03rd week of 2019 patent applcation highlights part 51 |
Patent application number | Title | Published |
20190019718 | TRANSFER SUPPORT AND TRANSFER MODULE | 2019-01-17 |
20190019719 | TRANSPORT APPARATUS AND ADAPTER PENDANT | 2019-01-17 |
20190019720 | Methods of Forming Material Within Openings Extending into a Semiconductor Construction, and Semiconductor Constructions Having Fluorocarbon Material | 2019-01-17 |
20190019721 | METHOD OF MANUFACTURE OF A SEMICONDUCTOR ON INSULATOR STRUCTURE | 2019-01-17 |
20190019722 | Integrated Circuitry | 2019-01-17 |
20190019723 | SEMICONDUCTOR DEVICE | 2019-01-17 |
20190019724 | CYCLIC CONFORMAL DEPOSITION/ANNEAL/ETCH FOR SI GAPFILL | 2019-01-17 |
20190019725 | TUNGSTEN FEATURE FILL | 2019-01-17 |
20190019726 | LINER RECESS FOR FULLY ALIGNED VIA | 2019-01-17 |
20190019727 | SEMICONDUCTOR DEVICE WITH GATE STACK | 2019-01-17 |
20190019728 | WAFER SINGULATION PROCESS CONTROL | 2019-01-17 |
20190019729 | METHOD AND DEVICE FOR THE PRODUCTION OF WAFERS WITH A PRE-DEFINED BREAK INITIATION POINT | 2019-01-17 |
20190019730 | EFFECTIVE COMPOUND SUBSTRATE FOR NON-DESTRUCTIVE EPITAXIAL LIFT-OFF | 2019-01-17 |
20190019731 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2019-01-17 |
20190019732 | GATE-END STRUCTURE ENGINEERING FOR SEMICONDUCTOR APPLICATIONS | 2019-01-17 |
20190019733 | NANOSHEET DEVICES WITH CMOS EPITAXY AND METHOD OF FORMING | 2019-01-17 |
20190019734 | OPTICAL EMISSION SPECTROSCOPIC TECHNIQUES FOR MONITORING ETCHING | 2019-01-17 |
20190019735 | TEST KEY AND METHOD FOR MONITORING SEMICONDUCTOR WAFER | 2019-01-17 |
20190019736 | LASER-SEEDING FOR ELECTRO-CONDUCTIVE PLATING | 2019-01-17 |
20190019737 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD, IMAGING DEVICE, AND ELECTRONIC APPARATUS | 2019-01-17 |
20190019738 | HIGH FREQUENCY MODULE | 2019-01-17 |
20190019739 | Thermal Conducting Sheet, Method for Manufacturing Thermal Conducting Sheet, Heat Dissipation Member, and Semiconductor Device | 2019-01-17 |
20190019740 | CERAMIC MODULE FOR POWER SEMICONDUCTOR INTEGRATED PACKAGING AND PREPARATION METHOD THEREOF | 2019-01-17 |
20190019741 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-01-17 |
20190019742 | SEMICONDUCTOR DEVICE | 2019-01-17 |
20190019743 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | 2019-01-17 |
20190019744 | FINGERPRINT CHIP PACKAGE AND METHOD FOR PROCESSING SAME | 2019-01-17 |
20190019745 | PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MOLD FLASHING FAILURE | 2019-01-17 |
20190019746 | CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME | 2019-01-17 |
20190019747 | INPUT/OUTPUT CELL WIRE CONNECTOR | 2019-01-17 |
20190019748 | PITCH DIVISION PATTERNING APPROACHES WITH INCREASED OVERLAY MARGIN FOR BACK END OF LINE (BEOL) INTERCONNECT FABRICATION AND STRUCTURES RESULTING THEREFROM | 2019-01-17 |
20190019749 | Integrated circuit structure, voltage-controlled oscillator and power amplifier | 2019-01-17 |
20190019750 | FUSE AND FABRICATION METHOD THEREOF | 2019-01-17 |
20190019751 | FUSE FABRICATION METHOD | 2019-01-17 |
20190019752 | ELECTRICAL FUSE AND/OR RESISTOR STRUCTURES | 2019-01-17 |
20190019753 | METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE | 2019-01-17 |
20190019754 | EMBEDDED VIALESS BRIDGES | 2019-01-17 |
20190019755 | HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD | 2019-01-17 |
20190019756 | SYSTEM ON INTEGRATED CHIPS AND METHODS OF FORMING THE SAME | 2019-01-17 |
20190019757 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-01-17 |
20190019758 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SAME | 2019-01-17 |
20190019759 | SEMICONDUCTOR DEVICE | 2019-01-17 |
20190019760 | MINI IDENTIFICATION MARK | 2019-01-17 |
20190019761 | SEMICONDUCTOR PACKAGES INCLUDING INDICATORS FOR EVALUATING A DISTANCE AND METHODS OF CALCULATING THE DISTANCE | 2019-01-17 |
20190019762 | SEMICONDUCTOR CHIP MODULE AND METHOD FOR ENHANCING VISUAL EFFECTS OF A PATTERN LAYER | 2019-01-17 |
20190019763 | SEMICONDUCTOR PACKAGE INCLUDING EMI SHIELDING STRUCTURE AND METHOD FOR FORMING THE SAME | 2019-01-17 |
20190019764 | SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING USING METAL LAYERS AND VIAS | 2019-01-17 |
20190019765 | Packaging Devices and Methods of Manufacture Thereof | 2019-01-17 |
20190019766 | SEMICONDUCTOR DEVICE INCLUDING CIRCUIT HAVING SECURITY FUNCTION | 2019-01-17 |
20190019767 | ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | 2019-01-17 |
