02nd week of 2014 patent applcation highlights part 9 |
Patent application number | Title | Published |
20140008764 | HIGH-NITROGEN CONTENT METAL RESISTOR AND METHOD OF FORMING SAME - A thin film metal resistor is provided that includes an in-situ formed metal nitride layer formed in a lower region of a metal nitride layer. The in-situ formed metal nitride layer, together with the overlying metal nitride layer, from a thin film metal resistor which has a nitrogen content that is greater than 60 atomic % nitrogen. The in-situ formed metal nitride layer is present on a nitrogen enriched dielectric surface layer. The presence of the in-situ formed metal nitride layer in the lower region of the metal nitride layer provides a two-component metal resistor having greater than 60 atomic % nitrogen therein. | 2014-01-09 |
20140008765 | POLY SILICON RESISTOR, REFERENCE VOLTAGE CIRCUIT COMPRISING THE SAME, AND MANUFACTURING METHOD OF POLY SILICON RESISTOR - The present invention relates to a polysilicon resistor, a reference voltage circuit including the same, and a method for manufacturing the polysilicon resistor. The polysilicon resistor according includes a first polysilicon resistor and at least one of second polusilicon resistors, coupled to the first polysilicon resistor in series. The first polysilicon resistor and the at least one of the second polysilicon resistors are P-type polysilicon, and a doping concentration of the first polysilicon resistor is different from a doping concentration of the at least one of the second polysilicon resistors. The polysilicon resistor formed by serially coupling the first polysilicon resistor and the at least one of the second polysilicon resistors is applied with a constant current such that a reference voltage or a constant voltage is generated. | 2014-01-09 |
20140008766 | EPITAXIAL STRUCTURE AND EPITAXIAL GROWTH METHOD FOR FORMING EPITAXIAL LAYER WITH CAVITIES - An epitaxial growth method includes the steps of: providing a substrate; forming a sacrifice layer on the substrate; patterning the sacrifice layer to form a plurality of bumps spaced apart from each other on the substrate; epitaxially forming a first epitaxial layer on the substrate to cover a portion of each of the bumps; removing the bumps to form a plurality of cavities; and epitaxially forming a second epitaxial layer on the first epitaxial layer such that the cavities are enclosed by the first epitaxial layer and the second epitaxial layer. An epitaxial structure grown by the method is disclosed as well. | 2014-01-09 |
20140008767 | OXIDE REMOVAL FROM SEMICONDUCTOR SURFACES - A method of removing at least one oxide from a surface of a body of semiconductor material is disclosed, the method comprising: arranging the body in a vacuum chamber; and maintaining a temperature of the body in the vacuum chamber within a predetermined range, or substantially at a predetermined value, while exposing said surface to a flux of indium atoms. Corresponding methods of processing an oxidised surface of a body of semiconductor material to prepare the surface for epitaxial growth of at least one epitaxial layer or film over said surface, and methods of manufacturing a semiconductor device are also disclosed. | 2014-01-09 |
20140008772 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - Provided are semiconductor devices and methods of fabricating the same. The semiconductor device may include a wiring board including a mounting region and a ground region that surrounds the mounting region, a ground pad positioned at the ground region, at least one semiconductor chip mounted at the mounting region of the wiring board, a molding layer covering the semiconductor chip and a first surface of the wiring board and exposing a portion of the ground pad of the ground region of the wiring board, and a shield layer covering the molding layer and electrically connected to the ground pad. The molding layer comprises a plurality of light-sensitive particles positioned in the molding layer and a plurality of conductive particles positioned at a surface of the molding layer. The shield layer is in direct contact with the conductive particles. | 2014-01-09 |
20140008773 | Integrated Antenna Structure - Some embodiments relate to a semiconductor module comprising an integrated antenna structure configured to wirelessly transmit signals. The integrated antenna structure has a lower metal layer and an upper metal layer. The lower metal layer is disposed on a lower die and is connected to a ground terminal. The upper metal layer is disposed on an upper die and is connected to a signal generator configured to generate a signal to be wirelessly transmitted. The upper die is stacked on the lower die and is connected to the lower die by way of an adhesion layer having one or more micro-bumps. By connecting the lower and upper die together by way of the adhesion layer, the lower and upper metal layers are separated from each other by a large spacing that provides for a good performance of the integrated antenna structure. | 2014-01-09 |
20140008776 | CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire bonds; a second chip bonded to one or more of the lead fingers via flip chip; and a heat slug attached to the second chip. | 2014-01-09 |
20140008777 | THERMAL LEADLESS ARRAY PACKAGE WITH DIE ATTACH PAD LOCKING FEATURE - Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts. | 2014-01-09 |
20140008778 | PHOTONIC SEMICONDUCTOR DEVICES IN LLC ASSEMBLY WITH CONTROLLED MOLDING BOUNDARY AND METHOD FOR FORMING SAME - Embodiments of a laminate leadless carrier package are presented. The package includes an optoelectronic chip, a substrate supporting the optoelectronic chip, a plurality of conductive slotted vias, a wire bond pad disposed on the top surface of the substrate, a wire bond coupled to the optoelectronic chip and the wire bond pad and an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate. The slotted vias provide electrical connections between the top conductive layer and the bottom conductive layer. The substrate includes a plurality of conductive and dielectric layers laminated together including a bottom conductive layer, a top conductive layer, and a dielectric layer between the top and bottom conductive layers. The encapsulation is a molding compound, and the molding compound is pulled back from at least one of the slotted vias. | 2014-01-09 |
20140008779 | WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFACTURING WAFER LEVEL PACKAGE - A wafer level package has a first wafer having a plurality of chips mounted or formed thereon in a plane, and a second wafer that is opposed to the first wafer. The first wafer and the second wafer are joined while a seal frame that seals a periphery of each chip is interposed therebetween. A gap is formed between the seal frames of the chips adjacent to each other. A partial connect part that partially connects the seal frames to each other is provided in the gap formed between the seal frames of the chips adjacent to each other. | 2014-01-09 |
20140008780 | SEMICONDUCTOR DEVICE HOUSING PACKAGE, AND SEMICONDUCTOR APPARATUS AND ELECTRONIC APPARATUS INCLUDING THE SAME - A semiconductor device housing package includes a base body having, on its upper surface, a mounting region of a semiconductor device; a frame body having a frame-like portion disposed on the upper surface of the base body, surrounding the mounting region, and an opening penetrating through from an inner side of the frame-like portion to an outer side thereof; a flat plate-like insulating member disposed in the opening, extending from an interior of the frame body to an exterior thereof; wiring conductors disposed on an upper surface of the insulating member, extending from the interior of the frame body to the exterior thereof; and a metallic film disposed on a part of the upper surface of the insulating member, the metallic film lying outside the frame body surrounding the wiring conductors. | 2014-01-09 |
20140008781 | SEMICONDUCTOR UNIT - A semiconductor unit includes a first conductive layer, a second conductive layer electrically insulated from the first conductive layer, a first semiconductor device mounted on the first conductive layer, a second semiconductor device mounted on the second conductive layer, a first bus bar for electrical connection of the second semiconductor device to the first conductive layer, and a second bus bar for electrical connection of the first semiconductor device to one of the positive and negative terminals of a battery. The first bus bar is disposed in overlapping relation to the second bus bar in such a manner that mold resin fills between the first bus bar and the second bus bar. | 2014-01-09 |
