02nd week of 2020 patent applcation highlights part 54 |
Patent application number | Title | Published |
20200013652 | CEILING CARRIER VEHICLE | 2020-01-09 |
20200013653 | TRANSFER DEVICE | 2020-01-09 |
20200013654 | SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE TRANSFER METHOD | 2020-01-09 |
20200013655 | OPENER APPARATUS | 2020-01-09 |
20200013656 | FLIP CHIP BONDING DEVICE AND BONDING METHOD | 2020-01-09 |
20200013657 | APPARATUS AND METHODS FOR EDGE RING REPLACEMENT, INSPECTION AND ALIGNMENT USING IMAGE SENSORS | 2020-01-09 |
20200013658 | ELECTROSTATIC CHUCK UNIT AND THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME | 2020-01-09 |
20200013659 | SAMPLE HOLDER | 2020-01-09 |
20200013660 | ELECTROSTATIC HOLDING APPARATUS AND METHOD FOR ITS PRODUCTION | 2020-01-09 |
20200013661 | ELECTROSTATIC CHUCK WITH VARIABLE PIXELATED MAGNETIC FIELD | 2020-01-09 |
20200013662 | INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE | 2020-01-09 |
20200013663 | METHOD FOR THE BONDING AND DEBONDING OF SUBSTRATES | 2020-01-09 |
20200013664 | POROUS CHUCK TABLE | 2020-01-09 |
20200013665 | CONDUCTIVE POROUS CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING SAME | 2020-01-09 |
20200013666 | SUBSTRATE TRANSFER DEVICE AND SUBSTRATE TRANSFER METHOD | 2020-01-09 |
20200013667 | NON-EMBEDDED SILICON BRIDGE CHIP FOR MULTI-CHIP MODULE | 2020-01-09 |
20200013668 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | 2020-01-09 |
20200013669 | Array Of Gated Devices And Methods Of Forming An Array Of Gated Devices | 2020-01-09 |
20200013670 | REWIRING METHOD FOR SEMICONDUCTOR | 2020-01-09 |
20200013671 | ENHANCEMENT OF ISO-VIA RELIABILITY | 2020-01-09 |
20200013672 | CAP STRUCTURE | 2020-01-09 |
20200013673 | INTEGRATED CIRCUIT INTERCONNECTS | 2020-01-09 |
20200013674 | Method of Forming Contact Metal | 2020-01-09 |
20200013675 | WAFER PROCESSING METHOD | 2020-01-09 |
20200013676 | WAFER PROCESSING METHOD | 2020-01-09 |
20200013677 | HIGH THRESHOLD VOLTAGE FET WITH THE SAME FIN HEIGHT AS REGULAR THRESHOLD VOLTAGE VERTICAL FET | 2020-01-09 |
20200013678 | INTEGRATED CIRCUIT STRUCTURE TO REDUCE SOFT-FAIL INCIDENCE AND METHOD OF FORMING SAME | 2020-01-09 |
20200013679 | ISOLATION TECHNIQUES FOR HIGH-VOLTAGE DEVICE STRUCTURES | 2020-01-09 |
20200013680 | DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | 2020-01-09 |
20200013681 | SELF-ALIGNED SILICIDE/GERMANIDE FORMATION TO REDUCE EXTERNAL RESISTANCE IN A VERTICAL FIELD-EFFECT TRANSISTOR | 2020-01-09 |
20200013682 | SEMICONDUCTOR DEVICES WITH SIDEWALL SPACERS OF EQUAL THICKNESS | 2020-01-09 |
20200013683 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 2020-01-09 |
20200013684 | PRODUCT THAT INCLUDES A PLURALITY OF VERTICAL TRANSISTORS WITH A SHARED CONDUCTIVE GATE PLUG | 2020-01-09 |
20200013685 | METHOD AND APPARATUS TO DETERMINE A PATTERNING PROCESS PARAMETER | 2020-01-09 |
20200013686 | ELECTRONIC DEVICE AND METHOD FOR REPAIRING ELECTRONIC DEVICE | 2020-01-09 |
20200013687 | POWER SEMICONDUCTOR DEVICE COMPRISING A POWER SEMICONDUCTOR COMPONENT AND A HOUSING | 2020-01-09 |
20200013688 | SEMICONDUCTOR DEVICE PACKAGE WITH A CAP TO SELECTIVELY EXCLUDE CONTACT WITH MOLD COMPOUND | 2020-01-09 |
20200013689 | PACKAGING STRUCTURES WITH IMPROVED ADHESION AND STRENGTH | 2020-01-09 |
20200013690 | CIRCUIT BOARD AND CIRCUIT MODULE | 2020-01-09 |
20200013691 | METHODS AND APPARATUSES FOR PACKAGING AN ULTRASOUND-ON-A-CHIP | 2020-01-09 |
20200013692 | SEMICONDUCTOR POWER DEVICE INCLUDING WIRE OR RIBBON BONDS OVER DEVICE ACTIVE REGION | 2020-01-09 |
20200013693 | THERMALS FOR PACKAGES WITH INDUCTORS | 2020-01-09 |
20200013694 | SEMICONDUCTOR DIE ASSEMBLY HAVING HEAT SPREADER THAT EXTENDS THROUGH UNDERLYING INTERPOSER AND RELATED TECHNOLOGY | 2020-01-09 |
20200013695 | THERMAL INTERFACE MATERIAL, METHOD FOR THERMALLY COUPLING WITH THERMAL INTERFACE MATERIAL, AND METHOD FOR PREPARING THERMAL INTERFACE MATERIAL | 2020-01-09 |
20200013696 | CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE | 2020-01-09 |
20200013697 | Heat Spreading Device and Method | 2020-01-09 |
20200013698 | Heat Spreading Device and Method | 2020-01-09 |
20200013699 | Stacked Microfluidic Cooled 3D Electronic-Photonic Integrated Circuit | 2020-01-09 |
20200013700 | Formation of Fine Pitch Traces Using Ultra-Thin PAA Modified Fully Additive Process | 2020-01-09 |
20200013701 | WAFER STENCIL FOR CONTROLLING DIE ATTACH MATERIAL THICKNESS ON DIE | 2020-01-09 |
