Class / Patent application number | Description | Number of patent applications / Date published |
523457000 | Elemental metal or metal compound other than as silicate DNRM | 62 |
20100174012 | MACROMONOMERS IMPROVING THE THERMAL STABILITY OF (METH)ACRYLIC COMB POLYMERS, USE OF THESE POLYMERS IN LOADED PLASTIC COMPOSITIONS - The invention concerns to the use, as an agent improving the thermal stability of (meth)acrylic comb polymers of a macromonomer whose formula (I) is: | 07-08-2010 |
20110054080 | METHOD FOR PRODUCING COATED RUBBER PARTICLES AND COATED RUBBER PARTICLES - The method describes a novel production method for coated particles made of rubber granules, the coating, the particles thus coated, and the use of the coated particles. | 03-03-2011 |
20110098383 | Composite comprising nanosize powder and use of the composite - A composite is formed from at least one base material and at least one filler powder mixture dispersed in the base material. The filler powder mixture has a filler powder fraction and at least one further filler powder fraction. The filler powder fraction has an average powder particle diameter (D50) selected from the range from 1 μm to 100 μm and the total proportion of the filler powder mixture in the composite (degree of fill) is above 50% by weight. The further filler powder fraction has a further average powder particle diameter selected from the range from 1 nm to 50 nm and the proportion of the further filler powder fraction in the filler powder mixture is selected from the range from 0.1% by weight to 50% by weight. A high degree of fill can be achieved at a low viscosity in the presence of nanosize filler particles. The composite is particularly suitable as embedding composition (pourable resin system). | 04-28-2011 |
20110124775 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME - Provided is a resin composition for encapsulating a semiconductor which has excellent flame resistance and solder resistance, and can be manufactured at a low cost. The semiconductor encapsulating resin composition includes a phenol resin (A) containing a polymer (A0) having structural units represented by the following general formulae (1) and (2), and composed of one or more components having an aromatic group having at least one alkyl group with 1 to 3 carbon atoms at least at one end; an epoxy resin (B); and an inorganic filler (C), | 05-26-2011 |
20110257300 | CERAMIC POWDER AND APPLICATIONS THEREOF - The present invention provides ceramic powder capable of being incorporated into rubber or a resin for the preparation of a composition, which shows excellent heat resistance and flame retardancy and which is used, for instance, as a semiconductor-sealing material. The ceramic powder has a multi-peak frequency distribution pattern having at least two peaks as a particle size distribution as determined using a laser diffraction-scattering type particle size-analyzer, wherein the maximum particle size for the first peak ranges from 40 to 80 μm and that for the second peak ranges from 3 to 8 μm and wherein the rate of the particles having a particle size of not less than 20 μm and less than 40 μm is not more than 20% by mass (inclusive of 0% by mass). | 10-20-2011 |
20110294921 | FUSION BONDED EPOXY COATING COMPOSITIONS THAT INCLUDE MAGNESIUM OXIDE - A powdered epoxy coating composition for coating a substrate. The coating composition comprises: (a) from about 50 wt % to about 90 wt % of at least one epoxy resin; (b) from about 1 wt % to about 30 wt % of at least one catechol novolak-type adhesion promoter; and (c) from about 0.1 wt % to about 5 wt % of magnesium oxide. The coating may also include from about 10 wt % to about 48 wt % of an inorganic filler. The coating composition provides improved adhesion at high temperature operating conditions and improved resistance to damage by cathodic disbondment for pipe, rebar, and other substrates. | 12-01-2011 |
20110301264 | TWO COMPONENT CURABLE COMPOSITIONS - A two component reactive composition is described, each component, before they are mixed together, contains a filler having thin platelet structure, e.g. a nanoclay, and a further filler that interacts with the platelets. The individual components can have a filler loading that makes them flowable and therefore the components can readily be mixed together for ready dispensing. When the components are mixed thoroughly together, the resulting resin may have a viscosity higher than that of the individual components. The loading of the filler is preferably chosen so that the resulting blended resin is capable of being applied on to a vertical surface without experiencing significant slump. The viscosity of the mixed material can be up to 5 to 10 times or more than that of the individual components before mixing. The composition can be used in adhesives, modelling pastes, coatings, sealants, putties, mastics, stopping compounds, caulking materials, encapsulants and surface coatings. | 12-08-2011 |
