREE-DIMENSIONAL MOUNTING SEMICONDUCTOR DEVICE - A three-dimensional mounting semiconductor device includes a layer structure including a plurality of first substrates with a trench-shaped concavity formed in and a plurality of second substrates with semiconductor elements formed in, which are alternately stacked, wherein an unevenness defined by a size difference between the first substrate and the second substrate is formed on a side surface, and a first through-hole are defined by an inside surface of the trench-shaped concavity and a surface of the second substrate, and a third substrate jointed to the side surface of the layer structure and having an unevenness formed on a surface jointed to the layer structure which are engaged with the unevenness formed on the side surface of the layer structure. | 2014-01-30 |
| 20140027896 | SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT - A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements. | 2014-01-30 |
| 20140027897 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - Provided is a semiconductor device and method of fabricating the semiconductor memory device. The semiconductor device may be formed by forming a first welding groove along outside edges of one case of a pair of upper and lower cases, forming a first welding protrusion along outside edges of the other case, the first welding protrusion being formed to correspond to the first welding groove and having a volume larger than a volume of the first welding groove. The method may further include inserting the first welding protrusion into the first welding groove to enclose a memory module in an inner accommodating space of the upper and lower cases, melting the first welding protrusion so that a first portion of the first welding protrusion fills the first welding groove and a second portion of the first welding protrusion fills a space between welding portions of the upper case and the lower case, and solidifying the first and second portions of the first welding protrusion. | 2014-01-30 |
| 20140027898 | MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE - A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant. | 2014-01-30 |
| 20140027899 | CONTROLLING THERMAL INTERFACE MATERIAL BLEED OUT - An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is cured. A bleed out of the TIM is controlled by the extension upon curing of the preform. | 2014-01-30 |
| 20140027900 | Bump Structure for Yield Improvement - A bump structure for electrically coupling semiconductor components is provided. The bump structure includes a first bump on a first semiconductor component and a second bump on a second semiconductor component. The first bump has a first non-flat portion (e.g., a convex projection) and the second bump has a second non-flat portion (e.g., a concave recess). The bump structure also includes a solder joint formed between the first and second non-flat portions to electrically couple the semiconductor components. | 2014-01-30 |
| 20140027901 | PACKAGE-ON-PACKAGE STRUCTURES HAVING BUFFER DAMS AND METHODS FOR FORMING THE SAME - A device includes a device die and a plurality of metal posts at a surface of the device die and electrically coupled to the device die. The device further includes a plurality of through-assembly vias (TAVs), a dam member between the device die and the plurality of TAVs, and a polymer layer encompassing the device die, the plurality of metal posts, the plurality of TAVs, and the dam member. | 2014-01-30 |
| 20140027902 | REPAIRING ANOMALOUS STIFF PILLAR BUMPS - Generally, the subject matter disclosed herein relates to repairing anomalous stiff pillar bumps that may be detected above a metallization system of a semiconductor chip or wafer. One illustrative method disclosed herein includes, among other things, forming a pillar bump above a metallization system of a semiconductor chip, and forming a plurality of notches in the pillar bump, wherein the plurality of notches are adapted to adjust a flexibility of the pillar bump when the pillar bump is exposed to a lateral force. | 2014-01-30 |
| 20140027903 | Semiconductor Package Including an Integrated Waveguide - Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit. | 2014-01-30 |
| 20140027904 | SEMICONDUCTOR DEVICE - A semiconductor device | 2014-01-30 |
| 20140027905 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME - A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate. | 2014-01-30 |
| 20140027906 | SEMICONDUCTOR DEVICE, A MOBILE COMMUNICATION DEVICE, AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - There is reduced the difference in inductance between bonding wires to be coupled to two semiconductor chips stacked one over another. A semiconductor device includes external terminals, lower and upper semiconductor chips, and first and second bonding wires. The lower semiconductor chip has first bonding pads, and the upper semiconductor chip has second bonding pads. The first bonding wire couples the first bonding pad of the lower semiconductor chip and the external terminal, and the second bonding wire couples the second bonding pad of the upper semiconductor chip and the external terminal. The diameter of the second bonding wire is larger than the diameter of the first bonding wire. | 2014-01-30 |
| 20140027907 | SEMICONDUCTOR DEVICE WITH EMBEDDED INTERCONNECT PAD - A semiconductor device comprising: a lower semiconductor package that comprises a first set of one or more semiconductor dies, an upper semiconductor package that is stacked on the lower semiconductor package, the upper semiconductor package comprises a second set of one or more semiconductor dies, and a first interconnect pad that is embedded in a top side of the lower semiconductor package to couple the upper semiconductor package to the lower semiconductor package. | 2014-01-30 |
| 20140027908 | Integrated Circuit Interconnects and Methods of Making Same - A copper alloy layer is blanket deposited over a low k dielectric layer and in via openings within the low k dielectric layer. The blanket deposited layer is then anisotropically etch to form horizontal interconnects. The interconnects are annealed to form a metal oxide barrier lining. A second low k dielectric layer is then depositing over the horizontal interconnects. Air gaps can be formed between adjacent interconnects to lower parasitic capacitance therebetween. | 2014-01-30 |
| 20140027909 | METALLIZATION OF FLUOROCARBON-BASED DIELECTRIC FOR INTERCONNECTS - Embodiments of the present disclosure are directed towards metallization of a fluorocarbon-based dielectric material for interconnect applications. In one embodiment, an apparatus includes a semiconductor substrate, a device layer disposed on the semiconductor substrate, the device layer including one or more transistor devices, and an interconnect layer disposed on the device layer, the interconnect layer comprising a fluorocarbon-based dielectric material, where x represents a stoichiometric quantity of fluorine relative to carbon in the dielectric material, and one or more interconnect structures configured to route electrical signals to or from the one or more transistor devices, the one or more interconnect structures comprising cobalt (Co), or ruthenium (Ru), or combinations thereof. Other embodiments may be described and/or claimed. | 2014-01-30 |
