02nd week of 2015 patent applcation highlights part 38 |
Patent application number | Title | Published |
20150011073 | LASER SCRIBING AND PLASMA ETCH FOR HIGH DIE BREAK STRENGTH AND SMOOTH SIDEWALL - In embodiments, a hybrid wafer or substrate dicing process involving an initial laser scribe and subsequent plasma etch is implemented for die singulation. The laser scribe process may be used to cleanly remove a mask layer, organic and inorganic dielectric layers, and device layers. The laser etch process may then be terminated upon exposure of, or partial etch of, the wafer or substrate. In embodiments, a hybrid plasma etching approach is employed to dice the wafers where an isotropic etch is employed to improve the die sidewall following an anisotropic etch with a plasma based on a combination of NF | 2015-01-08 |
20150011074 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING WRAPPING LAYER - A method of fabricating a semiconductor device includes providing a substrate having first areas and second areas, forming first metal wires on the first areas of the substrate, forming second metal wires on the second areas of the substrate, forming an interlayer insulation layer to cover the first and second metal wires, forming pad patterns on the first metal wires, forming a passivation layer to cover the pad patterns on the interlayer insulation layer, and forming a wrapping layer on the passivation layer. The wrapping layer includes first openings that are vertically aligned with the pad patterns, and second openings that are disposed on the second areas and that horizontally connect the first openings with each other. | 2015-01-08 |
20150011075 | VACUUM DEPOSITION APPARATUS AND METHOD USING THE SAME - A vacuum deposition apparatus includes a vacuum deposition device, a mask, a vacuum chamber and a controlling unit. The vacuum deposition device deposits a thin film layer on a substrate. The mask is disposed between the substrate and the vacuum deposition device, and the thin film layer is selectively deposited on the substrate using the mask. The vacuum chamber surrounds the vacuum deposition device and the mask, the controlling unit is disposed outside of the vacuum chamber, and the controlling unit is connected with the vacuum deposition device and controls both a tensile force and a compressive force on the mask. | 2015-01-08 |
20150011076 | REACTOR GAS PANEL COMMON EXHAUST - A substrate processing system is described that has a reactor and a gas panel, and a common exhaust for the reactor and the gas panel. An exhaust conduit from the reactor is routed to the gas panel, and exhaust gases from the reactor are used to purge the gas panel. Gases from the reactor may be cooled before flowing to the gas panel. | 2015-01-08 |
20150011077 | VAPOR PHASE GROWTH APPARATUS AND VAPOR PHASE GROWTH METHOD - A vapor phase growth apparatus of an embodiment includes: a reaction chamber configured to perform a film formation process of nitride; a first gas supply path configured to supply a halogen-based gas; a second gas supply path configured to supply an ammonia gas; a shower plate disposed at the upper portion of the reaction chamber, the shower plate configured to supply the halogen-based gas and the ammonia gas into the reaction chamber, the shower plate having a first gas passage and a second gas passage in the shower plate, the first gas passage connected to the first gas supply path and the second gas passage connected to the second gas supply path, the second gas passage being separated from the first gas passage in the shower plate until the second gas passage reaches the reaction chamber; and a substrate provided inside the reaction chamber. | 2015-01-08 |
20150011078 | MASK FOR FORMING SEMICONDUCTOR PATTERN, PATTERNING SYSTEM WITH THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - A mask for forming a semiconductor pattern includes a first body portion provided with a first through hole for injecting a semiconductor material and a second body portion provided with a second through hole for exhausting a gas. As the result of the gas suction through the second through hole, the semiconductor material may be crystallized to form a semiconductor pattern on a base substrate. A thickness of the semiconductor pattern can be controlled by a space between the mask and the base substrate, and a crystal structure of the semiconductor pattern can be controlled by an amount of the gas to be exhausted through the second through hole. | 2015-01-08 |
20150011079 | METHOD FOR MANUFACTURING SILICON EPITAXIAL WAFER - The present invention provides a method for manufacturing a silicon epitaxial wafer, characterized in that a silicon epitaxial layer is formed on an N-type silicon single crystal wafer manufactured by doping with arsenic to set a resistivity to 1.0 to 1.7 mΩcm and further doping with carbon, nitrogen, or both carbon and nitrogen. As a result, there can be provided the method for manufacturing a silicon epitaxial wafer that can suppress occurrence of stacking faults at the time of performing epitaxial growth on the arsenic-doped super-low resistance silicon single crystal wafer. | 2015-01-08 |
20150011080 | METHOD FOR ELECTRICAL ACTIVATION OF DOPANT SPECIES IN A GaN FILM - The method includes the steps of a) Providing a stack having a support substrate and a film of GaN having dopant species, b) Directly bonding a shielding layer having a thickness higher than 2 micrometers to the surface of the film of GaN, so as to form an activation structure, and c) Applying a thermal budget to the activation structure according to conditions allowing to electrically activate at least one portion of the dopant species. | 2015-01-08 |
20150011081 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - In a method of fabricating a semiconductor device having a MISFET of trench gate structure, a trench is formed from a major surface of a semiconductor layer of first conductivity type which serves as a drain region, in a depth direction of the direction of the semiconductor layer, a gate insulating film including a thermal oxide film and a deposited film is formed over the internal surface of the trench, and after a gate electrode has been formed in the trench, impurities are introduced into the semiconductor substrate of first conductivity type to form a semiconductor region of second conductivity type which serves as a channel forming region, and impurities are introduced into the semiconductor region of second conductivity type to form the semiconductor region of first conductivity type which serves as a source region. | 2015-01-08 |
20150011082 | CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME - A conductive structure for a semiconductor chip and a method for forming the conductive structure are provided. The semiconductor chip comprises a semiconductor substrate, a pad, a passivation layer and a patterned insulating layer. The patterned insulating layer is disposed on the passivation layer and partially and directly covers the first opening of the pad to expose a second opening. The conductive structure comprises an under bump metal (UBM) layer and a conductive bump. The UBM layer is disposed in the second opening defined by the patterned insulating layer and is electrically connected to the pad. The conductive bump is disposed on the UBM layer and is electrically connected to the UBM layer. The upper surface of the conductive bump is greater than the upper surface of the patterned insulating layer, while the portion of the conductive bump disposed in the second opening is covered by the UBM layer. | 2015-01-08 |
20150011083 | Through-Vias and Methods of Forming the Same - An integrated circuit structure includes a substrate, a metal ring penetrating through the substrate, a dielectric region encircled by the metal ring, and a through-via penetrating through the dielectric region. The dielectric region is in contact with the through-via and the metal ring. | 2015-01-08 |
20150011084 | METHOD OF MAKING INTERCONNECT STRUCTURE - A method of making a semiconductor device including forming a first adhesion layer over a substrate. The method further includes forming a second adhesion layer over the first adhesion layer, where the second adhesion layer is formed using an inert gas with a first flow rate under a first RF power. Additionally, the method includes forming a low-k dielectric layer over the second adhesion layer, where the low-k dielectric layer is formed using the inert gas with a second flow rate under a second RF power under at least one of the following two conditions: 1) the second flow rate is different from the first flow rate; or 2) the second RF power is different from the first RF power. Furthermore, the method includes forming an opening in the dielectric layer, the second adhesion layer, and the first adhesion layer. Additionally, the method includes forming a conductor in the opening. | 2015-01-08 |
