05th week of 2015 patent applcation highlights part 17 |
Patent application number | Title | Published |
20150028464 | LEAD FRAME, ELECTRIC POWER CONVERTING DEVICE, SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS - According to the disclosure, a lead frame is provided, which includes: a first island and a second island that are arranged side by side; an outer peripheral frame; first leads that extend in a second direction perpendicular to the first direction; second leads that extend in the second direction; a first coupling portion that couples the first leads to the frame; a second coupling portion that couples the second leads to the frame; an intermediate portion formed between the first and second coupling portions in the first direction such that it extends in the second direction to terminate before the space between the first and second islands; and a deformation restraining portion formed or provided in at least one of the first leads, the second leads, the first and the second coupling portions and configured to restrain deformations of the first and second leads during a molding process. | 2015-01-29 |
20150028465 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor element that is mounted on a substrate, an electrode pad that contains aluminum as a main component and is provided in the semiconductor element, a copper wire that contains copper as a main component and connects a connection terminal provided on the substrate and the electrode pad, and an encapsulant resin that encapsulates the semiconductor element and the copper wire. When the semiconductor device is heated at 200° C. for 16 hours in the atmosphere, a barrier layer containing any metal selected from palladium and platinum is farmed at a junction between the copper wire and the electrode pad. | 2015-01-29 |
20150028466 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The present invention relates to a semiconductor device and a manufacturing method thereof. The semiconductor device has a plurality of power units placed in parallel in a predetermined direction, wherein each of the power units includes a plurality of semiconductor elements placed on a metal plate having predetermined gaps with each other. The semiconductor elements of each of the two power units include a near-sided semiconductor element that is closer to an inlet of the resin among the two semiconductor elements having the predetermined gap therebetween. A structure is positioned on a passage and downstream in a resin flow direction relative to a predetermined position that corresponds to end parts of the near-sided semiconductor elements. The structure is a joint to connect the two power units placed adjacent to each other in the predetermined direction, and to be integrally sealed with the resin, along with the power unit. | 2015-01-29 |
20150028467 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device can reduce the number of bonding wires. The semiconductor device includes two or more semiconductor elements each of which has electrodes on a first main surface and a second main surface, an electrode plate that has one surface which is bonded to electrodes on the first main surfaces of the semiconductor elements, with a first bonding material layer interposed therebetween, and extends over the electrodes on the first main surfaces of the two or more semiconductor elements, and a conductive plate that includes a first lead terminal and a semiconductor element bonding portion which is bonded to electrodes on the second main surfaces of the semiconductor elements. A second bonding material layer is interposed therebetween, and is connected to the electrodes on the second main surfaces of the two or more semiconductor elements. | 2015-01-29 |
20150028468 | NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME - A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling. | 2015-01-29 |
20150028469 | SEMICONDUCTOR ASSEMBLY AND METHOD OF MANUFACTURE - A monolithically integrated semiconductor assembly is presented. The semiconductor assembly includes a substrate including silicon (Si), and gallium nitride (GaN) semiconductor device is fabricated on the substrate. The semiconductor assembly further includes at least one transient voltage suppressor (TVS) structure fabricated in or on the substrate, wherein the TVS structure is in electrical contact with the GaN semiconductor device. The TVS structure is configured to operate in a punch-through mode, an avalanche mode, or combinations thereof, when an applied voltage across the GaN semiconductor device is greater than a threshold voltage. Methods of making a monolithically integrated semiconductor assembly are also presented. | 2015-01-29 |
20150028470 | Through-Silicon Coaxial Via Structure And Method - A silicon interconnect structure includes a peripheral outer via in a silicon substrate, a solid core inner via in the silicon substrate, the solid core inner via coaxial with the peripheral outer via to form a coaxial via structure, a metal interconnect stack formed over a first surface of the peripheral outer via and the solid core inner via, at least portions of the metal interconnect stack forming an electrical connection with the peripheral outer via and the solid core inner via, first contact pads on a surface of the metal interconnect stack, and second contact pads on an exposed surface of the peripheral outer via and the solid core inner via. | 2015-01-29 |
20150028471 | Semiconductor Device and Method of Forming Through Mold Hole with Alignment and Dimension Control - A semiconductor device includes a semiconductor die and an encapsulant formed over a first surface of the semiconductor die and around the semiconductor die. A first insulating layer is formed over a second surface of the semiconductor die opposite the first surface. A plurality of conductive vias is formed through the first insulating layer. A conductive pad is formed over the encapsulant. An interconnect structure is formed over the semiconductor die and encapsulant. A first opening is formed in the encapsulant to expose the conductive vias. The conductive vias form a conductive via array. The conductive via array is inspected through the first opening to measure a dimension of the first opening and determine a position of the first opening. The semiconductor device is adjusted based on a position of the conductive via array. A conductive material is formed in the first opening over the conductive via array. | 2015-01-29 |
20150028472 | STACKED PACKAGE AND METHOD FOR MANUFACTURING THE SAME - The stacked package includes: a substrate having an upper surface formed with connection pads, a lower surface, and four side surfaces; a first semiconductor chip mounted over the upper surface of the substrate; a first adhesive member that covers a portion of the substrate including the first semiconductor chip; and a second semiconductor chip formed with bumps on edges of a first surface and mounted over the substrate with interposition of the first semiconductor chip and the first adhesive member such that a center of the first surface is attached over the first adhesive member and the bumps are bonded onto the connection pads, with a second surface opposing to the first surface being polished evenly. | 2015-01-29 |
20150028473 | STACK PACKAGES AND METHODS OF FABRICATING THE SAME - Stack packages are provided. The stack package includes a first chip and a second chip. The first chip includes a first chip body, first through electrodes penetrating the first chip body, and an insulation layer disposed on a bottom surface of the first chip body. The second chip includes a second chip body and bumps disposed on a top surface of the second chip body. The first and second chips are vertically stacked such that the bumps penetrate the insulation layer to pierce the first through electrodes and the top surface of the second chip body directly contacts the insulation layer. Related fabrication methods, electronic systems and memory cards are also provided. | 2015-01-29 |
20150028474 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - Embodiments of the inventive concept include a semiconductor package having a plurality of stacked semiconductor chips. A multi-layered substrate includes a central insulation layer, an upper wiring layer disposed on an upper surface of the central insulation layer, and a first lower wiring layer disposed on a lower surface of the central insulation layer. The stacked semiconductor chips are connected to the multi-layered substrate and/or each other using various means. The semiconductor package is capable of high performance operation, like a semiconductor package based on flip-ship bonding, and also meets the need for large capacity by overcoming a limitation caused by a single semiconductor chip. Embodiments of the inventive concept also include methods of manufacturing the semiconductor package. | 2015-01-29 |
