| Entries |
| Document | Title | Date |
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| 20080201093 | Assessment of Weather Damage in Cereal Grains - An NIR (near infra red) spectrum is obtained from a cereal grain sample and processed to deduce characteristics related to possible weather damage, for the purpose of assessing sample quality. In addition or alternatively, cereal grain is subjected to a compression test, for example to obtain data below the yield point of the shell of the grain, to determine state of any weather damage. An embodiment includes data processing to assess weather damage from data of NIR spectrum analysis and/or data from compression test analysis; a cross correlation is relevant where either of the NIR and compression tests alone are not sufficiently decisive. | 08-21-2008 |
| 20080221815 | Method and System for Concrete Quality Control Based on the Concrete's Maturity - A method and system for controlling and monitoring the quality of concrete based on the concrete's maturity (which is a function of its time-temperature profile, or temperature history). Five different applications or embodiments of the present invention are discussed, namely, Enhanced Maturity, Moisture-Loss Maturity, Improved Maturity, SPC Maturity, Loggers, Readers, and Software. Enhanced Maturity involves a maturity calibration method to account for the water-to-cementitious-materials ratio, air content, and gross unit weight of the concrete. Moisture-Loss Maturity is a method for determining the appropriate time to terminate moisture-loss protection of concrete and concrete structures. Improved Maturity is a method and system for determining the strength of curing concrete using improved maturity calculations. SPC Maturity is a method that beneficially couples maturity measurements and calculations with Statistical Process Control (SPC) methods to enable rapid recognition of changes to the concrete mix and/or incompatibilities between the various components of the concrete mix. Loggers, Readers, and Software represent the preferred embodiment for automating and simplifying the implementations of Enhanced Maturity, Moisture-Loss Maturity, Improved Maturity, and SPC Maturity. | 09-11-2008 |
| 20080228418 | Determination of time zero from a charged particle detector - A method, system and computer program is used to determine a linear track having a good fit to a most likely or expected path of charged particle passing through a charged particle detector having a plurality of drift cells. Hit signals from the charged particle detector are associated with a particular charged particle track. An initial estimate of time zero is made from these hit signals and linear tracks are then fit to drift radii for each particular time-zero estimate. The linear track having the best fit having the best fit is then search and selected and errors in fit and tracking parameters computed. The use of large and expensive fast detectors needed to time zero in the charged particle detectors can be avoided by adopting this method and system. | 09-18-2008 |
| 20080228419 | PROCESS CONDITION SENSING WAFER AND DATA ANALYSIS SYSTEM - A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. | 09-18-2008 |
| 20080234960 | Method and apparatus for inspecting and analyzing welded structures - An apparatus and method for inspecting and analyzing welded structures includes a laser for directing at least one beam of light at a weld bead to define at least one visible profile line; a camera directed at the weld bead for capturing an image of the at least one profile line and generating a usable image signal based on the image; and a preprogrammed microprocessor assembly configured for receiving the usable image signal and processing the signal as an image to determine a dimension of the weld bead defined along the at least one profile line and comparing the dimension of the weld bead with a predetermined dimension set point to determine the quality of the weld bead. | 09-25-2008 |
| 20080255786 | Optical metrology using support vector machine with profile parameter inputs - A structure formed on a semiconductor wafer can be examined using a support vector machine. A profile model of the structure is obtained. The profile model is defined by profile parameters that characterize the geometric shape of the structure. A training set of values for the profile parameters is obtained. A training set of simulated diffraction signals is generated using the training set of values for the profile parameters, each simulated diffraction signal characterizing the behavior of light diffracted from the structure. The support vector machine is trained using the training set of values for the profile parameters as inputs to the support vector machine and the training set of simulated diffraction signals as expected outputs of the support vector machine. A measured diffraction signal off the structure is obtained. A simulated diffraction signal is generated using a set of values for the profile parameters as inputs to the trained support vector machine. The measured diffraction signal is compared to the simulated diffraction signal. When the measured diffraction signal and simulated diffraction signal match within one or more matching criteria, values of profile parameters of the structure are determined to be the set of values for the profile parameters used to generate the simulated diffraction signal. | 10-16-2008 |
| 20080262768 | System and Method for Rating the Nutritional Quality of Food Items - The present application provides improved systems and methods for rating the nutritional quality of food. The method includes (a) determining the water free weight percentage of one or more macronutrients in the food item; (b) assigning a numerical influence factor to each of the macronutrients; (c) multiplying the water free weight percentage of each macronutrient by the influence factor of the macronutrient to calculate a nutrient and influence factor product for each macronutrient; and (d) summing the nutrient and influence factor products of the macronutrients to calculate a numerical rating for the food item. | 10-23-2008 |
| 20080270056 | WAFER-LEVEL RELIABILITY YIELD ENHANCEMENT SYSTEM AND RELATED METHOD - A yield enhancement system has a fabrication line with semiconductor fabrication devices for fabricating a wafer, an inspection and measurement monitoring system coupled to the fabrication line for determining process data corresponding to semiconductor fabrication devices, and a post-process testing line coupled to the fabrication line for performing in-line wafer-level testing. The post-process testing line includes a wafer acceptance tester, a yield monitor coupled to the wafer acceptance tester, and a wafer level reliability tester coupled to the wafer acceptance tester for estimating a life span of a device on the wafer. | 10-30-2008 |
| 20080275658 | Method and apparatus for reducing the effects of window clouding on a viewport window in a reactive environment - The present invention is directed to a method and apparatus for reducing the effects of window clouding on a viewport window in a reactive environment. One or more clouded viewport windows are obtained for testing, in which the clouding results from exposure to the reactive environment. The clouding typically appears as a coating film on the test windows. The clouded viewport windows are analyzed for one or more spectral regions having good transmission. The threshold level of light transmission is determined by the particular application in which the window is used. The spectral regions of good transmission are evaluated for their usefulness with a particular algorithm that will use the spectral data in a production environment. Spectral regions that cannot be evaluated using the subject algorithm are eliminated from consideration. Spectral regions that can be evaluated using the subject algorithm and exhibit low absorption are selected for monitoring in the production environment. | 11-06-2008 |
| 20080281541 | System and method for estimating reliability of components for testing and quality optimization - A system and method for determining the early life reliability of an electronic component, including classifying the electronic component based on an initial determination of a number of fatal defects, and estimating a probability of latent defects present in the electronic component based on that classification with the aim of optimizing test costs and product quality. | 11-13-2008 |
| 20080294361 | Intelligent execution system for the monitoring and execution of vaccine manufacturing - Intelligent execution systems and methods thereof used to monitor and execute a vaccine manufacturing process are disclosed herein. Consequently, the methods and systems provide a means to perform validation and quality manufacturing on an integrated level whereby vaccine manufacturers can achieve data and product integrity and ultimately minimize cost. | 11-27-2008 |
| 20080300809 | Defect inspecting method and device thereof - A defect inspecting method is provided. The defect inspecting method for inspecting a defect information of a target device includes steps of retrieving one of a whole image and a part of image of the target device; setting a plurality of conditions for a defect recognizing scheme; adjusting the plurality of conditions by a manual scheme; adjusting the plurality of conditions based on the retrieved image; and implementing the defect recognizing scheme based on the adjusted plurality of conditions for inspecting the target device, so as to obtain the defect information of the target device is provided. | 12-04-2008 |
| 20080306701 | COMPUTER-IMPLEMENTED METHODS, CARRIER MEDIA, AND SYSTEMS FOR DETECTING DEFECTS ON A WAFER BASED ON MULTI-CORE ARCHITECTURE - Computer-implemented methods, carrier media, and systems for detecting defects on a wafer based on multi-core architecture are provided. One computer-implemented method for detecting defects on a wafer includes acquiring output for the wafer generated by an inspection system. Dies are formed on the wafer, and multiple cores are formed in the dies. The method also includes detecting defects on the wafer by comparing the output for a first of the multiple cores to the output for a second of the multiple cores. The first and second of the multiple cores are formed in the same die, different dies, or the same die and different dies. | 12-11-2008 |
| 20080306702 | Method of Rating Wood Product Quality - The invention is a method of rating the quality of wood, such as solid wood panels and hardwood veneer faces. The method incorporates multiple and different criteria, reconciling them with each other to produce a cumulative rating. This enables samples having different quality profiles to be compared directly to each other by simply comparing their respective cumulative ratings. | 12-11-2008 |
| 20090006017 | Methods for testing ophthalmic lenses - What has been developed is a method for testing ophthalmic plastic lenses and ophthalmic plastic lens-making processes for compliance with federal safety performance requirements. The method of the invention provides an easier, less costly, and more effective means for complying with these safety performance requirements than what current methods provide. | 01-01-2009 |
| 20090030630 | OPTICAL INSPECTION TOOL FEATURING MULTIPLE SPEED MODES - An optical inspection tool can feature a double-speed and other modes whereby the inspection rate is increased by using pixel binning. For instance, the tool may include an array of pixels provided by one or more detectors. Some or all of the pixels in one or more of the detectors may be binned according to inspection requirements. Based on the reduction in effective pixels due to the binning, in some embodiments, the rate of imaging and scanning rate of the wafer (or other object) can be increased. Different portions of the array may be binned differently to provide for increased throughput during inspections; for instance, the binning arrangement across an array can be correlated to the features that will be imaged using the array. | 01-29-2009 |
