04th week of 2017 patent applcation highlights part 56 |
Patent application number | Title | Published |
20170025568 | LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME - A light emitting diode and a method of manufacturing the light emitting diode are provided. The light emitting diode includes an n-type semiconductor layer, an inclined type superlattice thin film layer, an active layer, and a p-type semiconductor layer. The n-type semiconductor layer is disposed on a substrate. The inclined type superlattice thin film layer is disposed on the n-type semiconductor layer and includes a plurality of thin film pairs in which InGaN thin films and GaN thin films are sequentially stacked. The active layer having a quantum well structure is disposed on the inclined type superlattice thin film layer. The p-type semiconductor layer is disposed on the active layer. Composition ratio of Indium (In) included in the InGaN thin film is increased as getting closer to the active layer. Thus, internal residual strain is reduced, and quantum confinement effect is enhanced, and internal quantum efficiency is increased. | 2017-01-26 |
20170025569 | OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF - The invention concerns an optoelectronic component comprising a layer structure with a light-active layer. In a first lateral region the light-active layer has a higher density of V-defects than in a second lateral region. | 2017-01-26 |
20170025570 | Light-Emitting Semiconductor Chip - A semiconductor chip includes a semiconductor body with a semiconductor layer sequence. An active region intended for generating radiation is arranged between an n-conductive multilayer structure and a p-conductive semiconductor layer. A doping profile is formed in the n-conductive multilayer structure which includes at least one doping peak. | 2017-01-26 |
20170025571 | LIGHT EMITTING DIODE WITH HIGH EFFICIENCY - A light emitting diode includes a light emitting structure including first and second conductive type semiconductor layers, an active layer, a first electrode electrically connected to the first conductive type semiconductor layer, a current blocking layer disposed on a lower surface of the light emitting structure, and a second electrode electrically connected to the second conductive type semiconductor layer. The second electrode includes a first reflective metal layer adjoining the second conductive type semiconductor layer, and a second reflective metal layer covering a lower surface of the current blocking layer and a lower surface of the first reflective metal layer, and adjoining the second conductive type semiconductor layer. A contact resistance between the second reflective metal layer and the second conductive type semiconductor layer is higher than a contact resistance between the first reflective metal layer and the second conductive type semiconductor layer. | 2017-01-26 |
20170025572 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light emitting device includes a base member; a light emitting element mounted on the base member; a light-transmissive member that covers an upper surface of the light emitting element, and is substantially rectangular in a plan view; and a light reflecting member that covers a lateral surface of the light-transmissive member, the light reflecting member having a substantially rectangular frame shape in a plan view. A width of the light reflecting member is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member. A height of the light reflecting member is smaller along the short side of the light-transmissive member than along the long side of the light-transmissive member at a position separated from an outer edge of the light reflecting member by a predetermined distance. | 2017-01-26 |
20170025573 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE USING SAME - A semiconductor light emitting device may include a substrate including: a first region having a first pattern; and a second region having a second pattern surrounding the first pattern, the second pattern being different from the first pattern; and a light emitting structure disposed on the first and second regions and including: a first conductive semiconductor layer; an active layer; and a second conductive semiconductor layer. | 2017-01-26 |
20170025574 | OPTOELECTRONIC SEMICONDUCTOR ELEMENT, OPTOELECTRONIC SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR ELEMENTS - An optoelectronic semiconductor element may include at least one LED chip which emits infrared radiation via a top side during operation. The radiation has a global intensity maximum at wavelengths between 800 nm and 1100 nm. The radiation has, at most 5% of the intensity of the intensity maximum at a limit wavelength of 750 nm. The radiation has a visible red light component. The semiconductor element may further include a filter element, which is arranged directly or indirectly on the top side of the LED chip and which has a transmissivity of at most 5% for the visible red light component of the LED chip, wherein the transmissivity of the filter element is at least 80%, at least in part, for wavelengths between the limit wavelength and 1100 nm, and a radiation exit surface provided for emitting the filtered radiation. | 2017-01-26 |
20170025575 | Light Emitting Diode Chip and Fabrication Method - A light emitting diode chip includes an epitaxial layer with a plurality of recess portions and protrusion portions over the top layer; a light transmission layer, located between top ends of adjacent protrusion portions and forming holes with the recess portions. The light transmission layer has a horizontal dimension larger than a width of the top ends of two adjacent protrusion portions, and serves as current blocking layer; a current spreading layer covering the surface of the light transmission layer and the surface of an epitaxial layer of a non-mask light transmission layer. As the refractive index of the light transmission layer is between those of the epitaxial layer and the hole, indicating a difference of refractive index between the light transmission layer and the epitaxial layer, the probability of scattering generated when light from a luminescent layer emits upwards can be increased, thus avoiding light absorption by electrodes and improving light extraction efficiency. | 2017-01-26 |
20170025576 | CONTROL OF P-CONTACT RESISTANCE IN A SEMICONDUCTOR LIGHT EMITTING DEVICE - A device according to embodiments of the invention includes a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A surface of the p-type region perpendicular to a growth direction of the semiconductor structure includes a first portion and a second portion. The first portion is less conductive than the second portion. The device further includes a p-contact formed on the p-type region. The p-contact includes a reflector and a blocking material. The blocking material is disposed over the first portion and no blocking material is disposed over the second portion. | 2017-01-26 |
20170025577 | High-Brightness Light-Emitting Diode with Surface Microstructures - A high-brightness light-emitting diode with surface microstructure and preparation and screening methods thereof are provided. The ratio of total roughened surface area of light transmission surface of a light emitting diode to vertically projected area is greater than 1.5, and the peak density of light transmission surface is not less than 0.3/um | 2017-01-26 |
20170025578 | NITRIDE SEMICONDUCTOR ELEMENT - According to one embodiment, a nitride semiconductor element includes a p-type semiconductor layer and a p-side electrode. The p-type semiconductor layer includes a nitride semiconductor, and has a first surface. The p-side electrode contacts the first surface. The first surface is a semi-polar plane. The first surface includes a plurality of protrusions. A height of the protrusions along a first direction is not less than 1 nanometer and not more than 5 nanometers. The first direction is from the p-type semiconductor layer toward the p-side electrode. A density of the protrusions in the first surface is more than 1.0×10 | 2017-01-26 |
