Class / Patent application number | Description | Number of patent applications / Date published |
451065000 | Combined | 82 |
20080214095 | Cutting Tool Sharpener - A tool sharpening assembly ( | 09-04-2008 |
20080274675 | MULTIPURPOSE BENCH GRINDER WITH LEFT AND RIGHT GRINDER ASSEMBLIES - A multipurpose bench grinder ( | 11-06-2008 |
20100093264 | Grinding apparatus having an extendable wheel mount - A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel. | 04-15-2010 |
20100112913 | FINISHING MACHINE WITH STONE ROTATING UNIT - A finishing machine with at least two finishing stones and a stone turning unit is proposed, in which the stone turning unit may be coupled to a rotary drive of the workpiece holder. A separate drive for the stone turning unit may thus be omitted, which results in a reduced weight of the stone turning unit and therefore lower drive power requirement of the stone turning unit and an improved processing quality. | 05-06-2010 |
20100120338 | PAPER FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A paper feeding apparatus includes a rack that stores sheets in a vertically placed state, a first conveying roller that conveys a sheet extracted from the rack in a first direction in an erected state, a scraper that scrapes a surface of the sheet conveyed in the erected state by the first conveying roller, and a second conveying roller that conveys the sheet, the surface of which is scraped by the scraper, in a second direction different from the first direction. | 05-13-2010 |
20100144249 | POLISHING APPARATUS - Provided is a polishing apparatus comprising a lower stool ( | 06-10-2010 |
20110045748 | DOUBLE SIDE POLISHING APPARATUS AND CARRIER THEREFOR - A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers. | 02-24-2011 |
20110104997 | APPARATUSES AND METHODS FOR POLISHING AND CLEANING SEMICONDUCTOR WAFERS - Wafer processing apparatuses and methods for polishing and cleaning semiconductor wafers with high productivity, small footprint, easy maintenance and low defectivity are provided. The apparatuses comprise a polishing apparatus and a cleaning apparatus. The polishing apparatus comprises at least one polishing module. Each module comprises at least one polishing surface, at least one polishing head, at least one wafer transfer station and a transport mechanism to transfer the at least one polishing head between the at least one polishing surface and the at least one wafer transfer station. The polishing module may comprise a shield member and fluid injection devices to protect the at least one polishing surface from foreign particles. The cleaning apparatus can comprise two or more dry chambers for high productivity. The wafer processing apparatuses can comprise two cleaning apparatuses for high productivity. | 05-05-2011 |
20110318998 | POLISHING DEVICE - A polishing device includes an outer barrel, an inner barrel, polishing members, and an actuator. The outer barrel defines a chamber and includes inner surfaces substantially parallel to a central axis of the outer barrel. Each of the inner surfaces defines a holding groove for holding a workpiece. The inner barrel is received in the chamber and includes a side surface substantially parallel to the central axis. The side surface defines installation grooves. Each polishing member includes an elastic piece, a polishing motor connected to a bottom of a corresponding installation groove by the elastic piece and received in the corresponding installation groove, and a polishing plate connected to the polishing motor and capable of being driven to rotate by the polishing motor. The actuator is configured for driving the outer barrel to spin and move back and forth along the central axis. | 12-29-2011 |
20120015590 | Knife sharpener - An electric sharpener includes a body having a reception area for receiving a driving device, and a sharpening area in which a gear set is located which is connected with the driving device. A shaft is located in the sharpening area and connected to the gear set. A rough sharpening set connected to the shaft and has a first spring unit. A fine sharpening set is connected to the shaft and has a second spring unit. The first and second spring sets have different spring forces applied to the rough sharpening set and the fine sharpening set. | 01-19-2012 |
20120021678 | CYLINDRICAL GRINDING AND POLISHING DEVICE - A cylindrical grinding and polishing device includes a main body defining a cavity, a polishing device, a cylindrical grinding device, a support device. The polishing device is received in the cavity, and includes a number of polishing wheels positioned along a first direction. The cylindrical grinding device is received in the cavity, and includes a grinding wheel positioned at an end of the cavity along a second direction substantially perpendicular to the first direction. The support device is received in the cavity, and includes a support plate for supporting a work-piece. The support device carries the work-piece to contact the polishing wheels or the grinding wheel. | 01-26-2012 |