20120010329 | CURABLE EPOXY RESIN COMPOSITIONS AND CURED PRODUCTS THEREFROM - Curable epoxy resin compositions, cured epoxy resin compositions, and processes of forming the same, including at least one epoxy resin, at least one sterically hindered amine curing agent and at least one non-sterically hindered amine curing agent which provides toughness properties to the curable composition and resultant cured product made from the curable composition. | 01-12-2012 |
20120065298 | SURFACE-COATED METALLIC PIGMENT, WATER BASE PAINT CONTAINING THE SAME, AND COATED PRODUCT TO WHICH WATER BASE PAINT HAS BEEN APPLIED - A surface-coated metallic pigment according to the present invention includes base particles and a coating layer constituted of one layer, or two or more layers formed on a surface of the base particles, the coating layer having an outermost layer composed of a first compound obtained by polymerizing one monomer or oligomer, or two or more monomers or oligomers having one or more polymerizable double bonds, the outermost layer having a surface to which one surface modifier or two or more surface modifiers is/are bonded, and the surface modifier being a monomer or an oligomer having a bridged ring structure containing 9 to 12 carbon atoms and having one or more polymerizable double bonds. | 03-15-2012 |
20120149807 | DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND - A diepoxy compound represented by the formula (1) | 06-14-2012 |
20120178853 | SOLVENTLESS ONE LIQUID TYPE CYANATE ESTER-EPOXY COMPOSITE RESIN COMPOSITION - The present invention is a solventless one liquid type cyanate ester-epoxy resin composition having high thermal resistance as well as excellent storage stability and curing properties, which contains (A) cyanate ester, (B) epoxy resin, (C) guanidine compounds and (D) at least one kind of phenol compounds selected from a group consisting of phenol compounds represented by the following general formulae. In the general formulae, 1 is an integer selected from 0 to 4, R | 07-12-2012 |
20120252933 | COMPOSITES OF INORGANIC MICROPARTICLES HAVING A PHOSPHATED SURFACE AND ALKALINE EARTH CARBONATE NANOPARTICLES - The present invention relates to composites comprising inorganic micro pigments and/or fillers in the form of surface-phosphated microparticles, whose surface is at least partially coated with finely divided with alkaline earth carbonate nanoparticles by means of binders based on copolymers comprising as the monomers one or more dicarboxylic acids and one or more monomers from the group of diamines, triamines, dialkanolamines or trialkanolamines and epichlorohydrin, a method for producing such composites, aqueous slurries thereof and the use thereof in papermaking or in the field of production of paints and plastics as well as the use of the binders for the coating of microparticles with nano alkaline earth carbonate. | 10-04-2012 |
20130030085 | ONE-PACK TYPE RESIN COMPOSITION FOR USE IN BACKING - Provided is the one-pack type backing resin composition which exhibits excellent fall-off resistance, excellent storage stability, and high flame retardancy. A one-pack type backing resin composition includes 100 parts by mass of (A) a (meth)acrylic polymer, and 50 to 500 parts by mass of (B) a flame retardant, the (meth)acrylic polymer (A) being produced by emulsion polymerization of a monomer component, and having a solvent-insoluble content of 0 to 85 mass %, the monomer component including 0.5 to 25 mass % of (a) glycidyl methacrylate, 0.2 to 10 mass % of (b) an unsaturated carboxylic acid monomer, and 70 to 99.3 mass % of (c) an additional copolymerizable monomer (provided that (a)+(b)+(c)=100 mass %). | 01-31-2013 |
20130225727 | GLASS COMPOSITION FOR PRODUCING HIGH STRENGTH AND HIGH MODULUS FIBERS - A glass composition including SiO | 08-29-2013 |
20130245160 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE ADHESIVE COMPOSITION OR THE ADHESIVE SHEET - The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).) | 09-19-2013 |
20130303660 | POLYESTER COMPOSITION - Compositions comprising: (a) 30 to 65 weight percent of a polyester, (b) 7 to 25 weight percent of an ethylene copolymer toughener; (c) 5 to 25 weight percent of a copolyether ester elastomer having a shore D hardness of 20 to 50; optionally (d) 15 to 35 weight percent of a halogenated epoxy flame retardant; and (e) when (d) is present in the composition, optionally, 2 to 10 weight percent of a flame retardant synergist; | 11-14-2013 |