20140008782 | SEMICONDUCTOR UNIT - A semiconductor unit includes a base having a surface where a first insulation layer is disposed, a second insulation layer spaced apart from the first insulation layer to form a region therebetween and disposed parallel to the surface of the base where the first insulation layer is disposed, a single conductive layer disposed across the first insulation layer and the second insulation layer, and a semiconductor device bonded to the conductive layer. | 2014-01-09 |
20140008783 | Semiconductor Device and Method of Forming Electrical Interconnection Between Semiconductor Die and Substrate with Continuous Body of Solder Tape - A semiconductor device has a flipchip type semiconductor die with contact pads and substrate with contact pads. A flux material is deposited over the contact pads of the semiconductor die and contact pads of the substrate. A solder tape formed as a continuous body of solder material with a plurality of recesses is disposed between the contact pads of the semiconductor die and substrate. The solder tape is brought to a liquidus state to separate a portion of the solder tape outside a footprint of the contact pads of the semiconductor die and substrate under surface tension and coalesce the solder material as an electrical interconnect substantially within the footprint of the contact pads of the semiconductor die and substrate. The contact pads on the semiconductor die and substrate can be formed with an extension or recess to increase surface area of the contact pads. | 2014-01-09 |
20140008784 | STACKABLE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES - Stacked semiconductor devices and assemblies including attached lead frames are disclosed herein. One embodiment of a method of manufacturing a semiconductor assembly includes forming a plurality of first side trenches to a first intermediate depth in a molded portion of a molded wafer having a plurality of dies arranged in rows and columns. The method also includes forming a plurality of lateral contacts at sidewall portions of the trenches and electrically connecting first side bond-sites of the dies with corresponding lateral contacts of the trenches. The method further includes forming a plurality of second side channels to a second intermediate depth in the molded portion such that the channels intersect the trenches. The method also includes singulating and stacking the first and second dies with the channels associated with the first die aligned with channels associated with the second die. | 2014-01-09 |
20140008785 | Package Redistribution Layer Structure and Method of Forming Same - A package-on-package (PoP) device comprises a bottom package on a substrate and a first set of conductive elements coupling the bottom package and the substrate. The PoP device further comprises a top package over the bottom package and a redistribution layer coupling the top package to the substrate. A method of forming a PoP device comprises coupling a first package to a substrate; and forming a redistribution layer over the first package and a top surface of the substrate. The method further comprises coupling a second package to the redistribution layer, wherein the redistribution layer couples the second package to the substrate. | 2014-01-09 |
20140008786 | BUMP-ON-TRACE PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME - A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer. | 2014-01-09 |
20140008787 | CONDUCTIVE BUMP STRUCTURE AND METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE - A conductive bump structure used to be formed on a substrate having a plurality of bonding pads. The conductive bump structure includes a first metal layer formed on the bonding pads, a second metal layer formed on the first metal layer, and a third metal layer formed on the second metal layer. The second metal layer has a second melting point higher than a third melting point of the third metal layer. Therefore, a thermal compression bonding process is allowed to be performed to the third metal layer first so as to bond the substrate to another substrate, and then a reflow process can be performed to melt the second metal layer and the third metal layer into each other so as to form an alloy portion, thus avoiding cracking of the substrate. | 2014-01-09 |
20140008792 | Semiconductor Device and Method of Forming Bump-on-Lead Interconnection - A semiconductor device has a semiconductor die with a plurality of composite bumps formed over a surface of the semiconductor die. The composite bumps have a fusible portion and non-fusible portion, such as a conductive pillar and bump formed over the conductive pillar. The composite bumps can also be tapered. Conductive traces are formed over a substrate with interconnect sites having edges parallel to the conductive trace from a plan view for increasing escape routing density. The interconnect site can have a width less than 1.2 times a width of the conductive trace. The composite bumps are wider than the interconnect sites. The fusible portion of the composite bumps is bonded to the interconnect sites so that the fusible portion covers a top surface and side surface of the interconnect sites. An encapsulant is deposited around the composite bumps between the semiconductor die and substrate. | 2014-01-09 |
20140008793 | SEMICONDUCTOR DEVICE - To provide a technique capable of reducing the chip size of a semiconductor chip and particularly, a technique capable of reducing the chip size of a semiconductor chip in the form of a rectangle that constitutes an LCD driver by devising a layout arrangement in a short-side direction. In a semiconductor chip that constitutes an LCD driver, input protection circuits are arranged in a lower layer of part of a plurality of input bump electrodes and on the other hand, in a lower layer of the other part of the input bump electrodes, the input protection circuits are not arranged but SRAMs (internal circuits) are arranged. | 2014-01-09 |
20140008798 | SEMICONDUCTOR DEVICE - A technique capable of improving reliability of a semiconductor device is provided. In the present invention, as a wiring board on which a semiconductor chip is mounted, a build-up wiring board is not used but a through wiring board THWB is used. In this manner, in the present invention, the through wiring board formed of only a core layer is used, so that it is not required to consider a difference in thermal expansion coefficient between a build-up layer and the core layer, and besides, it is not required either to consider the electrical disconnection of a fine via formed in the build-up layer because the build-up layer does not exist. As a result, according to the present invention, the reliability of the semiconductor device can be improved while a cost is reduced. | 2014-01-09 |
20140008799 | METHOD FOR FABRICATING METAL LINE AND DEVICE WITH METAL LINE - A metal line fabricating method includes the following steps. Firstly, a substrate is provided. Then, a first barrier layer is formed over the substrate. A first dielectric layer is formed over the first barrier layer. An opening is formed in the first dielectric layer, wherein the opening runs through the first dielectric layer, so that the first barrier layer is exposed to the opening. A metal deposition process is performed to form a metal line over the exposed first barrier layer at a bottom of the opening. The first dielectric layer and the first barrier layer underlying the first dielectric layer are removed, but the metal line and the first barrier layer underlying the metal line are remained. Afterwards, a second dielectric layer is formed over the substrate which is provided with the metal line and the first barrier layer. | 2014-01-09 |
