| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 451283000 | Work rotating | 65 |
| 20090047880 | GRINDING MACHINE - A grinding machine enabling the easy maintenance and inspections of mechanisms arranged therein, an increase in visibility when the states of a workpiece and a grinding wheel are confirmed, and the easy loading/unloading of the workpiece and the easy replacement of the grinding wheel. The grinding machine comprises a workpiece supporting/driving device, a wheel work head, a wheel head feeder, a coolant supply unit, a cover covering internal devices such as the workpiece supporting/driving device, the wheel work head, the wheel head feeder, and the coolant supply unit, and an open/close door formed at a part of the working space side upper surface of the cover and allowing at least the loading/unloading of the workpiece and the replacement of the grinding wheel. | 02-19-2009 |
| 20100151773 | Tool for polishing and fine-grinding optically active surfaes in precision optics - A tool for polishing and fine-grinding optically active surfaces in precision optics has a main body which can be attached in a rotationally fixed manner to a tool spindle of a machining machine. A guide element is arranged concentrically in the main body and is mounted such that it can be displaced axially therein. A machining disk is replaceably attached to the outer end of the guide element. The main body is rigidly connected in a rotationally fixed manner, over the full displacement travel, to the guide element mounted such that it can be displaced axially therein, and in that the machining disk is rigidly fixed in a non-tiltable manner on the guide element. | 06-17-2010 |
| 20160184955 | WHEEL POLISHING APPARATUS - The present invention relates to a wheel polishing apparatus composed of a frame, motors, servo electric cylinders, a polishing head, guide rails and the like. A wheel is fixed onto the clamp on the platform, a motor I rotates the platform and the wheel via the main shaft, a motor II rotates the polishing head via the drive shaft; the canting servo electric cylinder can realize the relative movement of the polishing head along the contour line of the back cavity of the wheel via the canting guide rail, the horizontal servo electric cylinder can realize constant contact between the polishing head and the back cavity of the wheel via the horizontal guide rail. The invention can realize the function of automatically polishing the back cavity of the wheel, which has desirable effects and advanced process and high degree of automation, and is characterized by simple construction and low cost. | 06-30-2016 |
| 451284000 | Raceway | 1 |
| 20100323590 | GRINDING MACHINE FOR BEARING RINGS - A bearing ring grinding machine having a grinding unit arranged to machine the bearings with micron-size tolerances and reduce a grinding cycle period. The grinding unit includes a fixed plate which supports a horizontally movable loader and sliding carriage. A carriage stopper, in the loader, holds the ring against the plate and between two lateral channels. The fixed plate has an opening for passage of a rotatable spindle, equipped with a magnetizable bush, to support the ring during machining and support stops for automatically positioning the ring on the bush. Initially, the carriage releases a ring to be ground which then passes toward the bush. The ring is then secured, machined, carried by a magnetic carrier of an automatic discharge device. | 12-23-2010 |
| 451285000 | Rotary work holder | 61 |
| 20080261497 | Retainer Ring For Cmp Device - A two-layer structure retainer ring is capable of giving a uniform pressing force while uniting a first ring and a second ring more securely. A first ring | 10-23-2008 |
| 20080287043 | Polishing apparatus - A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring configured to hold and press the substrate against the polishing surface, a top ring shaft configured to lift and lower the top ring, and an elongation detecting device configured to detect an elongation of the top ring shaft. The polishing apparatus further includes a controller configured to set a vertical position of the top ring at the time of polishing, and control a lifting and lowering mechanism to lower the top ring to a preset polishing position as the set vertical position. The controller corrects the preset polishing position based on the elongation of the top ring shaft which has been detected by the elongation detecting device. | 11-20-2008 |
| 20080293339 | Retainer Ring - A retainer ring and a method of using the retainer ring are provided. The retainer ring has openings along a bottom surface. Grooves encompass the openings and extend to an interior portion of the retainer ring wherein a semiconductor wafer may be held. In operation, a semiconductor wafer is placed inside the retainer ring. As the retainer ring and the semiconductor wafer are moved relative to an underlying polishing pad, slurry is dispensed through the openings in the retainer ring. The grooves in the retainer ring allow the slurry to flow from the openings to the interior portion of the retainer ring and the semiconductor wafer. | 11-27-2008 |