20130338266 | EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - The present invention relates to an epoxy resin composition which comprises a phosphorus-containing modified epoxy resin (A) consisting of a compound (a) represented by Formula (a); a novolak epoxy resin (B); a hardener (C) for epoxy resins; and a metal hydroxide (D), wherein the content in mass % of the phosphorus-containing modified epoxy resin (A), C | 12-19-2013 |
20140018474 | COMPOSITION FOR ANTI-SCRATCH AND WEAR-RESISTANCE PROPERTIES, METHOD OF PREPARING THE SAME, AND ITS APPLICATIONS - Provided are a composition for anti-scratch and wear-resistance properties, a method of preparing the same, and its application. The composition has inorganic particles, a dispersant and an organic binding agent. The inorganic particles are spherical and have an average particle size ranging from 10 nanometers to 999 nanometers. The dispersant has an inorganic dispersant and a polymer dispersant. The specific gravity of the inorganic particles and inorganic dispersant are respectively represented by s1 and s2, 0.0501-16-2014 | |
20140113994 | PARTIALLY ESTERIFIED EPOXY RESIN AND EPOXY RESIN COMPOSITION APPLIED WITH THE SAME, AND METHOD FOR PREPARING THE COMPOSITION - A partially esterified epoxy resin and an epoxy resin composition applied with the same, and a method for preparing the composition are provided. The preparation method includes the following steps. A bifunctional epoxy resin and an anhydride are mixed and heated, wherein the number of equivalent moles of the bifunctional epoxy resin is greater than that of the anhydride, to form a partially esterified epoxy resin. A curing agent is mixed into the partially esterified epoxy resin to form a mixed solution. The mixed solution is cured to form the partially esterified epoxy resin composition. | 04-24-2014 |
20140128512 | METHOD FOR PRODUCING GLITTER - The invention relates to a method for producing glitter comprising particles having a thickness of ≧1 μm from a predetermined starting material, which particles are introduced into a mixed bed which is produced by means of a fluidised bed, the mixed bed being adjusted by means of a primary flow and a secondary flow, and the individual particles in the mixed bed being sealed at all sides with a layer of protective material so as to enclose cut and broken edges. | 05-08-2014 |
20140148530 | FUSION BONDED EPOXY COATING COMPOSITIONS THAT INCLUDE MAGNESIUM OXIDE - A powdered epoxy coating composition for coating a substrate. The coating composition comprises: (a) from about 50 wt % to about 90 wt % of at least one epoxy resin; (b) from about 1 wt % to about 30 wt % of at least one catechol novolak-type adhesion promoter; and (c) from about 0.1 wt % to about 5 wt % of magnesium oxide. The coating may also include from about 10 wt % to about 48 wt % of an inorganic filler. The coating composition provides improved adhesion at high temperature operating conditions and improved resistance to damage by cathodic disbondment for pipe, rebar, and other substrates. | 05-29-2014 |
20150141550 | POLYARYLENE SULFIDE RESIN COMPOSITION AND A PREPARATION METHOD THEREOF - The present invention relates to a polyarylene sulfide resin composition having excellent impact resistance in which a polyarylene sulfide resin having a specific end group, an epoxy-containing olefin-based elastomer, and/or an organic or inorganic filler are included, and a preparation method thereof. | 05-21-2015 |
20160002062 | PROCESS FOR PRODUCING HEAT-RESISTANT ALUMINUM HYDROXIDE - A process for producing a heat-resistant aluminum hydroxide, comprising the step of applying a heating treatment to a gibbsite-type aluminum hydroxide at a pressure equal to or higher than an atmospheric pressure and equal to or lower than 0.3 MPa, in an atmosphere whose water vapor molar fraction is equal to or higher than 0.03 and equal to or lower than 1, and at a temperature equal to or higher than 180° C. and equal to or lower than 300° C. | 01-07-2016 |
20160083619 | LIGHTWEIGHT PARTICLES AND COMPOSITIONS CONTAINING THEM - Disclosed are particles that have an exterior surface coated with a thin polymeric coating, such as a coating that includes a sulfur-containing polymer. Also disclosed are compositions, such as fuel-resistant sealant and coating compositions, which include such particles. Aerospace vehicles having an aperture at least partially sealed with a sealant deposited from such a sealant composition are also disclosed. | 03-24-2016 |