20190019768 | Three Terminal Solid State Plasma Monolithic Microwave Integrated Circuit | 2019-01-17 |
20190019769 | METHOD OF PATTERN PLACEMENT CORRECTION | 2019-01-17 |
20190019770 | PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES | 2019-01-17 |
20190019771 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DEVICE | 2019-01-17 |
20190019772 | METHOD FOR FORMING BUMP STRUCTURE | 2019-01-17 |
20190019773 | SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCING STRESS | 2019-01-17 |
20190019774 | METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING DEVICES | 2019-01-17 |
20190019775 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF | 2019-01-17 |
20190019776 | STRUCTURES AND METHODS FOR CAPACITIVE ISOLATION DEVICES | 2019-01-17 |
20190019777 | METHOD, APPARATUS AND SYSTEM TO INTERCONNECT PACKAGED INTEGRATED CIRCUIT DIES | 2019-01-17 |
20190019778 | FACE-TO-FACE SEMICONDUCTOR ASSEMBLY HAVING SEMICONDUCTOR DEVICE IN DIELECTRIC RECESS | 2019-01-17 |
20190019779 | LIGHT EMITTING DEVICE PACKAGE AND DISPLAY DEVICE USING THE SAME | 2019-01-17 |
20190019780 | LIGHT EMITTING DEVICE PACKAGE | 2019-01-17 |
20190019781 | TRANSPARENT ACTIVE MATRIX DISPLAY COMPRISING EMITTING PIXELS WITH COLORED LIGHT-EMITTING DIODES | 2019-01-17 |
20190019782 | LIGHT EMITTING ELEMENT | 2019-01-17 |
20190019783 | METHOD OF PRODUCING AN OPTOELECTRONIC LIGHTING DEVICE AND OPTOELECTRONIC LIGHTING DEVICE | 2019-01-17 |
20190019784 | SEMICONDUCTOR DEVICE AND OPTICAL COUPLING DEVICE | 2019-01-17 |
20190019785 | POWER SEMICONDUCTOR MODULE | 2019-01-17 |
20190019786 | LED DISPLAY MODULES AND METHODS FOR MAKING THE SAME | 2019-01-17 |
20190019787 | CAPACITOR AND BOARD HAVING THE SAME | 2019-01-17 |
20190019788 | ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE AND FABRICATION METHOD THEREOF | 2019-01-17 |
20190019789 | DISPLAY APPARATUS | 2019-01-17 |
20190019790 | FIELD EFFECT TRANSISTOR (FET) STRUCTURE WITH INTEGRATED GATE CONNECTED DIODES | 2019-01-17 |
20190019791 | Isolated Wells For Resistor Devices | 2019-01-17 |
20190019792 | Isolated Wells for Resistor Devices | 2019-01-17 |
20190019793 | TRANSISTOR THRESHOLD VOLTAGE VARIATION OPTIMIZATION | 2019-01-17 |
20190019794 | SEMICONDUCTOR DEVICE | 2019-01-17 |
20190019795 | DYNAMIC RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME | 2019-01-17 |
20190019796 | LASER SPIKE ANNEALING FOR SOLID PHASE EPITAXY AND LOW CONTACT RESISTANCE IN AN SRAM WITH A SHARED PFET AND NFET TRENCH | 2019-01-17 |
20190019797 | SEMICONDUCTOR DEVICE WHICH INCLUDES FINS | 2019-01-17 |
20190019798 | METHOD OF REDUCING FIN WIDTH IN FINFET SRAM ARRAY TO MITIGATE LOW VOLTAGE STRAP BIT FAILS | 2019-01-17 |
20190019799 | Horological Functions in Commercial Transactions Using Time Cells | 2019-01-17 |
20190019800 | FERROELECTRIC MEMORY DEVICES | 2019-01-17 |
20190019801 | FERROELECTRIC MEMORY DEVICE AND A METHOD OF MANUFACTURING THE SAME | 2019-01-17 |
20190019802 | FERROELECTRIC MEMORY DEVICE | 2019-01-17 |
20190019803 | ANTI-FUSE WITH REDUCED PROGRAMMING VOLTAGE | 2019-01-17 |
20190019804 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES | 2019-01-17 |
20190019805 | MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE | 2019-01-17 |
20190019806 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-01-17 |
20190019807 | SEMICONDUCTOR DEVICE INCLUDING GATES | 2019-01-17 |
20190019808 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-01-17 |
20190019809 | VERTICAL MEMORY DEVICE | 2019-01-17 |
20190019810 | Semiconductor Chip Having Region Including Gate Electrode Features Formed In Part from Rectangular Layout Shapes on Gate Horizontal Grid and First-Metal Structures Formed In Part from Rectangular Layout Shapes on First-Metal Vertical Grid | 2019-01-17 |
20190019811 | EXTREMELY THIN SILICON-ON-INSULATOR SILICON GERMANIUM DEVICE WITHOUT EDGE STRAIN RELAXATION | 2019-01-17 |
20190019812 | ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE | 2019-01-17 |
20190019813 | DISPLAY PANEL, ITS MANUFACTURING METHOD, AND DISPLAY DEVICE | 2019-01-17 |
20190019814 | DISPLAY SUBSTRATE, METHOD FOR FABRICATING THE SAME, DISPLAY PANEL | 2019-01-17 |
20190019815 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS | 2019-01-17 |
20190019816 | LIGHT EMITTING DIODE DISPLAY DEVICE | 2019-01-17 |
20190019817 | ARRAY SUBSTRATE, MANUFACTURING METHOD FOR THE SAME AND DISPLAY PANEL | 2019-01-17 |