| 20080293340 | METHODS AND APPARATUS FOR REMOVAL OF FILMS AND FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING PADS - Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided. | 11-27-2008 |
| 20080293341 | METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING - An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided. | 11-27-2008 |
| 20080305725 | Chemical mechanical polish system having multiple slurry-dispensing systems - A chemical mechanical polish system includes a polishing pad, a platen supporting and rotating the polishing pad, a top slurry dispenser placed over a polishing pad, a bottom slurry dispenser placed through an opening in the polishing pad, and a duct connected to the bottom slurry dispenser, the duct extending toward the bottom of the polishing pad. | 12-11-2008 |
| 20090042493 | CHAMFERING APPARATUS FOR CHAMFERING GLASS SUBSTRATES - A chamfering apparatus is used to chamfer a peripheral edge of a glass substrate. The chamfering apparatus includes a grindstone having a cylindrical hollow end portion; a grindstone driving unit that rotates the grindstone around an axis of the cylindrical hollow end portion; a substrate rotation-driving unit that rotates the glass substrate around either one of an axis of the outer periphery and an axis of the center circular hole; and a pressing unit that presses the grindstone to the glass substrate such that an annular end surface of the grindstone contacts with an edge of either one of the outer periphery and the inner periphery of the glass substrate while the cylindrical hollow end portion of the grindstone faces with one of the outer periphery and the inner periphery of the glass substrate. | 02-12-2009 |
| 20090176445 | Flexible Membrane Assembly for a CMP System - A flexible membrane assembly for a wafer carrier in a CMP system. The flexible membrane assemble has a flat, flexible membrane joined to a rigid cylindrical sidewall. | 07-09-2009 |
| 20100323591 | SELF-ALIGNING ROTARY BLADE HOLDER FOR SHARPENER - A universal blade sharpening machine is operable to securely hold and sharpen any one of multiple variously sized circular blades. The machine includes a blade-sharpening drive with an adjustable blade sharpener and also includes a universal blade holder that is rotatably powered by the drive. The blade holder includes a blade-receiving chassis that holds the blade during sharpening and is rotatable about a rotation axis of the blade holder. The chassis includes a plurality of radially spaced blade-retaining sections each associated with a respective one of the circular blades. | 12-23-2010 |
| 20110009037 | POLISHING APPARATUS - A polishing apparatus for polishing an end edge of a work piece by bringing a bristle tip of a polishing brush into contact with the end edge of the work piece as the bristle tip passes the end edge of the work piece includes a support plate having a through hole into which the polishing brush is inserted and a suppression portion that is provided at the support plate and suppresses a deformation of the bristle tip of the polishing brush when the work piece is polished. | 01-13-2011 |
| 20170232574 | CHEMICAL-MECHANICAL WAFER POLISHING DEVICE | 08-17-2017 |
| 451286000 | By means loosely confining work | 4 |
| 20100062694 | CARRIER HEAD USING FLEXURE RESTRAINTS FOR RETAINING RING ALIGNMENT - One embodiment provides a retaining ring assembly. The retaining ring assembly comprises a retaining ring configured to circumferentially surround and retain the substrate within an inner surface of the retaining ring, and a flexure coupled to the retaining ring. The flexure is configured to maintain a gap between an inner surface of a carrier ring and an outer surface of the retaining ring, and the carrier ring is circumferentially surrounding the retaining ring. | 03-11-2010 |
| 20110151755 | CMP RETAINING RING - An improved chemical mechanical polishing retaining ring. A representative embodiment comprises a base portion made from a wear-resistant plastic material, and an upper portion, or backbone portion, made from a stiffer and more wear resistant material. One of the base or backbone portion is preferably overmolded onto the other. The base portion can be generally defined by a flat pad-contacting surface, an outer surface, and an inner surface. The base portion can additionally include channels extending from the outer surface to the inner surface to facilitate transfer of slurry to and from the substrate to be polished during the process. One or both of the base portion or backbone portion further includes a plurality of circular ribs that serve to create additional bonding surface with the overmolded material. The retaining ring may additionally includes a plurality of bosses with threaded insert holes by which the retaining ring is attached to a chemical mechanical polishing system. | 06-23-2011 |
| 20140242886 | POLISHING HEAD IN CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME - A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including a pressing portion to adsorb and press a substrate, a first partition on the pressing portion and extending from an edge of the pressing portion along a height direction, a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, and a second horizontal extending portion from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion expanding by pneumatic pressure. | 08-28-2014 |
