| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 528350000 | From carboxylic acid having three or more carboxylic acid groups or derivatives thereof, and an organic amine, or from an organic amine salt of a tri-or higher carboxylic acid | 33 |
| 20140221601 | AMINE/THIOL CURING OF BENZOXAZINES - Novel oligomers and polymers derived from the reaction of benzoxazine compounds with a mixture of thiol compounds and amine compounds are disclosed. The compositions are useful in coating, sealants, adhesive and many other applications. | 08-07-2014 |
| 528351000 | Polymerizing in the presence of a specified material other than a reactant | 3 |
| 20140275470 | DIANHYDRIDE MONOMER HAVING SIDE CHAIN, POLYIMIDE COMPOUND HAVING SIDE CHAIN AND MANUFACTURING METHOD THEREOF - A dianhydride monomer having a large side chain R is provided. The large side chain would interrupt the symmetry and regularity of diamine monomer. The diamine monomer has the general formula shown as formula (I) below: | 09-18-2014 |
| 20140336352 | POLYIMIDE FILM - The present invention provides a polyimide film which is both outstandingly transparent and highly heat resistance, and which can be usefully employed as a transparent electrically conductive film, a TFT substrate, a flexible printed circuit substrate, and the like. | 11-13-2014 |
| 20160122474 | METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING POLYIMIDE - A method for producing a polyimide precursor, including: reacting tetracarboxylic dianhydride represented by the following General Formula (1) with a diamine compound represented by the following General Formula (2) in a compressive fluid to thereby produce a polyimide precursor represented by the following Formula (3): | 05-05-2016 |
| 528352000 | Phosphorus- or sulfur-containing reactant | 2 |
| 20080319159 | SINGLE-STEP-PROCESSABLE POLYIMIDES - A process for synthesizing formulations for polyimides suitable for use in high-temperature composites in which all reactions other than chain-extension have already taken place prior to making a composite is described, wherein the resulting oligomers comprise a backbone and at least one difunctional endcap. The resulting resin systems have only the single step of endcap-to-endcap reactions during composite processing. Prior to the initiation temperature of these endcap-to-endcap reactions, the resins are stable affording the composite manufacturer a very large processing window. | 12-25-2008 |
| 20090182116 | MANUFACTURE OF PHOSPHORUS-CONTAINING DIAMINES AND THEIR DERIVATIVES - A series of novel phosphorus-containing compounds having the following formula are disclosed: | 07-16-2009 |
| 528353000 | Carboxylic acid contains at least four carboxylic acid groups or is a derivative of a carboxylic acid containing at least four carboxylic groups | 27 |
| 20080269458 | POLYIMIDE AND LIQUID CRYSTAL ALIGNMENT FILM THEREOF - The present invention provides a polyimide having the formula (II) formed by reacting a dianhydride with the diamine having the formula (I). The polyimide provided by the present invention serves as a material for preparing the liquid crystal aligning film, wherein the liquid crystal aligning film could achieve the pre-tilt angle of 88-90° by containing only less than 5% of the diamine having the formula (I), which could highly lower down the manufacturing cost. | 10-30-2008 |
| 20090082543 | METHOD OF PREPARING POLY(AMIC ACID) AND METHOD OF PREPARING POLYIMIDE - A method of preparing a poly(amic acid) includes a step of reacting an aromatic diacid anhydride or alicyclic diacid anhydride, an aliphatic diamine or alicyclic diamine, and an acid having a pKa of 3 to 5. A method of preparing a polyimide by imidating the resulting poly(amic acid) is also disclosed. | 03-26-2009 |
| 20090088551 | POLYIMIDE FILM - The objective of the present invention is to provide a polyimide film with decreased water absorption. A polyimide film, which is made of diamine and tetracarboxylic dianhydride, characterized in that tetracarboxylic dianhydride, which constitutes polyimide, contains tetracarboxylic dianhydride. | 04-02-2009 |
| 20090118461 | Wholly Aromatic Liquid Crystalline Polyetherimide (LC-PEI) Resins - The benefits of liquid crystal polymers and polyetherimides are combined in an all-aromatic thermoplastic liquid crystalline polyetherimide. Because of the unique molecular structure, all-aromatic thermotropic liquid crystal polymers exhibit outstanding processing properties, excellent barrier properties, low solubilities and low coefficients of thermal expansion in the processing direction. These characteristics are combined with the strength, thermal, and radiation stability of polyetherimides. | 05-07-2009 |
