Class / Patent application number | Description | Number of patent applications / Date published |
700105000 | Rework or engineering change | 61 |
20080300710 | METHODS AND SYSTEMS FOR MANAGING ELECTRONIC WORK INSTRUCTIONS FOR MANUFACTURE OF PRODUCT - Methods and systems for interfacing computer modeled design and manufacture data from an Manufacturing Process Planning (MPP) system to a Manufacturing Execution System (MES) and allowing, via an integration server interface, electronic work instructions of the MPP system to be revised promptly and efficiently in mid-production manufacturing processes. | 12-04-2008 |
20090018688 | METHODS AND SYSTEMS FOR DESIGNING AND VALIDATING OPERATION OF ABATEMENT SYSTEMS - A method of developing an integrated abatement system is provided, including the steps: a) determining whether an integrated abatement system meets a destruction removal efficiency standard wherein the determination includes the steps: i) operating an electronic device manufacturing process tool using a best known method, whereby effluent containing a target species is produced; ii) abating the target species to form abated effluent, using an abatement system which is coupled to the process tool; and iii) calculating a destruction removal efficiency for the target species; and b) modifying the abatement system by altering at least one of a design parameter and an operating parameter of the abatement system to improve the destruction removal efficiency. Numerous other aspects are provided. | 01-15-2009 |
20090082894 | Online Recipe Synchronization in a Real-Time Batch Executive Environment - A method of executing a batch process in a manufacturing environment according to a product recipe, such that the product recipe specifies a plurality of actions and a plurality of parameters, includes performing at least one action of the batch process corresponding to a first version of the product recipe, receiving a second version of the product recipe, such that the second version of the product recipe is distinct from the first version of the product recipe, suspending the execution of the batch process prior to completion of the batch process, and resuming the execution of the batch process according to the second version of the product recipe. | 03-26-2009 |
20090093902 | METHOD FOR PRODUCTION SCHEDULING IN A MANUFACTURING EXECUTION SYSTEM OF A SHOP FLOOR - In a method for production planning in a manufacturing execution system of a shop floor, the following steps are performed: obtaining shop floor data from the shop floor; analyzing the shop floor data using detection logic to detect a disturbance and to provide an opportunity for a corrective action; and generating a production schedule based on the detected disturbance and opportunity for a corrective action by a scheduler. | 04-09-2009 |
20090132080 | METHOD AND DEVICE FOR COMPENSATING FOR POSITIONAL AND SHAPE DEVIATIONS - A method for compensating positional and/or shape deviations in NC-controlled cutting production machines, the method having the following steps: a) chucking a new workpiece; b) processing the workpiece using the nominal data of the NC program; c) acquisition of the set deviation; d) optimization of the NC program using the acquired data from c);and e) repetition of iterative steps a) to d) until the required positional and/or shape tolerances have been achieved. | 05-21-2009 |
20090198363 | PRODUCTION SYSTEM CREATING SYSTEM, PRODUCTION SYSTEM CREATING METHOD, AND STORAGE MEDIUM STORING PRODUCTION SYSTEM CREATING PROGRAM FOR ALLOWING COMPUTER TO EXECUTE PRODUCTION SYSTEM CREATING METHOD - To provide a production system creating system that can create a production system of an article by freely combining a plurality of production factors of various types from a superordinate concept toward a subordinate concept thereof. In a production system creating system | 08-06-2009 |
20090240364 | METHOD AND APPARATUS FOR DESIGNING AND INTEGRATED CIRCUIT - Method and apparatus for designing an integrated circuit by adding a plurality of control points to an integrated circuit wafer design. Each control point has at least one attribute. Then, an integrated circuit wafer is manufactured using the integrated circuit wafer design. A defect on the integrated circuit wafer is then located. The control points are adjusted such that they correspond with the defect. | 09-24-2009 |
20090248187 | ADVANCED PROCESS CONTROL FOR SEMICONDUCTOR PROCESSING - A computer comprising a recordable medium on which is stored instructions for at least one model-based, run-to-run controller routine is provided. The computer includes instructions to receive a first dataset regarding a first wafer after a first process, to determine a process parameter for the first process for a second wafer using the first dataset; and to determine a second process parameter for a second process for the first wafer using the first dataset. In an embodiment, the first process is an etch process. In an embodiment, the second process is a planarization process. | 10-01-2009 |
20090326698 | SYSTEM AND METHOD FOR TRACKING TRANSPORTS IN A PRODUCTION PROCESS - A method of tracking transports in a production process including processing a first transport in a first system, developing changes for the first transport, and updating the first system with the changes developed for the first transport. The method also includes processing a second transport in a second system, developing changes for the second transport, and updating the second system with the changes developed for the second transport. The method further includes moving the changes developed for the second transport to the first system, sequencing the changes developed for the first transport and the changes developed for the second transport in the first system, and processing a third transport in the first system. The third transport includes all of the changes developed for the first transport and all of the changes developed for the second transport. | 12-31-2009 |
