02nd week of 2015 patent applcation highlights part 13 |
Patent application number | Title | Published |
20150008573 | Bonded Body and Semiconductor Module - Bondability and heat conductivity of a bonded body in which some of metal, ceramic, or semiconductor are bonded to each other are improved. In the bonded body in which a first member and a second member each comprise one of metal, ceramic, or semiconductor are bonded to each other, the second member is bonded to the first member by way of an adhesive member disposed to the surface of the first member, and the adhesive member contains a V | 2015-01-08 |
20150008574 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes an insulating substrate; a semiconductor element mounted on the insulating substrate; and a cooler cooling the semiconductor element. The cooler includes a heat radiating substrate bonded to the insulating substrate; a plurality of fins provided on a surface opposite to a surface bonded with the insulating substrate of the heat radiating substrate; and a case accommodating the fins, and including an inlet and an outlet for a coolant. Upper end portions of side walls of the case include cutaways to arrange end portions of the heat radiating substrate. The heat radiating substrate is liquid-tightly bonded to the case. | 2015-01-08 |
20150008575 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A surface mounting semiconductor component includes a semiconductor device, a circuit board, a number of first solder bumps, and a number of second solder bumps. The semiconductor device included a number of die pads. The circuit board includes a number of contact pads. The first solder bumps are configured to bond the semiconductor device and the circuit board. Each of the first solder bumps connects at least two die pads with a corresponding contact pad. Each of the second solder bumps connects a die pad with a corresponding contact pad. A method of forming a surface mounting component or a chip scale package assembly wherein the component or assembly has at least two different types of solder bumps. | 2015-01-08 |
20150008576 | WAFER-LEVEL CHIP-SCALE PACKAGE DEVICE HAVING BUMP ASSEMBLIES CONFIGURED TO FURNISH SHOCK ABSORBER FUNCTIONALITY - Semiconductor devices are described that have bump assemblies configured to furnish shock absorber functionality. In an implementation, a wafer-levelchip-scale package devices include an integrated circuit chip having an array of bump assemblies disposed over the integrated circuit chip. The array of bump assemblies comprises a plurality of first bump assemblies that include solder bumps composed at least substantially of a solder composition (i.e., solder bumps that do not include a core). The array further comprises a plurality of second bump assemblies that includes a solder bump having a core configured to furnish shock absorber functionality to the integrated circuit chip. | 2015-01-08 |
20150008577 | METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING DEVICES - A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure. | 2015-01-08 |
20150008578 | DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DEFINED PADS - Package substrates enabling reduced bump pitches and package assemblies thereof. Surface-level metal features are embedded in a surface-level dielectric layer with surface finish protruding from a top surface of the surface-level dielectric for assembly, without solder resist, to an IC chip having soldered connection points. Package substrates are fabricated to enable multiple levels of trace routing with each trace routing level capable of reduced minimum trace width and spacing. | 2015-01-08 |
20150008579 | SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC INSULATING FILM AND MANUFACTURING METHOD OF THE SAME - A semiconductor device includes a semiconductor substrate on which a structure portion is provided except a peripheral portion thereof, and has a laminated structure including low dielectric films and wiring lines, the low dielectric films having a relative dielectric constant of 3.0 or lower and a glass transition temperature of 400° C. or higher. An insulating film is formed on the structure portion. A connection pad portion is arranged on the insulating film and connected to an uppermost wiring line of the laminated structure portion. A bump electrode is provided on the connection pad portion. A sealing film made of an organic resin is provided on a part of the insulating film which surrounds the bump electrode. Side surfaces of the laminated structure portion are covered with the insulating film and/or the sealing film. | 2015-01-08 |
20150008580 | STACKED PACKAGE AND METHOD FOR MANUFACTURING THE SAME - The disclosure relates to a stacked package and a method for manufacturing the same. The stacked package includes: a lower package including a substrate formed with ball lands in a periphery of an upper surface thereof, a semiconductor chip mounted over the upper surface, first solder balls formed over the ball lands and each having a side surface cut along an edge of the substrate and a polished upper surface, and a mold part for molding the upper surface including the semiconductor chip and the first solder balls, the cutted side surfaces and polished upper surfaces being exposed by the mold part; and an upper package stacked over the lower package and provided with second solder balls bonded to the first solder balls. | 2015-01-08 |
20150008581 | Package-on-Package Process for Applying Molding Compound - A method of packaging includes placing a package component over a release film, wherein solder regions on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder regions remain in physical contact with the release film. | 2015-01-08 |
20150008582 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a transistor formed on a semiconductor chip, a lower-layer wiring connected to a diffusion layer of the transistor, and drawn outside the diffusion layer, and an upper-layer wiring drawn out from a pad electrode formed on the semiconductor chip, connected to the lower-layer wiring, and having resistivity lower than that of the lower-layer wiring. | 2015-01-08 |
20150008583 | Method and Structure of Packaging Semiconductor Devices - A method for fabricating packaged semiconductor devices; attaching a batch-sized metallic grid with openings onto an adhesive tape having an insulating clear core covered by a layer of UV-releasable adhesive, the openings sized larger than a semiconductor chip; attaching a semiconductor chip onto the tape of each window, the chip terminals facing the adhesive surface; laminating insulating material of low coefficient of thermal expansion to fill gaps between each chip and respective grid; turning over assembly to place a carrier under backside of chips and lamination and to remove the tape; plasma-cleaning the assembly front side and sputtering uniform at least one metal layer across the assembly; optionally plating metal layers; and patterning the metal layers to form rerouting traces and extended contact pads for assembly. | 2015-01-08 |
20150008584 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a plurality of wires arranged in parallel at a predetermined pitch, a plurality of first contacts that are each connected to an odd-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to a wiring direction of the wires, and a plurality of second contacts that are each connected to an even-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to the wiring direction of the wires in such a way as to be offset from the first contacts in the wiring direction of the wires, in which the first contacts are offset from the second contacts by a pitch of the wires in an orthogonal direction with respect to the wiring direction of the wires. | 2015-01-08 |
