| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 451444000 | Tool cleaner | 11 |
| 20080254722 | PAD CONDITIONER - A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and optionally a brush portion having a second hardness less than the first hardness. The plastic abrasive portion comprises a base plate and a plurality of plastic nodules formed on a surface of the base plate, each of the plastic nodules having a planar top surface, wherein the planar top surface is positioned to substantially contact a polishing pad. The brush portion may be positioned adjacent to the plastic abrasive portion, the brush portion having a plurality of brush elements positioned to substantially contact the pad. | 10-16-2008 |
| 20080311834 | System and Method for Cleaning a Conditioning Device - A system for cleaning a conditioning device to improve the efficiency of the conditioning of a polishing pad using the conditioning device as part of a chemical-mechanical polishing process, the system comprising a conditioning device; a fluid dispenser arranged to dispense a fluid on the conditioning device; and an acoustic nozzle arranged to emit a megasonic or ultrasonic signal at the conditioning device while the fluid dispenser is dispensing the fluid on the conditioning device. | 12-18-2008 |
| 20090068937 | CMP Pad Conditioners with Mosaic Abrasive Segments and Associated Methods - A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another. | 03-12-2009 |
| 20090093199 | CLEANING DEVICE FOR CHEMICAL MECHANICAL POLISHING EQUIPMENT - A cleaning device for chemical-mechanical equipment, which includes: an irrotatable center shaft irrotatably coupled with a spindle which is rotated, the irrotatable center shaft including a first channel and a second channel formed in an interior of the irrotatable center shaft, cleaning liquid flowing into the first channel and compressed gas flowing into the second channel; and a nozzle block coupled with the spindle so as to revolve about the irrotatable center shaft above a polishing pad, the nozzle block mixing cleaning liquid supplied through the first channel with compressed gas supplied through the second channel so as to generate twin-fluid, and pressure-injecting the mixed twin-fluid on the polishing pad. Accordingly, cleaning liquid is pressurized so as to be rapidly injected on a polishing pad so that slurry particles and alien substances on the polishing pad are completely removed. Furthermore, wafer scratch can be prevented and the life of the polishing pad can also be increased. | 04-09-2009 |
| 20100062696 | RETRACTABLE WATER DISPENSER ARM FOR GRINDER/POLISHER - A retractable water dispenser arm system for a grinder/polisher includes a flexible hose formed, in part in a loop and affixed at at least one location to a base of the grinder polisher. A spout is mounted to an end of the flexible hose. A biased tension arm engages the hose at the loop, and is moveable, along with movement of the hose, to maintain the hose in tension. The biased tension arm includes a roller over which the hose traverses. A mount on the base is configured to receive the spout and is further configured for traverse of the hose therethrough. The mount includes a mount roller operably mounted thereto for guiding the hose through the mount. | 03-11-2010 |
| 20120309278 | METHOD FOR REMOVING POLISHING BYPRODUCTS AND POLISHING DEVICE - A method for removing polishing byproducts and a polishing device are provided. The method includes mounting a positive electrode on the center of a polishing platen and a negative electrode on an edge of the polishing platen, applying a voltage between the positive electrode and the negative electrode after a polishing process for metal is finished, and rotating the polishing platen and rinsing a polishing pad with deionized water or a chemical cleaning solution to remove polishing byproducts that are formed in the polishing process. The combination of the centrifugal force and the electromotive force increases the removal rate of the polishing byproducts. | 12-06-2012 |
| 20140099870 | GRINDING APPARATUS FOR A SUBSTRATE - A substrate grinding apparatus according to an exemplary embodiment of the present invention includes a grinding wheel grinding an object substrate, a nozzle unit spraying cooling water to the object substrate and the grinding wheel in a plurality of directions, and a cooling water controller connected to the nozzle unit and controlling spray speed and pressure of the cooling water, in which the nozzle unit includes a cleansing nozzle cleansing the grinding wheel, a cooling nozzle cooling the grinding wheel, and a surface protecting nozzle cooling the object substrate. | 04-10-2014 |
| 20150079885 | DEVICE FOR CLEANING FIXED ABRASIVES POLISHING PAD - A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning liquid, an inject orifice coupled to the inlet for injecting the cleaning liquid and being provided on the surface of the main body, an outlet coupled to the end of the main body, and a recycle orifice coupled to the outlet, and being provided on the surface of the main body. | 03-19-2015 |
| 20150290766 | SUBSTRATE PROCESSING APPARATUS - The CMP apparatus is provided with a polishing unit | 10-15-2015 |
| 20150290767 | SUBSTRATE PROCESSING APPARATUS - A CMP apparatus includes a polishing unit | 10-15-2015 |
| 20180021818 | Apparatus and Method for Cleaning Wafer Handling Equipment | 01-25-2018 |