| 20140027910 | METHOD FOR REDUCING WETTABILITY OF INTERCONNECT MATERIAL AT CORNER INTERFACE AND DEVICE INCORPORATING SAME - A method for forming an interconnect structure includes forming a recess in a dielectric layer of a substrate, forming a first transition metal layer in the recess on corner portions of the recess, and forming a second transition metal layer in the recess over the first transition metal layer to line the recess. The method further includes filling the recess with a fill layer and annealing the substrate so that the first transition metal layer and the second transition metal layer form an alloy portion proximate the corner portions during the annealing, the alloy portion having a reduced wettability for a material of the fill layer than the second transition metal. Additionally, the method includes polishing the substrate to remove portions of the fill layer extending above the recess. | 2014-01-30 |
| 20140027911 | SIDEWALLS OF ELECTROPLATED COPPER INTERCONNECTS - A structure formed in an opening having a substantially vertical sidewall defined by a non-metallic material and having a substantially horizontal bottom defined by a conductive pad, the structure including a diffusion barrier covering the sidewall and a fill composed of conductive material. The structure including a first intermetallic compound separating the diffusion barrier from the conductive material, the first intermetallic compound comprises an alloying material and the conductive material, and is mechanically bound to the conductive material, the alloying material is at least one of the materials selected from the group of chromium, tin, nickel, magnesium, cobalt, aluminum, manganese, titanium, zirconium, indium, palladium, and silver; and a first high friction interface located between the diffusion barrier and the first intermetallic compound and parallel to the sidewall of the opening, wherein the first high friction interface results in a mechanical bond between the diffusion barrier and the first intermetallic compound. | 2014-01-30 |
| 20140027912 | SIDEWALLS OF ELECTROPLATED COPPER INTERCONNECTS - A structure formed in an opening having a substantially vertical sidewall defined by a non-metallic material and having a substantially horizontal bottom defined by a conductive pad, the structure including a diffusion barrier covering the sidewall and a fill composed of conductive material. The structure including a first intermetallic compound separating the diffusion barrier from the conductive material, the first intermetallic compound comprises an alloying material and the conductive material, and is mechanically bound to the conductive material, the alloying material is at least one of the materials selected from the group of chromium, tin, nickel, magnesium, cobalt, aluminum, manganese, titanium, zirconium, indium, palladium, and silver; and a first high friction interface located between the diffusion barrier and the first intermetallic compound and parallel to the sidewall of the opening, wherein the first high friction interface results in a mechanical bond between the diffusion barrier and the first intermetallic compound. | 2014-01-30 |
| 20140027913 | SEMICONDUCTOR STRUCTURES COMPRISING CONDUCTIVE MATERIAL LINING OPENINGS IN AN INSULATIVE MATERIAL - Semiconductor devices have conductive material lining a first opening in an insulative material and in contact with a metal silicide layer at the base of the opening overlying an active area within a silicon material and lining a second opening in the insulative material in direct contact with a polysilicon plug having substantially no metal silicide situated thereon. | 2014-01-30 |
| 20140027914 | PROTECTION OF UNDER-LAYER CONDUCTIVE PATHWAY - Systems and methods are presented for preventing removal of material comprising a metal gate during removal of a mask layer in a semiconductor structure. Upon exposure of the metal line during formation of a via opening the exposed portion of the metal line undergoes chemical modification to form a passivation layer. The passivation layer is subsequently covered by an etch selectivity layer, wherein the etch selectivity layer prevents removal of at least one of a portion of the metal line or the passivation layer during removal of a hard mask layer comprising the semiconductor structure. In an alternate approach, the metal line is formed with a capping layer which, following exposure by a via opening formed in the semiconductor structure, is chemically modified to form a layer having etch selectivity to acts as a protective layer during removal of a hard mask layer comprising the semiconductor layer. | 2014-01-30 |
| 20140027915 | PRODUCTION OF ADHESION STRUCTURES IN DIELECTRIC LAYERS USING PHOTOPROCESS TECHNOLOGY AND DEVICES INCORPORATING ADHESION STRUCTURES - In various aspects of the disclosure, a semiconductor device including at least one semiconductor die; a dielectric layer adjoining the semiconductor die; geometric structures formed in the dielectric layer; and a conductive layer deposited over the dielectric layer, wherein the conductive layer is at least partially located over the geometric structures. | 2014-01-30 |
| 20140027916 | SEMICONDUCTOR DEVICE HAVING VERTICAL CHANNEL - A semiconductor device includes: bit lines each extending in a first direction; word lines each extending in a second direction, which crosses the first direction; pillars provided in a region between the bit lines and the word lines, wherein the pillars are each arranged along a third direction; and bit line contacts arranged along the third direction and alternately between the pillars and coupled to alternate bit lines. | 2014-01-30 |
| 20140027917 | NON-LITHOGRAPHIC LINE PATTERN FORMATION - A metal layer is deposited over an underlying material layer. The metal layer includes an elemental metal that can be converted into a dielectric metal-containing compound by plasma oxidation and/or nitridation. A hard mask portion is formed over the metal layer. Plasma oxidation or nitridation is performed to convert physically exposed surfaces of the metal layer into the dielectric metal-containing compound. The sequence of a surface pull back of the hard mask portion, trench etching, another surface pull back, and conversion of top surfaces into the dielectric metal-containing compound are repeated to form a line pattern having a spacing that is not limited by lithographic minimum dimensions. | 2014-01-30 |
| 20140027918 | CROSS-COUPLING BASED DESIGN USING DIFFUSION CONTACT STRUCTURES - An approach for providing cross-coupling-based designs using diffusion contact structures is disclosed. Embodiments include providing first and second gate structures over a substrate; providing a first gate cut region across the first gate structure, and a second gate cut region across the second gate structure; providing a first gate contact over the first gate structure, and a second gate contact over the second gate structure; and providing a diffusion contact structure between the first and second gate cut regions to couple the first gate contact to the second gate contact. | 2014-01-30 |
| 20140027919 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device which uses a semiconductor chip originally designed for flip chip bonding and is assembled by a wire bonding process to reduce the cost of assembling a semiconductor product. A second electrode pad group and a fourth electrode pad group are located in the central area of the semiconductor chip and a first electrode pad group and a third electrode pad group are located adjacently to the two long sides of the semiconductor chip. The electrode pads of each electrode group are electrically coupled with a plurality of conductive wires. The layouts of the wiring layers formed in an interconnection substrate are modified so that the wire-bonded semiconductor device is the same as a flip-chip-bonded semiconductor device in terms of the positions of input/output signals. | 2014-01-30 |