20150011085 | METHOD FOR FORMING FINE PITCH STRUCTURES - A mold having an open interior volume is used to define patterns. The mold has a ceiling, floor and sidewalls that define the interior volume and inhibit deposition. One end of the mold is open and an opposite end has a sidewall that acts as a seed sidewall. A first material is deposited on the seed sidewall. A second material is deposited on the deposited first material. The deposition of the first and second materials is alternated, thereby forming alternating rows of the first and second materials in the interior volume. The mold and seed layer are subsequently selectively removed. In addition, one of the first or second materials is selectively removed, thereby forming a pattern including free-standing rows of the remaining material. The free-standing rows can be utilized as structures in a final product, e.g., an integrated circuit, or can be used as hard mask structures to pattern an underlying substrate. The mold and rows of material can be formed on multiple levels. The rows on different levels can crisscross one another. Selectively removing material from some of the rows can from openings to form, e.g., contact vias. | 2015-01-08 |
20150011086 | NOVEL CONDUCTOR LAYOUT TECHNIQUE TO REDUCE STRESS-INDUCED VOID FORMATIONS - A semiconductor device is prepared by an annealing process to interconnect at least two components of the device by a conductor line surrounded by an insulator material. The annealing process results in formation of residual stresses within the conductor line and the insulator material. One or multiple notches are designed in the layout on a selective portion of the mask for patterning conductor line. The existence of the notch or notches on the selective portion generates extra stress components within the conductor line than would exist without the existence of the notch. The position of the notch is selected so that the extra stress components substantially counteract the residual stresses, thereby causing a net reduction in the residual stresses. The reduction in the residual stresses results in a corresponding mechanical stress migration and therefore improvement in the reliability of the device. | 2015-01-08 |
20150011087 | METHOD OF DEPOSITING FILM - A method of depositing a film is provided. In the method, a first process gas and a second process gas that react with each other is sequentially supplied to cause an atomic layer or a molecular layer of a reaction product of the first process gas and the second process gas to deposit on a substrate in a chamber by repeating a cycle of sequentially supplying the first process gas and the second process gas to the substrate once each cycle. A cycle time of the cycle is set equal to or shorter than 0.5 seconds. | 2015-01-08 |
20150011088 | METHODS AND APPARATUS FOR DEPOSITING AND/OR ETCHING MATERIAL ON A SUBSTRATE - Methods are disclosed for depositing material onto and/or etching material from a substrate in a surface processing tool having a processing chamber, a controller and one or more devices for adjusting the process parameters within the chamber. The method comprises: the controller instructing the one or more devices according to a series of control steps, each control step specifying a defined set of process parameters that the one or more devices are instructed to implement, wherein at least one of the control steps comprises the controller instructing the one or more devices to implement a defined set of constant process parameters for the duration of the step, including at least a chamber pressure and gas flow rate through the chamber, which duration is less than the corresponding gas residence time (T | 2015-01-08 |
20150011089 | PATTERN FORMATION METHOD - According to one embodiment, a pattern formation method includes forming a layer above an underlying layer. The layer includes a block copolymer. The method further includes forming a first phase including a first polymer and a second phase including a second polymer in the layer by phase-separating the block copolymer, and selectively removing the first phase by dry etching the layer using an etching gas including carbon monoxide. | 2015-01-08 |
20150011090 | FIN-SHAPED STRUCTURE FORMING PROCESS - A fin-shaped structure forming process includes the following step. A first mandrel and a second mandrel are formed on a substrate. A first spacer material is formed to entirely cover the first mandrel, the second mandrel and the substrate. The exposed first spacer material is etched to form a first spacer on the substrate beside the first mandrel. A second spacer material is formed to entirely cover the first mandrel, the second mandrel and the substrate. The second spacer material and the first spacer material are etched to form a second spacer on the substrate beside the second mandrel and a third spacer including the first spacer on the substrate beside the first mandrel. The layout of the second spacer and the third spacer is transferred to the substrate, so a second fin-shaped structure and a first fin-shaped structure having different widths are formed respectively. | 2015-01-08 |
20150011091 | SUBSTRATE PROCESSING METHOD AND CONTROL APPARATUS - Provided is a substrate processing method of filling a recess of a predetermined uneven pattern formed on a substrate with a film forming material by performing a first film forming processing, a first etching processing and a second film forming processing on the substrate, using a vertical substrate processing apparatus and a control apparatus controlling operations of the vertical substrate processing apparatus. The method includes calculating a first film forming condition, a first etching condition, and a second film forming condition by the control apparatus such that the film forming material is filled in the recess without any void after the second film forming processing; and performing the first film forming processing, the first etching processing and the second film forming processing on the substrate based on the calculated first film forming condition, first etching condition and second film forming condition. | 2015-01-08 |
20150011092 | RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING COPOLYMER RESIN HAVING HETEROCYCLIC RING - A resist underlayer film-forming composition for forming a resist underlayer film having both dry etching resistance and heat resistance. A resist underlayer film-forming composition comprising a polymer containing a unit structure of Formula (1): | 2015-01-08 |
20150011093 | ION BEAM ETCHING SYSTEM - The disclosed embodiments relate to methods and apparatus for removing material from a substrate. In various implementations, conductive material is removed from a sidewall of a previously etched feature such as a trench, hole or pillar on a semiconductor substrate. In practicing the techniques herein, a substrate is provided in a reaction chamber that is divided into an upper plasma generation chamber and a lower processing chamber by a corrugated ion extractor plate with apertures therethrough. The extractor plate is corrugated such that the plasma sheath follows the shape of the extractor plate, such that ions enter the lower processing chamber at an angle relative to the substrate. As such, during processing, ions are able to penetrate into previously etched features and strike the substrate on the sidewalls of such features. Through this mechanism, the material on the sidewalls of the features may be removed. | 2015-01-08 |
20150011094 | MANUFACTURING METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS - A manufacturing method of a semiconductor manufacturing apparatus is provided for etching a multilayer film having a first film and a second film with differing dielectric constants alternatingly stacked on a substrate, and forming a hole with a predetermined shape in the multilayer film. The manufacturing method includes a first step of etching the multilayer film to a first depth using a gas mixture containing a CF based gas at a first flow rate and a bromine-containing gas, a chloride-containing gas, and/or an iodine-containing gas; a second step of etching the multilayer film to a second depth after the first step using a gas mixture containing the CF based gas at a second flow rate and the bromine-containing gas, the chloride-containing gas, and/or the iodine-containing gas; and a third step for over etching the multilayer film after the second step until the hole reaches a base layer. | 2015-01-08 |
