| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 451397000 | Work rotating | 30 |
| 20100233946 | Polishing holder for workpiece end surface - A polishing holder for a workpiece end surface comprises a main body and a framework, in which the main body is coupled to a plurality of fixtures used for coupling to polished-to-be workpieces, a periphery of the main body is provided with a ring first supporting portion; a framework, provided with a second supporting portion surrounding an outside of the first supporting portion. Whereby, the second supporting portion limits a deviation region of the first supporting portion to enable the main body to be kept parallel to a polishing surface during a polished end surface of the workpiece is brought into contact with the polishing surface and polished thereby so that the production time and cost of the first supporting portion can be reduced broadly. | 09-16-2010 |
| 20120164926 | GRINDING-SUPPORTING DEVICE - In a method and apparatus for multiple-bearing grinding of workpieces, such as crankshafts, wherein a support element seat occurs at a bearing point at the same time as the grinding of the main bearing a grinding-supporting unit is used that contains a grinding spindle head having at least one grinding disk and support elements in the form of support jaws or support bodies that can be swiveled in. After the support point seat is ground, the support elements are brought into contact therewith and support the workpiece during the further machining. The simultaneous grinding of the support point seat and several bearing points results in a reduction in the machining time in the grinding of the workpiece compared to the prior art. | 06-28-2012 |
| 451398000 | Rotary work holder | 28 |
| 20080299882 | RETAINER-RING OF CMP (CHEMICAL MECHANICAL POLISHING) MACHINE - A retainer ring is provided which may restrain the time taken for a break-in polish to a minimum. This retainer ring may be disposed inside of a holding head in a CMP apparatus which polishes a wafer chemically and mechanically; may have a ring shape so as to surround the periphery of the wafer; may press a polish surface of a polish pad; may be made of an engineering plastic material such as PPS; and may have a pressure surface for pressing the polish surface of the polish pad whose surface roughness is a center-line average roughness (Ra) of 0.2 μm or below. | 12-04-2008 |
| 20090036042 | METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE - Methods, systems and apparatus are provided for polishing an edge of a substrate. The invention includes an apparatus adapted to apply a preset pressure to a polishing film in contact with an edge of a substrate. The apparatus includes an actuator adapted to apply a preset pressure to the polishing film; and a controller coupled to the actuator and adapted to receive a signal indicative of a condition of the edge of the substrate, and to adjust a pressure applied by the actuator to the polishing film so as to maintain the preset pressure based on the received signal. Numerous other aspects are provided. | 02-05-2009 |
| 20090203300 | Carrier for holding an object to be polished - The present invention provides a diamond-like carbon coated carrier for holding an object to be polished used for double-sided polishing, and a manufacturing method therefor. The carrier for holding a workpiece according to the present invention has a substrate whose entire surface is coated with diamond-like carbon. The method of the present invention includes coating the entire carrier surface with diamond-like carbon using a surface coating apparatus using plasma CVD. | 08-13-2009 |
| 20100003907 | INCLINATION ANGLE ADJUSTING DEVICE AND WORKPIECE ATTACHING DEVICE - The present invention facilitates with high accuracy the adjustment of a minute angle degree, and also is capable of sufficiently securing the rigidity of the whole device after the adjustment and provides good operability, accuracy, and rigidity. Provided are a workpiece attaching body having a workpiece attaching surface and a rotating body rotatably supporting the workpiece attaching body. The rotating body has an inclination angle adjusting surface inclined relative to an axis of the rotating body, the workpiece attaching body has opposite to the workpiece attaching surface an inclination angle adjusting surface which is inclined relative to the workpiece attaching surface and which comes in surface contact with the inclination angle adjusting surface of the rotating body, and spherical coupling means is arranged which is for rotatably adjustably coupling the workpiece attaching body and the rotating body about a spherical center on an axis of the rotating body along both inclination angle adjusting surfaces. Thereby, the rotating body and the workpiece attaching body are relatively rotated about the spherical center along both inclination angle adjusting surfaces so as to adjust the inclination angle of the workpiece attaching surface. | 01-07-2010 |
| 20100003908 | INCLINATION ANGLE ADJUSTING DEVICE AND WORKPIECE ATTACHING DEVICE - To facilitate with high accuracy adjustment of a minute angle degree and also to sufficiently secure the rigidity of a whole device after the adjustment. Provided are a workpiece attaching body | 01-07-2010 |