| 20140027920 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a first semiconductor chip including a first surface and a plurality of first electrodes disposed on the first surface; a second semiconductor chip including a second surface which faces the first surface, a plurality of second electrodes each of which includes at least one end disposed on the second surface, and a plurality of first protrusions each of which surrounds the one end of each of the second electrodes on an electrode by electrode basis; a plurality of conductive joint materials each of which joins a third electrode included in the first electrodes to the one end of an electrode which faces the third electrode among the second electrodes; and a plurality of first underfill resins each of which is disposed inside one of the first protrusions and covers one of the conductive joint materials on a material by material basis. | 2014-01-30 |
| 20140027921 | Connection Carrier for Semiconductor Chips and Semiconductor Component - A connection carrier for at least one semiconductor chip is disclosed. The connection carrier has a carrier body having a main surface. A first connection area and a second connection area at a distance from the first connection area are formed on the main surface. The connection carrier has a mechanical decoupling device which is intended to reduce transmission of mechanical forces from the carrier body to at least one region of the first connection area. A semiconductor component having such a connection carrier is also stated. | 2014-01-30 |
| 20140027922 | VIA IN SUBSTRATE WITH DEPOSITED LAYER - An opening such as a small-diameter via is formed in a semiconductor substrate such as a monocrystalline silicon chip or wafer by a high etch rate process which leaves the opening with a rough interior surface. A smoothing layer such as a polysilicon layer is applied over the interior surfaces of the openings. The smoothing layer presents a surface smoother than the original interior surface. An insulating layer is formed over the smoothing layer or formed from the smoothing layer, and a conductive element such as a metal is formed in the opening. In a variant, a glass-forming material such as BPSG is applied in the opening. The glass-forming material is reflowed to form a glassy insulating layer which presents a smooth surface. The interface between the metal conductive element and the insulating or glassy layer is smooth, which improves mechanical and electrical properties. | 2014-01-30 |
| 20140027923 | NON-LITHOGRAPHIC HOLE PATTERN FORMATION - A metal layer is deposited over a material layer. The metal layer includes an elemental metal that can be converted into a dielectric metal-containing compound by plasma oxidation or nitridation. A hard mask portion is formed over the metal layer. A plasma impermeable spacer is formed on at least one first sidewall of the hard mask portion, while at least one second sidewall of the hard mask portion is physically exposed. Plasma oxidation or nitridation is performed to convert physically exposed surfaces of the metal layer into the dielectric metal-containing compound. A sequence of a surface pull back of the hard mask portion, cavity etching, another surface pull back, and conversion of top surfaces into the dielectric metal-containing compound are repeated to form a hole pattern having a spacing that is not limited by lithographic minimum dimensions. | 2014-01-30 |
| 20140027924 | SEMICONDUCTOR DEVICES INCLUDING SPACERS ON SIDEWALLS OF CONDUCTIVE LINES AND METHODS OF MANUFACTURING THE SAME - Semiconductor devices including spacers on sidewalls of conductive lines are provided. The semiconductor device includes bit lines on a semiconductor substrate, a storage node contact plug penetrating an insulation layer between the bit lines, triple-layered bit line spacers between the bit lines and the storage node contact plugs, and storage node electrodes on the storage node contact plugs. Each of the triple-layered bit line spacers includes a first spacer adjacent to one of the bit lines, a third spacer adjacent to the storage node contact plugs and a second spacer between the first and third spacers. The second spacer includes a lower portion having a lower dielectric constant than the first and third spacers and an upper portion having the same material as the first and third spacers. Related methods are also provided. | 2014-01-30 |
| 20140027925 | THROUGH-HOLED INTERPOSER, PACKAGING SUBSTRATE, AND METHODS OF FABRICATING THE SAME - A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer. | 2014-01-30 |
| 20140027926 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element. | 2014-01-30 |
| 20140027927 | METHOD FOR MANUFACTURING A COMPONENT HAVING AN ELECTRICAL THROUGH-CONNECTION - A method for manufacturing a component having an electrical through-connection is described. The method includes the following steps: providing a semiconductor substrate having a front side and a back side opposite from the front side, producing an insulating trench, which annularly surrounds a contact area, on the front side of the semiconductor substrate, filling the insulating trench with an insulating material, producing an electrical contact structure on the front side of the semiconductor substrate by depositing an electrically conductive material in the contact area, removing the semiconductor material remaining in the contact area on the back side of the semiconductor substrate in order to produce a contact hole which opens up the bottom side of the contact structure, and depositing a metallic material in the contact hole in order to electrically connect the electrical contact structure to the back side of the semiconductor substrate. | 2014-01-30 |
| 20140027928 | SEMICONDUCTOR DEVICE HAVING CRACK-RESISTING RING STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor device an interlayer insulating layer disposed over a semiconductor substrate, and including a plurality of wiring layers; a seal ring disposed in the interlayer insulating layer, and surrounding a circuit region of the semiconductor substrate; a crack lead ring disposed in the interlayer insulating layer, and surrounding the seal ring; and a protective film disposed over the interlayer insulating layer, and covering the crack lead ring and the seal ring. The crack lead ring includes an uppermost wiring layer in an uppermost layer of a plurality of wiring layers. When the crack lead ring has a wiring in an underlayer below the uppermost layer, the uppermost layer wiring extends towards the outside of the device, relative to the wiring in the underlayer. The protective film has an end overlapped with an end of the uppermost layer wiring to form a step over the interlayer insulating layer. | 2014-01-30 |
