01st week of 2012 patent applcation highlights part 14 |
Patent application number | Title | Published |
20120001301 | ANNEALED WAFER, METHOD FOR PRODUCING ANNEALED WAFER AND METHOD FOR FABRICATING DEVICE - An annealed wafer obtained by performing rapid thermal annealing on a silicon single crystal wafer sliced from a silicon single crystal ingot in which an entire plane is an OSF region, an N region outside an OSF region, or a mixed region thereof, the silicon single crystal ingot being grown by the Czochralski method, in which RIE defects do not exist in a region having at least a depth of 1 μm from a surface, a good chip yield of a TDDB characteristic is 80% or more, and a depth of a region where an oxygen concentration is decreased due to outward diffusion is within 3 μm from the surface, and a method for producing an annealed wafer. | 2012-01-05 |
20120001302 | METHOD FOR FABRICATING SEMICONDUCTOR THIN FILM USING SUBSTRATE IRRADIATED WITH FOCUSED LIGHT, APPARATUS FOR FABRICATING SEMICONDUCTOR THIN FILM USING SUBSTRATE IRRADIATED WITH FOCUSED LIGHT, METHOD FOR SELECTIVELY GROWING SEMICONDUCTOR THIN FILM USING SUBSTRATE IRRADIATED WITH FOCUSED LIGHT, AND SEMICONDUCTOR ELEMENT USING SUBSTRATE IRRADIATED WITH FOCUSED LIGHT - An apparatus ( | 2012-01-05 |
20120001303 | SEMICONDUCTOR STRUCTURE HAVING LOW THERMAL STRESS AND METHOD FOR MANUFACTURING THEREOF - A semiconductor structure includes a Si substrate, a supporting layer and a blocking layer formed on the substrate and an epitaxy layer formed on the supporting layer. The supporting layer defines a plurality of grooves therein to receive the blocking layer. The epitaxy layer is grown from the supporting layer. A plurality of slots is defined in the epitaxy layer and over the blocking layer. The epitaxy layer includes an N-type semiconductor layer, a light-emitting layer and a P-type semiconductor layer. A method for manufacturing the semiconductor structure is also disclosed. | 2012-01-05 |
20120001304 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - There are provided a semiconductor device and a semiconductor device manufacturing method capable of preventing electrical leakage while suppressing increase of wiring resistance and deterioration of productivity. The semiconductor device manufacturing method for forming on a substrate a semiconductor device having a porous low-k film serving as an interlayer insulating film. Further, the semiconductor device manufacturing method includes forming the low-k film on the substrate; etching the low-k film to form a trench or a hole therein; reforming a surface of the low-k film exposed by etching the low-k film by allowing plasma of a nitro compound to act on the exposed surface within the trench or the hole; and filling the trench or the hole with a conductor. | 2012-01-05 |
20120001305 | Method of Manufacturing Vertical Pin Diodes - The invention concerns a method of manufacturing a vertical PIN diode comprising: providing an epitaxial wafer comprising a vertically stacked N-type layer, intrinsic layer and P-type layer; forming an anode contact of the vertical PIN diode by forming an anode metallization on a first portion of the P-type layer defining an anode region; forming an electrically insulating layer around the anode region such that a first portion of the intrinsic layer extends vertically between the N-type layer and the anode region and second portions of the intrinsic layer extend vertically between the N-type layer and the electrically insulating layer; forming a trench in the electrically insulating layer and in the second portions of the intrinsic layer so as to expose a portion of the N-type layer defining a cathode region and to define a sacrificial side-guard ring consisting of a portion of the electrically insulating layer that extends laterally between the trench and the anode region and laterally surrounds said anode region; and forming a cathode contact of the vertical PIN diode by forming a cathode metallization on the exposed portion of the N-type layer defining the cathode region. | 2012-01-05 |
20120001306 | SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES - A device is disclosed. The device includes a carrier substrate having first and second major surfaces. The first surface includes a die region and contact pads and the second surface includes package contacts. The carrier substrate includes a patterned lead frame which defines a line level with conductive traces and a via level with via contacts. The patterned lead frame provides interconnections between the contact pads and package contacts. The carrier substrate further includes a dielectric layer isolating the conductive traces and via contacts. The device includes a die mounted on the die region of the first surface. | 2012-01-05 |
20120001307 | Lead Frame and Method For Manufacturing the Same - A lead frame comprises: a base metal layer; a copper plating layer, including one of a copper layer and an alloy layer including a copper, configured to plate the based metal layer to make a surface roughness; and an upper plating layer, including at least one plating layer including at least one selected from the group of a nickel, a palladium, a gold, a silver, a nickel alloy, a palladium alloy, a gold alloy, and a silver alloy, configured to plate the copper plating layer. | 2012-01-05 |
20120001308 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME - In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal. | 2012-01-05 |
20120001309 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus according to aspects of the invention can include a metal base; resin case having a bonding plane facing metal base; a coating groove formed in bonding plane and holding adhesive for bonding resin case to metal base at a predetermined position, with the top plane of the wall that forms coating groove being spaced apart from the plane which contains bonding plane such that an escape space is formed between the metal base and the resin case; the escape space receiving the excess amount of adhesive which has flowed out from the coating groove; and a receiver groove communicating to the escape space and receiving securely the excess amount of adhesive which the escape space has failed to receive. If an excess amount of adhesive too much for the receiver groove to receive is coated, the excess amount of adhesive can be received in a stopper groove. | 2012-01-05 |
20120001310 | PACKAGE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE - A package for a semiconductor device according to the present invention includes at least one through hole | 2012-01-05 |
20120001311 | PACKAGE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE - In a package for a semiconductor device according to the present invention, steps | 2012-01-05 |
20120001312 | PACKAGE FOR SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE - In a package for a semiconductor device according to the present invention, coating resin | 2012-01-05 |
20120001313 | SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND STACKED DIE - A two tier power module has, in one form thereof, a PC board having upper and lower traces with an opening in the insulating material that contains a power device which has upward extending solder bump connections. An upper leadframe is mounted on the solder bumps and the upper tracks of the PC board. Vias in the PC board connect selected upper and lower traces. A control device is mounted atop the leadframe and wire bonded to the leadframe, and the assembly is encapsulated leaving exposed the bottom surfaces of the lower traces of the PC board as external connections. In another form the PC board is replaced by a planar leadframe and the upper leadframe has stepped sections which make connections with the planar leadframe, the bottom surfaces of the planar leadframe forming external connections of the module. | 2012-01-05 |