20150008585 | MULTIPLE-PATTERNED SEMICONDUCTOR DEVICE - A multiple-patterned semiconductor device and a method of manufacture are provided. The semiconductor device includes a conductive layer. The conductive layer includes conductive tracks which may be defined by photomasks. The conductive tracks may have quality characteristics. Distinct quality characteristics of distinct conductive tracks may be compared. Based on the comparison, signals and supply voltage may be routed on particular conductive tracks. | 2015-01-08 |
20150008586 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor structure includes a molding compound, a conductive plug, and a cover. The conductive plug is in the molding compound. The cover is over a top meeting joint between the conductive plug and the molding compound. The semiconductor structure further has a dielectric. The dielectric is on the cover and the molding compound. | 2015-01-08 |
20150008587 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A fan-out package includes a molding compound, a conductive plug and a stress buffer. The conductive plug is in the molding compound. The stress buffer is between the conductive plug and the molding compound. The stress buffer has a coefficient of thermal expansion (CTE). The CTE of the stress buffer is between a CTE of the molding compound and a CTE of the conductive plug. A method of manufacturing a three dimensional includes plating a post on a substrate, and disposing a stress buffer on the sidewall of the post. The method further includes surrounding the stress buffer with a molding compound. | 2015-01-08 |
20150008588 | SEMICONDUCTOR CHIP AND STACKED TYPE SEMICONDUCTOR PACKAGE HAVING THE SAME - The disclosure relates to a semiconductor chip and a stacked type semiconductor package having the same. The semiconductor chip includes: a semiconductor chip body having a first surface formed with a plurality of bonding pads and a second surface which is opposite to the first surface, a plurality of first and second through electrodes that pass through the semiconductor chip body and one ends thereof are electrically connected to the bonding pads, an insulating layer formed over the second surface of the semiconductor chip body such that the other ends of the first and second through electrodes are not covered by the insulating layer, and a first heat spreading layer formed over the insulating layer. | 2015-01-08 |
20150008589 | METHOD OF FORMING STACKED-LAYER WIRING, STACKED-LAYER WIRING, AND ELECTRONIC ELEMENT - A method of forming a stacked-layer wiring includes forming first wettability variable layer on a substrate using material that changes surface energy by energy application; forming first conductive layer in or on the first wettability variable layer; forming second wettability variable layer on the first wettability variable layer using material that changes surface energy by energy application; forming concave portion to become wiring pattern of second conductive layer to the second wettability variable layer while concurrently forming high surface energy area on surface exposed by forming the concave portion by changing surface energy; forming via hole by exposing a part of the first conductive layer while concurrently forming high surface energy area on surface exposed by forming the via hole by changing surface energy; and applying conductive ink to the high surface energy area to form the second conductive layer and via simultaneously. | 2015-01-08 |
20150008590 | SEMICONDUCTOR DEVICE - To reinforce power supply wirings without sacrificing the interconnectivity of semiconductor devices. When three wirings are formed in parallel in the same wiring layer and the center wiring among them is shorter than the outer wirings, a projecting portion integrated into the outer wiring is formed utilizing a free space remaining on the extension of the center wiring. For example, when the outer wirings are used as power supply wirings, the power supply wirings can be reinforced by adding the projecting portion. At this time, because the projecting portion is arranged in the free space, the interconnectivity is not sacrificed. | 2015-01-08 |
20150008591 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - Disclosed herein is a semiconductor device including: a substrate having a first conductive layer and a second conductive layer arranged deeper than the first conductive layer; a large-diameter concave portion having, on a main side of a substrate, an opening sized to overlap the first and second conductive layers, with the first conductive layer exposed in part of the bottom of the large-diameter concave portion; a small-diameter concave portion extended from the large-diameter concave portion and formed by digging into the bottom of the large-diameter concave portion, with the second conductive layer exposed at the bottom of the small-diameter concave portion; and a conductive member provided in a connection hole made up of the large- and small-diameter concave portions to connect the first and second conductive layers. | 2015-01-08 |
20150008592 | Method for Carbon Nanofiber Alignment Using Magnetic Nanoparticles - The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The chip stack further includes a thermal interface material pad between the first chip and the second chip. The thermal interface material pad comprises a plurality of nanotubes containing a magnetic material, aligned parallel to mating surfaces of the first chip and the second chip, wherein a hydrophobic tail of oleic acid is wrapped around each one of the plurality of nanotubes and a hydrophilic acid head of the oleic acid is attached to the magnetic material. | 2015-01-08 |
20150008593 | STACKED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor device includes a first substrate and a second substrate. The first electrode is connected to the second electrode so that the first surface faces the second surface. A tip portion of the first wall section that faces the second substrate is connected to a tip portion of the second wall section that faces the first substrate. The first wall section is connected to the second wall section over an entire circumference. An outside space that is formed in an outside of the first wall section and an outside of the second wall section between the first substrate and the second substrate is filled with a sealing member over the entire circumference. | 2015-01-08 |
20150008594 | SEMICONDUCTOR PACKAGES - A semiconductor package may include a first substrate, a second substrate facing the first substrate, a plurality of first electrical connections disposed between the first substrate and the second substrate, and a first material disposed between the first substrate and the second substrate. The plurality of first electrical connections may electrically couple the first substrate and the second substrate to each other. The first material may surround each of the plurality of first electrical connections, and a width of the first material proximal the first substrate may be smaller than a width of the first material proximal the second substrate. | 2015-01-08 |
20150008595 | SEMICONDUCTOR DEVICE WITH PRE-MOLDING CHIP BONDING - This disclosure relates generally to a semiconductor device and method of making the semiconductor device by pressing an electrical contact of a chip into a bonding layer on a carrier. The bonding layer is cured and coupled, at least in part, to the electrical contact. A molding layer is applied in contact with the chip and a first major surface of the bonding layer. Distribution circuitry is coupled to the electrical contact. | 2015-01-08 |
20150008596 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a substrate; first and second pads disposed adjacent to each other on the substrate; an electrically conductive tape adhered to the first and second pads and having a through hole at an inner portion of the first pad; an electrically conductive adhesive in the through hole and having a thermal conductivity higher than the thermal conductivity of the electrically conductive tape; a semiconductor chip mounted on the first pad via the electrically conductive adhesive; and an electronic component part mounted on the second pad via the electrically conductive tape. | 2015-01-08 |