| 20140027929 | Semiconductor Device and Method of Forming Vertical Interconnect Structure with Conductive Micro Via Array for 3-D FO-WLCSP - A semiconductor device includes a semiconductor die. An encapsulant is deposited over the semiconductor die. A conductive micro via array is formed outside a footprint of the semiconductor die and over the semiconductor die and encapsulant. A first through-mold-hole (TMH) is formed including a step-through-hole structure through the encapsulant to expose the conductive micro via array. An insulating layer is formed over the semiconductor die and the encapsulant. A micro via array is formed through the insulating layer and outside the footprint of the semiconductor die. A conductive layer is formed over the insulating layer. A conductive ring is formed comprising the conductive micro via array. A second TMH is formed partially through the encapsulant to a recessed surface of the encapsulant. A third TMH is formed through the encapsulant and extending from the recessed surface of the encapsulant to the conductive micro via array. | 2014-01-30 |
| 20140027930 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE - According to one embodiment, a semiconductor device includes a package substrate, a semiconductor package, a first semiconductor chip and a first bonding wire. The package substrate has a first pad on a first principal surface. The semiconductor package is mounted on the first principal surface of the package substrate. The semiconductor package contains a semiconductor chip and has a second pad. The first semiconductor chip is mounted on the semiconductor package. The first bonding wire is connected between the first pad and the second. | 2014-01-30 |
| 20140027931 | STACK PACKAGES USING RECONSTITUTED WAFERS - A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads. | 2014-01-30 |
| 20140027932 | MANUFACTURING AN UNDERFILL IN A SEMICONDUCTOR CHIP PACKAGE - A method for manufacturing an underfill in a semiconductor chip stack having a cavity between a first surface and a second surface includes providing at least one access hole in one of the first or second surface; providing at least one vent hole in the one of the first or second surfaces; and applying a viscous filling material through the at least one access hole into the cavity thereby squeezing out air or gas through the at least one vent hole. | 2014-01-30 |
| 20140027933 | DEVICE AND METHOD FOR ALIGNMENT OF VERTICALLY STACKED WAFERS AND DIE - A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively. | 2014-01-30 |
| 20140027934 | OPTICAL BODIES INCLUDING ROUGH STRIPPABLE BOUNDARY LAYERS AND ASYMMETRIC SURFACE STRUCTURES - Optical bodies are disclosed that include an optical film and at least one rough strippable skin layer. The at least one rough strippable skin layer can include a continuous phase and a disperse phase. In some embodiments, the at least one rough strippable skin layer can include a first polymer, a second polymer different from the first polymer and an additional material that is substantially immiscible in at least one of the first and second polymers. In some exemplary embodiments, a surface of the at least one rough strippable skin layer adjacent to the optical film comprises a plurality of protrusions and the adjacent surface of the optical film comprises a plurality of asymmetric depressions substantially corresponding to said plurality of protrusions. Methods of making such exemplary optical bodies are also disclosed. | 2014-01-30 |
| 20140027935 | METHOD AND SYSTEM FOR LASER ABRASION OF OPTICAL FIBERS - In one aspect, the present invention relates to a system for abrasion of optical fibers. The system includes an adjustment member, a platform disposed on the adjustment member, and a focus block disposed on the platform. A laser is disposed above, and is in optical alignment with, the focus block. The laser abrades an optical fiber positioned on the focus block. | 2014-01-30 |
| 20140027936 | Retroreflective Sheet Structure - A retroreflective sheet structure ( | 2014-01-30 |
| 20140027937 | DEVICE AND METHOD FOR PRODUCING POLYMER AGGLOMERATES - The invention relates to a device ( | 2014-01-30 |
| 20140027938 | PROCESS FOR ELECTROSPINNING CHITIN FIBERS FROM CHITINOUS BIOMASS SOLUTION AND FIBERS AND ARTICLES PRODUCED THEREBY - Disclosed are methods for electrospinning chitinous biomass solution to form chitin fibers, using ionic liquids or other ion-containing liquids as solvent. Chitin fibers produced thereby and articles containing such chitin fibers are also disclosed. The chitin fiber thus obtained has very high surface area and improved strength over currently commercially available chitin materials. | 2014-01-30 |
| 20140027939 | POROUS BIOCERAMIC COMPOSITION FOR BONE REPAIR - The present invention relates to a porous bioceramic composition for bone repair and method of fabrication of the same. 3D-scaffolds were fabricated with a novel micro- and macro-architecture. Porous scaffolds based on dextrin, dextran, gelatin and biomineral (CaCO | 2014-01-30 |
| 20140027940 | FORM, SYSTEM AND METHOD FOR FORMING CONCRETE DIAPHRAGMS - A form or a series of forms for forming the bridge diaphragm from concrete material includes one or more bottom walls having an inner surface thereof abutting a bottom surface of the diaphragm. There is at least a pair of side walls upstanding on the inner surface of the bottom wall or walls at a respective longitudinal edge thereof and has an inner surface thereof abutting a respective side surface of the diaphragm. The at least the pair of side walls define each of a generally open top and a generally hollow interior of the form. There is also means for securely attaching each end of the form or series of forms to one of a side surface of at least one of the pair of longitudinal members and an end of another form for forming the diaphragm from the concrete material. Bracing of upper edges is also provided. | 2014-01-30 |
| 20140027941 | EXTRUSION DIE PRE-HEATING DEVICE AND METHOD - A method of pre-heating an extrusion die comprises heating an extrusion die using a first group of heating elements and a second group of heating elements; and then heating the extrusion die using only the first group of heating elements to bring the extrusion die to a desired pre-heat temperature, or heating the extrusion die using the first and second groups of heating elements, the second group of heating elements being operated at reduced power, to bring the extrusion die to a desired pre-heat temperature. | 2014-01-30 |
| 20140027942 | PROCESS FOR PRODUCING WOODEN SYNTHETIC CONSTRUCTION MATERIAL - A process for producing a high utility wooden synthetic construction material, with a woodgrain appearance close to the texture of natural wood, which effectively uses waste in the form of a wood powder of plywood. A wood powder of plywood, manufactured by adding an adhesive to wood fibers or chips and pressurizing, and a thermoplastic synthetic resin are used as main raw materials. A material obtained by adding an auxiliary raw material to the main raw materials is heated and melted at 160° C. to 200° C., and then pelletized to obtain raw material pellets. The raw material pellets are loaded into an extrusion molding or an injection molding machine, without actively removing contained moisture derived from the wood powder of plywood and an adhesive component from the raw material pellets, heated and melted at 150° C. to 200° C., and extruded from the mold or injected into the mold. | 2014-01-30 |