20100010658 | CONTROL DEVICE AND CONTROL METHOD OF PLASMA PROCESSING SYSTEM, AND STORAGE MEDIUM STORING CONTROL PROGRAM - In a control device of a plasma processing system, a storage unit is configured to store a reference recipe indicating an order of the plasma processing. An operation unit calculates a state variation value of each of the plasma processing devices by a predetermined timing at a plurality of processing lot intervals. A table generation unit generates an adjusting table for adjusting the reference recipe from the calculated state variation value of each of the plasma processing devices. In addition, a process executing control unit adjusts the reference recipe by using one of the generated adjusting tables for the plasma processing devices by the table generation unit and performs the plasma processing on the target object in the corresponding plasma processing device according to an order of the adjusted reference recipe. | 01-14-2010 |
20100023151 | VAO Productivity Suite - A semiconductor fabrication facility (fab) configuration module is defined to virtually model physical systems and attributes of a fab. A data acquisition module is defined to interface with the physical systems of the fab and gather operational data from the physical systems. A visualizer module is defined to collect and aggregate the operational data gathered from the physical systems. The visualizer module is further defined to process the operational data into a format suitable for visual rendering. The processed operational data is displayed within a visual context of the fab in a graphical user interface controlled by the visualizer module. An analyzer module is defined to analyze data collected by the visualizer module and to resolve queries regarding fab performance. An optimizer module is defined to control systems within the fab in response to data collected by the visualizer module, data generated by the analyzer module, or a combination thereof. | 01-28-2010 |
20100036515 | Real-Time Assembly and Part Validation and Auto-Disposition - Real-time assembly and part validation (or “containment”) and auto-disposition in a manufacturing environment. Validation and auto-disposition are performed in a real-time, proactive manner where the validation and auto-disposition processing are not coupled to the installation process. Validation problems or issues may therefore be identified and resolved before an assembly or part is needed for installation. | 02-11-2010 |
20100057239 | SEMICONDUCTOR MANUFACTURING APPARATUS - It is determined whether or not a previously received wafer process condition can be changed to a newly received wafer process condition based on a wafer operation progress indicating which wafer is treated or untreated among a given number of wafers in a previously received lot process condition table when a new lot process condition table containing wafer process conditions corresponding to wafer identification information and having the wafer identification information all equal to wafer identification information in the previously received lot process condition table. When any wafer process condition is changeable, the wafer process condition is changed to the newly received wafer process condition. In this way, a semiconductor manufacturing apparatus can have increased yields in accordance with wafers. | 03-04-2010 |
20100057240 | METHOD FOR UPDATING MANUFACTURING PLANNING DATA FOR A PRODUCTION PROCESS - Manufacturing planning data for a production process that is managed by a manufacturing execution system is updated by way of a plurality of steps, which include: Gathering data from a PLC level relevant to the manufacturing planning data and the execution of the production process; mapping the gathered data with the current manufacturing planning data in order to determine suggested changes between the gathered data and the current manufacturing planning data; applying a predetermined update scenario for the manufacturing planning data depending on the suggested changes to update the manufacturing planning data; and adapting the current production process and optionally following production processes according to the updated manufacturing planning data. The reliability of the so-called standard data used in production planning processes is thus dramatically improved. Furthermore, since trends on possible deviations from the standard data can be recognized in real-time, it is now possible to dynamically update the standard data as soon as accompanying quality improvement programs reach those performance results which are significant for the current production plan based on the production planning data. | 03-04-2010 |
20100082143 | Data Recorder For Industrial Automation Systems - Systems and methods for efficiently improving manufacturing conditions are presented herein. A data collection component can record one or more manufacturing parameters of a product during a manufacture of the product. A historical component can retrieve stored manufacturing information related to the product. In addition, a prediction component can predict, during the manufacture, an outcome associated with the manufacture. The prediction can be based on, at least in part, the recorded manufacturing parameter(s) and the retrieved information. A specification component can determine a desired characteristic state for at least one of the recorded manufacturing parameters, and a suggestion component can recommend, during the manufacture, an adjustment of at least one parameter based on, at least in part, the predicted outcome and the desired characteristic state for the at least one recorded manufacturing parameter(s). A notification component can alert one or more factory personnel of the recommendation during the manufacture. | 04-01-2010 |