20140008800 | METHOD FOR MANUFACTURING THROUGH SUBSTRATE VIA (TSV), STRUCTURE AND CONTROL METHOD OF TSV CAPACITANCE - A method for manufacturing a through substrate via (TSV) structure, a TSV structure, and a control method of a TSV capacitance are provided. The method for manufacturing the TSV structure includes: providing a substrate having a first surface and a second surface; forming a trench in the first surface of the substrate; filling a low resistance material into the trench; forming an insulating layer on the first surface of the substrate; forming at least one opening in the first surface of the substrate, wherein the opening is located differently the trench; forming an oxide liner layer, a barrier layer and a conductive seed layer on a sidewall and a bottom of the opening and on the insulating layer of the first surface; and filling a conductive material into the opening, wherein the opening is used to form at least one via. | 2014-01-09 |
20140008801 | SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT WAFERS - A submicron connection layer and a method for using the same to connect wafers is disclosed. The connection layer comprises a bottom metal layer formed on a connection surface of a wafer, an intermediary diffusion-buffer metal layer formed on the bottom metal layer, and a top metal layer formed on the intermediary diffusion-buffer metal layer. The melting point of the intermediary diffusion-buffer metal layer is higher than the melting points of the top and bottom metal layers. The top and bottom metal layers may form a eutectic phase. During bonding wafers, two top metal layers are joined in a liquid state; next the intermediary diffusion-buffer metal layers are distributed uniformly in the molten top metal layers; then the top and bottom metal layers diffuse to each other to form a low-resistivity eutectic intermetallic compound until the top metal layers are completely exhausted by the bottom metal layers. | 2014-01-09 |
20140008804 | COPPER INTERCONNECTS SEPARATED BY AIR GAPS AND METHOD OF MAKING THEREOF - A semiconductor device including a plurality of copper interconnects. At least a first portion of the plurality of copper interconnects has a meniscus in a top surface. The semiconductor device also includes a plurality of air gaps, wherein each air gap of the plurality of air gaps is located between an adjacent pair of at least the first portion of the plurality of bit lines. | 2014-01-09 |
20140008805 | Component and Method of Manufacturing a Component Using an Ultrathin Carrier - A system and method for manufacturing a packaged component are disclosed. An embodiment comprises forming a plurality of components on a carrier, the plurality of components being separated from each other by kerf regions on a front side of the carrier and forming a metal pattern on a backside of the carrier, wherein the metal pattern covers the backside of the carrier except over regions corresponding to the kerf regions. The method further comprises generating the component by separating the carrier. | 2014-01-09 |
20140008806 | STAIR STEP FORMATION USING AT LEAST TWO MASKS - Apparatuses and methods for stair step formation using at least two masks, such as in a memory device, are provided. One example method can include forming a first mask over a conductive material to define a first exposed area, and forming a second mask over a portion of the first exposed area to define a second exposed area, the second exposed area is less than the first exposed area. Conductive material is removed from the second exposed area. An initial first dimension of the second mask is less than a first dimension of the first exposed area and an initial second dimension of the second mask is at least a second dimension of the first exposed area plus a distance equal to a difference between the initial first dimension of the second mask and a final first dimension of the second mask after a stair step structure is formed. | 2014-01-09 |
20140008807 | SEMICONDUCTOR CONSTRUCTIONS AND METHODS OF FORMING SEMICONDUCTOR CONSTRUCTIONS - Some embodiments include methods in which first insulative material is formed across a memory region and a peripheral region of a substrate. An etch stop structure is formed to have a higher portion over the memory region than over the peripheral region. A second insulative material is formed to protect the lower portion of the etch stop structure, and the higher portion is removed. Subsequently, at least some of the first and second insulative materials are removed. Some embodiments include semiconductor constructions having a first region with first features, and a second region with second features. The first features are closer spaced than the second features. A first insulative material is over the second region and an insulative structure is over the first insulative material. The structure has a stem joined to a bench. The bench has an upper surface, and the stem extends to above the upper surface. | 2014-01-09 |
20140008812 | SEMICONDUCTOR REFLOW PROCESSING FOR FEATURE FILL - A method for at least partially filling a feature on a workpiece generally includes obtaining a workpiece including a feature depositing a first conformal conductive layer in the feature, and thermally treating the workpiece to reflow the first conformal conductive layer in the feature. | 2014-01-09 |
20140008813 | COMPLIANT MONOPOLOAR MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODE - A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure. | 2014-01-09 |
20140008818 | METHOD AND APPARATUS FOR STACKED SEMICONDUCTOR CHIPS - Stacked semiconductor chips include a bonding-wire-free interconnection electrically connecting the semiconductor chips to each. An opening in an adhesion layer between the semiconductor chips may provide a path for the interconnection from a bonding pad on one semiconductor chip, along a sidewall insulation layer of the semiconductor chip, along a sidewall insulation layer of another semiconductor chip to a bonding pad on the other semiconductor chip. | 2014-01-09 |
20140008819 | SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING THE SAME - A substrate structure is provided, including a substrate and a strengthening member bonded to a surface of the substrate. The strengthening member has a CTE (Coefficient of Thermal Expansion) less than that of the substrate so as to effectively prevent warpage from occurring to the substrate structure. | 2014-01-09 |
20140008822 | LIQUID COMPRESSION MOLDING ENCAPSULANTS - Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials. | 2014-01-09 |
20140008823 | SPLASH FILL BAR SUPPORT AND METHOD OF MANUFACTURING THEREOF - A cost-effective cooling tower splash fill bar support assembly that includes a plurality of perforated substantially planar components supporting a plurality of splash fill bars extending therethrough in a manner that distributes stress over a relatively large area, typically by using a splash fill bar support. Also, a method of forming a cooling tower splash fill bar support assembly including a splash fill bar support assembly having substantially planar components and splash fill bar supports. | 2014-01-09 |
20140008828 | ELECTROLUMINESCENT PHOSPHOR AND METHOD OF MAKING - A copper activated zinc sulfide electroluminescent phosphor is disclosed, wherein the phosphor comprises greater than about 1,000 ppm copper. Also disclosed is a copper activated zinc sulfide electroluminescent phosphor having a y color coordinate of at least about 0.480. A method for preparing the copper activated zinc sulfide electroluminescent phosphor is disclosed, comprising contacting a zinc sulfide, a first copper source, a magnesium source, and a lithium halide to form a first mixture; heating the mixture at a temperature and for a time sufficient to form a fired mixture; subjecting the fired mixture to a shear force capable of inducing a plurality of defects in the zinc sulfide lattice structure; and then contacting the fired mixture with a second copper source and a zinc oxide to form a second mixture; heating the second mixture at a temperature and for a time sufficient to form a second-fired material. | 2014-01-09 |
20140008829 | DEVICE AND METHOD FOR EXTRUSION OF A SOLID BODY - The extrusion device of a solid film comprises a cell provided with an input opening of a material designed to form the solid film, and an output opening of the solid film from the cell. The device comprises a first heat exchanger for applying a first temperature to the output opening and a second heat exchanger for applying a second temperature in a first zone of the cell distinct from the output opening and a control circuit imposing first and second sets of first and second temperatures. The first set enables a volume of the material in solid phase to be formed. The second set enables a temperature gradient to be generated in the volume so as to generate a pressure forcing extrusion of the solid film via the output opening. | 2014-01-09 |
