| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 525509000 | Solid polymer or SICP derived from at least one amine-, N-C(=X)- or N-S(=O) containing reactant and at least one aldehyde or aldehyde-type reactant (X is chalcogen) | 8 |
| 20080207850 | Melamine Polyols and Coatings Thereof - Novel low viscosity oligomeric polyols and the use thereof in coating compositions are disclosed. The novel low viscosity oligomeric polyols may be prepared by reacting at least one melamine aldehyde resin and at least one of α,β-diol, α,γ-diol, or mixture thereof. The reaction may occur in the presence of an acid catalyst. Coating compositions with a low VOC able to cure under ambient and forced dry conditions while providing good application and performance characteristics, such as an improved scratch resistance, are also disclosed. | 08-28-2008 |
| 20080249260 | Methods of preparing polymers having terminal amine groups - The present invention is directed to methods of preparing linear polymers such as polyalkylene oxides containing a terminal amine in high purity. One preferred method includes reacting a polyalkylene oxide such as polyethylene glycol containing a terminal azide with a phosphine-based reducing agent such as triphenylphosphine or an alkali metal borohydride reducing agent such as sodium borohydride in a solvent to reflux. The resultant polymer-amines are of sufficient purity so that expensive and time consuming purification steps required for pharmaceutical grade polymers are avoided. | 10-09-2008 |
| 20090124767 | Sulfone Polymer Composition - The invention relates to a sulfone polymer composition comprising: at least one high glass transition temperature sulfone polymer (A); at least one miscible polymer (B); and at least one immiscible polymer (C). The invention also relates to a process for manufacturing the sulfone polymer composition and to the articles thereof. The sulfone polymer composition of the invention possesses notably thermal performances and processability advantages in addition to minor cost with respect to high glass transition temperature sulfone polymers taken done. | 05-14-2009 |
| 20090326166 | STORAGE STABLE AMINO-FORMALDEHYDE RESINS AND APPLICATIONS THEREOF - Amino-formaldehyde resins may be prepared using formulations including formaldehyde, glycerin and at least one amino compound selected from the group consisting of urea, melamine, and mixtures thereof; under reaction conditions sufficient to prepare a resin, wherein; the amino-formaldehyde resin is prepared in a substantial absence of a sulfonating agent, ethylene glycol, and polyalkylene glycols. If the amino compound is urea, then the urea is present in a molar ratio of formaldehyde to urea ranging from 0.70 to 1.30; if the amino compound is melamine, then the melamine is present in a molar ratio of formaldehyde to melamine ranging from 1.3 to 2.2; and if the amino compound is a mixture of urea and melamine, then the mixture of urea and melamine is present in a molar ratio of formaldehyde to urea and melamine ranging from 0.35 to 1.3 | 12-31-2009 |
| 20100249340 | BIAXIALLY ORIENTED NYLON FILM, LAMINATE WRAPPING MATERIAL AND PROCESS FOR PRODUCTION OF BIAXIALLY ORIENTED NYLON FILM - Biaxially-oriented nylon film according to the present invention is biaxially-oriented nylon film made from nylon. In the biaxially-oriented nylon film, an elongation ratio of the film in each of four directions (an MD direction, a TD direction, a 45 degree direction and a 135 degree direction) until a film rupture is 70 percent or more, the elongation ratio being measured in a tensile test (testing conditions: a sample width is 15 mm; a distance between gauge points is 50 mm; and a tensile speed is 100 mm/min), and a stress ratio A (σ | 09-30-2010 |
| 525515000 | Mixed with additional aldehyde or aldehyde-type solid polymer; or SICP; or aldehyde or aldehyde-type reactant | 1 |
| 525516000 | Contains a phenolic reactant or polymer thereof | 1 |
| 20120108763 | MODIFIED POLYAMIDE COMPOSITION COMPRISING AT LEAST ONE PHENOLIC COMPOUND - A phenolic compound for manufacturing a modified polyamide that has an increased degree of crystallinity is described. A polyamide composition comprising at least one such phenolic compound and optionally reinforcing fillers or extenders is also described. The composition is preferably a composition to be molded, for example in the form of granules or powder, that is used for the manufacture of articles by an injection-molding process. | 05-03-2012 |
| 525518000 | Mixed with unsaturated reactant or polymer derived therefrom | 1 |
| 20130072643 | CURABLE FLUOROELASTOMER COMPOSITION - Fluoroelastomer compositions comprising fluoroelastomers having copolymerized units of a nitrile-containing cure site monomer are cured with certain carbazates. The carbazate is of the general formula R | 03-21-2013 |
| 525519000 | Mixed with carboxylic acid or derivative reactant or polymer therefrom | 1 |
| 20090306309 | POLYPHENYLENE SULFIDE RESIN COMPOSITION - A process for producing a polyphenylene sulfide resin composition includes melt-kneading about 99 to about 60 wt % of a polyphenylene sulfide resin (a) and about 1 to about 40 wt % of a polyamide resin (b), and about 0.1 to 10 parts by weight of a compatibilizing agent (c) per 100 parts by weight in total of the polyphenylene sulfide resin (a) and the polyamide resin (b), using a double screw extruder with two or more kneading portions at a temperature of the range from a melting peak temperature of the polyphenylene sulfide resin+10° C. to a melting peak temperature of the polyphenylene sulfide resin+70° C., wherein the polyamide resin (b) is excluded nylon 46 and has a relative viscosity of 1.5 or more measuring in concentrated sulfuric acid at a concentration of 1% and at 25° C., wherein the compatibilizing agent (c) is a compound having one or more types of groups selected from epoxy groups, amino group and isocyanate group, and wherein the resin composition has a morphology that the polyphenylene sulfide resin (a) in the resin composition forms a sea phase while the polyamide resin (b) in the resin composition forms an island phase, and the number average dispersed particle size of the polyamide resin (b) is kept at less than about 500 nm after the resin composition is melted and allowed to reside at 300° C. for 30 minutes. | 12-10-2009 |