| 20100041323 | CMP RETAINING RING - An improved chemical mechanical polishing retaining ring. A representative embodiment comprises a base portion made from a wear-resistant plastic material, and an upper portion, or backbone portion, made from a stiffer and more wear resistant material. One of the base or backbone portion is preferably overmolded onto the other. The base portion can be generally defined by a flat pad-contacting surface, an outer surface, and an inner surface. The base portion can additionally include channels extending from the outer surface to the inner surface to facilitate transfer of slurry to and from the substrate to be polished during the process. One or both of the base portion or backbone portion further includes a plurality of circular ribs that serve to create additional bonding surface with the overmolded material. The retaining ring may additionally includes a plurality of bosses with threaded insert holes by which the retaining ring is attached to a chemical mechanical polishing system. | 02-18-2010 |
| 20100056028 | SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS - The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion. | 03-04-2010 |
| 20100136892 | CARRIER HEAD WITH RETAINING RING AND CARRIER RING - A carrier head that has a housing, a base assembly, a retaining ring, a carrier ring, and a flexible membrane is described. The base assembly is vertically movable relative to the housing. The retaining ring is connected to and vertically movable relative to the base assembly and has a lower surface configured to contact a polishing pad and an inner surface configured to circumferentially surround the edge of a substrate to retain the substrate. The carrier ring is connected to and vertically fixed relative to the base assembly, circumferentially surrounds the retaining ring to prevent lateral motion of the retaining ring, and has a bottom surface configured to contact a polishing pad. | 06-03-2010 |
| 20100144255 | RETAINING RING AND ARTICLES FOR CARRIER HEAD - A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide. | 06-10-2010 |
| 20100240287 | Flexible Membrane for Carrier Head - A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. The flexible membrane has a main portion and an outer annular portion, wherein a junction between the main portion and the outer annular portion comprises a peripheral edge hinge and an annular recess above the hinge along the outer wall of the outer annular portion. | 09-23-2010 |
| 20100317266 | WORKPIECE HOLDER FOR A SURFACE GRINDING MACHINE - The present disclosure relates to a workpiece holder for a surface grinding machine, with a central workpiece holder shaft around which the workpiece holder can be driven in rotation, with at least one workpiece fixture to hold at least one workpiece, and with at least two holder parts movable relative to one another that jointly define the at least one workpiece fixture and that can be fixed relative to one another by means of a joining device. | 12-16-2010 |
| 20110045751 | CARRIER FILM FOR MOUNTING POLISHING WORKPIECE AND METHOD FOR MAKING THE SAME - The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate consists of first elastomer, the first elastomer comprising a plurality of first holes; wherein the first holes have a drop shape, and each of the first holes has an opening. The buffer substrate consists of second elastomer, the second elastomer comprising a plurality of second holes. The surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece. | 02-24-2011 |
| 20120184190 | DOUBLE-SIDE POLISHING APPARATUS - In the double-side polishing apparatus, one end part of a slurry supply hole has a female-tapered face whose inner diameter is gradually increased toward a polishing face of a polishing plate. A pad hole, which corresponds to the slurry supply hole, is formed in a polishing pad covering the slurry supply hole. An edge of the pad hole is located in the slurry supply hole. A fixation pipe, in which a flange section facing the female-tapered face is formed at one end part, is fixed in the slurry supply hole. The edge of the pad hole is sandwiched and held between the female-tapered face of the slurry supply hole and the flange section of the fixation pipe. | 07-19-2012 |
| 20120252327 | MACHINE FOR BLASTING ABRASIVES - The object of the present invention is to provide a machine for blasting abrasives that has a simple structure and that solves the problem of abrasives falling when the door for the gateway for the work is opened or closed. The machine for blasting abrasives comprises a chamber | 10-04-2012 |
| 20120289131 | CMP APPARATUS AND METHOD - A CMP apparatus includes an enclosure; a platen disposed within the enclosure, and a carrier for holding and rotating a wafer. The platen consists of a central, circular-shaped segment and a peripheral, annular-shaped segment with a gap formed therebetween. A first polishing pad is mounted on the central, circular-shaped segment. A second polishing pad is mounted on the peripheral, annular-shaped segment. In polishing, the carrier rotates between the first and second polishing pads, such that an annular edge region of the wafer is in direct contact with the second polishing pad. | 11-15-2012 |
| 20130165028 | RETAINING RING FOR CHEMICAL MECHANICAL POLISHING - An improved retaining ring used for chemical mechanical polishing of substrates, such as semiconductor wafers, to hold a substrate in place during the polishing process. The retaining rings are configured with inserts through which fasteners are positioned to securely affix the retaining ring to the polishing head. The inserts assist in dissipating the force of the fasteners, thereby allowing a more uniform polishing surface. The opening through which the fastener is positioned may be configured with concave or convex side walls to assist in dissipating the force of the fasteners during installation of the retaining ring or the polishing process. | 06-27-2013 |
