| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 528421000 | Reactant has a three-membered ring containing oxygen and two carbon atoms, i.e., 1,2-epoxy | 21 |
| 20080200642 | Method For Making a Chlorhydrine by Reaction Between a Polyhydroxylated Aliphatic Hydrocarbon and a Chlorinating Agent - Process for preparing a chlorohydrin from a polyhydroxylated aliphatic hydrocarbon, from an ester of a polyhydroxylated aliphatic hydrocarbon or from a mixture thereof, and from a chlorinating agent, the chlorinating agent comprising at least one of the following compounds: nitrogen, oxygen, hydrogen, chlorine, an organic hydrocarbon compound, an organic halogen compound, an organic oxygen compound and a metal. | 08-21-2008 |
| 20080281074 | Compounds and Methods for Reversible Modification of Biologically Active Molecules - The present invention is directed compounds for reversibly modification of biologically active molecules. Described are polyconjugates systems that incorporate targeting, anti-opsonization, anti-aggregation, and transfection activities into small biocompatible in vivo delivery conjugates. The use of reversible modification provides for physiologically responsive activity modulation. | 11-13-2008 |
| 20090036644 | METHOD OF REMOVING RESIDUAL ETHYLENE OXIDE MONOMER IN POLYETHYLENE OXIDE - The present invention relates to a method of removing a residual ethylene oxide monomer in polyethylene oxide used as a raw material for pharmaceutical preparations. More particularly, the method of the present invention comprises retaining high-molecular weight polyethylene oxide particles at a temperature not higher than a crystal melting point of the polyethylene oxide in the absence of an aggregation inhibitor under an atmospheric pressure in the standing state and, then, cooling the particles to 40° C. or lower under an atmospheric pressure and in the standing state, thereby, reducing a residual ethylene oxide monomer concentration to 1 ppm or lower without influencing on physical properties such as a specific surface area of the high-molecular weight polyethylene oxide particles. | 02-05-2009 |
| 20090093611 | Epoxy/modified silicon dioxide corrosion resistant nanocomposite material and preparation method thereof - An epoxy/modified silicon dioxide corrosion resistant nanocomposite material and a preparation method thereof are disclosed. The method includes the steps of: dispersing TS(TEOS-SiO | 04-09-2009 |
| 20090118463 | Ink channel forming member - An ink channel forming member, wherein a layer containing a diacetylene tetraol compound represented by General Formula 1 below is formed on the surface of a base material, and the layer inhibits adhesion of air bubbles thereto: | 05-07-2009 |
| 20090270588 | PROCESS FOR PRODUCING DICHLOROPROPANOL - Process for producing dichloropropanol wherein glycerol is reacted with at least one chlorinating agent in a reactor made of or coated with materials selected from enamelled steel, polyolefins, fluorinated polymers, phenolic resins, tantalum, and silver. | 10-29-2009 |
| 20090275726 | PROCESS FOR PRODUCING EPICHLOROHYDRIN - Process for producing epichlorohydrin comprising subjecting to a dehydrochlorination operation, dichloropropanol produced from glycerol comprising aldehydes. | 11-05-2009 |
| 20090281276 | Method for Functionalization of Nanoscale Fibers and Nanoscale Fiber Films - A method is provided for functionalizing nanoscale fibers including reacting a plurality of nanoscale fibers with at least one epoxide monomer to chemically bond the at least one epoxide monomer to surfaces of the nanoscale fibers to form functionalized nanoscale fibers. Functionalized nanoscale fibers and nanoscale fiber films are also provided. | 11-12-2009 |
| 20090326189 | PROCESS FOR CONTINUOUS PRODUCTION OF EPOXY RESINS - An epoxy resin with amine functionality is manufactured continuously through a first reaction zone in which an epoxide-functional resin is made by ring-opening addition, a second reaction zone in which the resin is reacted with amine to make an epoxide-functional product, and a third reaction zone in which the epoxide functional product is reacted with amine to make the epoxy resin with amine functionality. In other embodiments, some amine may be added in the first reaction zone to produce an epoxide functional product, with elimination of the second reaction zone, or all of the amine reactant may be added in the first reaction zone to produce an amine functional product, with elimination of both the second and third reaction zones. Optionally, solvent may be removed in an evaporation zone and recycled into the continuous process and further zones may be included to incorporate crosslinker, additives, and to emulsify the resin. | 12-31-2009 |
| 20100022745 | ONE COMPONENT RESIN COMPOSITION CURABLE WITH COMBINATION OF LIGHT AND HEAT AND USE OF THE SAME - A one component resin composition curable with a combination of light and heat, which comprises (1) an epoxy resin, (2) an acrylic ester monomer and/or methacrylic ester monomer, or an oligomer thereof, (3) a latent epoxy curing agent, (4) a photo radical initiator, and (5) a compound having two or more thiol groups per molecule, wherein the ingredient (5) is contained in an amount of 0.001 to 5.0 parts by weight per 100 parts by weight of this resin composition. According to the present invention, a one component resin composition curable with a combination of light and heat, which has excellent curability especially in a light-shielded area can be provided. Also, a liquid crystal sealant composition curable with a combination of light and heat, which is applicable to the one-drop-fill method and has excellent curability in light-shielded areas and adhesion reliability, especially high-temperature and high-humidity adhesion reliability, can be provided. | 01-28-2010 |
| 20100069604 | BLOCK FUNCTIONALIZATION METHODS - Epoxy resins are chemically attached to carbon nanotubes (CNTs), in a one-step process in which a reaction mixture comprising the epoxy polymer, the CNTs and a bridging agent which is a chemical compound capable of forming living polymers, e.g. styrene or MMA is formed and radical formation is initiated in the reaction mixture; the epoxy polymer or monomer grafts onto the CNTs through the intermediary block of the bridging agent. | 03-18-2010 |