| 20090030631 | METHOD FOR ENHANCING THE MEASUREMENT CAPABILITY OF MULTI-PARAMETER INSPECTION SYSTEMS - A method for improving the measurement capability of multi-parameter inspection systems includes performing a measuring procedure to acquire a measured signature of a sample, calculating weighting factors representing a correlation between structural parameters of the sample by using a weighting algorithm, transforming the weighting factors into a sampling function by using a transforming rule, updating the measured signature to form an updated measured signature and generating a plurality of updated nominal signatures according to the sampling function, and comparing the updated measured signature and the updated nominal signatures to determine the structural parameters of the sample. | 01-29-2009 |
| 20090043523 | Coating Appearance Evaluation Method and Coated Article - A new, simple, and easy coating appearance evaluation method which has a point of origin for consumer preference with respect to the coating in which wavelength coexist is found to provide a coated article having a coating level of consumer satisfaction; a method for producing thereof; and an apparatus for evaluating an coating appearance. A coating appearance evaluation method, in which, among surface swells of a coating, the amplitude of the swell with a wavelength in the range of 1 to 10 mm are selectively measured, and a coating appearance of the surface of the coating is evaluated by the sizes of the resulting measurement thereof. | 02-12-2009 |
| 20090055114 | METHOD AND ARRANGEMENT FOR CORRECTING THERMALLY-INDUCED FIELD DEFORMATIONS OF A LITHOGRAPHICALLY EXPOSED SUBSTRATE - The invention provides a method for correcting thermally-induced field deformations of a lithographically exposed substrate. First, a model is provided to predict thermally-induced field deformation information of a plurality of fields of the substrate. The pre-specified exposure information used to configure an exposure of the fields is then modified based on the thermally-induced deformation information as predicted by the model. Finally a pattern is exposed onto the fields in accordance with the pre-specified exposure information as modified. The predicting of thermally-induced field deformation information by the model includes predicting of deformation effects of selected points on the substrate. It is based on a time-decaying characteristic as energy is transported across substrate; and a distance between the selected points and an edge of the substrate. | 02-26-2009 |
| 20090055115 | METHOD AND ARRANGEMENT FOR PREDICTING THERMALLY-INDUCED DEFORMATION OF A SUBSTRATE, AND A SEMICONDUCTOR DEVICE - The invention provides a method for correcting thermally-induced field deformations of a lithographically exposed substrate. First, a model is provided to predict thermally-induced field deformation information of a plurality of fields of the substrate. The pre-specified exposure information used to configure an exposure of the fields is then modified based on the thermally-induced deformation information as predicted by the model. Finally a pattern is exposed onto the fields in accordance with the pre-specified exposure information as modified. The predicting of thermally-induced field deformation information by the model includes predicting of deformation effects of selected points on the substrate. It is based on a time-decaying characteristic as energy is transported across substrate; and a distance between the selected points and an edge of the substrate. | 02-26-2009 |
| 20090063074 | Mask Haze Early Detection - Detecting haze formation on a mask by obtaining an optical property of the mask and determining progress of the haze formation based on the obtained optical property. | 03-05-2009 |
| 20090070055 | INTELLIGENT INSPECTION BASED ON TEST CHIP PROBE FAILURE MAPS - A method and system for semiconductor wafer inspection is disclosed. Each of a plurality of dies on a wafer may be probed with a probe tool to produce probe data. The probe data may be used to generate one or more non-repeating care areas. An inspection tool may use the non-repeating care areas to perform an inspection of the semiconductor wafer. | 03-12-2009 |
| 20090076754 | Methods, systems and apparatuses for modeling optical images - Methods, systems and apparatuses for modeling high resolution images which significantly shortens computation time and reduces image artifacts, as compared to known methods. Embodiments implement a look-up table, to compute once and store the point spread functions for various points of an image. During modeling of the optical system, previously stored point spread functions may be used to determine the point spread function for a specified point using a weighted interpolation of the point spread functions that have been stored for nearby points. | 03-19-2009 |
| 20090088997 | DATA PROCESSING SYSTEM - A data processing system manages data of inspection conditions of a plurality of inspection devices. The system includes a storage device, a computing device, and an input/output device. The storage device stores therein data of master inspection conditions of one of the plurality of inspection devices for use as reference data in data comparison and data of comparison target inspection conditions of one or more of the others of the plurality of inspection devices. The input/output device displays thereon names of the master inspection conditions and names of the comparison target inspection conditions in the form of lists arranged side by side, and concurrently displays thereon one of the master inspection conditions and a selected comparison target inspection condition(s) of a comparison target inspection device(s) in a display mode distinguished from a display mode applied for other inspection conditions. | 04-02-2009 |
| 20090105981 | Method of Calculating Key Performance Indicators in a Manufacturing Execution System - Key performance indicators, herein after referred as KPIs, are calculated within a manufacturing execution system. The calculation is performed by defining a custom KPI set at engineering time. In the case that the custom KPI definition is valid, a function code for calculating each custom KPI belonging to the custom KPI set is, automatically generated, through a software framework with support for code generation, at engineering time. At a runtime, a calculation is requested of a given custom KPI belonging to the custom KPI set. In the case that the calculation request is valid, at runtime, the calculation function code of the given custom KPI is executed. | 04-23-2009 |
| 20090112501 | METHODS AND SYSTEMS FOR SEMICONDUCTOR TESTING USING REFERENCE DICE - Methods and systems of semiconductor testing where reference dice and non-reference dice in a wafer and/or lot are tested differently. In one embodiment of the invention, geography, lithography exposure, other characteristics, performance and/or behavior are taken into account when selecting reference dice, thereby improving the likelihood that the response of reference dice to testing is well representative of the wafer and/or lot. In one embodiment, based on data from the testing of reference dice, the test flow for non-reference dice and/or other testing may or may not be adjusted. | 04-30-2009 |
| 20090138223 | On-Line Quality Prediction System for Stainless Steel Slab and the Predicting Method Using It - Disclosed is an on-line quality prediction system for stainless steel slab and the predicting method using it, which can allow produced slab quality to predict in high precision on the on-line using a network based system by collecting all operation data available from a steel making process to a continuous casting process and then using them as a metallurgical calculation evaluating model through thermodynamics and statistics programs, the system comprises: a main computer collecting and storing information from a production line for the stainless steel slab; a thermodynamics calculation only computer mutually communicating with the main computer; and a server computer mutually communicating with the main computer, whereby it can overcome a limitation of a predicting method due to existing operation data and allow produced slab quality to predict in high precision on the on-line using a network based system by collecting all operation data available from a steel making process to a continuous casting process and then using them as a metallurgical calculation evaluating model through thermodynamics and statistics programs, significantly improving quality and productivity. | 05-28-2009 |
| 20090144007 | System and method for electronic testing of devices - A system and method electronically tests devices. The method comprises receiving a first testing model including a first plurality of parameters and acceptable limits for the first plurality of parameters; receiving a second testing model including a second plurality of parameters and acceptable limits for the second plurality of parameters; receiving a first value for a first parameter from the first plurality of parameters, the first parameter at least partially affecting a second parameter from the second plurality of parameters; determining a second value for the second parameter based on the first value; determining if the first value is within the acceptable limits for the first parameter; determining if the second value is within the acceptable limits for the second parameter; and providing an indication when at least one of the first and second values is outside the acceptable limits for a corresponding one of the first and second parameters. | 06-04-2009 |
| 20090171605 | Method and System for Defect Inspection - In one embodiment, a method includes receiving inspection data from an optical inspection tool. The inspection data represents a plurality of surface features of a substrate. The inspection data is compared to a first pattern. The first pattern corresponds to a second pattern formed by dispensing a flowing substance on a surface of the substrate. The method further includes determining, based at least in part on the comparison, if the inspection data indicates one or more defects. | 07-02-2009 |
| 20090198463 | AUTOMATIC ANALZYER - An object of the present invention is to automatically investigate factors in complicated uncertainty, particularly from the view point of reagents and samples which are subject to quality change and prone to affect the measurement quality. To accomplish the above object, quality control samples having a plurality of concentration levels are measured to calculate the average, coefficient of variation, standard deviation, and other numerical values. When quality control samples having n (n>=2) different concentration levels are measured, the present invention provides the method to presume the factors in uncertainty, the factors being specific to each of 3 | 08-06-2009 |
| 20090210182 | OPACITY OPTIMISATION FOR PAINT TOPCOAT/UNDERCOAT COMBINATION - An opacity process for paint, including generating paint color data representing a paint color, based on the scatter and absorption data, or reflectance data, for the paint color, generating, based on the paint color data, full hiding color data representing the reflectance of the paint color at full hiding, generating, for a plurality of undercoat paints with different reflectance levels, color combination data representing the color of at least one coat of the paint color and one of the undercoat paints, respectively, and generating color difference data representing opacity, based on a difference between the full hiding color data and the color data combination. | 08-20-2009 |