20140080384 | EDGE-GRINDING MACHINE FOR LIQUID CRYSTAL PANEL - The present disclosure provides an edge-grinding machine used for grinding a liquid crystal panel. The edge-grinding machine includes a chamfering grinding wheel assembly corresponding to a cutting edge of the liquid crystal panel for chamfering the cutting edge and further removing a sharp portion of the cutting edge; and a reshaping grinding wheel assembly corresponding to a complete cutting surface of the liquid crystal panel for reshaping the complete cutting surface and further removing a step and unwanted objects on the complete cutting surface. The edge-grinding machine of the present disclosure is capable of chamfering the corresponding cutting edge of the liquid crystal panel while reshaping the complete cutting surface for removing the step and unwanted objects thereon, which saves resources and labors required to reshape the liquid crystal panel and thus improves the yield rate of the liquid crystal panel. | 03-20-2014 |
20150038060 | GRINDING WORKBENCH WITH IMPROVED STRUCTURE - The present invention is primarily assembled from a main body, a lifting device, a control switch, a grinding device, a nozzle apparatus, and a dust collecting device. The main body includes a first casing, and a second casing disposed within the first casing. The lifting device enables raising and lowering of the first casing relative to the second casing for adjustment to a suitable height. An operating area at the top of the first casing is equipped with the control switch. The nozzle apparatus includes an air compressor, a dryer, a sand storage tank, and a nozzle, which facilitate the user in operational use, and enable powerful collection of dust. In particular, during the sand blasting process, the present invention enables optimum handling of environmental dust pollution. | 02-05-2015 |
451066000 | Scouring or polishing means | 8 |
20090011684 | Polishing Machine Comprising a Work Chamber and a Platform - A polishing machine for optical elements, comprising:—a spindle arranged to rotationally drive an optical element;—a polishing tool mobile relative to the spindle; wherein the polishing machine further comprises a platform mounted on top of a work chamber, the work chamber comprising the spindle, and the platform holding a body on which is mounted the polishing tool. | 01-08-2009 |
20090098809 | BOWLING BALL SURFACE TREATMENT DEVICE - A bowling ball surface treatment device for abrading, polishing or cleansing a bowling ball includes a housing, a ball displacing unit movably mounted to the housing for holding the bowling ball in a rotatable manner and for reciprocatingly displacing the bowling ball between a temporary waiting region and a surface treatment region, a surface treatment disc for supporting and spinning the bowling ball in the surface treatment region, the surface treatment disc having a surface treatment element for making frictional contact with the bowling ball, a temporary support disc for temporarily supporting the bowling ball in the temporary waiting region when the bowling ball is moved out of the surface treatment region, and a disc drive unit for rotatingly driving the surface treatment disc and the temporary support disc. | 04-16-2009 |
20090137192 | MULTI-ZONE PRESSURE CONTROL SYSTEM - A pressure control system that controls the pressure of a fluid in a plurality of zones includes a distribution manifold, at least one main manifold connected to the distribution manifold, and at least one disposable manifold connected to the distribution manifold and the main manifold. The disposable manifold is adapted to be replaced independent of the distribution manifold and the main manifold, and is connected to each zone and to at least one vacuum source. The distribution manifold distributes the fluid to the plurality of zones, so as to cause flow of the fluid into and out of a measurement chamber located within each zone. The main manifold includes, for each zone, a pressure sensor configured to measure pressure in the measurement chamber in that zone, and a control valve configured to regulate the flow of the fluid through that zone. | 05-28-2009 |
20090233531 | Blasting device for steel pipe inner surface, blasting method for steel pipe inner surface, and method for producing steel pipe with excellent inner surface texture - [Problem] To provide a blasting device for steel pipe inner surface with improved blast performance as well as the capability to sufficiently blast the inner surface of the steel pipe from the beginning portion to the end portion; a blasting method for steel pipe inner surface; and a method for producing a steel pipe with excellent inner surface texture. | 09-17-2009 |
