01st week of 2010 patent applcation highlights part 39 |
Patent application number | Title | Published |
20100003806 | DETERMINISTIC GENERATION OF AN INTEGRATED CIRCUIT IDENTIFICATION NUMBER - The generation of an identification number of a chip supporting at least one integrated circuit, including the step of causing a cutting of at least one conductive section by cutting of the chip among several first conductive sections parallel to one another and perpendicular to at least one edge of the chip, the first sections being individually connected, by at least one of their ends, to the chip, and exhibiting different lengths, the position of the cutting line with respect to the chip edge conditioning the identification number. | 2010-01-07 |
20100003807 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS AND STORAGE MEDIUM - Provided is a method for performing etching process or film forming process to a substrate W whereupon a prescribed pattern is formed with an opening. The method is provided with a step of mixing a liquid and a gas, at least one of which contains a component that contributes to the etching process or the film forming process, and generating charged nano-bubbles | 2010-01-07 |
20100003808 | METHOD OF PREPARING AN ELECTRICALLY INSULATING FILM AND APPLICATION FOR THE METALLIZATION OF VIAS - The present invention essentially relates to a method of preparing an electrically insulating film at the surface of an electrical conductor or semiconductor substrate, such as a silicon substrate. | 2010-01-07 |
20100003809 | METHOD FOR DESTRUCTION OF METALLIC CARBON NANOTUBES, METHOD FOR PRODUCTION OF AGGREGATE OF SEMICONDUCTING CARBON NANOTUBES, METHOD FOR PRODUCTION OF THIN FILM OF SEMICONDUCTING CARBON NANOTUBES, METHOD FOR DESTRUCTION OF SEMICONDUCTING CARBON NANOTUBES, METHOD FOR - A method for destruction of metallic carbon nanotubes is provided. The method includes irradiating a mixture of semiconducting carbon nanotubes and metallic carbon nanotubes with energy beams (such as laser light), thereby selectively destroying metallic carbon nanotubes or semiconducting carbon nanotubes. The energy beams have energy components for resonance absorption by the metallic carbon nanotubes or semiconducting carbon nanotubes. | 2010-01-07 |
20100003810 | METHOD OF FORMING P-TYPE COMPOUND SEMICONDUCTOR LAYER - A method of forming a p-type compound semiconductor layer includes increasing a temperature of a substrate loaded into a reaction chamber to a first temperature. A source gas of a Group III element, a source gas of a p-type impurity, and a source gas of nitrogen containing hydrogen are supplied into the reaction chamber to grow the p-type compound semiconductor layer. Then, the supply of the source gas of the Group III element and the source gas of the p-type impurity is stopped and the temperature of the substrate is lowered to a second temperature. The supply of the source gas of nitrogen containing hydrogen is stopped and drawn out at the second temperature, and the temperature of the substrate is lowered to room temperature using a cooling gas. Accordingly, hydrogen is prevented from bonding to the p-type impurity in the p-type compound semiconductor layer. | 2010-01-07 |
20100003811 | METHOD FOR MANUFACTURING EPITAXIAL WAFER - A method for manufacturing an epitaxial wafer is provided, which can alleviate distortions on a back surface of the epitaxial wafer. The method for manufacturing an epitaxial wafer using a susceptor for a vapor phase growth system having a concave shaped wafer placement portion on an upper face thereof, on which a semiconductor wafer is placed, includes: an oxide film forming step in which an oxide film Ox is formed on a back surface of the semiconductor wafer; a wafer placing step in which, after the oxide film forming step, the semiconductor wafer is placed on a wafer placement portion so that the back surface of the semiconductor wafer faces downward; and an epitaxial growth step in which, after the wafer placing step, an epitaxial layer is grown on a main surface of the semiconductor wafer. | 2010-01-07 |
20100003812 | Solar Cell Fabrication Using Extrusion Mask - Large-area ICs (e.g., silicon wafer-based solar cells) are produced by positioning a mask between an extrusion head and the IC wafer during extrusion of a dopant bearing material or metal gridline material. The mask includes first and second peripheral portions that are positioned over corresponding peripheral areas of the wafer, and a central opening that exposes a central active area of the wafer. The extrusion head is then moved relative to the wafer, and the extrusion material is continuously extruded through outlet orifices of the extrusion head to form elongated extruded structures on the active area of the wafer. The mask prevents deposition of the extrusion material along the peripheral edges of the wafer, and facilitates the formation of unbroken extrusion structures. The mask may be provided with a non-rectangular opening to facilitate the formation of non-rectangular (e.g., circular) two-dimensional extrusion patterns. | 2010-01-07 |
20100003813 | Semiconductor device and method of fabricating the same - According to the present invention, there is provided a semiconductor device comprising:
| 2010-01-07 |
20100003814 | Interconnections Having Double Capping Layer and Method for Forming the Same - Provided are an interconnection of a semiconductor device which includes a capping layer and a method for forming the interconnection. The interconnection of the semiconductor device is a copper damascene interconnection where the capping layer is formed as a dual layer of a silicon nitride layer and silicon carbide layer on a copper layer processed by chemical mechanical polishing (CMP). Therefore, it is possible to maintain a high etching selectivity and a low dielectric constant of the silicon carbide layer while providing superior leakage suppression. | 2010-01-07 |
20100003815 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device and method for manufacturing the same is provided, capable of gap-filling a copper metal wiring while minimizing void generation. A semiconductor device according to an embodiment includes a copper sulfide layer formed on a first barrier metal formed in a via and trench; and a via plug and an upper metal wiring formed in the via hole and the trench, respectively, on the copper sulfide layer and an exposed lower metal wiring. | 2010-01-07 |
20100003816 | Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed - An insulating film formed on a conducting layer is dry-etched so as to make a connection hole in the insulating film to expose the conducting layer. Plasma is supplied onto the exposed conducting layer to dry-clean a damage layer produced in the connection hole. A product produced in the connection hole as a result of the dry cleaning is removed by a wet process. An oxide film formed in the connection hole as a result of the wet process is etched by a chemical dry process using a gas including either NF | 2010-01-07 |
20100003817 | Method of light induced plating on semiconductors - Methods of light induced plating of nickel onto semiconductors are disclosed. The methods involve applying light at an initial intensity for a limited amount of time followed by reducing the intensity of the light for the remainder of the plating period to deposit nickel on a semiconductor. | 2010-01-07 |