20140008830 | THIN FILM WITH NON-SELF-AGGREGATING UNIFORM HETEROGENEITY AND DRUG DELIVERY SYSTEMS MADE THEREFROM - The invention relates to film products containing desired levels of active components and methods of their preparation. Desirably, the films disintegrate in water and may be formed by a controlled drying process, or other process that maintains the required uniformity of the film. Desirably, the films may be exposed to temperatures above that at which the active components typically degrade without concern for loss of the desired activity. | 2014-01-09 |
20140008831 | Films and Drug Delivery Systems Made Therefrom - The invention relates to the film products and methods of their preparation that demonstrate a non-self-aggregating uniform heterogeneity. Desirably, the films disintegrate in water and may be formed by a controlled drying process, or other process that maintains the required uniformity of the film. The films contain a polymer component, which includes polyethylene oxide optionally blended with hydrophilic cellulosic polymers. Desirably, the films also contain a pharmaceutical and/or cosmetic active agent with no more than a 10% variance of the active agent pharmaceutical and/or cosmetic active agent per unit area of the film. | 2014-01-09 |
20140008832 | Films and Drug Delivery Systems Made Therefrom - The invention relates to the film products and methods of their preparation that demonstrate a non-self-aggregating uniform heterogeneity. Desirably, the films disintegrate in water and may be formed by a controlled drying process, or other process that maintains the required uniformity of the film. The films contain a polymer component, which includes polyethylene oxide optionally blended with hydrophilic cellulosic polymers. Desirably, the films also contain a pharmaceutical and/or cosmetic active agent with no more than a 10% variance of the active agent pharmaceutical and/or cosmetic active agent per unit area of the film. | 2014-01-09 |
20140008833 | Non ionic groups of amphoteric polysaccharide linear or branched alkyl or acid and base distillation reservoir liquid or gas solids particle and Nano particle dispersion and recovery basin in vacuum processing for Building Materials and High Wear-Heat Resistant Parts Brushes; Windings; Coils; Battery Cells; Brake Pads; Bushings; And 2.5 Phase Extrusion Die Cast Molding - The variable hydraulic preform slurry electrolyte carbon extrusion high wear-heat resistant parts press is utilized process specified scientific formula liquid or gas Nano particle dispersion preform slurry electrolyte extrusion carbon nanofoam CNFs, with or without ionic suspension element | 2014-01-09 |
20140008846 | SHALLOW METALLURGICAL WIRE INJECTION METHOD AND RELATED DEPTH CONTROL - A method and system for dispensing an additive wire involves use of a lance for delivering the additive wire and determination of location data with respect to a surface of a metallurgical melt into which the lance is placed. | 2014-01-09 |
20140008847 | MANUFACTURING METHOD OF HIGH-STRENGTH AND HIGH-TOUGHNESS THIN STEEL AND HEAT TREATMENT APPARATUS - To provide a technique suitable for elevating strength and toughness of a thin low-carbon steel. By performing rapid heating and rapid cooling to a thin low-carbon steel which is an ordinary steel with a thickness of 1.2 mm or less, a steel where a microstructure becomes a duplex grain size structure mixed with crystal grains having different grain diameters, which is not homogeneous, preferably, hard phase structures are contained in addition to the duplex grain size structure is obtained, and a high-strength and high-toughness thin low-carbon steel is obtained. Further, by performing a heat treatment process involving rapid heating and rapid cooling multiple times, a duplex grain size structure of crystal grains with smaller grain diameters or a hard phase structure contained therein is obtained, so that a thin low-carbon steel with higher strength and higher toughness is obtained. | 2014-01-09 |
20140008852 | SPRING AND MANUFACTURE METHOD THEREOF - A spring with superior fatigue resistance is provided by decreasing the material cost while simplifying the production process. Disclosed is a spring including: a composition consisting of, by mass %, 0.5 to 0.7% of C, 1.0 to 2.0% of Si, 0.1 to 1.0% of Mn, 0.1 to 1.0% of Cr, not more than 0.035% of P, not more than 0.035% of S, and the balance of Fe and impurities; a structure including not less than 95% of tempered martensitic structure; a compressive residual stress layer formed to a depth of 0.35 mm to D/4, in which D (mm) is a diameter; the compressive residual stress layer having maximum compressive residual stress of 800 to 2000 MPa; a center portion with Vickers hardness of 550 to 700 HV; and a high hardness layer with greater hardness than the center portion. | 2014-01-09 |
20140008853 | Magnetic Device for Gripping and Clamping a Workpiece in a Machining Unit or Machining Line - A magnetic device for gripping and clamping a workpiece in a machining unit or on a machining line including a magnetic plate having a distribution of high-energy permanent-magnet modules, which can be electrically activated. An auxiliary workpiece-holder plate made of ferromagnetic material rests on a main surface of the magnetic plate and has a top surface shaped in a way complementary to a surface of the workpiece that rests thereon. The workpiece rests on the top surface of the auxiliary workpiece-holder plate only in points corresponding to some supporting pads, whilst the facing surfaces of the workpiece and auxiliary workpiece-holder plate are kept slightly set apart from one another for most of their extension. | 2014-01-09 |
20140008854 | Method and Apparatus for Forming an Angled Flange - A method and apparatus comprising a structure and a locking magnet. The structure comprises a retaining portion and a magnetic portion. The retaining portion of the structure is configured to receive a first section of a workpiece such that a second section of the workpiece is positioned at an angle relative to the magnetic portion of the structure. The magnetic portion of the structure is positioned at a first side of the workpiece. The locking magnet is configured to exert an attractive force that causes the magnetic portion of the structure to move towards the second section of the workpiece when the locking magnet is positioned at a second side of the workpiece. | 2014-01-09 |
20140008855 | APPARATUS AND METHOD FOR SUPPORTING A WORKPIECE DURING PROCESSING - An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece. | 2014-01-09 |
20140008856 | APPARATUS FOR HOLDING A CONTAINER - The apparatus comprises holder ( | 2014-01-09 |
20140008857 | Workpiece Carrier Device - A workpiece carrier has a base frame, a shaft surrounding a drive axis and a workpiece carrier and includes a rotary frame mounted on the base frame so as to be rotatable about the drive axis, workpiece holders mounted on the rotary frame so as to be rotatable about holding axes, a driving part with a holder mounted so as to be rotatable about the drive axis, a transmission part operationally connected to the rotatably mounted workpiece holders, and an intermediate gear attached to the rotatably mounted holder. The intermediate gear is connected to the shaft and to the transmission part in such a way that the transmission part engages with the driving part so as to be rotatable about an output point that is spaced apart from the drive axis by an eccentricity. | 2014-01-09 |
20140008858 | PAPER SHEET HANDLING APPARATUS - According to one embodiment, a paper sheet handling apparatus includes a supply unit including a support surface which tilts from a vertical direction, and a mounting surface substantially perpendicular to the support surface, and configured to receive a plurality of paper sheets which tilt along the support surface and are stacked on the mounting surface, a pick up mechanism configured to pick up the paper sheets from a mounting surface side of the supply unit, a conveyance path configured to convey the picked up paper sheet, an inspection device configured to inspect the conveyed paper sheet, and an accumulation unit configured to accumulate the inspected paper sheets. | 2014-01-09 |
