| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 522012000 |
Contains compound containing keto group not part of a ring and a specified rate-affecting material; or contains a specified rate-affecting material and a nonspecified photoinitiator or photosensitizer
| 50 |
| 522008000 |
At least two specified rate-affecting materials containing keto group not part of a ring; or contains a nonspecified photoinitiator or photosensitizer and specified ketone containing material wherein the keto group is not part of a ring
| 29 |
| 522028000 |
Specified rate-affecting material contains phosphorous, arsenic, antimony or nitrogen
| 21 |
| 522026000 |
Specified rate-affecting material is heterocyclic
| 18 |
| 522011000 |
Contains compound containing keto group not part of a ring and nonspecified rate-affecting material other than mere photoinitiator or photosensitizer
| 8 |
| 522025000 |
Specified rate-affecting material contains onium group
| 8 |
| 522024000 |
Specified rate-affecting material is a peroxide
| 6 |
| 522030000 |
Specified rate-affecting material is organic | 4 |
| 20090298961 | MULTI-COMPONENT SYSTEMS, METHOD FOR THE PRODUCTION AND USE THEREOF - Multicomponent systems comprising | 12-03-2009 |
| 20110124764 | INITIATOR SYSTEM WITH BIPHENYLENE DERIVATES, METHOD OF PRODUCTION AND USE THEREOF - The invention relates to an initiator system comprising (a) an iodonium salt, (b) a light sensitizer and (c) an electron donor compound comprising a biphenylene structure, the biphenylene structure comprising at least one but not more than about 4 alkyl groups. The invention also relates to a hardenable composition comprising such an initiator system and the use thereof, as well as to a process for producing the substituted biphenylene compound. | 05-26-2011 |
| 20130217800 | Hydrophobic self-etch dental adhesive compositions - A hydrophobic self-etch dental adhesive composition including a hydrophobic, surfactant-type acidic monomer. The composition may further include hydrophilic and hydrophobic monomers, preferably in a ratio of less than 1:1, and may include a solvent that is an azeotrope. | 08-22-2013 |
| 20140296362 | NEW POLY-AMIC ACID, PHOTO-SENSITIVE RESIN COMPOSITION, DRY FILM, AND CIRCUIT BOARD - The present invention relates to a novel polyamic acid introduced with an imidazolyl group in the polymer chain, a photosensitive resin composition including the polyamic acid and that is capable of providing a photosensitive material that satisfies the characteristics of an excellent bending property and low stiffness and also exhibits excellent heat resistance and coating resistance, a dry film obtained from the photosensitive resin composition, and a circuit board including the dry film. | 10-02-2014 |
| 522027000 |
Specified rate-affecting material contains sulfur | 1 |
| 20110319513 | SPRAY COATABLE ADHESIVE FOR BONDING SILICON DIES TO RIGID SUBSTRATES - A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate. | 12-29-2011 |