20160145468 | HIGH-SOLIDS COATING COMPOSITION - The present invention pertains to a coating composition based on a specific epoxy-functional siloxane oligomer and an amine-functional polyorganosiloxane. The coating composition is suitable for use on substrates subjected to outdoor conditions, in particular conditions where a high durability, a high UV resistance, and good anti-corrosive properties are required. | 05-26-2016 |
523458000 | Transition metal | 31 |
20090286902 | Cast Solid Surface Materials Manufactured From Polymers and Post-Consumer Waste Glass - A solid surface material suitable for use as a countertop contains a resin and a filler which includes clean dry glass powder produced from unsorted post-consumer waste glass, including a substantial fraction of non-glass items. The powdered glass is used as at least a portion of the filler and/or gelling agent in lieu of or in addition to other fillers and gelling agents known in the art. | 11-19-2009 |
20100331456 | Powder Coating Composition with New Pigment - A powder coating composition comprising an intimate mixture of at least one film forming resin binder and from 0.1 to 50 wt. %, based on the total weight of the powder coating composition, of at least one modified encapsulated titanium dioxide. | 12-30-2010 |
20110046268 | Self-Filleting Die Attach Paste - A composition that will automatically flow (auto-flow) and form a fillet (self-fillet) will have a yield stress within the range of 1.8 Pa to 10 Pa (20 dynes/cm | 02-24-2011 |
20120016058 | MANGANESE VANADIUM TANTALUM OXIDE AND PIGMENTS HAVING A BLACK METALLIC EFFECT COATED WITH THE SAME - Manganese vanadium tantalum oxide that can be represented by the formula Mn | 01-19-2012 |
20120029118 | TOUGHENED RESIN FIBER LAMINATES WITH TITANIUM PARTICLES - A composite structure includes at least one resin matrix layer having a resin material and a plurality of fiber elements and a plurality of titanium particles provided in the resin material. A method of toughening a resin matrix layer is also disclosed. | 02-02-2012 |
20120184648 | DISPERSION METHOD FOR THE PREPARATION OF PARTICLE REINFORCED POLYMER COMPOSITIONS - Method of preparing a particle dispersion within a polymer is disclosed. The dispersion may include core shell rubber particles and the polymer may include epoxies. The particles are capable of being substantially dispersed within the polymer so as to substantially inhibit agglomeration of the particles. Mechanical properties, such as toughness are improved while glass transition temperature and viscosity are not substantially impaired by the presence of the particles. | 07-19-2012 |
20120302668 | SEMICONDUCTOR SEALING MATERIAL COMPOSITION - Disclosed herein is a semiconductor sealing material composition, including: 9.0˜13 wt % of an epoxy resin; 6˜7 wt % of a hardener; 0.2˜0.3 wt % of a curing catalyst; 0.60˜0.68 wt % of at least one additive selected from the group consisting of a coupling agent, a release agent and a coloring agent; and 79˜84 wt % of a filler, wherein the filler is nano-graphene plate powder. The semiconductor sealing material composition has excellent crack resistance at a high temperature of 270° C. or more and has high thermal conductivity and excellent flame retardancy. | 11-29-2012 |
20120316266 | SILANE SURFACE-TREATED METAL OXIDE FINE PARTICLES AND PRODUCTION METHOD FOR SAME - There is provided a colloidal particle of an oxide of at least one metal selected from the group consisting of Ti, Fe, Zr, Sn, Ta, Nb, Y, Mo, W, Pb, In, Bi, and Sr, which is capable of being dispersed in a hydrophobic organic solvent, and a hydrophilic organic solvent dispersed sol thereof or a sol thereof dispersed in a hydrophobic organic solvent having a solubility of water of 0.05 to 12% by mass, and further, a fine powder of a metal oxide colloidal particle capable of being redispersed in various organic solvents. A silane treated modified metal oxide colloidal particle on the surface of which an amine compound and 1 to 4 silyl group(s) per 1 nm | 12-13-2012 |
20130005858 | INSULATING POLYMER MATERIAL COMPOSITION - An insulating polymer material composition of the environment-conscious type which is obtained by using a renewable resource and a waste material as starting materials is provided. A vegetable oil-origin epoxy resin and a plant-origin polyphenol are mixed and the obtained mixture is subjected to a heat treatment, with which a liquid epoxy resin composition which is a compatibilized blend of the vegetable oil-origin epoxy resin and the plant-origin polyphenol is provided. To this liquid epoxy resin composition, coal ash and a silane coupling agent are added followed by mixing. Further, an additive such as a curing accelerator is added thereto, followed by a heat treatment, thereby obtaining an insulating polymer material composition. As the coal ash, it is preferable to use fly ash. It is also preferable to use a silane coupling agent having epoxy group. | 01-03-2013 |