20150011095 | CHEMICAL DEPOSITION APPARATUS HAVING CONDUCTANCE CONTROL - A chemical deposition apparatus having conductance control, which includes a showerhead module having a faceplate and a backing plate, the showerhead module including a plurality of inlets which deliver reactor chemistries to a cavity and exhaust outlets which remove reactor chemistries, a pedestal module configured to support a substrate and which moves vertically to close the cavity between the pedestal module and an outer portion of the faceplate, and at least one conductance control assembly, which is in fluid communication with the cavity via the exhaust outlets. The at least one conductance control assembly selected from one or more of the following: a ball valve assembly, a fluidic valve, magnetically coupled rotary plates, and/or a linear based magnetic system. | 2015-01-08 |
20150011096 | DEPOSITION APPARATUS INCLUDING AN ISOTHERMAL PROCESSING ZONE - A deposition apparatus for processing semiconductor substrates having an isothermal processing zone comprises a chemical isolation chamber in which semiconductor substrates are processed. A process gas source is in fluid communication with a showerhead module which delivers process gases from the process gas source to the isothermal processing zone wherein the showerhead module includes a faceplate wherein a lower surface of the faceplate forms an upper wall of a cavity defining the isothermal processing zone, a backing plate, and an isolation ring which surrounds the faceplate and the backing plate. At least one compression seal is compressed between the faceplate and the backing plate which forms a central gas plenum between the faceplate and the backing plate. A substrate pedestal module is configured to heat and support a semiconductor substrate wherein an upper surface of the pedestal module forms a lower wall of the cavity defining the isothermal processing zone within the chemical isolation chamber. A vacuum source is in fluid communication with the isothermal processing zone for evacuating process gas from the processing zone. | 2015-01-08 |
20150011097 | METHODS AND APPARATUS FOR DUAL CONFINEMENT AND ULTRA-HIGH PRESSURE IN AN ADJUSTABLE GAP PLASMA CHAMBER - A plasma processing system having a plasma processing chamber configured for processing a substrate is provided. The plasma processing system includes at least an upper electrode and a lower electrode for processing the substrate. The substrate is disposed on the lower electrode during plasma processing, where the upper electrode and the substrate forms a first gap. The plasma processing system also includes an upper electrode peripheral extension (UE-PE). The UE-PE is mechanically coupled to a periphery of the upper electrode, where the UE-PE is configured to be non-coplanar with the upper electrode. The plasma processing system further includes a cover ring. The cover ring is configured to concentrically surround the lower electrode, where the UE-PE and the cover ring forms a second gap. | 2015-01-08 |
20150011098 | TRAILER ADAPTER WITH LIGHT - A trailer adapter to connect a master electrical system of a towing vehicle with a subservient electrical system of a towed vehicle having a light connectable thereto is disclosed. In particular, the trailer adapter may include a body having at least one electrical interface, where the at least one electrical interface is capable of electrically engaging the electrical system of the towing vehicle. The trailer adapter may also include a light source operatively coupled to the body, where the light source is selectively changeable between at least two operative modes capable of providing illumination. | 2015-01-08 |
20150011099 | Portable device's protecting case having sliding connector - Provided is a portable device's protecting case having a sliding connector, the portable device's protecting case including: a sliding connector | 2015-01-08 |
20150011100 | PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING SAME, AND METHOD OF MOUNTING THE CIRCUIT BOARD IN A CONNECTOR SOCKET - A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and second opposite sides of the circuit board, each of the retention bosses protruding from a surface of the circuit board and extending parallel to and adjacent to the first edge of the circuit board. When the first edge of the circuit board is inserted into a slot of a connector socket, contact surfaces of the first and second retention bosses contact top surfaces of the connector socket to help immobilize the circuit board with respect to the connector socket. Adhesive layers on the contact surfaces of the first and second retention bosses may adhere to the top surfaces of the connector socket to help hold the circuit board immobile with respect to the connector socket. | 2015-01-08 |
20150011101 | SINGLE LAYER LEADFRAME WITH INTEGRATED THREE-ROW CONNECTOR - A lead frame assembly having a lead frame made of a single layer, a housing substantially surrounding the lead frame, and a plurality of leads formed as part of the lead frame. The lead frame assembly also includes a plurality of interfaces, allowing various devices to interact with the lead frame, such as sensors, thermistors, solenoids, engine controllers, or electronic control units, or the like. The interfaces may be formed as part of the lead frame, oriented in different directions, and may be located in different planes, making the lead frame assembly suitable for applications with different packaging requirements. The interfaces may be a plurality of connectors, where one of the connectors has multiple rows of pins which are in communication with the rest of the connectors, facilitating the communication between the connector and various devices. | 2015-01-08 |
20150011102 | Connector - A connector connecting a main circuit board and a sub circuit board has two bases, two electrical contacting sets, two resilient bar sets and two mounting brackets. The bases are mounted on the main circuit board. The electrical contacting sets are mounted respectively in the bases and each electrical contacting set has multiple electrical contacting elements. The resilient bar sets are mounted respectively on the bases. The mounting brackets are mounted respectively on the bases and cover the electrical contacting sets and the resilient bar sets. Circuit-board-receiving channels are defined between the bases and the mounting brackets for receiving the sub circuit board such that combination of the main circuit board and the sub circuit board are parallel and flat. | 2015-01-08 |
20150011103 | ELECTRICAL CONNECTOR WITH IMPROVED SOLDER EFFECT - An electrical connector for being surface-mounted to a Printed Circuit Board (PCB) and electrically connected with a complementary connector, includes an insulative housing, a number of conductive contacts received in the insulative housing, and a fixing spacer. The insulative housing includes a front main portion defining a receiving space for accommodating the complementary connector. Each conductive contact includes a contacting portion partially exposed into the receiving space for electrically connecting with the complementary connector, and a termination portion extending along a direction parallel to the PCB. The fixing spacer is insert-molded with the conductive contacts. | 2015-01-08 |
20150011104 | CONNECTOR FOR REDUCING NEAR-END CROSSTALK - A connector is providing for reducing near end cross-talk (NEXT). The connector includes a first pin set having sequentially arranged pins configured to transmit a uni-directional signal, a single ended pin adjacent to the first pin set, and a second pin set having sequentially arranged pins adjacent to the single ended pin and having sequentially arranged pins configured to transmit a bi-directional signal. | 2015-01-08 |
20150011105 | LEVER CONNECTOR - A second connector housing ( | 2015-01-08 |
20150011106 | Lever Type Connector - After first and second connector housings have been aligned at an engagement initiating position, a lever is rotatably engaged with the first connector housing. The lever is provided with boss parts slidable in boss guiding grooves of the second connector housing and boss retracting grooves of the first connector housing. When the boss parts slide with rotation of the engagement operating lever, the connector housings move in an engaging direction such that the boss guiding grooves may be overlapped on the boss retracting grooves. By further rotating the lever, after the mutual engagement between the connector housings has been completed, the boss parts are released from the boss guiding grooves and the boss retracting grooves with the aid of slopes, thus enabling the lever to be detached from both the connector housings. | 2015-01-08 |