20120001314 | MULTI-CHIP PACKAGE WITH THERMAL FRAME AND METHOD OF ASSEMBLING - A semiconductor device includes a substrate having a plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice are stacked on the bonding surface of the substrate to form a die stack. Each die has a plurality of die bonding pads arranged along at least one bonding edge thereof. The remaining edges of each die are non-bonding edges. A plurality of bonding wires each electrically connects one of the die bonding pads to one of the substrate bonding pads. At least one thermally conductive layer is disposed between two adjacent semiconductor dice. At least one thermally conductive lateral portion is in thermal contact with the at least one layer of thermally conductive material. Each thermally conductive lateral portion is arranged along a non-bonding edge of the die stack. | 2012-01-05 |
20120001315 | SEMICONDUCTOR DEVICE - A semiconductor package includes a print circuit part, a lower chip, an upper chip, a thermal conductivity part, and an encapsulation resin. The lower chip and the upper chip are mounted on the print circuit part through wire bonding connection. The thermal conductivity part efficiently dissipates heat from the chips to the outside of the package. The encapsulation resin entirely seals the package while exposing the thermal conductivity part. A adhesive sheet is hardened to form a bonding layer between the thermal conductivity part and the upper chip, a bonding layer between the semiconductor chips, and a bonding layer between the semiconductor chip and the wired component. The configuration contributes to miniaturization, high integration, and heat resistance reduction of a semiconductor package using high-heat-generating ICs. | 2012-01-05 |
20120001316 | Package for High Power Devices - A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resistive shunt. Plural packages may be formed in a DBC card and may be separated individually or in clusters. The individual packages are mounted in various arrays on a support DBC board and heat sink. Integrated circuits may be mounted on the assembly and connected to the die for control of the die conduction. | 2012-01-05 |
20120001317 | POWER SEMICONDUCTOR MODULE HAVING LAYERED INSULATING SIDE WALLS - A power semiconductor module includes at least two interconnected power semiconductor units having actuatable power semiconductors, a module housing in which the power semiconductor units are disposed and which has an electrically insulating side wall, and at least one connection bus extended through the side wall and connected to at least one of the power semiconductor units. High explosion resistance and particularly inexpensive production are provided by forming the insulating side wall as a stack of insulating and partial elements constructed as a single piece, in which contact areas of the partial elements contact each other. | 2012-01-05 |
20120001318 | SEMICONDUCTOR DEVICE - A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together. | 2012-01-05 |
20120001319 | FLUID COOLED ENCAPSULATED MICROELECTRONIC PACKAGE - An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips. | 2012-01-05 |
20120001320 | SUBSTRATE PROCESSING INCLUDING A MASKING LAYER - Methods for substrate processing are described. The methods include forming a material layer on a substrate. The methods include selecting constituents of a molecular masking layer (MML) to remove an effect of variations in the material layer as a result of substrate processing. The methods include normalizing the surface characteristics of the material layer by selectively depositing the MML on the material layer. | 2012-01-05 |
20120001321 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OF SAME - A method for manufacturing a semiconductor device, includes: forming a first metal layer on a semiconductor substrate, the semiconductor substrate including a diffusion layer; forming an insulating layer having an opening on the first metal layer; forming a second metal layer on the first metal layer in the opening of the insulating layer; removing the insulating layer; covering an exposed surface of the second metal layer with a third metal layer, the third metal layer including a metal having an ionization tendency lower than that of the second metal layer; and forming an electrode interconnect including the first metal layer, the second metal layer, and the third metal layer by removing the first metal layer using the third metal layer as a mask. | 2012-01-05 |
20120001322 | DOUBLE MOLDED CHIP SCALE PACKAGE - Chip scale semiconductor packages and methods for making and using the same are described. The chip scale semiconductor packages (CSPs) contain a die with an integrated circuit device, a patterned plating layer, and a second interconnect structure formed from a Cu etched substrate that has a portion of an upper surface connected to the patterned plating layer, a side surface, and a bottom surface. The die can be attached to the patterned plating layer by a first interconnect structure that uses wirebonding or that uses a flip chip attachment process. The CSP contains a double molded structure where a first molding layer encapsulates the die, the patterned plating layer, the first interconnect structure, and the upper surface of the second interconnect structure. The second molding layer encapsulates the side surface of the second interconnect structure without encapsulating the bottom surface of the second interconnect structure. With such a configuration, the second molding layer helps control warpage during the manufacturing process and no printed circuit board (PCB) substrate is needed when the package is used in an electronic device since the signal routing is performed by the second interconnect structure. Other embodiments are described. | 2012-01-05 |
20120001323 | Semiconductor Device Including Ultra Low-K (ULK) Metallization Stacks with Reduced Chip-Package Interaction - In complex semiconductor devices, sophisticated ULK materials may be used in metal line layers in combination with a via layer of enhanced mechanical stability by increasing the amount of dielectric material of superior mechanical strength. Due to the superior mechanical stability of the via layers, reflow processes for directly connecting the semiconductor die and a package substrate may be performed on the basis of a lead-free material system without unduly increasing yield losses. | 2012-01-05 |
20120001324 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - In one embodiment, a semiconductor device includes a circuit substrate, and first and second semiconductor chips mounted on it. The first semiconductor chip and the second semiconductor chip are flip-chip connected, and an underfill resin is filled between them. The underfill resin has a fillet portion. A thickness T | 2012-01-05 |
20120001325 | Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP - A semiconductor device has a stress relief buffer mounted to a temporary substrate in locations designated for bump formation. The stress relief buffer can be a multi-layer composite material such as a first compliant layer, a silicon layer formed over the first compliant layer, and a second compliant layer formed over the silicon layer. A semiconductor die is also mounted to the temporary substrate. The stress relief buffer can be thinner than the semiconductor die. An encapsulant is deposited between the semiconductor die and stress relief buffer. The temporary substrate is removed. An interconnect structure is formed over the semiconductor die, encapsulant, and stress relief buffer. The interconnect structure is electrically connected to the semiconductor die. A stiffener layer can be formed over the stress relief buffer and encapsulant. A circuit layer containing active devices, passive devices, conductive layers, and dielectric layers can be formed within the stress relief buffer. | 2012-01-05 |
20120001326 | Semiconductor Package and Method of Forming Similar Structure for Top and Bottom Bonding Pads - A semiconductor device includes a first semiconductor die. A plurality of conductive vias is formed around the first semiconductor die. A first conductive layer is formed over a first surface of the first semiconductor die and electrically connects to the plurality of conductive vias. A second conductive layer is formed over a second surface of the first semiconductor die opposite the first surface and electrically connects to the plurality of conductive vias. A first passivation layer is formed over the first surface and includes openings that expose the first conductive layer. A second passivation layer is formed over the second surface and includes openings that expose the second conductive layer. Bonding pads are formed within the openings in the first and second passivation layers and are electrically connected to the first and second conductive layers. An interconnect structure is disposed within the openings in the first and second passivation layers. | 2012-01-05 |