20150028475 | TECHNIQUE FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES - Semiconductor package device, such as wafer-level package semiconductor devices, are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to support the pillar. | 2015-01-29 |
20150028476 | DEVICES, SYSTEMS, AND METHODS RELATED TO FORMING THROUGH-SUBSTRATE VIAS WITH SACRIFICIAL PLUGS - Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming one or more openings in a front side of the semiconductor device and forming sacrificial plugs in the openings that partially fill the openings. The method further includes further filling the partially filled openings with a conductive material, where individual sacrificial plugs are generally between the conductive material and a substrate of the semiconductor device. The sacrificial plugs are exposed at a backside of the semiconductor device. Contact regions can be formed at the backside by removing the sacrificial plugs. | 2015-01-29 |
20150028477 | SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENING IN SHIELDING CORE PLATE - A semiconductor package includes a first plate having a through hole therein, at least one interconnection layer disposed on a first surface of the first plate, and at least one semiconductor chip disposed on the at least one interconnection layer in a space defined by the through hole and electrically connected to the least one interconnection layer. The package further includes a second plate disposed on the at least one semiconductor chip and a second surface of the first plate on a side of the first plate opposite the first surface, and at least one conductive pad disposed on the second surface of the first plate and electrically connected to the at least one interconnection layer. | 2015-01-29 |
20150028478 | SEMICONDUCTOR DEVICES - A semiconductor device includes: a chip having at least one electrically conductive contact at a first side of the chip; an extension layer extending laterally from one or more sides of the chip; a redistribution layer on a surface of the extension layer and the first side, and coupled to the contact; an interposer having at least one electrically conductive contact at a first surface of the interposer and coupled to the redistribution layer, and at least one electrically conductive contact at a second surface of the interposer opposite to the first surface; a molding material at least partially enclosing the chip and the redistribution layer, and in contact with the interposer. Another semiconductor device includes: an interposer; a redistribution layer over the interposer; a circuit having first and second circuit portions, wherein the redistribution layer includes the first circuit portion, and the interposer includes the second circuit portion. | 2015-01-29 |
20150028479 | SEMICONDUCTOR DEVICES WITH CLOSE-PACKED VIA STRUCTURES HAVING IN-PLANE ROUTING AND METHOD OF MAKING SAME - The invention relates to a semiconductor structure, comprising a substrate of a semiconductor material having a first side (FS) and an opposite second side (BS). There is at least one conductive wafer-through via (V) comprising metal, and at least one recess (RDL) provided in the first side of the substrate and in the semiconductor material of the substrate. The recess is filled with metal and seamlessly connected with the wafer-through via. The exposed surfaces of the metal filled via and the metal filled recess are essentially flush with the substrate surface on the first side of the substrate. There is also provide an interposer comprising the above structure, further comprising contacts for attaching circuit boards and integrated circuits on opposite sides of the interposer. A method of making the structure is also provided. | 2015-01-29 |
20150028480 | SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASED POST HEIGHT - An interconnection substrate includes a plurality of electrically conductive elements of at least one wiring layer defining first and second lateral directions. Electrically conductive projections for bonding to electrically conductive contacts of at least one component external to the substrate, extend from the conductive elements above the at least one wiring layer. The conductive projections have end portions remote from the conductive elements and neck portions between the conductive elements and the end portions. The end portions have lower surfaces extending outwardly from the neck portions in at least one of the lateral directions. The substrate further includes a dielectric layer overlying the conductive elements and extending upwardly along the neck portions at least to the lower surfaces. At least portions of the dielectric layer between the conductive projections are recessed below a height of the lower surfaces. | 2015-01-29 |
20150028481 | SEMICONDUCTOR DEVICES WITH BALL STRENGTH IMPROVEMENT - A semiconductor device includes a contact region over a substrate. The semiconductor device further includes a metal pad over the contact region. Additionally, the semiconductor device includes a post passivation interconnect (PPI) line over the metal pad, where the PPI line is in contact with the metal pad. Furthermore, the semiconductor device includes an under-bump-metallurgy (UBM) layer over the PPI line. Moreover, the semiconductor device includes a plurality of solder balls over the UBM layer, the plurality of solder balls being arranged at some, but not all, intersections of a number of columns and rows of a ball pattern. | 2015-01-29 |
20150028482 | DEVICE LAYOUT FOR REDUCING THROUGH-SILICON-VIA STRESS - Approaches for reducing through-silicon via (TSV) stress are provided. Specifically, provided is a device comprising a substrate and a TSV formed in the substrate, the TSV having an element patterned therein. The TSV further comprises a set of openings adjacent the element that are subsequently filled with a TSV fill material. The element may be patterned according to any number of shapes (e.g., circle, oval, rectangle, etc.) to optimize the stress distribution for the TSV. The element is patterned and provided within the TSV in order to reduce or compensate for stress forces caused by a change in volume of the conductive fill materials of the openings of the TSV. These approaches apply to both single TSVs and a plurality of TSVs (e.g., arranged as a matrix). | 2015-01-29 |
20150028483 | NOVEL METHOD FOR ELECTROMIGRATION AND ADHESION USING TWO SELECTIVE DEPOSITION - A method of manufacturing a semiconductor device includes providing a semiconductor substrate, sequentially forming an etch stop layer and an interlayer dielectric layer on the semiconductor substrate, forming a copper metal interconnect structure in the interlayer dielectric layer, forming a copper layer in the copper metal interconnect structure, forming a cobalt layer on the copper layer, and forming an aluminum nitride layer on the cobalt layer. The stack of cobalt layer and copper layer effectively suppresses electromigration caused by diffusion of the copper layer into the interlayer dielectric layer, improves the adhesion between the copper layer and the etch stop layer, and prevents delamination. | 2015-01-29 |
20150028484 | RANDOM LOCAL METAL CAP LAYER FORMATION FOR IMPROVED INTEGRATED CIRCUIT RELIABILITY - A method and structure for preventing integrated circuit failure due to electromigration and time dependent dielectric breakdown is disclosed. A randomly patterned metal cap layer is selectively formed on the metal interconnect lines (typically copper (Cu)) with an interspace distance between metal cap segments that is less than the critical length (for short-length effects). Since the diffusivity is lower for the Cu/metal cap interface than for the Cu/dielectric cap interface, the region with a metal cap serves as a diffusion barrier. | 2015-01-29 |
