Class / Patent application number | Description | Number of patent applications / Date published |
451446000 | Abradant supplying | 18 |
20090117834 | HEATLESS SLURRY SYSTEM - A heatless slurry system for use with a glass removal apparatus for restoring a glass surface. The system comprises a slurry container and a pump mounted externally relative to the container to prevent heating of the slurry as the system is operated. Vacuum pressure is created by activation of the pump to promote circulation of the slurry within the tool, thereby allowing the latter to be worked against the surface. | 05-07-2009 |
20100112917 | SELF CLEANING AND ADJUSTABLE SLURRY DELIVERY ARM - Embodiments of the invention provide a slurry delivery and rinse system for a chemical mechanical polishing (CMP) apparatus which is capable of self-cleaning, and which can adjustably deliver the slurry agent and rinse agent over a polishing pad. In one embodiment, the fluid delivery system has a distributed slurry delivery arm (DSDA) which contains at least one manifold, usually two or more manifolds attached to the lower surface of the delivery arm. Each DSDA manifold contains a plurality of slurry nozzles disposed along the length of the manifold. The delivery arm also contains a plurality of high pressure rinse nozzles extending from the lower surface of the delivery arm and disposed along the length of the delivery arm, parallel to each DSDA manifold. In one example, the delivery arm contains two DSDA manifolds disposed parallel to each other and a plurality of high pressure rinse nozzles disposed between the manifolds. | 05-06-2010 |
20100203815 | POLISHING PAD - A polishing pad includes polishing elements interdigitated with one another over a surface of the polishing pad. Each of the polishing elements is secured so as to restrict lateral movement thereof with respect to others of the polishing elements, but remains moveable in an axis normal to a polishing surface of the polishing elements. Different densities of the polishing elements may be positioned within different areas of the surface of the polishing pad. | 08-12-2010 |
20100221989 | FAN NOZZLE - A fan nozzle for cleaning a surface with an abrasive blast media is constructed of a longitudinal body having an axial pathway through which the media is passed under pressure for release from a substantially rectangular cross-sectional outlet to release the media in a substantially flat, wide path. A first transition zone provides a conversion in the axial pathway from the inlet cross-section to the substantially rectangular cross-section of the outlet opening. A second transition or convergence zone first reduces and then expands the cross-section of the axial pathway for providing a Venturii acceleration of the media as it passes through the nozzle. The transition zone and the convergence zone may be coexistent along a portion of the axial pathway. | 09-02-2010 |
20120015593 | Apparatus for Supplying Constant Amount of Abrasive - An apparatus for supplying a constant amount of abrasive which can supply even dry ice particles, ice particles, or the like as abrasive in a constant amount is provided. In order to take out abrasive contained in measuring holes | 01-19-2012 |
20120071069 | SURFACE TREATMENT DEVICE - A surface treatment device includes an enclosure which has an opening through which the leading edge of an aerofoil passes. A sealing element is provided on the enclosure to seal the device to the surfaces of the aerofoil. An abrasive is located within the enclosure and two fluid openings are also provided through which a chemical accelerant can be pumped. In operation the enclosure is oscillated relative to the component so that material is abraded. Whilst the enclosure is oscillated a chemical accelerant is simultaneously pumped through it. The device allows for the local application of a surface treatment on a component. | 03-22-2012 |
20120171939 | CHEMICAL MECHANICAL POLISHING DEVICE AND POLISHING ELEMENT - A polishing element used in chemical mechanical polishing device includes a polishing plate for holding a wafer that is provided; a polishing pad arm, one end of the polishing pad arm being fixed, another end of the polishing pad arm holding a polishing pad, and the polishing pad arm driving the polishing pad for moving relatively to the wafer; the polishing pad moving relatively to the wafer with drive from the polishing pad arm, and the polishing pad arm ensuring the polishing pad contacting the wafer during movement; and a slurry supply route for supplying polishing slurry between the polishing pad and the wafer during polishing. The present invention also provides a chemical mechanical polishing device. It makes for realizing miniaturization of a chemical mechanical polishing device, saving polishing slurry and improving utilization rate of the polishing pad in the chemical mechanical polishing device to apply the present invention. | 07-05-2012 |
20120202408 | PRESSURE REGULATION IN REMOTE ZONES - A pressure control system remotely controls pressure within one or more remote zones, each respectively connected to an enclosure through a conduit, by controlling flow of a fluid into and out of each enclosure. The pressure of the fluid is measured within each enclosure. An estimated pressure within each zone is computed, as a function of the measured pressure in the enclosure and known characteristics of the conduit and the zone. For each zone, an inlet proportional valve and an outlet proportional valve of each enclosure is operated so as to control the input flow rate of the fluid into the respective enclosure and the output flow rate of the fluid out of the enclosure as a function of a pressure set point and the estimated pressure, thereby regulating pressure within the zone in accordance with the pressure set point. | 08-09-2012 |
20120220206 | METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY - Disclosed is an apparatus for injecting slurry onto the polishing pad surface of a chemical mechanical polishing (CMP) tool. The disclosed apparatus includes a rectilinear shaped injector bottom, where multiple slots are created in the top surface of the injector bottom, allowing the injector bottom to flex and to conform to the polishing pad profile. CMP slurry or components thereof are introduced through one or more top surface openings, travel through the injector body, and exit through a slit or bottom surface opening. The slurry is spread into a thin film by the injector, and is introduced at the gap between the surface of the polishing pad and the wafer, along the leading edge of the wafer, in quantities small enough that all or most of the slurry is introduced between the wafer and the polishing pad. | 08-30-2012 |