20130059946 | BIOCOMPATIBLE POLYMER NANOPARTICLE COATING COMPOSITION AND METHOD OF PRODUCTION THEREOF - Biocompatible polymeric coating compositions having nanoscale surface roughness and methods of forming such coatings are described. A polymeric biocompatible coating may be produced using a powder coating method, where one or more thermosetting polymer resins and one or more biocompatible materials are mixed and extruded, ground into microscale particles, and mixed with nanoparticles to form a dry powder mixture that may be coated onto a substrate according to a powder coating method. Alternatively, the thermosetting polymeric resin can be first extruded and ground into microscale particles, and then mixed with the biocompatible materials in particular form of nanoscale to microscale in size, and then further mixed with nanoparticles to form a dry powder mixture for coating. Bioactive materials may also be selectively added into the polymeric coating in a similar way as the biocompatible materials, either before or after the extrusion, to form a bioactive polymeric coating. | 03-07-2013 |
20130116362 | INORGANIC-ORGANIC HYBRID MATERIAL, OPTICAL MATERIAL USING THE SAME, AND INORGANIC-ORGANIC COMPOSITE COMPOSITION - The invention relates to an inorganic-organic hybrid material which comprises an inorganic component and an organic component, has a content of the inorganic component of 20-80% by mass, and has a refractive index of 1.60 or higher, wherein, when preparing a strip specimen having a thickness of 1,000 μm, a width of 5 mm and a length of 70 mm by using the inorganic-organic hybrid material and winding the specimen by 180° on a cylindrical metal rod having a diameter of 10 mm at 25° C., the specimen does not crack. | 05-09-2013 |
20130217807 | HIGH REFRACTIVE INDEX GLASS COMPOSITION - A glass composition including SiO | 08-22-2013 |
20130338267 | Systems, Devices, and/or Methods for Manufacturing Castings - Certain exemplary embodiments can provide a composition, system, machine, device, manufacture, circuit, and/or user interface adapted for, and/or a method and/or machine-readable medium comprising machine-implementable instructions for, activities that can comprise, after removing a cast device from a stack-lamination-derived mold, said cast device formed from a molding composition, applying a desired shape to said cast device to form a shaped cast device, said molding composition comprising: a ceramic composition comprising silica; an cycloaliphatic epoxy binder composition, said cycloaliphatic epoxy binder composition present in said molding composition in an amount up to 30% by weight of said molding composition; a silicone composition comprising a siloxane resin, said silicone composition present in said molding composition in an amount up to 30% by weight of said molding composition; and a solvent composition adapted to dissolve said cycloaliphatic epoxy binder composition and said silicone composition. | 12-19-2013 |
20140005304 | NANOCOMPOSITE AND METHOD OF MAKING THE SAME | 01-02-2014 |
20140011919 | TRIPHENYL MONOMERS SUITABLE FOR MICROSTRUCTURED OPTICAL FILMS - Optical films are described having a polymerized microstructured surface that comprises the reaction product of a polymerizable resin composition comprising at least one polymerizable ethylenically unsaturated triphenyl monomer. Also described are certain triphenyl(meth)acrylate monomers and polymerizable resin compositions. | 01-09-2014 |
20140018475 | HIGH GLASS TRANSITION TEMPERATURE THERMOSET AND METHOD OF MAKING THE SAME - A process for preparing a nanocomposite includes combining a resin and silsesquioxane; introducing a curing agent to the resin and silsesquioxane to form a composition; and forming a reaction product of the composition to prepare the nanocomposite, wherein a total amount of the silsesquioxane and curing agent in the composition is from 1 wt % to 70 wt %, based on a weight of the composition. Additionally, a process for preparing an article includes combining an epoxy resin and silsesquioxane; introducing a curing agent to the epoxy resin and silsesquioxane to form a composition; and reacting the epoxy resin, silsesquioxane, and curing agent to form the nanocomposite, wherein a molar ratio of a number of moles of an epoxy functional group of the epoxy resin to the sum of the number of moles of the silsesquioxane and curing agent is from 1:1 to 100:1. An article includes the reaction product of the resin, silsesquioxane, and curing agent. | 01-16-2014 |