20150028485 | SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A substrate structure is provided. The substrate structure includes a substrate body; a metal layer formed on a surface of the substrate body; an insulating layer formed on the surface of the substrate body and having at least an opening for exposing the metal layer; and at least a die attach area defined on the surface of the substrate body corresponding in position to the opening for a semiconductor chip to be disposed thereon. The die attach area covers the entire opening or the metal layer is formed within the die attach area, thereby effectively preventing package delamination and improving the product yield. | 2015-01-29 |
20150028486 | INTERCONNECT STRUCTURES FOR EMBEDDED BRIDGE - Embodiments of the present disclosure are directed towards interconnect structures for embedded bridge in integrated circuit (IC) package assemblies. In one embodiment, a method includes depositing an electrically insulative layer on a bridge interconnect structure, the bridge interconnect structure including a die contact that is configured to route electrical signals between a first die and a second die, depositing a sacrificial layer on the electrically insulative layer, forming an opening through the sacrificial layer and the electrically insulative layer to expose the die contact and forming a die interconnect of the first die or the second die by depositing an electrically conductive material into the opening. Other embodiments may be described and/or claimed. | 2015-01-29 |
20150028487 | Chip Package with Passives - A chip package device includes an electrically conducting chip carrier, at least one semiconductor chip attached to the electrically conducting chip carrier, and an insulating laminate structure embedding the chip carrier, the at least one semiconductor chip and a passive electronic device. The passive electronic device includes a first structured electrically conducting layer, the first structured electrically conducting layer extending over a surface of the laminate structure. | 2015-01-29 |
20150028488 | METHOD FOR MANUFACTURING A CONDUCTING CONTACT ON A CONDUCTING ELEMENT - The invention relates to a method for producing an interconnection pad on a conducting element comprising an upper face and a side wall; the method being executed from a substrate at least the upper face of which is insulating; the conducting element going through at least an insulating portion of the substrate, the method being characterized in that it comprises the sequence of the following steps: a step of embossing the conducting element, a step of forming, above the upper insulating face of the substrate, a stack of layers comprising at least one electrically conducting layer and one electrically resistive layer, a step of partially removing the electrically resistive layer, a step of electrolytic growth on the portion of the electrically conducting layer so as to form at least one interconnection pad on said conducting element. | 2015-01-29 |
20150028489 | METHOD FOR OFF-GRID ROUTING STRUCTURES UTILIZING SELF ALIGNED DOUBLE PATTERNING (SADP) TECHNOLOGY - A method for efficient off-track routing and the resulting device are disclosed. Embodiments include: providing a hardmask on a substrate; providing a plurality of first mandrels on the hardmask; providing a first spacer on each side of each of the first mandrels; providing a plurality of first non-mandrel regions of the substrate being separated from the first mandrels and between two of the first spacers, each of the first mandrels, first non-mandrel regions, and first spacers having a width equal to a distance; and providing a second mandrel having a width of at least twice the distance and being separated from one of the first non-mandrel regions by a second spacer. | 2015-01-29 |
20150028490 | INTEGRATED CIRCUITS HAVING DEVICE CONTACTS AND METHODS FOR FABRICATING THE SAME - Integrated circuits and methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes forming a conductive plug that at least partially fills a contact seam void. The contact seam void is formed in a contact that extends through an ILD layer of dielectric material overlying a device region. A metallization layer is deposited overlying the contact. | 2015-01-29 |
20150028491 | Improved SiCOH Hardmask with Graded Transition Layers - A structure and method for fabricating an improved SiCOH hardmask with graded transition layers having an improved profile for forming sub-20 nm back end of the line (BEOL) metallized interconnects are provided. In one embodiment, the improved hardmask may be comprised of five layers: an oxide adhesion layer, a graded transition layer, a dielectric layer, an inverse graded transition layer, and an oxide layer. In another embodiment, the improved hardmask may be comprised of four layers; an oxide adhesion layer, a graded transition layer, a dielectric layer, and an oxide layer. In another embodiment, a method of forming an improved hardmask may comprise a continuous five step plasma enhanced chemical vapor deposition (PECVD) process utilizing a silicon precursor, a porogen, and oxygen. In yet another embodiment, a method of forming an improved hardmask may comprise a continuous four step PECVD process utilizing a silicon precursor, a porogen, and oxygen. | 2015-01-29 |
20150028492 | SEMICONDUCTOR DEVICES HAVING BIT LINE STRUCTURES DISPOSED IN TRENCHES, METHODS OF FABRICATING THE SAME, PACKAGES INCLUDING SAME, MODULES INCLUDING THE SAME, AND SYSTEMS INCLUDING THE SAME - Semiconductor devices are provided. The semiconductor device includes a bit line contact plug and a storage node contact plug electrically connected to an active region of a substrate. A bit line structure is disposed on the bit line contact plug to extend in a first direction. The bit line structure is disposed in a trench pattern that intrudes into a side of the storage node contact plug. Related methods and systems are also provided. | 2015-01-29 |
20150028493 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor device includes forming an opening in a first substrate and filling the opening with a metal to form a first connection electrode. The first substrate is then polished by chemical mechanical polishing under conditions such that a polishing rate of the metal is less that of the region surrounding the metal. The chemical mechanical polishing thereby causes the first connection electrode to protrude from the surface of the first substrate. The first substrate is stacked with a second substrate having a second connection electrode. The first and second connection electrodes are bonded by applying pressure and heating to a temperature that is below the melting point of the metal of the first connection electrode. | 2015-01-29 |
20150028494 | INTEGRATED CIRCUIT DEVICE HAVING THROUGH-SILICON-VIA STRUCTURE AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT DEVICE - Provided is an integrated circuit device including a through-silicon-via (TSV) structure and a method of manufacturing the integrated circuit device. The integrated circuit device includes a semiconductor structure including a substrate and an interlayer insulating film, a TSV structure passing through the substrate and the interlayer insulating film, a via insulating film substantially surrounding the TSV structure, and an insulating spacer disposed between the interlayer insulating film and the via insulating film. | 2015-01-29 |
20150028495 | SOC DESIGN WITH CRITICAL TECHNOLOGY PITCH ALIGNMENT - An SOC apparatus includes a plurality of gate interconnects with a minimum pitch g, a plurality of metal interconnects with a minimum pitch m, and a plurality of vias interconnecting the gate interconnects and the metal interconnects. The vias have a minimum pitch v. The values m, g, and v are such that g | 2015-01-29 |
20150028496 | Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure - A semiconductor device is made by forming first and second interconnect structures over a first semiconductor die. A third interconnect structure is formed in proximity to the first die. A second semiconductor die is mounted over the second and third interconnect structures. An encapsulant is deposited over the first and second die and first, second, and third interconnect structures. A backside of the second die is substantially coplanar with the first interconnect structure and a backside of the first semiconductor die is substantially coplanar with the third interconnect structure. The first interconnect structure has a height which is substantially the same as a combination of a height of the second interconnect structure and a thickness of the second die. The third interconnect structure has a height which is substantially the same as a combination of a height of the second interconnect structure and a thickness of the first die. | 2015-01-29 |