20150008597 | Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation - A semiconductor wafer contains a plurality of semiconductor die separated by a saw street. An insulating layer is formed over the semiconductor wafer. A protective layer is formed over the insulating layer including an edge of the semiconductor die along the saw street. The protective layer covers an entire surface of the semiconductor wafer. Alternatively, an opening is formed in the protective layer over the saw street. The insulating layer has a non-planar surface and the protective layer has a planar surface. The semiconductor wafer is singulated through the protective layer and saw street to separate the semiconductor die while protecting the edge of the semiconductor die. Leading with the protective layer, the semiconductor die is mounted to a carrier. An encapsulant is deposited over the semiconductor die and carrier. The carrier and protective layer are removed. A build-up interconnect structure is formed over the semiconductor die and encapsulant. | 2015-01-08 |
20150008598 | ALIGNMENT MARK, PHOTOMASK, AND METHOD FOR FORMING ALIGNMENT MARK - According to one embodiment, an alignment mark provided on an underlayer includes a plurality of first guide pattern features, and a first self-assembled film. The first guide pattern features extend in a first direction and are aligned in a second direction crossing the first direction. The first self-assembled film is provided between adjacent ones of the first guide pattern features and includes a plurality of first line pattern features and a second line pattern feature. The first line pattern features extends in the first direction, is aligned in the second direction, and has a pitch in the second direction narrower than a pitch in the second direction of the first guide pattern features. The second line pattern feature is provided between adjacent ones of the first line pattern features and extends in the first direction. | 2015-01-08 |
20150008599 | Waterfall decorative humidifier - A waterfall decorative humidifier, including mainly a housing, a water exit on top of the housing, a water sub-receptacle in the lower portion of the housing, a water pump in the water sub-receptacle, and a fan in the housing; in which the water pump is connected with the water exit through a water pipe, and in which the housing is generally of the shape of a waterfall; wherein at least one shaft is provided on the housing, and a decoration is connected to the shaft directly or through a mechanism. | 2015-01-08 |
20150008600 | FLUID AERATOR - A fluid aerator connectable to the neck of a container holding a fluid, the fluid aerator having a tubular body having one end adapted to sealingly connect to the neck of the container, a plurality of mixing elements disposed within the tubular body, and wherein when the fluid aerator is attached to the neck of the container and fluid is dispensed from the container, ambient air is drawn into the tubular body and mixes with fluid as it passes over the plurality of mixing elements to aerate the fluid. | 2015-01-08 |
20150008601 | RETARDATION PLATE MANUFACTURING METHOD - A retardation plate manufacturing method for manufacturing a retardation plate that has an orientation pattern in which is formed a plurality of regions having optical axes oriented in different directions from each other, the retardation plate manufacturing method comprising arranging an unoriented light orientation layer that is to be oriented by light on a first surface of a substrate; preparing a retardation mask including an orientation pattern in which is formed a plurality of regions that have a quarter wavelength retardation plate retardation function and correspond to the plurality of regions in the orientation pattern of the retardation plate; and orienting the light orientation layer by irradiating the retardation mask with elliptically polarized light and irradiating the light orientation layer with polarized light emitted form the retardation mask. | 2015-01-08 |
20150008602 | Method for Preparing Fibrous Polymeric Adsorption Material - A method of preparing a fibrous polymeric adsorption material includes preparing a linear polymer yarn from a linear polymer via melt-blow spinning, the linear polymer having a molecular weight of 15,000 to 20,000 g/mol; treating the linear polymer yarn with a crosslinking agent and a porogen agent; and heating the treated linear polymer yarn at 130 to 150° C. for 25 to 35 seconds to obtain the fibrous polymeric adsorption material. The fibrous polymeric adsorption material includes fibers with a diameter of 4 to 6 microns. The crosslinking agent is in an amount of 1 to 3 weight % of the linear polymer. The crosslinking agent is a diacrylate ester compound having Formula J1, J2 or J3. The porogen agent is in an amount of about 1 weight % of the fibrous polymeric adsorption material. | 2015-01-08 |
20150008603 | De-warping Appliance for Vinyl Records - The present invention relates to an improved device and method for de-warping a warped vinyl record so that it may be played and enjoyed. | 2015-01-08 |
20150008604 | METHOD FOR ADJUSTING SIDEWALL UNIT AND SIDEWALL UNIT - A method for adjusting a sidewall unit ( | 2015-01-08 |
20150008605 | PATTERN FORMATION METHOD, LITHOGRAPHY APPARATUS, LITHOGRAPHY SYSTEM, AND ARTICLE MANUFACTURING METHOD - A pattern forming method includes: a first step of forming a first pattern to define a first shot arrangement; and a second step of performing an imprint process, thereby forming a second pattern on the imprint material on the first pattern and defining a second shot arrangement. In the second step, the second shot arrangement is defined so as to reduce an overlay error between the first and second shot arrangements by deforming the mold. In the first step, based on information of the estimated second shot arrangement definable on the substrate when the second step is performed after the second pattern formed on the mold is amended by deforming the mold, the first pattern is formed to make an overlay error between the first and second shot arrangements fall within an allowable range. | 2015-01-08 |
20150008606 | METHOD, APPARATUS AND HOLLOW CORE FORMING MEMBER FOR CASTING CONCRETE PRODUCTS BY SLIPFORM CASTING - A method for casting a hollow core concrete product with a substantially horizontal slipform casting process, where concrete mass is fed at least in one feeding stage through a limited cross-section ( | 2015-01-08 |
20150008607 | METHOD FOR PRODUCING SKIN-COVERED POLYOLEFIN RESIN FOAMED MOLDED ARTICLE - A method for producing a skin-covered polyolefin-based resin foamed molded article, including blow-molding a polyolefin parison into a skin defining a hollow space; and placing multi-layered polyolefin expanded beads in the hollow space; and heating the expanded beads placed in the hollow space to fuse-bond the expanded beads together and to fuse-bond the expanded beads to the skin, wherein the expanded beads have specific apparent density, specific average diameter, specific endothermic peaks in their DSC curve and specific melting point characteristics. | 2015-01-08 |
20150008608 | INJECTION MOLDING APPARATUS AND METHOD OF MAKING FOAMED INJECTION MOLDED PRODUCT - A method and apparatus for injection molding a foamed product. A short shot of formable resin is injected into a cavity ( | 2015-01-08 |