20140121301 | ENGINEERED COMPOSITE MATERIAL AND PRODUCTS PRODUCED THEREFROM - A composite material includes a polymer matrix material and filler material that includes vitreous china. The composite material has a water absorption of less than about one percent. Such a composite material may be used in the production of articles such as sinks, bathtubs, shower receptors, and other articles that may benefit from low water absorption properties. | 05-01-2014 |
20140296387 | RESIN COMPOSITION WITH HIGH DIELECTRIC INSULATION PROPERTIES - Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 10 | 10-02-2014 |
20140316033 | INORGANIC-ORGANIC HYBRID MATERIAL, OPTICAL MATERIAL USING THE SAME, AND INORGANIC-ORGANIC COMPOSITE COMPOSITION - The invention relates to an inorganic-organic hybrid material which comprises an inorganic component and an organic component, has a content of the inorganic component of 20-80% by mass, and has a refractive index of 1.60 or higher, wherein, when preparing a strip specimen having a thickness of 1,000 μm, a width of 5 mm and a length of 70 mm by using the inorganic-organic hybrid material and winding the specimen by 180° on a cylindrical metal rod having a diameter of 10 mm at 25° C., the specimen does not crack. | 10-23-2014 |
20140323612 | ANTIREFLECTION COATING FILM AND ANTIREFLECTION COATING MATERIAL FOR OPTICAL ELEMENT AND OPTICAL ELEMENT - An antireflection coating film for an optical element is provided on a surface of a substrate of an optical material and includes first particles having a refractive index (nd) of at least 2.2 or more for the d-line and an average particle size of 10 to 70 nm, second particles of at least one of silica and sericite and having an average particle size of 1 to 11 μm, a colorant of an organic substance and soluble in an organic solvent, and a resin, in which the first particle content is in the range of 10% to 35% by weight, and second particle content is in the range of 1% to 11% by weight. The antireflection coating film has a high effect of preventing surface reflection, a high effect of preventing inner-surface reflection, satisfactory absorption of visible light, and low levels of reflection and scattering in the film. | 10-30-2014 |
20140329935 | METHOD FOR IMPROVING THE EFFECTIVENESS OF TITANIUM DIOXIDE-CONTAINING COATINGS - The invention provides a method for forming a TiO | 11-06-2014 |
20150065612 | ELECTRICAL INSULATION BODY FOR A HIGH-VOLTAGE ROTARY MACHINE AND METHOD FOR PRODUCING THE ELECTRICAL INSULATION BODY - An electrical insulation body for a high-voltage rotary machine is provided. The electrical insulation body has a synthetic resin which is produced by reacting an epoxy with a hardener, and to which a filler component comprising particles is added, wherein the mass fraction of chlorine in the epoxy is less than 100 ppm. | 03-05-2015 |
20150105497 | INORGANIC FILLER COATED WITH MOLYBDENUM COMPOUND AND USAGE THEREOF - An inorganic filler coated with molybdenum compound used as an additive is added into a resin mixture in an amount of 20 to 80 wt % of the resin mixture, resulted in that printed circuit boards if made from a laminate or a prepreg containing the resin mixture have properties of a low coefficient of thermal expansion, good heat tolerance and excellent drilling processability. | 04-16-2015 |
20150148452 | COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP - There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less. | 05-28-2015 |
20150329670 | SEMIAROMATIC POLYAMIDE, SEMIAROMATIC POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE - To provide: a semiaromatic polyamide which has excellent moldability, heat resistance, chemical resistance and mechanical characteristics; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy ([increment]H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the intrinsic viscosity of the semiaromatic polyamide (I) is 0.7-1.6 dl/g. | 11-19-2015 |
20150337106 | Low-Melting-Point Glass Resin Composite Material and Electronic/Electric Apparatus Using Same - The purpose of the present invention is to provide a low-melting-point glass resin composite material with which the heat resistance and heat conductivity of an insulating resin can be improved. The low-melting-point glass resin composite material includes: a lead-free low-melting-point glass composition that contains Ag | 11-26-2015 |
20150361245 | IMPREGNATING RESIN FOR AN ELECTRICAL INSULATION BODY, ELECTRICAL INSULATION BODY, AND METHOD FOR PRODUCING THE ELECTRICAL INSULATION BODY - An impregnating resin for an electrical insulation body includes a base resin, a filler having nanoscale particles, and a radically polymerizing reactive diluent. The impregnating resin includes a crosslinker for crosslinking the base resin and the reactive diluents. The base resin is an epoxy resin. An electrical insulation body includes the impregnating resin and a method produces the electrical insulation body by production of an impregnating resin having a base resin, a filler having nanosize particles and a free-radically polymerizing reactive diluent. | 12-17-2015 |