| 20150017890 | POLISHING HEAD AND POLISHING APPARATUS - The present invention provides a polishing head including: an annular rigid ring; an elastic film bonded to the rigid ring; and an upward and downward movable mid-plate, the mid-plate defining a first sealed space together with the rigid ring and the elastic film; an incompressible fluid enclosed in a sealed space; and a mid-plate positioning device for adjusting vertical position of the mid-plate, to hold a back surface of a workpiece on a lower surface of the elastic film and polish a front surface by bringing the front surface into contact with a polishing pad attached to a turn table, wherein the mid-plate can adjust a shape of the lower surface of the elastic film by adjusting the vertical position of the mid-plate. The polishing head polishes a workpiece without generating surface defects on the workpiece surface and easy detachment of the workpiece from a polishing pad after polishing. | 01-15-2015 |
| 451287000 | Planar surface abrading | 42 |
| 20080242202 | EXTENDED PAD LIFE FOR ECMP AND BARRIER REMOVAL - A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polishing process by removing conductive and dielectric material from a substrate while minimizing downtime of the polishing tool. In some embodiments, the polishing article may be a dielectric material or a conductive material and is configured to include a longer usable lifetime to minimize replacement and downtime of the tool. | 10-02-2008 |
| 20090036041 | CMP PAD DRESSER AND CMP APPARATUS USING THE SAME - A CMP pad dresser for dressing a polishing pad of a CMP apparatus is provided with a dressing pad having abrasive grains, a purified water supply unit provided to an external periphery of the dressing pad, and a drive mechanism for sliding the dressing pad in a radial direction of the polishing pad. The dressing pad is slidable to the outer side of the polishing pad. The purified water supply unit supply purified water at a prescribed pressure so that particles of abrasive grains that are dislodged from the dresser accumulate in the dressing pad. | 02-05-2009 |
| 20090061743 | METHOD OF SOFT PAD PREPARATION TO REDUCE REMOVAL RATE RAMP-UP EFFECT AND TO STABILIZE DEFECT RATE - A method and apparatus for pre-conditioning a new soft polishing pad and processing a substrate on a soft polishing pad is described. The method includes coupling a soft polishing pad to a platen, contacting the processing surface of the soft polishing pad with a conditioning disk, applying a pressure conditioning disk, removing the conditioning disk from contact with the processing surface of the soft polishing pad, and contacting a first substrate with the processing surface of the soft polishing pad to perform a polishing process on the first substrate. | 03-05-2009 |
| 20090068933 | System and Method for Directional Grinding on Backside of a Semiconductor Wafer - A backside grinding apparatus removes semiconductor material from a surface of a semiconductor wafer. The wafer is mounted to a backing plate. The backside surface undergoes a first grinding operation in a rotational motion to remove excess semiconductor material. The semiconductor wafer is then aligned such that edges of the die are oriented along a reference line. The backside surface undergoes a second grinding operation in a linear direction on a 45-diagonal with respect to the reference line to create linear grind marks which are diagonal to the edges of the die. The linear grind marks are formed by an abrasive surface having at least 4000 mesh count. The second grinding operation removes the radial grind marks produced by the first grinding operation. The linear grind marks oriented diagonal with respect to the reference line increases the strength of the die to resist cracking. | 03-12-2009 |
| 20090247057 | Polishing platen and polishing apparatus - The present invention provides a polishing platen which does not require a large force for removing a polishing pad from an upper surface of the polishing platen and can thus make it relatively easy to remove the polishing pad therefrom. The present invention also provides a polishing apparatus having such polishing platen. The polishing platen ( | 10-01-2009 |
| 20090291623 | Polishing head and polishing apparatus - The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the template is 26% or more and 45% or less. Thereby, a polishing head and the like that can obtain constant flatness stably can be provided. | 11-26-2009 |
| 20100099339 | POLISHING PAD EDGE EXTENSION - A method and apparatus for providing a substantially uniform pressure to a polishing surface from a conditioning element is provided. The method includes urging a conditioning disk against a polishing surface of a rotating polishing pad, moving the conditioning disk across the polishing surface in a sweep pattern that includes at least a portion of the conditioning disk extending over a peripheral edge of the polishing surface, and maintaining a substantially uniform pressure to the polishing surface from the conditioning disk across the sweep pattern. | 04-22-2010 |