20140008859 | PRINTING APPARATUS AND DUPLEX PRINTING METHOD THEREFOR - A printing apparatus comprising an image forming system, a sheet-feeding system, a sheet-transporting system, a sheet-controlling device, a sheet-detection device, a first driving system, a second driving system and a controller is provided. The sheet-controlling device and the sheet-detection device are disposed between the sheet-feeding system and the sheet-transporting system. The sheet-controlling device controls an entry of a sheet into the sheet-transporting system. The first driving system drives the sheet-controlling device, and the second driving system drives a transporting mechanism of the sheet-transporting system. The controller upon receiving an error signal from the sheet-detection device signals the sheet-controlling device to inhibit the entry of the sheet into the sheet-transporting system and signals the transporting mechanism to continue its operation. A duplex printing method is also provided. | 2014-01-09 |
20140008862 | PAPER OUTPUT STRUCTURE OF PRINTER - A paper output structure includes a printer enclosure and a paper output extending device. The paper output extending device includes a pivot shaft, a drive gear, and a toothed bar which is capable of internal telescopic extension by means of a drive gear which includes a great gear portion and a first small gear portion. A printed sheet of paper is slightly stretched so as to be dropped uncrinckled and perfectly flat into the output tray. | 2014-01-09 |
20140008863 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A sheet feeding apparatus includes a sheet stacking portion on which sheets are stacked, a sheet feeding unit configured to feed the sheets stacked on the sheet stacking portion, a slope portion arranged downstream of the sheets in a feeding direction of the sheets stacked on the sheet stacking portion and configured to separate the sheets from each other, the sheets fed by the sheet feeding unit being bent when contacting the slope portion, and a contact width variable mechanism configured to change a contact width in which the slope portion and a leading edge of the sheet, in the feeding direction, fed by the sheet feeding unit are in contact with each other by moving part of the slope portion in the feeding direction or in a direction opposite to the feeding direction. | 2014-01-09 |
20140008864 | PAPER ALIGNING APPARATUS FOR PRINTER - A paper aligning apparatus includes a paper tray, a plurality of blocking tabs, and an ordering block. The paper tray includes a stack of paper. The paper tray includes a first edge and a second edge. The plurality of blocking tabs is located on the paper tray and adjacent the first edge. The plurality of blocking tabs is aligned in a line. The ordering block is movably mounted on the paper tray and adjacent to the second edge. The ordering block pushes the stack of paper in the paper tray so that the plurality of blocking tabs resist against the stack of paper. | 2014-01-09 |
20140008865 | Cover Opening-Closing Mechanism and Sheet Feeder Having the Same - A cover opening-closing mechanism is provided, which is configured to allow a cover to rotate around a rotational axis with respect to a housing, the cover opening-closing mechanism including a connecting member configured to connect the housing with the cover, a first contact portion disposed at the cover, and a second contact portion disposed at the housing, the second contact portion configured to contact the first contact portion of the cover so as to hold the cover in a hold position relative to the housing. | 2014-01-09 |
20140008866 | PAPER PRESSING APPARATUS FOR PRINTING APPARATUS - A paper pressing apparatus for a printing apparatus includes a bracket, a paper pressing member, a first gear, a first rolling arm, a second rolling arm, and a first elastic member. The paper pressing member is lifted up from the bracket to accommodate heavily creased or buckled papers, and then released to press the papers flat as they are drawn into the printer. | 2014-01-09 |
20140008867 | PAPER FEEDING DEVICE AND IMAGE FORMING APPARATUS - A remaining amount detector measures beforehand a distance H where there is one sheet. A motor displaces a lifting plate to a paper-feeding position upon storing paper in the feeding unit. The remaining amount detector measures a distance y1 to the lower face of a paper stack. Thereafter, upon transport of paper from the stack, a control unit causes the remaining amount detector to measure a distance y2 for every predetermined number n of fed sheets. A remaining sheet calculation unit calculates a displacement y1−y2=Δy to the bottom of the paper stack S, and calculates the thickness of one sheet on the basis of the displacement Δy and the number n of fed sheets (t=Δy/n). The remaining sheet calculation unit divides the thickness (H−y2) of the paper stack by the thickness t of one paper sheet, and calculates the number of remaining sheets m as (m=((H−y2)/t)+1). | 2014-01-09 |
20140008868 | Battle Chess - A chess-like game involving a board and a plurality of pieces that follow chess based movements. In addition each piece has an attack and defense value which is used to determine if one piece can capture another. Game play may be enhanced with game cards which enhance some aspect of a piece's qualities when capturing or defending. Game play may further be enhanced by board enhancement features. The game may be implemented in physical form as well as using a computer and computer based interface. | 2014-01-09 |
20140008869 | ACTIVE LEARNING CARD GAME AND METHOD FOR GAME BASED TEACHING AND LEARNING OF PERIODIC TABLE OF CHEMICAL ELEMENTS - An educational card game comprises a set of cards and rules for playing card games using them to facilitate Game Based Teaching and Learning is presented. Each card represents a respective one of the chemical elements listed in the Periodic Table of Chemical Elements. The rules prescribe for cards to be distributed to the players who, in their turns in a particular round of the game, attempt to use the cards to win the round by creating meaningful patterns using the played card or by playing the highest value card in that round, or to spoil the round or to save a round from being spoiled by an opponent and optionally using the earned card to form chemical compounds or to form ironing equations, points being scored according the nature of the cards used or the nature of the compound formed, or both. | 2014-01-09 |
20140008886 | ARM COMPONENT FOR VEHICLES AND ITS MANUFACTURING METHOD - Disclosed herein is a suspension arm component for vehicles with sufficient strength or rigidity to withstand repetitive compressive and tensile forces, and a method for manufacturing such a component by pressing or hemming process alone, without recourse to any welding process, forming quickly and simply, a process with advantages in terms of material yield and cost. The suspension arm component for vehicles includes first flange pieces as well as second flange pieces, and a pair of half members, each having a hat-like shaped cross-section perpendicular to its axis, are joined together to protrude the first flange part and the second flange part from an expanded part, where both the first flange part and the second flange part extend linearly along the axis of the main body part. The main body part presents a rectangular shape in its side view. | 2014-01-09 |
20140008887 | SUSPENSION ARRANGEMENT FOR A VEHICLE - A suspension arrangement for a vehicle including a leaf spring element having a substantially longitudinal configuration. Also included is a deflection limiting element coupled to said leaf spring element at an intermediate location thereof, wherein said deflection limiting element comprises a J-shaped spring element. Further included is a resilient element attached to said J-shaped spring element. | 2014-01-09 |