20100082144 | METHOD OF CALCULATING PATTERN-FAILURE-OCCURRENCE-REGION, COMPUTER PROGRAM PRODUCT, PATTERN-LAYOUT EVALUATING METHOD, AND SEMICONDUCTOR-DEVICE MANUFACTURING METHOD - Method of calculating pattern-failure-occurrence-region comprising calculating a pattern failure occurrence region using relation information and a layout used for forming a convex section, the relation information being a relation between a distance from a formed pattern in a film to cover the convex section on a substrate to the convex section and a region in the film in which a shape of the formed pattern cannot satisfy a predetermined condition because of influence of the convex section. | 04-01-2010 |
20100087945 | Substrate reworking system, substrate reworking method, computer program, and computer-readable storage medium - A substrate reworking system ( | 04-08-2010 |
20100106279 | SERVER DEVICE, INFORMATION PROCESSING METHOD AND PROGRAM - A server device includes: a recipe storage unit for storing therein at least a recipe used in a manufacturing apparatus; a recipe receiving unit for receiving a modified recipe in case a content of the recipe in the manufacturing apparatus is modified; a recipe accumulation unit for accumulating the recipe received by the recipe receiving unit in the recipe storage unit; a modification information composition unit for composing modification information related to a modification of the content of the recipe; a transmission destination information storage unit for storing therein transmission destination information indicating a transmission destination of the modification information; a transmission destination information acquisition unit for acquiring the transmission destination information from the transmission destination information storage unit; and a modification information transmitting unit for transmitting the modification information to the transmission destination indicated by the transmission destination information. | 04-29-2010 |
20100152876 | Method for generating layout pattern of semiconductor device and layout pattern generating apparatus - In a layout pattern generating method, a specific rework cell used for edition is specified among rework cells and fill cells which are arranged in a semiconductor chip area and a specific pattern of a predetermined shape is generated in a wiring layer for the specific rework cell. A dummy wiring pattern is arranged in at least a part of the wiring layer of and the fill cell and un-specific rework cells among the rework cell other than the specific rework cell. The specific pattern is deleted from the wiring layer for the specifying rework cell. A wiring pattern is arranged in the wiring layer for the specific rework cell by wiring the specific rework cell as a logic cell. | 06-17-2010 |
20100161100 | COMPONENT REPAIR USING REVERSE ENGINEERING - A method for modifying a component may comprise measuring the component using a modifying tool, and recording position data for the component based on the measuring. A path for the modifying tool may be provided using the position data, and the component may be modified by moving the same modifying tool based on the provided path. | 06-24-2010 |
20100168897 | Control Component and Method for an Energy Management Unit in an Industrial Automation Arrangement - A control component and method for an energy management unit (EM) in an industrial automation arrangement which is configured to control one of a process, a subprocess and a system part of the industrial automation arrangement. Here, the control component is configured to detect the energy consumption of at least one part of the industrial automation arrangement, and the control component is configured to relate the detected energy consumption to at least one stored specification. The control component is also configured to generate a request for at least one automation component as the result of the relating operation. The control component is configured to transmit a message containing the request to the automation component and to receive an acknowledgement message from this automation component, where the request is directed to changing an operational state of one of the process, subprocess and system part that is controlled by the automation component. | 07-01-2010 |
20100174393 | PHOTOMASK WITH DETECTOR FOR OPTIMIZING AN INTEGRATED CIRUCIT PRODUCTION PROCESS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT USING THE SAME - A photomask for integrated circuit production comprising a substrate, one or more layers and a detector for monitoring a process parameter of the integrated circuit production in combination with one or more of the following: communication circuitry for communicating with external equipment for the integrated circuit production, a computational processor for analyzing the monitored process parameter, and a data storage component. In addition, a method of integrated circuit production comprising the steps of providing a photomask in the integrated circuit production process and monitoring a process parameter of the integrated circuit production using the photomask, in combination with one or more following steps: analyzing the monitored process parameter using the photomask; communicating the monitored process parameter from the photomask to external equipment involved in the integrated circuit production; and storing the monitored process parameter in the photomask. For example, the photomask embodying aspects of the present invention may monitor and track the process parameter of a stepper during the integrated circuit production. The monitored data may be analyzed against the production information to determine possible adjustment or alteration to the integrated circuit production steps. | 07-08-2010 |