| 20100099340 | TEXTURED PLATEN - Embodiments described herein generally relate to the planarization of substrates. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus comprises a rotatable platen having a textured upper surface, at least one groove formed in the upper surface, and a pad disposed on the textured upper surface and bridging the at least one groove. | 04-22-2010 |
| 20100216378 | CHEMICAL MECHANICAL POLISHING APPARATUS - Provided is a chemical mechanical polishing (CMP) apparatus. The CMP apparatus may include a polishing pad including a plurality of concave regions. These concave regions may be two-dimensionally arranged in the polishing pad in a first direction and a second direction that are not perpendicular to each other and not parallel to each other. The concave regions arranged in the first direction may have a first pitch, and the concave regions arranged in the second direction may have a second pitch equal to the first pitch. | 08-26-2010 |
| 20120149286 | WAFER POLISHING APPARATUS AND METHOD - A wafer polishing apparatus includes a rotatable turntable for holding a polishing pad and at least one rotatable polishing head adapted for attachment of at least one wafer alignment assembly. A wafer alignment assembly includes an upper plate and a lower plate connected by three lever assemblies symmetrically positioned about a wafer alignment assembly axis of rotation. Each of the lever assemblies comprises a spherical joint, an elongated cylindrical hinge, and a kinematic axis which intersects a center of rotation for the spherical hinge, an axis of rotation for the elongated cylindrical hinge, and a gimbal point about which a wafer may tilt during polishing. The gimbal point may be positioned above, coincident with, or below a working surface of a polishing pad by adjustment of the lever assemblies. Some embodiments of the invention comprise steps in a method for polishing a wafer in a wafer polishing apparatus. | 06-14-2012 |
| 20140094098 | POLISHING APPARATUS - To provide a polishing apparatus capable of more accurately determining a polishing end point. The polishing apparatus includes a turntable | 04-03-2014 |
| 20150050866 | POLISHING PAD, POLISHING APPARATUS AND METHOD FOR MANUFACTURING POLISHING PAD - The present invention relates to a polishing pad comprising a foaming resin frame and a plurality of auxiliary fiber filaments, and each of the auxiliary fiber filaments is independent and dispersed randomly in the foaming resin frame. The invention also relates to a polishing apparatus and a method for manufacturing the polishing pad. | 02-19-2015 |
| 20150093971 | POLISHING APPARATUS AND METHOD - A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector. | 04-02-2015 |
| 20150118944 | POLISHING APPARATUS, METHOD FOR ATTACHING POLISHING PAD, AND METHOD FOR REPLACING POLISHING PAD - The work of replacing a polishing pad is easily performed, and thermal damage is prevented from occurring in a polishing table. A polishing apparatus | 04-30-2015 |
| 20160059376 | BUFFING APPARATUS, AND SUBSTRATE PROCESSING APPARATUS - A buffing module for buffing a substrate is provided. The buffing module comprises a buff table for supporting the substrate, the buff table being rotatable; and a buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table. The buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other. | 03-03-2016 |
| 20160151879 | RETAINING RING HAVING INNER SURFACES WITH FACETS | 06-02-2016 |
| 20160193712 | POLISHING HEAD AND POLISHING PROCESSING DEVICE | 07-07-2016 |
| 451288000 | Having pressure plate | 25 |
| 20080254720 | Polishing Head, Polishing Apparatus and Polishing Method for Semiconductor Wafer - The present invention provides a polishing head | 10-16-2008 |
| 20080293342 | CMP HEAD AND METHOD OF MAKING THE SAME - A CMP head includes a membrane support and a membrane. The membrane support is disk-shaped, having an origin and a radius R. The membrane support has at least a ventilator disposed in a central region within the range between origin and (2/3) R, and at least a diversion opening disposed in a peripheral region within the range between (2/3) R and R. The membrane includes a disk-shaped part disposed on the first surface of the membrane support, and an annular part surrounding the annular sidewall of the membrane support. | 11-27-2008 |
| 20080299878 | SYSTEMS AND METHODS FOR REDUCING ELECTROSTATIC CHARGE OF SEMICONDUCTOR WAFERS - A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and configured to carry a semiconductor wafer, and a transfer station proximate to the polishing pad for holding the wafer during loading and/or unloading. At least one of the wafer carrier and the transfer station is configured to dissipate electrostatic charge from the wafer. | 12-04-2008 |
| 20080318499 | Substrate holding apparatus, polishing apparatus, and polishing method - A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member. | 12-25-2008 |