20120001327 | Ball Grid Array with Improved Single-Ended and Differential Signal Performance - An improved system and method for assigning power and ground pins and single ended or differential signal pairs for a ball grid array semiconductor package. In certain embodiments, the system uses a hexagonal pattern where the grid may be represented by a multiplicity of nested hexagonal patterns. | 2012-01-05 |
20120001328 | CHIP-SIZED PACKAGE AND FABRICATION METHOD THEREOF - A chip-sized package and a fabrication method thereof are provided. The method includes forming a protection layer on an active surface of a chip and attaching a non-active surface of the chip to a carrier made of a hard material; performing a molding process and removing a protection layer from the chip; performing an RDL process to prevent problems as encountered in the prior art, such as softening of adhesive films, an encapsulant overflow, a pliable chip and chip deviation or contamination caused by directly adhering the active surface of the chip to the adhesive film that may even lead to inferior electrical contacts between a circuit layer and a plurality of chip bond pads during subsequent RDL process, and cause the package to be scraped. Further, the carrier employed in this invention can be repetitively used in the process to help reduce manufacturing costs. | 2012-01-05 |
20120001329 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package and a method for fabricating the same. The semiconductor package includes a first substrate including a first pad, a second substrate spaced apart from the first substrate and where a second pad is formed to face the first pad, a first bump electrically connecting the first pad to the second pad, and a second bump mechanically connecting the first substrate to the second substrate is disposed between the first substrate where the first pad is not formed and the second substrate where the second pad is not formed. A coefficient of thermal expansion (CTE) of the second bump is smaller than that of the first bump. | 2012-01-05 |
20120001330 | Semiconductor Device Comprising Through Hole Vias Having a Stress Relaxation Mechanism - In a semiconductor device, through hole vias or through silicon vias (TSV) may be formed so as to include an efficient stress relaxation mechanism, for instance provided on the basis of a stress relaxation layer, in order to reduce or compensate for stress forces caused by a pronounced change in volume of the conductive fill materials of the through hole vias. In this manner, the high risk of creating cracks and delamination events in conventional semiconductor devices may be significantly reduced. | 2012-01-05 |
20120001331 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor device includes a plurality of first interconnects, a second interconnect, a third interconnect, and a plurality of conductive members. The plurality of first interconnects are arranged periodically to extend in one direction. The second interconnect is disposed outside a group of the plurality of first interconnects to extend in the one direction. The third interconnect is provided between the group and the second interconnect. The plurality of conductive members are disposed on a side opposite to the group as viewed from the second interconnect. A shortest distance between the first interconnect and the third interconnect, a shortest distance between the third interconnect and the second interconnect, and a shortest distance between the first interconnects are equal. A shortest distance between the second interconnect and the conductive member is longer than the shortest distance between the first interconnects. | 2012-01-05 |
20120001332 | Semiconductor Device and Manufacturing Method Thereof - A semiconductor film having an impurity region to which at least an n-type or p-type impurity is added and a wiring are provided. The wiring includes a diffusion prevention film containing a conductive metal oxide, and a low resistance conductive film over the diffusion prevention film. In a contact portion between the wiring and the semiconductor film, the diffusion prevention film and the impurity region are in contact with each other. The diffusion prevention film is formed in such a manner that a conductive film is exposed to plasma generated from a mixed gas of an oxidizing gas and a halogen-based gas to form an oxide of a metal material contained in the conductive film, the conductive film in which the oxide of the metal material is formed is exposed to an atmosphere containing water to be fluidized, and the fluidized conductive film is solidified. | 2012-01-05 |
20120001333 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Provided are a semiconductor device and a method of fabricating the semiconductor memory device. A contact plug is formed by wet etching. An aspect ratio of SAC is decreased and SAC fail is reduced so that a process margin is secured. The semiconductor device includes a semiconductor substrate comprising an active region and a device isolation layer defining the active region, a conductive pattern formed on the semiconductor substrate, and a nitride layer formed on the semiconductor substrate perpendicularly to the conductive pattern. | 2012-01-05 |
20120001334 | Structure and Process for the Formation of TSVs - An integrated circuit structure includes a semiconductor substrate; an interconnect structure over the semiconductor substrate, wherein the interconnect structure comprises a top inter-metal dielectric (IMD); an opening penetrating the interconnect structure into the semiconductor substrate; a conductor in the opening; and an isolation layer having a vertical portion and a horizontal portion physically connected to each other. The vertical portion is on sidewalls of the opening. The horizontal portion is directly over the interconnect structure. The integrated circuit structure is free from passivation layers vertically between the top IMD and the horizontal portion of the isolation layer. | 2012-01-05 |
20120001335 | Semiconductor Device and Manufacturing Method Thereof - Provided is a method for manufacturing a semiconductor device having favorable electric characteristics with a high yield. A groove and/or a contact hole reaching a semiconductor region or a conductive region is formed in an insulating film covering the semiconductor region or the conductive region; a first conductive film is formed in the groove and/or the contact hole; the first conductive film is exposed to plasma generated from a mixed gas of an oxidizing gas and a halogen-based gas and to an atmosphere containing water to be fluidized partially or entirely; and a second conductive film is formed over the first conductive film. | 2012-01-05 |
20120001336 | CORROSION-RESISTANT COPPER-TO-ALUMINUM BONDS - A connection formed by a copper wire ( | 2012-01-05 |
20120001337 | Alignment Mark and Method of Formation - In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess. | 2012-01-05 |
20120001338 | OPENING STRUCTURE - An opening structure is disclosed. The opening structure includes: a semiconductor substrate; at least one dielectric layer disposed on the semiconductor substrate, wherein the dielectric layer has a plurality of openings exposing the semiconductor substrate, and each of the openings has a sidewall; a dielectric thin film covering at least a portion of the sidewall of each of the openings; an etch stop layer disposed between the semiconductor substrate and the dielectric layer and extending partially into the openings to isolate the dielectric thin film from the semiconductor substrate; and a metal layer filled in the openings. | 2012-01-05 |