20170025579 | LIGHT EMITTING DEVICE, ELECTRODE STRUCTURE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided are a light emitting device, an electrode structure, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure layer comprising a first semiconductor layer, a second semiconductor layer, and an active layer. An electrode disposed on a top surface of the first semiconductor layer, a first layer includes a transmittive oxide material between the top surface of the first semiconductor layer and the electrode, and a second layer disposed is disposed between the first layer and the electrode, wherein the first layer is formed in a different material from the second layer, wherein the electrode comprises a lower portion connected to the first semiconductor layer and an upper portion on a top surface of the second layer. | 2017-01-26 |
20170025580 | Integrated LED Light-Emitting Device and Fabrication Method Thereof - A light-emitting diode (LED) includes: an epitaxial structure having an upper and a lower surface, wherein the upper surface comprises a light-emitting surface; at least one insulating layer over the lower surface; and an electrode pad layer over the at least one insulating layer; wherein: the electrode pad layer comprises a P electrode region and an N electrode region; and the at least one insulating layer is configured to adjust a distribution of the P and N electrode regions over the electrode pad layer | 2017-01-26 |
20170025581 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT - An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body; at least one via including an electrically conductive material; and at least one electrically conductive connection electrically conductively connected to the semiconductor chip and the via, wherein the via is laterally spaced part from the semiconductor chip; the via includes a contact pin, the contact pin including an electrically conductive material; and the contact pin is laterally completely enclosed by the shaped body. | 2017-01-26 |
20170025582 | PHOTOLUMINESCENCE MATERIAL COATING OF LED CHIPS - A photoluminescence sheet comprises a polymer sheet having particles of at least one photoluminescence material homogeneously distributed throughout its volume. The polymer sheet comprises a UV-curable polymer that is partially cured and which is thermally re-flowable before being fully cured by exposure to UV light. | 2017-01-26 |
20170025583 | SEMICONDUCTOR PHOSPHOR NANOPARTICLE, SEMICONDUCTOR PHOSPHOR NANOPARTICLE-CONTAINING GLASS, LIGHT EMITTING DEVICE, AND LIGHT EMITTING ELEMENT - There is provided a semiconductor phosphor nanoparticle comprising: a nano particle core composed of a compound semiconductor, a first coating layer coating the nano particle core, and a second coating layer bonded to an outer surface of the first coating layer through Si—O bonding. | 2017-01-26 |
20170025584 | COLOR-CONVERTING SUBSTRATE FOR LIGHT-EMITTING DIODE AND METHOD FOR PRODUCING SAME - The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-converting substrate of a light-emitting diode capable of completely protecting the quantum dots (QD) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate. To that end, provided are a color-conversion substrate of a light-emitting diode and a method for producing the color-conversion substrate, the color-conversion substrate of a light-emitting diode comprising: a first substrate and a second substrate arranged facing each other on a light-emitting diode; a sheet, having a hole, arranged in between the first and second substrates; QDs filling the hole; and sealing material disposed in between the first substrate and the lower surface of the sheet and in between the second substrate the upper surface of the sheet, wherein the sealing material is disposed along the edge of the hole, and the sheet is made of a substance allowing laser sealing of the sealing material, first substrate and second substrate. | 2017-01-26 |
20170025585 | Fluorescent Strip and Light-Emitting Diode (LED) Packaging Module Employing Same - The invention provides a fluorescent strip, which covers a luminous body, wherein the fluorescent strip includes a fluorescent powder layer and at least two protective layers; and the fluorescent powder layer is sandwiched between the two protective layers, so that the falling of fluorescent powder is avoided, a function of protecting and limiting the fluorescent powder is realized, and the fluorescent powder is uniformly laid on a surface of the luminous body. The fluorescent strip further includes a light converging layer, wherein the light converging layer covers the outer protective layer; and light emitted from the luminous body sequentially passes through the inner protective layer, the fluorescent power layer, the outer protective layer and the light converging layer, and is converged into light rays through the light converging layer. | 2017-01-26 |
20170025586 | LIGHT EMITTING DEVICE - A light emitting device includes a substrate, a light emitting element mounted on the substrate, a phosphor plate for covering an upper surface of the light emitting element, a white reflecting resin placed on the substrate to surround side surfaces of the light emitting element and the phosphor plate, and a reflecting frame, including a reflecting film formed by plating and a bonding portion, and placed on the substrate to surround the light emitting element, the phosphor plate, and the white reflecting resin. The reflecting frame is directly bonded to the substrate by the bonding portion in a portion where the white reflecting resin is not located. | 2017-01-26 |
20170025587 | LIGHT EMITTING DIODE DEVICE AND METHOD FOR PRODUCTION THEREOF CONTAINING CONVERSION MATERIAL CHEMISTRY - In one embodiment, a device can comprise: a light emitting diode located in a housing. The housing is formed from a polymer composition comprising: a polymer material, wherein the polymer material comprises at least one of polyolefins, polyesters, cyanoacrylate, cellulose triacetate, ethyl vinyl acetate, propyl vinyl acetate, polyvinylbutyral, polyvinyl chloride, polycarbonate, polyethylene naphthalate, polyurethane, thermoplastic polyurethane, polyamide, polymethyl methacrylate, polystyrene, cellulose nitrate, and combinations comprising at least one of the foregoing polymer materials; and a coated conversion material wherein the coated conversion material comprises an inorganic material that converts radiation of a certain wavelength and re-emits of a different wavelength. The coated conversion material can have a coating comprising at least one of a silicone oil and amorphous silica and, after the coated conversion material has been exposed to an excitation source, it can have a luminescence lifetime of less than 10 | 2017-01-26 |
20170025588 | MANUFACTURING METHOD OF A FLIP-CHIP LIGHT EMITTING DIODE PACKAGE MODULE - The instant disclosure relates to a flip-chip LED package module and a method of manufacturing thereof. The method of manufacturing flip-chip LED package module comprises the following steps. A plurality of LEDs is disposed on a carrier. A packaging process is forming a plurality of transparent lens corresponding to LEDs and binding each other by a wing portion. A separating process is proceeding to form a plurality of flip-chip LED structures without the carrier. A bonding process is proceeding to attach at least one flip-chip LED structure on the circuit board. | 2017-01-26 |
20170025589 | LIGHT EMITTING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - The present disclosure provide a light emitting device package, including a light emitting die emitting a first color and an encapsulant encapsulating the light emitting die. The encapsulant includes a matrix and a plurality of inert particles dispersed in the matrix. The inert particles are transparent to the first color, and a radiation pattern of the light emitting package is lambertian-like. | 2017-01-26 |
20170025590 | LIGHT EMITTING DIODE - Disclosed herein is a light emitting diode. The light emitting diode includes: a light emitting diode chip; a first molding portion covering the light emitting diode chip and having a first index of refraction; a second molding portion covering the first molding portion and having a second index of refraction, wherein the second index of refraction is not higher than the first index of refraction. The light emitting diode chip is covered by a molding portion having a high index of refraction and a molding portion having a low index of refraction and covering the molding portion having a high index of refraction in order to reduce total reflection in the molding portions through reduction in difference in index of refraction between external air and the molding portion having a high index of refraction, thereby improving quantity of light. | 2017-01-26 |