20140008892 | Cart Transporting Apparatus - A cart transporting apparatus including a hitch assembly and a cart coupling assembly. The hitch assembly may include an elongated body, at least one catch member, and a hitch stop. The hitch stop may be, for example, a rotating hitch stop or a sliding hitch stop. The rotating hitch stop may include at least three flanges configured to abut a cart and may further include a detent mechanism. The cart coupling assembly may include at least a first portion and a second portion. The first portion may be pivotally coupled to the second portion. The first portion may include first and second engagement members. The second portion may include third and fourth engagement members. | 2014-01-09 |
20140008893 | Composite Articles, Wear Plates and Methods - A metal matrix composite article is described that includes a metal component, a ceramic component, and a lubricious component. The metal matrix composite article has a first surface and a second surface. The lubricious component is present in an amount that is highest at the first surface and is lowest at the second surface. The ceramic component is present in an amount that is highest at the first surface and is lowest at the second surface. The metal component is present in an amount that is highest at the second surface and is lowest at the first surface. In some cases, the metal matrix composite article is a wear plate for a fifth wheel hitch. | 2014-01-09 |
20140008902 | AIRBAG WITH LOW-VOLUME STRUCTURE - A frontal airbag has a first section, a second section, and a third section, the second section being in fluid communication with both the first and the third section. The first, second and third sections form a triangular structure upon inflation of the airbag. A gas generator is attached to the first section and in fluid communication with the first section. An end portion on the third section remote from the second sections attached to the first section in an area between the gas generator and the second section. Two side tethers attached to the first section and to one of the second and third sections or near transitional bend between the second and third section provide resistance against flattening of the airbag after inflation. The first section and the third section are directly attached to each other by a seam, by an adhesive, or by lamination. | 2014-01-09 |
20140008903 | AIRBAG APPARATUS - An airbag includes a high pressure expansion chamber, a low pressure expansion chamber, and a communication passage, which connects the high pressure expansion chamber and the low pressure expansion chamber to each other. A gas supply port, which supplies inflation gas into the airbag, is located inside the low pressure expansion chamber to discharge the inflation gas toward the inside of the communication passage. The communication passage extends from the edge of a communication port, which connects the high pressure expansion chamber and the low pressure expansion chamber, toward the inside of the high pressure expansion chamber. At deployment and inflation of the airbag, the communication passage is located between a seam formed at the outer periphery of the base fabric sheet of the airbag and the gas supply port. | 2014-01-09 |
20140008904 | STRUCTURE FOR REDUCING KNEE INJURY IN VEHICLE - A structure for reducing knee injury in a vehicle, may include a toe stopper disposed on a bottom of a vehicle interior at a driver's seat or a passenger's seat in a traverse direction of a vehicle body, wherein the toe stopper is protrusively disposed from the bottom of the vehicle interior to have a height such that a front tip of a foot of the driver or the passenger is stopped from moving forward and thus a knee part of the driver or the passenger contacts a crash pad earlier than a shin part of the driver or the passenger. | 2014-01-09 |
20140008905 | SUPPORT DEVICE FOR WORK VEHICLES - A support device for work vehicles, including a support post ( | 2014-01-09 |
20140008912 | METHOD OF OPERATING A WIND TURBINE AS WELL AS A SYSTEM SUITABLE THEREFOR - According to a method of the present invention, a method of operating a wind turbine comprising a power generator, a generator side converter connected to the power generator, a line side converter connected to a power grid through power components, and a DC-link connected between the generator side converter and the line side converter is provided, the method comprising: monitoring the grid voltages on the power grid for overvoltage events; if an overvoltage event is detected, operating the line side converter in an overmodulation range for at least a part of the duration of the overvoltage event. | 2014-01-09 |
20140008913 | Gasification Method, Gasification System and Integrated Coal Gasification Combined Cycle - A method is provided for reducing an amount of steam to be introduced from the outside for a shift reaction in a coal gasification system. A coal gasification method for gasifying a fuel containing carbon, includes the steps of gasifying the fuel containing carbon by reacting the fuel with a gas containing oxygen; cooling a gas produced in the step of gasifying the fuel by spraying water into the produced gas; removing solid particles contained in the cooled produced gas; decomposing ammonia contained in the produced gas into N | 2014-01-09 |
20140008914 | Method and Apparatus for Improved Hydropower Generation at Existing Impoundments - A floatable or moveable and/or fixed frame for insertion of power generating modules to generate power from impounded water through the frame in lock and dam and other settings presenting head potential and moving water. The frame is prefabricated and moved onto site as a module or modules, or as a ballastable marine hulled device with positions in the frame for insertion of modular elements including a generator, a turbine and a spacer for configuring a generating cell in different positions within the frame. A gantry positioned on the frame permits easy movement of individual modules into position. | 2014-01-09 |
20140008915 | GEARLESS CONTRA-ROTATING WIND GENERATOR - A wind turbine generator comprises a stator disposed between first and second generator rotors. The first generator rotor comprises a first rotor shaft and an inner permanent magnet rotor. The second generator rotor is configured to contra-rotate relative to the first generator rotor, and comprises a second rotor shaft and an outer permanent magnet rotor. Inner and outer annular ferromagnetic cores are anchored respectively to radially inner and outer portions of the stator. First and second inner permanent magnets of opposite polarity are anchored to a radially outer surface of the inner permanent magnet rotor adjacent the inner annular ferromagnetic core across an inner air gap, and first and second outer permanent magnets of opposite polarity are anchored to a radially inner surface of the outer permanent magnet rotor adjacent the outer annular ferromagnetic core across an outer air gap. | 2014-01-09 |
20140008920 | LOCK ASSEMBLY - A lock assembly ( | 2014-01-09 |
20140008921 | LOCKING DEVICE FOR CLOSING-OPENING MEMBER - An openable/closable member locking device includes a mounting base, a pivot, a rotor which is mounted rotatably on the mounting base, a pair of arms, a pair of sliding pins having proximal end portions connected to the arms and distal end portions to be inserted into and dislocated from engagement holes, a torsion coil spring which rotationally urges the rotor such that the sliding pins are inserted into the engagement holes, and a lock release unit which moves the sliding pins against an urging force of the torsion coil spring such that they are dislocated from the engagement holes, and a guide portion is provided which causes the sliding pins to slide straight along a lengthwise direction thereof. | 2014-01-09 |
20140008922 | SYSTEM AND METHOD FOR ASSEMBLING A DOOR LOCK - A door lock assembly is configured for installation in a cross bore of a door. The lock assembly includes a lock housing including a disk portion having an outer perimeter and an inner wall extending from the disk portion and defining an annular space between the inner wall and the outer perimeter and a lock space inside of the inner wall. The inner wall is sized to fit within the cross bore and define an annular gap between the inner wall and the cross bore. A retention clip is removably attached to the lock housing and includes a retention portion that engages the cross bore to removably retain the lock housing within the cross bore without the use of fasteners. | 2014-01-09 |
