Class / Patent application number | Description | Number of patent applications / Date published |
524540000 | Solid polymer or SICP derived from at least one phenol or inorganic phenolate reactant | 28 |
20080319124 | Thermosetting resin material - A thermosetting resin material is provided with: (A) a thermosetting resin having a dihydrobenzoxazine ring; and (B) a condensed polycyclic aromatic hydrocarbon resin is described. | 12-25-2008 |
20090023855 | NOVEL CURABLE RESIN, PRODUCTION METHOD THEREOF, EPOXY RESIN COMPOSITION, AND ELECTRONIC DEVICE - A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent. | 01-22-2009 |
20090069490 | EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, NOVEL EPOXY RESIN AND PRODUCTION METHOD THEREOF, AND NOVEL PHENOL RESIN - The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin. | 03-12-2009 |
20090192258 | SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION METHOD, AND SEMICONDUCTOR DEVICE - A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 μm, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components. | 07-30-2009 |
20100016498 | Epoxy resin composition and cured article thereof - Disclosed is an epoxy resin composition that cures with high thermal conductivity and low thermal expansion and is capable of dissipating heat efficiently and displaying good dimensional stability when applied to encapsulation of semiconductor devices or to printed wiring boards. The epoxy resin composition is formulated from epoxy resins 50 wt % or more of which is a diphenyl ether type epoxy resin represented by the following general formula (1) | 01-21-2010 |
20100036046 | Polymeric material - A polyaryletherketone polymeric material, for example polyetheretherketone and composite materials comprising said polymeric material are described. The polymeric material has a melt viscosity (MV) in the range 0.05 to 0.12 kNsm | 02-11-2010 |
20100087590 | EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, SEMICONDUCTOR ENCAPSULATION MATERIAL, NOVEL PHENOL RESIN, AND NOVEL EPOXY RESIN - The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material. | 04-08-2010 |
20100234520 | Curable Epoxy Resin Composition and Cured Body Thereof - A curable epoxy resin composition comprising: (I) an epoxy resin; (II) a curing agent for the epoxy-resin; (III) cross linked silicone particles characterized by having secondary amino groups represented by the following general formula: R | 09-16-2010 |
20110112240 | POLYCARBONATES HAVING IMPROVED TRANSMISSION - The present invention relates to a composition containing polycarbonate and 0.01 wt. % to less than 0.30 wt. % of polyol, polyether polyol, or combinations thereof. | 05-12-2011 |
20110201747 | BRANCHED POLYARYLENE ETHERS AND THERMOPLASTIC MOLDING COMPOUNDS CONTAINING SAID ETHERS - The present invention relates to branched polyarylene ethers (A) comprising branching sites of the formula (I): | 08-18-2011 |
20110218294 | BLENDS OF POLYARYLENE ETHERS AND POLYARYLENE SULFIDES - The present invention relates to thermoplastic molding compositions comprising the following components:
| 09-08-2011 |
20110294943 | FIBERS SIZED WITH POLYETHERKETONEKETONES - Fibers sized with a coating of amorphous polyetherketoneketone are useful in the preparation of reinforced polymers having improved properties, wherein the amorphous polyetherketoneketone can improve the compatibility of the fibers with the polymeric matrix. | 12-01-2011 |
20140073732 | PHENOLIC RESIN MOLDING COMPOUND - A phenolic resin molding compound includes (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight. | 03-13-2014 |
20140155540 | MOLDING MATERIAL, MOLDING METHOD USING SAME, METHOD FOR PRODUCING MOLDING MATERIAL, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL - Provided is a molding material comprising a composite of 1 to 50 wt % of a continuous reinforcing fiber bundle (A) and 0.1 to 20 wt % of a poly(phenylene ether ether ketone) oligomer (B); and 30 to 98.9 wt % of a thermoplastic resin (C) adhering to the composite, wherein the component (B) has a melting point of not higher than 270° C. Also provided are a method for molding the molding material, a method for producing the molding material, and a method for producing a fiber-reinforced composite material. | 06-05-2014 |
20140179858 | Phosphorous Copolymer, Method for Preparing the Same, and Flame Retardant Thermoplastic Resin Composition Including the Same - A phosphorous copolymer, a method for preparing the same, and a flame retardant thermoplastic resin composition including the same is disclosed. The phosphorous copolymer includes a repeat unit represented by Formula 1: | 06-26-2014 |
20140357782 | HIGH PERFORMANCE POLYMER COMPOSITION FOR MOBILE ELECTRONIC DEVICES - The present invention relates to mobile electronic devices comprising at least one structural part made of a polymer composition (C) comprising at least one polyaryletherketone (PAEK), at least one aromatic sulfone polymer (SP) such as poly phenylsulfone (PPSU), polyethersulfone (PESU), polysulfone (PSU) or mixture thereof, and at least one reinforcing filler. | 12-04-2014 |