20150028497 | ENCAPSULANT WITH BASE FOR USE IN SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - The present invention provides an encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, the encapsulant comprising the base, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. The encapsulant enables a semiconductor apparatus having a good appearance and laser marking property to be manufactured. | 2015-01-29 |
20150028498 | MOLDING COMPOSITION FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME - Disclosed herein are a molding composition for a semiconductor package including a liquid crystal thermosetting polymer resin and graphene oxide to thereby effectively decrease coefficient of thermal expansion (CTE) and warpage and maximize an effect of thermal conductivity, and a semiconductor package using the same. | 2015-01-29 |
20150028499 | Apparatus and Method for Forming Alignment Features for Back Side Processing of a Wafer - A method for forming an alignment feature for back side wafer processing in a wafer fabrication process involves forming a trench into but not entirely through a wafer from a top side of the wafer; forming a contrasting material on surfaces of the trench; and grinding a bottom side of the wafer to expose the trench using the handling wafer to handle the wafer during such grinding, wherein the contrasting material lining the exposed trench provides an alignment reference for precise alignment of the wafer for back side processing the wafer. | 2015-01-29 |
20150028500 | FORMING ALIGNMENT MARK AND RESULTING MARK - Methods for forming an alignment mark and the resulting mark are disclosed. Embodiments may include forming a first shape having rotational symmetry; forming a second shape; and forming an alignment mark by combining the first shape and one or more of the second shape, wherein the alignment mark has rotational symmetry. | 2015-01-29 |
20150028501 | CARBURETOR AND METHODS THEREFOR - A carburetor having an inlet opening that includes a pair of concavities operative to direct air toward the metering rod of the carburetor. A carburetor having an inlet opening that includes an arcuate manifold adjacent to the inlet opening and in fluid communication with a fuel reservoir. A carburetor having a slide assembly that includes a positioning mechanism operative to adjust the position of the metering rod relative to the throttle slide. A throttle slide that includes a flow guide that bisects an arcuate relief on an underside thereof. A method for configuring the throat of a carburetor that includes an upper portion of a first diameter and a lower portion of a second diameter that is offset from the first diameter. The method comprises deriving an optimum size for the first and second diameters and the offset based on the pumping efficiency and operating parameters of the engine. | 2015-01-29 |
20150028502 | POTABLE WATER DISPENDER - A potable water dispenser comprising a supporting structure for means of producing carbonated water. The means of producing carbonated water comprise at least one dispensing assembly that can be connected hermetically to the mouth of a container and is provided with a water dispensing port that is controlled by a first valve and is adapted to pour into the container a measured quantity of water, and a port for injecting pressurized gas into the container, which can be activated to carbonate the water poured into the container from the dispensing port. In the dispensing assembly there is, moreover, a venting port, which is controlled by a second valve, so as to allow the outflow of air from the container when water is poured into the container by the dispensing port. | 2015-01-29 |
20150028503 | METHOD FOR MAKING HOMOGENEOUS SPRAY-DRIED SOLID AMORPHOUS DRUG DISPERSIONS UTILIZING MODIFIED SPRAY-DRYING APPARATUS - Conventional spray-drying methods are improved by incorporation of a pressure nozzle and a diffuser plate to improve the flow of drying gas and a drying chamber extension to increase drying time, such improvements leading to the formation of homogeneous solid dispersions of drugs in concentration-enhancing polymers. | 2015-01-29 |
20150028504 | QUICK CHANGE MOLD SYSTEM - The system ( | 2015-01-29 |
20150028505 | MOLD RELEASABILITY EVALUATING APPARATUS AND MOLD RELEASABILITY EVALUATION METHOD - A mold releasability evaluating apparatus includes a forming die that includes a bottom portion having a main surface, and a wall surface portion that is connected to the main surface of the bottom portion and has a wall surface in which an angle formed with the main surface of the bottom portion is an obtuse angle; an extrusion pin capable of protruding out from the main surface of the bottom portion in a direction that separates a compact from the main surface of the bottom; and a measuring device configured to measure a load applied to the extrusion pin when the extrusion pin pushes the compact away from the main surface of the bottom portion, after one surface of the compact is formed by the main surface of the bottom portion. | 2015-01-29 |
20150028506 | IMPRINTING METHOD, IMPRINTING APPARATUS, AND DEVICE MANUFACTURING METHOD - Arrangement information regarding shot areas is obtained in an imprinting method. When a pattern is sequentially formed in the shot areas, the attraction force of a first attraction area is reduced to less than that of the second attraction area. After the pattern is formed in the shot area corresponding to the first attraction area, the attraction forces of the first and second attraction areas are changed. The position information regarding the shot area corresponding to the second attraction area is obtained, which is compared with the position information regarding the shot area corresponding to the second attraction area based on the arrangement information. If the difference between the compared position information is a threshold value or less, positioning of a substrate and a mold is achieved using the arrangement information. If the difference is greater than the threshold value, the arrangement information regarding the shot areas is obtained again. | 2015-01-29 |
20150028507 | ACOUSTIC NOISE SENSING FOR CONTROLLING MANUFACTURE OF A COMPONENT PART MADE OF A FLOWABLE BASE MATERIAL | 2015-01-29 |
20150028508 | METHOD AND DEVICE FOR MANUFACTURING OBLIQUELY STRETCHED LONG FILM - A method of manufacturing an obliquely stretched long film includes an oblique stretching step and a tension application step. In the oblique stretching step, a long film is stretched in an oblique direction with respect to a width direction into a stretched film (F). In the tension application step, while the stretched film (F) is being drawn along a longitudinal direction, a tension in a drawing direction is applied to the stretched film (F). Here, in the tension application step, the tension in the drawing direction of the stretched film (F) is changed in the width direction, and thus the stretched film (F) is drawn. | 2015-01-29 |
20150028509 | METHOD FOR MANUFACTURING AN INTERIOR LINING PART AND CORRESPONDING PART - A method for manufacturing an interior lining part, includes producing a skin; placing the skin in a foaming mold with a support layer; foaming an intermediate layer; cutting out an area of the skin producing a cutout area of the skin; placing a piece of adhesive tape or film in the cutout area, the piece of adhesive tape or film being placed in between the skin and the intermediate foam layer; and placing an insert in the cut out area of the skin. A method for manufacturing an interior lining part, includes producing a skin by rotational molding; placing a piece of adhesive tape or film in the cutout area, the piece of adhesive tape or film being placed in between the skin and the intermediate foam layer; placing the skin in a foaming mold with a support layer; foaming an intermediate layer; cutting out an area of the skin producing a cutout area of the skin; and placing an insert in the cut out area of the skin. | 2015-01-29 |
20150028510 | POROUS MATERIALS, METHODS OF MAKING AND USES - The present specification discloses porous materials, methods of forming such porous materials, materials and devices comprising such porous materials, and methods of making such materials and devices. | 2015-01-29 |