20120289134 | CMP SLURRY MIX AND DELIVERY SYSTEM - A CMP slurry mix and delivery system includes at least one container for holding a polishing agent; a pump connected to the container for pumping the polishing agent to a point of use; and a slurry dispersion unit installed between the pump and the point of use, wherein slurry dispersion unit provides megasonic energy that is capable of dispersing the polishing agent flowing through the slurry dispersion unit. | 11-15-2012 |
20130005225 | AUTOMATIC ABRASIVE SAND DELIVERY MACHINE ESPECIALLY FOR WATER-JET CUTTING MACHINES - An automatic loader of abrasive sand into a storage and supply tank (T) of a machine tool that uses the abrasive sand, and in particular of a cutting machine, includes a loading chamber ( | 01-03-2013 |
20130122791 | APPARATUS AND PROCESS FOR FORMATION OF LATERALLY DIRECTED FLUID JETS - A processing apparatus is provided to process a workpiece. The processing apparatus can have a low-profile nozzle system capable of navigating through spaces in order to process target regions with relatively small clearances. A fluid jet outputted from the nozzle system is used to cut, mill, or otherwise process the target region of the workpiece. | 05-16-2013 |
20130225053 | DEVICE FOR SUPPLYING SLURRY FOR SEMICONDUCTOR, PROVIDED WITH PIPE CLOGGING PREVENTION MEANS - Disclosed is a device for supplying slurry for semiconductor in a polishing process when the semiconductor is manufactured. The slurry supply apparatus includes: a storage tank in which the slurry is stored; a plurality of pressure vessels connected to the storage tank, respectively, for receiving the slurry from the storage tank and discharging the slurry to the outside; an aspiration unit connected to the pressure vessels, for generating a vacuum pressure in the pressure vessels; and a centrifugal separation unit installed in a connection line of the aspiration unit between the pressure vessels and the aspiration unit, for separating foreign substances contained in the introduced compressed air from the compressed air by using a centrifugal force. | 08-29-2013 |
20140134932 | DEVICE FOR POLISHING WORKPIECE SURFACES - A device for polishing metallic workpiece surfaces. The device includes a tool holder which can be exchangeably fitted into a rotationally driven working spindle of a program-controlled milling machine, and a polishing tool, which is fastened in the tool holder. The device also includes a tool shank and a polishing head at the free end thereof, and is coupled to a polishing agent supply, which arrives at the effective surface of the polishing head. The tool shank contains a chamber, which can admit a pressure medium and is at least partially filled with the polishing agent, wherein this chamber is in connection with the polishing head by way of a channel and wherein the polishing head has polishing agent permeable material or it contains passages for the polishing agent that is forced out of the chamber. | 05-15-2014 |
20140235147 | GAS-LIQUID SEPARATOR AND POLISHING APPARATUS - A gas-liquid separator includes: a gas-liquid separation tank; a gas-liquid introduction pipe configured to introduce a gas-liquid two-phase flow into the gas-liquid separation tank, the gas-liquid introduction pipe extending in the gas-liquid separation tank; a spray nozzle configured to spray pure water toward a liquid that has been collected on a bottom of the gas-liquid separation tank; a drain pipe communicating with a liquid discharge outlet provided in the bottom of the gas-liquid separation tank; and an exhaust pipe communicating with a gas discharge outlet provided in a side wall of the gas-liquid separation tank. The gas discharge outlet is located above a lower end of the gas-liquid introduction pipe. | 08-21-2014 |
20160045999 | SLURRY SUPPLY DEVICE AND POLISHING APPARATUS INCLUDING THE SAME - Disclosed is a slurry supply device including a nozzle configured to eject slurry, a slurry supply unit configured to receive the slurry from the nozzle and to discharge the slurry through at least one slurry hole, a receiving unit configured to allow the slurry supply unit to be mounted, inserted, seated, coupled, supported, or placed therein so as to enable discharge of the slurry from the slurry supply unit, the receiving unit being configured to receive a flowing material around the slurry supply unit and a slurry protection unit configured to enclose a space for passage of the slurry from an exit of the nozzle to an entrance of the slurry supply unit in conjunction with the flowing material. | 02-18-2016 |
451447000 | Grader | 2 |
20090053981 | METHOD OF RECYCLING ABRASIVE SLURRY - A method of recycling an abrasive slurry for recycling a slurry that: contains colloidal silica; and has been used in polishing semiconductor wafer(s) is provided. The method includes: adding a dispersant to the used slurry having been collected so as to prevent the used slurry from being gelled; irradiating ultrasound to the used slurry having been added with the dispersant so as to disperse a gelled portion and aggregated silica in the used slurry; and, by using a filter, removing a foreign substance contained in the used slurry having been irradiated with the ultrasound. | 02-26-2009 |
20130165029 | SYSTEMS FOR RECYCLING SLURRY MATERIALS DURING POLISHING PROCESSES - Systems for recycling slurry materials during polishing processes are provided. One system includes a polisher having an inlet and drain outlet, and a slurry storage tank to supply a slurry including a preselected material to the polisher inlet, and a recycling assembly including a cross flow filter including an inlet to receive a waste slurry including the preselected material from the polisher drain outlet, where the cross flow filter is configured to concentrate the preselected material in an outlet slurry, a density meter configured to measure a concentration of the preselected material in the filter outlet slurry, a valve coupled to the filter outlet and configured to supply the slurry storage tank, and a controller coupled to the density meter and valve, where the controller is configured to open the valve when the concentration of the preselected material reaches a first concentration threshold. | 06-27-2013 |