20100003818 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device according to one embodiment includes: forming a porous film above a semiconductor substrate; forming an altered layer by applying alteration treatment to a first pattern region of the porous film up to a predetermined depth; forming a first concave portion by etching a second pattern region to a depth deeper than the predetermined depth, the second pattern region at least partially overlapping the first pattern region of the porous film having the altered layer formed therein; and forming a second concave portion by selectively removing the altered layer from the porous film after forming the first concave portion. | 2010-01-07 |
20100003819 | DESIGN LAYOUT DATA CREATING METHOD, COMPUTER PROGRAM PRODUCT, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A design layout data creating method includes creating design layout data of a semiconductor device such that patterns formed on a wafer when patterns corresponding to the design layout data are formed on the wafer have a pattern coverage ratio within a predetermined range in a wafer surface and total peripheral length of the patterns formed on the wafer when the patterns corresponding to the design layout are formed on the wafer is pattern peripheral length within a predetermined range. | 2010-01-07 |
20100003820 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes forming in order a barrier film, an insulating film, a first mask, and a second mask having etching properties different from those of the first mask on a substrate, removing the insulating film, the first mask, and the second mask to form a via hole in the insulating film, removing the second mask in a wiring trench forming region including the via hole, and etching the first mask using the second mask as a mask to remove the first mask in the wiring trench forming region. Removing the first mask in the wiring trench forming region includes etching the first mask and etching the barrier film at the bottom of the via hole to partially remove the barrier film at the bottom of the via hole. | 2010-01-07 |
20100003821 | WETTING AGENT FOR SEMICONDUCTORS, AND POLISHING COMPOSITION AND POLISHING METHOD EMPLOYING IT - To provide a wetting agent for semiconductors and a polishing composition whereby the wettability of a semiconductor substrate surface can be improved, and microdefects such as particle attachments can be remarkably reduced. | 2010-01-07 |
20100003822 | METHOD FOR PRODUCING COLUMNAR STRUCTURED MATERIAL - A microcolumnar structured material having a desired material. The columnar structured material includes columnar members obtained by introducing a filler into columnar holes formed in a porous material. The porous material has the columnar holes formed by removing columnar substances from a structured material in which the columnar substances containing a first component are dispersed in a matrix member containing a second component capable of forming a eutectic with the first component. The matrix member may be removed. In the columnar structured material, the filler is a conductive material, and an electrode can be structured by electrically connecting the conductive materials in at least a part of a plurality of holes to a conductor. | 2010-01-07 |
20100003823 | Method for Forming Trenches with Wide Upper Portion and Narrow Lower Portion - A method for forming a semiconductor structure includes the following steps. A hard mask layer is formed over a semiconductor region. The hard mask layer has inner portions that are thinner than its outer portions, and the inner portions define an exposed surface area of the semiconductor region. A portion of the semiconductor region is removed through the exposed surface area of the semiconductor region. The thinner portions of the hard mask layer are removed to expose surface areas of the semiconductor region underlying the thinner portions. An additional portion of the semiconductor region is removed through all exposed surface areas of the semiconductor region thereby forming a trench having an upper portion that is wider than its lower portion. | 2010-01-07 |
20100003824 | Clamped showerhead electrode assembly - An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses. | 2010-01-07 |
20100003825 | PLASMA ETCHING METHOD, CONTROL PROGRAM AND COMPUTER STORAGE MEDIUM - A plasma etching method, for plasma-etching a target substrate including at least a film to be etched, an organic film to become a mask of the to-be-etched film, and a Si-containing film which are stacked in order from bottom, includes the first organic film etching step, the treatment step and the second organic film etching step when the organic film is etched to form a mask pattern of the to-be-etched film. In the first organic film etching step, a portion of the organic film is etched. In the treatment step, the Si-containing film and the organic film are exposed to plasma of a rare gas after the first organic film etching step. In the second organic film etching step, the remaining portion of the organic film is etched after the treatment step. | 2010-01-07 |
20100003826 | CORROSION RESISTANT COMPONENT OF SEMICONDUCTOR PROCESSING EQUIPMENT AND METHOD OF MANUFACTURE THEREOF - A corrosion resistant component of a plasma chamber includes a liquid crystalline polymer. In a preferred embodiment, the liquid crystalline polymer (LCP) is provided on an aluminum component having an anodized or non-anodized surface. The liquid crystalline polymer can also be provided on an alumina component. The liquid crystalline polymer can be deposited by a method such as plasma spraying. The liquid crystalline polymer may also be provided as a preformed sheet or other shape adapted to cover the exposed surfaces of the reaction chamber. Additionally, the reactor components may be made entirely from liquid crystalline polymer by machining the component from a solid block of liquid crystalline polymer or molding the component from the polymer. The liquid crystalline polymer may contain reinforcing fillers such as glass or mineral fillers. | 2010-01-07 |
20100003827 | METHOD AND DEVICE FOR ETCHING A SUBSTRATE BY MEANS OF PLASMA - In a method and device for etching a substrate by a plasma, the plasma is generated and accelerated at substantially sub-atmospheric pressure between a cathode and an anode of a plasma source ( | 2010-01-07 |
20100003828 | METHODS FOR ADJUSTING CRITICAL DIMENSION UNIFORMITY IN AN ETCH PROCESS WITH A HIGHLY CONCENTRATED UNSATURATED HYDROCARBON GAS - Methods for etching a metal material layer disposed on a substrate to form features with desired profile and uniform critical dimension (CD) of the features across the substrate. In one embodiment, a method for etching a material layer disposed on a substrate includes providing a substrate having a metal layer disposed on a substrate into an etch reactor, flowing a gas mixture containing at least a halogen containing gas and a passivation gas into the reactor, the passivation gas including a nitrogen containing gas and an unsaturated hydrocarbon gas, wherein the nitrogen gas and the unsaturated hydrocarbon gas and etching the metal layer using a plasma formed from the gas mixture. The CD uniformity could be conveniently, efficiently tuned by the gas ratio, if the concentration of the unsaturated hydrocarbon gas is high enough that the molecular ratio of the unsaturated hydrocarbon gas in the diluent gas times the reactor pressure in milliTorr is greater than 1.25. | 2010-01-07 |
20100003829 | Clamped monolithic showerhead electrode - An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode. | 2010-01-07 |