| 20090240454 | METHOD AND SYSTEM FOR VALIDATING A PROCESSOR IN A SEMICONDUCTOR ASSEMBLY - A method of conducting validation is provided. The method includes providing a processor that does not include a validation function and providing an auxiliary die coupled to the processor. The method also includes receiving validation data from the processor in the auxiliary die and conducting validation of the processor in the auxiliary die. | 09-24-2009 |
| 20090248337 | Systems and Methods of Alternative Overlay Calculation - Methods and systems of alternative overlay calculation and of calculating overlay stability based on alternative overlay settings in a fabrication unit, and a computer readable medium are disclosed being capable of calculating alternative overlay error values based on alignment model parameters, alternative alignment model parameters, and overlay error values for a plurality of measurement positions. | 10-01-2009 |
| 20090248338 | METHOD AND APPARATUS FOR MATCHING TRANSLUCENT COATINGS OF ABSORBENT SUBSTRATES - In one embodiment, the present invention is a method and apparatus for matching translucent coatings of absorbent substrates. In one embodiment, a method for matching a color of a sample includes generating a plurality of recipes, each of the recipes representing a mixture of one colorant and a clear vehicle and defining a concentration of the one colorant and a concentration of the clear vehicle, applying each of the recipes to one or more absorbent substrates, determining an absorption value and a scattering value for each of the recipes as applied to the absorbent substrates, storing the recipes in a database, where each of the recipes is stored with an associated absorption value and an associated scattering value, selecting a first recipe from among the recipes stored in the database, and evaluating a quality of the first recipe as a match to the color of the sample. | 10-01-2009 |
| 20090276174 | METHOD AND SYSTEM FOR A TWO-STEP PREDICTION OF A QUALITY DISTRIBUTION OF SEMICONDUCTOR DEVICES - By performing a two-step approach for predicting a quality distribution during the fabrication of semiconductor devices, enhanced flexibility and efficiency may be accomplished. The two-step approach first models electrical characteristics on the basis of measurement data, such as inline measurement data, and, in a second step, an appropriate distribution for the electrical characteristics may be established, thereby obtaining modeled wafer sort data which may then be used for predicting a quality distribution of the semiconductor devices under consideration. | 11-05-2009 |
| 20090281753 | METHOD AND SYSTEM FOR PHOTOVOLTAIC CELL PRODUCTION YIELD ENHANCEMENT - A system and a method for photovoltaic thin film quality control. The system illuminates an area of photovoltaic film, acquires the illuminated area and compares it with a predetermined i A system and a method for photovoltaic thin film quality control. The system illuminates an area of photovoltaic film, acquires the illuminated area and compares it with a predetermined image. The difference between the images indicates on presence of photovoltaic thin film defects. | 11-12-2009 |
| 20090287438 | Increased Fault Diagnosis Throughput Using Dictionaries For Hyperactive Faults - Techniques to achieve greater diagnostic speeds using relatively small fault dictionaries, such as dictionaries that are only slightly larger than so-called N | 11-19-2009 |
| 20090292491 | SUBSTRATE PROCESSING APPARATUS, DEVICE INSPECTING METHOD, DEVICE INSPECTING PROGRAM AND RECORDING MEDIUM HAVING THE PROGRAM RECORDED THEREIN - Efficiency of inspection work for inspecting all the plurality of modules of a substrate processing system is improved and the management of information obtained by inspecting the modules is facilitated. A substrate processing system | 11-26-2009 |
| 20090299667 | Qualifying Data Produced By An Application Carried Out Using A Plurality Of Pluggable Processing Components - Methods, apparatus, and products are disclosed for qualifying data produced by an application carried out using a plurality of pluggable processing components. Qualifying data produced by the application includes: receiving, by an application manager, quality metrics for one of the pluggable processing components; determining, by the application manager, a component quality rating for the pluggable processing component in dependence upon the quality metrics; and assigning, by the application manager, a data quality rating to application data for the application in dependence upon the component quality rating for the pluggable processing component. | 12-03-2009 |
| 20090299668 | APC SYSTEM AND MULTIVARIATE MONITORING METHOD FOR PLASMA PROCESS MACHINE - An advance process control (APC) system for a plasma process machine is provided, which includes at least an optical emission spectroscopy (OES) system and an APC analysis apparatus. The OES system is used for monitoring a testing object in the plasma process machine. The APC analysis apparatus is used for analyzing the data received from the OES system. | 12-03-2009 |
| 20090319213 | VEHICULAR DOOR CLOSING-INSPECTION APPARATUS AND VEHICULAR DOOR CLOSING-INSPECTION METHOD - This door closing-inspection apparatus for a vehicle is provided with: a first lightening and light-receiving device which is arranged so as to stride over a transferring conveyer in a finished vehicle inspection line which inspects a finished vehicle while transferring the finished vehicle; a pair of door-closing devices arranged at positions where are on a downstream side of the first lightening and light-receiving device, and are on symmetrically both sides of a length of the transferring conveyer; a second lightening and light-receiving device arranged on downstream side of the door-closing devices so as to stride over the transferring conveyer; a pair of door distance-measuring sensors arranged at positions where are on a downstream side of the second lightening and light-receiving device, and are on symmetrically both sides of the length of the transferring conveyer; and a controller which is connected to the first lightening and light-receiving device, the second lightening and light-receiving device, the door-closing devices, the distance-measuring sensors, and a driving source controller of the transferring conveyer, wherein: each of the door-closing devices is provided with a linear cylinder which can control a rod stroke thereof, and a door-pressing pad which is attached via a spherical joint to a rod distal end portion of the linear cylinder; each of the door-closing devices is activated to close an opened door of the finished vehicle after a predetermined time has passed since the first lightening and light-receiving device has detected a vehicular body of the finished vehicle; and each of the distance-measuring sensors is activated to measure a distance with respect to a vehicular body side face of the finished vehicle after a predetermined time has passed since the second lightening and light-receiving device has detected the vehicular body of the finished vehicle. | 12-24-2009 |
| 20100010763 | METHOD FOR DETECTING VARIANCE IN SEMICONDUCTOR PROCESSES - A method of detecting variance by regression model is disclosed. Said method comprising: preparing the FDC and WAT data for analysis, figuring out what latent variable effect WAT by Factor Analysis, utilizing Principal Component Analysis to reduce the number of FDC variables to a few independent principal components, demonstrating how the tool and FDC affect WAT by Analysis of covariance model, and constructing interrelationship among FDC, WAT and tools. The interrelationship can point out which parameter effect WAT significantly. By the method, when WAT abnormal situation happened, it is easier for engineers to trace where the problem is. | 01-14-2010 |
| 20100017159 | GAMMA AND TEMPERATURE HARDENED PHARMACEUTICAL DEVICES - A system and method for implementing embedded electronics in environments where radiation or extreme temperatures are used is disclosed. Embedded electronics are affixed to various components of a pharmaceutical system, thereby enabling the customer to download pertinent information about the component, such as lot number, date of manufacturer, test parameters, etc. Additionally, these electronics allow an array of functions and features to be implemented, such as integrity tests and diagnostics. The electronics in the pharmaceutical components utilize a technology that is not as susceptible to radiation and extreme temperatures as traditional electronics. | 01-21-2010 |
| 20100049460 | QUALITY DEGRADATION POINT ESTIMATING SYSTEM AND QUALITY DEGRADATION POINT ESTIMATING METHOD - A quality degradation point estimating method for estimating a quality degradation point in a directed link set through which a communication flow passed is provided. The quality degradation point estimating method has: (A) determining a test flow set for estimating a quality degradation point; and (B) estimating the quality degradation point in the directed link set by sending the test flow set to the network. The (A) step includes a step of setting the flow, which passes through a partial set as a part of the directed link set, as the test flow and adding the set test flow to the test flow set. The test flow is sent from the test terminal on the network to a predetermined node in the partial set. A response is obtained at the predetermined node, and the response is sent from the predetermined node to a predetermined terminal. | 02-25-2010 |
| 20100057391 | CLASSIFICATION OF SPATIAL PATTERNS ON WAFER MAPS - Classification of spatial patterns on wafer maps is generally described. In one example, a method includes applying K-means type clustering to wafer maps comprising one or more spatial patterns to group one or more clusters comprising wafer maps having similar spatial patterns and producing a dendrogram using a clustering process to display the one or more clusters. | 03-04-2010 |
| 20100088054 | METHODS AND APPARATUS FOR DATA ANALYSIS - A method and apparatus for data analysis according to various aspects of the present invention is configured to automatically identify a characteristic of a component fabrication process guided by characteristics of the test data for the components. | 04-08-2010 |
| 20100100348 | Device for monitoring a product stream for interfering inclusion - A device for monitoring a product stream for undesired inclusions wherein, in a section of the product stream which is to be monitored, a material-specific detection signal is derived by means of a sensor system comprising a plurality of sensors arranged in a staggered manner under formation of a sensor row in the direction of transport of the product stream and by means of an evaluation circuit associated with said sensor system, by simultaneously adding the output signals of the individual sensors in an addition circuit in a correlated manner, said output signals originating from single products with regard to metal particles in the product stream to be checked, and using the output signal of the addition circuit as a detection signal for a metal particle to be discovered. At least one sensor of a sensor row, the output signals of which are added in an antiphase manner to the output signals of other sensors for difference-taking purposes, is provided for the compensation of interfering magnetic fields. The resulting difference signals are evaluated in an addition circuit in a correlated manner, said addition circuit being provided for forming the detection signal. | 04-22-2010 |