20170025591 | LIGHT-EMITTING DEVICE - A light-emitting device includes a carrier with a first surface and a second surface opposite to the first surface; and a light-emitting unit disposed on the first surface and configured to emit a light toward but not passing through the first surface. When emitting the light, the light-emitting device has a first light intensity above the first surface, and a second light intensity under the second surface, a ratio of the first light intensity to the second light intensity is in a range of 2˜9. | 2017-01-26 |
20170025592 | LIGHT EMITTING STRUCTURE AND A MANUFACTURING METHOD THEREOF - A light-emitting structure comprises a semiconductor light-emitting element which includes a first connection point and a second connection point. The light-emitting structure further includes a first electrode electrically connected to the first connection point, and a second electrode electrically connected the second connection point. The first electrode and the second electrode can form a concave on which the semiconductor light-emitting element is located. | 2017-01-26 |
20170025593 | REDISTRIBUTION LAYER FOR SUBSTRATE CONTACTS - A structure with an interconnection layer for redistribution of electrical connections includes a plurality of first electrical connections disposed on a substrate in a first arrangement. An insulating layer is disposed on the substrate over the first electrical connections. A plurality of second electrical connections is disposed on the insulating layer on a side of the insulating layer opposite the plurality of first electrical connections in a second arrangement. Each second electrical connection is electrically connected to a respective first electrical connection. An integrated circuit is disposed on the substrate and is electrically connected to the first electrical connections. The first electrical connections in the first arrangement have a greater spatial density than the second electrical connections in the second arrangement. | 2017-01-26 |
20170025594 | THERMOELECTRIC DEVICES - An embodiment of a thermoelectric device may include a plurality of thermoelectric cells disposed between first and second planes. Each of the thermoelectric cells may include a thermoelectric element formed from a thermoelectric material of a single semiconductor type, the thermoelectric element including a first end, a second end, and a portion extending from the first end to the second end, the portion extending from the first end to the second end including at least two surfaces that face each other; and at least one conductive element electrically connected to and extending away from the second end of the thermoelectric element toward the first end of the thermoelectric element of another thermoelectric cell. Each thermoelectric cell also may further include an insulating element disposed between the at least two surfaces of the thermoelectric element and between portions of the at least one conductive element. | 2017-01-26 |
20170025595 | PIEZOELECTRIC VIBRATION MODULE - A piezoelectric vibration module includes external electrodes arranged in a stack direction on the outside surface of a piezoelectric device so that the state in which the piezoelectric device is coupled to the terminals of an FPCB can be reliably maintained even in a piezoelectric device bending phenomenon dependent on the repetition of contraction and/or expansion of the piezoelectric device. A portion in which the external electrodes of the piezoelectric device come in contact with the FPCB may be placed in a portion having small displacement. | 2017-01-26 |
20170025596 | Tunable film bulk acoustic resonators and filters - In wireless communications, many radio frequency bands are used. For each frequency band, there are two frequencies, one for transmitting and the other for receiving. As the band widths are small and separation between adjacent bands is also small, many band pass filters with different band pass frequencies are required for each communication unit such as mobile handset. The invention provides tunable film bulk acoustic resonators TFBARs containing semiconducting piezoelectric layers and methods for tuning and adjusting the resonant properties. When a DC biasing voltage is varied, both the depletion region thickness and neutral region thickness associated in the semiconducting piezoelectric layers varies leading to changes in equivalent capacitances, inductance and resistances and hence the resonance properties and frequencies. A plurality of the present TFBARs are connected into a tunable oscillator or a tunable and selectable microwave filter for selecting and adjusting of the bandpass frequency by varying the biasing voltages. | 2017-01-26 |
20170025597 | FERROELECTRIC FILM AND METHOD FOR MANUFACTURING THE SAME - To produce a ferroelectric film formed of a lead-free material. The ferroelectric film according to an aspect of the present invention includes a (K | 2017-01-26 |
20170025598 | ELECTRONIC DEVICE - This technology provides an electronic device. An electronic device in accordance with an implementation of this document includes a semiconductor memory, and the semiconductor memory may include a substrate; a plurality of structures formed over the substrate to be spaced apart from each other, each structure comprising a free layer having a variable magnetization direction, a pinned layer having a pinned magnetization direction, and a tunnel barrier layer interposed between the free layer and the pinned layer; and a magnetic correction layer formed adjacent to the plurality of structures and structured to reduce an influence to the free layer by a stray magnetic field generated by the pinned layer. | 2017-01-26 |
20170025599 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - An electronic device may include a semiconductor memory. The semiconductor memory may include a variable resistance element including a ferromagnetic layer including a hydrogen group; an oxide spacer formed on sidewalls of the variable resistance element; and a nitride spacer formed on the oxide spacer. | 2017-01-26 |
20170025600 | MAGNETORESISTIVE ELEMENT AND MAGNETIC MEMORY - A magnetoresistive element includes a reference layer having a fixed magnetization direction and including a ferromagnetic material containing Fe or Co, a recording layer having a variable magnetization direction and including a ferromagnetic material, and one non-magnetic layer that is formed between the reference layer and the recording layer and that contains oxygen. One of the reference layer and the recording layer contains Fe. The three layers are arranged so that a magnetization direction of the one of the reference layer and the recording layer becomes perpendicular to a layer surface by an interfacial perpendicular magnetic anisotropy at an interface between the one of the reference layer and the recording layer and the one non-magnetic layer resulting from the one of the reference layer and the recording layer having a predetermined thickness. The one of the reference layer and the recording layer has a bcc structure. | 2017-01-26 |
20170025601 | 3D MRAM WITH THROUGH SILICON VIAS OR THROUGH SILICON TRENCHES MAGNETIC SHIELDING - Emerging memory chips and methods for forming an emerging memory chip are presented. For example, magnetoresistive random access memory (MRAM) chip magnetic shielding and vertical stacking capabilities processed at the wafer-level are disclosed. The method includes providing a magnetic shield in the through silicon vias and/or through silicon trenches surrounding or adjacent to magnetic tunnel junction (MTJ) array within the MRAM region and also at the front side and back side of the chip. Magnetic shield in the through silicon trenches connects front side and back side magnetic shield. Magnetic shield in the through silicon vias provides vertical stacking, magnetic shielding and electrical connection of the MRAM chips to form 3D IC packages. This magnetic shielding method is applicable for both in-plane and perpendicular MRAM chips. The MTJ array is formed in the MRAM region and in between adjacent inter layer dielectric (ILD) levels of the upper ILD layer in the back end of line (BEOL) of the MRAM chip. | 2017-01-26 |