| 20090011690 | Polishing apparatus and polishing method - A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing mechanism for pressing, against the first polishing surface, the surface of the substrate which has been brought into contact with the first polishing surface by the substrate carrier, a retainer ring mounted on the substrate carrier so as to surround the substrate which has been pressed against the first polishing surface by the pressing mechanism, and a retainer-ring-position-adjustment mechanism for adjustably positioning the retainer ring relative to the substrate, which has been pressed against the first polishing surface, in directions toward and away from the first polishing surface. | 01-08-2009 |
| 20090023368 | POLISHING HEAD AND EDGE CONTROL RING THEREOF, AND METHOD OF INCREASING POLISHING RATE AT WAFER EDGE - A polishing head used for CMP is described, including a retaining ring that is for engaging with a wafer, a membrane and an edge control ring. The membrane includes a bottom part for engaging with the wafer, and a lip part contiguous with the bottom part. The edge control ring is disposed between the retaining ring and the membrane, including a bottom part that has an abutting surface. The abutting surface of the edge control ring contacts with the external surface of the lip part of the membrane when the membrane is not inflated. | 01-22-2009 |
| 20090061744 | POLISHING PAD AND METHOD OF USE - A polishing pad has one or more polishing elements made from a hydrogel material having an intrinsic ability to absorb water. The hydrogel material may or may not have micropores, but has a water absorption capability of 4%-60% by weight, a wet tensile strength greater than 1000 psi, a flexural modulus greater than 2000 psi, and a wet Shore D hardness between 25-80, inclusive. The hydrogel material may be made from one or a combination of the following moieties: urethane, alkylene oxides, esters, ethers, acrylic acids, acrylamides, amides, imides, vinylalcohols, vinylacetates, acrylates, methacrylates, sulfones, urethanes, vinylchlorides, etheretherketones, and/or carbonates. | 03-05-2009 |
| 20090068934 | Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same - A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions. | 03-12-2009 |
| 20090149118 | Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method - A silicon wafer grinding apparatus, a retaining assembly used for the same, and a silicon wafer flatness correcting method are provided. | 06-11-2009 |
| 20090233532 | Substrate holding apparatus and polishing apparatus - A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically. | 09-17-2009 |
| 20090264054 | POLISHING MACHINE, WORKPIECE SUPPORTING TABLE PAD, POLISHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the pedestal pad which comes into contact with the wafer is non-absorbable to a fluid. The tissue of the pedestal pad is dense and smooth, and does not have any cavity, such as fine holes, which holds the fluid. | 10-22-2009 |
| 20090291624 | SUBSTRATE POLISHING APPARATUS AND METHOD - A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished. | 11-26-2009 |
| 20100197207 | CHEMICAL MECHANICAL POLISHING APPARATUS - A chemical mechanical polishing apparatus includes a container, a platen, first and second brushes, a polishing pad, a carrier, and a slurry supplier. The container has a bottom wall and a side wall. The side wall has an inwardly-extending upper portion. The platen is supported over the bottom wall. The platen is positioned lower than the inwardly-extending upper portion. The first brush brushes the side wall. The first brush is fixed to a side surface of the platen. The second brush brushes a side surface of the platen. The second brush is fixed to the bottom wall. The polishing pad is attached to the platen. The carrier presses a workpiece to be polished against the polishing pad. The slurry supplier supplies a slurry onto the polishing pad. | 08-05-2010 |
| 20100273404 | Polishing Pad and Polishing Device - A polishing pad used in semiconductor polishing process is provided in the present invention and a pressure sensitive adhesive is used to couple the polishing pad. The polishing pad includes a substrate, and the substrate includes a polishing surface and a reverse surface corresponding to the polishing surface. The polishing pad is characterized by: a pressure sensitive adhesive formed on the reverse surface of the substrate and used to couple with a bottom layer, and the horizontal adhesion of the pressure sensitive adhesive is higher than the vertical adhesion of the pressure sensitive adhesive. | 10-28-2010 |
| 20100273405 | POLISHING APPARATUS - A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table ( | 10-28-2010 |
| 20100291842 | POLISHING HEAD ZONE BOUNDARY SMOOTHING - A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided. | 11-18-2010 |