| 20100100349 | Method and System for Automatically Generating Do-Not-Inspect Regions of a Photomask - A method and system for inspecting a photomask are provided. A method for automatically generating do-not-inspect regions in a photomask includes performing one or more manufacturing rules checks (MRCs) on a mask pattern file. The method may also include identifying manufacturing rule violations and automatically generating one or more DNIRs, each DNIR corresponding to a location of one or more of the identified manufacturing rule violations. | 04-22-2010 |
| 20100106443 | Defect Inspection Apparatus and Defect Inspection Method - A defect inspection apparatus includes: stages each mounting an inspecting object on which a circuit pattern having a group of parallel lines is formed, and each running perpendicular or parallel to the group of lines; an illumination optical system which illuminating a surface of the inspecting object with a slit beam being slit light so that a longitudinal direction of the slit beam is substantially perpendicular to the running directions of the stages, and which has a first inclined angle formed by the direction of the group of lines and a projection line, of an optical axis of the slit beam, to the inspecting object; a spatial filter that shields or transmits reflected and scattered light of the inspecting object according to a difference in distribution of orientation; and a detection optical system that detects the reflected and scattered light transmitted through the spatial filter by image sensors. Moreover, the illumination optical system illuminates the inspecting object with another slit beam from a direction opposite to an incident direction of the slit beam on a plane. | 04-29-2010 |
| 20100121598 | CAPTURING SYSTEM INTERACTIONS - A computer-implemented method for capturing interactions in a system is disclosed. The method includes receiving a selection of a first component of the system and receiving a selection of a second component of the system. The method further includes receiving a selection of an interaction between the first component and the second component, and displaying a list of functions performed by the selected interaction. | 05-13-2010 |
| 20100131221 | METHOD FOR DETERMINING QUALITY PARAMETER AND THE ELECTRONIC APPARATUS USING THE SAME - The invention provides a method for determining quality parameter and the electronic apparatus using the same. The electronic apparatus includes a central processing unit (CPU) and a memory module. The method includes the following steps: performing a CPU overclocking process to obtain a highest operable CPU frequency; tuning a quality parameter and performing a memory test to obtain a test result; and determining an optimal value based on the test result to be a default value of the quality parameter. | 05-27-2010 |
| 20100145646 | Predicting Wafer Failure Using Learned Probability - Techniques for estimating a quality of one or more wafers are presented. One or more first wafers comprising one or more first dies are tested. A probability of wafer failure is determined in accordance with one or more first test measurements of the one or more first dies. A pass status and/or a fail status of one or more second wafers is inferred by testing a select one or more second dies of the one or more second wafers and evaluating one or more second test measurements of the select one or more second dies in accordance with the determined probability of wafer failure. | 06-10-2010 |
| 20100228510 | Quality Information Control Analysis System - A quality information collection analysis system includes at least one assembly installation having at least one assembly machine which assembles a component, and outputs an assembly time of an assembly as a production time, at least one inspection machine which inspects the assembly to which the component is assembled by the assembly machine, and outputs an inspection result of the assembly as inspection information, and a quality collection analysis device which manages quality information of the assembly, having a storing section which stores information of the component, the production time and the inspection information and a quality information collection analysis section which analyzes a defect factor of the assembly by using the information of the component, the production time and the inspection result. | 09-09-2010 |
| 20100250171 | LENS EVALUATION METHOD, LENS EVALUATION DEVICE, LENS MANUFACTURING METHOD, AND LENS CHARACTERISTIC DISPLAY METHOD - The present invention is to provide a lens evaluation method capable of easily evaluating whether there is a difference which greatly changes locally in a lens, and evaluating the degree of the difference. According to the lens evaluation method of the present invention, first, power a distribution of a plurality of measurement point in an arbitrary direction. Next, a calculation power distribution (a design power distribution) is created. Further, a difference distribution between an actually measured power distribution, which indicates an actual power distribution, and a calculation power distribution is obtained. Further, the difference distribution is differentiated to obtain a difference index, and an evaluation is performed based on the difference index to evaluate whether there is a difference which greatly changes locally in a lens, and evaluate the degree of the difference. | 09-30-2010 |
| 20100268501 | Method for assessing data worth for analyzing yield rate - A method for assessing data worth for analyzing yield rate includes: getting measured data with data points that corresponds to control variables of semiconductor manufacturing; transforming the data points into a distance matrix with matrix distances corresponding to differences of the data points under the control variables; expressing sample differences recorded in the distance matrix by two-dimension vectors and calculating similarity degrees of the two-dimension vectors and the distance matrix so as to take loss information as a conversion error value; calculating discriminant ability of the transformed two-dimension data and expressing the discriminant ability by an error rate of discriminant; and taking the conversion error value and the error rate of discriminant as penalty terms and calculating a quality score corresponding to the measured data. Thereby, before analyzing the yield rate of semiconductor manufacturing, analysts can determine whether data includes information affecting the yield rate based on the quality score. | 10-21-2010 |
| 20100332172 | Secure test-for-yield chip diagnostics management system and method - A chip diagnostics management system includes secure design information that define production features of integrated circuit devices and are accessible according to selected levels of access privilege. A database of device defect information includes information of defects of devices produced according to the production features of the design information and associated wafers, production lots, and dies in or with which the devices were produced. A diagnostic manager correlates device defect information from plural wafers with the design information to identify a device location with a probability of being associated with the device defect information. A diagnostic manager viewer indicates the device location together with an amount of design information correlated the level of access privilege assigned to a selected user. | 12-30-2010 |
| 20110119009 | Measuring Apparatus - Measuring apparatus for monitoring the position of the centre of mass of a semiconductor wafer is disclosed. The apparatus includes a wafer support ( | 05-19-2011 |
| 20110137595 | YIELD LOSS PREDICTION METHOD AND ASSOCIATED COMPUTER READABLE MEDIUM - A yield loss prediction method includes: performing a plurality of types of defect inspections upon a plurality of batches of wafers which begin to be processed during different periods to generate defect inspection data, respectively; for a specific batch of wafers different from the plurality of batches of wafers, calculating defect prediction data of at least one type of defect inspection according to the defect inspection data of at least the type of defect inspections; and predicting a yield loss of the specific batch of wafers according to at least the defect prediction data. | 06-09-2011 |
| 20110153248 | OPHTHALMIC QUALITY METRIC SYSTEM - A method for automatically measuring and quantitatively evaluating the optical quality of an ophthalmic lens, such as, for example, a contact lens. The method measures an ophthalmic lens with an optical phase measurement instrument to derive measured data. The method creates a set of objective optical quality metrics within a computational software. And, the method applies the measured data to at least one of the objective optical quality metrics to determine lens quality. | 06-23-2011 |
| 20110161029 | SURFACE MOUNT TECHNOLOGY MEASUREMENT SYSTEM AND METHOD - In a surface mount technology (SMT) measurement system and method, the number of PCBs input to an SMT production line, the frequency of solder paste printing of the PCBs, the frequency of surface mount component placement of the PCBs, and a yield of the PCBs are calculated. Accordingly, production performance of the SMT production line is determined. The production performance is output to an output device. | 06-30-2011 |
| 20110161030 | Method And Device For Monitoring Measurement Data In Semiconductor Process - An embodiment of the present invention discloses a method for monitoring measurement data in a semiconductor process, which includes: updating measurement data of wafer performance parameters periodically from a real time system into an analysis database; retrieving from the analysis database the measurement data of a predetermined performance parameter for analysis covered in a time range required in a selected analysis rule according to information on the performance parameter for analysis and information on the selected analysis rule; determining whether the measurement data of the performance parameter retrieved from the analysis database violates a control range of the selected analysis rule, and if so, then transmitting alarm information for the performance parameter violating the control range of the selected analysis rule. The method and device according to the embodiments of the invention can automatically monitor measurement data of wafer performance parameters and discover an abnormal performance parameter. | 06-30-2011 |
| 20110224932 | MONITORING OF TIME-VARYING DEFECT CLASSIFICATION PERFORMANCE - Systems and methods for monitoring time-varying classification performance are disclosed. A method may include, but is not limited to: receiving one or more signals indicative of one or more properties of one or more samples from one or more scanning inspection tools; determining populations of one or more defect types for the one or more samples according an application of one or more classification rules to the one or more signals received from the one or more scanning inspection tools; determining populations of the one or more defect types for the one or more samples using one or more high-resolution inspection tools; and computing one or more correlations between populations of one or more defect types for one or more samples determined from application of one or more classification rules applied to one or more signals received from the one or more scanning inspection tools and populations of the one or more defect types for the one or more samples determined using the one or more high-resolution inspection tools. | 09-15-2011 |