20100185313 | PATTERN DATA CREATING METHOD, COMPUTER PROGRAM PRODUCT, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A pattern data creating method comprising: referring to a first correspondence relation between an amount of dimension variation between a first pattern formed on a substrate and a second pattern formed by processing the substrate using the first pattern and either one of a pattern total surface area and a pattern boundary length of the first pattern; and creating pattern data for forming the first pattern. | 07-22-2010 |
20100234975 | ADVANCED PROCESS CONTROL FOR GATE PROFILE CONTROL - A method for fabricating a integrated circuit with improved performance is disclosed. The method comprises providing a substrate; performing a plurality of processes to form a gate stack over the substrate, wherein the gate stack comprises a gate layer; measuring a grain size of the gate layer after at least one of the plurality of processes; determining whether the measured grain size is within a target range; and modifying a recipe of at least one of the plurality of processes if the measured grain size of the gate layer is not within the target range. | 09-16-2010 |
20100234976 | METHOD TO IMPROVE REQUIREMENTS, DESIGN MANUFACTURING, AND TRANSPORTATION IN MASS MANUFACTURING INDUSTRIES THROUGH ANALYSIS OF DEFECT DATA - A computer-implemented method of optimizing at least one of a design, production and testing process in a mass manufacturing process includes steps of: collecting error data relating to a product; classifying the error data into categories of symptoms; mapping the symptom to a revealing condition of the product; mapping the revealing condition to a test type; mapping a scope of a fix to phases of error injection mapping; and recommending modifications to an end user for at least one of the design, production, delivery, and testing process based on the scope of the fix. | 09-16-2010 |
20100241264 | SYSTEM AND METHOD FOR MANUFACTURING AN IN-PROCESS PART - A method and system for manufacturing an in-process part is provided. The method includes manufacturing one or more primary features of the in-process part. The method also includes measuring multiple locations and attributes of the manufactured in-process part including the primary features. The method further includes designing multiple optimal locations and attributes of multiple secondary features of the in-process part based on the measured locations and attributes of the manufactured in-process part and the primary features. The method also includes manufacturing one or more secondary features of the in-process part based on the optimal design locations and attributes of the secondary features. | 09-23-2010 |
20100249974 | ADVANCED PROCESS CONTROL WITH NOVEL SAMPLING POLICY - The present disclosure provides a semiconductor manufacturing method. The method includes performing a first process to a first plurality of semiconductor wafers; determining a sampling rate to the first plurality of semiconductor wafers based on process quality; determining sampling fields and sampling points to the first plurality of semiconductor wafers; measuring a subset of the first plurality of semiconductor wafers according to the sampling arte, the sampling fields and the sampling points; modifying a second process according to the measuring; and applying the second process to a second plurality of semiconductor waders. | 09-30-2010 |
20100292824 | SYSTEM AND METHOD FOR IMPLEMENTING A WAFER ACCEPTANCE TEST ("WAT") ADVANCED PROCESS CONTROL ("APC") WITH NOVEL SAMPLING POLICY AND ARCHITECTURE - System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing a key process on a sample number of wafers of a lot of wafers; performing a key inline measurement related to the key process to produce metrology data for the wafers; predicting WAT data from the metrology data using an inline-to-WAT model; and using the predicted WAT data to tune a WAT APC process for controlling a tuning process or a process APC process. | 11-18-2010 |
20100305737 | TUNING A PROCESS CONTROLLER BASED ON A DYNAMIC SAMPLING RATE - A method for estimating a state of a process implemented by a tool for fabricating workpieces includes collecting metrology data associated with a subset of workpieces processed in the tool. The collecting exhibits an irregular pattern. Metrology data associated with a selected state observation is received for a selected run of the process. A tuning factor for the selected run is determined based on the irregular pattern. The selected state observation is discounted based on the determined tuning factor. A state estimate of the process is determined based on the discounted selected state observation. At least one process tool operable to implement the process is controlled based on the state estimate. | 12-02-2010 |
20100305738 | SYSTEMS AND METHODS FOR CONTROLLING REGISTRATION OF ADVANCING SUBSTRATES IN ABSORBENT ARTICLE CONVERTING LINES - The present disclosure relates to systems and processes for controlling the registration of advancing substrates in absorbent article converting lines. The systems and methods may utilize feedback from technologies, such as vision systems, sensors, remote input and output stations, and controllers with synchronized embedded clocks to accurately correlate registration feature detections and substrate speed control on an absorbent article converting process. The systems and methods may accurately apply the use of precision clock synchronization for both instrumentation and control system devices on a non-deterministic communications network. In turn, the clock synchronized control and instrumentation network may be used to control the substrate speed. As such, the controller may be programmed to track registration features on substrates and components along the converting line without having to account for undeterminable delays. | 12-02-2010 |