20100105297 | POLISHING APPARATUS - A polishing apparatus includes a cyclic mechanism moving cyclically in a certain direction, a holder moving cyclically by the cyclic mechanism in a direction parallel to an object to be polished, a plurality of polishing pins held on the holder, a magnet member including a first part which is exposed on a front face side of the polishing pin and a second part which is not exposed on the front face side of the polishing pin, a part of the second part being covered with a non-magnetic material, and a polishing member held on the polishing pin by magnetic force of the magnet member and polishing a tip of the object to be polished by the cyclic motion of the cyclic mechanism, wherein a contact area of the polishing member and the polishing pin includes a contact area of the magnet member and the polishing member. | 04-29-2010 |
20120220201 | Core Cleaning Apparatus - Apparatus for removing remnants of debris from the exterior surface of cores includes an assembly moveable from a position spaced from the exterior surface of the cores to a position adjacent the exterior surface. One or more abrasion belts are looped around rotatable shafts which move the belts to abrade the exterior surface of the cores. | 08-30-2012 |
20140051338 | Knife Sharpening System - A knife sharpening system mountable in a small vehicle is disclosed. The knife sharpening system includes a grinding device including a motor, and an abrasive member directly connected to the motor without using a reduction device, to reduce loss of power transmitted from a battery to the abrasive member, and a water-proof device for preventing scattering of water and dust caused by rapid rotation of the abrasive member. The abrasive member can rotate using small force in accordance with direct connection of the abrasive member to the motor. Even when the abrasive member rotates at high speed, scattering of water or dust is prevented in accordance with direct connection of the abrasive member to the motor. Accordingly, the abrasive member can be driven using a battery of a small vehicle. | 02-20-2014 |
20160136775 | SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CLEANING METHOD - A substrate cleaning apparatus capable of removing fine particles from a substrate, such as a wafer, without using a chemical liquid is disclosed. The substrate cleaning apparatus includes: a substrate supporting structure for supporting the substrate; a vibration device secured to the substrate supporting structure; a vibration controller configured to cause the vibration device to vibrate at a natural frequency of the substrate; and a cleaning liquid supply nozzle configured to supply a cleaning liquid onto the substrate. | 05-19-2016 |
451067000 | With nonabrading means | 61 |
20090011685 | Polishing Machine Comprising Sliding Means Transverse to the Front Face - A polishing machine for optical elements includes: —a spindle arranged to rotationally drive an optical element; —a polishing tool mobile relative to the spindle; —a front face provided with a door enabling the access to the spindle and to the polishing tool. The polishing tool is mounted on a body which is rotationally mounted on sliding members by way of a first axis, the sliding members being substantially perpendicular to the front face. | 01-08-2009 |
20090280728 | HAND-GUIDED MACHINE TOOL - A hand-held machine tool has an electric drive motor ( | 11-12-2009 |
20090311950 | DEVICE FOR RESTORING LIGHT PERMEABILITY OF MOTOR VEHICLE HEADLIGHT LENSES - A device for restoring a light permeability of headlight lenses of motor vehicles has a holder, a working layer attached to the holder and adapted to clean and polish a surface of a headlight lense when the device is moved relative to the latter, and a sponge-like element located between the holder and the working layer and formed so that it applies an elastic biasing action to the working layer to provide a cleaning and polishing action by the working layer and at the same time to absorb a liquid required for the cleaning and polishing action. | 12-17-2009 |
20100087125 | POLISHING TOOL AND POLISHING DEVICE - A grinding machine ( | 04-08-2010 |
20100197205 | GRINDING DEVICE USING ULTRASONIC VIBRATION - A grinding device ( | 08-05-2010 |
20100323587 | CHEMICAL MECHANICAL PLANARIZATION METHODS AND APPARATUS - A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure. | 12-23-2010 |
