| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 525390000 | Solid polymer derived solely from phenolic reactants wherein none of the reactants contains a plurality of methylol groups or derivatives thereof | 47 |
| 20090088535 | METHOD OF PRODUCING PHENOL RESIN AND METHOD OF PRODUCING EPOXY RESIN - The present invention provides a method to producing a phenol resin by which a polyarylene having low melt viscosity ether can be industrially produced by extremely simple and easy method, without the need of a special aftertreatment after polymerization and complicated multistep reaction, and produces a method of producing an epoxy resin from a phenol resin obtained by the above-mentioned method. The method of producing a phenol resin having a polyarylene ether structure includes a step of a dehydration condensation reaction of reacting a polyhydroxyaromatic compound (A) having two or more phenolic hydroxyl groups per molecule in the presence of a basic catalysis (B). | 04-02-2009 |
| 20090118436 | Star Polymer and Method of Producing the Same - The present invention provides a novel narrow distribution dendrimer-like star polymer having a controlled molecular structure, and a method capable of easily producing the star polymer. | 05-07-2009 |
| 20090192272 | DIVINYLSILANE-TERMINATED AROMATIC ETHER-AROMATIC KETONE-CONTAINING COMPOUNDS - A compound having the formula: | 07-30-2009 |
| 20090215967 | MANUFACTURE OF NOVEL EPOXY RESINS SEMI-THERMOSETS AND THEIR HIGH TG THERMOSETS FOR ELECTRONIC APPLICATIONS - An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material. | 08-27-2009 |
| 20110144283 | COPOLYCARBONATE COMPOSITIONS HAVING IMPROVED THERMAL PROPERTIES AND BASED ON BLENDS - The invention relates to compositions containing at least one copolycarbonate containing one or more bisphenol building blocks and one or more further specific (co)polycarbonates as well as compositions which optionally contain additives, the use thereof for the production of shaped articles, and shaped articles obtainable therefrom. | 06-16-2011 |
| 20110213095 | Method for the manufacture of poly(aryl ether ketone)s in the presence of sodium carbonate - Sodium carbonate (Na | 09-01-2011 |
| 20110275766 | MORPHOLINE-SUBSTITUTED POLY(ARYLENE ETHER) AND METHOD FOR THE PREPARATION THEREOF - A poly(2,6-dimethyl-1,4-phenylene ether) prepared using a morpholine-containing polymerization catalyst has a monomodal molecular weight distribution with a reduced content of very high molecular weight species. It also exhibits increased morpholine incorporation in the high molecular weight fraction. Compared to commercially available poly(2,6-dimethyl-1,4-phenylene ether) prepared using a di-n-butylamine-containing polymerization catalyst, the poly(2,6-dimethyl-1,4-phenylene ether) of the invention exhibits reduced odor. Compared to other poly(2,6-dimethyl-1,4-phenylene ether) prepared using a morpholine-containing polymerization catalyst, the poly(2,6-dimethyl-1,4-phenylene ether) of the invention exhibits improved molecular weight build during compounding and improved compatibilization with polyamides. | 11-10-2011 |
| 20130217834 | POLYARYLENE COMPOSITION - Blend (B) comprising at least one polyarylene in a form other than fibers, and at least one poly(aryl ether ketone). | 08-22-2013 |
| 20140039132 | C-SUBSTITUTED, 1H-AZOLES FOR AMPHOTERIC, SOLVENT-LESS PROTON CONDUCTIVITY - Disclosed herein are the compounds shown below. Also disclosed are methods of making the compounds. | 02-06-2014 |
| 20140107299 | MEDICAL DEVICE COMPRISING MACHINED PARTS AND INJECTION MOLDED PARTS - A medical device comprises parts made by injection moulding and parts made by machining such that the respective parts have similar colours, measured on the L*, a*, b* scale. The parts made by injection moulding may be made in a process which involves introducing molten material comprising polymeric material such as PEEK into a mould, wherein a mould surface which contacts the molten material is at a temperature of at least 210° C. and maintaining the molten material in the mould for at least 90 seconds. | 04-17-2014 |
| 20140148556 | METHOD FOR PREPARING PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE RESIN WITH LOW MOLECULAR WEIGHT - Disclosed is a method for preparing a phosphorus-containing polyphenylene oxide resin with a low molecular weight, comprising the steps of: step 1: providing a phosphorus-containing phenolic compound and a raw polyphenylene oxide resin having a number-average molecular weight of more than 10000; step 2: dissolving the raw polyphenylene oxide resin into a solvent to make a solution of the raw polyphenylene oxide resin; step 3: adding the phosphorus-containing phenolic compound to into the solution of the raw polyphenylene oxide resin; step 4: introducing an initiator, and carrying out a re-dispersing reaction at a reaction temperature of above 60° C. under the effect of the initiator; and step 5: after the reaction is finished, the product obtained being phosphorus-containing polyphenylene oxide resin with a low molecular weight, the number-average molecular weight thereof being 1000-6000. | 05-29-2014 |