20140008923 | Bumper Assembly for Vehicle - A bumper assembly for vehicle may include a first side member disposed in each of both sides of a vehicle body in a longitudinal direction thereof, a second side member coupled to an external surface of the first side member, a fender member having one side coupled to an external side of the second side member, a member flange connected to front ends of the first and second side members respectively, a mounting flange coupled with the member flange, a first crash box having a rear end connected to the mounting flange, a second crash box having a rear end connected to the mounting flange, and a bumper beam having both distal sides, each of which may be coupled to front ends of the first and second crash boxes. | 2014-01-09 |
20140008926 | CONTAINER CARRYING APPARATUSES AND RELATED METHODS - A carrier for hoisting a load from a first height to a second height. The carrier comprises a substantially bucket-shaped frame configured to support a load while the load is being hoisted from the first height to the second height and a bail for affixing a hoisting mechanism in order to enable the hoisting. The frame includes a base, an upper portion, and a plurality of vertical supports that extend between the base and the upper potion. The base comprises at least one lower support that defines a support surface for supporting the load, which may include a standard five gallon bucket. | 2014-01-09 |
20140008927 | TRANSFER DEVICE COMPRISING A GRIPPER - A gripper ( | 2014-01-09 |
20140008934 | FOLDING TOP - A double buttress folding top has rear-side tensioning bows with two rearwardly directed U-shaped sections that are connected to each other via a central bow section. The tensioning bows tension the folding top cloth in the region of the buttresses. The folding top cloth is fastened to the tensioning bow. The tensioning bow bears from below against a folding top compartment cover and against edges of lateral body cutouts. The folding top compartment cover therefore has two lateral cutouts which, in the open position of the folding top, are closed by lateral flaps. The tensioning bow is of U-shaped design and, above a rear window, has a bow web to which the rear window is coupled in a hinged or pivotable manner. | 2014-01-09 |
20140008935 | FOLDING TOP FOR A MOTOR VEHICLE - A folding top has a folding-top cloth with has fins that are directed toward a rear cover. The fins are arranged on the rear cover in a closed position of the folding top. The fins of the folding-top cloth are pivotable about an axis of rotation via laterally arranged fin links on the folding-top frame. The folding-top cloth can be moved from a braced position into an open position, and vice versa by an adjusting device between the rear cover and the fin link. | 2014-01-09 |
20140008938 | METAL REINFORCEMENT FOR B-PILLAR - A metal reinforcement for a B-pillar of an automotive vehicle includes a lower flange and an upper structure. The lower flange is adapted to adjoin a door sill structure of the automotive vehicle, and the upper structure includes a central portion, surrounded by a plurality of spaced, paired regions. In each paired region, members are identically ordered in position from the central portion, and both members of each paired region have the same profile thickness. | 2014-01-09 |
20140008939 | STRIKER DEVICE FOR A MOTOR VEHICLE DOOR LOCK AND A MOTOR VEHICLE EQUIPPED WITH SUCH STRIKER DEVICE - A striker device for a motor vehicle door lock having a striker and an element made of a plastic material and equipped with a plate, which is suitable for being placed against a wall of the motor vehicle and is coupled to the striker in fixed relative position; the element has a plurality of tongues, which protrude from the plate in the opposite direction to the striker and are arranged in positions so as to engage, in use, the edges of two apertures in the wall of the motor vehicle, to keep the plate in a fixed reference position during a first fitting step; the tongues are breakable to enable changing the position of the striker device with respect to the wall of the motor vehicle in a possible second fitting step. | 2014-01-09 |
20140008940 | ROOF FRAME FOR A MOTOR VEHICLE - A roof frame for a motor vehicle has a cowl frame with upper and lower segments and a plurality of chambers in each segment. An upper connecting surface is on top side of the free end of the lower segment. A lower connecting surface is opposite the upper connecting surface and is connected to a reinforcing element of an A pillar. The upper segment is arranged offset back from the lower segment of the cowl frame and is shortened by mechanical machining to form a step-shaped shoulder in which the outer roof frame is held. | 2014-01-09 |
20140008941 | OPEN ROOF CONSTRUCTION FOR A VEHICLE - Open roof construction for a vehicle having a roof assembly with a panel and a mechanism for closing and opening a roof opening. The moving mechanism comprises two stationary guides extending at least partly in a non-parallel manner along opposite longitudinal edges of the roof opening and two pivot arms each having a first end movably attached to the panel and a second end connected to one of the stationary guides. Each pivot arm is provided with at least one guide member, whereas the movable panel comprises at least two guide parts along which the guide members will move when the respective pivot arms pivot around a respective pivot axis. The shape of said guide parts is such that as a result of the cooperation between corresponding guide members and guide parts the movable panel may be moved in a vertical and/or horizontal direction. | 2014-01-09 |
20140008944 | PACKAGED QUICK ASSEMBLY PICNIC TABLE - A packaged quick assembly picnic table has a tabletop with a pair of leg subassemblies hingedly connected to a bottom side of the table. A pair of side beams is received upon the pair of leg subassemblies, with a pair of bench seats sandwiching the pair of side beams. A binder, such as straps, shrink wrap or the like, secures the tabletop, pair of leg assemblies, pair of side beams and pair of seats together, all being secured within a perimeter defined by the tabletop. There is thus presented a packaged quick assembly picnic table that is secure, stable for stacking, easy to move and maneuver, and capable of quick assembly when delivered to a final location. | 2014-01-09 |
20140008945 | Cool Seat - The Cool Seat is a stadium seat cushion that uses frozen gel packs enclosed in insulation and a waterproof cover to keep a person cool in extremely hot weather. | 2014-01-09 |
20140008946 | Child Support Apparatus - A collapsible child support apparatus includes a frame supporting a seat for the child, the frame and the seat having an open condition for seating a child in the seat and a collapsed condition. The frame includes left and right frame assemblies, each frame assembly comprising a front member, a rear member and a handle member pivotally mounted together by a hinge member to allow pivotal movement of the frame members between open and collapsed conditions. The seat includes a seat base supported by the front frame members, a seat back suspended to the handle members and a seat pivot to allow the seat back and seat base to pivot between open and closed conditions, wherein the seat back is suspended to the handle members to allow the seat back to pivot to any one of a plurality of reclined positions relative to the seat base in the open condition. Each frame assembly comprises a strut of fixed length which is connected between the seat pivot and the handle member for resisting movement of the seat pivot relative to the frame in the open condition. | 2014-01-09 |
20140008947 | Seated Rocking Devices - Seated rocking devices including seats and first supports and second supports attached to the seats. In some examples, first supports may be swingingly connected to seats, define first support surfaces distal the seat, and may be configured to swing about first support axes of rotation. In some examples, second supports may be spaced from first supports and be configured to swing about second axes of rotation. In some examples, seated rocking devices may be configured to adjust between retracted configurations and extended configurations. Some examples may include support interfaces configured to restrict first supports and the second supports from swinging beyond selected spacings associated with extended configurations. In some examples, second supports may be rigidly attached to seats. | 2014-01-09 |