| 20090137770 | POLYMIDE OPTICAL COMPENSATION FILMS - A polyimide optical compensation film is provided. The polyimide optical compensation film has the formula: | 05-28-2009 |
| 20090171063 | Polyimide film and methods relating thereto - A polyimide film with advantageous handleability, flexibility, dimensional stability and heat resistance is provided. The polyimide film is characterized by block-copolymerizing an aromatic diamine component comprising 10˜25 mol % of paraphenylenediamine (a1) and 75˜90 mol % of 4,4′-diaminodiphenyl ether (a2) with an aromatic tetracarboxylic acid component consisting of 75˜99.9 mol % of pyromellitic acid dianhydride (b1) and 0.1˜25 mol % of 3,3′,4,4′-biphenyl tetracarboxylic acid dianhydride (b2). The Young's modulus, linear expansion coefficient, water absorption rate and glass transition temperature of such polyimide films can be controlled within very useful ranges. | 07-02-2009 |
| 20090253891 | CLEANING SUBSTRATE OF SUBSTRATE PROCESSING EQUIPMENT AND HEAT RESISTANT RESIN PREFERABLE THEREOF - The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×10 | 10-08-2009 |
| 20100041860 | POLYIMIDE, DIAMINE COMPOUND AND METHOD FOR PRODUCING THE SAME - A polyimide obtained by reacting a tetracarboxylic acid component with a diamine component containing a diamine compound represented by the following general formula (1): | 02-18-2010 |
| 20100305299 | BIPHENYLTETRACARBOXYLIC ACID DIANHYDRIDE AND PROCESS FOR PRODUCING THE SAME, AND POLYIMIDE FORMED FROM THE SAME AND PROCESS FOR PRODUCING THE SAME - To provide a process for producing BPDA whereby high productivity is attained while high purity is maintained. | 12-02-2010 |
| 20110178266 | POLYIMIDE FILM - Disclosed is a polyimide film, which is very transparent and very resistant to heat and thus undergoes little dimensional change under thermal stress, and is suitable for use in transparent conductive films, TFT substrates, flexible printed circuit boards and so on. | 07-21-2011 |
| 20110245455 | POLYIMIDE FILM - The present invention provides a polyimide film having a good transparency and also an excellent thermal resistance so that it is useful in a transparent conductive film, TFT substrate, a flexible printing circuit substrate, and the like. | 10-06-2011 |
| 20110257360 | TETRACARBOXYLIC ACID OR POLYESTERIMIDE THEREOF AND PROCESS FOR PRODUCING THE SAME - The present invention provides a useful and novel alicyclic polyesterimide. | 10-20-2011 |
| 20110257361 | ALKYL BENZENE TETRACARBOXYLIC DIANHYDRIDE, MANUFACTURING METHOD THEREOF, POLYIMIDE, AND APPLICATION THEREOF - Disclosed is a 5-alkyl-1,2,3,4-benzene tetracarboxylic-1:2,3:4-dianhydride which is represented by the general formula (1) and has excellent solubility with respect to various organic solvents. Depending on the diamine that is used, a polyimide with excellent heat resistance or a polyimide with good workability at a low melting point can be provided, and in addition, a polyimide that exhibits excellent characteristics for electronic materials or the like can be provided. | 10-20-2011 |
| 20120029164 | ESTER GROUP-CONTAINING TETRACARBOXYLIC ACID DIANHYDRIDE, POLYESTER POLYIMIDE PRECURSOR, POLYESTERIMIDE, AND METHODS FOR PRODUCING SAME - Disclosed is a polyesterimide having a repeating unit expressed by the formula below, and also provides the manufacturing methods thereof: | 02-02-2012 |
| 20130005940 | POLYIMIDE NANOWEB - A nanoweb that contains a plurality of nanofibers wherein the nanofibers contain a fully aromatic polyimide that is characterized by having a crystallinity index (CI) and a degree of imidization (DOI). The product of the DOI and the CI is between 0.08 and 0.25 or above a lower limit to obtain a desired tensile strength and/or toughness. The nanoweb may for example have a tensile strength per unit basis weight of greater than 15 kg/cm | 01-03-2013 |
| 20130012682 | BIPHENYLTETRACARBOXYLIC ACID DIANHYDRIDE AND PROCESS FOR PRODUCING THE SAME, AND POLYIMIDE FORMED FROM THE SAME AND PROCESS FOR PRODUCING THE SAME - To provide a process for producing BPDA whereby high productivity is attained while high purity is maintained. | 01-10-2013 |