| 20100105862 | Process for the manufacture of dichloropropanol - Process for manufacturing dichloropropanol via reaction between glycerol and/or monochloropropanediol and a chlorinating agent in a reactor which is supplied with one or more liquid streams, in which the sum of the glycerol and monochloropropanediol contents in all the liquid streams introduced into the reactor is less than 50 wt % and in which all the liquid streams introduced into the reactor comprise at least one liquid recycling stream, the recycling stream forming at least 10 wt % of all the liquid streams introduced into the reactor. | 04-29-2010 |
| 20100179302 | Manufacture of Dichloropropanol - Manufacture of dichloropropanol Process for manufacturing dichloropropanol wherein a glycerol-based product comprising at least one diol containing at least 3 carbon atoms other than 1,2-propanediol, is reacted with a chlorinating agent, and of products derived from dichloropropanol such as epichlorohydrin and epoxy resins. No figure. | 07-15-2010 |
| 20110028683 | Composition comprising glycerol, process for obtaining same and use thereof in the manufacture of dichloropropanol - A composition comprising glycerol and at least one cyclic oligomer of glycerol, a process for obtaining the composition, and its use in the manufacture of dichloropropanol and of derived products such as epichlorohydrin and epoxy resins. | 02-03-2011 |
| 20110218322 | POLYALKYLENE GLYCOL DERIVATIVE AND PROCESS FOR PRODUCING SAME - An object of the present invention is to provide a process for producing a polyalkylene glycol derivative having such high molecular weight and purity that the derivative can be used in pharmaceutical applications. | 09-08-2011 |
| 20110237773 | Glycerol treatment process - Process for treating a glycerol product contaminated with at least one glycerol alkyl ether in order to convert at least one portion of the glycerol alkyl ether to glycerol, in which the glycerol product is subjected to a reaction with at least one halo-de-alkoxylation agent introduced during the treatment, and in which the molar ratio of the total amount of the halo-de-alkoxylation agent to the total amount of the glycerol alkyl ether present in the glycerol product before the treatment, is greater than or equal to 0.1 and less than or equal to 1 000 000. | 09-29-2011 |
| 20120165502 | MOLDED BODY PRODUCTION DEVICE, MOLDED BODY PRODUCTION METHOD, AND MOLDED BODY - In a molded body production device, a release agent injection means applies a release agent onto an upper punch surface by injecting the release agent toward the upper punch surface in a state that an upper punch is located above an upper end surface of a molding die, and applies the release agent onto a lower punch surface and an inner circumferential surface exposing above the lower punch surface by injecting the release agent toward the lower punch surface in a state that the lower punch surface is located into the cavity and below the upper end surface of the molding die, before the molding material is filled into the cavity. This makes it possible to prevent the molding material from bonding to the upper punch surface, the lower punch surface and the inner circumferential surface defining the cavity. | 06-28-2012 |
| 20130131309 | SYNTHESIS OF HIGH MOLECULAR WEIGHT PEO USING NON-METAL INITIATORS - A new synthetic method to prepare high molecular weight poly(ethylene oxide) with a very narrow molecular weight distribution (PDI<1.5) is described. The method involves a metal free initiator system, thus avoiding dangerous, flammable organometallic compounds. | 05-23-2013 |
| 20140303342 | One Component Epoxy Curing Agents Comprising Hydroxyalkylamino Cycloalkanes - Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing. | 10-09-2014 |
| 20140316102 | METHOD OF PREDICTING VISCOSITY BEHAVIOR OF THERMOSETTING RESIN, SIMULATION SOFTWARE, METHOD OF PRODUCING THERMOSETTING RESIN, AND UNDERFILL PRODUCED IN THE PRODUCTION METHOD - A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained. The method includes: measuring a reaction rate and measuring viscosity behavior to measure a calorimetry peak and viscosity behavior of the thermosetting resin with three or more rates of temperature increase respectively; fitting a reaction rate to fit measurement data with each rate of temperature increase obtained by the measuring a reaction rate to a Kamal model formula to obtain fitting curves; fitting viscosity behavior to fit parameters in the Kamal model formula and the measurement data for each rate of temperature increase obtained by the measuring viscosity behavior to a Castro-Macosko model formula to obtain fitting curves; and calculating virtual viscosity behavior to calculate virtual viscosity behavior of the thermosetting resin at the arbitrary rate of temperature increase by simulation based on each fitting curve for each rate of temperature increase obtained by the fitting viscosity behavior. | 10-23-2014 |
| 20140316103 | INSULATING MATERIAL USING EPOXY RESIN COMPOSITION - An insulating material obtained by using an epoxy resin composition comprising, as an epoxy resin curing agent, a polycondensation-type aryloxysilane compound contained in an amount of 50 to 100 wt %, having a hydroxyl group equivalent in a range of 1,000 to 8,000 g/eq, and an epoxy resin having an epoxy equivalent of 200 to 500, wherein a thermally cured product obtained by curing this epoxy resin composition at a temperature of 180° C. or lower, shows a dielectric constant and a dielectric loss tangent of 3.00 or smaller and 0.015 or smaller, respectively, at 1 GHz under normal temperature. The insulating material using the epoxy resin composition can exhibit both excellent dielectric properties and practical characteristics, and is suitable for an interlayer insulating material of a multilayer printed circuit board. | 10-23-2014 |