20100003830 | IMPRINT MASK MANUFACTURING METHOD, IMPRINT MASK MANUFACTURING DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A pattern is formed on a mask substrate. Positional deviation information between an actual position of the pattern formed on the mask substrate and a design position decided at the time of designing the pattern is calculated. A heterogeneous layer of which a volume expands more greatly than that of surrounding mask substrate region is formed in a predetermined position within the mask substrate so that volume expansion of the heterogeneous layer according to the positional deviation information is achieved. | 2010-01-07 |
20100003831 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS - A predicted film formation rate value is computed based on a film formation rate prediction formula obtained in advance and apparatus parameters obtained during a previously-performed film formation process. A processing time required for an amount of film formed on a wafer to reach a predetermined target film thickness is computed based on the computed predicted film formation rate value and the target film thickness. Then, according to the computed processing time, a film-formation process is performed on wafers. In addition, it is determined whether the computed predicted film formation rate value is within a predetermined range, and only when it is determined to be within the predetermined range, the film formation process may be performed. | 2010-01-07 |
20100003832 | VAPOR PHASE DEPOSITION APPARATUS, METHOD FOR DEPOSITING THIN FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A vapor phase deposition apparatus | 2010-01-07 |
20100003833 | METHOD OF FORMING FLUORINE-CONTAINING DIELECTRIC FILM - A method of forming a fluorine-containing dielectric film on a substrate by plasma CVD, includes: introducing as a process gas a fluorinated carbon compound having at least two double bonds in its molecule and an unsaturated hydrocarbon compound into a reaction space wherein a substrate is placed; and applying RF power to the reaction space to deposit a fluorine-containing dielectric film on the substrate by plasma CVD. | 2010-01-07 |
20100003834 | MRAM - Disclosed is a method to convert a low resistance cell in a MRAM device to a capacitive cell. The low resistance cell has a plurality of layers on a substrate. At least one layer remote from the substrate is sensitive to oxygen infusion. The method includes removing a cap layer of the cell and applying an oxygen barrier around the cell to expose at least a part of a surface of the at least one layer remote from the substrate. The at least one layer is oxidized. The oxygen barrier is removed. | 2010-01-07 |
20100003835 | Low-K Precursors Based on Silicon Cryptands, Crown Ethers and Podands - Disclosed herein is the use of a silicon podand, silicon crown ether, or silicon cryptand to form a low-k dielectric film on a substrate. | 2010-01-07 |
20100003836 | Rotary Terminal Mechanism - A rotary terminal mechanism ( | 2010-01-07 |
20100003837 | 276-PIN BUFFERED MEMORY MODULE WITH ENHANCED MEMORY SYSTEM INTERCONNECT AND FEATURES - A memory subsystem system including a rectangular printed circuit card having a first side and a second side, a length of between 149.5 and 153.5 millimeters, and first and second ends having a width smaller than the length. The memory system also includes a first plurality of pins on the first side extending along a first edge of the card that extends the length of the card, and a second plurality of pins on the second side extending on the first edge of the card. The memory system further includes a positioning key having it center positioned on the first edge of the card and located between 84.5 and 88.5 millimeters from the first end of the card and located between 62.5 and 66.5 millimeters from the second end of the card. | 2010-01-07 |
20100003838 | BURN-IN SOCKET - A burn-in socket includes a base, a sliding plate mounted to the base and having a number of pin holes, a number of contacts secured to the base and an actuator mounted on the base. The contacts each comprise a base portion and a pair of arms received in the pin holes of the sliding plate. The actuator includes a frame and a number of actuating portion for driving the sliding plate to move in a transversal direction. The actuating portion has a protrusion at a top end thereof and the protrusion makes the sliding plate not only open one of the pair of arms, but also push a solder ball received in the pair of arms away from the other one of the pair of arms. | 2010-01-07 |
20100003839 | CONNECTOR DEVICE FOR INTERCONNECTING CIRCUIT SUBSTRATES - A connector device for interconnecting circuit substrates is obtained, in which a pitch for electrically conducting paths can easily be aligned with a pitch for electrodes on the side of circuit substrates. The connector includes a rectangular parallelepiped connecting element ( | 2010-01-07 |
20100003840 | Dielectric Isolators - The present application is directed to dielectric isolators for use in aircraft fuel systems to control lightning induced current and allow dissipation of electrostatic charge. The dielectric isolators are configured to have a high enough impedance to limit lightning currents to low levels, but low enough impedance to allow electrostatic charge to dissipate without allowing buildup. Although the dielectric isolators may develop a potential difference across the dielectric length due to the effects of lightning currents and its inherent impedance, they are configured to withstand these induced voltages without dielectric breakdown or performance degradation. In one embodiment, the dielectric isolator includes a tube constructed of a composition including a thermoplastic organic polymer (e.g., PEEK) and carbon nanotubes, and a pair of couplings attached to opposing ends of the tube. The dielectric isolator is capable of exhibiting an electrical resistance from about 10 | 2010-01-07 |
20100003841 | PLUG-TYPE CONNECTOR FOR USE ON A GLOW PLUG AND HAVING AN INTGEGRAL PROJECTING BLADE CONTACT - The invention relates to a plug-in connector ( | 2010-01-07 |
20100003842 | COAXIAL CONNECTOR WITH A NEW TYPE OF CONTACT - A coaxial connector for receipt of a central contact of a complementary coaxial connector to be inserted therein, comprising an insulative case including an upper insulative case portion and a lower insulative case portion; an upper fixed contact, a movable contact and a bottom fixed contact essentially stacked in the space section; the upper fixed contact arranged to be sandwiched by the upper insulative case portion and the lower insulative case portion, the upper fixed contact having a planar contact part along a lengthwise direction; the movable contact having a central planar contact section, the central planar contact section arranged to initially come into contact with the contact part of the upper fixed contact; wherein the contact section of the movable contact is arranged to be movable from a position at which the movable contact is in contact with the upper fixed contact to a position at which the movable contact is separated from the upper fixed contact while not coming into contact with the bottom fixed contact in accordance with attachment and detachment of a complementary coaxial connector. | 2010-01-07 |
20100003843 | SMT/DIP TYPE CONNECTOR STRUCTURE HAVING AT LEAST THREE ROWS OF TERMINALS - A SMT/DIP type connector structure having at least three rows of terminals is provided. The connector structure mainly includes a printed circuit board and a connector having at least a first row of terminals, a second row of terminals and a third row of terminals. The printed circuit board is disposed centrally with respect to the connector. The first row and second row of terminals are respectively mounted to top and bottom board sides of the printed circuit board by using SMT. The third row and further rows of terminals can be mounted to the top or bottom board side of the printed circuit board selectively by using SMT or DIP. This structure can increase the speed of mounting the connector to the printed circuit board and significantly reduce the overall height of the resulted product. | 2010-01-07 |