| 20130018167 | Solvent-Soluble 6,6-Polyimide Copolymers and Processes for Preparing ThemAANM Itatani; HiroshiAACI Ushiku-shiAACO JPAAGP Itatani; Hiroshi Ushiku-shi JP - Heat-resistant polyimide copolymers having the following four components: pyromellitic dianhydride (PMDA), 1,4-diaminodiphenyl ether (DADE), biphenyltetracarboxylic dianhydride (BPDA), and 2,4-diaminotoluene (DAT) are provided. In an embodiment the molar ratio of (BPDA):(DADE):(PMDA):(DAT) is 2:2:m:m, in which m is an integer of 3, 4 or 5. | 01-17-2013 |
| 20140058060 | POLYIMIDE FILM PRODUCTION METHOD, POLYIMIDE FILM PRODUCTION APPARATUS, AND POLYIMIDE FILM - A polyimide film which rarely undergoes the formation of bubbles, blisters or the like, even when heated to a high temperature; and a production method and a production apparatus for the polyimide film. The polyimide film production apparatus includes a support body, a cast furnace and a cure furnace, wherein the cure furnace is partitioned into multiple zones so that the temperature of a self-supporting film can be increased in a stepwise manner, and an infrared electric heater, which is disposed at a predetermined distance from the film, is arranged in a zone for heating the atmosphere of the self-supporting film to a temperature of 450° C. or higher on the upper surface side and/or the lower surface side of the self-supporting film. The polyimide production apparatus enables the production of a polyimide film which has a volatile content of 0.1 mass % or less after being heated at 450° C. for 20 minutes. | 02-27-2014 |
| 20140336353 | NEW POLYMERS DERIVED FROM RENEWABLY RESOURCED LYSINOL - Disclosed are salt compositions of lysinol and dicarboxylic acids; and lysinol derived polymers including polyamide, polyimide, polyurea, cross-linked polyurea comprising urethane linkages, polyurea foams, cross-linked polyurea foams, and lysinol-epoxy thermoset. | 11-13-2014 |
| 20140378645 | LIQUID CRYSTAL ALIGNING AGENT - A problem of the present invention is to provide a liquid crystal aligning agent which never deteriorates even in a method where UV is irradiated such as a liquid crystal dropping method or the like, and is capable of forming a liquid crystal alignment film having high UV resistance. | 12-25-2014 |
| 20150344626 | DIANHYDRIDE AND POLYIMIDE - A dianhydride and a polyimide formed by the same are provided. The dianhydride has a chemical structure represented below: | 12-03-2015 |
| 20160032055 | POLYAMIC ACID, VARNISH COMPRISING SAME AND POLYIMIDE FILM - The present invention addresses the problem of providing: a polyimide film that has a small phase difference in the thickness direction and has a low coefficient of linear thermal expansion; and a polyamic acid and varnish to obtain the same. In order to solve this problem, the present invention provides a polyimide film which comprises polyimide that is produced by reacting a diamine component and a tetracarboxylic dianhydride component, the polyimide film having a coefficient of linear thermal expansion of 35 ppm/K or less over a temperature range of 100 to 200 DEG C, an absolute value of phase difference in the thickness direction of 200 nm or less per 10 μm thickness, a glass transition temperature of 260 DEG C or more, and a total light transmittance of 85% or more. | 02-04-2016 |
| 20160152630 | DIANHYDRIDES, POLYIMIDES, METHODS OF MAKING EACH, AND METHODS OF USE | 06-02-2016 |
| 20160159985 | SOLVENT SOLUBLE POLYIMIDE COPOLYMER - Provided is a solvent-soluble polyimide copolymer which satisfies storage stability and heat resistance at high levels and has excellent utility. The polyimide copolymer is obtained by copolymerizing (A) 3,3′,4,4′-biphenyltetracarboxylic dianhydride with (B) diamine(s) and/or diisocyanate(s) and has no glass transition temperature observed at lower than 500° C. The component (B) is preferably at least one diamine and/or diisocyanate represented by the following Formulae (1) to (3): | 06-09-2016 |
| 20170233575 | HIGH HEAT-RESISTANT POLYAMIC ACID SOLUTION AND POLYIMIDE FILM | 08-17-2017 |
| 20180022874 | VARNISH FOR PHOTO ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY DEVICE | 01-25-2018 |
| 20220135797 | POLYIMIDE FILM AND METHOD FOR MANUFACTURING SAME - A polyimide film with improved dielectric and mechanical properties includes a polyimide layer with a liquid crystal structure which incorporates liquid crystal polymer powder. The polyimide layer is formed by a condensation reaction applied to dianhydride and diamine monomers, at least one of the dianhydride monomer and the diamine monomer having the liquid crystal structure. A method for manufacturing the polyimide film is also disclosed. | 05-05-2022 |