20150011107 | WET-MATEABLE ELECTRICAL CONNECTOR WITH WET CONTACTS AND AN ASSOCIATED METHOD - A wet-mateable electrical connection and an associated method are provided for use, for example, within an adverse environment such as underwater. A wet-mateable electrical connection may include a female connector body comprising at least one receptacle. A female contact is disposed within the at least one receptacle. A male connector body having at least one axially directed male contact pin having a forward end portion releaseably engages with the female contact body within the receptacle, thus forming a fully-mated engagement. In the fully-mated engagement, the electrical contacts are in contact with water/fluid. Thus, the electrical connection is established even in the presence of water/fluid. | 2015-01-08 |
20150011108 | PANEL CONNECTOR - The disclosure relates to a panel connector for locking to a pass-through opening of a panel to allow electrical connection from one side of the panel to the other side. This connection can be considered to be of an outside-in type. The connector can seal the pass-through opening to resist passage dirt, debris and/or liquids. A channel provided on the connector can include a sealing gasket and can receive an annular rib disposed on the panel to create an effective and robust seal against even pressurized water spray. The connector can also prevent unlocking of the connector from the panel once locked to the panel. A resilient locking arm provided on the connector for engaging a mating slot of the panel opening can prevent counter rotational unlocking and detent member can prevent continued rotation after the connector is in the locked position. | 2015-01-08 |
20150011109 | HIGH VOLTAGE CONNECTOR - A high voltage connector is provided that includes a female body, a male body, and a safety pin. The female body has an insertion bore, a push bar, and an engagement portion. The male body is inserted in the female body. An upper end portion of the male body has an engagement hook positioned to correspond to the engagement portion to engage the engagement hook and the engagement portion when the male body is inserted into the insertion bore of the female body. In addition, a first side of the safety pin is inserted in an upper portion of the insertion bore in the female body and contacts first sides of the engagement portion and the engagement hook A second side of the safety pin is exposed and has a pin recess into which a removal tool is to be inserted. | 2015-01-08 |
20150011110 | ELECTRICAL CONNECTORS AND RECEPTACLE ASSEMBLIES HAVING RETENTION INSERTS - An electrical connector includes a housing extending from a mating face to an opposite face, and first and second side walls that extend between the mating face and the opposite face. The housing has a contact cavity that includes opposing sides. The first side wall includes a side opening that extends through the first side wall into communication with the contact cavity. The contact cavity is accessible through the mating face for receiving a mating connector therein. Electrical contacts are held by the housing and arranged in opposing rows that extend along the opposing sides of the contact cavity. A retention insert is received within the side opening. The retention insert includes fingers that extend into the contact cavity and engage in physical contact with corresponding electrical contacts of one of the rows of the electrical contacts to hold the corresponding electrical contacts within the contact cavity. | 2015-01-08 |
20150011111 | POWER SUPPLY CONNECTOR - The link member ( | 2015-01-08 |
20150011112 | ELECTRICAL CONNECTION DEVICE, ASSEMBLY INCLUDING SUCH A DEVICE AND AN ELECTRONIC BOARD, AND METHOD FOR ELECTRICALLY CONNECTING AN ELECTRONIC BOARD - The invention relates to a device ( | 2015-01-08 |
20150011113 | ELECTRICAL CONNECTOR AND CONTACT FOR INTERCONNECTING DIFFERENT COMPONENTS - Electrical connector including a connector body having an engagement side and a contact cavity that opens to the engagement side. The contact cavity includes a wire-receiving slot that is shaped to receive a wire conductor and a board-receiving slot that is shaped to receive a circuit board. The electrical connector also includes an electrical contact held by the connector body within the contact cavity. The electrical contact includes a spring member and an insulation displacement contact (IDC) channel. The spring member extends into the board-receiving slot to engage the circuit board. The IDC channel opens to the wire-receiving slot to receive the wire conductor. | 2015-01-08 |
20150011114 | CONNECTOR TERMINAL AND CONNECTOR HOUSING USED FOR THE SAME - The connector terminal includes at opposite ends a pair of press-fit terminals to be inserted into through-holes formed through two printed circuit boards located facing each other, each of the press-fit terminals having a plurality of contact pieces, and further includes at least one buffer portion deformable in accordance with a gap between imaginary longitudinal center lines of the press-fit terminals. | 2015-01-08 |
20150011115 | ELECTRICAL CONNECTION SECURED AGAINST ROTATION, IN PARTICULAR FOR AN ELECTRICALLY HEATABLE HONEYCOMB BODY - An electrical connection for an electrical component or electrically heatable honeycomb body, in an exhaust system of an internal combustion engine includes an electrical conductor passing through a metallic jacket of the exhaust system, a bushing and an insulating layer and having an outer connection section with circular cross section. The connection section has a contact surface for connection to a supply line connection piece. The bushing and/or electrical conductor near the bushing can absorb torques up to 3.6, 4.5 or 7 Nm per cm | 2015-01-08 |
20150011116 | CONNECTION TERMINAL - A connection terminal includes: a terminal connection portion to be connected with a mating terminal; a wire connection portion including a pair of crimping pieces crimped to an exposed conductor and insulation sheath of a wire; an anticorrosion material provided to cover the exposed conductor and insulation sheath exposed on an outside of the wire connection portion and cover a gap provided in a portion where edges of the respective crimping pieces face and come into contact with each other; and an anticorrosion material holding portion provided in the portion where the edges of the respective crimping pieces face and come into contact with each other. | 2015-01-08 |
20150011117 | CONNECTION TERMINAL - A connection terminal includes a terminal connection portion to be connected with a mating terminal is connected, a wire connection portion connected to the terminal connection portion and a wire, an anticorrosion material provided to cover an area in the wire connection portion where water may be poured to the wire, and an anticorrosion material holding portion provided in the wire connection portion towards the terminal connection portion. | 2015-01-08 |
20150011118 | CONNECTOR - A connector that reduces damage of a contact portion of a contact, caused by a frame portion of a card holder when the frame portion is inserted into or extracted from a holder accommodating portion of a connector main body. A connector includes a card holder that includes a frame portion having a card accommodating portion for accommodating a card, and a connector main body that is mounted on a printed substrate and has a holder accommodating portion for accommodating the card holder. The frame portion is provided with inclined portions for suppressing deformation of contact portions of contacts protruding into the holder accommodating portion, caused by a front side of the frame portion when the card holder is inserted into or extracted from the holder accommodating portion. | 2015-01-08 |
20150011119 | ROTATABLE FRAME, CONNECTOR, AND CONNECTOR SUPPORT SYSTEM - A rotatable frame is provided for accommodating a connector. The rotatable frame can be used with a plate and includes a frame body, two positioning portions, and two pivots. The frame body has a first sidewall, a second sidewall, a top plate, and a bottom plate, wherein the first sidewall, the second sidewall, the top plate, and the bottom plate are connected to enclose an accommodation space for accommodating the connector and to form a connector inserting opening. The two positioning portions are respectively formed on the top plate and the bottom plate at one side that is near the connector inserting port. The two positioning portions respectively have a blocking surface, wherein the blocking surface obliquely extends away from the connector inserting opening. The two pivots respectively protrude from the outer side of the first sidewall and the outer side of the second sidewall coaxially. | 2015-01-08 |