20170025602 | Magnetic Tunnel Junction with Low Defect Rate after High Temperature Anneal for Magnetic Device Applications - A magnetic tunnel junction is disclosed wherein the reference layer and free layer each comprise one layer having a boron content from 25 to 50 atomic %, and an adjoining second layer with a boron content from 1 to 20 atomic %. One of the first and second layers in each of the free layer and reference layer contacts the tunnel barrier. Each boron containing layer has a thickness of 1 to 10 Angstroms and may include one or more B layers and one or more Co, Fe, CoFe, or CoFeB layers. As a result, migration of non-magnetic metals along crystalline boundaries to the tunnel barrier is prevented, and the MTJ has a low defect count of around 10 ppm while maintaining an acceptable TMR ratio following annealing to temperatures of about 400° C. The boron containing layers are selected from CoB, FeB, CoFeB and alloys thereof including CoFeNiB. | 2017-01-26 |
20170025603 | SEMICONDUCTOR DEVICE PRODUCTION METHOD AND PRODUCTION APPARATUS - A method for producing a semiconductor device capable of showing its desired performance. In an etching module of a semiconductor device production apparatus, a plasma etching is performed for a stack structure of a wafer such that a portion not covered by a hard mask in the stack structure is etched away. The wafer having a pillar structure whose lateral side is inclined by the plasma etching is loaded into a trimming module. An acetic acid gas is supplied into a processing chamber of the trimming module. In addition, an oxygen GCIB is irradiated from a GCIB irradiating device toward the pillar structure. | 2017-01-26 |
20170025604 | Array Of Cross Point Memory Cells And Methods Of Forming An Array Of Cross Point Memory Cells - A method of forming an array of cross point memory cells comprises forming spaced conductive lower electrode pillars for individual of the memory cells being formed along and elevationally over spaced lower first lines. Walls cross elevationally over the first lines and between the electrode pillars that are along the first lines. The electrode pillars and walls form spaced openings between the first lines. The openings are lined with programmable material of the memory cells being formed to less-than-fill the openings with the programmable material. Conductive upper electrode material is formed over the programmable material within remaining volume of the openings and spaced upper second lines are formed which cross the first lines elevationally over the conductive upper electrode material that is within the openings. A select device is between the lower electrode pillar and the underlying first line or is between the conductive upper electrode material and the overlying second line for the individual memory cells. Aspects of the invention include an array of cross point memory cells independent of method of manufacture. | 2017-01-26 |
20170025605 | RESISTIVE RANDOM ACCESS MEMORY DEVICE EMBEDDING TUNNEL INSULATING LAYER AND MEMORY ARRAY USING THE SAME AND FABRICATION METHOD THEREOF - A resistive random access memory device is provided with a tunneling insulator layer between a resistance change layer and a bottom electrode. Thus, it is possible: to raise the selection (on/off) ratio by the current of a direct tunneling induced by low voltage in the unselected cell and the current of an F-N tunneling induced by high voltage in the selected cell, to efficiently suppress the leakage current in the read operation, to make a low current operation less μA level by controlling the thickness of the tunneling insulator layer, and to be simultaneously fabricated together with circuit devices by forming the bottom electrodes (word lines) with a semiconductor material. | 2017-01-26 |
20170025606 | Semiconductor Constructions and Memory Arrays - Some embodiments include semiconductor constructions having an electrically conductive interconnect with an upper surface, and having an electrically conductive structure over the interconnect. The structure includes a horizontal first portion along the upper surface and a non-horizontal second portion joined to the first portion at a corner. The second portion has an upper edge. The upper edge is offset relative to the upper surface of the interconnect so that the upper edge is not directly over said upper surface. Some embodiments include memory arrays. | 2017-01-26 |
20170025607 | METHOD FOR PRODUCING A RESISTIVE RANDOM ACCESS MEMORY - A method for producing a resistive random access memory includes preparing a first metal layer and sputtering a resistive switching layer on the first metal layer. Surface treatment is conducted on the resistive switching layer by using a plasma containing mobile ions to dope the mobile ions into the resistive switching layer. The polarity of the mobile ions is opposite to the polarity of oxygen ions. Then, a second metal layer is sputtered on the resistive switching layer. | 2017-01-26 |
20170025608 | PHOTOACTIVE COMPOSITION - There is disclosed a photoactive composition; and there is also disclosed an organic electronic device comprising a first electrical contact, a second electrical contact and a photoactive layer therebetween, the photoactive layer comprising the photoactive composition. | 2017-01-26 |
20170025609 | ELECTROACTIVE MATERIALS - There is disclosed a compound having Formula I | 2017-01-26 |
20170025610 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an organic light-emitting display apparatus including forming a liftoff layer containing a fluoropolymer on a substrate, forming a photoresist on the liftoff layer and patterning the photoresist by removing a portion thereof, etching, using a first solvent, the liftoff layer in a region where the photoresist is removed so that a portion of the liftoff layer remains on the substrate, forming an etch stop layer above the liftoff layer that remains on the substrate and above a region where the photoresist remains on the liftoff layer, and removing, using a second solvent, the liftoff layer under the region where the photoresist remains on the liftoff layer. | 2017-01-26 |
20170025611 | MASK AND METHOD FOR MANUFACTURING DISPLAY PANEL - The present disclosure relates to a mask and a method for manufacturing a display panel. The mask includes: a body provided with a plurality of openings for defining pixel patterns and partition areas each of which is located among adjacent openings; and at least partition member provided on the partition areas. Using the mask and manufacturing provided by the present disclosure, pixel color mixing can be reduced. | 2017-01-26 |
20170025612 | Organic Electronic Compositions and Device Thereof - The present invention relates to organic electronic devices, and more specifically to organic field effect transistors, comprising a dielectric layer that comprises a polycycloolefinic polymer with an olefinic side chain. | 2017-01-26 |
20170025613 | COMPOSITION AND POLYMER COMPOUND, AND ORGANIC SEMICONDUCTOR DEVICE COMPRISING THE COMPOSITION OR THE POLYMER COMPOUND - A composition comprising a polymer compound containing a structural unit represented by the formula (1) and a compound represented by the formula (2): | 2017-01-26 |
20170025614 | SELF-ALIGNED VERTICAL CNT ARRAY TRANSISTOR - A transistor device includes an array of fin structures arranged on a substrate, each of the fin structures being vertically alternating stacks of a first isoelectric point material having a first isoelectric point and a second isoelectric point material having a second isoelectric point that is different than the first isoelectric point; one or more carbon nanotubes (CNTs) suspended between the fin structures and contacting a side surface of the second isoelectric point material in the fin structures; a gate wrapped around the array of CNTs; and source and drain contacts arranged over the fin structures; wherein each of the fin structures have a trapezoid shape or parallel sides that are oriented about 90° with respect to the substrate. | 2017-01-26 |
20170025615 | Light-Emitting Element, Display Device, Electronic Device, and Lighting Device - Provided is a light-emitting element including a first organic compound, a second organic compound, and a guest material. The LUMO level of the first organic compound is lower than that of the second organic compound. The HOMO level of the first organic compound is lower than that of the second organic compound. The LUMO level of the guest material is higher than that of the first organic compound. The HOMO level of the guest material is higher than that of the second organic compound. An energy difference between the LUMO level and the HOMO level of the guest material is larger than an energy difference between the LUMO level of the first organic compound and the HOMO level of the second organic compound. The guest material can convert triplet excitation energy into light emission. The combination of first organic compound and the second organic compound can form an exciplex. | 2017-01-26 |