| 20140343232 | RESIN COMPOSITION ELIMINATING VOLATILE LOSS OF INITIATING SPECIES FOR THE PREPARATION OF PRINTED CIRCUIT BOARD LAMINATES - An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin. | 11-20-2014 |
| 20150065661 | BLEND OF POLY(PHENYLENE ETHER) PARTICLES AND POLYOXYMETHYLENE, ARTICLE THEREOF, AND METHOD OF PREPARATION - A composition contains (a) 1 to 40 weight percent of poly(phenylene ether) particles having a mean particle size of 1 to 40 micrometers; and (b) 60 to 99 weight percent of a polyoxymethylene; wherein polystyrene is absent from the poly(phenylene ether) particles; wherein the composition comprises less than 0.1 volume percent, based on the total volume of the composition, of particulate metals, metalloids, oxides thereof, and combinations thereof, wherein the metals and metalloids are selected from iron, copper, aluminum, magnesium, lead, zinc, tin, chromium, nickel, tungsten, silicon, gold, silver, platinum, and alloys thereof. The poly(phenylene ether) particles reduce the density and increase the char yield of the polyoxymethylene. When the composition is prepared at a temperature below the glass transition temperature of the poly(phenylene ether), increased flexural strength can also be obtained. The composition is useful as a molding composition for a variety of articles. | 03-05-2015 |
| 20160024295 | AMINIC HARDENERS WITH IMPROVED CHEMICAL RESISTANCE - A hardener composition comprising: a) an epoxy-amine adduct of i) a novolac epoxy resin; and ii) a first amine and b) a modifier wherein the hardener has a viscosity in the range of from 50 to 20,000 mPa·s and wherein a cured epoxy thermoset comprising the hardener exhibits no more than 1% weight loss or gain after immersion in concentrated mineral acid for 7 days at a temperature in the range of from 25° C. to 130° C., is disclosed. The hardener composition can be used with an epoxy resin to form a curable composition. | 01-28-2016 |
| 20160046772 | RESIN COMPOSITION, FRICTION MATERIAL, AND METHOD FOR PRODUCING SAME - Provided are: a resin composition that can be given excellent formability and wear resistance when used as a friction material or the like; and a method for producing the resin compound. A titanate compound, which is a salt of at least one element selected from the group consisting of alkali metals and alkaline earth metals, is dispersively contained in a thermosetting resin prior to curing. | 02-18-2016 |
| 20160083518 | POLYETHER AMINES USEFUL AS ACCELERANTS IN EPOXY SYSTEMS - The present invention relates to the speeded curing of a composition comprising an epoxy compound, an amino or anhydride hardener and a high-branched polyether amine accelerant. The high-branched polyether amine may have terminal hydroxyl groups (polyol) and/or amino groups (amino modified). The amino-modified high-branched polyether amines are obtainable by subsequently modifying the terminal hydroxyl groups of high-branched polyether amine polyols. | 03-24-2016 |
| 20160102174 | LOW MOLECULAR WEIGHT POLYPHENYLENE ETHER PREPARED WITHOUT SOLVENTS - Low molecular weight polyphenylene ether (PPE) is made from higher molecular weight PPE without using solvents by extruding the higher molecular weight PPE with a phenolic modifier and a redistribution catalyst. The low molecular weight PPE has a Mw/Mn polydispersity greater than about 2 and a Mn ranging from about 10,000 to about 20,000. | 04-14-2016 |
| 20160137842 | ARTICLE OF MANUFACTURE CONTAINING A FLAME RETARDANT FILLER PREPARED FROM A BRIDGED POLYSILSESQUIOXANE - A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to manufactured articles such as connectors and other articles of manufacture that employ thermosetting plastics or thermoplastics. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(tri-methoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. | 05-19-2016 |
| 525391000 | Mixed with ethylenically unsaturated reactant or polymer derived therefrom | 8 |
| 20080269427 | Polyphenylene ether oligomer compound, derivatives thereof and use thereof - The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding. | 10-30-2008 |
| 20080287610 | Copolycarbonate, Copolycarbonate Composition, and Optical molded Article Obtained Therefrom - Provided is a copolycarbonate which can meet a wide range of molding conditions as a raw material and which results in providing good optical molded articles. | 11-20-2008 |
