| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 521135000 | At least one polymer is derived from reactant containing two or more three membered heterocyclic rings having two carbon atoms and one chalcogen atom or polymer-forming system contains the same type of reactant | 11 |
| 20090069456 | COMPOSITION MADE FROM A DIISOCYANATE AND A MONOAMINE AND PROCESS FOR PREPARING IT - Process for preparing a composition by reacting a polyisocyanate, a monoalkoxy polyoxyalkylene monoamine and water. The composition and its use in making cellular products are claimed as well. | 03-12-2009 |
| 20100273905 | THERMOPLAST-CONTAINING EPOXY RESINS AND THE PROCESSING THEREOF BY EXTRUSION OR INJECTION MOLDING - The invention relates to a material mixture comprising at least one epoxy resin and a thermoplast, selected from such copolymers that comprise at least three different monomers. Preferably, the thermoplast is selected from such where at least one monomer is a hydrocarbon without heteroatoms and with at least one C═C double bond and where at least one other monomer is an optionally substituted acrylate or an optionally substituted acrylic acid ester. The invention also relates to a material mixture of said kind that additionally comprises the following components: at least one blowing agent, at least one hardener and at least one filler. The invention relates to methods for the production of molded bodies made from said material mixture, to the molded bodies and the use thereof for structural reinforcement. | 10-28-2010 |
| 20110152394 | ADHESIVE COMPOSITION FOR STEALTH DICING OF SEMICONDUCTOR, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE INCLUDING THE ADHESIVE FILM - An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic epoxy resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent. | 06-23-2011 |
| 20110178196 | BIODEGRADABLE POLYMER MIXTURE - The present invention relates to biodegradable polymer mixtures comprising
| 07-21-2011 |
| 20120295997 | RESIN KNEADED MATERIAL AND SHEET - A resin kneaded material has not more than 30 pores having a pore diameter of not less than 20 μm in a surface area of 4.00 mm | 11-22-2012 |
| 20130035411 | THERMAL EXPANSION CONTROL EMPLOYING PLATELET FILLERS - Bilayer platelet fillers are employed to compensate for a positive coefficient of thermal expansion (CTE) of an embedding polymeric material, or even to provide a composite structure having a negative CTE to eliminate or alleviate thermomechanical stress and/or delamination during thermal cycling. A bilayer platelet includes two joined layers having different CTEs. The CTE mismatch induces bending of the bilayer platelets, thereby causing cavities at temperatures lower than the joining temperature at which the bilayers are joined. The decrease in the volume of the polymeric material and the bilayer platelets at low temperatures is compensated by an accompanying increase in the volume of the cavities so that the composite structure has a temperature independent volume, a low net CTE, or even a negative CTE. | 02-07-2013 |
| 20130281559 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME - An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C. | 10-24-2013 |
| 20150080486 | Flame Retardant with Compositions - A flame retardant containing composition resistant to becoming sticky from moisture is prepared by the introduction of epoxy containing compound either into the ethyleneamine polyphosphates or into the polymeric composition. | 03-19-2015 |
| 20160108297 | Bonding Dissimilar Materials with Adhesive Paste - A rivetable adhesive for use in a joint between dissimilar materials, comprising a liquid epoxy resin, an expoxidized polysulfide, a flexibilizer, a solid epoxy CTBN adduct based upon bisphenol A, a phenoxy resin, an impact modifier including methacrylate-butadiene-styrene, a curing agent; and a blowing agent. The adhesive finds particular suitability for use in riveting aluminum panels to steel structures, such as for forming automotive vehicle roof structures. | 04-21-2016 |
| 20160122491 | Polymeric Material for Use in Thermal Insulation - A polymeric material for use in thermal insulation is provided. The polymeric material is formed from a thermoplastic composition containing a continuous phase that includes a matrix polymer and within which a microinclusion additive and nanoinclusion additive are dispersed in the form of discrete domains. A porous network is defined in the material that includes a plurality of nanopores having an average cross-sectional dimension of about 800 nanometers or less. The polymeric material exhibits a thermal conductivity of about 0.20 watts per meter-kelvin or less. | 05-05-2016 |
| 20170233542 | TRIPLE SHAPE MEMORY COMPOSITE FOAMS | 08-17-2017 |