20170025616 | ANTHRACENE COMPOUND, LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC APPLIANCE, AND LIGHTING DEVICE - An organic compound having a high T | 2017-01-26 |
20170025617 | ORGANIC LIGHT-EMITTING ELEMENT - An organic light-emitting element is provided, including: an anode; a first hole assisting layer and a second hole assisting layer sequentially formed on the anode; a light-emitting layer formed on and in contact with the second hole assisting layer, the light-emitting layer including a host luminesce containing a compound having a carbazole group; at least one electron transport layer formed on the light-emitting layer; and a cathode formed on the electron transport layer, the second hole assisting layer including a hole transport compound represented by formula (I) to improve the performance of the organic light-emitting element. | 2017-01-26 |
20170025618 | Organic Electroluminescent Materials and Devices - Compounds containing indolocarbazole and terphenyl building blocks are disclosed in this application. These compounds are useful for application in organic electroluminescent devices. | 2017-01-26 |
20170025619 | ORGANIC LIGHT-EMITTING DEVICE - An organic light-emitting device includes a first electrode, a second electrode disposed opposite to the first electrode, and an organic layer disposed between the first electrode and the second electrode and including an emission layer. The emission layer includes at least one first light-emitting material represented by Formula 1 and at least one second light-emitting material represented by Formula 2: | 2017-01-26 |
20170025620 | CONDENSED CYCLIC COMPOUND AND ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME - A condensed cyclic compound represented by Formula 1: | 2017-01-26 |
20170025621 | Light-Emitting Element, Light-Emitting Device, Electronic Device, Lighting Device, and Lighting System - A light-emitting element that contains a fluorescent compound, which has high efficiency is provided. A light-emitting element in which the proportion of delayed fluorescence to the total light emitted from the light-emitting element is higher than that in a conventional light-emitting element is provided. Emission efficiency of the light-emitting element containing a fluorescent compound can be improved by increasing the probability of TTA caused by an organic compound in an EL layer, converting energy of triplet excitons, which does not contribute to light emission, into energy of singlet excitons, and making the fluorescent compound emit light by energy transfer of the singlet excitons. | 2017-01-26 |
20170025622 | ULTRASENSITIVE SOLUTION-PROCESSED PEROVSKITE HYBRID PHOTODETECTORS - A photodetector includes an active layer formed of an inorganic/organic hybrid perovskite material, such as organometal halide perovskites. The perovskite hybrid photodetector provides low dark-current densities and high external-quantum efficiencies, resulting in a photodetector with enhanced photoresponsivity and detectivity. Advantageously, the perovskite hybrid photodetector may be prepared by solution processing, and is compatible with large-scale manufacturing techniques. | 2017-01-26 |
20170025623 | Metal Complex and Organic Light-Emitting Component - A metal complex and an organic light-emitting component are disclosed. In an embodiment, the metal complex includes the following structural formula I: | 2017-01-26 |
20170025624 | Metal Complex and Organic Light-Emitting Component - A metal complex and an organic light-emitting component are disclosed. In an embodiment the metal complex includes the following structural formula I: | 2017-01-26 |
20170025625 | Metal Complex and Organic Light-Emitting Component - A metal complex and an organic light-emitting component are disclosed. In an embodiment, the metal complex includes the following structural formula I: | 2017-01-26 |
20170025626 | Metal Complexes Comprising Diazabenzmidazolocarbene Ligands and the Use Thereof in OLEDS - The present invention relates to metal-carbene complexes comprising a central atom selected from iridium and platinum, and diazabenzimidazolocarbene ligands, to organic light diodes which comprise such complexes, to light-emitting layers comprising at least one such metal-carbene complex, to a device selected from the group comprising illuminating elements, stationary visual display units and mobile visual display units comprising such an OLED and to the use of such a metal-carbene complex in OLEDs, for example as emitter, matrix material, charge transport material and/or charge or exciton blocker. | 2017-01-26 |
20170025627 | SILYL-BENZIMIDAZOLO[1,2-A]BENZIMIDAZOLE AS HOST FOR ORGANIC LIGHT EMITTING DIODES - The present invention relates to compounds of formula (I) and their use in electronic devices, especially electroluminescent devices. When used as hole transport material in electroluminescent devices, the compounds of formula (I) may provide improved efficiency, stability, manufacturability, or spectral characteristics of electroluminescent devices. | 2017-01-26 |
20170025628 | ORGANIC THIN FILM PHOTOVOLTAIC DEVICE, FABRICATION METHOD THEREOF, AND ELECTRONIC APPARATUS - An organic thin film photovoltaic device ( | 2017-01-26 |
20170025629 | Organic Electroluminescent Device with Multiple Phosphorescent Emitters - A multiple emitter organic light emitting diode (OLED) is provided. The OLED comprises a host having a triplet energy gap. At least one emitter having a triplet energy gap greater than the triplet energy gap of the host is doped into the host and at least one other emitter having a triplet energy gap less than the triplet energy gap of the host is also doped into the host. | 2017-01-26 |
20170025630 | Light-Emitting Element, Display Device, Electronic Device, and Lighting Device - A light-emitting element with high emission efficiency. The light-emitting element includes a first organic compound, a second organic compound, and a guest material. The LUMO level of the first organic compound is lower than the LUMO level of the second organic compound. The HOMO level of the first organic compound is lower than the HOMO level of the second organic compound. The HOMO level of the guest material is higher than the HOMO level of the second organic compound. The energy difference between the LUMO level of the guest material and the HOMO level of the guest material is larger than the energy difference between the LUMO level of the first organic compound and the HOMO level of the second organic compound. The guest material has a function of converting triplet excitation energy into light emission. The first organic compound and the second organic compound form an exciplex. | 2017-01-26 |
20170025631 | ORGANIC LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DIODE DISPLAY INCLUDING THE SAME - An organic light emitting element according to an example embodiment of the present disclosure includes: an anode and a cathode facing each other; an emission layer between the anode and the cathode; an electron transfer layer between the emission layer and the cathode; and a buffer layer between the cathode and the electron transfer layer, wherein the buffer layer includes an inorganic metal halide having p-type semiconductor characteristics. | 2017-01-26 |
20170025632 | DISPLAY APPARATUS - A display apparatus including a substrate having an active area and a sealing area surrounding the active area; a display unit disposed on the active area of the substrate; a sealing member including a recess, which is formed in the sealing area of the substrate and is concave in a direction from an edge of the substrate to the active area of the substrate or from the active area of the substrate to the edge of the substrate; and an alignment mark disposed between the recess and the edge of the substrate or between the recess and the active area of the substrate. | 2017-01-26 |