20120001339 | BUMPLESS BUILD-UP LAYER PACKAGE DESIGN WITH AN INTERPOSER - The present disclosure relates to the field of integrated circuit package design and, more particularly, to packages using a bumpless build-up layer (BBUL) designs. Embodiments of the present description relate to the field of fabricating microelectronic packages, wherein an interposer, such as a through-silicon via interposer, may be used in a bumpless build-up layer package to facilitate stacked microelectronic components. | 2012-01-05 |
20120001340 | METHOD AND SYSTEM FOR ALIGNMENT OF INTEGRATED CIRCUITS - Alignment for electronic devices using a template having holes to align the protrusions of one or more integrated circuits. There are least one integrated circuit having a plurality of protrusions arranged in a protrusion pattern. There is a template with holes disposed on the integrated circuit, wherein at least some of the holes are arranged in the protrusion pattern and the holes are disposed onto the protrusions such that a portion of the protrusions extends from the template. There is an interconnect disposed on the template, wherein the interconnect has a plurality of electric contacts, wherein at least some of the electrical contacts are arranged in the protrusion pattern, and wherein at least some of the electrical contacts are electrically coupled to at least some of the protrusions. | 2012-01-05 |
20120001341 | SEMICONDUCTOR DEVICE - The semiconductor device has a unit stack body including a plurality of units stacked on one another. Each unit includes a power terminal constituted of a lead part and a connection part. The connection part is formed with a projection and a recess. When the units are stacked on one another, the projection of one unit is fitted to the recess of the adjacent unit, so that the power terminals of the respective unit are connected to one another. | 2012-01-05 |
20120001342 | SEMICONDUCTOR DEVICE - The reliability of a semiconductor device is improved. | 2012-01-05 |
20120001343 | Sophisticated Metallization Systems in Semiconductors Formed by Removing Damaged Dielectric Surface Layers After Forming the Metal Features - In sophisticated semiconductor devices, densely packed metal line layers may be formed on the basis of an ultra low-k dielectric material, wherein corresponding modified portions of increased dielectric constant may be removed in the presence of the metal lines, for instance, by means of a selective wet chemical etch process. Consequently, the metal lines may be provided with desired critical dimensions without having to take into consideration a change of the critical dimensions upon removing the modified material portion, as is the case in conventional strategies. | 2012-01-05 |
20120001344 | SEMICONDUCTOR DEVICE MANUFACTURE METHOD AND SEMICONDUCTOR DEVICE - A semiconductor device manufacture method includes: forming an insulating film above a semiconductor substrate; etching the insulating film to form a dummy groove having a first depth, a wiring groove having a second depth deeper than the first depth, and a via hole to be disposed on a bottom of the wiring groove; depositing a conductive material in the dummy groove, wiring groove and via hole and above the insulating film; and polishing and removing the conductive material above the insulating film. | 2012-01-05 |
20120001345 | THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is a three dimensional semiconductor device. The device may include mold layers vertically and sequentially stacked, a conductive pattern between the stacked mold layers, a plugging pattern vertically penetrating the stacked mold layers, an intermediate pattern between the conductive pattern and the plugging pattern, and protective layer patterns between the mold layers and the plugging pattern, wherein the protective layer patterns are separated by the intermediate pattern. | 2012-01-05 |
20120001346 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a word line, a bit line crossing the word line, an active region arranged in an oblique direction at the word line and the bit line, and a contact pad contacting the active region, where the contact pad extends in the oblique direction. | 2012-01-05 |
20120001347 | SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE - A semiconductor package includes a substrate, a first semiconductor chip stacked on the substrate and a second semiconductor chip stacked on the first semiconductor chip. In the semiconductor package, the second semiconductor chip is rotated to be stacked on the first semiconductor chip. The semiconductor package is used in an electronic system. | 2012-01-05 |
20120001348 | WAFER STACKED PACKAGE WAVING BERTICAL HEAT EMISSION PATH AND METHOD OF FABRICATING THE SAME - A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips. | 2012-01-05 |
20120001349 | METHOD OF MANUFACTURING SEMICONDUCTOR MODULES AND SEMICONDUCTOR MODULE - A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate. | 2012-01-05 |
20120001350 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not less than 40% in terms of area percentage and the content of a C≧4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor. | 2012-01-05 |
20120001351 | LOW PRESSURE GAS TRANSFER DEVICE - Certain embodiments of the present technology present a low pressure gas transfer device for transferring gas into a liquid stream. The gas transfer device has a primary pipe branch with a gas injector, and a secondary pipe branch intersecting the primary pipe branch. A liquid stream passing through the secondary pipe branch mixes with the liquid stream passing through the primary pipe branch. The primary outlet port delivers a dispersion stream that is a mixture of gas-injected liquid passing through the primary pipe branch and the secondary liquid stream passing through the secondary pipe branch. | 2012-01-05 |
20120001352 | Induced draft cooling tower - A cooling tower or, in alternate operation an evaporative condenser, is provided having a dry sensible or indirect heat exchange section and an evaporative heat exchange section. The dry sensible section includes a coil circuit through which a liquid to be cooled passes. The evaporative section is below the dry sensible section and may include a coil circuit or fill sheets. Modulating louvers are provided to allow the air flow and accordingly the evaporative loading to be varied between the dry sensible section and the evaporative section. | 2012-01-05 |
20120001353 | METHOD AND APPARATUS FOR THE DRY RELEASE OF A COMPLIANT OPHTHALMIC ARTICLE FROM A MOLD SURFACE - An apparatus for releasing a molded lens from a deformable mold includes a shear ring for temporarily retaining an annular portion of the deformable mold outside a periphery of the lens and a plunger for deforming an annular section of the deformable mold within the periphery of the lens. The apparatus can be employed to release a non-hydrated hydrogel lens from a deformable mold section. | 2012-01-05 |
20120001354 | MAKING NANOSTRUCTURED POROUS HOLLOW SPHERES WITH TUNABLE STRUCTURE - Hollow, porous, spherical metal-carbon composite particles, having nanostructures, are prepared from suitable precursor solutions containing metal-organic ligand coordination complexes with template. Such precursors may be made for each elemental metal to be in the spherical particles. The precursor solution is atomized as an aerosol in an inert gas stream and the aerosol stream heated to decompose the organic ligand portion of the precursor leaving the spherical metal-carbon composite or metal alloy-carbon composite particles. The organic ligand serves as a structure directing agent in the shaping of the spherical particles after the ligand has been removed. Other materials may also be used as permanent or removed templates. The morphology of the particles may be altered for an application by varying the preparation and composition of the metal precursor material, and the optional use of a template. | 2012-01-05 |
20120001355 | VARIABLE-ORIFICE PRILL PLATE - Prill heads having prilling assemblies that include adjustable openings. Prilling methods using the prilling assemblies can allow for the size of the openings to be varied during processing to alter the size of the prills as desired, or for clogged openings to be cleared, while maintaining operation of the prilling process. The prilling assemblies and prilling methods can be used to produce fertilizer products, including fertilizers comprising ammonium sulfate nitrate. | 2012-01-05 |
