| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 525529000 | Mixed with unsaturated reactant or polymer derived therefrom | 9 |
| 20080269430 | Low temperature curing coating powder - A low temperature curable coating powder comprising an epoxy functional resin is cured with styrene maleimide in combination with at least one other curing agent such as dicyandiamide, imidazole, or an imidizole adduct. The combination of three curing agents such styrene maleimide, dicyandiamide, and an imidizole or imidizole adduct is useful for achieving gloss control. The coating powder may be curable at temperatures of 300° F. or lower. The coating of heat-sensitive and non-conductive substrates is facilitated with use of such coating powder, although other substrates, such as metal may be coated in accordance with the invention. | 10-30-2008 |
| 20090326167 | COMPOSITIONS AND METHODS OF MAKING COMPOSITIONS EXHIBITING FUEL RESISTANCE - Curable compositions comprising polythioether polymers and polybasic acid-based polyepoxies, and methods of using curable compositions comprising polythioether polymers and polybasic acid-based polyepoxies are disclosed. Cured, curable compositions exhibit enhanced corrosion resistance and adhesion upon exposure to fuels. | 12-31-2009 |
| 20100280192 | Fast Curable Epoxy Compositions Containing Imidazole- And 1-(Aminoalkyl) Imidazole-Isocyanate Adducts - Epoxy curing agents comprising imidazole-isocyanate adducts, including 1-(aminoalkyl) imidazole-isocyanate adducts and especially 1-(3-aminopropyl) imidazole-isocyanate adducts, and their use as curing agents in heat curable one-component epoxy resin compositions. | 11-04-2010 |
| 20120196991 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF - An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C):
| 08-02-2012 |
| 525530000 | Wherein unsaturated reactant is a carboxylic acid or derivative or polymer derived therefrom | 5 |
| 20150126691 | Multiple Copolymer Systems as Templates for Block Copolymer Nanolithography - Methods are generally provided for preparing a polymeric composition that includes a grafted block copolymer. Methods are also generally provided for preparing a polymeric composition that includes a star block copolymer prepared from a central core molecule that includes a plurality of attachment moieties. Methods are also generally provided for preparing a polymeric composition that includes a linear block copolymer. Block copolymers are also generally provided. Multi-segmented linear block copolymers are also generally provided. | 05-07-2015 |
| 20150315330 | PHASE-SEGMENTED NON-ISOCYANATE ELASTOMERS - Elastomers are prepared from a reaction mixture that contains a polyene compound, an epoxy resin, a thiol curing agent and a basic catalyst. The polyene compound has an average of at least two groups containing aliphatic carbon-carbon double bonds capable of reaction with a thiol group. At least one of said aliphatic carbon-carbon double bonds is separated from each other said aliphatic carbon-carbon double bond by an aliphatic spacer group having a weight of at least 500 atomic mass units. These elastomers are typically phase-separated materials having good elongation and tensile properties. | 11-05-2015 |
| 525531000 | Wherein unsaturated reactant contains only one free carboxyl group | 2 |
| 20090131608 | Adhesive Compositions - Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C. | 05-21-2009 |
| 20120232228 | RESIN COMPOSITION SUITABLE FOR (RE) LINING OF TUBES, TANKS AND VESSELS - Compounds are provided according to structure 1: | 09-13-2012 |
| 525532000 | Contains polyol reactant or polymer derived therefrom | 1 |
| 20120322955 | POLYOXYETHYLENE DERIVATIVE HAVING PLURAL HYDROXYL GROUPS AT TERMINAL END THEREOF - A polyoxyethylene derivative represented by the formula (1): | 12-20-2012 |