| 20110294961 | THERMOPLASTIC POLYESTER ELASTOMER COMPOSITIONS - Disclosed is a composition including a melt mixed blend including (a) 52 to 96.9 weight percent one or more copolyester thermoplastic elastomers; (b) 3 to 40 weight percent polyphenylene ether; and (c) 0.1 to 8 weight percent of polymeric toughener selected from the group consisting ethylene copolymers of the formula E/X/Y wherein:
| 12-01-2011 |
| 20120010373 | METHOD FOR MANUFACTURING CURED PRODUCT OF THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT OBTAINED THEREBY - The present invention relates to a method for producing a cured product of a thermosetting resin composition, the method including: heating a thermosetting resin composition including the following ingredients (A) to (C) at a temperature of 100 to 200° C. for 1 to 60 minutes; and then further heating the thermosetting resin composition at a temperature of 220 to 350° C. for 10 to 6,000 minutes, thereby curing the thermosetting resin composition: (A) an allyletherified phenol resin; (B) an epoxy resin; and (C) a curing accelerator. | 01-12-2012 |
| 20120190799 | Polyamide Curative Composition - The present invention relates to a polyamide curative composition comprising a reaction product (P) of (1) at least three compounds of formula H | 07-26-2012 |
| 20130041114 | POLY(ALLYL ETHERS) OF POLYCYCLOPENTADIENE POLYPHENOL - Embodiments include poly(allyl ether)s of polycyclopentadiene polyphenol that can be obtained by allylation of a polycyclopentadiene polyphenol, where the aromatic hydroxyl group(s) (—OH) are converted to HR | 02-14-2013 |
| 20130267663 | MASTERBATCH-TYPE LATENT CURING AGENT FOR EPOXY RESIN, AND EPOXY RESIN COMPOSITION USING THE SAME - The masterbatch-type latent curing agent for epoxy resin comprised of (A) glycidyl ether type epoxy resin, (B) a fine particle of mixture containing (B-1) 50 to 99 mass % of adduct-modified amine obtained by reacting the glycidyl ether type epoxy resin with a polyamine compound and (B-2) 50 to 1 mass % of a phenol compound, (C) an active hydrogen compound and (D) an isocyanate compound; and a one-component curable epoxy resin composition containing the masterbatch-type latent curing agent and epoxy resin. | 10-10-2013 |
| 525392000 | Unsaturated aromatic reactant or polymer thereof | 1 |
| 20140323666 | POLYPHENYLENE ETHER OLIGOMER AND ARTICLE EMPLOYING THE SAME - A polyphenylene ether oligomer is provided. The polyphenylene ether oligomer has the following formula (I): | 10-30-2014 |
| 525393000 | Mixed with silicon-containing reactant or polymer derived therefrom | 6 |
| 20080242804 | POLYCARBONATE-POLYSILOXANE COPOLYMERS, METHODS FOR THE PREPARATION THEREOF, AND ARTICLES DERIVED THEREFROM - A polycarbonate-polysiloxane copolymer comprising structural units of the formula: | 10-02-2008 |
| 20090292082 | Mold releasing film for printed circuit board production - The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films. | 11-26-2009 |
| 20110160406 | BLENDS OF ISOSORBIDE-BASED COPOLYCARBONATE, METHOD OF MAKING, AND ARTICLES FORMED THEREFROM - Disclosed herein is are thermoplastic compositions comprising a blend of a homopolycarbonate comprising units derived from an aromatic dihydroxy compound and a copolymer comprising isosorbide units and siloxane units. The copolymer comprising isosorbide units and siloxane units can further comprise non-isosorbide aliphatic units derived from a C | 06-30-2011 |
| 20110190453 | POLY(ARYLENE ETHER)-POLYSILOXANE COMPOSITION AND METHOD - A thermoplastic composition includes a poly(arylene ether) and a poly(arylene ether)-polysiloxane block copolymer. The thermoplastic composition is prepared by a method that includes oxidatively copolymerizing a monohydric phenol and a hydroxyaryl-terminated polysiloxane. The method is simpler than prior methods of preparing poly(arylene ether)-polysiloxane block copolymers by linking pre-formed poly(arylene ether) and polysiloxane blocks. The method is also produces greater incorporation of polysiloxane into the poly(arylene ether)-polysiloxane block copolymer than prior methods of copolymerizing monohydric phenols and hydroxyaryl-terminated polysiloxane. | 08-04-2011 |
| 20110190454 | POLY(ARYLENE ETHER)-POLYSILOXANE COMPOSITION AND METHOD - A thermoplastic composition includes a poly(arylene ether) and a poly(arylene ether)-polysiloxane block copolymer. The thermoplastic composition is prepared by a method that includes oxidatively copolymerizing a monohydric phenol and a hydroxyaryl-terminated polysiloxane. The method is simpler than prior methods of preparing poly(arylene ether)-polysiloxane block copolymers by linking pre-formed poly(arylene ether) and polysiloxane blocks. The method is also produces greater incorporation of polysiloxane into the poly(arylene ether)-polysiloxane block copolymer than prior methods of copolymerizing monohydric phenols and hydroxyaryl-terminated polysiloxane. | 08-04-2011 |