| 20140027943 | MANUFACTURING DEVICE FOR ABSORBENT BODY AND MANUFACTURING METHOD THEREFOR - A device for manufacturing an absorbent body by depositing on a deposit portion liquid absorbent fiber contained in a first gas flowing through a duct. The device for manufacturing an absorbent body includes the deposit portion that travels along a predetermined travel path, the duct that distributes the liquid absorbent fiber from a distribution opening placed opposing the travel path, a particulate matter discharge tube, a tip end thereof being introduced into the duct, that discharges a second gas having particulate matter mixed therein from a discharge hole of the tip end, and an operable throttle portion that throttles a flow path of the particulate matter discharge tube to change discharge distribution of the particulate matter. The operable throttle portion is operated in conjunction with the travel of the deposit portion. | 2014-01-30 |
| 20140027944 | Die and Method for Impregnating Fiber Rovings - A die and a method for impregnating fiber rovings ( | 2014-01-30 |
| 20140027945 | METHOD FOR THE PREPARATION OF POLYALKYLENE TEREPHTHALATE RESIN COMPOSITIONS EMPLOYING TITANIUM-CONTAINING CATALYST COMPLEX - A process of preparing a polyalkylene terephthalate comprising reacting an alkylene diol and an aromatic dicarboxy compound that is an aromatic dicarboxylic acid, aromatic dicarboxylic (C | 2014-01-30 |
| 20140027946 | RESIN MOLDING, METHOD FOR MANUFACTURING THE SAME, AND METAL MOLD FOR MANUFACTURING THE SAME - A resin molding is provided. A main body is comprised of 100 parts by weight of thermoplastic resin and 0.1 to 4 parts by weight of bright material having the aspect ratio of 30 to 50. A main body has a design surface formed with a groove. The lower limit of the depth of the groove is set to 0.3 mm and the upper limit of the depth of the groove is set to 0.5 mm. | 2014-01-30 |
| 20140027947 | Integrated Contact Heating for Thermoplastically Bound Mats In An Injection-Molding Tool - The invention proposes a device for manufacture of a composite piece, which exhibits a shaped plate and at least one plastic functional piece molded on to the shaped plate. The device has a heater for heating a plate blank; a shaping tool with at least two shaping elements and for admitting and shaping of the plate blank, to bring the plate blank into a desired shape and thus to manufacture the shaped plate; means for insertion of a shaped mass into the shaping tool for molding the plastic functional piece onto the shaped plate in the shaping tool to manufacture the composite piece, wherein the shaping tool is so configured that after the shaping of the plate blank, at least one cavity remains, in which the plastic functional piece is shaped; and a closing unit for opening and closing the shaping tool; wherein the heater is integrated into the closing unit and the closing unit is furnished to open and close the heater. | 2014-01-30 |
| 20140027948 | SYSTEM AND METHOD FOR PRODUCING PARTICLES AND PATTERNED FILMS - A system including a mold having a fluoropolymer wherein the mold defines a plurality of cavities having a predetermined shape and a cross-sectional dimension less than about 100 micrometers; a roller; a surface in cooperation with the roller to form a nip point configured to receive the mold, wherein the nip point is further configured to receive a substantially liquid composition and accelerate entry of the substantially liquid composition into the cavity. A method of forming particles including applying a substantially liquid composition to a mold, wherein the mold comprises a fluoropolymer and defines a plurality of cavities each having a broadest cross-sectional dimension of less than about 100 micrometers; nipping the mold between a roller and a surface such that the substantially liquid composition enters the cavities of the mold; and hardening the substantially liquid composition in the cavities of the mold to form a particle within each cavity, wherein the particle has a size and shape that substantially mimics the size and shape of the cavity of the mold. | 2014-01-30 |
| 20140027949 | METHOD AND MANUFACTURING SYSTEM FOR PRODUCING PREFABRICATED PARTS FROM MINERAL-BOUND BUILDING MATERIALS - A method and manufacturing system for producing prefabricated parts of mineral-bound building materials, in particular for construction of buildings is disclosed. The manufacturing system includes at least one formwork table provided for casting the prefabricated parts of mineral-bound building materials as the essential component. The manufacturing system is mobile and it can be brought to the site of use of the prefabricated parts and in particular to the erection site of a building for manufacturing the prefabricated parts. Thus, this mobility allows transporting a complete small factory for manufacturing prefabricated parts of mineral-bound building materials to very different locations. | 2014-01-30 |
| 20140027950 | Compositions and Methods for Selective Deposition Modeling - There is provided compositions and methods for producing three-dimensional objects by selective deposition modeling with a polar build material and a non-polar support material. The build material comprises a hydrocarbon wax material and a viscosity modifier, and the support material comprises a hydrocarbon alcohol wax material and a viscosity modifier. After the selective deposition modeling process has been completed, the object can be placed in a bath of polar solvent to remove the support material. The particular materials provided herein, and the post-processing methods associated therewith, provide for improved part quality of the three-dimensional object and for improved post-processing techniques. The three-dimensional objects can subsequently be used in a number of applications, such as patterns for investment casting. | 2014-01-30 |
| 20140027951 | CUTTING OF BRITTLE MATERIALS WITH TAILORED EDGE SHAPE AND ROUGHNESS - The method of and device for cutting brittle materials with tailored edge shape and roughness are disclosed. The methods can include directing one or more tools to a portion of brittle material causing separation of the material into two or more portions, where the as-cut edge has a predetermined and controllable geometric shape and/or surface morphology. The one or more tools can comprise energy (e.g., a femtosecond laser beam or acoustic beam) delivered to the material without making a physical contact. | 2014-01-30 |
| 20140027952 | Methods for Producing Coaxial Structures Using a Microfluidic Jet - The object of the invention is the provision of methods for controlled production of continuous multi-component filaments or discreet structures using a multi-component liquid jet issuing from an orifice. A multi-component jet consists of two or more liquids. The liquids may be miscible or immiscible, and form a co-axially propagating flow along the central axis of a flow cell. The working distance between the exit orifice and a substrate can be as large as 50 mm, so that in-flight processing of the jet is possible. The coaxial flow consists of an outer sheath liquid and an inner sample liquid or composite of liquids. The flow cell and the exit channel of the deposition head are heated so that the pressurized sheath liquid temperature is raised to near or above the boiling point of the sheath liquid at the local atmospheric pressure. The jet exits the deposition head through the orifice, and the outer liquid is evaporated as the jet falls at atmospheric pressure. The sheath liquid is processed thermally, optically, or chemically during flight to form a protective or insulating layer for the inner liquid or liquids. The inner liquids may contrastingly consist of an ultraviolet (UV) curable ink that is processed in-flight or after deposition. Since UV curable inks contain no volatile components, the coaxial jetted filament can be processed without producing cracks or bubbles in the sheath layer. Line widths are produced in the range from approximately 1 to 1000 microns. | 2014-01-30 |