20150008609 | DEPOSITING DEVICE - The invention is a depositing device for depositing flowable food containing gas comprising a pressurized feed N line conveying flowable food containing gas under pressure into the food; piston means operatively connected to the feed line comprising a piston and a chamber; an outlet to deliver food at the atmospheric pressure into moulds. The device comprises a pressure retaining means arranged to retain the product in the chamber at the same pressure as the line pressure and to deliver the product through the outlet as pressure in the chamber increases from the line pressure upon descent of the piston in the chamber. | 2015-01-08 |
20150008610 | METHOD FOR APPLYING AN INSERT OF POLYMER MATERIAL ONTO A SUPPORT AND APPARATUS FOR IMPLEMENTING THIS METHOD - Method for applying an insert | 2015-01-08 |
20150008611 | METHOD AND APPARATUS FOR PRODUCTION OF AN OBLIQUELY STRETCHED LONG FILM - A method for producing obliquely stretched long film comprises an oblique stretching step and a folding step. In the oblique stretching step, a long film is stretched in the oblique direction with respect to the widthwise direction to create a stretched film (F). In the folding step, while conveying the stretched film (F) after stretching, the stretched film (F) is folded back at least once on the inner face thereof in a direction parallel or perpendicular to the stretching direction. | 2015-01-08 |
20150008612 | PRODUCTION METHOD OF REINFORCED HOSE - A brake hose | 2015-01-08 |
20150008613 | METHOD OF FABRICATING A PART OUT OF CMC MATERIAL - Fabricating a composite material part comprises the steps of making a consolidated fiber preform, the fibers of the preform being carbon or ceramic fibers that are coated in an interphase formed by at least one layer of pyrolytic carbon (PyC) or of boron-doped carbon (BC). Obtaining a partially densified consolidated fiber preform, where partial densification comprises forming a first matrix phase on the interphase, the first matrix phase comprising a plurality of layers of self-healing material alternating with one or more layers of PyC or of BC. Continuing densification by dispersing carbon and/or ceramic powder within the partially densified consolidated preform and by infiltrating molten silicon or a liquid composition formed for the most part of silicon. | 2015-01-08 |
20150008614 | METHOD OF MANUFACTURING A MULTI-LAYER GOLF BALL - A method of manufacturing a multi-layer golf ball includes injection molding a core from an ionomeric thermoplastic material such that the core has an outer surface that includes a plurality of protrusions extending radially outward from a spherical land portion, with each protrusion having a maximum height relative to the spherical land portion of between 0.15 mm and 2.0 mm. The core is then positioned between a first hemispherical shell and a diametrically opposed second hemispherical shell, which are each formed from a rubber material. The first and second hemispherical shells are then compression molded such that rubber material conforms to the outer surface of the core. The rubber material is then cured to form a unitary intermediate layer that surrounds the core. Finally, a cover layer is molded about the intermediate layer through one of injection molding and compression molding. | 2015-01-08 |
20150008615 | FRICTION MATERIAL COMPOSITION, FRICTION MATERIAL USING THE SAME, AND FRICTION MEMBER - Provided is a friction material composition comprising: a binder; a fibrous base material; an abrasive material; an inorganic filler; and an organic filler,
| 2015-01-08 |
20150008616 | MOLD AND MOLDING APPARATUS FOR EMBEDDING BIOLOGICAL SPECIMEN IN A BLOCK AND RELATED METHODS - A mold for producing a biological tissue embedded in a block of an embedding material is provided. The mold comprises a compartment having a compartment floor and a depression extending downwards from the compartment floor. A molding apparatus, comprising a mold and a press for pressing a sample sheet onto the compartment floor of the mold is provided. The press comprises a foot configured to enter at least partially into the compartment and press a sample tissue, at least partially into the depression. A method of embedding a biological tissue in an embedding material using a mold as described herein is provided. A cleaning device configured for removing excess embedding materials from the press of the molding apparatus is provided. | 2015-01-08 |
20150008617 | METHOD AND DEVICE FOR PRODUCING A THREE-DIMENSIONAL PREFORM FROM A FIBRE FABRIC AS PART OF PRODUCTION OF FIBRE-REINFORCED FORMED COMPONENTS - The invention relates to a method and a device for producing a three-dimensional preform ( | 2015-01-08 |
20150008618 | METHOD FOR FORMING CYLINDRICAL RUBBER MEMBER - A method for forming a cylindrical rubber member includes bringing a die | 2015-01-08 |
20150008619 | METHOD AND DEVICE FOR PRODUCING A THREE-DIMENSIONAL PREFORM FROM A LAID SCRIM IN THE COURSE OF PRODUCTION OF FIBER REINFORCED MOLDED PARTS - The invention relates to a method and a device for producing a three-dimensional preform ( | 2015-01-08 |
20150008620 | Solid Soap Fragment Melting Apparatus and Method - An apparatus and method for melting soap fragments to create a soap bar from the soap fragments. The apparatus includes various replaceable molds to create soap bars having various shapes. | 2015-01-08 |
20150008621 | METHOD OF PRODUCING PRESSED PAPER PIECE AND APPARATUS THEREFOR - The objective of the present invention is to provide a method of forming a pressed paper piece by deep drawing a sheet of blank that is primarily made of paper in use of a punch and a die, and a production apparatus for implementing the method, whereby no distinguishable wrinkles are formed in upright portions of the pressed paper piece. The method of producing a pressed paper piece according to the present invention, implemented when deep drawing a sheet-like blank that is primarily made of paper in use of a punch and a die, includes maintaining a predetermined gap between a first blank holder and the die in an outer peripheral region of a process portion of the blank and applying a pressure to a radially inner region thereof via a second blank holder, thereby reducing wrinkling by an effect of integrated functions exerted in both regions of the blank. | 2015-01-08 |
20150008622 | METHOD OF MAKING A CONCRETE BLOCK - Molds and processes that permit high-speed, mass production of retaining wall blocks having patterned or other processed front faces, as well as retaining wall blocks formed by such processes. The invention permits the front face of the block to be impressed with a pattern or otherwise directly processed, to allow the formation of pre-determined block front faces, while at the same time facilitating high-speed, high-volume production of blocks. A mirror image of the desired pattern can be created on a stripper shoe by selecting a desired three-dimensional surface from a naturally occurring or man made object and digitally scanning the selected three-dimensional pattern to create scanned data. The scanned data can then be used to machine a face of the stripper shoe that is the mirror image of the selected pattern. | 2015-01-08 |
20150008623 | METHOD AND MOULD SYSTEM FOR NET MOULDING OF A CO-CURED, INTEGRATED STRUCTURE - The present invention relates to a mould system and a method for net moulding of a co-cured integrated structure ( | 2015-01-08 |
20150008624 | Vacuum Bag Processing of Composite Parts Using a Conformable Vacuum Bag Assembly - A vacuum bag assembly is used to process the composite part. The vacuum bag assembly includes a stretchable vacuum bag attached to a stretchable breather. | 2015-01-08 |
20150008625 | METHOD OF PRODUCING HONEYCOMB STRUCTURED BODY, AND DIE FOR EXTRUSION MOLDING - In a method of producing a honeycomb structured body, a die for extrusion molding is provided to produce at least one honeycomb molded body. The die includes a die body having a raw material inlet side face and a molded body extrusion side face. The raw material inlet side face includes raw material supply holes for supplying a ceramic raw material. The molded body extrusion side face includes molding grooves for molding the ceramic raw material into a shape of the at least one honeycomb molded body. The raw material supply holes and the molding grooves communicate with one another through connecting parts provided between the raw material supply holes and the molding grooves. The connecting parts each include, in a cross section substantially parallel to an extruding direction of the ceramic raw material, a curved part and a straight part. | 2015-01-08 |