20150028511 | STEAM PRESSING APPARATUSES, SYSTEMS, AND METHODS - According to one embodiment, the steam pressing apparatus generally comprises a substantially rectangular or square-shaped inner chamber (such as an autoclave) and an outer, generally rectangular or square-shaped structure. In one embodiment, the steam pressing apparatus comprises a hydraulic system used to compress and treat a working material with high efficiency, timing and precision. In one aspect, the steam pressing apparatus comprises a structure and system that allows modularity and scalability for manufacturing final products of varying dimensions. Further, the steam pressing apparatus can be designed to respond to computerized instructions relating to the pressure to be applied, steam to be applied, vacuum parameters, timing of the press operation, thickness of the resultant working material, and other informational inputs. | 2015-01-29 |
20150028513 | BIOABSORBABLE POLYMERIC COMPOSITION AND MEDICAL DEVICE - A method for fabricating an embodiment of a medical device comprising the steps of: preparing a biodegradable polymeric structure; coating the biodegradable polymeric structure with a polymeric coat including a pharmacological or biological agent; cutting the structure into patterns configured to allow for crimping of the cut structure and expansion of the cut structure after crimping into a deployed configuration. | 2015-01-29 |
20150028514 | USE, IN THE MANUFACTURE OF A COMPOSITE COMPONENT, OF A PENETRATION OPERATION TO IMPROVE THE TRANSVERSE ELECTRIC CONDUCTIVITY OF THE COMPOSITE COMPONENT - The invention relates to the use, in the fabrication of a composite part formed from a stack of reinforcement materials of carbon fibres between which is sandwiched at least one layer of thermoplastic or thermosetting material or a mixture of thermoplastic and thermosetting materials, of an operation of spot application of transverse forces on at least two layers constituting the stack and positioned as neighbours in the stack, so as to successively traverse at least one reinforcement material and at least one layer of thermoplastic or thermosetting material or a mixture of thermoplastic and thermosetting materials placed in superposed position, to improve the transverse electrical conductivity of the composite part obtained. | 2015-01-29 |
20150028515 | HEAT SEALABLE MONOAXIALLY-ORIENTED PROPYLENE-BASED FILM WITH DIRECTIONAL TEAR - A monoaxially oriented film including heat sealable layer including an ethylene-propylene impact copolymer and a metallocene-catalyzed propylene-butene elastomer. The heat sealable layer may include a metallocene-catalyzed ethylene-butene elastomer. The film is oriented at least 4 times in the machine direction and exhibits excellent linear directional tear properties in the machine direction and excellent heat seal performance. This film formulation and orientation is suitable for pouch applications requiring an “easy-tear” linear tear feature and excellent hermetic seal properties, particularly for retort pouches. | 2015-01-29 |
20150028516 | Electrode Separator - A multi-functional battery separator comprises two or more active separator layers deposited from different polymer solutions to form a multilayered unitary structure comprising a free-standing film, a multiplex film on one side of a porous substrate, or separate films or multiplex films on opposite sides of a porous substrate. In a preferred embodiment, the cascade coating method is used to simultaneously deposit the active separator layers wet so that the physical, electrical and morphological changes associated with the polymer drying out process are avoided or minimized. The multi-functional separator is inexpensive to fabricate, exhibits enhanced ionic conductivity and ionic barrier properties, and eliminates gaps between individual layers in a separator stack that can contribute to battery failure. | 2015-01-29 |
20150028517 | IDENTIFICATION DEVICE FOR A PNEUMATIC SPRING - An identification device ( | 2015-01-29 |
20150028518 | Process for Producing Crosslinked, Melt-Shaped Articles - Crosslinked, melt-shaped articles are manufactured by a process that does not require the use of post-shaping external heat or moisture, the process comprising the steps of:
| 2015-01-29 |
20150028519 | METHOD OF PRODUCING HEADGEAR STRUCTURE FOR A BREATHING MASK - A headband for use in supporting a breathing mask on a user's face comprises a flexible band body that is provided with upper and lower band portions. At least some portions of the band body are made of a foamed plastic material. The headband may be provided with a supporting structure made of a material in which at least some portions of the supporting structure can be individually adjusted to the shape of the back of the user's head. A method for producing the headband and the supporting structure include injecting a plastic material into a first molding tool space to form a stiffening layer, subsequently, injecting a pore-forming plastic material into a second molding tool space such that the pore-forming plastic material at least partially covers the stiffening layer to form a cushion layer. | 2015-01-29 |
20150028520 | METHOD FOR MAKING A FEMALE MEMBER OF A HOOK-AND-LOOP FASTENER - A method for making a female member of a hook-and-loop fastener includes the steps of: (a) bonding together a base layer and a surface layer, that is formed from a fiber material and that is superimposed on the base layer, by applying heat to the surface layer so that fibers of the surface layer are curled; and (b) immediately after step (a), subjecting the surface layer to a rapid cooling treatment so as to set the curled fibers of the surface layer. | 2015-01-29 |
20150028521 | APPARATUS AND METHOD FOR MANUFACTURING PRODUCT WITH DECORATIVE PATTERNS - An apparatus for manufacturing product with decorative patterns includes a fixed and a movable mold base, and a decorative film. A fixed mold insert is fitted in the fixed mold base and is provided with a sprue and at least one molding cavity. | 2015-01-29 |
20150028522 | METHOD AND DEVICE FOR MANUFACTURING SHEET HAVING FINE SHAPE TRANSFERRED THEREON - A method for manufacturing a sheet having a fine shape transferred thereon, in which a sheet-like base made of a thermoplastic resin is placed between an imprint mold and an intermediate base and the sheet-like base is then pressed by a pair of pressing plates to imprint the fine shape of surface irregularity of the imprint mold to the sheet-like base. The sheet-like base is pressed such that, when pressing force of the pressing plates is maximum, an imprinting pressure difference is present in an imprinting surface of the imprint mold, a maximum imprinting pressure section is present in the imprinting surface, and a portion where the imprinting pressure is minimum is not present in the imprinting surface. The method achieves uniform and highly accurate shape transfer without trapping of air. | 2015-01-29 |
20150028523 | POLYGLYCOLIC ACID SUPPORT MATERIAL FOR ADDITIVE MANUFACTURING SYSTEMS - A support material for use in an additive manufacturing system, which compositionally includes a polyglycolic acid polymer, which is at least partially soluble in an aqueous solution, and which is configured for use in the additive manufacturing system for printing a support structure in coordination with printing of a three-dimensional part. | 2015-01-29 |
20150028524 | RESIST MATERIAL AND PATTERN FORMING METHOD USING SAME - In one embodiment, a resist material to be used in an imprint process includes a diluent monomer having a hydroxyl group and at least one functional group selected from a vinyl ether group, an epoxy group and an oxetanyl group. The material further includes a dendrimer having at least two reactive groups for photo-cationic polymerization. The material further includes a photo-acid generator as a polymerization initiator. | 2015-01-29 |
20150028525 | Granulated Material Used In A Liquid Composite Moulding Process - A system for liquid composite moulding includes a first rigid tool part onto which a semi-finished fiber material is positioned, a first vacuum foil arrangeable on the first rigid tool part to provide a first gastight chamber therebetween having a first port, a second vacuum foil and the first vacuum foil providing a second gastight chamber, and granulated material arranged in the second gastight chamber. The semi-finished fiber material is infusible with a matrix material via the first port. A second port is provided at the second gastight chamber for applying a negative pressure thereto. Therein, the granulated material is adapted for forming a second rigid tool part when negative pressure is applied to the second port. I.e. the first vacuum foil, the second vacuum foil and the granulated material function similarly to a vacuum mattress and may be stiffened and collapsed. | 2015-01-29 |