20150011120 | SHIELDED AND MULTISHIELDED COAXIAL CONNECTORS - A shielded coaxial connector with a moveable center conductor and a stationary center conductor, the center conductors forming a disconnect switch that interoperates with a waveguide to shield one of the center conductors from radio frequency signals such as radio frequency signals carried by the other center conductor. | 2015-01-08 |
20150011121 | ANTENNA LINE PROTECTION DEVICE - An antenna line protection device includes a pair of coaxial connectors and a streamer discharge module. The pair of coaxial connectors are disposed on both side ends of the antenna line protection device. The streamer discharge module is coupled between the coaxial connectors so that, when a pulse signal is input via the coaxial connectors, the streamer discharge module induces an electric field and thus establishes a discharge current channel, thereby suppressing an excessive input pulse. | 2015-01-08 |
20150011122 | SOCKET CONNECTOR WITH SHIELDING STRUCTURE - A socket connector includes an insulative base ( | 2015-01-08 |
20150011123 | POWER RECEIVING CONNECTOR AND COMMUNICATION SYSTEM - The power receiving connector to be placed as a vehicle-mounted feeding port is formed by integrating connection terminals, internal wirings, wiring branch parts, a ground wire side branch line, a control wire side branch line, capacitors, a superposition separation element, and a low-pass filter with a housing as a replaceable unit. | 2015-01-08 |
20150011124 | Apparatus and method for providing a resistive shunt within a light string - A shunting mechanism is provided within a socket of a light string system having a resistive element that substantially mirrors the resistive characteristic of the bulb inserted in the socket. The shunting mechanism is disabled when the bulb is inserted into the light string socket. When the bulb is removed from the light string socket, the shunting mechanism bridges the internal socket leads so as to maintain current flow and power delivery at levels similar to those provided when the bulb is present. In one embodiment, the resistive element is a resistive coating on the shunting mechanism or a resistive node on the shunting mechanism. In other embodiments, the resistive element is applied to the socket's internal leads. In yet other embodiments, the resistive element consists of sophisticated electronic circuitry specifically designed to mirror the resistive characteristics of the bulb assembly. | 2015-01-08 |
20150011125 | ELECTRICAL CONNECTOR FOR TRANSMITTING DATA SIGNALS - Electrical connector including a connector body having a pathway assembly extending between mating and mounting faces of the connector body. The pathway assembly includes a signal conductor having separate conductor segments and a dielectric body that holds the conductor segments of the signal conductor. The conductor segments have respective interior ends that are positioned adjacent to each other with a signal gap therebetween. The pathway assembly also includes a signal-control component that electrically joins the conductor segments and is configured to modify current flowing through the conductor segments. The dielectric body forms an open channel having at least one of the conductor segments disposed therein. The at least one conductor segment has an exposed surface that interfaces with an air gap in the connector body. | 2015-01-08 |
20150011126 | METHODS AND APPARATUS FOR TERMINATING WIRE WOUND ELECTRONIC COMPONENTS TO AN INSERT HEADER ASSEMBLY - An exemplary connector insert assembly, and methods of manufacture and use thereof. In one embodiment, the connector insert assembly comprises an insert body assembly consisting of two insert body elements made from a high-temperature polymer. The insert body assembly includes an electronic component receiving cavity that is configured to receive any number of electronic components, including without limitation, chip chokes and wire wound electronic components. The insert body assembly includes a wire termination feature that includes termination slots that position the wire ends of the wire wound electronic components adjacent to a substrate to which the wire ends are ultimately to be secured. The wire ends are then secured to the substrate using, for example, a mass termination technique. The aforementioned connector insert assembly can then be inserted into a single or multi-port connector assembly. Methods of manufacturing the aforementioned single or multi-port connector assemblies are also disclosed. | 2015-01-08 |
20150011127 | ELECTRICAL CONNECTOR - An electrical connector can include a connector housing including a housing body that can define an opening that is configured to receive a complementary electrically conductive component along a mating direction. The electrical connector can further include at least one contact member that is supported by the connector housing and is configured to contact the complementary electrically conductive component when the complementary electrically conductive component is received in the opening. The at least one contact member can include an arm having a proximate portion, a distal portion, and an intermediate portion between the proximal and distal portions. The intermediate portion can be spaced outward with respect to each of the proximate and distal portions, and the intermediate portion can bear against the retention rib so as to retain the at least one contact member with respect to the connector housing. | 2015-01-08 |
20150011128 | PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING SAME, AND METHOD OF MOUNTING THE CIRCUIT BOARD IN A CONNECTOR SOCKET - A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and second opposite sides of the circuit board, each of the retention bosses protruding from a surface of the circuit board and extending parallel to and adjacent to the first edge of the circuit board. When the first edge of the circuit board is inserted into a slot of a connector socket, contact surfaces of the first and second retention bosses contact top surfaces of the connector socket to help immobilize the circuit board with respect to the connector socket. Adhesive layers on the contact surfaces of the first and second retention bosses may adhere to the top surfaces of the connector socket to help hold the circuit board immobile with respect to the connector socket. | 2015-01-08 |
20150011129 | Foolproof Structure for Sharing Card Slot Space - The present invention discloses a structure for sharing card slot space. The structure includes a housing. A first card slot and a second card slot are disposed inside the housing. The insertion port of the first card slot is disposed opposite the insertion port of the second card slot. A common space is disposed between the first card slot and the second card slot. A groove is disposed inside the housing of the common space. A stopper is disposed inside the groove. The stopper can slide in the groove between the first card slot and the second card slot and is configured to prevent a card corresponding to the second card slot from being inserted into the first card slot or to prevent a card corresponding to the first card slot from being inserted into the second card slot. | 2015-01-08 |
20150011130 | ELECTRICAL CONNECTOR - An electrical connector includes an insulating housing defining an inserting chamber and terminal grooves communicating with the inserting chamber, electrical terminals of which each has an elastic arm received in the terminal groove and a contact portion protruding towards the inserting chamber at a front end of the elastic arm, and a pressing member slidably sleeved round a front of the insulating housing. A plurality of pressing blocks is protruded at inner sides of the pressing member and projects in the terminal grooves to resist against the elastic arms. The contact portions are located in the terminal grooves when the pressing member is at an initial position. After a mating connector is mated with the electrical connector, push the pressing member rearward to make the pressing blocks press the elastic arms so as to make the contact portions project into the inserting chamber and contact with the mating connector. | 2015-01-08 |
20150011131 | METHODS AND APPARATUS FOR TERMINATING WIRE WOUND ELECTRONIC COMPONENTS TO A HEADER ASSEMBLY - An exemplary header insert assembly, and methods of manufacture and use thereof. In one embodiment, the header insert assembly comprises a connector insert assembly having an insert body assembly consisting of an insert body element. The insert body element includes an electronic component receiving cavity that is configured to receive any number of electronic components. The insert body assembly also includes a wire termination feature that includes termination slots that position the wire ends of the wire wound electronic components adjacent to a substrate to which the wire ends are ultimately to be secured. The wire ends are then secured to the substrate using, for example, a mass termination technique. The aforementioned header insert assembly can then be optionally inserted into a single or multi-port connector assembly. Methods of manufacturing the aforementioned single or multi-port connector assemblies are also disclosed. | 2015-01-08 |