20150008626 | BLAST FURNACE - A blast furnace includes: a blast furnace body; raw material charging means for charging raw material into the blast furnace body; hot air blowing means for blowing hot air into the blast furnace body; a drying apparatus etc. for evaporating moisture in low-grade coal; a dry distillation apparatus etc. for carbonizing dried coal; a cooling apparatus etc. for cooling carbonized coal; a pulverization apparatus etc. for pulverizing the carbonized coal cooled by the cooling apparatus; a storage tank for storing powdered coal; a nitrogen gas supply source, a conveyor line and a cyclone separator etc. for conveying the powdered coal pulverized by the pulverization apparatus to the inside of the storage tank by generating a gas flow with the nitrogen gas; and an injection lance etc. for feeding the powdered coal inside the storage tank to hot air that is blown into the blast furnace body. | 2015-01-08 |
20150008627 | AXIAL CLUTCH ASSEMBLY AS WELL AS GAS SPRING AND GAS DAMPER ASSEMBLY AND METHOD INCLUDING SAME - A gas spring and gas damper assembly can include a gas spring and a gas damper. The gas spring can include a first end member, a second end member and a flexible wall that at least partially form a spring chamber. The gas damper can include first, second and third damper elements that are telescopically interconnected with one another. The first and third damper elements can be operatively connected to respective ones of the first and second end members. The third damper element includes damper piston having an axial clutch. The second damper element is suspended between the first and third damper elements by biasing elements that engaging the damper piston. | 2015-01-08 |
20150008628 | COMPENSATOR FOR UNBALANCED COMPRESSION FORCES FOR PRESS MACHINES - Described is a compensator ( | 2015-01-08 |
20150008629 | SPIRAL SPRING - A spiral spring for reducing maximum stress value and variations in stress distribution. The spiral spring is elastically deformable from a minimally to maximally deformed state. In maximally deformed state, the spiral spring includes a non-contact section, wherein at least some spring material portions are adjacent in radial direction not contacting each other, and a contact section, wherein all spring material portions are adjacent in radial direction contacting each other. An inner reference portion is corresponding to a central angle of 80° or more and 160° or less about a spiral center along a direction of spiral portion extension with a reference line connecting the spiral center and outer contact portion, wherein the outer end portion and outer fixing member contact in maximally deformed state, the inner reference portion being on a radially spiral portion inner side. The contact section is on a radially inner reference portion outer side. | 2015-01-08 |
20150008630 | BUSH | 2015-01-08 |
20150008631 | SPRING CLAMP - A spring clamp may include a main body, two clamping units, a plurality of positioning pins and a positioning unit, wherein a main body has two clamping arms pivotally connected together in a cross manner, and one end of each clamping arms has a handle and the positioning unit is disposed between the handles; the other end of each clamping arms has a socket that is not aligned with each other; and wherein each of the clamping units has a clamping piece connected with an extension bar that is inserted into the socket of the main body, so a clamp opening becomes adjustable through extension and retraction of the extension bar, and two positioning pins on the clamping arms are used to secure the extension bars, and the positioning pins located in an opposite direction to a direction of the pressure applied on the extension bar. | 2015-01-08 |
20150008632 | DEVICE FOR HOLDING WAFER SHAPED ARTICLES - A device for holding a wafer-shaped article comprises an annular chuck base body having a plurality of movable contact elements for securing a wafer-shaped article to the annular chuck base body, and a gear mechanism driving the contact elements in unison between a first position and a second position. The annular chuck base body comprises a housing formed from a material that is resistant to attack by strong inorganic acids. The annular chuck base body also comprises a reinforcing ring fitted within the housing and formed from a material whose coefficient of linear thermal expansion is substantially less than that of the housing material. | 2015-01-08 |
20150008633 | Holder For A Sheet Of Metal | 2015-01-08 |
20150008634 | ALIGNED PASTING OF A NEW ROLL OF SUBSTRATE TO AN EXPIRING ROLL OF SUBSTRATE IN A PRINTING PRESS - Systems and methods for aligning preprinted images on a roll of substrate to the moving components of a web press are disclosed. A method in accordance with one embodiment includes determining the speed of the moving components of the press, determining the speed of the web of preprinted images and adjusting the speed of the web of preprinted image to match the speed of the web. In particular embodiments, a press which produces rolls of preprinted material can be modified to change the equivalent cutoff length of the press. In further embodiments, a method of pasting new rolls of material to expiring rolls of material is accomplished by modulating the drive speed of the new roll of material to match the expiring roll of material while at the same time aligning the images on the new roll with the expiring roll. | 2015-01-08 |
20150008635 | SHEET PROCESSING APPARATUS AND IMAGE FORMING SYSTEM - A sheet processing apparatus including: an accumulating section on which a sheet is accumulated; a staple inserting section which is provided above the accumulating section; a staple receiving section which is provided so as to face the staple inserting section across a sheet bundle accumulated on the accumulating section; and a movement section which moves an inserting unit or the accumulating section according to a thickness of the sheet bundle so that the inserting unit faces a predetermined position on an upmost sheet of the sheet bundle, wherein the staple inserting section includes the inserting unit which inserts a staple into the sheet bundle by rotating toward the sheet bundle. | 2015-01-08 |
20150008636 | IMAGE FORMING APPARATUS - An image forming apparatus includes a first roller to come into contact with a first side of a recording medium and a second roller and a third roller to come into contact with a second side of the recording medium opposite the first side. Each of the first roller, the second roller, and the third roller includes a plurality of increased diameter portions and a plurality of decreased diameter portions alternately arranged in an axial direction of each of the first roller, the second roller, and the third roller to produce an uneven outer circumferential surface thereof. The increased diameter portions of the first roller overlap the increased diameter portions of each of the second roller and the third roller, respectively, with a clearance therebetween. | 2015-01-08 |