20150028526 | COMPOSITION FOR EXTRUSION-MOLDED CERAMIC BODIES COMPRISING A CELLULOSE DERIVATIVE OF CERTAIN MEDIAN PARTICLE LENGTH - A composition which is suitable for extrusion molding comprises a) a ceramic-forming material, and b) a cellulose derivative that has a median particle length of from 110 to 300 micrometers. Advantageously a cellulose ether is used that has been obtained by providing a moist cellulose derivative having a moisture content of from 35 to 90 percent, based on the total weight of the moist cellulose derivative, and drying-grinding the moist cellulose derivative in a gas-swept impact mill to a median particle length of from 110 to 300 micrometers. | 2015-01-29 |
20150028527 | FAST FIRING METHOD FOR HIGH POROSITY CERAMICS - A method for firing a green honeycomb ceramic body including heating the green honeycomb ceramic body from room temperature to a first temperature of about 300° C. The green honeycomb ceramic body is then heated from the first temperature to a second temperature of greater than or equal to about 800° C. at a heating rate of greater than or equal to about 90° C./hr. The green honeycomb ceramic body may have a diameter of from greater than or equal to about 4.0 inches to less than or equal to about 9.0 inches, and it may include a carbon-based pore former in a concentration of from greater than or equal to about 10% to less than or equal to about 45% by weight. | 2015-01-29 |
20150028528 | FAST FIRING METHOD FOR HIGH POROSITY CERAMICS - A method for firing a green honeycomb ceramic body including heating the green honeycomb ceramic body from room temperature to a first temperature of less than or equal to about 350° C. with at least one heating rate of greater than or equal to about 80° C./hr. The green honeycomb ceramic body may be heated from the first temperature to a second temperature of greater than or equal to about 800° C. at a heating rate of greater than or equal to about 90° C./hr. The green honeycomb ceramic body may be heated from the second temperature to a third temperature of greater than or equal to about 1000° C. The green honeycomb ceramic body may include aluminum raw materials for forming an aluminum titanate ceramic body. | 2015-01-29 |
20150028529 | VALVE FOR A VEHICLE SUSPENSION SYSTEM - A valve assembly for a suspension system includes a housing including a first port, a second port, and a third port, the housing defining a first flow path extending between the third port and the first port and a second flow path extending between the third port and the second port. The valve assembly further includes a first check valve having a first crack pressure positioned within the housing along the first flow path and a second check valve having a second crack pressure positioned within the housing along the second flow path. A difference between the first crack pressure and the second crack pressure provides a corresponding difference in pressures at the first port and the second port. | 2015-01-29 |
20150028530 | FLUID-FILLED VIBRATION DAMPING DEVICE - A fluid-filled vibration damping device including: a primary liquid chamber which gives rise to pressure fluctuations based on deformation of a main rubber elastic body at times of vibration input; an auxiliary liquid chamber which gives rise to pressure fluctuations relative to the primary liquid chamber at times of vibration input; and an orifice passage that allows flow action of a scaled fluid between the primary liquid chamber and the auxiliary liquid chamber. The sealed fluid contains at least 0.03 volume % of a dissolved gas under atmospheric pressure at room temperature. A low-adhesion energy surface with a water contact angle of at least 90 degrees is provided on an inner surface of the primary liquid chamber. | 2015-01-29 |
20150028531 | ELASTOMER BEARING - An elastomer bearing, includes a cylindrical inner metal part, a metallic outer sleeve arranged at a radial distance around the inner metal part; and an elastomer part arranged between the inner metal part and the metallic outer sleeve. The elastomer part has an outer sheath provided with a plastic layer. The outer sleeve is constructed as a one-piece extruded part made of lightweight metal, and the outer sleeve has an inner sheath surface provided with a profiling which form fittingly engages in the plastic layer. | 2015-01-29 |
20150028532 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS FOR CORRECTING SKEW OF A SHEET - A sheet conveying apparatus forms a loop of a sheet between a first conveyance roller pair and a second conveyance roller pair, and before a leading edge of the sheet reaches a nip portion of a third conveyance roller pair, separates the first conveyance roller pair. | 2015-01-29 |
20150028533 | SHEET FEEDER, DOCUMENT READER, AND IMAGE FORMING APPARATUS - A sheet feeder picking up and transporting sheets includes a transport unit transporting sheets along a sheet transport path one by one, a gap occurrence detection unit detecting, within a predetermined section of the sheet transport path, occurrence of a gap between sheets, and a controller controlling a timing of the transport of sheets according to a result of the detection. The gap occurrence detection unit includes a first detection unit and a second detection unit. The first detection unit is configured to detect light that is emitted toward the predetermined section, reaches a converging surface thereof across the predetermined section, and converged on a receiving element thereof. The second detection unit is configured to detect light reflected by a sheet passing through the predetermined section. The occurrence of the gap is detected based on outputs from the first detection unit and the second detection unit. | 2015-01-29 |
20150028534 | CORRUGATED CARDBOARD SHEET FEEDER - An inclined type kicker for pushing out a lowermost-layer corrugated cardboard sheet in a plurality of corrugated cardboard sheets stacked in a hopper toward a front gate disposed on the downstream side of a sheet transferring direction in the hopper includes: a push-out face for pushing out the lowermost-layer corrugated cardboard sheet toward a lower end opening side of the front gate in abutment against a rear end of the lowermost-layer corrugated cardboard sheet on the upstream side of the sheet transferring direction; and a rear end lift-up face which is obliquely formed such that the height is gradually increased toward the upstream side of the sheet transferring direction and adapted to lift upward the rear end side of the corrugated cardboard sheet located on the upper layer side of the lowermost-layer corrugated cardboard sheet with an operation of pushing out the lowermost-layer corrugated cardboard sheet. | 2015-01-29 |
20150028535 | PAPER FEEDER AND IMAGE FORMING APPARATUS - A paper feeder includes a document loading tray | 2015-01-29 |
20150028536 | SHEET FEED DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet feed device includes a feed unit and a sheet loading cassette. The feed unit includes a separation conveyance portion that is composed of a feed member and a separation member, a separation holder that supports the separation member and is swingable, and a pressing member that presses the separation holder. The sheet loading cassette includes a grip portion, a pressure release member that, in conjunction with an operation of drawing out the sheet loading cassette, comes into contact with the pressing member, an operation lever that is provided at the grip portion. In a state where the sheet loading cassette is inserted in the apparatus main body, the operation lever is gripped together with the grip portion, and thus the pressure release member slides to come into contact with the pressing member, so that the pressing member is released from the separation holder. | 2015-01-29 |
20150028537 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A sheet feeding apparatus includes a stacking plate configured to stack sheets, a sheet feeding unit configured to feed the sheets by contacting the sheets stacked on the stacking plate, an elevating unit configured to elevate the stacking plate by a drive transmitted from a drive unit, a drive transmission unit configured to transmit the drive from the drive unit to drive the sheet feeding unit, and a clutch mechanism configured to cause the drive transmission unit to transmit the drive from the drive unit to the sheet feeding unit after the elevating unit urges the sheets stacked on the stacking plate toward the sheet feeding unit by elevating the stacking plate. | 2015-01-29 |