20170025633 | Method for Manufacturing Sealed Structure - A method for manufacturing a sealed structure in which few cracks are generated is provided. Scan with the laser beam is performed so that there is no difference in an irradiation period between the middle portion and the perimeter portion of the glass layer and so that the scanning direction is substantially parallel to the direction in which solidification of the glass layer after melting proceeds. More specifically, in a region where the beam spot is overlapped with the glass layer, scan is performed with a laser beam having a beam spot shape whose width in a scanning direction is substantially uniform. Further, as a laser beam with which the glass layer is irradiated, a laser beam (a linear laser beam) having a linear beam spot shape with a major axis and a minor axis which is orthogonal to the major axis. | 2017-01-26 |
20170025634 | FOLDABLE DISPLAY APPARATUS - A foldable display apparatus includes a flexible display panel that is foldable, and a case configured to support the flexible display panel, wherein the flexible display panel includes a first protective film at a first region corresponding to an out-folding portion, and a second protective film at a second region corresponding to an in-folding portion, wherein the in-folding portion and the out-folding portion have opposite directions of curvature, and wherein the first and second protective films include different materials. | 2017-01-26 |
20170025635 | MIXED METAL-SILICON-OXIDE BARRIERS - A method of forming a thin barrier film of a mixed metal-silicon-oxide is disclosed. For example, a method of forming an aluminum-silicon-oxide mixture having a refractive index of 1.8 or less comprises exposing a substrate to sequences of a non-hydroxylated silicon-containing precursor, activated oxygen species, and metal-containing precursor until a mixed metal-silicon-oxide film having a thickness of 500 Ångstroms or less is formed on the substrate. | 2017-01-26 |
20170025636 | LAMINATED SHEET FOR SEALING ELECTRONIC ELEMENTS AND PRODUCTION METHOD FOR ELECTRONIC DEVICES - A laminated sheet for sealing electronic elements is configured to comprise: a first long release sheet; a plurality of sealing materials that are laminated on the first release sheet within a central area in the width direction and at different positions in the longitudinal direction; protection materials that are laminated on the first release sheet at both side portions in the width direction; and a second long release sheet that is laminated on the sealing materials and the protection materials at the opposite sides to the first release sheet. According to such a laminated sheet for sealing electronic elements, highly reliable electronic devices can be produced in an efficient manner. | 2017-01-26 |
20170025637 | DISPLAY APPARATUS - A display apparatus capable of preventing (or protecting from) permeation of moisture. The apparatus includes a substrate comprising a display area and a peripheral area surrounding the display area; a pad unit located on the peripheral area; an organic insulating layer covering the display area and a part of the peripheral area adjacent to the display area; and an inorganic insulating layer that covers at least a first area when the first area is a part between the organic insulating layer and the pad unit. | 2017-01-26 |
20170025638 | Light-Emitting Device, Module, Electronic Device, and Manufacturing Method of Light-Emitting Device - A novel light-emitting device that is highly convenient or reliable is provided. A method for manufacturing a novel light-emitting device that is highly convenient or reliable is also provided. Further, a novel light-emitting device, a method for manufacturing a novel light-emitting device, or a novel device is provided. The present inventor has conceived the structure in which a first insulating film and a light-emitting element are provided between a first support having certain isotropy and a second support. | 2017-01-26 |
20170025639 | ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE - An organic electroluminescent display device has a display region where image display is performed and a frame region surrounding said display region. The organic electroluminescent display device includes: a first substrate; a second substrate disposed facing said first substrate; an organic electroluminescent element provided on said first substrate in the display region; and a sealing film on said first substrate in the frame and display regions so as to cover said organic electroluminescent element, a surface of the sealing film in the frame region being hydrophilic. | 2017-01-26 |
20170025640 | Electronic Device Display With Flexible Encapsulation - A flexible display encapsulation layer may be used to encapsulate and protect organic light-emitting diodes and a thin-film transistor layer on a flexible display. The flexible encapsulation layer may include a lateral dispersion layer that exhibits an anisotropic moisture diffusion characteristic. Lateral diffusion in the lateral dispersion layer is larger than vertical dispersion in a direction that runs perpendicular to the display. An inorganic conformal coating layer may cover the lateral diffusion layer and may serve as a pinhole filling layer. The pinhole filling layer may be covered with a moisture barrier layer that serves to prevent moisture from penetrating the display. A polymer protective layer may cover the moisture barrier layer and may be relatively insensitive to bending induced stress as the display is flexed. | 2017-01-26 |
20170025641 | Organic Light-Emitting Diode Device and Manufacturing Method Thereof and Organic Light-Emitting Display Panel - The invention relates to the field of display device technology, more particularly, to an organic light-emitting diode device and a manufacturing method thereof and an organic light-emitting display panel, which changes the traditional micro-cavity structure, spin-coatings the liquid filling agent on the cathode layer to form the micro-cavity adjusting layer, and make it between the cover and the cathode layer, on the one hand, controls the thickness of the filling agent by spin-coating to change the resonance node of OLED, to achieve the strongest resonance effect, and at the same time avoid the defect of high cost of traditional evaporation; on the other hand, configuring the micro-cavity adjusting layer on the cathode layer, when OLED in working state, the length of the electric current passing through significantly shortens, the resistance reduces, and effectively reduces the working voltage of OLED device and improves the emitting efficiency of OLED device. | 2017-01-26 |
20170025642 | DISPLAY - The present disclosure provides a display, including a substrate, a display unit and a package structure, wherein the display unit is disposed between the substrate and the package structure, and the substrate or the package structure is a single-sided visible structure. Since the substrate or the package structure in the display is configured as the single-sided visible structure, the incident intensity of backside light is reduced, while light transmittance of the display unit is not affected, such that the backside light can be reduced from entering viewer's visual field, so as to increase the contrast of the display. | 2017-01-26 |
20170025643 | CRUCIBLE AND EVAPORATION DEVICE - The present disclosure provides a crucible and an evaporation device. The crucible includes an external wall, an internal wall and a heating member arranged outside the external wall. The external wall and the internal wall define a cavity, and a heat transfer liquid is received in the cavity. | 2017-01-26 |
20170025644 | FILM FORMING APPARATUS, SUBSTRATE PROCESSING APPARATUS AND DEVICE MANUFACTURING METHOD - A film forming apparatus, a substrate processing apparatus, and a device manufacturing method are provided, which improve the film thickness uniformity of a thin film that is formed on a substrate by spraying a thin film material. The film forming apparatus which forms a thin film on a substrate is provided with a nozzle that sprays a thin film material and an exhaust unit that discharges a gas. An exhaust port of the exhaust unit is arranged on a side that is opposite to the direction in which the gravity acts with respect to the substrate. The substrate processing apparatus performs a predetermined process on the substrate using the film forming apparatus. The device manufacturing method manufactures a device using the film forming apparatus. | 2017-01-26 |