| 20140027953 | METHOD FOR PRODUCING A THREE-DIMENSIONAL OBJECT AND STEREOLITHOGRAPHY MACHINE EMPLOYING SAID METHOD - A method for producing a three-dimensional object ( | 2014-01-30 |
| 20140027954 | Method of manufacturing high aspect ratio silver nanowires - A process for manufacturing silver nanowires is provided, comprising: providing a silver ink core component containing ≧60 wt % silver nanoparticles dispersed in a silver carrier; providing a shell component containing a film forming polymer dispersed in a shell carrier; providing a substrate; coelectrospinning the silver ink core component and the shell component depositing on the substrate a core shell fiber having a core and a shell surrounding the core, wherein the silver nanoparticles are in the core; and, treating the silver nanoparticles to form a population of silver nanowires, wherein the population of silver nanowires exhibit an average length, L, of ≧60 μm. | 2014-01-30 |
| 20140027955 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An imprint apparatus performs includes an irradiation unit which irradiates a resin on a substrate with light, and a control unit which controls the irradiation unit. The imprinting is performed in an edge shot region, including an edge of the substrate, of a plurality of shot regions on the substrate. The edge shot region includes a pattern forming region where a pattern is to be formed, and a near-edge region closer to a side of the edge than the pattern forming region, and the control unit controls the irradiation unit to irradiate the resin which spreads from a position on the pattern forming region to a position on the near-edge region as the pattern surface comes into contact with the resin in the pattern forming region. | 2014-01-30 |
| 20140027956 | METHOD AND APPARATUSES - An apparatus includes a first operating machine arranged for processing objects, a second operating machine positioned downstream of the first operating machine and arranged for further processing the objects, an accumulating arrangement interposed between the first operating machine and the second operating machine and arranged for receiving the objects, and a command and control arrangement arranged for detecting a parameter indicating the quantity of the objects contained in the accumulating arrangement and regulating the operation of the second operating machine on the basis of the parameter. A method includes dispensing synthetic plastics in a pasty state, compression-moulding the plastics to obtain a perform, blowing the perform to obtain a container, and filling the container with a product. Each step maintains its own regulated temperature so that the dispensing temperature is greater than the blowing temperature and the blowing temperature is greater than the filling temperature. | 2014-01-30 |
| 20140027957 | DEVICE FOR MANUFACTURING A COMPOSITE PART INCLUDING A BELL AND ASSOCIATED METHOD - The main purpose of the invention is a device for manufacturing a composite part, comprising a mould, designed to be associated with a reinforcement of the composite part comprising a preform, into which the resin forming the matrix of the composite part will be injected, possibly a support element on which the mould is supported, a preform vacuum creation membrane supported on the mould and/or the support element, if there is one; characterised in that it also comprises a vacuum chamber covering the vacuum creation membrane, the vacuum chamber comprising a flexible wall designed to apply a mechanical pressure to the vacuum creation membrane. | 2014-01-30 |
| 20140027958 | PROCESS FOR MANUFACTURING A FUEL TANK - A process for manufacturing a plastic fuel tank including at least one component, by molding a parison using a mold including two impressions and a core, the process including: introducing a parison into the mold impressions; introducing a core inside the parison, the core having a moving device including the at least one component closing the mold so that the impressions come into leaktight contact with the core; pressing the parison against the impressions by blowing through the core and/or applying a vacuum behind the impressions; fastening the at least one component on an inner wall of the parison; opening the mold to withdraw the core; and final molding the parison by blow-molding and/or thermoforming; and to enable its fastening to the parison, the component is moved away from the core by the moving device through a combination of a rotational motion and a linear motion. | 2014-01-30 |
| 20140027959 | METHOD FOR MANUFACTURING A PLASTIC FUEL TANK WITH IMPROVED CREEP STRENGTH - A method for manufacturing a plastic fuel tank including: a) inserting a plastic parison including two distinct parts into an open two-cavity mold; b) inserting a core, bearing at least part of a reinforcing element configured to create a link between the two parison parts, inside the parison; c) pressing the parison firmly against the mold cavities, for example by blowing through the core and/or creating suction behind the cavities; d) fixing the part of the reinforcing element to at least one of the parison parts using the core; e) withdrawing the core; f) closing the mold, bringing its two cavities together to grip the two parison parts around their periphery to weld them together; g) injecting a pressurized fluid into the mold and/or creating a vacuum behind the mold cavities to press the parison firmly against the mold cavities; and h) opening the mold and extracting the tank. | 2014-01-30 |
| 20140027960 | METHOD FOR MANUFACTURING COMPOSITE MATERIAL - A reinforced fiber base material is placed on a forming die having a concave part and fixed to the forming die by at least a pair of fixing members disposed on either side of the concave part so as to form a gap between the reinforced fiber base material and a bottom surface of the concave part of the forming die. Subsequently, the reinforced fiber base material fixed to the forming die is covered by a bag film, a forming space that is formed between the forming die and the bag film is decompressed, and a matrix resin is allowed to flow inside the decompressed forming space. The matrix resin is then hardened so as to obtain a composite material in which the reinforced fiber base material and the matrix resin are integrally formed. | 2014-01-30 |
| 20140027961 | LEAF SPRING SYSTEM - The invention provides a leaf spring system which supports a leaf spring assembly using attachment mechanisms which allows normal operation of the leaf spring assembly while providing support through a resilient deformable reinforcing spring. | 2014-01-30 |