20110009996 | PERVASIVE MODEL ADAPTATION: THE INTEGRATION OF PLANNING AND INFORMATION GATHERING IN DYNAMIC PRODUCTION SYSTEMS - A computer-based method and system for pervasive model adaptation are provided. The method includes providing a production plan to a production system, executing the production plan in the production system, collecting observation data produced by at least one sensor in the production system during execution of the production plan into computer memory, calculating changes to be made to a system model in the computer memory based on the collected observation data, dynamically updating the system model according to the calculated changes, creating an updated production plan based at least partially on the dynamically updated system model, and storing the updated production plan within the computer memory. | 01-13-2011 |
20110029118 | METHOD AND APPARATUS FOR MODELING CHEMICALLY AMPLIFIED RESISTS - Some embodiments provide a system for accurately and efficiently modeling chemically amplified resist. During operation, the system can determine a quenched acid profile from an initial acid profile by applying multiple quenching models which are associated with different acid concentration ranges to the initial acid profile. One quenching model may be expressed as H=H | 02-03-2011 |
20110029119 | Process and Method for a Decoupled Multi-Parameter Run-to-Run Controller - A manufacturing process including a controller method to generate a tool setting which includes a tool offset and a device offset. The controller method uses a device parameter measurement to update the tool offset and device offset. A tool weight and a device weight is assigned so that only one of the tool offset and device offset is significantly changed during the update. The process may be applied to semiconductor device manufacturing and particularly to integrated circuit fabrication. | 02-03-2011 |
20110098838 | SYSTEM AND METHOD FOR CORRECTING SYSTEMATIC PARAMETRIC VARIATIONS ON INTEGRATED CIRCUIT CHIPS IN ORDER TO MINIMIZE CIRCUIT LIMITED YIELD LOSS - Disclosed are a system and a method of correcting systematic, design-based, parametric variations on integrated circuit chips to minimize circuit limited yield loss. Processing information and a map of a chip are stored. The processing information can indicate an impact, on a given device parameter, of changes in a value for a specification associated with a given process step. The map can indicate regional variations in the device parameter (e.g., threshold voltage). Based on the processing information and using the map as a guide, different values for the specification are determined, each to be applied in a different region of the integrated circuit chip during the process step in order to offset the mapped regional parametric variations. A process tool can then be selectively controlled to ensure that during chip manufacturing the process step is performed accordingly and, thereby to ensure that the regional parametric variations are minimized. | 04-28-2011 |
20110160890 | Methods For Generating Representations of Flatness Defects on Wafers - Methods are disclosed for generating a representation of flatness defects on a wafer. Data is received describing the thickness of the wafer at a plurality of points on a wafer divided into a plurality of sites. A reference plane is defined for each of the plurality of sites. For each of the sites, an upper plane and a lower plane are defined relative to the reference plane. A determination is made as to which of the plurality of points on the wafer represents a flatness defect by identifying which points are not disposed between the upper plane and lower plane. A representation is then generated depicting a location of each of the flatness defects on the wafer. In some embodiments, a single representation is generated depicting the location of flatness defects on a plurality of wafers. | 06-30-2011 |
20110160891 | Systems For Generating Representations of Flatness Defects on Wafers - Systems and computer-readable media having computer-executable components are disclosed for generating a representation of flatness defects on a wafer. Data is received describing the thickness of the wafer at a plurality of points on a wafer divided into a plurality of sites. A reference plane is defined for each of the plurality of sites. For each of the sites, an upper plane and a lower plane are defined relative to the reference plane. A determination is made as to which of the plurality of points on the wafer represents a flatness defect by identifying which points are not disposed between the upper plane and lower plane. A representation is then generated depicting a location of each of the flatness defects on the wafer. In some embodiments, a single representation is generated depicting the location of flatness defects on a plurality of wafers. | 06-30-2011 |
20110160892 | METHOD FOR COLOR MATCHING - The invention relates to a method for matching the color of a dry color shade standard, said method comprising the steps of A) Measuring the dry color shade standard, B) Calculating a recipe for the dry color shade standard, C) Generating a virtual wet color shade standard based on the recipe for the dry color shade standard calculated in step B), wherein the virtual wet color shade standard is generated with wet characterisation data and D) Matching the virtual wet color shade standard. The method can be used for elaboration of color shades and batch adjustment in production of paints. | 06-30-2011 |