20170025645 | HOLLOW PACKAGING FOR CABLE-TYPE SECONDARY BATTERY, AND CABLE-TYPE SECONDARY BATTERY COMPRISING SAME - The present invention relates to a hollow packaging for a cable-type secondary battery and a cable-type secondary battery comprising same, and more specifically, to a hollow packaging for a cable-type secondary battery and a cable-type secondary battery comprising same, wherein the hollow packaging for a cable-type secondary battery comprises a packaging sheet including a sheet-type thin metal layer provided with a corrugated pattern on the surface, a first polymer resin layer formed on one surface of the thin metal layer, and a mechanical support layer formed on the other surface of the thin metal layer, wherein the packaging sheet forms a hollow space by bending so that the first polymer resin layer faces inward. | 2017-01-26 |
20170025646 | SINGLE POUCH BATTERY CELLS AND METHODS OF MANUFACTURE - Apparatus, systems, and methods described herein relate to the manufacture and use of single pouch battery cells. In some embodiments, an electrochemical cell includes a first current collector coupled to a first portion of a pouch, the first current collector having a first electrode material disposed thereon, a second current collector coupled to a second portion of the pouch, the second current collector having a second electrode material disposed thereon, and a separator disposed between the first electrode material and the second electrode material. The first portion of the pouch is coupled to the second portion of the pouch to enclose the electrochemical cell. | 2017-01-26 |
20170025647 | PACKAGING MATERIAL FOR ELECTRICAL STORAGE DEVICES, ELECTRICAL STORAGE DEVICE, AND METHOD FOR PRODUCING EMBOSSED PACKAGING MATERIAL - A packaging material for electrical storage devices which includes a base layer, a metal foil layer arranged on the base layer, and a sealant layer arranged on the metal foil layer. In the packaging material for electrical storage devices, the base layer includes at least one of a stretched polyester resin and a stretched polyamide resin, and the metal foil layer is an aluminum foil containing iron in the range of about 0.5 mass % or more to about 5.0 mass % or less. The packaging material has a tensile elongation of about 50% or more both the MD and TD directions of the base layer. | 2017-01-26 |
20170025648 | SECONDARY BATTERY POUCH WITH ENHANCED INSULATION PROPERTY, AND METHOD FOR MANUFACTURING SAME - The present disclosure relates to a secondary battery pouch with an enhanced insulation property, and a method for manufacturing the same, and more specifically, to a secondary battery pouch for preventing occurrence of cracks in a sealing portion of a periphery of a pouch in a completed pouch-type secondary battery, particularly at a folded portion of the sealing portion, and a method for manufacturing the same. | 2017-01-26 |
20170025649 | Flat Secondary Battery - A flat secondary battery has a laminate-type power generation element in which two or more plate-like electrodes are laminated via each of separators; and a pair of rectangular exterior members when viewed from a lamination direction of the two or more electrodes, the rectangular exterior members sealing the laminate-type power generation element and an electrolyte solution. At least one exterior member of the pair of the rectangular exterior members comprises: an abutting part including an abutting surface that abuts against an uppermost layer electrode of the two or more electrodes; a sealing part at which the rectangular exterior members overlap each other at an outer circumferential position of the rectangular exterior members; and an extending part that extends from the abutting part to the sealing part, and the flat secondary battery satisfies: | 2017-01-26 |
20170025650 | LATCHING MECHANISM FOR A BATTERY PACK - A power tool assembly includes a power tool having a battery support portion that defines a battery insertion axis and a battery operatively engageable with the power tool support portion along the battery insertion axis to provide power to the power tool. The power tool assembly also includes a battery latching mechanism having a latch pivotable about a pivot axis transverse to the battery insertion axis and engageable with one of the battery pack or the battery support portion for securing the battery pack to the battery support portion. The battery latching mechanism further includes a handle coupled for pivoting movement with the latch about the pivot axis. | 2017-01-26 |
20170025651 | TENSIONING BATTERY PACK ENCLOSURE - An exemplary battery pack enclosure assembly includes a tensioning section that limits movement of a first enclosure side relative to a second enclosure side to resist expansion of at least one battery cell within a group of battery cells that are disposed along an axis between the first enclosure side and the second enclosure side. | 2017-01-26 |
20170025652 | BATTERY PACK ENDPLATE - An exemplary battery pack assembly includes an endplate with a first side region and a second side region opposite the first side region, a first connector in the first side region, and a second connector in the second side region. The first and second connectors each provide a connection point to secure the endplate to a support when a respective one of the first or second side regions is positioned proximate the support. | 2017-01-26 |
20170025653 | BATTERY ASSEMBLY ARRAY PLATE - A battery pack according to an exemplary aspect of the present disclosure includes, among other things, an array plate including a first engagement feature configured to engage a second engagement feature when the first engagement feature is positioned proximate another structure equipped with the second engagement feature. | 2017-01-26 |
20170025654 | BATTERY CELL HOLDER MEMBER - A battery cell holder member, including a main body including a plurality of accommodating portions accommodating ends of a plurality of battery cells, respectively, and a partition separating the plurality of accommodating portions; at least one stopper portion on a first side of the partition; and at least one engaging portion on a second side of the partition. | 2017-01-26 |
20170025655 | BATTERY DEVICE AND METHOD OF PRODUCTION THEREOF - A battery device for an at least partially electrically operated vehicle and a method for producing the battery device. The battery device includes a plurality of battery modules, each having at least one battery cell, and a receiving device for receiving the battery modules. In this arrangement, the receiving device includes a dividing wall, which is arranged underneath the battery modules, and a base plate, which is arranged underneath the dividing wall. The dividing wall and the base plate are attached to at least one connecting element and are connected to one another by the connecting element while being spaced apart. | 2017-01-26 |
20170025656 | BATTERY PACK - A second battery module is stacked on a first battery module. A control device is mounted on a mounting plate of the first battery module. The control device is arranged between the first battery module and the second battery module. A control device of the first battery module is arranged between inner surfaces of first bolt insertion portions and inner surfaces of second bolt insertion portions of second battery holders. | 2017-01-26 |
20170025657 | ENERGY STORAGE UNIT, PARTICULARLY A BATTERY MODULE, AND AN ENERGY STORAGE SYSTEM COMPRISING A PLURALITY OF ENERGY STORAGE UNIT - The invention relates to an energy storage unit ( | 2017-01-26 |