20150011132 | PRESS-FIT TERMINAL AND ELECTRONIC COMPONENT USING THE SAME - There are provided a press-fit terminal which has an excellent whisker resistance and a low inserting force, is unlikely to cause shaving of plating when the press-fit terminal is inserted into a substrate, and has a high heat resistance, and an electronic component using the same. A press-fit terminal comprises: a female terminal connection part provided at one side of an attached part to be attached to a housing; and a substrate connection part provided at the other side and attached to a substrate by press-fitting the substrate connection part into a through-hole formed in the substrate. At least the substrate connection part has the surface structure described below, and the press-fit terminal has an excellent whisker resistance. The surface structure comprises: an A layer formed as an outermost surface layer and formed of Sn, In, or an alloy thereof; a B layer formed below the A layer and constituted of one or two or more selected from the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir; and a C layer formed below the B layer and constituted of one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co, and Cu. The A layer has a thickness of 0.002 to 0.2 μm. The B layer has a thickness of 0.001 to 0.3 μm. The C layer has a thickness of 0.05 μm or larger. | 2015-01-08 |
20150011133 | INFLATABLE WATERCRAFT WITH BATTERY POWERED MOTORIZED CASSETTE - An inflatable watercraft comprises a motorized cassette and at least one inflatable chamber. The at least one inflatable chamber is foldable relative to the motorized cassette at least when the inflatable watercraft is in a deflated configuration. The motorized cassette includes a motor, an impeller, at least one battery, and a pump configured to inflate the at least one inflatable chamber. The pump can include a reversible pump configured to deflate the at least one inflatable chamber. | 2015-01-08 |
20150011134 | Stand Up Mirage Watercraft - A device for insertion in watercraft including propulsion means comprising a pair of flappers which oscillate through an arcuate path in a transverse direction with respect to the central longitudinal dimension of the watercraft. As input force is applied, the flappers twist to form an angle of attack for providing forward thrust. The means for applying propulsive force includes a pair of pedals, and further includes pedal cranks operatively associated with the propulsion means, the fore ends of the pedals being pivotally attached to a fixed point. | 2015-01-08 |
20150011135 | FLOTATION ASSISTANCE BELT - A flotation assistance belt is configured to fit beneath arms of a human user in order to provide buoyancy to the human user in water. The flotation assistance belt includes a belt mechanically coupled to a female fastener and a male fastener. A flotation tube is partially surrounding the belt and configured to bend forming a circle without plastic deformation while having the tensile strength to resist this bending causing the flotation tube to expand outward slightly when the female fastener and the male fastener are connected. Connecting the female fastener to the male fastener forms a circle configured to fit beneath the arms of the human user in order to provide the buoyancy to the human user in the water. | 2015-01-08 |
20150011136 | Personal Flotation Device Having Selectively Inflatable Bladders - An improved structure for a personal floatation device that is relatively comfortable to wear when not in use includes a primary bladder that is shaped to extend about a waist of a user. The personal flotation device also includes a secondary bladder that is in fluid communication with the primary bladder and is shaped to extend upwardly from the waist across a stomach of the user. Lastly, the personal flotation device includes a tertiary bladder that is in fluid communication with the secondary bladder and is shaped to is adapted to across the front of a chest of the user. | 2015-01-08 |
20150011137 | SHOWER CURTAIN WITH ANTI-FOULING FACILITY AND METHOD FOR THE PRODUCTION THEREOF - Shower curtain with anti-fouling facility and method for the production thereof, the shower curtain having an openly cross-linked, multicomponent polycondensate anchored on its fabric, said polycondensate repelling liquid water and having at least the partial condensates of the starting materials a) acrylate prepolymer, b) aliphatic diol, and c) zinc-organic compound with hydroxyl group, remainder adjuvants, additives and unavoidable impurities. | 2015-01-08 |
20150011138 | ANTI-SAGGING GYPSUM PRODUCT AND A METHOD TO MANUFACTURE - The present invention provides a composition, a gypsum board and their preparation method and the use of ascorbic acid as an anti-sagging additive in a gypsum board. Said gypsum board comprises set gypsum prepared from the composition; while said composition comprises hemi-hydrate gypsum, water and a compound comprising | 2015-01-08 |
20150011139 | ELECTROSPINNING OF PTFE WITH HIGH VISCOSITY MATERIALS - An improved process for forming a PTFE mat is described. The process includes providing a dispersion with PTFE, a fiberizing polymer and a solvent wherein said dispersion has a viscosity of at least 50,000 cP. An apparatus is provided which comprises a charge source and a target a distance from the charge source. A voltage source is provided which creates a first charge at the charge source and an opposing charge at the target. The dispersion is electrostatically charged by contact with the charge source. The electrostatically charged dispersion is collected on the target to form a mat precursor which is heated to remove the solvent and the fiberizing polymer thereby forming the PTFE mat. | 2015-01-08 |
20150011140 | POST-BREAST SURGERY BRASSIERE AND PROFILE-CORRECTING INSERT - A brassiere for women who have undergone a single or double mastectomy with breast reconstruction and a profile-correcting insert that is either sewn directly into the brassiere or can be worn separately with other conventional brassiere and garments. The brassiere provides a natural, conical-shaped breast profile. The brassiere further provides elastic gathering at the upper-side region or around the bottom-half of the support cup, side-seam in close proximity to the cups, the option of elimination of any underwire within the support cup, and a wider elastic band underneath the cup(s) along the front of the wearer's rib-cage. Additionally, the profile-correcting insert can be affixed to other conventional brassieres or garments and the brassiere can be incorporated into other garments. | 2015-01-08 |
20150011141 | SHAPEWEAR - A shapewear garment made from a double face fabric having an inner face that comprises a cotton layer that does not have a gusset in the crotch portion of the garment. A shapewear garment having adjustable bodice cups having draw strings that gather the bodice cups along a vertically-extending seam in the garment. The fabric of the bodice cups has a folded upper edge defining a neckline without a seam. A shaperwear garment or other garment made using a high tension, flexible thin seam for seaming two adjacent stretchable fabrics along abutting edges, and having an adhesive film bonded across the abutting edges and a pattern of stitching through the adhesive film and the adjacent, abutted stretchable fabrics. | 2015-01-08 |
20150011142 | DOUBLE-SIDE DRESSER - The present disclosure relates to an apparatus and to a method for dressing generating grinding tools or profile grinding tools for the gear cutting processing of toothed workpieces using at least two disk-shaped dressing tools with which one or more tool regions and/or profile regions of the tool are provided with a defined dressing geometry. | 2015-01-08 |
20150011143 | TOOL REST WITH ANGLE INDICATOR FOR USE WITH BENCH GRINDER - A bench grinder has a tool rest mounted on a bracket and disposed adjacent a grinding wheel of the grinder. The tool rest has a tool rest platform that is connected to the bracket by a pivot connection and that may be secured in different angular positions by a bolt, such as a hand bolt. The bracket end to which the platform is affixed is provided with a cylindrical surface portion marked with angle marks. An opening is provided in the tool rest platform through which the angle marked surface is visible. An indicator line on the tool rest platform aligns to the angle mark to indicate the angle of the platform. | 2015-01-08 |