20100003844 | ELECTRICAL CONNECTOR HAVING LATCHING MECHANISM - An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body includes a receiving part. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. The latching mechanism has a second engaging element engaged with the first engaging element, so that the latching mechanism is fixed onto the isolation body. | 2010-01-07 |
20100003845 | ELECTRICAL CONNECTOR WITH IMPROVED HOUSING - An electrical connector ( | 2010-01-07 |
20100003846 | Electrical Connector - An electrical connector including a first connection section adapted to connect to a first electrical conductor; and a second connection section adapted to connect to a second electrical conductor. The first and second connection sections include a first member, a second member and a compression member for compressing the second member towards the first member. The second member is pivotably connected to the first member at a rotating pivot which is spaced from the compression member and the second connection section. | 2010-01-07 |
20100003847 | ELECTRICAL PLUG-IN CONNECTOR - The invention relates to an electrical plug-in connector ( | 2010-01-07 |
20100003848 | SUPPLY SIDE BACKFEED METER SOCKET ADAPTER - A utility meter adapter plugs between a utility meter and its meter socket to provide a power pigtail suitable for a solar electric system to backfeed power to the utility. A round plastic base has several connector jaw blades underneath positioned like a meter to fit in a meter socket and its jaw sockets. A corresponding set of jaw sockets is provided for the jaw blades on the meter to plug into the topside. The jaw sockets in the adapter on the load side of the meter are pigtailed to terminal lugs with a conduit access. A solar electric system backfeed can be run through conduit tubing to the terminal lugs on top of any flush walls, thus avoiding any disturbances to the pre-existing walls and service panels. | 2010-01-07 |
20100003849 | ELECTRONIC APPARATUS AND CONNECTOR - According to one embodiment, an electronic apparatus includes a connector into which a plug of a USB cable is insertable. The connector includes a housing and a terminal portion provided in the housing. The housing includes an insertion opening part which exposes the terminal portion outside, a back part positioned at an end part opposite to the insertion opening part in the housing, and a side part provided between the insertion opening part and the back part and configured to oppose to the plug when the plug is inserted into the connector. The side part includes an inclined part which continues to the insertion opening part and is inclined such that a distance between the inclined part and the plug increases in a direction from the back part toward the insertion opening part to form a gap between the inclined part and the plug. | 2010-01-07 |
20100003850 | PLUG CONNECTOR FOR FRONT PLATE OR BACK PLATE ASSEMBLY - A plug connector ( | 2010-01-07 |
20100003851 | Surface mount coaxial connector assembly - A disclosed coaxial connector can be surface-mounted on a circuit board without degradation in signal transmission characteristics. The coaxial connector includes a center conductor, a surrounding conductor by which the center conductor is surrounded, and an insulating housing. The center conductor has a leg portion at its base end. The surrounding conductor has six lugs at its base end that extend radially. The leg portion and the lugs are exposed on a bottom surface of the housing. The coaxial connector is mounted on the circuit board with the leg portion pressed against a signal pad on the circuit board for electrical connection and the lugs pressed against a ground pad for electrical connection. | 2010-01-07 |
20100003852 | ELECTRICAL CONNECTOR WITH IMPROVED GROUNDING - A shielded electrical connector is disclosed that includes a receptacle having a outer ground shield surrounding a dielectric cover. The dielectric cover includes a plug reception cavity and has an electrical contact and an inner ground shield disposed therewithin. The outer ground shield includes grounding features configured to ground the outer shield to a module wall and attachment features configured to attach and ground the outer shield to a substrate. | 2010-01-07 |
20100003853 | USB ELECTRIC CONNECTOR FOR TRANSFERRING DATA BETWEEN COMPUTERS - A (universal serial bus) USB electric connector for transferring data between computers includes an outer shell, a seat body, a terminal set, a bridge circuit board and a lid body. The outer shell has a hollow main body, in which a seat body is provided, on which a terminal set is disposed, one side of which is electrically connected to the bridge circuit board. The lid body is connected by sealing the bottom of the seat body. The electrically conductive legs on the bridge circuit board pass through the lid body and are electrically connected to the motherboard of an electronic device. By applying a USB electric connector for connecting two computers via a traditional USB transmission line, it is possible to inter-transfer data between two computers. | 2010-01-07 |
20100003854 | ELECTRICAL CONNECTOR WITH IMPROVED EMI STRUCTURE - An electrical connector includes an insulative housing, first and second contact modules received in the insulative housing, a first metal shell covering the insulative housing and a grounding piece. The insulative housing includes a mating tongue and the first metal shell includes a plurality of peripheral walls enclosing the mating tongue to cooperatively form a mating opening therebetween. The grounding piece includes a number of side walls and a receiving opening through which the peripheral walls extend. The side walls include a number of half-spherical embosses stamped therefrom to abut against the front metal shell for EMI protection. | 2010-01-07 |
20100003855 | ELECTRICAL CONNECTOR - An electrical connector is revealed. The electrical connector includes an insulating body with at least one terminal receiving hole and an accommodation space disposed on one side of the terminal receiving hole, at least one conductive terminal set that is received in the terminal receiving hole and having a first conductive terminal and a second conducive terminal, and at least one elastic member. The first conductive terminal is connected with the second conductive terminal slidingly and slantingly and the sliding stroke of the first conductive terminal is between the terminal receiving hole and the accommodation space. Each elastic member is correspondingly mounted in one of the accommodation spaces for elastically supporting the first conductive terminal. That means each elastic member gives the first conductive terminal a horizontal lateral force so that the first conductive terminal always applies a normal pressure to the second conductive terminal. Thus the good contact between the two conductive terminals is ensured. | 2010-01-07 |