20150038638 | FLEXIBLE WHITE REFLECTIVE DIELECTRIC FOR ELECTRONIC CIRCUITS - This invention is directed to a polymer thick film white reflective flexible dielectric composition comprising urethane resin, thermoplastic phenoxy resin, and white reflective powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to reflect light in 3D circuits containing LED's. | 02-05-2015 |
20160024344 | USE OF POLYPROPYLENEIMINE AS CURING AGENT FOR EPOXIDE RESINS - The present invention relates to the use of substantially linear polypropyleneimine as a hardener for epoxy resins, and also to a corresponding curable composition, to the curing thereof, and to the cured epoxy resin obtainable therefrom. | 01-28-2016 |
20160075876 | Polyarylene ether sulfone (PAES) compositions - A composition [composition (C), herein after] comprising from 30 to 95% by weight of at least one poly(arylether sulfone) polymer, wherein said polymer comprising more than 50% moles of recurring units (R | 03-17-2016 |
20160108229 | COMPOSITION OF POLY-ARYLENE ETHER KETONE KETONE POWDERS SUITABLE FOR LASER SINTERING - The present invention relates to a composition comprising at least one poly(arylene ether ketone) powder suitable for laser sintering and also to the process which makes it possible to obtain it, minimizing the amount by weight of remaining non-sintered powder after production of the part by sintering. | 04-21-2016 |
20160115314 | COMPOSITION BASED ON POLY(ARYLENE ETHER KETONE) HAVING IMPROVED PROPERTIES - The present invention relates to a composition based on poly(ether ether ketone) (PEEK) comprising poly(ether ketone ketone) (PEKK), characterized in that the poly(ether ketone ketone) (PEKK) comprises a mixture of terephthalic and isophthalic units, the percentage by weight of terephthalic units, with respect to the sum of the terephthalic and isophthalic units, being between 55 and 85%, limits included, and preferably between 55 and 70%, the said composition comprising between 1 and 40%, limits included, preferably between 5 and 40% and more preferably still between 10 and 30% by weight of PEKK, with respect to the total weight of the composition. | 04-28-2016 |
20160122527 | METHOD FOR THE THERMAL TREATMENT OF POLY-ARYLENE ETHER KETONE KETONE POWDERS SUITABLE FOR LASER SINTERING - The invention relates to a process for the heat treatment of poly(arylene ether ketone ketone) powder suitable for laser sintering, and also to the powders resulting from this process. | 05-05-2016 |
524541000 | Aldehyde or derivative reactant | 6 |
20090054585 | EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, SEMICONDUCTOR ENCAPSULATION MATERIAL, NOVEL PHENOL RESIN, AND NOVEL EPOXY RESIN - The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material. | 02-26-2009 |
20090137725 | PHENOLIC RESIN, PRODUCTION METHOD AND USE THEREOF - Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin. | 05-28-2009 |
20100113678 | FLUORINE-CONTAINING NOVOLAC RESIN, FLUORINE-CONTAINING SURFACTANT, FLUORINE-CONTAINING SURFACTANT COMPOSITION, AND RESIN COMPOSITION - A fluorine-containing novolac resin represented by the following formula, as well as a fluorine based surfactant and a fluorine based surfactant composition, which include the fluorine-containing novolac resin. In the formula, R represents a fluorinated alkyl-containing substituent, R′ represents a hydrogen atom or a methyl group, R″ represents a hydrogen atom or a non-fluorinated substituent, —X— represents any one of following four types of linking groups, —X′ represents any one of three following types of substituents, n represents 0 or an integer of 1 or more, m represents an integer of 1 or more, and n+m is an integer of 2 or more. | 05-06-2010 |
20100190916 | COATINGS COMPOSITION HAVING VIBRATION-DAMPING OF TWO-COMPONENTS TYPE AND COATING TYPE WHICH CAN BE CURED AT NORMAL TEMPERATURE - [Constitution] A coatings composition having vibration-damping of two-components type and coating type which can be cured at the normal temperature comprising: | 07-29-2010 |
20120095156 | METHOD FOR PRODUCING PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, NOVEL PHOSPHORUS-CONTAINING PHENOL, CURABLE RESIN COMPOSITION, CURED PRODUCT OF THE SAME, PRINTED WIRING BOARD, AND SEMICONDUCTOR SEALING MATERIAL - Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3). | 04-19-2012 |
20160115317 | BENZOXAZINE RESINS - A curable polymer composition containing: (A) a thermoset benzoxazine resin precursor component; (B) optionally, an aryl sulphone-containing benzoxazine component, and (C) a polyarylsulphone thermoplastic toughening agent, wherein in the absence of component (B), component (C) contains one or more benzoxazine pendant- and/or end-groups. | 04-28-2016 |