| 20110224933 | METHOD AND SYSTEM FOR DATA COLLECTION AND ANALYSIS TO ASSIST IN FACILITATING REGULATORY APPROVAL OF A PRODUCT - A method for providing a service to assist in obtaining regulatory approval of a product includes using a computing device programmed to search at least one database of literature and programmed to identify data relative to determining substantial equivalence for the product to provide a first data set. The method further includes determining experimental data to collect for the product based in part on the first data set, collecting the experimental data for the product to provide a second data set, and documenting comparative data comprising comparisons between the first data set and the second data set data indicative of substantial equivalence for the product. | 09-15-2011 |
| 20110231129 | IDENTIFICATION METHOD OF DATA POINT DISTRIBUTION AREA ON COORDINATE PLANE AND RECORDING MEDIUM - A disclosed identification method of identifying a data point distribution area on a coordinate plane includes dividing an area on the coordinate plane into divided areas so that the divided areas radiate from a division center point; selecting, in each of the divided areas, from among the data points in the divided area, a data point having the greatest distance from the division center point as a representative point; determining whether there is an overlapping area where a distribution representative point area overlaps a determination area; and determining, when there is the overlapping area, that the data group to be determined is a relevant data group. | 09-22-2011 |
| 20110251811 | METHOD TO DETERMINE A QUALITY ACCEPTANCE CRITERION USING FORCE SIGNATURES - A method is provided to determine a quality acceptance criterion using force signatures measured on a first and a second set of elements. The first set has no quality defect and the second set has a deliberate quality defect. Selection of an initial subset of time points is based on statistical analysis of the force data on the force signatures in the two sets. The quality acceptance criterion includes a quality threshold established using Mahalanobis Distance (MD) values and the MD values are produced from force data at a selected initial subset of time points for each element in the two sets. An output of the determined quality acceptance criterion is using the defined quality threshold to separate an element having a force signature into a group of elements having no quality defect or into a group of elements having a quality defect like the deliberate quality defect. | 10-13-2011 |
| 20110257919 | Method and apparatus for automated quality assurance in medical imaging - The present invention relates to a computer-implemented quality assurance system, which includes the steps of retrieving quality assurance and supporting information from a database; receiving information on technical variables from monitoring of the patient, and on radiographic equipment in the performance of an imaging study; generating a quality assurance score after said imaging study based on said technical variables and said quality assurance and supporting information; and performing a quality assurance analysis of the imaging study based on the quality assurance score. | 10-20-2011 |
| 20120035876 | SYSTEM FOR AUTOMATICALLY GATHERING BATTERY INFORMATION - A method that includes affixing a radio frequency identification tag on a storage battery at a battery manufacturing plant. The method also includes storing battery manufacturing information into the radio frequency identification tag at the battery manufacturing plant. The battery manufacturing information includes a battery algorithm suitable for use in testing the storage battery. | 02-09-2012 |
| 20120101757 | DIMENSIONAL INSPECTION METHOD FOR A COMPOSITE PART - A method for performing a dimensional inspection of a fabricated composite part ( | 04-26-2012 |
| 20120101758 | METHOD OF ANALYZING CAUSE OF ABNORMALITY AND PROGRAM ANALYZING ABNORMALITY - A method of analyzing a cause of abnormality of a wafer processed by plasma in at least any one of two or more process modules disposed in a plasma processing system of a cluster type, the method includes recording information about transfer paths of the processing target from when the wafer is transferred from a shipping container and transferred to at least any one of the two or more process modules to when the processing target is returned to the shipping container, in relation with identification information of the wafer for each processing target; testing a state of the wafer after a plasma process has finished; and analyzing a cause of abnormality based on a result of comparison between recorded informations about transfer paths of the processing target determined to be abnormal and the processing target determined to be normal as a result of the testing. | 04-26-2012 |
| 20120116704 | METHOD AND APPARATUS FOR VERIFYING TWO DIMENSIONAL MARK QUALITY - A method and system for applying a two dimensional mark on a first surface of a component and assessing mark quality, the method comprising the steps of positioning a component with a first surface at a first station, applying a two dimensional mark to the first surface at the first station wherein the applied mark is intended to codify a first information subset, obtaining an image of the applied two dimensional mark at the first station using a stationary camera that has a field of view that is centered along a trajectory that forms an obtuse angle with at least a portion of the first surface and that includes at least a portion of the first surface, performing a mark quality assessment on the obtained image and performing a secondary function as a result of the mark quality assessment. | 05-10-2012 |
| 20120136601 | Method and System of Improved Uniformity Testing - A method and system includes a first substrate and a second substrate, each substrate comprising a predetermined baseline transmittance value at a predetermine wavelength of light, processing regions on the first substrate by combinatorially varying at least one of materials, process conditions, unit processes, and process sequences associated with the graphene production, performing a first characterization test on the processed regions on the first substrate to generate first results, processing regions on a second substrate in a combinatorial manner by varying at least one of materials, process conditions, unit processes, and process sequences associated with the graphene production based on the first results of the first characterization test, performing a second characterization test on the processed regions on the second substrate to generate second results, and determining whether at least one of the first substrate and the second substrate meet a predetermined quality threshold based on the second results. | 05-31-2012 |
| 20120158336 | MANAGEMENT OF A NUMBER OF SWIMMING POOLS - Method for managing a group of swimming pools, characterized in that it includes the following steps:
| 06-21-2012 |
| 20120209553 | TOLERANCE EVALUATION WITH REDUCED MEASURED POINTS - A method of determining whether a part satisfies tolerance criteria includes making a multiplicity of measurements of the part, reducing the number of measured points to a number of boundary points that define a boundary within which all measured points are encompassed and comparing the boundary to a tolerance limit of a normal surface to determine whether the part conforms to the tolerance. | 08-16-2012 |
| 20120221272 | QUALITY ESTIMATION APPARATUS, QUALITY ESTIMATION METHOD AND NON-TRANSITORY COMPUTER-READABLE MEDIUM STORING PROGRAM - According to one embodiment, a quality estimation apparatus includes: a storage module which stores designation information for designating inspection targets to be subjected to sampling inspection in estimation targets including the inspection targets and non-inspection targets, characteristic values obtained by the sampling inspection of the inspection targets and criterion information for determining qualities of the inspection targets based on the characteristic values; a threshold value calculator which calculates threshold values indicating qualities of the inspection targets from the characteristic values of the inspection targets by using the criterion information; and a clustering module which classifies the estimation targets in clusters so that the clusters have probability distributions with the threshold values used as a variable. | 08-30-2012 |
| 20120232822 | WELD DETECTING METHOD AND WELD DETECTING APPARATUS - A weld detecting method that detects a weld on a work includes: obtaining in advance at least one correlation, from among a correlation between a width of the neck and an amount of elongation of the work and a correlation between the width of the neck and an amount of change in at least one of a sheet thickness and a sheet width of the work before and after elongation of the work, and calculating the width of the neck based on the at least one correlation by obtaining at least one of the sheet thickness, the sheet width, or the amount of elongation of the work from the obtained at least one correlation; setting a conveying speed, according to the calculated width of the neck; and detecting the neck by measuring the sheet width of the work at predetermined intervals, while conveying the work the set conveying speed. | 09-13-2012 |
| 20120265466 | MONITORING THE LOW CYCLE FATIGUE OF RUGGEDIZED AVIONICS ELECTRONICS - A health monitoring system for monitoring the health of an electronic system. The health monitoring system includes an analog-to-digital converter, and a monitoring circuit within the electronic system. The monitoring circuit includes fatigue life characterized electrical components representative of electrical components comprising the balance of the electronic system. The fatigue life characterized electrical components are employed solely to monitor the health of the electronic system. The monitoring circuit output is electrically connected to the analog-to-digital converter. | 10-18-2012 |
| 20120296591 | WAVEFRONT OPTICAL MEASURING APPARATUS - An apparatus for measuring a wavefront of light traveling through test optics includes: a light source; a lenslet array where light from the light source travels through; a detector array configured to acquire a light intensity distribution through the lenslet array; and a processing unit, wherein the processing unit executes data processing with the acquired light intensity distribution, the data processing comprising an estimation process using a beamlet-based propagation model or a ray-based propagation model as a forward propagation model. | 11-22-2012 |
| 20120310574 | SYSTEMS AND METHODS FOR DETERMINING ADJUSTABLE WAFER ACCEPTANCE CRITERIA BASED ON CHIP CHARACTERISTICS - Systems and methods for determining adjustable wafer acceptance criteria based on chip characteristics. The method includes measuring a density of at least one chip. The method further includes computing a difference in density between the density of the at least one chip and a density of at least one kerf structure. The method further includes calculating an offset value to modify a Wafer Acceptance Criteria (WAC) to match the density difference between the at least one chip and the at least one kerf structure. The method further includes applying the offset value to the WAC for a wafer level measurement in order to increase chip yield performance. | 12-06-2012 |