20100003856 | CARD EDGE CONNECTOR - A card edge connector includes an insulating body having opposite lateral side frames for mounting respectively two metallic pieces thereon, and terminals mounted in the insulating body and coupled to a circuit board. When an insertion side with conductive terminals of an electronic card is inserted into an insertion groove in the insulating body, the conductive terminals contact respectively contact portions of the terminals extending into the insertion groove. Each metallic piece includes first and second resilient arms extending from a base, and a carved metallic piece extending from the first resilient arm. When the insertion side of the electronic card is inserted into the insertion groove, each lateral side of the electronic card is clamped between the anchoring member and the second resilient arm of a corresponding metallic piece, and is formed with a notch engaging a projection of the second resilient arm of the corresponding metallic piece. | 2010-01-07 |
20100003857 | ELECTRICAL CONNECTOR ASSEMBLY WITH A TRANSITION BOARD - An electrical connector assembly includes a first and a second connector ( | 2010-01-07 |
20100003858 | Repair Adapter for a Modular Plug - A device and method for repairing a failed modular connector having a broken locking tab by providing an adapter which receives the broken modular connector and includes a mechanism for retaining the broken modular connector, which may include a retaining clip, retaining barbs, or teeth, tight friction, friction bumps, adhesive or other retaining device. The adapter mechanically and electrically connects to the broken connector and provides a straight through wired modular plug with a retaining clip so that the assembly comprising the broken connector and adapter may plug into a jack for the original broken connector and be securely retained. | 2010-01-07 |
20100003859 | COMPOSITE CONNECTOR - A composite connector includes a base, a DisplayPort and an eSATA electrical connector. The base is provided with a first assembling hole and a second assembling hole. The DisplayPort is assembled in the first assembling hole and has a body. The front end of the body has an insertion opening. The bottom of the body has a plurality of conductive pins. The conductive pins extend to the outside of the base. The eSATA electrical connector is assembled in the second assembling hole and has a body. The front end of the body has an insertion hole. The bottom of the body has a plurality of conductive pins. The conductive pins extend to the outside of the base. Via the Displayport and the eSATA electrical connector, a transmission line for a displayer and an eSATA transmission line can be connected thereto. | 2010-01-07 |
20100003860 | ASSEMBLY FOR PERMITTING POWER-OVER-INTERNET CONNECTION - An assembly for permitting “Power-over-Ethernet” (PoE) connection between a PoE control device and a component of a cabling network, the assembly comprising: a network connection device comprising a plurality of cable terminations each operatively connectable to a respective data cable for the transmission of data, each cable termination being operatively connected to a socket; and a PoE plug jack device directly connectable to a PoE control device or PoE power source, such that, when directly connected to the PoE control device or PoE power source, the PoE plug jack device receives power and/or power signals in dependence of the output of the PoE control device when connected to the PoE control device or PoE power source, the PoE plug jack device being engageable with a respective socket, and thereby operatively connectable to a said data cable via a data transmission path forming part of the network connection device. | 2010-01-07 |
20100003861 | PLUG CONNECTOR FOR TELECOMMUNICATIONS AND DATA TECHNOLOGY - The invention relates to a plug connector ( | 2010-01-07 |
20100003862 | ELECTRICAL PLUG-IN CONNECTOR - The invention relates to an electrical plug-in connector ( | 2010-01-07 |
20100003863 | Modular Connector With Reduced Termination Variability - A telecommunications connector assembly including a cable having a first pair of twisted wires and a second pair of twisted wires; a first connector having a first substrate having a first termination area, the first pair of twisted wires provided for electrical termination on a first side of the first substrate, the second pair of twisted wires provided for electrical termination on a second side of the first substrate, the second side opposite the first side; a second connector having a second substrate having a second termination area, the second pair of twisted wires provided for electrical termination on the first side of the second substrate, the first pair of twisted provided for electrical termination on the second side of the second substrate, the second side opposite the first side. | 2010-01-07 |
20100003864 | ELECTRICAL CABLE CONNECTOR - A wedge connector for mechanically securing two electrical cables and making them electrically common is disclosed. The wedge connector has a C-shaped body member and a wedge. The body member has sides that converge toward a first body member end from a second body member end. The body member has edges that are formed to define a pair of inwardly facing channels connected by a web extending between the channels. The wedge also has converging sides to be conformably received in the C-shaped body member. The wedge has concave, outwardly facing surfaces on each side connected by a web extending between the sides. It also has a spring rib formed in the web that extends continuously from a first wedge end toward a second wedge end. | 2010-01-07 |
20100003865 | WIRING DEVICE TERMINAL AND RELATED METHOD OF TERMINATION - A terminal of a wiring device includes a conductive plate, an arm, and a wire guide. The conductive plate has an opening formed therethrough. The conductive plate receives a fastener for securing a substantially straight wire to the conductive plate. The arm extends from the conductive plate and defines a mating element on the wiring device. The arm is an anchor of said conductive plate. The mating element of the arm is adapted to cooperate with a complementary mating element. The wire guide is in spaced relation to the fastener to position the substantially straight wire adjacent to the fastener. | 2010-01-07 |
20100003866 | Electrical Connectors - An electrical connector including a first and second assembly that are matable with one another by a sliding push fit to establish electrical interconnection between the two assemblies is disclosed. The first assembly includes a contact pin with a collar extending concentrically around the pin to define a recess therebetween, with the collar supporting on its inner surface a first resilient contact element. The second assembly includes a sleeve open at one end thereof such that the sleeve can be received in the recess of the first assembly, with the sleeve supporting on its inner surface a second resilient contact element. The two assemblies may be arranged such that, when the second assembly is inserted into the first assembly, the first resilient contact element makes sliding electrical contact with an external surface of the sleeve of the second assembly, and the second resilient contact element makes sliding electrical contact with the external surface of the pin of the first assembly. | 2010-01-07 |
20100003867 | CONNECTOR FOR USE WITH LIGHT-WEIGHT METAL CONDUCTORS - Connecting elements and methods for the electrical connection between a light-weight metal conductor and an electrical contact, in particular for use in motor vehicles are disclosed. A metal sleeve is cold welded to the conductor. A contact element is connected to the metal sleeve in an electrically conductive manner and can be connected to the contact. A hardenable liquid seals, in a gas-tight manner, a contact element-side opening in the metal sleeve cold welded to the light-weight metal conductor. | 2010-01-07 |