20120001356 | APPARATUS AND METHOD FOR CONTINUOUS PRODUCTION OF MATERIALS - Embodiments of a continuous-flow injection reactor and a method for continuous material synthesis are disclosed. The reactor includes a mixing zone unit and a residence time unit removably coupled to the mixing zone unit. The mixing zone unit includes at least one top inlet, a side inlet, and a bottom inlet. An injection tube, or plurality of injection tubes, is inserted through the top inlet and extends past the side inlet while terminating above the bottom outlet. A first reactant solution flows in through the side inlet, and a second reactant solution flows in through the injection tube(s). With reference to nanoparticle synthesis, the reactant solutions combine in a mixing zone and form nucleated nanoparticles. The nucleated nanoparticles flow through the residence time unit. The residence time unit may be a single conduit, or it may include an outer housing and a plurality of inner tubes within the outer housing. | 2012-01-05 |
20120001357 | MAKING NANOCRYSTALLINE MESOPOROUS SPHERICAL PARTICLES - Spherical particles of one or more elemental metals and carbon are prepared from a precursor in the form of a metal oleate. The metal oleate precursor is dispersed in a liquid vehicle and aerosol droplets of the dispersed precursor are formed in a stream of an inert gas. The aerosol droplets are heated in the stream to decompose the oleate ligand portion of the precursor and form spherical particles that have a mesoporous nanocrystalline structure. The open mesopores of the spherical particles provide a high surface area for contact with fluids in many applications. For example, the mesopores can be infiltrated with a hydrogen absorbing material, such as magnesium hydride, in order to increase the hydrogen storage capacity of the particles. | 2012-01-05 |
20120001358 | DRYING METHOD FOR CERAMIC GREENWARE - The present invention is directed to a method comprising a) placing wet ceramic greenware body on a carrying structure, and b) exposing the wet ceramic greenware body to conditions such that the liquid carrier in the ceramic greenware body is substantially removed; wherein the carrying structure contains a carrying sheet comprising a material which retains its shape under drying conditions, the carrying sheet having two flat parallel faces and a plurality of walls perpendicular to the flat parallel faces wherein the walls form a plurality of flow passages communicating between the two faces wherein the largest distance between any two walls in the carrying sheet is about 6 mm or less and the walls have a sufficient thickness to support the wet ceramic greenware body under drying conditions without deforming and the area of the flow passages measured parallel to the two faces is from about 60 to about 90 percent by volume. | 2012-01-05 |
20120001359 | ARTICLES COMPRISING FIBRES AND/OR FIBRIDS, FIBRES AND FIBRIDS AND PROCESS FOR OBTAINING THEM - The present invention relates to novel articles, especially non-woven articles comprising fibres and/or fibrids. It also relates to novel fibres and fibrids and to a process for obtaining these fibres and fibrids. | 2012-01-05 |
20120001360 | CONCRETE BLOCK MOLD WITH DIAMOND INSERT - A block mold for forming a block, comprising a bottom wall, a side wall movable relative to the bottom wall, and a textured material on the side wall (e.g., near a bottom portion of the side wall) and adapted to create a textured surface on the block when the side wall is moved relative to the bottom wall. The textured material comprises abrasive particles (e.g., ten to sixty micron diamond grain) in a matrix (e.g., nickel alloy). In one embodiment, opposing first and second side surfaces of the side wall form two adjacent mold cavities, and the first and second side surfaces each include textured material (e.g., on a lower portion of the respective side surface). Preferably, the side wall includes a side surface defining a plane, and the textured material is applied to the side surface to create the textured surface that protrudes from the plane. | 2012-01-05 |
20120001361 | PREPARATION OF COMPOSITIONS WITH ESSENTIALLY NONCRYSTALLINE EMBEDDED MACROLIDE ANTIBIOTICS - A description is given of a process for the preparation of a pharmaceutical composition of a macrolide antibiotic in essentially noncrystalline form, in which the macrolide antibiotic, a water-swellable polymer and a proton donor are blended in an extruder in the presence of water and forced through a die, the ratio by weight of the sum of macrolide antibiotic, water-swellable polymer and proton donor to water being at least 1:1. The macrolide antibiotic is preferably clarithromycin and the water-swellable polymer is preferably chosen from crosslinked polyvinylpyrrolidone, crosslinked sodium carboxymethylcellulose and crosslinked polyacrylic acid. | 2012-01-05 |
20120001362 | Spin pack assembly - A spin pack assembly for use in melt spinning elastic fibers. The spin pack assembly includes a circular breaker plate having a center aperture and several circular patterns of apertures with each circular pattern having a plurality of apertures. Each circular pattern is located concentrically about an axis of the center aperture. The apertures in the outer circular patterns have a greater diameter than the apertures in the inner circular patterns. The spin pack assembly also has a spinneret plate where the exit aperture of the spinneret plate is recessed in the body of the spin pack assembly. | 2012-01-05 |
20120001363 | STUFFING BOX FOR WALKING BEAM COMPRESSOR - Various methods and devices are provided for use in a walking beam compressor used with an oil well pump. In general, an injectable fibrous sealant is provided for use in a stuffing box to form a seal around a piston rod that couples to a walking beam for pumping oil out of the ground. The injectable fibrous sealant can be configured to form a gas tight seal around the piston rod, while allow reciprocal longitudinal movement of the piston rod therethrough. The injectable fibrous sealant is particularly advantageous as it has an extended life, eliminating the need to replace the seal, and repairs can be performed on-site by injecting additional sealant into the stuffing box. | 2012-01-05 |
20120001364 | Injection Molding Apparatus - The injection molding apparatus includes a first mold, a second mold, and a film having a micro pattern. The film contacts an injection molding material injected into a space defined by the first mold and the second mold. | 2012-01-05 |
20120001365 | CLAMPING DEVICE OF MICRO-NANO IMPRINT PROCESS AND THE METHOD THEREOF - The invention discloses a clamping device of the micro/nano imprint process and the method thereof for clamping a substrate. The clamping device comprises a first module, a second module and a locking module. The first module and the second module are used to accommodate and support at least one mold. The mold has a predetermined structure. The locking module is used to lock the first module and the second module. The clamping device drives the mold to imprint the substrate or the material layer of the substrate by a predetermined way. | 2012-01-05 |
20120001366 | METHOD OF MANUFACTURING A DRESSING - A therapeutic device for promoting the healing of a wound in a mammal is disclosed. An exemplary device comprises a permeable structure having a plurality of depressions formed in a surface thereof. In use, the surface having the depressions is disposed adjacent a surface of the wound. A method of manufacturing a therapeutic device for promoting the healing of a wound in a mammal comprising the steps of providing a permeable substrate, and forming a plurality of depressions into a surface of the permeable substrate to provide the therapeutic device. A method of treating a wound comprises: providing a permeable structure comprising a plurality of randomly disposed fibers and having i) a plurality of wound surface contact elements disposed between end portions of the structure, and ii) a plurality of voids defined by the contact elements; and applying the permeable structure to at least one surface of the wound. | 2012-01-05 |