| 20140027962 | AIR SPRING HAVING HYBRID BELLOWS - An air spring assembly for a motor vehicle, including an air spring, a rolling piston, a tubular rolling air spring bellows arranged concentrically about a central longitudinal axis of the air spring, and an air spring cover. A first partial air spring bellows has a first embedded textile reinforcement and a second partial air spring bellows has a second embedded textile reinforcement The first textile reinforcement has first reinforcing threads, the preferred axis of which extends parallel or nearly parallel to the axis of the central longitudinal axis of the air spring The second textile reinforcement has second reinforcing threads, the first preferred axis of which extends obliquely to the longitudinal axis of the air spring and the second preferred axis of which extends obliquely to the longitudinal axis of the air spring, wherein the first and the second preferred axis are at an angle to each other. | 2014-01-30 |
| 20140027963 | System and Method for Vibration Isolation - In accordance with one embodiment of the present disclosure, an apparatus includes a connection body and a connection element arranged at least partially within the connection body. The connection body is operable to couple to a first element in a link arrangement and the connection element is operable to couple to a second element in the link arrangement. The apparatus further includes a metallic spring system arranged circumferentially around at least a portion of the connection element. The metallic spring system is operable to compress in response to relative movement between the connection body and the connection element. | 2014-01-30 |
| 20140027964 | RECOVERABLE ENERGY ABSORBER - An energy absorber includes a base sheet and a plurality of recovering crush lobes extending from the base sheet. The crush lobes protect an adjacent object by cushioning the blow following repeated impacts in both vehicular and non-vehicular (e.g. helmets) environments. Each crush lobe includes a side wall that is oriented to buckle or bend and then spring back after absorbing energy when impacted. At least one of the base sheet and an end wall of at least one crush lobe optionally includes a number (X) of integrally-formed protruding countermeasures where 0<=X<1000 of lower standing strength than the crush lobes. Methods related to the above are also described. | 2014-01-30 |
| 20140027965 | CONSTANT-FORCE SPRING SYSTEMS - Adjustable constant force spring systems are disclosed. An adjustable constant-force spring system includes first and second rolled metal strips and a spool. The first strip is rolled around a first axis. The first strip has an inner end adjacent the first axis and an outer end configured for selective attachment to a load. The second strip is rolled around the first axis such that the second strip overlaps the first strip. The second strip has an inner end adjacent the first axis and an outer end configured for selective attachment to the load. The spool is located on a second axis parallel to and spaced from the first axis. The spool is sized to enable the first strip to reroll around the spool. | 2014-01-30 |
| 20140027966 | CUTTING BOARD DEVICE - The present invention is an improved cutting board device. The device allows a user to prepare food on one side of the cutting board while the other is being cleaned. The device provides a user a quick and easy transition to a new, clean, cutting board work surface without the need to carry waste to a disposal bin, without having to stop to wash and dry the soiled surface of the cutting board. | 2014-01-30 |
| 20140027967 | CONTINUOUSLY SCANNING XY TRANSLATION STAGE - An XY translation stage includes a primary drive mechanism and a stage drive assembly. The primary drive mechanism rotates the stage drive assembly about an axis of rotation. The XY translation stage also includes an object stage that orbits freely in a defined plane without rotation of the object stage out of that defined plane. A stage pin associates the stage drive assembly with the object stage such that rotational movement of the stage drive assembly yields orbital movement of the object stage within the defined plane. The positioning of the stage pin relative to the axis of rotation is adjustable such that the diameter of the orbital movement of the object stage is adjustable. | 2014-01-30 |
| 20140027968 | CHAMBER ELEMENTS AND A METHOD FOR PLACING A CHAMBER AT A LOAD POSITION - Chamber elements defining a chamber include a first element having a first surface, a second element, a first dynamic seal and load mechanism. The second element includes an outer floating element that includes a second surface about the periphery of the chamber, and an inner floating element. The second surface and the first surface are maintained proximate to each other when the chamber is in a load position and when the chamber is closed. The load mechanism may move the inner floating element from the outer floating element until a gap between the inner floating element and the second element to facilitate loading of the device to the chamber. A movement system may generate relative movement between the first element and the second element. | 2014-01-30 |
| 20140027969 | RECORDING DEVICE - To provide a recording device that can inhibit the occurrence of a recording media jam state in a shared passage part that is shared as a recording media shared path with a plurality of media supply paths, this is equipped with a plurality of conveyance paths for supplying paper, a shared passage part, a moving unit that moves the paper, a printing unit that performs printing on the paper, an insertion port that is able to insert paper in the conveyance path by paper being inserted, an opening and closing lid provided so that the insertion port can be opened and closed, a detection sensor for detecting an open lid state when the opening and closing lid opens the insertion port, and a movement control unit that, when the detection sensor detects the open lid state. | 2014-01-30 |
| 20140027970 | APPARATUS FOR SEPARATING INDIVIDUAL FLAT, BENDABLE OBJECTS FROM THE UNDERSIDE OF A STACK OF SUCH OBJECTS - An apparatus for separating individual flat, bendable objects from the underside of a stack of such objects. The apparatus includes a stacking area having a support region, a roller arrangement produced from a plurality of rollers, the roller arrangement supporting the stack from below in the support region, as well as a separating and holding device for separating the objects from the underside of the stack. The rollers of the roller arrangement are guided along a circular path so as to be movable past under the stack in the support region. The apparatus further includes a supporting and stopping device for positioning the supporting and stopping device in a holding position between the stack and the rollers of the roller arrangement. | 2014-01-30 |
| 20140027971 | SHEET FEEDER THAT DETECTS MULTI-FEED OF SHEETS AND IMAGE FORMING APPARATUS - A sheet feeder which is capable of accurately detecting multi-feed of sheets even when the distance between sensors is changed. The sheet feeder includes a sheet container for holding a stack of sheets. Ultrasonic sensors for transmitting and receiving ultrasonic waves, respectively, are provided on a conveying path. The ultrasonic sensor as a transmitter transmits ultrasonic waves to a sheet being fed and conveyed. A reception circuit detects a level of ultrasonic waves received by the ultrasonic sensor as a receiver. The level of ultrasonic waves detected after lapse of a predetermined time from transmission of ultrasonic waves is compared with a predetermined threshold value to determine multi-feed of sheets. A distance between the ultrasonic sensors is detected, and at least one of the predetermined time period and the predetermined threshold value is corrected based on the detected distance between the sensors. | 2014-01-30 |