20150011144 | MULTI-FUNCTION MEAT TENDERIZING MALLET - A multi-function meat tenderizing mallet includes a head including a faceplate having a face surface elastically supported by at least one spring, movably mounted on at least one bolt; a shaft attached to the head; and a top plate positioned opposite the faceplate and attached to the shaft via mounting bolts. The faceplate is movably mounted in relation to a set of chopping blades attached to one another by means of at least one mounting bolt. In a rest position the edges of said chopping blades are retracted in the slots of the faceplate. | 2015-01-08 |
20150011145 | COIN PROCESSING DEVICE - A coin processing device includes a rotating member that has an annular rib provided annularly along a circumferential direction on the outer peripheral portion, which transports a coin upon a transport path using a cutout portion formed upon a lower portion of the annular rib. An open position intersects the annular rib. An opening and closing member, when positioned at the open position, is positioned adjacent to the annular rib in a radial direction of the rotating member so as to allow rotation of the rotating member. | 2015-01-08 |
20150011146 | INTEGRATED DUCT STEP GARNISH ASSEMBLY - An integrated duct step garnish assembly for a vehicle includes a deck member defining a stepping area on an upper side thereof and an underside member secured to an underside of the deck member for defining an air duct between the underside member and the deck member. The air duct extends along a longitudinal length of the deck member and the underside member for delivering conditioned airflow to a rear of the vehicle. | 2015-01-08 |
20150011147 | INFLATABLE VENTILATION LIFE CURTAIN - An inflatable ventilation curtain includes a curtain portion and an inflatable portion provided around a perimeter of the curtain portion. The inflatable portion includes an inner layer and an outer layer attached together, wherein the inner layer is provided immediately adjacent to the perimeter of the curtain portion and wherein the outer layer is provided around at least a part of an outer perimeter of the inner layer, thereby providing two distinct inflatable areas. | 2015-01-08 |
20150011148 | ARRANGEMENT FOR PROVIDING AIR TO A ROOM - The invention relates to an arrangement for providing air to a room is provided. The arrangement comprises a first inlet for taking in air from the room, a first outlet for providing air to the room, a second inlet for taking in air from a space other than the room, the second inlet being connected to the first outlet and a second outlet for exhausting air to the space other than the room; the second outlet being connected to the first inlet. The arrangement further comprises a cooling duct connecting the first inlet and the first outlet, the cooling duct having a cooling module disposed therein for cooling air in the duct and a first flow control module for controlling a first airflow ratio between an exhaust airflow flowing from the first inlet to the second outlet and a cooling airflow from the first inlet to the first outlet. | 2015-01-08 |
20150011149 | PORTABLE ELECTRONIC MODULE AND HEAT DISSIPATING MECHANISM THEREOF - A portable electronic module includes a casing having an air inlet, a heat generating member disposed in the casing, and a heat dissipating mechanism. The heat dissipating mechanism includes a fixing frame disposed at the casing corresponding to the air inlet, a driving handle, a driving device for driving the driving handle to move reciprocally, and a plurality of fans. The driving handle is disposed at a side of the fixing frame and has a plurality of holes arranged alternately. The fans are pivotally connected to the fixing frame in an alternate arrangement so as to swing relative to the fixing frame. Each fan has a protruding pillar extending toward the corresponding hole. Each protruding pillar is movably disposed through the corresponding hole, so that each fan could swing with reciprocation of the driving handle to guide airflow to pass through the air inlet to the heat generating member. | 2015-01-08 |
20150011150 | Air Distribution Units for Telecommunication Equipment - Novel tools and techniques are provided for providing in-lineup passive air distribution system designs, and for delivering more effective cooling for termination dense network equipment with high heat dissipation. In some embodiments, one or more air distribution units might be positioned in-line with one or more heat generating equipment. The one or more air distribution units might receive air from an HVAC system, and might distribute the received air to the one or more heat generating equipment. In some cases, the one or more air distribution units might distribute the received air to a position in front of and/or behind the one or more heat generating equipment for intake by an air intake device of at least one of the one or more heat generating equipment. Some air distribution units might comprise dowels for storing fiber slack. Some dowels might comprise an air shaft for distributing the received air. | 2015-01-08 |
20150011151 | FIELD ACCESS STATION - A field access station for housing and protecting an electronic display system in a sealed compartment in a first configuration and in a positively-pressurized compartment having a controlled outflow flow of filtered air in a second configuration. | 2015-01-08 |
20150011152 | DATA CENTER - A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum. | 2015-01-08 |
20150011153 | VENTILATION DEVICE FOR CLEAN ROOM APPLICATIONS - A ventilation device for supplying air to a clean room having a passage duct ( | 2015-01-08 |
20150011154 | METHOD AND SYSTEM FOR CONTROLLING VENTILATION IN A BUILDING - A method and a system for controlling ventilation of an indoor area of a building, comprising the steps of: ventilating the indoor area by means of mechanical ventilation and natural ventilation according to a ventilation mode selected among a plurality of ventilation modes, a set of adjustable control parameters ( | 2015-01-08 |
20150011155 | Air Deflector Driving device and Indoor Air-Conditioning Unit Using Driving device - Disclosed is an air deflector driving device, comprising a driving case and connecting rod ( | 2015-01-08 |
20150011156 | RADIO COMMUNICATION DEVICES AND METHODS THEREOF - A method, non-transitory computer readable medium, and apparatus for identifying content from one or more radio frequency signals. One or more radio frequency signals are monitored for available content. The one or more radio frequency signals with available content are processed to obtain audio or data associated with the one or more radio frequency signals. The obtained audio or data is analyzed. The radio frequency signals are categorized based on the analyzed audio or data. One or more items of information related to the radio frequency signals are identified. The one or more items of categorizing information are stored. | 2015-01-08 |
20150011157 | MULTI-AMPLIFIER BOOSTER FOR A WIRELESS COMMUNICATION SYSTEM - A multi-amplifier system includes a remote amplifier located near one or both system antennas. Locating the remote amplifier closer to the antenna improves the system performance while meeting regulatory limitations. The base unit may also have multiple remote antenna ports on one or both sides of the base unit allowing multiple remote antennas to be connected on that side of the base unit. A signal splitter with multiple antenna ports allows multiple remote antennas to be connected on the same side of the base unit. A remote amplifier located near each remote antenna removes the associated signal propagation losses from the regulated system performance. The base unit includes an amplifier detector for each remote antenna port to determine which output ports are connected to remote amplifiers. An automatic gain adjustment unit maintains the system gain, typically at the regulatory gain limit, based on the detected system configuration. | 2015-01-08 |
20150011158 | APPARATUS, METHOD, AND COMPUTER PROGRAM FOR A MOBILE RELAY STATION TRANSCEIVER, SYSTEM, AND MEANS FOR MASS TRANSPORTATION - Embodiments provide an apparatus, a method, and a computer program for a mobile relay station transceiver. Embodiments may further provide a system and means for mass transportation. An apparatus ( | 2015-01-08 |
20150011159 | SYSTEM FOR DUAL FREQUENCY RANGE MOBILE TWO-WAY SATELLITE COMMUNICATIONS - A microwave antenna terminal for two-way, in-motion communication systems using geostationary or other orbit satellites, and capable of supporting two-way communication in two different frequency ranges, for example Ku and Ka frequency ranges, is provided. | 2015-01-08 |