| 20120330591 | FAULT DETECTION METHOD OF SEMICONDUCTOR MANUFACTURING PROCESSES AND SYSTEM ARCHITECTURE THEREOF - A fault detection method of semiconductor manufacturing processes is disclosed. The method includes the steps of providing a storage device, collecting a fault detection and classification(FDC) parameter by the storage device, setting up a measurement site for measuring an online measurement parameter, collecting a wafer acceptance test(WAT) in correspondence to the FDC parameter, establishing a first relationship equation between the FDC parameter and the online measurement parameter, establishing a second relationship equation of the online measurement parameter and the WAT by using the first relationship equation, establishing a third relationship equation between the FDC parameter and the WAT, establishing a waning region of the manufacturing processes by using the first, second, and third relationship equations, and determining the situation of generating wafer defects according to the warning region. The present invention discloses a system architecture for the method. | 12-27-2012 |
| 20130006562 | QUALITY ASSURANCE SYSTEM FOR ELECTIONS - A system is provided for improved quality assurance (QA) in remote-access elections by a QA unit that evaluates an election service provider (ESP) that tallies votes, each of which includes a vote-identification number (VIN) and a vote content. The QA unit assures a likelihood that no votes have been deleted, inserted or changed by the ESP. The QA unit does this by allocating QA VINs and voting QA votes and then checking the ESP's report of all VINs included in the tally and the content of all QA votes. The ESP, if unaware of which votes are QA votes and which are voter voters, is prevented from deleting, inserting, or changing votes without risk of detection by the check of the QA votes. The system includes capability of ensuring defined confidence levels for a given quantity of voters and an expected voter turnout by incorporation of a suitable number of QA VINs. | 01-03-2013 |
| 20130006563 | Continuous monitoring methods in vaccine production - Methods of monitoring an acceptance criteria of vaccine manufacturing processes are disclosed herein. Consequently, the methods and systems provide a means to perform high-quality manufacturing on an integrated level whereby vaccine manufacturers can achieve data and product integrity and ultimately minimize cost. | 01-03-2013 |
| 20130006564 | DISCRETE COMPONENT BACKWARD TRACEABILITY AND SEMICONDUCTOR DEVICE FORWARD TRACEABILITY - A system is disclosed for providing backward and forward traceability by a methodology which identifies discrete components (die, substrate and/or passives) that are included in a semiconductor device. The present technology further includes a system for generating a unique identifier and marking a semiconductor device with the unique identifier enabling the semiconductor device, and the discrete components within that device, to be tracked and traced through each process and test in the production of the semiconductor device. | 01-03-2013 |
| 20130018617 | INTEGRATING MANUFACTURING FEEDBACK INTO INTEGRATED CIRCUIT STRUCTURE DESIGNAANM Buck; Nathan C.AACI UnderhillAAST VTAACO USAAGP Buck; Nathan C. Underhill VT USAANM Dreibelbis; Brian M.AACI UnderhillAAST VTAACO USAAGP Dreibelbis; Brian M. Underhill VT USAANM Dubuque; John P.AACI JerichoAAST VTAACO USAAGP Dubuque; John P. Jericho VT USAANM Foreman; Eric A.AACI FairfaxAAST VTAACO USAAGP Foreman; Eric A. Fairfax VT USAANM Habitz; Peter A.AACI HinesburgAAST VTAACO USAAGP Habitz; Peter A. Hinesburg VT USAANM Hemmett; Jeffrey G.AACI St. GeorgeAAST VTAACO USAAGP Hemmett; Jeffrey G. St. George VT USAANM Venkateswaran; NatesanAACI Hopewell JunctionAAST NYAACO USAAGP Venkateswaran; Natesan Hopewell Junction NY USAANM Visweswariah; ChandramouliAACI Croton-on-HudsonAAST NYAACO USAAGP Visweswariah; Chandramouli Croton-on-Hudson NY USAANM Wang; XiaoyueAACI KanataAACO CAAAGP Wang; Xiaoyue Kanata CAAANM Zolotov; VladmimirAACI Putnam ValleyAAST NYAACO USAAGP Zolotov; Vladmimir Putnam Valley NY US - Solutions for integrating manufacturing feedback into an integrated circuit design are disclosed. In one embodiment, a computer-implemented method is disclosed including: defining an acceptable yield requirement for a first integrated circuit product; obtaining manufacturing data about the first integrated circuit product; performing a regression analysis on data representing paths in the first integrated circuit product to define a plurality of parameter settings based upon the acceptable yield requirement and the manufacturing data; determining a projection corner associated with the parameter settings for satisfying the acceptable yield requirement; and modifying a design of a second integrated circuit product based upon the projection corner and the plurality of parameter settings. | 01-17-2013 |
| 20130030744 | MONITORING SYSTEM FOR A PACKAGING SYSTEM - A monitoring system for a packaging system comprising a plurality of machine units comprises an output sensor for measuring packages output from the packaging system, a number of pairs of machine unit sensors, each pair of sensors comprising an input sensor and an output sensor, wherein the number of pairs of machine unit sensors is arranged at a number of machine units, respectively, a processing apparatus configured to receive information from the sensors, and a communications network configured to send information from the sensors to the processing apparatus. Based on the information from the number of pairs of machine unit sensors a number of wasted packages may be determined, which in turn imply that a reliable efficiency measure may be determined. | 01-31-2013 |
| 20130035888 | METHOD AND SYSTEM FOR PROVIDING A QUALITY METRIC FOR IMPROVED PROCESS CONTROL - The present invention may include acquiring a plurality of overlay metrology measurement signals from a plurality of metrology targets distributed across one or more fields of a wafer of a lot of wafers, determining a plurality of overlay estimates for each of the plurality of overlay metrology measurement signals using a plurality of overlay algorithms, generating a plurality of overlay estimate distributions, and generating a first plurality of quality metrics utilizing the generated plurality of overlay estimate distributions, wherein each quality metric corresponds with one overlay estimate distribution of the generated plurality of overlay estimate distributions, each quality metric a function of a width of a corresponding generated overlay estimate distribution, each quality metric further being a function of asymmetry present in an overlay metrology measurement signal from an associated metrology target. | 02-07-2013 |
| 20130073241 | Application Of Wideband Sampling For Arc Detection With A Probabilistic Model For Quantitatively Measuring Arc Events - An arc detection system for a plasma generation system includes a radio frequency (RF) sensor that generates first and second signals based on a respective electrical properties of (RF) power that is in communication with a plasma chamber. A correlation module generates an arc detect signal based on the first and second signals. The arc detect signal indicates whether an arc is occurring in the plasma chamber and is employed to vary an aspect of the RF power to extinguish the arc. | 03-21-2013 |
| 20130080099 | DATA ACQUISITION METHOD IN SUBSTRATE PROCESSING APPARATUS AND SENSOR SUBSTRATE - A method that acquires data on a processing module of a substrate processing apparatus using a sensor substrate efficiently and highly precisely is provided. The method includes: holding a sensor substrate by a first holding member, the sensor substrate having a sensor section for acquiring data on the processing modules and a first power supply section with a rechargeable electricity storage section for supplying electric power to the sensor section; advancing the first holding member to transfer the sensor substrate to a processing module; acquiring data on the processing module by the sensor section of the sensor substrate; and causing the first holding member to receive the sensor substrate, whose electric charge is consumed, from the processing module and retract, and with that state, charging the first power supply section of the sensor substrate in a non-contact manner by a second power supply section that moves together with the base. | 03-28-2013 |
| 20130110436 | INSPECTION APPARATUS, PROCESSING APPARATUS, INFORMATION PROCESSING APPARATUS, OBJECT MANUFACTURING APPARATUS, AND MANUFACTURING METHOD FOR AN OBJECT | 05-02-2013 |
| 20130132013 | METHOD FOR DIAGNOSING MANUFACTURING VARIANCES - A method of diagnosing manufacturing variances of an electrical, mechanical or electro-mechanical apparatus based on radiation emitted by the apparatus where the method includes establishing baseline profile for a number of apparatuses to form a set of baseline profiles for the multiple apparatuses and comparing the set of baseline profiles to determine a difference indicative of a variance in the manufacturing of the apparatuses. | 05-23-2013 |
| 20130132014 | EVALUATION FOR ETCH MASK FILM - In conjunction with a photomask blank comprising a transparent substrate, a pattern-forming film, and an etch mask film, the etch mask film is evaluated by measuring a first etching clear time (C1) taken when the etch mask film is etched under the etching conditions to be applied to the pattern-forming film, measuring a second etching clear time (C2) taken when the etch mask film is etched under the etching conditions to be applied to the etch mask film, and computing a ratio (C1/C2) of the first to second etching clear time. | 05-23-2013 |
| 20130211760 | NUMERICAL APERTURE INTEGRATION FOR OPTICAL CRITICAL DIMENSION (OCD) METROLOGY - Provided are techniques for numerically integrating an intensity distribution function over a numerical aperture in a manner dependent on a determination of whether the numerical aperture spans a Rayleigh singularity. Where a singularity exists, Gaussian quadrature (cubature) is performed using a set of weights and points (nodes) that account for the effect of the Wood anomaly present within the aperture space. The numerical aperture may be divided into subregions separated by curves where the Wood anomaly condition is satisfied. Each subregion is then numerically integrated and a weighted sum of the subregion contributions is the estimate of the integral. Alternatively, generalized Gaussian quadrature (cubature) is performed where an analytical polynomial function which accounts for the effect of the Wood anomaly present within the aperture space is integrated. Points and nodes generated from a fit of the analytical polynomial function are then used for integration of the intensity distribution function. | 08-15-2013 |
| 20130226491 | METHODS AND APPARATUS FOR HYBRID OUTLIER DETECTION - Methods and apparatus for data analysis according to various aspects of the present invention are configured to identify statistical outliers in test data for components, including hybrid outliers representing outliers within subsets of larger data populations. A method and apparatus according to various aspects of the present invention may operate in conjunction with a test system having a tester, such as automatic test equipment (ATE) for testing semiconductors. | 08-29-2013 |
| 20130262006 | White LED Quality Inspection Method and Device - A white LED quality inspection method includes steps as follows. A steady current is supplied to a LED by a rated voltage supply unit for generation of a stable light spot from the LED; a stable light spot is received by a photosensor of a luminous intensity sensing unit and transformed to digital information; the digital information is received by a preprocessing unit and transformed to pixel information; the pixel information is received by a calculation unit to calculate a Yellow Ring Index of each pixel in the pixel information. | 10-03-2013 |
