| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 451331000 | WORK FEEDER | 8 |
| 20090068935 | POLISHING APPARATUS - A polishing apparatus has a top ring configured to hold a semiconductor wafer on a substrate holding surface, and a pushser configured to deliver the semiconductor wafer to the top ring and receive the semiconductor wafer from the top ring. The pushser includes a push stage having a substrate placement surface on which the semiconductor wafer is placed and an air cylinder configured to vertically move the push stage. The pushser also includes a high-pressure fluid port configured to eject a high-pressure fluid toward the semiconductor wafer. | 03-12-2009 |
| 20130102233 | APPARATUS FOR DEBURRING WORKPIECE - Disclosed is a deburring apparatus. The deburring apparatus includes a transfer module installed on a base to form a transfer path of transferring a workpiece to be deburred, a deburring module provided on the transfer path of the workpiece installed on the base to deburr the workpiece, and a blocking cover installed on the base to reciprocate thereon to selectively prevent the transfer module and the workpiece on the transfer module from being exposed to an outside, and to prevent dust and noise, which are produced when a deburring work is performed for the workpiece by using the deburring module, from being delivered to the outside. The burrs, which are produced when a metallic produce or a non-metallic produce having a 3-D shape is molded or cut, are easily and rapidly removed. | 04-25-2013 |
| 451332000 | Rotary | 2 |
| 20090186565 | SPOOL TO SPOOL CONTINUOUS THROUGH FEED SYSTEM - A grinding machine has a machine bed, a first spool and a second spool mounted on the machine bed. The spools are capable of storing stock to be ground and are rotatable in a coordinated manner. A grinding wheel is mounted on the machine bed. The first spool is capable of continuously unwrapping the stock, the second spool is capable of continuously wrapping the stock and the grinding wheel is adapted to grind the stock during its travel between the first spool and the second spool. The grinding machine can be used to continuously grinding a slender stock. The stock is continuously unwrapped from the first spool and continuously wrapped on the second spool. The stock is ground during its travel from first spool to the second spool. | 07-23-2009 |
| 20130109283 | DEBURRING MACHINE | 05-02-2013 |
| 451334000 | Reciprocating | 1 |
| 20130273819 | WAFER TRANSFER DEVICE FOR CHEMICAL MECHANICAL POLISHING APPARATUS - A wafer-transfer device for a chemical-mechanical polishing apparatus includes a base and lifting frame. A first cylinder is connected to a lower portion of the lifting frame to lift it and includes a piston rod passing through the lower portion of the lifting frame and fixed to the base. A basin-shaped contraposition ring is mounted onto an upper portion of the lifting frame via a spring. An inner edge of a top of the contraposition ring defines a curved surface adapted to a contour of a polishing head of the chemical-mechanical polishing apparatus. A wafer support is disposed above the contraposition ring. A second cylinder is mounted onto the contraposition ring and includes a piston rod passing through the contraposition ring and connected to a bottom of the wafer support to lift it. Respective axes of the wafer support, second cylinder, and contraposition ring coincide with one another. | 10-17-2013 |
| 451336000 | Endless | 1 |
| 20130260652 | BRUSH-TYPE DEBURRING MACHINE - The invention concerns a brush-type deburring machine for simultaneously deburring of an elongate profile section arranged in the longitudinal direction during conveying in a conveying direction with two rows, extending respectively in the conveying direction, of conveying discs arranged offset with respect to each other and having apertures arranged along the periphery thereof for receiving the opposite ends, which are arranged offset with respect to one another, in order to permit a transfer of the elongate profile sections in the conveying direction by rotation of the conveying discs, and the two rows are at a distance adjustable in the longitudinal direction from a minimum distance of less than 80 mm from each other, and with two rotatable brush rollers which are orientated in each case in the conveying direction along one of the two rows (and which are intended for the deburring of the two opposite ends of the conveyed elongate profile sections. | 10-03-2013 |
| 451339000 | Ejector or unloader | 2 |
| 20110177762 | WAFER UNLOADING SYSTEM AND WAFER PROCESSING EQUIPMENT INCLUDING THE SAME - A wafer unloading system and wafer processing equipment (system) including the same are disclosed. The wafer unloading system includes a fluid supply tube for supplying a fluid, a nozzle for injecting the supplied fluid, and an injection hole defined in a plate to allow the injected fluid to reach a space between a polishing pad and a wafer. | 07-21-2011 |
| 20150306723 | GRINDING MACHINE FOR BEARING RINGS AND METHOD FOR MOVING A BEARING RING IN SUCH A MACHINE - A grinding machine for bearing rings, the machine includes a frame, a rotating grinding wheel movable in rotation around a first rotation axis, and a working station where a bearing ring stands during a grinding operation of one of its surfaces. The grinding machine also includes a holding subsystem for holding a bearing ring in the working station and transfer subsystem for transferring bearing rings to and from the working station. The transfer subsystem includes at least a multi-axis robot and a ring moving arm provided with a gripping subsystem for temporarily gripping a bearing ring, the ring moving arm being rotatable around a second rotation axis, parallel to the first rotation axis, and movable in translation along the second rotation axis. | 10-29-2015 |