| 20130324674 | Polymeric Additive for Strength, Deformability, and Toughness Enhancement of Cemetitious Materials and Composites - Methods are generally provided for forming a polymer-cement composite. In one embodiment of the method, a plurality of dopamine monomers is dispersed in a buffer solution. Polymerization of the dopamine monomers can then be initiated, and a cement-sand mixture can be added to the buffer solution to form a composite mixture. Finally, the composite mixture can be cured to form a polymer-cement composite. Polymer-cement composites are also generally provided that, in one embodiment, include cement, sand, and poly(dopamine), with the polymer-cement composite having a compressive strength of 8000 psi. | 12-05-2013 |
| 525394000 | Mixed with -O-C(=O)-O-, hal-C(=O)-O-, or hal-C(=O)-hal containing reactant or polymer derived therefrom | 1 |
| 20110144284 | POLYCARBONATE COMPOSITIONS HAVING IMPROVED SURFACE HARDNESS - The present invention relates to polycarbonate compositions having improved surface hardness, processes for the preparation thereof and the use thereof for the production of blends, shaped articles and extrudates. | 06-16-2011 |
| 525395000 | Mixed with -N=C=X-containing reactant or polymer therefrom (X is chalcogen) | 1 |
| 20100204410 | ONE LIQUID TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION - The present invention is one liquid type cyanate-epoxy composite resin composition comprised of cyanate ester resin (A), epoxy resin (B), and potential curing agent (C), characterized in that the above potential curing agent is the potential curing agent containing phenol resin (b) as well as modified amine (a) which has one or more amino groups having an active hydrogen within a molecule obtained by reacting polyamine compound (a-1) with epoxy compound (a-2). The one liquid type cyanate-epoxy composite resin composition having storage stability, curing properties and high heat resistance properties at the same time can be realized by this composition. | 08-12-2010 |
| 525396000 | Mixed with 1,2-epoxy containing reactant or polymer therefrom, or wherein polymer contains at least one 1,2-epoxy group | 7 |
| 20090111948 | Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto - Water absorption resistant compositions of the present disclosure, e.g., pastes (or solutions), are well suited for electronic screen-printable materials and electronic components. The composition of the present disclosure may optionally contain thermal crosslinking agents, adhesion promoters, and other inorganic fillers. The composition of the present disclosure can have a glass transition temperature greater than 250° C. and a water absorption factor of less than 2%, and a positive solubility measurement. | 04-30-2009 |
| 20100048826 | Polyphenylene ether oligomer compound, derivatives thereof and use thereof - The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding. | 02-25-2010 |
| 20100160572 | Branched Polycarbonate Resin Composition, and Branched Polycarbonate Resin and Molded Product Made Using the Same - Disclosed are a branched polycarbonate resin composition that includes: (A) a polycarbonate resin; (B) a polymer including a reactive group being capable of reacting with a hydroxyl group; and (C) an ionic compound including an alkali metal ion, organic cation, or a combination thereof, and a branched polycarbonate resin and a molded product using the same. | 06-24-2010 |
| 20100324228 | INSULATING POLYMER MATERIAL COMPOSITION - An insulating polymer material composition is obtained by adding curing agent (amine, acid anhydride, or phenol, preferably imidazole), curing accelerator, etc. (curing accelerator such as organic peroxide, amine, imidazole, or the like, and reaction aid such as peroxide), kneading under conditions according to the amounts of addition, and subjecting the kneaded substance to heat treatment, thereby conducting a peroxide vulcanization and achieving a three-dimensional crosslinking. This insulating polymer material composition is applied to polymer products such as high-voltage devices, etc. | 12-23-2010 |
| 20110282010 | EPOXY RESIN COMPOSITION - An epoxy resin composition having low moisture permeability, transparency and a high refractive index. The epoxy resin composition includes an epoxy compound, and a compound having two or more crosslinking groups that are reactive with the epoxy compound. The weight ratio of (a) to (b) is from 0.3 to 3, and the epoxy resin composition has a refractive index of 1.6 or higher. | 11-17-2011 |
| 20140005340 | Ultrafine Poly(phenylene ether) Particles and Compositions Derived Therefrom | 01-02-2014 |