| 20140032151 | INFORMATION PROCESSING APPARATUS, PROCESSING SYSTEM, PROCESSING METHOD, AND PROGRAM - An information processing apparatus for processing information on semiconductor treatment apparatus includes an abnormality information display device which displays information on an abormality in semiconductor treatment apparatus, a countermeasure information receiving device which receives countermeasure information on countermeasure, a countermeasure information storing device which stores the countermeasure information matched with abnormality identification information, an output device which outputs the countermeasure and abnormality identification information via communication device to outside, a countermeasure item display device which displays countermeasure item candidates, a countermeasure item storing device which stores countermeasure item selected from the candidates matched with the abnormality identification information, a countermeasure item transmitting device which transmits the countermeasure item and abnormality identification information via the communication device to outside, a countermeasure item statistic receiving device which receives statistic regarding the countermeasure item corresponding to the abnormality identification information from outside, and a countermeasure item statistic display device which displays the statistic. | 01-30-2014 |
| 20140067302 | PRODUCT RELIABILITY ESTIMATION - Methods and systems for systems and methods for product reliability estimation are provided. A method implemented in a computer infrastructure includes separating products into different process window segments. The method also includes calculating a product reliability estimation for each process window segment. The method further includes calculating a system product reliability estimation. At least one of the separating, calculating the product reliability estimation, and calculating the system product reliability estimation is performed using a processor. | 03-06-2014 |
| 20140088903 | MANUFACTURING CONTROL SYSTEM, AMNUFACTURING CONTROL METHOD, AND MANUFACTURING CONTROL PROGRAM - According to one embodiment, a manufacturing control system includes a reference data creating unit, first, second and third data storing units, first, second and third data extracting units. The reference data creating unit creates reference data including a reference time related to a product. The first data storing unit stores data related to parts acceptance inspection and related to assembly of the product. The second data storing unit stores data related to inspection in manufacturing. The third data storing unit stores data related to quality assurance inspection and of acceptance inspection at a customer site. The first data extracting unit extracts data related to latest parts acceptance inspection and related to latest assembly of the product. The second data extracting unit extracts data related to inspection in latest manufacturing. The third data extracting unit extracts data related to latest quality assurance inspection and of latest acceptance inspection. | 03-27-2014 |
| 20140095096 | NON-DESTRUCTIVE THERMOGRAPHIC WELD INSPECTION - A non-destructive system for characterizing welds that includes at least one weldment that further includes at least two components joined together a weld; at least one source of heat energy directed toward one side of the weldment, wherein the source of heat energy is operative to direct a predetermined amount of heat energy through the first component toward one side of the weld, through the weld and the area surrounding the weld, and through the second component to the opposite side of the weldment, and wherein the heat energy is sufficient to induce a temperature change in the weld and the area surrounding the weld; and a temperature measuring device directed toward the opposite side of the weldment for gathering temperature data from heat passing through the second component away from the weld and the area surrounding the weld, wherein the gathered temperature data is indicative of weld quality. | 04-03-2014 |
| 20140278177 | METHOD AND APPARATUS FOR LOW LATENCY COMMUNICATION IN AN AUTOMATIC TESTING SYSTEM - According to some aspects, a system and method for processing messages in a plurality of successive cycles is provided. One such system comprises a plurality of first circuits, each first circuit configured to output a message, the plurality of first circuits configured to operate synchronously, a first plurality of buffers, each buffer associated with a respective first circuit and configured to store a message output by the respective first circuit, a communication path configured to receive the plurality of messages from the buffers and to perform aggregation of the messages, thereby generating an aggregated indication, and one or more second circuits. The one or more second circuits are configured to operate synchronously and to receive the aggregated indication, wherein buffers of the first plurality of buffers are configured to store messages from respective first circuits for different times. | 09-18-2014 |
| 20140278178 | MICRO-CLIMATE DISPLAY ENCLOSURE - An enclosure for displaying artwork, historical documents, and artifacts that require controlled atmospheric conditions is provided that is low cost and less cumbersome compared to existing microclimate enclosures. The enclosure has a frame construction that is easy to set up, maintain, and monitor with a hypoxic/anoxic microclimate that protects against, oxidation of its contents, pests, and bacterial growth. The enclosure is suitable for: paintings, works on paper, ephemera, textiles, mineral specimens, archeological metallic artifacts, animal skins and other organic items, rubber and polymers, and items susceptible to insect damage. A method of testing and servicing one or more enclosures is also provided. | 09-18-2014 |
| 20140297211 | STATISTICAL MODEL-BASED METROLOGY - Methods and systems for creating a measurement model based on measured training data are presented. The trained measurement model is used to calculate process parameter values, structure parameter values, or both, directly from measured data collected from other wafers. The measurement models receive measurement data directly as input and provide process parameter values, structure parameter values, or both, as output. The measurement model enables the direct measurement of process parameters. Measurement data from multiple targets is collected for model building, training, and measurement. In some examples, the use of measurement data associated with multiple targets eliminates, or significantly reduces, the effect of under layers in the measurement result, and enables more accurate measurements. Measurement data collected for model building, training, and measurement, may be derived from measurements performed by a combination of multiple, different measurement techniques. | 10-02-2014 |
| 20140303919 | PHOTOINDUCED CARRIER LIFETIME MEASUREMENT DEVICE AND PHOTOINDUCED CARRIER LIFETIME MEASUREMENT METHOD - A photoinduced carrier lifetime measurement device includes light sources that respectively apply light that differs in wavelength and generates photoinduced carriers to a semiconductor substrate, a microwave generation section that generates microwaves that are applied to the semiconductor substrate, a detection section that detects the intensity of the microwaves that have passed through the semiconductor substrate, and a calculation section that calculates the effective carrier lifetime corresponding to the wavelength of each light based on the intensity of the microwaves detected when applying each light, and calculates the bulk carrier lifetime and a surface recombination velocity of the semiconductor substrate based on the effective carrier lifetime calculated corresponding to the wavelength of each light. | 10-09-2014 |
| 20140316730 | ON-DEVICE METROLOGY - Methods and systems for performing semiconductor metrology directly on device structures are presented. A measurement model is created based on measured training data collected from at least one device structure. The trained measurement model is used to calculate process parameter values, structure parameter values, or both, directly from measurement data collected from device structures of other wafers. In some examples, measurement data from multiple targets is collected for model building, training, and measurement. In some examples, the use of measurement data associated with multiple targets eliminates, or significantly reduces, the effect of under layers in the measurement result, and enables more accurate measurements. Measurement data collected for model building, training, and measurement may be derived from measurements performed by a combination of multiple, different measurement techniques. | 10-23-2014 |
| 20140324373 | QUALITY CONTROL SENSOR METHOD, SYSTEM AND DEVICE FOR USE WITH BIOLOGICAL/ENVIRONMENTAL RAPID DIAGNOSTIC TEST DEVICES - Quality control (QC) sensor methods, systems and devices are for use with biological/environmental rapid diagnostic test (RDT) devices and provide for automatic timers, reminders and RDT cassette images. Sensors are calibrated and optimized, and provide for quality control of the RDT devices. Image analysis identifies cassette and patient information, and evaluates the processing and conditions of the RDT devices, cassettes and RDTs. Results may be accessed and analyzed remotely from the RDT devices. RDT chain of custody and workflow, incubation and reading sequences are tracked. A QC score for each unique patient RDT is determined based on QC criteria. | 10-30-2014 |
| 20150032398 | Combined X-Ray and Optical Metrology - Structural parameters of a specimen are determined by fitting models of the response of the specimen to measurements collected by different measurement techniques in a combined analysis. X-ray measurement data of a specimen is analyzed to determine at least one specimen parameter value that is treated as a constant in a combined analysis of both optical measurements and x-ray measurements of the specimen. For example, a particular structural property or a particular material property, such as an elemental composition of the specimen, is determined based on x-ray measurement data. The parameter(s) determined from the x-ray measurement data are treated as constants in a subsequent, combined analysis of both optical measurements and x-ray measurements of the specimen. In a further aspect, the structure of the response models is altered based on the quality of the fit between the models and the corresponding measurement data. | 01-29-2015 |
| 20150051859 | ANALYTIC SYSTEM OF WAFER BIN MAP AND NON-TRANSITORY COMPUTER READABLE MEDIA THEREOF - The present invention relates to an analytic system of wafer bin map and a non-transitory computer readable media thereof. The analytic system of wafer bin map includes a wafer bin map input module, a wafer bin map database, a degeneration module, a standardization module, a coordinate transformation module, a defect density characterization module, a test of randomness module, a similarity comparison module, and a pattern evaluation module. | 02-19-2015 |
| 20150112624 | METROLOGY THROUGH USE OF FEED FORWARD FEED SIDEWAYS AND MEASUREMENT CELL RE-USE - Metrology may be implemented during semiconductor device fabrication by a) modeling a first measurement on a first test cell formed in a layer of a partially fabricated device; b) performing a second measurement on a second test cell in the layer; c) feeding information from the second measurement into the modeling of the first measurement; and after a lithography pattern has been formed on the layer including the first and second test cells, d) modeling a third and a fourth measurement on the first and second test cells respectively using information from a) and b) respectively. | 04-23-2015 |