20100003868 | Electrical connector - An electrical connector includes a base having a plurality of through holes, and a plurality of conducting pins respectively located in the through holes. There is a convex block located at the side wall of the base for each of the through holes. Each of the conducting pins has an arm portion. The arm portion and the convex block are located at the same side. The arm portion has a through opening, and one end of the arm portion is bent and extended to form a contacting portion. The contacting portion has an opening that links with the through opening to form a channel that makes the convex block pass through the channel without interference. Because of the lack of interference, the conducting pin will not be damaged due to contact with the convex block when the conducting pin is installed into the through hole. | 2010-01-07 |
20100003869 | CONTACT AND CONNECTOR INCLUDING THE CONTACT - A contact capable of facilitating adjustment of impedance and ensuring a high holding force when held in a housing. To a contact portion capable of being brought into contact with a pad on a module substrate, a spring portion is connected for pressing the contact portion against the pad. A press-fitting portion that is press-fitted into the housing is connected to the spring portion, and has a connecting portion connected thereto. A terminal portion to be connected to a pad on a motherboard is connected to the connecting portion. The spring portion is bent in a manner folded back from the rear end of the press-fitting portion in the inserting direction, toward a front side in the inserting direction. The connecting portion extends from the rear end of the press-fitting portion in the inserting direction, toward a rear side in the inserting direction. | 2010-01-07 |
20100003870 | CONTACT SHEET AND CONNECTING DEVICE INCLUDING THE SAME - A support portion of an elastic contactor is located in a fixed region surrounded by a plurality of openings on a contact sheet. The support portion extends over the substantially entire fixed region and along the outer rims of the surrounding openings. | 2010-01-07 |
20100003871 | Increased efficiency counter-rotating electric motor for propelling a boat - An enhanced counter-rotating electric motor and an associate propulsion system for use with a water-vehicle includes a motor housing, a stator within the housing that rotates about a central axis in one direction, an armature within the stator that rotates about the central axis in an opposite direction from the stator, a first axel that is secured to the stator and extends out from the housing, a second axel that is secured to the armature and extends out from the housing, water-tight rotational seals about each of the two axels, a centrifugal-force-balancing electrical connection mechanism that supplies functioning electrical communication between the motor and external electrical circuitry while operating the motor, and a propeller secured to each said axel. | 2010-01-07 |
20100003872 | DRIVE-STEERING CONTROL SYSTEM AND VEHICLES EQUIPPED THEREWITH - A drive-steering control system suitable for off-road land and amphibious vehicles. The system includes first and second steering input levers, each operable to rotate in forward and rearward pivotal directions. A coupling mechanism converts and transmits rotation of the first steering input lever in the forward pivotal direction into rotation of the second steering input lever in the rearward pivotal direction, and vice-versa. A reducing mechanism operates to selectively reduce the propulsion outputs of first and second propulsion devices, and a converting mechanism operates to convert the rotations of the steering input levers into inputs to the reducing mechanism. Depending on the directions the steering input levers are rotated, the reducing mechanism reduces the propulsion output of either the first or second propulsion device, which causes either the lefthand or righthand side of the vehicle to travel at a lower speed and thereby turn the vehicle either left or right. | 2010-01-07 |
20100003873 | OUTBOARD MOTOR - An outboard motor includes an engine and an exhaust pipe. The engine has a crank case, a cylinder body, and a cylinder head aligned along the front-rear direction of the outboard motor, and arranged to support a crankshaft so as to extend along an up-down direction. The exhaust pipe is arranged to lead an exhaust gas of the engine to a main exhaust passage positioned below the engine. The cylinder head has an exhaust gas outlet opened in the side portion on one side of the cylinder head in the left-right direction of the outboard motor. The exhaust pipe has a bypass exhaust pipe which, in a plan view, extends from the exhaust gas outlet, bypasses the engine along the crank case, and reaches the other side in the left-right direction of the engine. | 2010-01-07 |
20100003874 | FLIPPER - A flipper for swimming or underwater activities or muscular training, includes a blade and a shoe, the ends of which facing one another are dynamically and kinematically separate. The blade has extensions projecting backwardly and fixed to the shoe in areas substantially corresponding to its central part. Elastic tier rods are provided between the blade and the front part of the shoe and are designed to control angular variations between the blade and the shoe. | 2010-01-07 |
20100003875 | Aquatic device with light-emitting surface - An aquatic device is provided which has a light-emitting surface. The device ( | 2010-01-07 |
20100003876 | Leather coating compositions having improved embossability - The present invention provides aqueous compositions of one or more divalent metal crosslinked aqueous carboxylic acid group containing acrylic polymer having a Tg of ≦10° C. and one or more acrylic oligomer of a molecular weight of 20,000 or less and having a glass transition temperature (Tg) of equal to or lower than the Tg of the aqueous carboxylic acid group containing acrylic polymer. IN addition, the present invention provides methods of forming such compositions by polymerizing the aqueous carboxylic acid group containing acrylic polymer as a first stage of a multi-stage polymerization, followed by polymerizing the acrylic oligomer in the second or a subsequent stage by polymerizing the monomers in the in second or a subsequent stage in the presence of a chain transfer agent. Preferably, the compositions are used in soft feel applications to coat leather for, for example, furniture for home use and upholstery for automotive use. | 2010-01-07 |
20100003877 | Three-tier reflective nanofibrous structure - The present invention provides a three-tier reflective nanofibrous structure having a woven or nonwoven substrate, a polymeric nanofibers web on the substrate, and an infrared radiation reflection coating on the web. The present nanofibrous structure has good reflection to heat radiation in the near infrared, has good resistance to heat conduction, has good permeability to water vapor moisture, and is light weight. A method of fabricating both radiation relective and nanofibrous structure is also presented. | 2010-01-07 |
20100003878 | Fire resistant mattress fabric material and mattress - A fire resistant fabric material comprising a substrate having an ionic charge which is coated with a coating having essentially the same ionic charge. The coating consists essentially of a filler material comprising clay and a binder material. The substrate is preferably fiberglass, the filler material may further comprise at least one additional filler selected from the group consisting of decabromodiphenyloxide, antimony trioxide, fly ash, charged calcium carbonate, mica, glass microspheres and ceramic microspheres and mixtures thereof and the binder material is preferably acrylic latex. | 2010-01-07 |