| 20140027972 | SHEET SUPPLY DEVICE - A sheet supply device includes registration rollers for feeding a print sheet to a print unit, feed rollers for feeding a print sheet to the registration rollers, and a controller for controlling the registration rollers and the feed rollers. The controller starts first rotation of the feed rollers to contact a leading edge of the print sheet to the registration rollers to form a slack with a predetermined slack amount, stops the first rotation after the slack is formed, starts rotation of the registration rollers after the first rotation is stopped to reduce a slack amount of the slack, and starts second rotation of the feed rollers after the rotation of the registration rollers is started so as to make the slack remained until a trailing edge of the print sheet passes through the feed rollers. According to the sheet supply device, noises during feeding print sheets can be reduced. | 2014-01-30 |
| 20140027973 | PAPER OUTPUT MECHANISM - A paper outputting mechanism includes a paper tray for receiving a paper, a paper drive device located above the paper tray, and a paper outputting device engaged with the paper drive device. The paper outputting device includes a drive wheel and a belt surrounding the drive wheel. The belt includes a touching portion. The paper outputting device is moveable by the paper pickup arm, so that the touching portion completely abuts the paper. | 2014-01-30 |
| 20140027974 | SHEET FEEDING DEVICE, AND IMAGE FORMING APPARATUS PROVIDED WITH SAME - The sheet feeding device includes a housing, first and second feeding paths, and first and second covers. The first feeding path extends in a vertical direction within the housing. The second feeding path extends in the vertical direction within the housing, and a lower end thereof is connected to an upper end of the first feeding path. The first cover exposes, in an open state, the first feeding path outside of the housing. The second cover exposes, in an open state, the second feeding path outside of the housing. When both the first cover and the second cover are opened, the first cover and the second cover are respectively in the open state relative to the housing in a mode where a second opening angle of the second cover relative to the housing is smaller than a first opening angle of the first cover relative to the housing. | 2014-01-30 |
| 20140027975 | SHEET CONVEYANCE APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveyance apparatus includes a first path and a second path through which a sheet is conveyed, and a guide portion rotatable between a first position where the sheet is guided to the first path and a second position where the sheet is guided to the second path, wherein the guide portion includes a resin member including a first guide surface configured to guide the sheet to the first path at the first position, and a second guide surface configured to guide the sheet to the second path at the second position, and a reinforcing member including a main body portion extending in a direction along an axis line of guide portion, and protrusions protruding, along the first guide surface and the second guide surface, from both end portions in a longitudinal direction of the main body portion. | 2014-01-30 |
| 20140027976 | Self-Adjusting Processing System for Sheet Material and a Processing Method Using Such System - The invention relates to a self-adjusting processing system for sheet material. A self-adjusting processing system for sheet material comprises a guiding device for sheet material having a main transport and a redirecting device for sheet material having a branch transport in association with the main transport to redirect the sheet material. The redirecting device further has fixed rollers adopted to interact with the branch transport and floating members, the fixed rollers and the floating members are positioned at opposite sides of the branch transport and each floating member is adopted to be aligned with appropriate fixed roller. The redirecting device further comprises fixing means for fixing the floating members' position relative to the fixed rollers, releasing means for releasing the floating members' position relative to the fixed rollers, and a first actuating means for moving the floating members towards the fixed rollers till the floating members engage the fixed rollers and backwards from the fixed rollers. Also provided is a method of processing of a piece of sheet material with the self-adjusting processing device of the present invention. The processing system and the method can be used with any sheet materials, advantageously with banknotes. | 2014-01-30 |
| 20140027977 | Recording Sheet Guide Structure and Cartridge - A recording sheet guide structure configured to guide a recording sheet conveyed between an image carrier and a transfer part, including: a pair of first guide parts including first ridgeline parts which are configured to respectively slidingly contact with a transfer surface side of both end portions of a first recording sheet having a first width; and a pair of second guide parts including second ridgeline parts which are configured to respectively slidingly contact with a transfer surface side of both end portions of a second recording sheet having a second width narrower than the first width, wherein the pair of second guide parts is positioned at an inner side of the pair of first guide parts in a width direction and is arranged at a downstream side than the pair of first guide parts in a conveyance direction of the recording sheet. | 2014-01-30 |
| 20140027978 | GAME AND A METHOD FOR PLAYING A GAME - A game and method for playing a game comprising a playing surface ( | 2014-01-30 |
| 20140027979 | BATCH CARD SHUFFLING APPARATUSES INCLUDING MULTI CARD STORAGE COMPARTMENTS, AND RELATED METHODS - Automatic card shufflers include a card input mechanism for inputting cards into the card shuffler, a card storage device for receiving cards from the card input mechanism and temporarily storing cards within the card shuffler, and a card output mechanism for outputting shuffled cards from the card shuffler. The card storage device may include a movable rack configured to move vertically within the card shuffler. The movable rack may have a plurality of card storage compartments therein, each of which may be sized and configured to hold two cards therein. The card output mechanism includes a movable ejector configured to simultaneously eject cards out from two or more card storage compartments of the movable rack. Related methods include methods of fabricating such card shufflers, and methods of using such card shufflers. | 2014-01-30 |
| 20140027980 | Wagering Event-Driven Game for Sporting Events - The invention is a gambling game to be played while observing a sporting event live, remotely or otherwise. The variations of the game differ slightly from one sport to the next, but all incorporate a wagering element and the passing of tokens as certain positive and negative aspects of the sporting event occur. In this particular embodiment, physical chips are used as tokens, however, in other embodiments a token can be anything representing an event including, but not limited to, playing cards or an electronic symbol of a chip if playing in an online/application space via a smart phone app or computer. | 2014-01-30 |