20150008637 | SHEET CONVEYING DEVICE AND IMAGE FORMING APPARATUS PROVIDED WITH THE SAME - A sheet conveying device includes: first, second and third rollers, a conveying member, a frame, a first pressing member, and a force-generating unit. The first and second rollers rotate while nipping the sheet therebetween. The third roller and the conveying member nip the sheet therebetween. The frame is elongated parallel to an axis about which the third roller rotates and supports the third roller. The first pressing member applies a first pressing force to an axial center of the first roller to press the first roller toward the second roller and applies a reaction force of the first pressing force to the frame to press the frame in a direction toward the conveying member. The force-generating unit generates a nipping force for nipping the sheet between the third roller and the conveying member and applies an urging force to the frame in a direction away from the conveying member. | 2015-01-08 |
20150008638 | SHEET FEEDING DEVICE, AND IMAGE READING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THIS - In a sheet feeding device, a feeding roller is driven and rotated to feed a sheet in a conveying direction of a sheet conveying path and a drive transmission mechanism transmits rotation drive force generated in a driving portion to the feeding roller. In this mechanism, a drive input gear having an inner space is arranged on a rotation axis supporting the feeding roller rotatably so as to rotate by the rotation drive force. A drive transmission gear arranged between the feeding roller and drive input gear on the rotation axis rotates and becomes slide-movable along the rotation axis between a first position transmitting the rotation drive force to the feeding roller and a second position cutting off the transmission of the rotation drive force to the feeding roller by the rotation drive force from the drive input gear to transmit the rotation drive force to the feeding roller. | 2015-01-08 |
20150008639 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveying apparatus includes a sheet conveying unit including a drive roller and a driven roller; a downstream detection unit and an upstream detection unit; a conveying amount measuring unit that measures a conveying amount of the sheet; and a conveying distance calculation unit that calculates a conveying distance of the sheet, wherein a distance between the downstream detection unit and the upstream detection unit or a perimeter of one of the drive roller and the driven roller is set such that an expected conveying distance calculated based on a set sheet length of an expected value of the sheet becomes a substantially integer multiple of a perimeter of the one of the drive roller and the driven roller. | 2015-01-08 |
20150008640 | SHEET THICKNESS DETECTOR, SHEET CONVEYOR INCORPORATING SAME, AND IMAGE FORMING APPARATUS INCORPORATING SAME - A sheet thickness detector incorporated in a sheet conveyor and/or an image forming apparatus includes multiple first rollers aligned in a direction perpendicular to a sheet conveying direction, multiple second rollers facing the respective first rollers, a first roller shaft supporting two first rollers, at least one second roller shaft supporting rollers other than the two first rollers, at least one third roller shaft to support at least three second rollers, a first roller shaft holder supporting the first roller shaft to move from the at least one third roller shaft in a contact/separation direction, a biasing member biasing the first roller shaft toward at least one third roller shaft, and a displacement amount detector detecting an amount of displacement of the first roller shaft. A thickness of a sheet between the first and second rollers is detected based on a detection result by the displacement amount detector. | 2015-01-08 |
20150008641 | POST-PROCESSING DEVICE - Provided is a post-processing device including a first stacking member on which recording materials are stacked, an extension member that is connected to one end side of the first stacking member and that supports the recording material, and a second stacking member on which plural recording materials are stacked as a recording material bundle and which is placed so as to be movable in a direction intersecting a discharge direction of the recording material bundle, wherein the extension member is connected to the first stacking member so as to be non-rotatable in a direction approaching the second stacking member and be rotatable in a direction away from the second stacking member. | 2015-01-08 |
20150008642 | SHEET EJECTION DEVICE, AND IMAGE FORMING APPARATUS AND POST-PROCESSING APPARATUS THAT ARE PROVIDED THEREWITH - A sheet ejection device comprises an ejection roller pair ( | 2015-01-08 |
20150008643 | ADJUSTMENT MECHANISM FOR SHUFFLEBOARDS AND OTHER GAME BOARDS - The present invention relates to an adjustment mechanism for game boards that allows a user to correct for warp to the playing surface due to changes in climatic conditions. The adjustment mechanism includes at least two adjusting members mounted in a transversely spaced arrangement to the underside of a game board and connecting member engaging the adjusting members through threaded connections. Through rotation, the connecting member exerts a force to drive the adjusting members away from or toward one another thereby impacting the degree of concavity imparted to the playing surface. Rotating the connecting member in one direction increases the concavity of the playing surface and rotating the connecting member in the opposite direction reduces the concavity of the playing surface. The connecting member includes a polygonal portion for engagement with a tool allowing the user to adjust the concavity of the playing surface in a single motion. | 2015-01-08 |
20150008644 | SHUFFLE BOARD GAME APPARATUS AND METHOD - A shuffle board game system includes a shuffle board game apparatus and a method of playing a game. The board game apparatus includes a base, a symmetrical, enclosed, cross-configured shuffle board with a target pattern at the center with multiple playing pieces that can be distributed from each of the four ramps surrounding the board. The method of playing includes each of four players strategically launching their respective playing pieces from a ramp toward the target pattern or to block another player's ramp. Each player seeks to gain the most points based upon the proximity of their playing pieces to spaces within the target pattern. | 2015-01-08 |
20150008645 | PUMPING SEAL WITH ALIGNED SPRING - A seal assembly for sealing a space between a housing and a rotary shaft includes a generally annular sealing member having a central axis and inner and outer circumferential surfaces extending about the axis, at least a portion of the inner surface providing a sealing surface engageable with the shaft outer surface so as to define a seal interface with opposing axial ends. The sealing surface is configured to direct substances entering the interface toward at least one of the axial ends. Further, an annular biasing member is disposed about the sealing member outer surface and configured to exert a radially-inwardly directed force on the sealing member so as to generate contact pressure within the seal interface. The biasing member is arranged on the sealing member such that at least a portion of the biasing member extends axially in general alignment with at least a portion of the sealing surface. | 2015-01-08 |
20150008646 | SEAL ASSEMBLY AND METHOD OF FORMING A SEAL ASSEMBLY - A downhole seal assembly comprises a base pipe upon which is mounted a seal element and a ring member, wherein the ring member is located adjacent an end region of the seal element. The ring member and seal element are adhered together with a bonding agent. | 2015-01-08 |
20150008647 | SEALING ASSEMBLY ADAPTED TO BE INSERTED BETWEEN TWO RELATIVELY SLIDABLE MEMBERS - A sealing assembly insertable between a rod and a guiding bush of a shock absorber to form a sealing and guiding unit for the rod is provided. The assembly includes an elastomeric ring having a first and a second annular lip which extend axially and radially overhanging; and a reinforcing ring integrally coupled to the elastomeric ring, radially on the side of the first and of the second sealing lip. The reinforcing ring is integrally coupled in one piece with the elastomeric ring, on the exterior of the elastomeric ring and on the side of a lateral surface thereof facing towards the lips, the reinforcing ring coupling in sliding manner with the rod to serve as guide therefor. The sealing ring coupling by interference with the guiding bush. | 2015-01-08 |