20110287697 | REMOVAL DEVICE FOR REMOVING ADHERENT - A novel removal device for removing adherent of the present invention has a process tank communicated respectively with a loading port through which an article-to-be-processed, which is composed of a film-like or sheet-like mold base having an adherent adhered thereon in a layer form, is loaded, and with the base discharge path through which the base removed from the adherent is output, and houses therein the article-to-be-processed; a spindle disposed in the process tank, and rotationally driven by a drive motor; a plurality of rotating blades, each of which having the base end fixed to the spindle, and having the top end located inside the process tank; a large number of openings provided to the process tank so as to allow therethrough passage of the adherent; and a plurality of receiving components consecutively disposed below the process tank along the longitudinal direction of the process tank, wherein the individual receiving components have suction hoses respectively at the lower ends thereof, which are provided so as to communicate themselves with the receiving components, and each of the suction hoses being connected with one end of a suction pipe having the base end thereof connected to a suction device. | 11-24-2011 |
20110306278 | Wall polishing machine - A wall polishing machine comprises a handle. The handle comprises at least two longitudinally arranged rod components. Each of the rod components is disposed with a dust guiding pipe therein. In any pair of adjacent rod components, the dust guiding pipe of a first rod component is exposed from the first rod component and has an outwardly exposed end which is inserted into a second rod component to connect to the dust guiding pipe of the second rod component, and secure connection is attained by means of a clamping component. As the handle is designed as being formed by at least two longitudinally arranged rod components connected via a clamping component, each of the rod components can be packed after being disassembled when the machine is not in use, therefore offering convenience in storage and carrying to users. | 12-15-2011 |
20120034852 | MULTI-PURPOSE MACHINE FOR WALL PROCESSING - A multi-purpose machine for wall processing includes a base, a working member and a sliding device that drives the working member slide up and down relative to the base. The base includes a bottom board with moving wheels therebelow, a top board, and several parallel upright posts therebetween. The working member includes a cover and a roller set inside the cover. A built-in motor is set inside the roller. Wall processing tools are releasably fixed on the outside of the roller. A feeding hole is provided on the upper part of the cover and connected with a supply system or an absorbing system. The multi-purpose machine may perform operations including putty scraping, grinding and polishing, painting, cleaning and wall paper removing on the wall to replace human labour, thus realizing multiple purposes, reducing the labour strength, and improving the working efficiency. | 02-09-2012 |
20120040593 | COATING AND CYLINDRICAL GRINDING APPARATUS - A coating and cylindrical grinding apparatus includes a main body defining a cavity, a roller device, a liquid jetting device, a heating device, a cylindrical grinding device, and a support device received in the cavity. The roller device includes a number of rollers positioned along a first direction and is used for coating a work-piece. The liquid jetting device is mounted above the roller device for ejecting coating liquid to the roller device. The heating device heats the work-piece. The cylindrical grinding device includes a grinding wheel positioned at an end of the cavity along a second direction substantially perpendicular to the first direction. The support device includes a support plate for supporting the work-piece, the support device is capable of carrying the work-piece to contact the rollers or the grinding wheel. | 02-16-2012 |
20120071065 | POLISHING APPARATUS - A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position. | 03-22-2012 |
20130012109 | POLISHING DEVICE - A polishing device is used for polishing at least one workpiece and includes a bracket, at least one loading device, a number of polishing tools having different roughness, a number of first driving devices, a supporting device, and a second driving device. The at least one loading device is positioned on the bracket, and is used for loading the at least one workpiece. Each first driving device is used for driving a respective one of the polishing tools to rotate to polish one workpiece. The supporting device is connected to the bracket, and is used for loading the polishing tools and the first driving devices. The second driving device is connected to the supporting devices, and is used for driving the supporting device to rotate to select a proper one of the polishing tools. | 01-10-2013 |