20150361262 | NEW USES OF CONDENSATION RESINS - The present invention relates to new uses of condensation resins made from urea, formaldehyde, and CH-acidic aldehydes. | 12-17-2015 |
20160024327 | DISPERSED COMPOSITION, COATING COMPOSITION, COATING FILM, AND COLORED ITEM - The present invention provides a dispersed composition containing an ultramarine (A), a black inorganic pigment (B) (excluding carbon black), and a dispersion medium (C), wherein the weight ratio of ultramarine (A)/black inorganic pigment (B) is from 80/20 to 4.3/95.7. As a result, the invention provides a coating film and a colored item having a high surface resistivity (an antistatic effect) and resistance to overheating by sunlight, as well as a coating composition for forming this coating film and colored item, for use in fields such as black matrices for color filters and automotive coating materials. | 01-28-2016 |
20160137808 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME - Disclosed herein is an epoxy resin composition for encapsulating semiconductor devices, the epoxy resin composition including an epoxy resin, a curing agent, inorganic fillers, and a colorant, the colorant including a hydrate. | 05-19-2016 |
20160185974 | HIGH ELASTIC PRIMER COMPOSITION - The present invention relates to a high elastic primer composition. The high elastic primer composition comprises: a hard urethane-modified polyester in an amount of about 10 to 20 wt %, a soft urethane-modified polyester in an amount of about 5 to 20 wt %, a polycaprolactone in an amount of about 1 to 10 wt %, a polymer resin 20 to 50 wt %, an extender pigment 0.1 to 20 wt % and a solvent 15 to 50 wt %, based on the total weight of the primer composition. | 06-30-2016 |
523459000 | Heavy metal | 6 |
20090018239 | UNDERFILL ADHESIVES - In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes. | 01-15-2009 |
20110263754 | METALLIC COMPOUNDS IN NON-BROMINATED FLAME RETARDANT EPOXY RESINS - A composition comprising a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof, and wherein said composition contains a non-halogen flame retardant is disclosed. | 10-27-2011 |
20130072597 | STORAGE STABLE WATER BASED EPOXY-AMINE CURABLE SYSTEMS - The invention relates to non aqueous curing agents for water dispersed epoxy resins. The curing agent composition offers a binder pot life of several hours, and in the presence of a metal, such as zinc, nearly no hydrogen generation is observed. The present curing composition can be mixed with a metal powder to provide a storage stable paste. The curing agent composition and/or paste is fully compatible with an epoxy water based resin. After low shear blending, the epoxy curing agent and metal system is storage stable for several hours working pot life that provides for cured coatings having good performance. | 03-21-2013 |
20130203897 | ELECTRICAL INSULATION SYSTEM - Electrical insulation system with improved electrical breakdown strength, including a hardened polymer component having incorporated therein a filler material and a nano-scale sized filler material. The hardened polymer component is selected from epoxy resin compositions, polyesters, polyamides, polybutylene terephthalate, polyurethanes and polydicyclo-pentadiene. The filler material has an average particle size within the range of 1 μm-500 μm, and is present in a quantity within the range of 40%-65% by weight, calculated to the total weight of the insulation system. The nano-scale sized filler material is a pretreated nano-scale sized filler material, having been produced by a sol-gel process. The nano-scale sized filler material is present within the electrical insulation system in an amount of about 1%-20% by weight, calculated to the weight of the filler material present in the electrical insulation system. | 08-08-2013 |
20140187679 | RESIN COMPOSITION WITH GOOD WORKABILITY, INSULATING FILM, AND PREPREG - This invention relates to a resin composition with good workability, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and an inorganic filler having a nanocone shape, and to an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition. | 07-03-2014 |
20150315432 | METALLIC COMPOUNDS IN NON-BROMINATED FLAME RETARDANT EPOXY RESINS - A composition comprising a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof, and wherein said composition contains a non-halogen flame retardant is disclosed. | 11-05-2015 |