20100003879 | Composition ignifugee a base de PVC - The use for yarn coating, for the manufacture of sun canopies, of a flame-retardant plastisol including a chlorinated polymer material free of lead including at least:
| 2010-01-07 |
20100003880 | Flame-resistant high visibility textile fabric for use in safety apparel - A knitted textile fabric for use in safety apparel, comprising a first yarn containing modacrylic fibers and a second yarn containing apparel, preferably cellulosic, fibers. The first and second yarns are interknitted with one another, e.g., in plated or bi-ply, relationship with the modacrylic yarn disposed predominantly at an outer face of the fabric for imparting flame resistant properties and an affinity for high visibility dyes and with the cellulosic yarn disposed predominantly at the opposite face of the fabric for imparting a hand suitable for comfortable body contact with a user's skin. | 2010-01-07 |
20100003881 | METHODS AND APPARATUS ASSOCIATED WITH NARROW TOWS FABRICATED FROM LARGE-TOW PREFORMS - A method for using a tow incorporating a large number of fibers to form a composite part that has the quality of parts made with tows incorporating a small number of fibers is described. The method includes spreading the tows incorporating a large number of fibers to form a relatively wide, flat, and continuous, unidirectional fabric, holding the fabric under tension to maintain the orientation and flatness, subjecting the flattened fabric to melt-bonding while held under tension to maintain the flattened configuration, and slicing the melt-bonded, unidirectional fabric into a plurality of narrow fiber tows and subsequently using these to produce braided, woven, and other fabric forms. | 2010-01-07 |
20100003882 | RESIN COMPOSITION AND MOLDED ARTICLE - A resin composition includes a biodegradable resin (A), a polyolefin resin (B) and a dispersing agent (C), which has a sea-isle structure in which the biodegradable resin (A) is dispersed as isles in the polyolefin resin (B) existing as a sea component wherein the average dispersed particle size of the biodegradable resin (A) is 1 nm to 1000 nm. | 2010-01-07 |
20100003883 | Reflective type liquid crystal display device and fabricating method thereof - The present invention provides a reflective type liquid crystal display device and fabricating method thereof, by which resolution is enhanced in a manner of representing two colors from one sub-pixel. The present invention includes a first substrate having a plurality of thin film transistors and a plurality of pixel electrodes within a plurality of sub-pixels defined by a plurality of gate and data lines perpendicularly crossing with each other, respectively, a second substrate assembled to the first substrate to confront, a liquid crystal layer between the first and second substrates, a third substrate assembled to the first substrate to confront, a plurality of reflective electrodes on an inside of the third substrate to correspond to a plurality of the sub-pixels, respectively, and a color filter layer having a plurality of electrophoretic bodies on a plurality of the reflective electrodes wherein each of the electrophoretic bodies is micro-encapsulated with ionic pigment particles. | 2010-01-07 |
20100003884 | Conductive Composition and Applications Thereof - A conductive composition and applications thereof are provided. The conductive composition comprises a mixture consisting of a metal powder and a glass powder. The diameter of the metal powder ranges from about 1 μm to about 3 μm. The diameter of glass powder ranges from about 0.5 μm to about 1 μm. The weight percentage of the metal powder to the mixture is from about 60% to about 98%. The conductive composition could be used to manufacture the electrodes of a flat lamp. | 2010-01-07 |
20100003885 | High intensity discharge lamps, arc tubes, and methods of manufacture - The present application discloses high intensity discharge (“HID”) lamps, arc tubes, and methods of manufacture. The application relates to HID lamps, arc tubes, and methods of manufacture wherein a precise amount of fill gas may be contained in the light-emitting chamber of the arc tube so that the pressure of the fill gas contained in the arc tube at substantially room temperature may be precisely controlled at pressures greater than about one-half atmosphere. | 2010-01-07 |
20100003886 | MODEL HELICOPTER - A toy helicopter with four electric motors having a main body, at least one battery, and front and rear coaxial rotor assemblies. The front coaxial rotor assembly is made up of front upper and lower rotors and a front stabilizing bar operatively connected to the front upper rotor. The rear coaxial rotor assembly is made up of rear lower and upper rotors and a rear stabilizing bar operatively connected to the rear upper rotor. The helicopter includes a means for concentrically rotating the front lower and upper rotors in opposite directions and a means for concentrically rotating the rear lower and upper rotors in opposite directions. The means for concentrically rotating the front lower and upper rotors in opposite directions includes first and second front electric motors, and the means for concentrically rotating the rear lower and upper rotors in opposite directions includes first and second rear electric motors. | 2010-01-07 |
20100003887 | Bath time toy bag - Bath time toy bag with a rectangular shape having mesh front panel and a mesh back panel, the panels sewn together at their edges so that the left and right side of the bag are permanently attached and the upper and lower edges of the bag are attached by one or more zipper assemblies. The zipper assemblies enable a user to insert play toys through the upper zipper assembly and to remove the play toys through the lower zipper assembly. | 2010-01-07 |
20100003888 | Life size Halloween novelty item - A life-size Halloween novelty item used for entertainment standing at 5′5″, designed to contain a reservoir of fluid inside the head, so it can be expelled through the mouth into a metal bucket via gravity when someone comes close to trigger the front sensor. Hands connect to the metel bucket's handle using hooks, further the arms connect to the hooks using chain link surrounded by pipe insulation, this combination coupled with the detachable metal bucket that slides on and off allows for the easiest disconnection of the arms from the metal bucket and the bucket from the body. There are four sensors, the sensor located in the right front of the invention controls the valve, the other three sensors facing forward, left, and right control messages. A switch on the invention controls what three messages will play. The invention contains three latches and one-hinge for folding. | 2010-01-07 |
20100003889 | FLEXIBLE MECHANICAL APPENDAGE - A flexible mechanical appendage is provided to include a predetermined length positioned between head and tail ends, and having two sides disposed along the length. Arms extending outwardly from both sides of the flexible spine, and having an aperture positioned through each arm. A cable extends along both sides of the flexible spine through each of the apertures and terminates about the tail end of the flexible spine. A pulley system is positioned about the head end and has a spool rotatably driven by a reciprocating motor. The spool has a fastener for securing the cable thereto, wherein when the pulley system rotates the spool in a single direction reeling on cable, one side of the flexible spine bends in an arc. | 2010-01-07 |