20150028538 | MEDIA STACKER TO RECEIVE MEDIA SHEETS FROM A SYSTEM - A drawer defines a chamber to receive a media sheet from a system. A moving element is to engage the media sheet as the media sheet is output from the system. The moving element is to slide the media sheet to a target position in the drawer, and the moving element is to disengage from the media sheet once the particular media sheet has reached the target position. A retaining element is to engage the media sheet as the media sheet slides into the drawer. | 2015-01-29 |
20150028539 | SHEET ALIGNMENT MODULE AND POST-PROCESSING DEVICE COMPRISING SUCH SHEET ALIGNMENT MODULE - Sheet alignment module and post-processing device comprising such sheet alignment module for aligning sheets in an operative orientation on a substantially horizontal sheet support member, comprising a support roller, the support roller being rotatably mounted on the sheet alignment module and configured to support the sheet alignment module during a sheet aligning movement, the sheet alignment module further comprising a jogger member comprising a substantially flat surface extending in a substantially vertical direction, the jogger member is moveably mounted on the sheet alignment module such that the jogger member is freely moveable in a substantially vertical direction with respect to the sheet alignment module. | 2015-01-29 |
20150028540 | SHEET PROCESSING APPARATUS AND IMAGE FORMING SYSTEM - A sheet processing apparatus including a stacking tray that stacks sheets, a conveying member that conveys a sheet to the stacking tray and discharges the sheet bundle from the stacking tray, wherein the conveying member includes a conveying roller and a conveying belt stretched by a plurality of stretch rollers, and a sheet processor that performs predetermined processing to the sheet bundle. When the conveying member conveys the sheet to the stacking tray, a part of the conveying belt that is not wound on the stretch roller contacts the conveying roller by moving the conveying belt as such a nip for conveying the sheet is formed. When the conveying member discharges the sheet bundle from the stacking tray, a part of the conveying belt that is wound on the stretch roller contacts the conveying roller by moving the conveying belt so that a nip for conveying the sheet is formed. | 2015-01-29 |
20150028541 | PROGRAM, SERVER, AND METHOD FOR PINBALL GAME - One object of a game program according to an embodiment is to provide a pinball game requiring more strategies. The game program comprises: a stage selection module for receiving stage selection by the user; a ball selection module for receiving selection of one or more ball objects by the user from a plurality of ball objects each having parameters; a screen display module for displaying a game screen; an owned point updating module for updating the owned point information such that the points are consumed in accordance with the game play; an injection module for injecting the ball objects; a ball-hitting operation module for operating flippers in accordance with instructions from the user; a game progress module for progressing the pinball game based at least on the parameters assigned to the selected ball objects; and a level updating module for updating the level of the ball objects. | 2015-01-29 |
20150028542 | Balanced Six-Sided Dice - Balanced six-sided dice are provided. In this regard, a representative die includes a cubical body provided with a corresponding set of five indicia on each face, wherein four of the five indicia of each set form a square pattern with a fifth of the indicia being positioned at a center of the corresponding face. | 2015-01-29 |
20150028543 | STRATEGIC BOARD GAME - The present invention dates to a board game in which a three piece rivalry system allows for interaction of player pieces in a battle simulation type game. | 2015-01-29 |
20150028544 | Modular Board Game - A board game is provided that includes a game board, game board enhancement pieces, game pieces and a rule set. The game board has a plurality of similarly shaped pieces configurable for connection to construct a variety of game playing surfaces. The game board enhancement pieces are configured to alter the game board through rule modifications or changes, physical barriers, elevated surfaces, depressed surfaces, or a combination thereof. The game pieces rest on the playing surface. The rule set is supplied either in print or via digital application or internet connection, and is modular to alter the game board and/or play of the board game. | 2015-01-29 |
20150028546 | PROJECTILE CONTAINMENT SYSTEM - Converging hardened steel plates are loosely mounted in a frame, with neoprene pads between them to better absorb the noise and impact from projectiles. The upstream end of the bullet trap is a target area, and a containment chamber communicates with the downstream ends of the plates defines a throat area. A transition area connects the chamber entry with the throat area. An impact plate between them has end portions fitted loosely in openings defined by the support frame. A plurality of vanes define the cylindrical chamber, and have loosely supported ends. These vanes have edges that abut and over-lap one another so movement of adjacent vanes will occur in response to one of these vanes being struck by a projectile. These vanes are normally restrained but can move radially outwardly when hit by a projectile. The number of vanes is less than 20 degrees in the chamber. | 2015-01-29 |
20150028547 | METHODS AND DEVICES FOR CUTTING COMPOSITE MATERIAL AND SEALING DEVICES MADE OF COMPOSITE MATERIAL - Then invention relates to seals, methods for making seals and devices for making seals wherein the seals comprise a rigid substrate with two substantially parallel major surfaces ( | 2015-01-29 |
20150028548 | TOOL HOLDER AND METHOD FOR PRODUCING A TOOL RECEIVING PORTION FOR SUCH A TOOL HOLDER - A tool holder with a main part, a deformable receiving portion for clamping a tool, and at least one blocking element which is designed to engage into a corresponding counter element on the tool in order to prevent the tool from moving axially out of the tool holder. The at least one blocking element is integrally formed with the receiving portion. A clamping system having such a tool holder and a method for producing a receiving portion for such a tool holder are also described. | 2015-01-29 |
20150028549 | ACTIVE ROAD NOISE CONTROL SYSTEM - An active road noise control system for a vehicle ( | 2015-01-29 |
20150028550 | Integrated System Of Independently-Variable Multi-Wheel Steering And Road Contact Geometry - Wheel assembly for a vehicle includes a wheel, at least one lower suspension link and an upper attachment joint, both being able to be attached to the vehicle, the wheel being able to rotate at 360° to steer the vehicle around a pivot line positioned by said at least one lower suspension link and said upper attachment joint once attached to the vehicle, a projection of the pivot line onto a vertical projection plane comprising a vertical axis passing through a contact point between the wheel and ground defining a caster angle with said vertical axis. The caster angle can be adjusted within a predetermined range, whatever the orientation of the projection plane. A distance between the upper attachment point and the contact point between the wheel and ground in relation to the adjusted caster angle can be adjusted. | 2015-01-29 |
20150028551 | Recuperating Passive And Active Suspension - An automobile includes an active suspension system and a leveling system. The leveling system receives high pressure fluid from the active suspension system in order to change static vehicle height and compensate for static load changes. | 2015-01-29 |
20150028552 | HYDRAULIC HEIGHT ADJUSTING SYSTEM FOR A VEHICLE - The system includes: a first pair of hydraulic linear actuators between a vehicle body and a respective rear wheel such that extension and compression the actuators causes increase and a decrease, respectively, in the height of the body from the ground at the rear axle; a second pair of actuators between the body and a respective front wheel such that extension and compression of the actuators causes increase and a decrease, respectively, in the height of the vehicle body from the ground at the front axle; a supply unit for generating a flow of fluid under pressure; a tank; a hydraulic circuit connecting the pairs of actuators, supply unit, and tank; and a flow controller arranged to control the fluid between the pairs of actuators such that, during raising or lowering of the vehicle body, the height at the front axle is always less than that at the rear axle. | 2015-01-29 |