| 20110053474 | POLISHING APPARATUS - The polishing apparatus is capable of improving accuracy of polishing a work. The work is pressed onto a polishing cloth, with an elastic sheet, by a pressing force generated by second pressing means and applied to a carrier and inner pressure of a first fluid chamber generated by a fluid supplied thereto, so as to polish the work. The fluid, which has been downwardly supplied into the first fluid chamber, horizontally flows outward in the first fluid chamber, collides with a side wall of a concave part of a board-shaped member and flows upward, and then the fluid is discharged outside from a fluid outlet, thereby a fluid feeding member follows movement of the elastic sheet and maintains parallel to the elastic sheet, and the fluid feeding member is centered in the first fluid chamber. | 03-03-2011 |
| 20120289129 | POLISHING HEAD AND POLISHING APPARATUS - A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more. | 11-15-2012 |
| 20120309275 | MEMBRANE ASSEMBLY AND CARRIER HEAD HAVING THE MEMBRANE ASSEMBLY - Provided is a membrane assembly of a carrier head in a chemical-mechanical polishing apparatus. The membrane assembly includes a main membrane and a circular ring. The main membrane has a wafer contacting surface in contact with a wafer while a chemical-mechanical polishing process is being performed. The circular ring is disposed at an edge portion of the main membrane and receives an air pressure to downwardly apply the air pressure to the main membrane at the edge portion. | 12-06-2012 |
| 20140113531 | POLISHING HEAD AND POLISHING APPARATUS - A polishing head comprising an annular rigid ring; a rubber film attached to the rigid ring by using uniform tensile force; a back plate that is connected to the rigid ring and forms a space portion with the rubber film and the rigid ring; and an annular template that is provided at a peripheral portion of a lower surface portion of the rubber film concentrically with the rigid ring and configured to hold an edge portion of a workpiece, the polishing head holding a back surface of the workpiece on the lower surface portion of the rubber film and sliding a front surface of the workpiece on a polishing pad attached to a turn table to perform polishing. The polishing head and the polishing apparatus can be used for final polishing and uniformly polish the entire front surface regardless of the thickness of the template. | 04-24-2014 |
| 20140154958 | WAFER POLISHING APPARATUS - The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone. | 06-05-2014 |
| 20140357164 | POLISHING APPARATUS - A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position. | 12-04-2014 |
| 20150328743 | POLISHING APPARATUS - A polishing apparatus capable of preventing wear of rollers which are to transmit a load to a retainer ring and capable of preventing wear particles from escaping outside is disclosed. The polishing apparatus includes: a retainer ring disposed so as to surround the substrate and configured to press the polishing surface while rotating together with a head body; a rotary ring secured to the retainer ring and configured to rotate together with the retainer ring; a stationary ring disposed on the rotary ring; and a local-load exerting device configured to apply a local load to a part of the retainer ring through the rotary ring and the stationary ring. The rotary ring has rollers which are in contact with the stationary ring. | 11-19-2015 |
| 20160082569 | RETAINER AND WAFER CARRIER INCLUDING THE SAME - A retainer for a wafer carrier comprising: a body including a plurality of slots configured to receive side surfaces of wafers; and for each of the slots, a supporting structure formed on a sidewall of the slot and configured to make contact with the side surfaces of a corresponding wafer, the supporting structure being spaced apart from an upper corner of the side surface of the corresponding wafer. | 03-24-2016 |
| 20160176011 | METHOD AND APPARATUS FOR POLISHING A SUBSTRATE | 06-23-2016 |
| 451289000 | Having vacuum or adhesive securing means | 3 |
| 20080299879 | POLISHING PAD, THE USE THEREOF AND THE METHOD FOR MANUFACTURING THE SAME - The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head. | 12-04-2008 |
| 20090061745 | POLISHING HEAD USING ZONE CONTROL - A polishing head for a chemical mechanical polishing apparatus is provided which includes at least two polishing head zones configured to provide different temperatures for transferring heat to at least two zones of a substrate corresponding to the at least two polishing head zones. The present disclosure addresses chemical mechanical polishing which allows a control of the polishing profile even if slurries are used, which show almost no dependency between polishing rate and down force. | 03-05-2009 |
| 20090258583 | DEVICE AND PROCESS FOR APPLYING AND/OR DETACHING A WAFER TO/FROM A CARRIER - The invention relates to a device for applying and/or detaching a wafer to/from a carrier with
| 10-15-2009 |
| 451291000 | Planetary | 1 |
| 20090047881 | COMBINATORIAL PROCESSING INCLUDING ROTATION AND MOVEMENT WITHIN A REGION - Combinatorial processing including rotation and movement within a region is described, including defining multiple regions of at least one substrate, processing the multiple regions of the at least one substrate in a combinatorial manner, rotating a head in one of the multiple regions to perform the processing, and repositioning the head relative to the one of the multiple regions while rotating the head during the processing. | 02-19-2009 |