20120001367 | METHOD FOR PRODUCING POLYIMIDE FILM - A method for producing a polyimide film comprises the steps of: preparing a polar organic solvent solution of a polyimide precursor obtained by mixing a tetracarboxylic acid dianhydride compound and a diamine compound; adding a dehydrating agent and an imidization catalyst to the polar organic solvent solution so as to prepare a resin solution composition; and drying the resin solution composition by heating so as to imidize the resin solution composition after flowing the resin solution composition onto a support in a casting manner, wherein diethyl pyridine is used as the imidization catalyst. According to the production method, it is possible to obtain a polyimide film which is highly productive and is excellent in the film quality such as the mechanical property, the adhesive strength, and the like. | 2012-01-05 |
20120001368 | METHOD FOR PRODUCING ANISOPTROPIC BULK MATERIALS - A method is disclosed for manufacturing an anisotropic material comprising providing a viscoplastic material having a yield stress, and a plurality of magnetic particles disposed therein, and then subjecting the viscoplastic material to a magnetic field for a time sufficient to at least partially align at least a portion of the magnetic particles to at least one of a predetermined position or orientation. Also disclosed is an article having anisotropic properties comprising a viscoplastic material, and a plurality of magnetic particles distributed therein and at least partially aligned to a predetermined orientation. An article having anisotropic properties, comprising a fixed viscoplastic material, and a plurality of magnetic particles distributed and at least partially anisotropically aligned in the fixed viscoplastic material is disclosed. | 2012-01-05 |
20120001369 | Sol-Gel Composition for Fabricating Conductive Fibers - Disclosed herein are sol-gel compositions for fabricating conductive fibers in an electrospinning process and methods for producing the same. | 2012-01-05 |
20120001370 | PRESSURE ADJUSTMENT DEVICE IN STRETCH BLOW MOULDING MACHINES - A pressure adjustment device applicable in particular, but not exclusively, to stretch blow moulding machines. More particularly, the invention relates to a pressure adjustment device for stretch blow moulding machines of containers made of plastic material. The device includes an opening for dispensing a blowing fluid, a hollow body having a first inlet opening for a high pressure fluid and a second inlet opening for a piloting fluid. A shutter is slidably arranged within the hollow body, the shutter being held in a closed position by elastic means, wherein the adjustable opening of the shutter occurs, in contrast with the elastic means, by introducing—through said second inlet opening—the piloting fluid into a piloting chamber arranged between the hollow body the shutter, and wherein the piloting fluid has a controlled and adjustable pressure. | 2012-01-05 |
20120001371 | Method for Producing a Ceramic Filter Element - The invention relates to a method for producing a ceramic filter element in an exhaust gas filter for internal combustion engines, wherein a wound paper element that comprises flow channels on one or both sides that are sealed on alternating sides with a ceramic plugging is formed, soaked with a ceramic slip, and then dried and sintered. The ceramic plugging is applied with an inward offset from the end face of the wound paper element. | 2012-01-05 |
20120001372 | REFRACTORY CERAMIC PLUG - The invention relates to a refractory ceramic plus for regulating a metal melt flowing past in the region of an outlet opening of a metallurgical melting vessel, for example of a tundish. | 2012-01-05 |
20120001373 | SEGMENTED ELASTOMERIC VIBRATION MOUNT WITH EDGE CONTROL - A mount assembly has a plurality of elastomeric members having a separator plate disposed between adjacent elastomeric members. The separator plate defines a flange which extends toward an adjacent separator plate to confine the elastomeric layer. A mounting plate is located at both ends of the mount assembly and can be used to attach the mount assembly to two components. | 2012-01-05 |
20120001374 | CYLINDRICAL ELASTIC MEMBER, STRUT MOUNT, AND PRODUCTION METHOD FOR SAID STRUT MOUNT - A cylindrical elastic member for connecting an inner cylindrical section attached to an operating axis as an axial center to an outer cylindrical section arranged outside the inner cylindrical section concentrically therewith, so as to be apart from the inner cylindrical section and surround the section, the member comprising a non-foamed elastic body and a foamed elastic body, about which in a contacting-surface of the member with the inner cylindrical section, at least a contacting-surface area with an outer circumferential end-region of the inner cylindrical section comprises the non-foamed elastic body, and in a contacting-surface of the member with the outer cylindrical section, at least contacting-surface areas with both operating-axis-direction inside surfaces of the outer cylindrical section each comprise the foamed elastic body. | 2012-01-05 |
20120001375 | DEVICE FOR REMOVING CLAMPING BLOCK MADE OF RESIN AND DEVICE FOR CLAMPING CLAMPING BLOCK MADE OF RESIN - When, while a resin-made clamping block molded to cover a part of a turbine blade is placed on a seat part, paired sliders disposed on opposite sides of the seat part are made to move closer to the resin-made clamping block, paired wedge members provided respectively on the paired sliders engage with notches formed respectively in paired side surfaces, opposed to each other, of the resin-made clamping block to generate cracks. Accordingly, it is possible to divide the resin-made clamping block into at least two pieces and to reliably remove the resin-made clamping block from the turbine blade. Furthermore, since the resin-made clamping block is not broken by a mechanical strike, there is no fear that the turbine blade might be damaged due to an erroneous setting of the strike force. | 2012-01-05 |
20120001376 | Combined Plastic Chopping Board Structure - A combined plastic chopping board structure includes an upper chopping board, a lower chopping board, and a base. The upper and lower chopping boards have a geometric shape in any color. The upper and lower chopping boards have pattern holes or first hanging holes thereon. The base is integrally formed with the upper and lower chopping boards by injection. The base has a protruding pattern to engage with the pattern holes of the upper and lower chopping boards and a second hanging hole corresponding to the first hanging holes. The upper and lower chopping boards are in different colors and have the pattern holes for identification with ease. The base can be coupled with the upper chopping board or the lower chopping board only to become a one-piece chopping board having two faces in different colors to lower the cost. | 2012-01-05 |
20120001377 | IMAGE FORMING APPARATUS, SHEET FEED CONTROL METHOD, AND STORAGE MEDIUM - An image forming apparatus capable of printing a non-standard size image on a sheet of a size as desired by the user as possible, and preventing stoppage of printing the image even when there is no sheet of the size desired by the user in a sheet feeder. When image data is for a non-standard size, if there is a sheet feeder accommodating recording sheets of which vertical and lateral lengths corresponding to vertical and lateral lengths represented by the image data are designated, a control unit feeds the sheets from the sheet feeding cassette. If there is no such a sheet feeder, the control unit feeds recording sheets of a free size from a manual feed tray accommodating the recording sheets of the free size. | 2012-01-05 |