20110190918 | Automated Logistics Support System Incorporating a Product Integrity Analysis System - A computer implemented system includes an integrated logistics support system and a product integrity analysis system that utilize an integrated database. The product integrity analysis system includes a failure mode effects and criticality analysis (FMECA) application that is operable to access a plurality of distribution references, analyze a first and a second distribution reference from the plurality of distribution references, and calculate a particular distribution for a particular part type in the first distribution reference using an associated distribution of the particular part type in the second distribution reference. | 08-04-2011 |
20110224818 | SUBSTRATE PROCESSING APPARATUS, METHOD FOR MODIFYING SUBSTRATE PROCESSING CONDITIONS AND STORAGE MEDIUM - A substrate processing apparatus includes a setting unit for setting substrate processing conditions for a substrate in a substrate processing unit for performing a process on the substrate; a detection unit for detecting an abnormality of the substrate processing unit while the substrate processing unit performs the process on the substrate under the substrate processing conditions; a stopping unit for stopping the process on the substrate of the substrate processing unit if the abnormality is detected; and a modifying unit for modifying the substrate processing conditions for a substrate on which the process is stopped to be performed by the stopping unit. Further, a method for modifying substrate processing conditions includes the steps of setting processing conditions; detecting an abnormality of the substrate processing unit; stopping the process if the abnormality is detected; and modifying the processing conditions for a substrate on which the process is stopped. | 09-15-2011 |
20110230999 | Fast Freeform Source and Mask Co-Optimization Method - The present invention relates to lithographic apparatuses and processes, and more particularly to tools for optimizing illumination sources and masks for use in lithographic apparatuses and processes. According to certain aspects, the present invention significantly speeds up the convergence of the optimization by allowing direct computation of gradient of the cost function. According to other aspects, the present invention allows for simultaneous optimization of both source and mask, thereby significantly speeding the overall convergence. According to still further aspects, the present invention allows for free-form optimization, without the constraints required by conventional optimization techniques. | 09-22-2011 |
20110231000 | POWER MONITORING DEVICE, POWER MONITORING METHOD, AND DEVICE FOR MOUNTING COMPONENT - A power monitoring device is configured to monitor power consumed in a device for mounting component, which constitutes a component mounting line. The power monitoring device includes: an operation information collecting section configured to collect in time-series operation information representing a device operation state of the device for mounting component and to create time-series data of the operation information; a power measuring section configured to measure in time-series an amount of power consumption representing an amount of power consumed in the device for mounting component and to create time-series data of the amount of power; a synchronous output section configured to output the time-series data of the operation information and the time-series data of the amount of power by synchronizing respective time axes in time-series with each other. | 09-22-2011 |
20110264256 | PROCESS CONTROL METHOD AND PROCESS CONTROL SYSTEM - A process control method is provided for controlling a tool which processes a deposition process on a plurality of wafers for a process time. The process control method comprises receiving a quantity of the wafers and calculating a deposition compensation time necessary for the deposition process performed on the wafers by the tool according to the quantity of the wafers and a deposition loading effect coefficient corresponding to the deposition process. The deposition loading effect coefficient is retrieved from a database according to a process program of the deposition process. According to the deposition compensation time, the process time is adjusted to be an adjusted process time. The deposition process is performed on the wafers for the adjusted process time by the tool. | 10-27-2011 |
20120078408 | Advanced Control System For Steam Hydrocarbon Reforming Furnaces - Embodiments of the invention provide an advanced control system for steam hydrocarbon reformer furnaces, especially steam methane reformer furnaces. As described herein, the advanced control system may improve the control quality and efficiency of adjusting steam hydrocarbon reformer furnaces operating coefficients. As a result, the steam hydrocarbon reformer furnace operations become more stable, resulting in energy savings and improved furnace yield. | 03-29-2012 |
20120083916 | DISPLACEMENT CALCULATION METHOD, DRAWING DATA CORRECTION METHOD, SUBSTRATE MANUFACTURING METHOD, AND DRAWING APPARATUS - Correction values (ΔX | 04-05-2012 |
20120116567 | SUBSTRATE TREATMENT APPARATUS, METHOD OF TRANSFERRING SUBSTRATE, AND NON-TRANSITORY COMPUTER STORAGE MEDIUM - A coating and developing treatment apparatus includes a substrate transfer mechanism; a defect inspection section; means for controlling transfer of a substrate; means for classifying a defect based on the state of the defect; means for storing a transfer route of the substrate by the substrate transfer mechanism when the substrate has been treated by treatment sections; and means for specifying, based on a kind of the defect classified by the defect classification means and the transfer route of the substrate stored in the storage means, a treatment section which is a cause of occurrence of the classified defect, and judging presence or absence of an abnormality of the specified treatment section, wherein the transfer control means controls the substrate transfer mechanism to transfer a substrate bypassing the treatment section which has been judged to be abnormal by the defective treatment specification means. | 05-10-2012 |