20170025658 | MEMBRANES, SEPARATORS, BATTERIES, AND METHODS - In accordance with at least selected embodiments, novel or improved porous membranes or substrates, separator membranes, separators, composites, electrochemical devices, batteries, methods of making such membranes or substrates, separators, and/or batteries, and/or methods of using such membranes or substrates, separators and/or batteries are disclosed. In accordance with at least certain embodiments, novel or improved microporous membranes, battery separator membranes, separators, energy storage devices, batteries including such separators, methods of making such membranes, separators, and/or batteries, and/or methods of using such membranes, separators and/or batteries are disclosed. In accordance with at least certain selected embodiments, a separator for a battery which has an oxidation protective and binder-free deposition layer which is stable up to 5.2 volts or more, for example, up to 7 volts, in a battery is disclosed. The deposition layer is preferably a thin, very thin or ultra-thin deposition on a polymeric microporous membrane applied via a binder-free and solvent-free deposition method. By employing such an ultra-thin deposition layer, the energy density of a battery may be increased. In accordance with at least particular embodiments, the battery separator membrane described herein is directed to a multi-layer or composite microporous membrane battery separator which may have excellent oxidation resistance and may be stable in a high voltage battery system up to 5.2 volts or more. In accordance with at least other certain selected embodiments, the present invention is directed to a separator for a battery which has a conductive deposition layer which is stable up to at least 5.2 volts or higher in a battery. | 2017-01-26 |
20170025659 | METHOD FOR PRODUCING LAMINATED POROUS FILM - A method is provided for producing a laminated porous film including: a porous base material layer containing polyolefin as a main component; a filler layer containing inorganic particles as a main component; and a resin layer containing resin particles as a main component, the filler layer and resin layer being provided on opposite surfaces of the porous base material layer. The method includes steps of: applying, on one surface of the porous base material layer, a coating solution containing more than 50 wt % of inorganic particles, and drying the coating solution to form a filler layer, and thereafter applying, on the other surface of the porous base material layer, a coating solution containing more than 50 wt % of resin particles, and drying the coating solution to form a resin layer, the weight percentages (wt %) being based on total weight of components other than the medium of each coating solution. | 2017-01-26 |
20170025660 | BATTERY ASSEMBLY USING PRINTED CIRCUIT BOARD SUBSTRATE INCLUDING BUS BAR - Disclosed is a battery assembly with a PCB substrate, comprising a bus bar stepped and end processed for enhanced assembly performance and electrical bonding reliability, and a PCB substrate having an assembling groove with an end of the bus bar and an insulating film for an improved stability. | 2017-01-26 |
20170025661 | SENSOR LEAD SECURING ASSEMBLY AND METHOD - An exemplary electrified vehicle assembly includes a sensor lead, and a busbar having a protrusion that secures the sensor lead to electrically connect the sensor lead with the busbar. A method of holding a sensor lead includes securing a busbar to at least one terminal of a battery cell, and securing a sensor lead to the busbar using a protrusion of the busbar. | 2017-01-26 |
20170025662 | ELECTRICAL STORAGE DEVICE AND MANUFACTURING METHOD FOR ELECTRICAL STORAGE DEVICE - An electrical storage device includes a polar plate and a collector plate. The polar plate includes a mixture layer and a collector. The collector includes an exposed portion. The exposed portion is exposed from the mixture layer in one end of the polar plate in a width direction. The collector plate includes a facing portion, a projection portion, and a corner portion. The facing portion is opposed to a tip end surface of the exposed portion. The projection portion extends from the facing portion so as to project toward the exposed portion relative to the facing portion. The corner portion is placed in a boundary between the facing portion and the projection portion. The collector plate is welded to the exposed portion in at least part of the corner portion. | 2017-01-26 |
20170025663 | EXTERNAL CONNECTOR OF VEHICLE BATTERY PACK - An external connector according to the present invention is connected to a battery pack provided with a battery module, a converter stepping down a voltage of the battery module to output to the exterior and stepping up an externally-input voltage to supply to the battery module, and a case accommodating the battery module and the converter therein, and the external connector includes a connector plate coupled to a connector exposing opening formed through the case so as to hermetically seal the connector exposing opening, and coupling bolts each having one end inserted into the connector plate and another end exposed, and connection bus bars each having one end forming a connection terminal and inserted into the connector plate so as to be exposed in the same direction as the coupling bolt, and another end coupled to a corresponding main bus bar connected to the battery module and the converter. | 2017-01-26 |
20170025664 | BATTERY MODULE - A battery module includes a cell assembly comprising a plurality of cells; a module housing including an upper housing having a closed inner space accommodating the cell assembly and a lower housing air-tightly attached to a lower end of the upper housing; and an air vent member air-tightly disposed at one side of the module housing to discharge inner gas of the module housing to the outside, the air vent member being configured to block external gas from entering into the module housing. | 2017-01-26 |
20170025665 | POWER BATTERY CAP STRUCTURE AND POWER BATTERY - A power battery cap structure and a power battery are provided in the present invention. The power battery cap structure includes a first terminal, a second terminal and a cap assembly; both the first terminal and the second terminal are provided on the cap assembly, and the second terminal is electrically insulated from the cap assembly. The power battery cap structure further includes a resistance attached to the first terminal and electrically connected the first terminal with the cap assembly. The cap assembly includes a cap sheet, a first short circuit part and a second short circuit part; the first short circuit part and the second short circuit part are attached to the cap sheet and configured to act upwards when pressure inside the power battery increases so that the first terminal and the second terminal are electrically connected to form a protection loop; and the first short circuit part and the resistance are connected in parallel when the protection loop is formed. With the technical solution of the present invention, a separate protection loop can be formed in a power battery respectively in the cases of overcharge and nailing abuses, thereby efficiently protecting the power battery. | 2017-01-26 |
20170025666 | SECONDARY BATTERY - A positive electrode sheet is electrically connected to a positive terminal with a positive electrode current collector, a deformable plate, and a conductive member interposed therebetween. When the pressure inside a battery is higher than or equal to a predetermined value, the deformable plate is deformed toward a sealing plate and an annular groove formed on a base portion of the positive electrode current collector is broken due to deformation of the deformable plate so that a conductive path between the positive electrode sheet and the positive terminal is disconnected. A first insulating member disposed between the deformable plate and the base portion of the positive electrode current collector includes a first rotation preventing protrusion on a surface thereof on a wound electrode body side and outside an outer circumferential edge of the base portion of the positive electrode current collector. | 2017-01-26 |
20170025667 | SECONDARY BATTERY - A conductive member including an opening portion is connected to a positive terminal and is integrally secured to a sealing plate together with an outer insulating member and a second insulating member. The conductive member opening portion is sealed by a deformable plate. A base portion of a positive electrode current collector is connected to the deformable plate. A first insulating member that is disposed between the deformable plate and the base portion of the positive electrode current collector includes a pair of first catch portions that are disposed so as to be aligned in a longitudinal direction of the sealing plate and a pair of second catch portions that are disposed so as to be aligned in a transverse direction of the sealing plate. The first catch portions and the second catch portions are connected to the second insulating member disposed between the sealing plate and the conductive member. | 2017-01-26 |