20120001378 | IMAGE RECORDING APPARATUS - An image recording apparatus according to one aspect comprises: a first tray disposed within an opening of a main body to allow a recording medium to be placed thereon; a second tray disposed above the first tray, the second tray having a second end portion located on a side of the opening; a conveying unit; and a recording unit. The second tray is movable between a first posture and a second posture. When the second tray is in the first posture, a top surface of the second tray in the vicinity of the second end portion is positioned at a predetermined height relative to the first tray. When the second tray moves from the first posture to the second posture, the top surface in the vicinity of the second end portion is moved toward the first tray. | 2012-01-05 |
20120001379 | SHEET SEPARATION MECHANISM AND IMAGE FORMING APPARATUS - A sheet separation mechanism includes a separation claw holder, a separation claw, a first coil spring and a second coil spring. The separation claw holder can be provided at a predetermined place in the image forming apparatus. The separation claw includes a separation claw base pivotally supported by the separation claw holder and a separation claw front-end pivotally supported by the separation claw base. The first coil spring is configured to apply a force to rotate the separation claw base toward an intermediate transfer belt. The second coil spring is configured to apply a force to rotate the separation claw front-end toward the intermediate transfer belt. | 2012-01-05 |
20120001380 | SHEET REMAINING AMOUNT DETECTION DEVICE AND IMAGE FORMING APPARATUS - A sheet feeder includes a tray on which sheets are to be placed, a rope connected to the tray, a pulley which includes a shaft and on which the rope is taken up such that the winds thereof are aligned in an axial direction of the shaft, and a motor for moving the tray upward by rotating the pulley about the shaft in a direction to take up the rope to locate the uppermost sheet on the tray at a sheet pickup position. A sheet remaining amount detection device applied to this sheet feeder includes a position detector for detecting a present position which is a present take-up position of the rope on the pulley in the axial direction, and a remaining amount detecting section for detecting the remaining amount of the sheets on the tray based on the present position detected by the position detector. | 2012-01-05 |
20120001381 | DAMPER MEMBER, TRANSPORT UNIT, AND RECORDING UNIT - A damper member moves a stopper after a delay in time from a restricting position, at which the stopper restricts the movement of paper, to a releasing position, at which the restriction on the movement is released; the damper member includes a base having a first sliding surface along the paper movement direction and also includes a slider, having a second sliding surface facing the first sliding surface through a viscous material, that slides between a first position at which the stopper is placed at the restricting position and a second position at which the stopper is placed at the releasing position; when at least the slider slides and reaches the first position or the second position, a clearance area is formed in the base to store a viscous material, at a position corresponding to the front end in the sliding direction of the slider. | 2012-01-05 |
20120001382 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveying apparatus includes a conveying portion which conveys a sheet, a lever which is pushed by the sheet conveyed by the conveying portion, and moves from a standby position, a detecting portion which generates a signal corresponding to a position of the lever, and generates a first signal when the lever moves in a first moving area from the standby position to a predetermined position and generates a second signal when the lever moves in a second moving area beyond the predetermined position, and a biasing portion which does not apply to the lever a biasing force when the lever is in the first moving area, and applies to the lever a biasing force opposite in a direction in which the lever is pushed by the sheet and moves when the lever is in the second moving area. | 2012-01-05 |
20120001383 | LOW COST ACTUATED IDLER NIP ASSEMBLY INTEGRATING NIP LOADING AND SUPPORT - This invention is a sheet handling assembly that incorporates the use of combined functions by using a passive-fixed flat spring to produce a nips load and nip release while simultaneously providing a nip support and mounting. | 2012-01-05 |
20120001384 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveying apparatus of the present invention includes an apparatus body, a conveyance unit which is movably supported by the apparatus body toward an outside of the apparatus body, and includes a sheet conveying path, a conveying guide which forms the sheet conveying path, and is rotatably supported on the conveyance unit wherein in a state that the conveyance unit moves to the outside, the conveying guide can be held in an opening position where the sheet conveying path is opened, and an interlock portion which causes a closure of the conveying guide held in the opening position through interlocking with an operation of mounting the conveyance unit in the apparatus body. | 2012-01-05 |
20120001385 | SHEET STACKING APPARATUS AND IMAGE FORMING APPARATUS - An image forming apparatus has a sheet stacking apparatus including a tray on which sheets are stacked, and an aligning member aligning the sheets stacked on the tray. The aligning member aligns sheets stacked, on a sheet previously stacked on the tray, with a displacement in an aligning direction of the aligning member with respect to the sheet previously stacked. An aligning operation of the aligning member is changed on the basis of whether or not the number of the sheets stacked on the sheets previously stacked is a predetermined number or less. | 2012-01-05 |
20120001386 | IMAGE FORMING APPARATUS - An image forming apparatus includes a main body, a sheet conveyance apparatus, and a control unit. The main body includes an image forming unit to form an image on a sheet. The sheet conveyance apparatus and the main body are detachable from each other and the sheet conveyance apparatus may convey the sheet to the image forming unit. The sheet conveyance apparatus includes a sheet conveyance path through which the sheet passes and a detection unit. The detection unit includes light emitting and receiving units that transmit light across the sheet conveyance path therebetween. The detection unit detects a reference and an edge position of the conveyed sheet in a width direction of the sheet orthogonal to a sheet conveyance direction. The control unit determines a position of the sheet based on detections of the reference and the edge position of the conveyed sheet by the detection unit. | 2012-01-05 |
20120001387 | PRINTING SYSTEM, SHEET PROCESSING METHOD IN THE PRINTING SYSTEM, AND STORAGE MEDIUM - A sheet processing method in a printing system constituted by a sheet processing apparatus including a plurality of paper discharge trays having different sheet stacking capacities, to any of whose paper discharge trays a printed sheet is discharged, and a printing apparatus includes setting which of the paper discharge trays is used first for discharging the sheet, specifying the number of remaining pages of sheets to be discharged by a job to be executed, and executing control for discharging the sheets starting from a paper discharge tray different from the set paper discharge tray according to the specified number of remaining pages and a restriction on a stacking amount on each paper discharge tray. | 2012-01-05 |
20120001388 | SPHERICAL PUZZLE - A spherical puzzle for learning knowledge about geography is disclosed. The spherical puzzle comprises a sphere and a plurality of puzzle pieces. The puzzle pieces can be arranged on the sphere by a user and are held to the sphere by magnetism. The puzzle pieces are formed in the shape of specific land masses and/or water masses. A base is provided for holding the sphere and allows the sphere to be rotated or turned. | 2012-01-05 |