20140008950 | VARIABLE LIGHTWEIGHT SEAT CONCEPT - A bench for a vehicle is provided, which bench comprises at least two seats that are arranged next to one another and are connected to one another. Provision is made for one of the at least two seats to act as a base seat that has at least one locking unit for the purpose of connection to a vehicle floor of a vehicle body, while the at least one other seat hovers above a vehicle floor since the other seat is reversibly connected solely to the base seat. | 2014-01-09 |
20140008951 | PIVOTAL HANDLE LOCK/RELEASE MECHANISM FOR CHILD CAR SEAT - A plurality of lock tracks on a carrier of a car seat, a slider that co-pivots with a handle of the carrier, and an actuator on the handle and moveable between lock and release positions. Each of the lock tracks defines a respective handle position. The slider is slideable between lock and release positions, and is spring-biased toward the lock position. In the slider lock position, the slider engages one of the lock tracks to secure the co-pivoting handle in the respective handle position. And in the slider release position, the slider does not engage any of the lock tracks to permit the co-pivoting handle to pivot between the handle positions. The actuator is biased toward the lock position by the spring-biased slider, and actuating the actuator from its lock position to its release position moves the slider from its lock position to its release position. | 2014-01-09 |
20140008952 | INFANT CARRIER AND CAR SAFETY SEAT WITH NO-RETHREAD HARNESS ADJUSTMENT - A vehicle safety seat and infant carrier system allowing height adjustment of a shoulder harness strap without rethreading the harness strap through the seat. A positioning member is normally biased out of engagement with a toothed rail, allowing a harness strap carried by the positioning member to be adjusted up or down to fit the size of a child. As the harness strap is pulled tight, the positioning member is brought into engagement with the toothed rail, fixing the position of the strap relative to the seat. | 2014-01-09 |
20140008953 | Child Safety Seat Assembly - A child safety seat assembly includes a detachable child seat and a base. The child seat has a seatback, and a foremost end opposite to the seat back. The base includes a shell body, an adjustable platform and a latch mechanism. The shell body has a first and a second end edge opposite to each other. The first end edge is at a height that is greater than that of the second end edge. The adjustable platform is operable to releasibly attach with the child seat. The adjustable platform and the child seat attached with each other are movable in unison between a first state where the foremost end is near the first end edge, and a second state where the foremost end is away from the first end edge and below the first end edge of the shell body. | 2014-01-09 |
20140008954 | DETACHABLE SEATING DEVICE - The present invention relates to a detachable seating device comprising an arrangement in a seat base to hold a seat back, a mechanism to couple a seat base, the seat back and a seat back cover, a mechanism of reclining the seat back housed in the seat back cover, a mechanism for adjusting one or more reclining positions, one or more detachable side support pads and hand rests and a mechanism housed in the seat base for detaching and replacing at least one detachable side support pad with at least one hand rest. | 2014-01-09 |
20140008955 | ADJUSTABLE CHILD SEAT BASE - An adjustable child seat base includes a seat base housing having first and second distal ends, a movable foot movably mounted to the seat base housing for movement between extended and retracted positions for adjusting the angle of the seat base, and a control handle and release positioned between the first and second distal ends of the seat base housing. The control handle and release is adapted for effecting one-handed control of the movement of the movable foot. | 2014-01-09 |
20140008956 | CONTINUOUS MANUAL RECLINER WITH INTEGRATED LOCK - A continuous manual seat recliner mechanism with an integrated lock includes an upper gear plate and lower gear plate in geared connection with the upper gear plate. The upper gear plate is able to rotate eccentrically in relation to the lower gear plate. A coiled locking spring is located within a central bore of a lock cylinder which is fixed to the lower gear plate so that an outside surface of the locking spring may frictionally engage the lock cylinder to prevent the lock cylinder and, thereby, the lower gear, from rotating. The ends of the lock spring engage with a knob hub and a driver hub such that rotation of the knob hub unlocks the recliner to allow adjustment by the operator, while rotation of the driver hub locks the recliner mechanism. | 2014-01-09 |
20140008957 | Wheelchair Backrest Assembly - A backrest assembly for a wheelchair includes a support plate pivotally connected to a seat, wherein the support plate is configured to be pivotally adjusted between upright and reclined positions with respect to the seat; a slide plate slidably secured on a front surface of the support plate; and a backrest adjustment assembly operatively connected to the support plate and the slide plate. The backrest adjustment assembly includes a link configured to adjust the support plate. The slide plate slides over the support plate through the link. | 2014-01-09 |
20140008958 | RECLINING DEVICE - A reclining device includes a first member, a second member which is stacked at an open side of the first member, a pawl which is movably provided with the second member, a rotating cam which is provided to be rotatable about an axis of the relative rotation and includes a hook portion having a hook shape a guide which is formed with the second member and guides the pawl between a locked position and the unlocked position and a cam which is provided among the rotating cam, the pawl and the guide. | 2014-01-09 |
20140008959 | CHILDCARE DEVICE INCLUDING INFLATABLE SAFETY ELEMENTS - A child care device is configured to receive a child. The device includes a child-restraint harness including first and second shoulder straps and inflatable elements associated with each shoulder strap. | 2014-01-09 |
20140008964 | WHEEL FOR PEDAL-ASSISTED BIKES - Wheel for pedal-assisted bikes includes:
| 2014-01-09 |
20140008965 | BRAKE DEVICE FOR VEHICLE - A brake device for a vehicle is provided in which when a slave cylinder generates a brake fluid pressure that is commensurate with the actual amount of operation of a brake pedal by a driver in a state in which a master cut valve is closed and a fluid path connecting a master cylinder to the slave cylinder is cut off, a wheel cylinder is actuated by the brake fluid pressure. Since deterioration determination means determines a leak in the downstream of the slave cylinder based on the actual amount of actuation of the slave cylinder detected by a slave cylinder stroke sensor and the actual brake fluid pressure generated by the slave cylinder and detected by a fluid pressure sensor, it is possible to rapidly determine a leak in the downstream of the slave cylinder. | 2014-01-09 |
20140008972 | ELECTRICAL POWER SUPPLY FOR AN AIRCRAFT - A generation method performed by a generator module of an electricity network of an aircraft, the electricity network including a power supply line powered by the generator module, a DC bus powered from the power supply line via a rectifier, and at least one electrical actuator powered with AC from the DC bus via an inverter. The generation method includes: delivering an AC voltage as a function of a voltage setpoint and of a voltage measured in the on-board network; and determining the voltage setpoint as a function of an operating parameter of the actuator. | 2014-01-09 |
20140008973 | DEVICE FOR THE INDUCTIVE TRANSMISSION OF ELECTRIC ENERGY - An apparatus inductively transmits electrical energy from a primary coil, which is arranged in a stationary unit, to a secondary coil, which is arranged in a vehicle. The primary coil and/or the secondary coil have or has at least one switchable coil tap for adjusting a coil length which is active for the inductive energy transmission. | 2014-01-09 |