| 20150134285 | DEVICES AND METHODS FOR COLLECTION OF DATA - Devices and methods for remotely collecting data for the assessment of value and/or like, kind, and quality are provided, including a mobile device equipped with an application configured to enable collection of data; the data acquired using the device are received by a service provider; and following the assessment transmitting of the assessment analysis by the service provide to the display of the mobile device of the user. | 05-14-2015 |
| 20150318222 | METHOD OF EVALUATING METAL CONTAMINATION IN SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER - An aspect of the present invention relates to a method of evaluating metal contamination in a semiconductor wafer that has been subjected to a heat treatment, which comprises obtaining analysis values by analyzing a plurality of analysis points on a surface of the semiconductor wafer by a first analysis method or a second analysis method, wherein in the first analysis method, analysis values employed in evaluation decrease as an amount of contamination by a metal element that is to be evaluated increases, and in the second analysis method, analysis values employed in evaluation increase as an amount of contamination by a metal element that is to be evaluated increases, and wherein determination of presence or absence of localized contamination by the metal element that is to be evaluated is made by evaluating the analysis values based on the normal value specified by a probability distribution function. | 11-05-2015 |
| 20150323457 | WAFER IMAGING AND PROCESSING METHOD AND APPARATUS | 11-12-2015 |
| 20150323586 | Hierarchical Wafer Lifetime Prediction Method - For improving wafer fabrication, yield and lifetime of wafers are predicted by determining coefficients of a yield domain for wafer yield prediction and a lifetime domain for a wafer lifetime prediction, an integral domain, an electric/layout domain, a metrology/defect domain, and a machine sensor domain in a hierarchical manner. With the aid of the hierarchically-determined coefficients, noises in prediction can be reduced so that precision of prediction results of the yields or the lifetimes of wafers can be raised. | 11-12-2015 |
| 20150346106 | METHOD AND DEVICE FOR INSPECTING AND TAILORING A MOVING PRODUCT WEB - In a method for inspecting and tailoring a predefined point of a moving product web ( | 12-03-2015 |
| 20150370247 | IDENTIFYING INTEGRATED CIRCUIT ORIGIN USING TOOLING SIGNATURE - A method for determining if an individual integrated circuit was manufactured using an individual instance of tooling includes collecting from the individual integrated circuit first data representing at least one attribute that varies as a function of the tooling used to manufacture the individual integrated circuit and second data identifying the integrated circuit as having been manufactured using the individual instance of tooling. The first data is compared to a signature of the individual instance of tooling identified by the second data. The signature is derived from the at least one attribute measured from a population of integrated circuits that were manufactured using the individual instance of tooling. The individual integrated circuit is identified as having been manufactured using the individual instance of tooling identified in the second data collected from the individual integrated circuit if the first data correlates to the signature by a predetermined threshold. | 12-24-2015 |
| 20150377793 | COMPUTERIZED METHOD AND SYSTEM FOR LIGHT PERFORMANCE GRADING OF GEMSTONES BY ONE SINGLE GRADING SCALE - There are provided a computerized method of grading a gemstone and a system thereof. The method comprises: upon obtaining in a memory of a computer a single grading scale including for each parameter a sub-grade scale, borderlines thereof, unique groups of values of the parameter and final grades corresponding to the unique groups; and upon obtaining values of the parameters of the gemstone to be graded, assigning to the obtained value of each parameter its sub-grade using the sub-grade scale and borderlines thereof specified in the single grading scale; recognizing among the unique groups specified in the single grading scale a unique group corresponding to the assigned sub-grades; and assigning to the gemstone, in accordance with the recognized unique group, a final grade in the single grading scale. | 12-31-2015 |
| 20160018320 | METHOD AND DEVICE FOR EVALUATING THE QUALITY OF A COMPONENT PRODUCED BY MEANS OF AN ADDITIVE LASER SINTERING AND/OR LASER MELTING METHOD - The invention relates to a method for evaluating the quality of a component ( | 01-21-2016 |
| 20160033251 | SYSTEM AND METHOD FOR AUTOMATED OBJECT MEASUREMENT - A method for automated part probing using a physical machine defining a physical working volume, the method including: generating a virtual model based on a virtual part design received from a user account, the virtual model comprising a virtual part model, based on the virtual part design, virtually fixed to a virtual fixture plate arranged within a virtual working volume representative of the physical working volume; generating a probing routine based on the virtual model; sending the probing routine to the machine; receiving probe outputs from the machine; and validating the virtual model based on the probe outputs. | 02-04-2016 |
| 20160063744 | Data Quality Test and Report Creation System - Embodiments relate to systems, devices, and computer-implemented methods for creating data quality tests and reports. A test creator interface for creating a test can be displayed for a user, and the user can select components of the test, select inputs for the components, and providing testing rules. Further, a report creator interface for creating a report template can be displayed for the user, and the user can provide instructions for displaying results of the test. | 03-03-2016 |
| 20160077519 | Welding Control System - A welding control system is provided for monitoring welding operations of a plurality of welding units within a production facility configured to provide weld data associated with the respective mechanical entities, including a determination unit configured to determine for each type of mechanical entity a corresponding welding error rate on the basis of weld data received from welding units of the production facility, a calculation unit configured to calculate for each type of mechanical entity the number of faulty mechanical entities of the respective entity type depending on the number of mechanical entities used and configured to weight the calculated number of faulty mechanical entities of the respective entity type with a predetermined manufacturing effort value. | 03-17-2016 |
| 20160109879 | Computer-Implemented System And Method For Attribute-Based Manufacturing Quality Control - A computer-implemented system and method for attribute-based manufacturing quality control is provided. A specification for manufacturing a part feature is maintained in a database, the specification including a nominal. Also maintained in the database are one or more measurements for the feature on a plurality of parts manufactured in accordance with the specification, each of the measurements associated with one or more attributes, each of the attributes identifying at least one of a circumstance relating to how that measurement was made and how the feature was manufactured. A user selection of one or more of the attributes is received. Each of the measurements that is associated with all of the selected attributes is identified. A score indicative of how close the identified measurements are to the nominal is calculated and displayed. | 04-21-2016 |
| 20160141193 | SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR COMBINING RAW DATA FROM MULTIPLE METROLOGY TOOLS - A system, method and computer program product are provided for combining raw data from multiple metrology tools. Reference values are obtained for at least one parameter of a training component. Signals are collected for the at least one parameter of the training component, utilizing a first metrology tool and a different second metrology tool. Further, at least a portion the signals are transformed into a set of signals, and for each of the at least one parameter of the training component, a corresponding relationship between the set of signals and the reference values is determined and a corresponding training model is created therefrom. Signals from a target component are collected utilizing at least the first metrology tool and the second metrology tool, and each created training model is applied to the signals collected from the target component to measure parametric values for the target component. | 05-19-2016 |
| 20160147883 | METHOD AND SYSTEM FOR DETERMINING DEFECTS PER UNIT OF A PRODUCT - A method, implemented on a computing device, for determining defects per unit of a product is disclosed. The method initiates with generating a data retrieval session between a processor and a database server. Thereafter, a product test data from the database server is retrieved based on a query executed by the processor. A data updating session between the database server and a plurality of data sources is then generated. The data updating session is terminated during retrieval of the product test data. Additionally, the product test data retrieved is inaccessible by the plurality of data sources. Moreover, the defects per unit is displayed through a display unit. The database server reactivates the data updating session with the data sources in response to the conclusion of the display of the defects per unit. | 05-26-2016 |
| 20160163574 | DETERMINING CRITICAL PARAMETERS USING A HIGH-DIMENSIONAL VARIABLE SELECTION MODEL - A high-dimensional variable selection unit determines a list of critical parameters from sensor data and parametric tool measurements from a semiconductor manufacturing tool, such as a semiconductor inspection tool or other types of semiconductor manufacturing tools. The high-dimensional variable selection model can be, for example, elastic net, forward-stagewise regression, or least angle regression. The list of critical parameters may be used to design a next generation semiconductor manufacturing tool, to bring the semiconductor manufacturing tool back to a normal status, to match a semiconductor manufacturing tool's results with that of another semiconductor manufacturing tool, or to develop a specification for the semiconductor manufacturing tool. | 06-09-2016 |
| 20160169818 | SCREENING OF ELECTRONIC COMPONENTS FOR DETECTION OF COUNTERFEIT ARTICLES USING AUTOMATED INSPECTION SYSTEM | 06-16-2016 |
| 20160187876 | SMART BOX FOR AUTOMATIC FEATURE TESTING OF SMART PHONES AND OTHER DEVICES - An automatic system level testing (ASLT) system for testing smart devices is disclosed. The system comprises a system controller coupled to and operable to stress a smart device in an enclosure, wherein the enclosure comprises a plurality of components, and wherein the system controller comprises: (a) a memory comprising test logic; and (b) a processor configured to automatically control the plurality of components and test the smart device in accordance with the test logic. Further, the plurality of components comprises: (a) a robotic arm comprising a stylus affixed thereto, wherein the stylus is operable to manipulate the smart device; and (b) a platform comprising a device holder affixed thereto, wherein the device holder is operable to receive the smart device, and wherein the platform and the robotic arm are robotically controlled to move by the processor. | 06-30-2016 |
| 20160202312 | METHOD OF GENERATING QUALITY AFFECTING FACTOR FOR SEMICONDUCTOR MANUFACTURING PROCESS AND GENERATING SYSTEM FOR THE SAME | 07-14-2016 |
| 20180024513 | METHOD OF MANAGING MEASURED DATA AND RELATED DATA MANAGEMENT SYSTEM | 01-25-2018 |
| 20190143521 | METHOD AND APPARATUS FOR HEALTH ASSESSMENT OF A TRANSPORT APPARATUS | 05-16-2019 |