20150008648 | SEALING DEVICE - In a sealing device installed to an installation groove which is provided in an outer peripheral surface of one member among two members relatively moving, and sealing between the two members by coming into close contact with the other member which is positioned in an outer peripheral side of the installation groove and one side wall of the installation groove, the sealing device has a seal ring, a support ring having a pressing surface which comes into contact with an inner peripheral corner portion the seal ring, and a spring means which presses the support ring and the seal ring. A collapsing margin in relation to the taper surface shaped pressing surface in the support ring is normally set in an inner peripheral corner portion in the seal ring. According to the sealing device, it is possible to improve pressure resistance and sealing performance. | 2015-01-08 |
20150008649 | GASKET - A gasket is provided that can effectively alleviate stresses arising therein when at high temperatures. A substantially annular gasket | 2015-01-08 |
20150008650 | LOW-STRESS MOLDED GASKET AND METHOD OF MAKING SAME - A molded discrete low stress gasket is constructed of restructured filled PTFE for use in corrosive or severe chemical environments under relatively low bolt loads. The gasket has a gasket surface and includes a raised outer sealing ring and a raised inner sealing ring. The gasket may constructed from a restructured filled PTFE material, with the sealing rings deforming at lower pressures than the remaining portions of the gasket. | 2015-01-08 |
20150008651 | SEALING ARRANGEMENT - A sealing arrangement includes a first member having a non-circular hole, a second member having a non-circular and annular groove that extends continuously around an outer circumference of the second member, and a seal made of an elastic material and seated in the groove. An outer circumference of a body of the seal is in contact with a wall of the first member defining the non-circular hole, and an inner circumference of the body of the seal is in contact with a wall of the second member defining the groove. At least one protrusion protrudes from at least one portion of the body where a relatively low contact pressure is applied between the body and the groove and along a direction of insertion of the second member into the first member. | 2015-01-08 |
20150008652 | HAND CART - A hand cart includes a body component, a grip component, a support component, a position adjustment mechanism, and a controller. The grip component is arranged relative to the body component at a grip position. The support component is arranged to link the body component and the grip component. The position adjustment mechanism is configured to adjust the grip position of the grip component. The controller is configured to operate the position adjustment mechanism such that displacement of the grip position with respect to a reference position due to an inclination of the body component is corrected. | 2015-01-08 |
20150008653 | YARD MAINTENANCE VEHICLE WITH CABLE STEERING ASSEMBLY FOR TIGHT TURNING - A riding yard maintenance vehicle may include a frame, a steering assembly, and a cable. Wheels of the riding yard maintenance vehicle may be attachable to the frame. The steering assembly may include a steering apparatus operably coupled to front wheels of the riding yard maintenance vehicle via a cable system. The cable system may include the cable, which may be wrapped around at least a portion of the steering shaft. The cable may terminate at respective ends thereof at corresponding portions of a turn magnification assembly that indirectly couples the cable to the front wheels. The turn magnification assembly may be configured to approximate Ackermann geometry steering of respective ones of the front wheels based on movement of the cable responsive to rotation of the steering shaft. | 2015-01-08 |
20150008654 | Single-Shell Spring Arm - The invention relates to a single-shell spring control arm, for a wheel suspension of a motor vehicle, comprising a first end portion for attaching to a chassis beam a second end portion for attaching on the wheel side, and an increased-width portion which is arranged between the two end portions, and which comprises a spine having flanks projecting therefrom and which defines a spring seat for supporting a spring. In order to attain high component rigidity and a wheel suspension which is optimized with regard to loads, the invention proposes that inwardly deformed surface parts are formed on the flanks, the longitudinal edges of which surface parts are spaced apart from one another along their entire length so that the increased-width portion has a C-profile-shaped cross-sectional profile, and in that a connection portion for attaching a shock absorber is formed between the spring seat and the second end portion. | 2015-01-08 |
20150008655 | Tri-fold, vehicle chassis - The teachings provided herein are generally directed to compact vehicle drive mechanisms that can be used in the design of a foldable, carry-on vehicle. The compact drive mechanisms presented herein, for example, have contributed to the advent of the compact, carry-on bicycles set-forth in the teachings which include drive-and-steering units and drive-and-chassis units. | 2015-01-08 |
20150008656 | FIFTH WHEEL TRAILER SAFETY DEVICE - A safety device for use with a fifth wheel trailer hitch. The safety device is mounted to a first and second rail, these rails secure both the fifth wheel hitch and the safety device to the frame of a vehicle. The safety device is generally U-shaped and extends rearwardly of the fifth wheel hitch to a catch. The catch is defined as the base of the “U” and serves to catch the king pin of a trailer in case the king pin is loosed from the fifth wheel hitch. | 2015-01-08 |
20150008657 | Hitch Coupler Receiving Apparatus - A hitch coupler receiving apparatus includes a base having opposite first and second surfaces, and a pair of spaced-apart first and second openings extending through the base from the first surface to the second surface. A pair of opposing, elongated first and second walls extend outwardly from the base first surface in adjacent, spaced-apart relationship. Each wall includes a plurality of spaced apertures formed therethrough. A hitch coupler is secured to the apparatus via a fastener that engages aligned apertures in the respective first and second walls. Each wall overlies a respective one of the first and second openings and includes an access opening. Each access opening is substantially larger than a respective opening in the base and facilitates insertion of a fastener into a respective opening in the base and rotation of the fastener via a tool. | 2015-01-08 |
20150008658 | FIFTH WHEEL HITCH SUPPORT ASSEMBLY - A fifth wheel mounting assembly comprises first and second support members adapted to couple to frame members and support assembly that comprises first and second portions slidably engaging the first and second support members and adjustable along a length thereof, the first and second portions including an upwardly-opening recess, first and second mounting members coupled to the first and second portions and configured to pivotably support the fifth wheel hitch plate, and a center portion having a first and second end received within the recesses of the first and second portions, wherein the recesses of the first and second portions are configured to receive the ends of the center portion subsequent to the first mounting member being coupled to the first mounting portion and the second mounting member being coupled to the second mounting portion. | 2015-01-08 |