| 20130196577 | METHODS AND APPARATUS FOR AN IMPROVED POLISHING HEAD RETAINING RING - Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed. | 08-01-2013 |
| 20130231031 | Stepped Retaining Ring - A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion. | 09-05-2013 |
| 20130252518 | POLISHING HEAD ZONE BOUNDARY SMOOTHING - A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. in one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly haying a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided. | 09-26-2013 |
| 20130260654 | CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING SYSTEM - Disclosed herein is a carrier head for a chemical mechanical polishing system. The carrier head for a chemical mechanical polishing system includes a base. A substrate receiving member having an outer surface against which a substrate can be mounted is connected to a lower part of the base. Inside of the substrate receiving member, at least two bladders are connected to the lower part of the base. The at least two bladders can apply pressure independently to predetermined areas of an inner surface of the substrate receiving member by expanding and contacting the inner surface. At least one wall structure is connected to the lower part of the base, wherein the at least one wall structure can limit lateral expansions of the at least two bladders. | 10-03-2013 |
| 20130316628 | FLEXIBLE MEMBRANES FOR A POLISHING HEAD - A flexible membrane for a polishing head includes a main part having a first surface configured to make contact with a surface of a substrate and a second surface opposite to the first surface, a plurality of extensions extending substantially perpendicularly from the second surface of the main part so as to define a plurality of independent spaces, respectively, and an inner ring coupled with an inner side of an outermost extension of the extensions to support an edge portion of the main part. A bottom surface of the inner ring is substantially flat. | 11-28-2013 |
| 20130324017 | TWO-PART RETAINING RING WITH INTERLOCK FEATURES - A retaining ring includes an annular lower portion and an annular upper portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, an inner rim projecting upward from the main body, an outer rim projecting upward from the main body and separated from the inner rim by a gap, and a plurality of azimuthally separated interlock features positioned between the inner rim and the outer rim, each interlock feature projecting upwardly from the main body. The annular upper portion has a top surface and a bottom surface and a plurality of azimuthally separated recesses in the bottom surface, the recesses defining thin portions of the upper portion, the plurality of interlock features fitting into the plurality of recesses. The lower portion is a plastic and the upper portion is a material that is more rigid than the plastic. | 12-05-2013 |
| 20140030967 | GRINDER/POLISHER - An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen. | 01-30-2014 |
| 20140287662 | RETAINING RING WITH ATTACHABLE SEGMENTS - A retaining ring includes a generally annular upper portion having a top surface configured to be connected to a base of a carrier head and a lower surface, and a plurality of substantially identical arcuate segments detachably secured to the upper portion to form an annular lower portion. Each of the arcuate segments has an upper surface that abuts the lower surface of the upper portion and a bottom surface for contacting a polishing pad during polishing. | 09-25-2014 |
| 20160101502 | CENTER FLEX SINGLE SIDE POLISHING HEAD HAVING RECESS AND CAP - A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive. | 04-14-2016 |
| 20160158909 | CHEMICAL MECHANICAL POLISHING FASTENING DEVICE - A chemical mechanical polishing fastening device includes an annular base and a fastening ring. The annular base has a first combining plane, a first inner annular plane, a first jointing plane, and a second inner annular plane. The diameter of the first inner annular plane is greater than that of the second inner annular plane. Two sides of the first inner annular base are connected to the first combining plane and the first jointing plane. Two sides of the first jointing plane are connected to the first inner annular plane and the second inner annular plane. The fastening ring has a second combining plane and an inner annular flange protruded from the second combining plane. The inner annular flange has an outer annular wall to be combined with the first inner annular plane and a top plane to be combined with the first jointing plane. | 06-09-2016 |
| 20160158910 | RETAINER RING FOR CHEMICAL-MECHANICAL POLISHING DEVICE - A retainer ring for a chemical-mechanical polishing device. The ring prevents damage that occur during polishing work and being usable in stable fashion up until a predetermined lifespan has elapsed, by ensuring that a first ring body mounted on the chemical-mechanical polishing device and a second ring body making contact with a polishing pad are firmly coupled together by means of securing bodies which pass through coupling holes in the first ring body and are coupled to recessed coupling parts in the second ring body, and also by means of adhesive parts which are provided in the coupling holes or the recessed coupling parts and adhere and secure the securing bodies. | 06-09-2016 |
| 20160176016 | COMPONENTS FOR A CHEMICAL MECHANICAL POLISHING TOOL | 06-23-2016 |