20120123581 | Metrology Method and Inspection Apparatus, Lithographic System and Device Manufacturing Method - Methods are disclosed for measuring target structures formed by a lithographic process on a substrate. A grating structure within the target is smaller than an illumination spot and field of view of a measurement optical system. The optical system has a first branch leading to a pupil plane imaging sensor and a second branch leading to a substrate plane imaging sensor. A spatial light modulator is arranged in an intermediate pupil plane of the second branch of the optical system. The SLM imparts a programmable pattern of attenuation that may be used to correct for asymmetries between the first and second modes of illumination or imaging. By use of specific target designs and machine-learning processes, the attenuation patterns may also be programmed to act as filter functions, enhancing sensitivity to specific parameters of interest, such as focus. | 05-17-2012 |
20120143365 | RAPID REWORK ANALYSIS SYSTEM - A rework system for a vehicle having an inconsistency on a component of the vehicle. A rework assessor is configured to examine a rework parameter array to ascertain whether a rework procedure is to be performed. The rework parameter array defines at least volumetric dimensions of the component, a type of the inconsistency, and location coordinates of the inconsistency with respect to the component or the vehicle. A rework interrogator is in communication with the rework assessor. The rework interrogator is configured to, when a rework is to be performed, identify a candidate for addressing the inconsistency. The candidate selected from the group that includes: a candidate part, a candidate rework procedure, and both the candidate part and the candidate rework procedure. | 06-07-2012 |
20120191236 | DISCRETE SAMPLING BASED NONLINEAR CONTROL SYSTEM - System, method and computer program product including instructions executed by a processor system for configuring and controlling a facility to perform a manufacturing process and updating a tool controlling the process according to a model employed for mapping calculated coefficients that characterize non-linear variations observed of a product to actual control parameters governing the processes/tools used by the facility during the manufacturing process. In a semiconductor manufacturing process, the method enables real-time control of variation in an exposure step of a patterning process using an exposure tool to minimize a nonlinear variation in one or more pattern attributes by adjusting the exposure tool or the patterning process corresponding to the calculated coefficients. In the method, measurements of product attributes, obtained by finite sampling over a well defined domain (e.g., a region such as a field/wafer in lithographic patterning), are projected onto a predefined reference mesh spanning the domain, using a physically based model comprised of functions constructed to be orthogonal and normalized over a discrete set of reference mesh locations. | 07-26-2012 |
20130173041 | INTEGRATED INTERFACING SYSTEM AND METHOD FOR INTELLIGENT DEFECT YIELD SOLUTIONS - Disclosed is an integrated interfacing system for intelligent defect yield solutions. The integrated interfacing system is configured to have a web server, which initiates a web interface for containing a plurality of functional items provided for clicking to activate a corresponding function. Through the graphical user interface, users may select one or more functions for viewing the multiple solutions regarding wafer yield. The system uses a memory to store the computer-executable instructions for selectively performing corresponding functionalities. When the wafer images are inputted through the interface, the system performs a defect coordinate conversion, dashboard summary, defect screening, defect sampling, defect yield diagnosis, design for yield, yield prediction, pattern diagnosis, data management, and system administration. By the interfacing system, an additional viewing method is also introduced to provision of full-chip viewing over the data retrieved during the wafer manufacturing procedure. | 07-04-2013 |
20130190914 | Aerodynamic Analysis for Quality Assurance of Manufactured Parts - According to one embodiment, a quality analyzer receives aerodynamic performance data for a part that has been manufactured according to a design. The aerodynamic performance data expresses aerodynamic performance of the part as calculated from a plurality of coordinates measured on the part. The quality analyzer determines whether the aerodynamic performance data for the part satisfies minimum aerodynamic performance requirements. | 07-25-2013 |
20130289757 | INFORMATION PROCESSING APPARATUS FOR DISCRIMINATING BETWEEN COMBINED RESULTS OF PLURALITY OF ELEMENTS, PROGRAM PRODUCT AND METHOD FOR SAME - An information processing apparatus, article of manufacture and method for discriminating between combined results of a plurality of elements. The apparatus includes: an assigning unit that assigns an element identification value to each of a plurality of basic elements, a generating unit that combines two or more basic elements, among the plurality of basic elements, so as to generate a combined element representing the two or more combined basic elements, and a calculating unit that merges, through an operation corresponding to an element combination method, a plurality of element identification values individually assigned to the plurality of basic elements contained in the combined element so as to calculate one element identification value for the combined element, where two elements are combined by an order-considered or ordered-ignored combination method, the calculating unit merges two corresponding element identification values through an operation where the commutative law holds or does not hold. | 10-31-2013 |