20150011160 | DOCKING STATION CONNECTIVITY MONITOR/CONTROLLER - A docking station apparatus and method provides wireless power and wireless communications to a mobile device, and provides or establishes connections to one or more external devices such as monitors, keyboards, mice, printers, and networks. In response to detection of the presence of the mobile device, the docking station is enabled to transfer wireless power to the mobile device and communicate wirelessly with the mobile device. The docking station also provides or establishes connections to external devices in response to one or more connectivity assignments. | 2015-01-08 |
20150011161 | NEAR FIELD COMMUNICATION ENABLED DEVICE WITH IMPROVED ELECTROMAGNETIC COMPATIBILITY AND A METHOD OF LOAD MODULATING IN NEAR FIELD COMMUNICATION - A near field communication (NFC) initiator communicates with a target device. The carrier is modulated to transmit a digital signal. During time slots allocated for target communication, the field is load modulated by the target. The target load modulator is driven by a digital modulator to vary voltage at antenna terminals so that peak amplitude of the carrier varies for specified periods between high and low values. To alleviate interference in the target device caused by the generation of aliases during transition, the load modulator sequentially applies a range of resistances to vary the amplitude (voltage) during transition according to a specific waveform determined by the infinite impulse response of a low pass filter tuned to the cut of frequency and sampling frequency determined according to the coexistence and cohabitation specifications of a chip in which the NFC functionality is embedded. | 2015-01-08 |
20150011162 | SECURE COMMUNICATIONS VIA NFC DEVICE - A system, method, and apparatus for negotiating a communication link between first and second near field communication (NFC) devices is disclosed. A third NFC device is placed in close proximity with a first host device operatively containing the first NFC device to determine communication information including at least one of a communication mechanism and a data transfer protocol usable by the first host device. The communication information usable by the first host device is stored in a portable device operatively containing the third NFC device. The third NFC device is momentarily placed in close proximity with the second NFC device. The stored communication information of the first host device is transferred from the portable device to a second host device operatively containing the second NFC device. A communication link is established between the first and second host devices to enable the first and second host devices to transfer data between them as a function of the determined communication information. | 2015-01-08 |
20150011163 | Apparatus and Method Using Radio Station Mapping - An apparatus including a receiver configured to receive wireless radio station broadcast signals; and a controller including at least one processor, and at least one memory including computer code. The controller is configured with use of the computer code to change a reception frequency of the receiver from a first broadcast radio station transmitting on a first frequency to a second broadcast radio station transmitting on a second different frequency based, at least partially, on location of the apparatus relative to coverage areas of the broadcast radio stations, and at least one substantially common entertainment content attribute of the signals from the first and second broadcast radio stations. | 2015-01-08 |
20150011164 | WIRELESS CONTROL SYSTEM AND WIRELESS NETWORK EXPANSION METHOD APPLIED THERETO - A wireless control system and a wireless network expansion method applied thereto are provided. The wireless control system comprises a mobile platform and a plurality of wireless devices capable of switching between a first role and a second role. The wireless network expansion method comprises following steps. A mobile platform is turned on. The mobile platforms scans the wireless devices and links to any wireless device serving the first role and then sends a control command to corresponding wireless device, which accordingly broadcasts the control command. The control command is received by at least one wireless device serving the second role. The wireless devices cyclically switch between the first role and the second role to continuously broadcast the control command to other wireless devices serving the second role, so that all of the wireless devices can finally receive the control command from the mobile platform. | 2015-01-08 |
20150011165 | PORTABLE INFORMATION TERMINAL DEVICE HOLDER AND CONTROLLER FOR PORTABLE INFORMATION TERMINAL DEVICE - The Invention is a supporting holder for portable information terminal device and controller for installation of information terminal device without the limitation of size, which is compact and easily portable. The holder of this invention has the Holder ( | 2015-01-08 |
20150011166 | INFORMATION-GATHERING DEVICE - [Problem] To provide a user-friendly information-gathering device enabling users to select buttons easily. | 2015-01-08 |
20150011167 | METHOD AND DEVICE FOR DETERMINING TRANSMISSION POWER - The present invention provides methods and devices for determining a transmission power and relates to the field of communication technologies. A method includes receiving, by a power determining device, capacity information of a first cell sent by a serving base station of the first cell and determining a transmission power used by a serving base station of the second cell on the specific resource of the second cell according to the capacity information of the first cell. The aforementioned method allows the capacity of the first cell to be guaranteed. | 2015-01-08 |
20150011168 | INTEGRATED CIRCULATOR FOR PHASED ARRAYS - A circulator/isolator assembly to operate within a first frequency range is disclosed. The assembly includes a first magnetic substrate having a first surface and a second surface and a first ground plane formed on the first surface, a dielectric layer disposed adjacent the first magnetic substrate, the dielectric layer comprising a multi-port junction circuit disposed on a first side of the dielectric layer and dimensioned to be resonant within the first frequency range, the multi-port junction circuit comprising a conductive disk coupled to a plurality of RF transmission traces, a first RF transmission trace forming an input port and a second RF transmission trace forming an output port, a ground plane disposed on a second side of the dielectric layer, and a first magnetic cylinder disposed proximate the multi-port junction circuit of the dielectric layer. | 2015-01-08 |
20150011169 | SYSTEM AND METHOD FOR HIGH-SENSITIVITY SENSOR - A sensor unit that includes at least one sensor configured to measure an ambient condition is described. The controller can be configured to receive instructions, to report a notice level when the controller determines that data measured by the at least one sensor fails a report threshold test corresponding to a report threshold value. The controller can also be configured to obtain a plurality of calibration measurements from the at least one sensor during a calibration period and to adjust the threshold based on the calibration measurements. The controller can be configured to compute a first threshold level corresponding to background noise and a second threshold level corresponding to sensor noise, and to compute the report threshold value from the second threshold. In one embodiment, the sensor unit adjusts one or more of the thresholds based on ambient temperature. | 2015-01-08 |
20150011170 | APPARATUS AND METHODS OF ACCESSING ALL CHANNELS OF A SUPERHETERODYNE RECEIVER SIMULTANEOUSLY - An apparatus and method associated with exploiting a characteristic in super-heterodyne receivers such that a modulated signal will be received on all channels simultaneously regardless of the channel selected on the receiver. | 2015-01-08 |
20150011171 | Electronic circuit arrangement for receiving low frequency electromagnetic waves with an adjustable attenuator element - An electronic circuit arrangement for receiving low-frequency electromagnetic waves is proposed, having an inductor (L) acting as an antenna for generating a received signal, having a first receiver ( | 2015-01-08 |
20150011172 | METHODS AND APPARATUS FOR ADAPTIVE NONLINEAR COINCIDENT INTERFERENCE CANCELLATION - Methods and apparatus to cancel an interfering signal using an analog cancellation stage followed by a digital cancellation stage. In an exemplary embodiment, the interfering signal is processed to determine modulation type for removal in the analog domain. The digital stage provides further interference reduction in the digital domain. | 2015-01-08 |