20100003890 | Stuffed toy filled with super absorbent polymer - The present design is related to stuffed toys formed in the shapes of various dolls or animals by using a bead-shaped super absorbent polymer as filler instead of cotton or packing in the stuffed toys, with the stuffed toys having variable states of contraction and expansion according to liquid absorption amount, without the leakage of the super absorbent polymer itself. The stuffed toy is characterized by having been stitched in the shape according to the stuffed toy with a water absorbent inner fabric on the inside of water absorbent outer fabric. The shape is formed by the bead-shaped super absorbent polymer that expands when water is absorbed to fill the inner space. The outer fabric and the inner fabric are water absorbent with the inner fabric being made of bead-proof material such that the stitching is made up of fine density that does not allow leakage of the beads. | 2010-01-07 |
20100003891 | Three dimensional displays having deformable constructions - An improved three dimensional display such as a Holiday decoration having collapsible constructions having a shape memory internal frame. In one embodied form, the unique display includes a collapsible internal frame formed, in part, from metal wire imparted with suitable memory characteristics. Such metals are referred to as “shape memory alloys” (SMAs) because much metals “remember” their original shapes. Accordingly, the present invention uses a deformable internal metal frame supporting an outer sheath formed from suitable materials such as fabric, or plastic film for the skin of the inventive three dimensional displays. | 2010-01-07 |
20100003892 | EYE - An eye is disclosed, which includes a spherical shell, a transparent body, a movable plate suspended inside the spherical shell, an elastic body disposed between the transparent body and the movable plate, and an electromagnetic driving device. The electromagnetic driving device drives the movable plate close to or away from the elastic body, and the elastic body is deformed when the electromagnetic driving assembly drives the movable plate. | 2010-01-07 |
20100003893 | Integral honey centrifuge or extractor from frames, combs, opercula and similar, and process for honey extraction - Patent of invention to a honey centrifuge or extractor which is comprised by a body or shield ( | 2010-01-07 |
20100003894 | Method and apparatus for selectively removing portions of an abradable coating using a water jet - A method and apparatus for forming raised ridges on the surface of a turbine component having an abradable coating formed on an outer surface thereof which includes a mask having a predetermined pattern of openings therein adjacent the abradable coating on a surface of the turbine component; and a high pressure water jet that has movement relative to the mask so that the high pressure water jet passes along the extent of the openings in the mask and passes through the openings in the mask to remove portions of the abradable coating on the turbine component located beneath the openings in the mask. | 2010-01-07 |
20100003895 | Orbital Grinding Aggregate - The invention concerns a grinding machine having displaceable grinding means for the processing of workpieces made from wood, wood composite materials, plastics, metals and similar materials. The invention further concerns a method of grinding a workpiece by means of the inventive grinding machine. The grinding aggregate comprises: at least one translational driving means configured to translate the grinding means ( | 2010-01-07 |
20100003896 | POLISHING PAD - A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices. | 2010-01-07 |
20100003897 | METHODS OF POLISHING AN OBJECT USING SLURRY COMPOSITIONS - In a slurry composition for chemical mechanical polishing, a method of preparing the slurry composition and a method of polishing an object using the slurry composition, the slurry composition includes a cerium oxide abrasive particle having a rare earth element other than cerium as a dopant, and an aqueous medium for dispersing the cerium oxide abrasive particle. The cerium oxide abrasive particle doped with the rare earth element may have an enhanced fracture strength as being compared with a pure cerium oxide abrasive particle, and also may reduce an amount of large or agglomerated particles and generation of a scratch on a polished surface of an object. | 2010-01-07 |
20100003898 | SUBSTRATE RETAINING RING FOR CMP - The edge effect or variation in polishing edge profile on a substrate undergoing CMP is reduced by structuring a retaining ring, housed in a carrier head for retaining the substrate, such that the polishing edge profile shifts back and forth with respect to the center of the substrate. Embodiments include structuring the retaining ring such that the width between inner and outer surfaces varies by an amount sufficient to compensate for polishing edge profile variation. Embodiments also include structuring the retaining ring such that the distance from the outer surface to the geometric inner surface varies. Embodiments further include structuring the retaining ring such that the distance between the outer surface to the perimeter of the substrate retained by the inner surface of the retaining ring varies. | 2010-01-07 |
20100003899 | DEVICE AND METHOD FOR POSITIONING AND BLOCKING STEADY RESTS FOR ROLLING MILL CYLINDERS IN GRINDING MACHINES AND GRINDING MACHINES EMPLOYING THE SAME - A device and method for positioning and blocking steady rests for rolling milly cylinders in grinding machines and grinding machines employing the same. A positioning and blocking device for steady rests includes a substantially flat carriage including a translation mechanism and a blocking mechanism, wherein the blocking mechanism is magnetic. | 2010-01-07 |
20100003900 | ABRASIVE TAPE, METHOD FOR PRODUCING ABRASIVE TAPE, AND VARNISHING PROCESS - There are provided an abrasive tape capable of suppressing contamination of a magnetic disk due to shattered abrasive particles and smoothing the surface of the magnetic disk; a method for producing an abrasive tape; and a varnishing process. An abrasive tape | 2010-01-07 |
20100003901 | Burnishing tape and method of manufacturing the same, and method of burnishing magnetic disk - Disclosed is a burnishing tape, a method of producing the same and a method of burnishing a magnetic disk with which a surface of the magnetic disk may be smoothed while contamination of a magnetic disk caused by crushed abrasive grains is prevented. A burnishing tape ( | 2010-01-07 |
20100003902 | MODULAR BASE-PLATE SEMICONDUCTOR POLISHER ARCHITECTURE - The present invention generally relates to a polishing system. Particularly, the present invention relates a polishing apparatus having one or more modular polishing stations, and a plurality of polishing heads movably connected to a transferring system. | 2010-01-07 |
20100003903 | DEVICE FOR PROCESSING THE SURFACE OF SPHERICAL SHELLS - This disclosure concerns a device for machining surfaces, e.g., superfinishing, polishing, grinding or lapping spherical shells or flattened domes of a workpiece, or, for example, a ball joint, using a tool having a machining stone with a workpiece receiver, a first drive for an oscillating motion about a first axis of the workpiece, a tool holder and a second drive for an oscillating motion about a second axis of the tool holder, whereby the axes are an angle to one another. | 2010-01-07 |
20100003904 | High speed flat lapping platen, raised islands and abrasive beads - A rotatable abrasive lapper machine platen assembly is attached to a lapper machine frame. The assembly has at least:
| 2010-01-07 |
20100003905 | PORTABLE BELT GRINDER - The portable belt grinder | 2010-01-07 |