20150028553 | ADJUSTMENT SYSTEM FOR STRAPS ON SNOWBOARD BINDINGS - The invention consist of a tool-less system applied for adjusting the wrist-strap and the toe-strap on snowboard bindings, where such tool-less system is made up with the combination of 3 elements, 1. It is tool-less so the attachment position of the binding strap can be unlocked from one position on the binding frame and locked into another position fairly easily with bare hands 2. It has a stable locking mechanism based on a profiled press-button/pin element fitting into at least one hole with profiled shape provided in the frame of the binding where also at least one hole provided in the strap(s) will fit in and be securely locked in when the button element is put in place 3. The press-button element is put in place from the inside and prevented from popping out during use also by the boot which blocks the only exit direction for the button element, which is inwards. The wrist-strap will further be prevented from popping out by the highback, which during riding covers the button element holding the wrist-strap in place. The toe-strap may further be prevented from popping out by the base-plate. | 2015-01-29 |
20150028554 | HAND TRUCK SYSTEM WITH REMOVABLE BIN - A wheeled hand truck system is provided having a removable and/or stackable bin or container formed by sidewalls and a bottom surface, the container having a plurality of leg slots and strap slots on one or more of the side walls, and a plurality of base plates secured to or formed with the exterior of the bottom surface and configured for engaging with a load supporting platform or support blade of a hand truck. The truck system may be configured for utilization of one or more bins or containers. More specifically, provided is a combination hand truck and bin that comprises a body, a load supporting platform or support blade, an axle, a wheel assembly having a pair of wheels, a bin or container, and a restraining device for retaining the bin or container securely on the platform or blade of the hand truck. | 2015-01-29 |
20150028555 | CASTER MOUNTING INTERFACE FOR INDUSTRIAL CART - An industrial cart has a caster interface which allows for the quick changing of wheel casters on the cart without the use of tools. The caster interface forms a three-sided pocket into which a wheeled caster seats. A plate of the caster seats within the pocket through an open end of the pocket. A locking mechanism is used to quickly and easily secure the caster into the pocket. | 2015-01-29 |
20150028556 | Frame Hanger For Vehicle Suspension - A frame hanger having a frame bracket adapted for connection to a vehicle frame rail, a spring box attached to the frame bracket, a gusset attached to the frame bracket and positioned within the spring box to form a first spring module and a second spring module, said spring box comprising a bottom wall, a top wall, and an outer side wall of the first spring module, and said spring box comprising a bottom wall a top wall and an outer side wall of the second spring module, and said gusset forming an inner side wall of the first spring module and an inner side wall of the second spring module. | 2015-01-29 |
20150028557 | Bicycle Chain Guide - The present invention reduces or eliminates suspension induced lower portion chain grow for rear derailer equipped bicycle drive trains using a pivoting mount for the common chain guide pulley. Attached about or near concentric with the chain ring and bottom bracket this mounting plate has a pivotally connected link to the suspension. The chain guide pulley is positioned to “take-up” or store some lower portion of chain length around the chain ring. Suspension activation creates pivotal movement of the guide mounting plate to relieve suspension induced chain grow by releasing some or the entire taken-up length of the lower portion of the drive chain. | 2015-01-29 |
20150028558 | WHEELCHAIR BOWLING KIT - A wheelchair bowling kit and bowling wheelchair are described. Embodiments of the wheelchair bowling kit can be implemented to allow a handicapped bowler to bowl more conventionally. Generally, the wheelchair bowling kit can include a drive mechanism and a locking mechanism. The drive mechanism can be implemented to propel a wheelchair forward using only one hand while the other hand is free to hold a bowling ball. The locking mechanism can be included to keep a castor of the wheelchair from rotating, resulting in the wheelchair moving in a substantially straight line. The bowling wheelchair can include components similar to the drive mechanism and locking mechanism that are manufactured as part of the bowling wheelchair. | 2015-01-29 |
20150028559 | WHEELCHAIR STRUCTURE AND SUSPENSION ASSEMBLY - The present invention relates to wheelchair improvements and, in particular, to a wheelchair including a monocoque structural skin according to one aspect, and a suspension assembly according to another aspect. | 2015-01-29 |
20150028560 | HUMAN-POWERED DRIVETRAIN - Embodiments described herein are configured to receive forces generated by a user moving their appendages, and convert the force into mechanical force and/or energy. More specifically, embodiments may convert axial and/or tangential force into rotational force. The rotational force may be utilized to power devices, drivetrains, vehicles, such as bicycles, tricycles, kayaks, boats, etc. | 2015-01-29 |
20150028561 | BICYCLE FRAME - A bicycle assembly can include a bicycle frame that can have a main frame, a sub-frame and a shock absorber. The sub-frame can move in relation to the main frame and the shock can be used to regulate that relationship. A extension body can be used to establish a rear pivot point of the shock absorber. In some embodiments, the extension body can also be used to adjust the length of the combined shock absorber and extension body. | 2015-01-29 |
20150028562 | Accessory Exchange System For Trailers - An accessory exchange system for trailers for that provides for various interchangeable accessories to be attached to the trailer. The accessory exchange system for trailers generally includes a mounting bracket for mounting to the frame of a trailer, a base coupler extending from the mounting bracket, a support arm removably connected to the base coupler, and an accessory device removably connected to the support arm. | 2015-01-29 |
20150028563 | WIDE SWING DRAWBAR SUPPORT ASSEMBLY - A drawbar support assembly includes a rail member attached to a hitch frame, a slider member and a drawbar support. The slider member is slidable in the rail member. The drawbar support has rollers which rollingly engage the slider member so that the drawbar is swingable laterally. The rail member includes a forwardly facing curved slot which slidably receives the tabs which project from the slider member. A spring unit is coupled between the rail member and the slider member and operates to urge the slider member to a central position relative to the rail member. | 2015-01-29 |
20150028564 | TOW HITCH WITH MOVABLE COUPLING - A tow hitch with a main body which is adapted to be fixed relative to a towing vehicle, and a coupling movable relative to the body between a first position arranged to engage a tow bar, and a second position for towing. | 2015-01-29 |
20150028565 | Removable Chain Attachment Insert - A chain attachment insert has a body with a flat underside, and provides an open loop chain attachment for receiving a chain or hook in a socket in the bed of a truck. A T-bolt portion of the chain attachment insert is received in the socket. A hole through the body extends parallel to the axis of rotation defined by the T-bolt portion, and an interference peg is vertically slidable into the hole after rotation of the chain attachment insert relative to the socket. The interference peg then rests with a portion of the interference peg in the socket to interfere with and prevent the chain attachment insert from rotating relative to the socket. A lock secures the interference peg within the hole in the body. | 2015-01-29 |