04th week of 2022 patent applcation highlights part 65 |
Patent application number | Title | Published |
20220028774 | SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028775 | INTEGRATED CIRCUIT PACKAGE AND DIE | 2022-01-27 |
20220028776 | SEMICONDUCTOR DEVICE WITH STRESS-RELIEVING STRUCTURES AND METHOD FOR FABRICATING THE SAME | 2022-01-27 |
20220028777 | CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME | 2022-01-27 |
20220028778 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028779 | INTEGRATED CIRCUIT DEVICE WITH CRENELLATED METAL TRACE LAYOUT | 2022-01-27 |
20220028780 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | 2022-01-27 |
20220028781 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | 2022-01-27 |
20220028782 | SEMICONDUCTOR DEVICE, AN IMAGE UNIT AND AN ENDOSCOPE SYSTEM | 2022-01-27 |
20220028783 | TOP VIA STACK | 2022-01-27 |
20220028784 | PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM LINE CUT DIELECTRIC | 2022-01-27 |
20220028785 | TOP VIA INTERCONNECT HAVING A LINE WITH A REDUCED BOTTOM DIMENSION | 2022-01-27 |
20220028786 | Semiconductor Device with Backside Spacer and Methods of Forming the Same | 2022-01-27 |
20220028787 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUG CONNECTED TO GATE STRUCTURE ON PMOS REGION | 2022-01-27 |
20220028788 | INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES | 2022-01-27 |
20220028789 | SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOCIATED SYSTEMS AND METHODS | 2022-01-27 |
20220028790 | HIGH DENSITY INTERCONNECT DEVICE AND METHOD | 2022-01-27 |
20220028791 | SEMICONDUCTOR PACKAGE | 2022-01-27 |
20220028792 | SEMICONDUCTOR INTERCONNECT, ELECTRODE FOR SEMICONDUCTOR DEVICE, AND METHOD OF PREPARING MULTIELEMENT COMPOUND THIN FILM | 2022-01-27 |
20220028793 | DEPOSITION OF METAL FILMS WITH TUNGSTEN LINER | 2022-01-27 |
20220028794 | SEMICONDUCTOR DEVICE, POWER CONVERTER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING POWER CONVERTER | 2022-01-27 |
20220028795 | RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS | 2022-01-27 |
20220028796 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | 2022-01-27 |
20220028797 | Bottom Barrier Free Interconnects Without Voids | 2022-01-27 |
20220028798 | SEMICONDUCTOR PACKAGES WITH INTEGRATED SHIELDING | 2022-01-27 |
20220028799 | MODULE AND METHOD OF MANUFACTURING THE SAME | 2022-01-27 |
20220028800 | SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR MANUFACTURING THE SAME | 2022-01-27 |
20220028801 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 2022-01-27 |
20220028802 | METHOD OF MAKING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIRCUIT | 2022-01-27 |
20220028803 | METHOD OF MAKING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIRCUIT | 2022-01-27 |
20220028804 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | 2022-01-27 |
20220028805 | PASSIVE DEVICE ORIENTATION IN CORE FOR IMPROVED POWER DELIVERY IN PACKAGE | 2022-01-27 |
20220028806 | SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING CAPACITOR | 2022-01-27 |
20220028807 | HIGH-FREQUENCY POWER TRANSISTOR AND HIGH-FREQUENCY POWER AMPLIFIER | 2022-01-27 |
20220028808 | MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY | 2022-01-27 |
20220028809 | ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE | 2022-01-27 |
20220028810 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE | 2022-01-27 |
20220028811 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE | 2022-01-27 |
20220028812 | SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE SUPPORT RING | 2022-01-27 |
20220028813 | Single-Shot Encapsulation | 2022-01-27 |
20220028814 | SEMICONDUCTOR DEVICE PACKAGES WITH ANGLED PILLARS FOR DECREASING STRESS | 2022-01-27 |
20220028815 | SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028816 | REDISTRIBUTION LAYER CONNECTION | 2022-01-27 |
20220028817 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2022-01-27 |
20220028818 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028819 | PACKAGE PROCESS, DAF REPLACEMENT | 2022-01-27 |
20220028820 | USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS | 2022-01-27 |
20220028821 | CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVICES AND RELATED METHODS OF SPUTTERING EUTECTIC ALLOYS | 2022-01-27 |
20220028822 | Hybrid Short Circuit Failure Mode Preform for Power Semiconductor Devices | 2022-01-27 |
20220028823 | Semiconductor Structure and Method | 2022-01-27 |