20200013702 | POSITIONAL RELATIONSHIP AMONG COMPONENTS OF SEMICONDUCTOR DEVICE | 2020-01-09 |
20200013703 | SEMICONDUCTOR DEVICE | 2020-01-09 |
20200013704 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING SAME | 2020-01-09 |
20200013705 | POWER DEVICE PACKAGE STRUCTURE | 2020-01-09 |
20200013706 | HIGH DENSITY INTERCONNECTS IN AN EMBEDDED TRACE SUBSTRATE (ETS) COMPRISING A CORE LAYER | 2020-01-09 |
20200013707 | INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME | 2020-01-09 |
20200013708 | WIRING SUBSTRATE | 2020-01-09 |
20200013709 | SEMICONDUCTOR DEVICE WITH ELECTROPLATED DIE ATTACH | 2020-01-09 |
20200013710 | Substrate Pad Structure | 2020-01-09 |
20200013711 | HYBRID PACKAGE | 2020-01-09 |
20200013712 | FABRICATING UNIQUE CHIPS USING A CHARGED PARTICLE MULTI-BEAMLET LITHOGRAPHY SYSTEM | 2020-01-09 |
20200013713 | STRUCTURE AND METHOD FOR IMPROVING HIGH VOLTAGE BREAKDOWN RELIABILITY OF A MICROELECTRONIC DEVICE | 2020-01-09 |
20200013714 | NON-VOLATILE MEMORY WITH CAPACITORS USING METAL UNDER SIGNAL LINE OR ABOVE A DEVICE CAPACITOR | 2020-01-09 |
20200013715 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF | 2020-01-09 |
20200013716 | SEMICONDUCTOR DEVICE, ELECTRONIC CIRCUIT HAVING THE SAME, AND SEMICONDUCTOR DEVICE FORMING METHOD | 2020-01-09 |
20200013717 | Semiconductor Device Including a Fuse | 2020-01-09 |
20200013718 | STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE INTERCONNECT THROUGH VIA LANDING MODIFICATION | 2020-01-09 |
20200013719 | Interconnection Structure, Fabricating Method Thereof, and Semiconductor Device Using the Same | 2020-01-09 |
20200013720 | Stretchable Form of Single Crystal Silicon for High Performance Electronics on Rubber Substrates | 2020-01-09 |
20200013721 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2020-01-09 |
20200013722 | Silicon Carbide Semiconductor Device Having a Metal Adhesion and Barrier Structure and a Method of Forming Such a Semiconductor Device | 2020-01-09 |
20200013723 | Silicon Carbide Device and Method for Forming a Silicon Carbide Device | 2020-01-09 |
20200013724 | METHOD OF FORMING OVERLAY MARK STRUCTURE | 2020-01-09 |
20200013725 | OPTICAL CHIP ID DEFINITION USING NANOIMPRINT LITHOGRAPHY | 2020-01-09 |
20200013726 | MINI IDENTIFICATION MARK | 2020-01-09 |
20200013727 | SEMICONDUCTOR PACKAGE | 2020-01-09 |
20200013728 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | 2020-01-09 |
20200013729 | ELECTRONIC COMPONENT | 2020-01-09 |
20200013730 | SEMICONDUCTOR DEVICE, POWER CONVERTER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-01-09 |
20200013731 | WAFER LEVEL FAN-OUT PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2020-01-09 |
20200013732 | LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS | 2020-01-09 |
20200013733 | Supporting InFO Packages to Reduce Warpage | 2020-01-09 |
20200013734 | METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES | 2020-01-09 |
20200013735 | SEMICONDUCTOR PACKAGE STRUCTURE WITH ANTENNA | 2020-01-09 |
20200013736 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | 2020-01-09 |
20200013737 | CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY HAVING THE CHIP PARTS AND ELECTRONIC DEVICE | 2020-01-09 |
20200013738 | Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP | 2020-01-09 |
20200013739 | SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS | 2020-01-09 |
20200013740 | SEMICONDUCTOR CHIP INCLUDING A BUMP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 2020-01-09 |
20200013741 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | 2020-01-09 |
20200013742 | Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices | 2020-01-09 |
20200013743 | Semiconductor Package | 2020-01-09 |
20200013744 | CIRCUIT BOARD ELEMENT AND MANUFACTURING METHOD THEREOF | 2020-01-09 |
20200013745 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 2020-01-09 |
20200013746 | METHOD OF MANUFACTURING 3DIC STRUCTURE | 2020-01-09 |
20200013747 | Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE | 2020-01-09 |
20200013748 | BONDING WIRE FOR SEMICONDUCTOR DEVICE | 2020-01-09 |
20200013749 | CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONTACT STRUCTURE AND PROTECTIVE LAYER, AND METHOD OF FORMING AN ELECTRICAL CONTACT | 2020-01-09 |
20200013750 | Semiconductor Structure and Method of Forming the Same | 2020-01-09 |
20200013751 | METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE | 2020-01-09 |