20140018951 | METHOD AND SYSTEM FOR DETERMINING AND MANAGING SUPPLY CHAIN RISK - The present disclosure discloses a supply chain management system that can estimate manufactured item delivery times at a facility, manufactured item costs or prices, and dynamically control supply chain performance. | 01-16-2014 |
20140074274 | THREE-DIMENSIONAL PRINTING OF LARGE OBJECTS - A variety of techniques are disclosed for visual and functional augmentation of a three-dimensional printer. | 03-13-2014 |
20140200699 | SUPPORT SYSTEM - A design support system and a method of generating and using a customisable analysis report comprising functional safety data for an electronic component, such as microcontroller, are described. | 07-17-2014 |
20140214192 | Apparatus For Design-Based Manufacturing Optimization In Semiconductor Fab - A design-based manufacturing optimization (DMO) server comprises a distributed computing system and a DMO software module incorporating with a design scanner to scan and analyze design data of a semiconductor device for optimizing manufacturing of the semiconductor device. The DMO software module sets up a pattern signature database and a manufacturing optimization database, generates design-based manufacturing recipes, interfaces with manufacturing equipment through a manufacturing interface module, and interfaces with electronic design automation suppliers for the design data through a design interface module. The DMO server executes the design-based manufacturing recipes for manufacturing optimization. | 07-31-2014 |
20140303767 | Method for Operating a Production Plant - A method for operating a production plant having a plurality of work stations to carry out at least one respective work step by a control system allocated to the production plant involves a control system assigning human workers or robots to work stations according to at least one criterion relating to a production requirement, wherein each worker or robot can be assigned to one or several work stations. | 10-09-2014 |
20140364984 | Replacement of suspect or marginally defective computing system components during fulfillment test of build-to-order test phase - A fulfillment test of a computing system having components is performed within a build-to-order test phase. Responsive to the fulfillment test failing, the component that most contributed to the fulfillment test failing is replaced, regardless of whether the given component was determined to be suspect or marginally defective pursuant to a fabrication test previously performed within a build-to-plan test phase. Any other component of that contributed to the fulfillment test failing and that was determined to be suspect or marginally defective pursuant to the fabrication test previously performed within the build-to-plan test phase is also replaced. | 12-11-2014 |
20150066183 | METHOD OF MAKING SEMICONDUCTOR DEVICES AND A CONTROL SYSTEM FOR PERFORMING THE SAME - A method of making a semiconductor device includes collecting process control parameters during operation of a processing tool processing a product. The method further includes calculating a processing tool offset for the processing tool based on the collected process control parameters and calculating a product offset based on the collected process control parameters. The method further includes determining whether the product offset is stable and calculating an offset time for processing the product using the processing tool based on the calculated processing tool offset if the product offset is stable. | 03-05-2015 |
20160048126 | GENERATING WORK PRODUCT PLANS SPECIFYING PROPORTIONS OF CONSTITUENTS TO BE USED IN FORMING A WORK PRODUCT - A method includes receiving a given work product plan specifying a set of constituents to be used in forming a given work product, each constituent having one or more properties, the given work product being associated with a given class of work products. The method also includes obtaining information associated with one or more existing work product plans for one or more existing work products in the given class from a knowledge database and selecting proportions of the set of constituents to be used in forming the given work product based at least in part on distributions of characteristics associated with types of constituents used in forming existing work products in the given class and of properties of constituents used in forming existing work products in the given class. The method further includes generating an updated work product plan for the given work product specifying the selected proportions of the set of constituents to be used in forming the given work product. | 02-18-2016 |
20160103448 | TIRE UNIFORMITY IMPROVEMENT THROUGH IMPROVED PROCESS HARMONIC RESOLUTION - Methods and systems for improving tire uniformity through identification of characteristics of one or more candidate process effects are provided. The magnitudes of process harmonics associated with one or more candidate process effects can be identified by combining uniformity measurements for a set of tires to achieve an enhanced resolution for a sampling of the process harmonic. The enhanced resolution approach can combine uniformity measurements for a set of a plurality of tires that are slightly offset from one another to generate a composite process harmonic sampling. In particular, the composite process harmonic sampling can be generated by aligning the uniformity measurements for each tire in the set of tires based on the azimuthal location of the maximum magnitude of the process harmonic on each tire. The magnitude of the process harmonic can then be determined using the composite process harmonic sampling. | 04-14-2016 |
20160179082 | A METHOD AND SYSTEM FOR CONTROLLING THE PRODUCTION PROCESS OF A PRODUCT | 06-23-2016 |