| 20160024250 | POLYMER COMPOSITIONS BASED ON PXE - New polymer compositions based on poly(2,6-dimethyl-1,4-phenylene oxide) and other high-softening-temperature polymers are disclosed. These materials have a microphase domain structure that has an ionically-conductive phase and a phase with good mechanical strength and a high softening temperature. In one arrangement, the structural block has a softening temperature of about 210° C. These materials can be made with either homopolymers or with block copolymers. | 01-28-2016 |
| 525397000 | Mixed with carboxylic acid or derivative reactant or polymer derived therefrom | 6 |
| 20090062478 | POLY(ARYLENE ETHER) PREPARATION METHOD - Capped poly(arylene ether)s are prepared by a method that includes reacting a poly(arylene ether) with a capping agent to form a capping reaction mixture, washing the capping reaction mixture with a concentrated basic aqueous solution, and isolating the capped poly(arylene ether) by a total isolation method. The washing method is effective for removal of capping-related impurities, and surprisingly does not result in decomposition of the capped poly(arylene ether). | 03-05-2009 |
| 20090247707 | PROCESS FOR THE PREPARATION OF SULFONATE AND SULFONATE SALT CAPPED POLYARYLATE RESINS WITH IMPROVED FLOW - A process for preparing a sulfonate terminated polyarylate comprises blending a polyarylate resin with an organic compound to form a reaction mixture, wherein the organic compound contains at least one aliphatic primary amine functional group and at least one other functional group selected from the group consisting of sulfonic acids, sulfonic acid salts, and mixtures thereof, and heating the reaction mixture to a temperature of 225 to 400° C. The temperature of heating is above the glass transition temperature of the polyarylate resin. Sulfonate terminated polyarylates and compositions prepared using the above process, and articles comprising the sulfonate terminated polyarylate compositions, are also disclosed. | 10-01-2009 |
| 20130046065 | POLYCYCLOPENTADIENE COMPOUNDS - Embodiments of the present disclosure include polycyclopentadiene compounds represented by Formula (I): in which each X is either a hydrogen or a cyano group (N≡C—), n has an average value from zero to 20; each m independently has a value of zero to 3; p has a value of zero to 20; each R is independently a halogen, a nitrile group, a nitro group, an alkyl group, an alkoxy group, an alkenyl group, or an alkenyloxy group, where the alkyl group, the alkoxy group, the alkenyl group, and the alkenyloxy group each independently contain 1 to 6 carbon atoms; and each Q is independently hydrogen or an alkyl group containing 1 to 6 carbon atoms. Embodiments of the present disclosure also include a curable composition that includes the polycyclopentadiene compound(s) of Formula (I) and a curing amount of a resin or a catalyst amount of a catalyst and/or a cure accelerating amount of an accelerating agent. | 02-21-2013 |
| 20150141583 | BENZOXAZINE RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - The embodiments herein relate to a benzoxazine resin composition, a prepreg, and a carbon fiber-reinforced composite material. More specifically, the embodiments herein relate to a benzoxazine resin composition that provides a carbon fiber-reinforced composite material that is suitable for use as a manufacture material due to its superior mechanical strength in extreme use environments, such as high temperature and high moisture, as well as a prepreg, and a carbon fiber-reinforced composite material. An embodiment comprises a benzoxazine resin composition having a multifunctional benzoxazine resin; a multifunctional epoxy resin that is a liquid at 40° C. and has three or more glycidyl groups; a sulfonate ester; and optionally at least one thermoplastic resin. The resin may include an interpenetrating network structure after curing. | 05-21-2015 |
| 20160053106 | Polyaryletherketone Composition - A polymer composition that contains a polyaryletherketone and a liquid crystalline polymer that includes repeating units derived from naphthenic hydroxycarboxylic acids, naphthenic dicarboxylic acids, or a combination thereof in an amount of more than about 15 mol. % of the polymer is provided. | 02-25-2016 |
| 20160053107 | Composition Containing a Polyaryletherketone and Low Naphthenic Liquid Crystalline Polymer - A polymer composition that contains a polyaryletherketone and a liquid crystalline polymer that includes repeating units derived from naphthenic hydroxycarboxylic acids, naphthenic dicarboxylic acids, or a combination thereof in an amount of about 15 mol. % or less of the polymer is provided. The composition optionally contains reinforcing fibers (e.g., glass fibers) in an amount of no more than about 10 wt. %. | 02-25-2016 |
