| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 525476000 | Mixed with reactant containing more than one 1,2-epoxy group per mole or polymer derived therefrom | 10 |
| 20080255321 | Bonded Composite of Silicone Resin and Epoxy Resin and a Method For Manufacturing Thereof - An firmly bonded composite of a silicone resin and an epoxy resin comprising:
| 10-16-2008 |
| 20100222525 | CURABLE COMPOSITION - Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same. Disclosed is a modified polyorganosiloxane compound having two or more epoxy group and/or oxetanyl group in a molecule, the compound being a hydrosilylation reaction product of the following compounds:
| 09-02-2010 |
| 20100280189 | SYNTHESIS OF CYCLOALIPHATIC SUBSTITUTED SILANE MONOMERS AND POLYSILOXANES FOR PHOTO-CURING - The present invention generally relates to compositions including linear cycloaliphatic siloxane polymers, and the cyclic cycloaliphatic siloxane oligomers from which they are made. The present invention also generally relates to methods for making cycloaliphatic siloxane polymers, and the cyclic cycloaliphatic siloxane oligomers from which they are made. Some embodiments relate to cationic polymerization of methyl, cyclopentyl, and/or cyclohexyl substituted polysiloxanes. In some embodiments the cationic polymerization is a cationic ring-opening polymerization. | 11-04-2010 |
| 20110003946 | CURABLE REACTION RESIN SYSTEM - A curable reaction resin system is described, which is to be processed as a two-component mass and which contains a resin component, a curing agent as well as polymer particles that are dispersed in the resin component, the polymer particles being contained in the reaction resin system at a proportion of more than 25 and up to 50 wt. %. | 01-06-2011 |
| 20110201763 | THERMOSETTING RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED MATERIAL THEREOF, AND OPTICAL-SEMICONDUCTOR DEVICE OBTAINED USING THE SAME - The present invention relates to a thermosetting resin composition for optical-semiconductor element encapsulation, the thermosetting resin composition including the following ingredients (A) to (D): (A) an epoxy group-containing siloxane compound represented by the following general formula (1) in which R | 08-18-2011 |
| 20120108762 | ADHESIVE COMPOSITION, ADHESIVE SHEET, SEMICONDUCTOR APPARATUS PROTECTION MATERIAL, AND SEMICONDUCTOR APPARATUS - A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, | 05-03-2012 |
| 20130289225 | ADHESIVE COMPOSITION, AND ADHESIVE SHEET, SEMICONDUCTOR APPARATUS-PROTECTIVE MATERIAL AND SEMICONDUCTOR APPARATUS USING THE SAME - There is disclosed an adhesive composition comprising the following Components (A), (B) and (C), wherein a minimum melt viscosity of the composition is less than 500 Pa·s, a temperature which gives the minimum melt viscosity is less than 200° C., and, a melt viscosity at 200° C. of the composition is 500 Pa·s or more: | 10-31-2013 |
| 20140011969 | METHODS FOR FABRICATING POLYMER COMPOSITES - A method for fabricating a polymer composite is provided that includes providing a mixture of carbon nanostructures and a polymeric material, and then photo-thermally heating the mixture to cross-link the carbon nanostructures and the polymeric material. The carbon nanostructures can be carbon nanotubes, buckyballs, graphene, or the like, and the mixture can include about 0.01 to about 1.0 percent by weight of the carbon nanostructures. Polymer composited produce by the fabrication methods are also provided. | 01-09-2014 |
| 20140275445 | Siloxane-Based Composition and Cured Product Thereof, and Use Therefor - A composition containing a metal compound and a siloxane compound (A) represented by general formula (1): | 09-18-2014 |
| 20140378625 | FUNCTIONAL SILANE-COMPATIBILIZED EPOXY COMPOSITIONS FOR INSULATION APPLICATIONS - Described is an epoxy composition containing: (a) an epoxy resin containing at least one epoxy group, (b) an anhydride hardener, (c) a hydroxyl-terminated polysiloxane, and (d) a functional silane having at least one functional group selected from the group consisting of an epoxy-reactive group, an anhydride-reactive group, and an epoxy- and anhydride-reactive group. Also describing a crosslinked epoxy composition and a method for preparing thereof. | 12-25-2014 |