20120001389 | SPHERICAL PUZZLE - A spherical puzzle for learning knowledge about geography is disclosed. The spherical puzzle comprises a plastic sphere and a plurality of plastic puzzle pieces. The plastic puzzle pieces are arranged on the plastic sphere by a user and are held to the sphere by magnetism. The puzzle pieces are formed in the shape of specific land masses. Metal mesh is provided on either the plastic puzzle pieces or the plastic sphere to attract magnets on the puzzle pieces or the plastic sphere. A base is provided for holding the sphere and allows the sphere to be rotated or turned. | 2012-01-05 |
20120001390 | GAME, METHOD OF PLAY, AND STACKABLE MEMBERS SUCH AS CARDS WHICH MAY BE USED FOR A GAME - In an aspect, the invention is directed to a set of game pieces including a character game piece representing a character and a plurality of parameter impact game pieces. Each of the parameter impact game pieces includes a parameter impact indicator. When a parameter impact game piece is stacked on the character game piece the parameter impact indicator provides a graphic representation of the parameter impact carried out by the parameter impact game piece. When another parameter impact game piece is stacked on the first parameter impact game piece a graphic representation of the total parameter impact carried out by both parameter impact game pieces is provided by permitting the parameter impact indicators from both parameter impact game pieces to be visible to the players. In this way, the parameter impact level incurred by the character can be shown to increase incrementally after subsequent parameter impacts. | 2012-01-05 |
20120001391 | STRIKING DEVICES FOR PRIZE-WINNING GAME MACHINES - A striking device for a prize-winning game machine is disclosed, primarily comprising a striking head, an X-Z axis moving mechanism, and a Y-axis striking mechanism. The moving mechanism comprises two symmetrically disposed X-axis guiding rails and a Z-axis guiding rail where both ends of the Z-axis guiding rail are movably connected at X-axis guiding rails. The Y-axis striking mechanism can movably connected at the Z-axis guiding rail and comprises a Y-axis guiding rail and a striking rod moving along and disposed on the Y-axis guiding rail. The striking rod is off-axis aligned and connected to a back surface of the striking head for striking the targets in the prize-winning game machine. Therefore, the Y-axis striking mechanism will not be tilted or shifted during numerous striking operations to greatly increase the durations of the striking head and the striking mechanism. | 2012-01-05 |
20120001392 | PROJECTILE AND TARGET GAME - A game of skill is disclosed where two teams of one or more players take turns trying to bounce disc-shaped projectiles through an opening in the top wall of the opposing side's generally wedge-shaped target. Points are scored when a projectile lands on the top wall of the target or goes through the opening in the top wall and lands within the target. | 2012-01-05 |
20120001393 | DEFORMABLE COMPOSITE PLUG - Deformable plugs, fluid seals formed from a deformable plug, and methods for sealing a hole with a deformable plug, are provided herein. In some embodiments, the deformable plug includes a resinous composite that expands and solidifies upon exposure to a catalyst. A carrier with a compressible body configured to embed within a hole is impregnated with the resinous composite. The fluid seal can be formed from a carrier with a porous body that is compressively embedded within a hole. The carrier is impregnated with a resinous composite that expands and solidifies upon exposure to a catalyst. One or more anchors are formed from the resinous composite after being exposed to the catalyst. The anchors retain the carrier inside the hole. | 2012-01-05 |
20120001394 | Mechanical Seal Device - Provided is a mechanical sealing device which is simply configured and wherein a rotation ring can be stably held in a specified axial position, and warping of the sealed surfaces can be prevented, thereby making it possible to obtain appropriate sealing characteristics. In a mechanical sealing device, a rotation ring is axially held between a rotation ring locking surface of a sleeve and a rotation ring locking surface of a collar. Furthermore, the sleeve, the rotation ring fixing collar, and the rotation ring are integrated together by means of a baffle knock pin for the rotation ring. Due to the above, whether positive pressure or negative pressure is applied, the rotation ring does not move, nor do the sealed surfaces of the rotation ring become warped. Moreover, assembly can be simply performed only by means of the knock pin. | 2012-01-05 |
20120001395 | SEAL ASSEMBLY - A seal assembly seals a first portion of a machine part relative to a second portion of the machine part. The seal assembly includes at least one seal element that contacts the machine part or contacts a component connected with the machine part or that extends with a gap relative to the machine part or to the component connected with the machine part. At least one of the seal element, the machine part and the component connected with the machine part is provided or coated with a material, which has super hydrophobic properties, in the area of the seal element. | 2012-01-05 |
20120001396 | Ice Skate Guard with Integrated Wheel and Brake System - An ice skate guard with an integrated wheel and brake system. The present invention with integrated wheel and brake system protects an ice skate blade by holding the blade inside the groove. Wheels on the ice skate guard with integrated wheels and brakes system allow the user to move freely on land. The brake system of the system allows users to lock the wheels when walking up a flight of stairs. | 2012-01-05 |
20120001397 | EXTRUDED TORQUE RODS - A light weight torque rod includes a first end joint assembly, a second end joint assembly and a connecting rod. The connecting rod is a non-ferrous material connecting rod that is produced by an extrusion process. The connecting rod is welded to the first and second end joint assemblies using a welding process which produces a full face weld. The first and second end joint assemblies can include an eye which is manufactured from an extrusion process and the eye can also be manufactured from a non-ferrous material. | 2012-01-05 |
20120001398 | KNUCKLE AND BUSHING ASSEMBLY - A suspension coupling for use in a vehicle suspension system the suspension coupling including a knuckle and bushing assembly wherein the knuckle member is a cast aluminum piece having a passage for receiving a two-piece bushing having a formed, metal inner member and a molded, elastomeric outer member having extension members at each end. The bushing member is press-fit into the knuckle member and exhibits higher stiffness in the radial and axial directions and lower stiffness in the torsional and conical directions. | 2012-01-05 |
20120001399 | SUSPENSION STRUT FOR A VEHICLE - A hydraulic strut system that damps vehicle vibration and includes a compressible fluid, a strut, and a valve plate. The strut includes three concentric tubes defining an inner cavity, an intermediary cavity, and an outer reservoir cavity, the inner cavity and intermediary cavity being fluidly coupled, wherein the inner cavity receives a piston that divides the inner cavity into a first volume and a second volume, the piston having an aperture that allows one way flow from the first volume to the second volume. The valve plate is removably coupled to the strut, and includes a first fluid path that allows one-way fluid flow from the intermediary cavity to the reservoir cavity, the first fluid path including a damping valve that damps fluid flowing therethorugh; and a second fluid path that allows one-way fluid flow from the reservoir cavity to the inner cavity, the second fluid path further including a replenishment valve. | 2012-01-05 |
20120001400 | TRICYCLE WITH FRONT AND REAR STEERING - A vehicle with front and rear steering is disclosed. The vehicle can be a cycle. The cycle includes a front wheel steered by a front hand-steering mechanism, and two back wheels steered by a back hand-steering mechanism. The back wheels are dual inclined casters with full rotational movement. A drive train forward of the front wheel drives the front wheel, while a rider is inclined in a seat in a recumbent orientation. The front and rear steering provides unlimited maneuverability and turning capabilities. | 2012-01-05 |