20150008659 | STROLLER FRAME WITH A HIDABLE RELEASE ACTUATOR - A stroller frame with a hidable release actuator includes a foldable frame, a locking mechanism, a release mechanism and a baby carrier. The locking mechanism is mounted on the foldable frame for locking the foldable frame in the erected configuration. The release mechanism has a release actuator operatively mounted on the foldable frame for unlocking the locking mechanism by rotation in either a forward direction or a rearward direction. The baby carrier has a deployed position to support a baby occupant thereon and can hide the release actuator thereunder. The baby carrier can be converted into a folded position to permit the access to the release actuator. By this arrangement, to prevent the caregiver from accessing the release actuator, so as to avoid accidentally folding of the foldable frame before the baby occupant being held up from the baby carrier. | 2015-01-08 |
20150008660 | COLLAPSIBLE CART - The present invention relates to a collapsible cart which has a substantially rectangular base comprising four side regions, four corner regions and hinge assemblies disposed at each corner region, hinged upright frame assemblies having a lower end rotatably connected to the hinge assemblies at the base, and an open top frame having hinge assemblies at each corner region rotatably connected to an upper end of the hinged upright frame assemblies. The base, upright and top frame hinge assemblies are all oriented so the upright frame assemblies can fold along the side regions of the cart when the collapsible cart is folded flat. In one particular embodiment, the base and top frame are square. A basket for storing a variety of items may be attached to the collapsible cart. The collapsible cart may also have wheels or casters on the base to permit easy movement of the collapsible cart. | 2015-01-08 |
20150008661 | APPARATUS FOR HOLDING AND DISPLAYING PAGES OF READING MATERIAL - A bookholder apparatus adapted to support a plurality of pages of reading material and to be slidable across a support surface includes a front cover, a back cover, and a spine operable coupled to the front cover and the back cover. The bookholder allows the container to be moved between an open position and a closed position, wherein the plurality of pages are supported within the container. A plurality of roller elements are mounted to an outer surface and within a perimeter of at least one of the front cover, the back cover, or the spine to allow the bookholder to slide and/or roll across a support surface. | 2015-01-08 |
20150008662 | Electrofusion Fittings and Methods - An electrofusion fiting ( | 2015-01-08 |
20150008663 | CLAMPING DEVICE COMPRISING A COLLAR AND A SLEEVE - The clamping device comprises a clamping collar ( | 2015-01-08 |
20150008664 | COVER FOR MALE MEMBER - A head portion ( | 2015-01-08 |
20150008665 | EXHAUST PIPE SPHERICAL JOINT - In an exhaust pipe spherical joint X, a spherical annular seal member | 2015-01-08 |
20150008666 | Condulet Coupler - A condulet coupler is provided for attachment to a condulet. The condulet coupler can facilitate tapping into an existing conduit system and reclosing the condulet opening to introduce new conduit runs beginning midstream in an in-place conduit and to introduce splices in an existing run. Other functional changes, such as rerouting select wiring, can also be served by the condulet coupler. | 2015-01-08 |
20150008667 | TIGHTLY THREADED JOINT FOR OIL FIELD PIPES - A threaded joint for oil field pipes includes a male pipe having a male thread and a female pipe having a female thread. The male thread and the female thread engage along a thread profile, the male pipe with a first end face and the female pipe with a second end face. The male pipe also has as first sealing surface and the female pipe has a second sealing surface. The first end face and second end face are substantially perpendicular to the first sealing surface and second sealing surface. When the male pipe and female pipe are fully adjoined, the first sealing surface abuts the second sealing surface, the first end face abuts the second end face, and the trailing face abuts female thread, while leaving a space between the female thread and the top face, and leaving a space between the female thread and the leading face. | 2015-01-08 |
20150008668 | PIPE FITTING - A compression pipe fitting is provided. The fitting comprises a body defining one or more sockets for receiving an end of a pipe, a clamping nut and a grip ring. The socket is encircled by a threaded face, and is internally adapted to receive a compressible O-ring. The nut can be screwed onto the threaded face of the socket and has an internal tapered surface while the grip ring has a complimentally tapered surface which, when the nut is tightened onto the threaded face, bears upon the grip ring compressing it against the pipe and compressing the o-ring located within the socket. | 2015-01-08 |
20150008669 | PIPE JOINT, AIR CONDITIONER, METHOD FOR PRODUCING CONNECTING PIPE, CONNECTING PIPE, AND CONNECTION METHOD - A pipe joint is connected with a connecting pipe, and includes a pipe joint body and a nut member. When the connecting pipe formed with a bead expanded in the radial direction is connected with this pipe joint, a male thread of the pipe joint body is engaged with a female thread of the nut member to hold the bead between a tapered face and a tapered face. In addition, the joined portion between the bead and the tapered face forms a first sealed portion, and a joined portion between the bead and the tapered face forms a second sealed portion. Still further, a tapered face of the pipe joint body is joined with the tapered face of the nut member to form a third sealed portion. | 2015-01-08 |
20150008670 | METHODS FOR MONITORING A SEAL ASSEMBLY - A method for monitoring functionality of a seal assembly within an injector feed assembly is described. The method includes providing a buffer fluid to the seal assembly, measuring at least one of a pressure and a flow rate of the buffer fluid, and determining a functionality of the seal assembly based at least partially on the at least one of a pressure and a flow rate of the buffer fluid. | 2015-01-08 |
20150008671 | PITCH DRIVE SYSTEMS AND METHODS - A wind turbine pitch drive system comprises an electric grid for supplying electrical power, a motor for driving a pitch actuator, an electronic converter for controlling the motor and a back-up energy storage unit for supplying electrical power. The electronic converter comprises a DC-link capacitor bank. The system furthermore comprises a switching device for selectively connecting the DC-capacitor bank link to the back-up energy storage unit, and a frequency generator for controlling the switching device. Also disclosed is a method for protecting a component of the electronic converter. | 2015-01-08 |
20150008672 | METHOD FOR DAMPING DRIVE TRAIN OSCILLATIONS IN A WIND TURBINE GENERATOR - The present invention relates a wind turbine generator with an electrical generator, a dump load unit, for dissipating power, a wind turbine power controller and a damping controller both arranged to control wind turbine components based on a damping reference signal, the damping reference signal is a combined signal, and comprises a first reference signal and a second reference signal, the second reference signal is an oscillating part, the wind turbine power controller is controlling the power from the electrical generator according to the first reference signal and the damping controller is controlling the dump load unit to dissipate power according to the second reference signal. The invention also relates to a method for damping oscillations with wind turbine generators. | 2015-01-08 |