20220028824 | METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COPPER BONDING PASTE | 2022-01-27 |
20220028825 | SEMICONDUCTOR PACKAGES INCLUDING PASSIVE DEVICES AND METHODS OF FORMING SAME | 2022-01-27 |
20220028826 | STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUBSTRATE HEAT SINKS AND ASSOCIATED SYSTEMS AND METHODS | 2022-01-27 |
20220028827 | SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME | 2022-01-27 |
20220028828 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028829 | UNIFIED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND HETEROGENEOUS MEMORIES AND METHODS FOR FORMING THE SAME | 2022-01-27 |
20220028830 | SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS | 2022-01-27 |
20220028831 | MULTI-CHIP PACKAGE STRUCTURE | 2022-01-27 |
20220028832 | MULTI-CHIP PACKAGE STRUCTURE | 2022-01-27 |
20220028833 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING THE SAME | 2022-01-27 |
20220028834 | SEMICONDUCTOR PACKAGE | 2022-01-27 |
20220028835 | INTERLAYER CONNECTION OF STACKED MICROELECTRONIC COMPONENTS | 2022-01-27 |
20220028836 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2022-01-27 |
20220028837 | METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE | 2022-01-27 |
20220028838 | DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUCTOR DIE | 2022-01-27 |
20220028839 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028840 | Circuitry and Method of Forming a Circuitry | 2022-01-27 |
20220028841 | MICRO LED DEVICE AND MANUFACTURING METHOD THEREOF | 2022-01-27 |
20220028842 | HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME | 2022-01-27 |
20220028843 | Optoelectronic Device and Method for Manufacturing the Same | 2022-01-27 |
20220028844 | VOLTAGE REGULATING DEVICE | 2022-01-27 |
20220028845 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | 2022-01-27 |
20220028846 | BONDED SEMICONDUCTOR DIE ASSEMBLY CONTAINING THROUGH-STACK VIA STRUCTURES AND METHODS FOR MAKING THE SAME | 2022-01-27 |
20220028847 | SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | 2022-01-27 |
20220028848 | SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER | 2022-01-27 |
20220028849 | Module Structure and Electronic Apparatus | 2022-01-27 |
20220028850 | SEMICONDUCTOR DEVICES, SEMICONDUCTOR DEVICE PACKAGES, ELECTRONIC SYSTEMS INCLUDING SAME, AND RELATED METHODS | 2022-01-27 |
20220028851 | MULTICHIP PACKAGE MANUFACTURING PROCESS | 2022-01-27 |
20220028852 | INTEGRATED CIRCUIT (IC) DEVICE | 2022-01-27 |
20220028853 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE | 2022-01-27 |
20220028854 | TRANSISTORS WITH HYBRID SOURCE/DRAIN REGIONS | 2022-01-27 |
20220028855 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | 2022-01-27 |
20220028856 | Epitaxy Regions with Large Landing Areas for Contact Plugs | 2022-01-27 |
20220028857 | MEMORY DEVICE INCLUDING DOUBLE PN JUNCTIONS AND DRIVING METHOD THEREOF, AND CAPACITOR-LESS MEMORY DEVICE INCLUDING DOUBLE PN JUNCTIONS AND CONTROL GATES AND OPERATION METHOD THEREOF | 2022-01-27 |
20220028858 | 3D ARCHITECTURE OF TERNARY CONTENT-ADDRESSABLE MEMORY METHOD FOR THE SAME | 2022-01-27 |
20220028859 | MEMORY DEVICE | 2022-01-27 |
20220028860 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME | 2022-01-27 |
20220028861 | DUAL GATE CONTROL FOR TRENCH SHAPED THIN FILM TRANSISTORS | 2022-01-27 |
20220028862 | Array Of Capacitors And Method Used In Forming An Array Of Capacitors | 2022-01-27 |
20220028863 | METHOD FOR MANUFACTURING A CAPACITIVE ELEMENT, AND CORRESPONDING INTEGRATED CIRCUIT | 2022-01-27 |
20220028864 | LINE BENDING CONTROL FOR MEMORY APPLICATIONS | 2022-01-27 |
20220028865 | Semiconductor Constructions, Memory Arrays, Electronic Systems, and Methods of Forming Semiconductor Constructions | 2022-01-27 |
20220028866 | METHODS OF MANUFACTURING DYNAMIC RANDOM ACCESS MEMORY | 2022-01-27 |
20220028867 | TRANSISTOR, MEMORY AND METHOD OF FORMING SAME | 2022-01-27 |
20220028868 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2022-01-27 |
20220028869 | PILLAR-SHAPED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2022-01-27 |
20220028870 | ATOMIC LAYER DEPOSITION OF III-V COMPOUNDS TO FORM V-NAND DEVICES | 2022-01-27 |
20220028871 | SILICON OXIDE NITRIDE TUNNEL DIELECTRIC FOR A STORAGE TRANSISTOR IN A 3-DIMENSIONAL NOR MEMORY STRING ARRAY | 2022-01-27 |
20220028872 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | 2022-01-27 |
20220028873 | NON-VOLATILE MEMORY CELL ARRAYS WITH A SECTIONED ACTIVE REGION | 2022-01-27 |