20140370789 | METHOD OF REMOVING BACKING ADHESIVE OF CARPET AND THE DEVICE THEREOF - Method of removing backing adhesive from a carpet by steps: (1) sorting collected waste carpet into various types according to the surface fiber materials, such as, nylon, PP, PET and wool, (2) removing PP mesh base from the sorted carpet, and (3) passing the carpet without the PP mesh base through an active feeding device to a grinding wheel to remove the backing adhesive. | 12-18-2014 |
20140378033 | ABRASIVE APPARATUS AND COMPONENTS THEREOF - Provided is an abrasive apparatus with a drive shaft terminating with a working head, where this working head is removably attach to an abrasive attachment. Also provided is a drive system arranged to rotate the drive shaft, the drive system being connected to the drive shaft distal from the working head. The abrasive apparatus also includes at least one fluid supply conduit having an inlet and at least one outlet, with the at least one outlet being located adjacent to the working head of the drive shaft and arranged to deliver fluid to the abrasive attachment and/or an immediate working area. | 12-25-2014 |
20160039067 | SANDING DEVICE INCLUDING MEANS FOR CHANGING A SANDING DISK - The invention relates to a sanding assembly including a sanding device ( | 02-11-2016 |
451069000 | Cutter | 9 |
20130267151 | GLASS-PLATED WORKING MACHINE - A glass-plate working machine | 10-10-2013 |
20150352680 | AN APPARATUS AND METHOD FOR MANUFACTURING A STEEL COMPONENT - An apparatus for edging a steel component, the apparatus having at least one edger roll ( | 12-10-2015 |
451070000 | Including abrader for cut surface | 7 |
20090221218 | TOOL FOR MACHINING COMPOSITE MATERIAL PARTS - A tool for machining composite material parts and a machining machine including such a tool. The tool has a substantially cylindrical main body. The main body includes a polishing part with a diameter D | 09-03-2009 |
20130109281 | BUMPER PAINT REMOVING APPARATUS | 05-02-2013 |
20140134930 | DEBURRING DEVICE - A deburring device, for removing burrs off an inner sidewall of a hole of a workpiece, includes a mounting seat, a first driving member, an elastic coupler, a cutter, a polisher assembly, an elastic coupler, and a controller. The first driving member is mounted on the mounting seat. The cutter is connected to the first driving member by the elastic coupler. The polishing assembly is assembled to the mounting seat and arranged opposite to the cutter, in which the controller is electrically connected to the first driving member and the polisher assembly. The controller controls the cutter to enter the hole of the workpiece and mill the inner sidewall of the hole of the workpiece to remove burrs off the workpiece, the polishing pad moves to remove burrs generated by the cutter. | 05-15-2014 |
20150038061 | Device for Fine Machining of Optically Effective Surfaces on In Particular Spectacle Lenses and Flexible Production Cell Comprising Such a Device - The invention relates to a polishing machine for spectacle lenses, including a least one workpiece spindle protruding into a workspace for a rotary drive of the spectacle lens about a workpiece rotational axis. At least one feed device lowers and raises a polishing tool relative to the spectacle lens. An oscillation drive unit moves the feed device back and forth in an oscillation direction, which during the polishing runs substantially transversely to the workpiece rotational axis. A swivel drive unit swivels the feed device about a swivel-adjusting axis which runs substantially perpendicular to the workpiece rotational axis and substantially normal to the oscillation direction. A swivel mechanism is provided to swivel the feed device, the oscillation drive unit and the swivel drive unit relative to the workpiece. | 02-05-2015 |
20150038062 | PROCESSING APPARATUS INCLUDING LASER BEAM APPLYING MECHANISM AND SEPARATING MEANS - A processing apparatus including a chuck table having a holding surface for rotatably holding a workpiece, a laser beam applying mechanism having a laser beam generating unit for generating a laser beam and focusing the laser beam to the inside of the workpiece held on the chuck table, a relatively moving unit for relatively moving the chuck table and the laser beam applying mechanism in a direction parallel to the holding surface of the chuck table while applying the laser beam to the workpiece to thereby form a modified layer inside of the workpiece, a separating unit for separating a part of the workpiece along the modified layer as a boundary formed inside the workpiece, and a grinding/polishing unit having a grinding/polishing wheel for grinding or polishing the modified layer left on the workpiece after separating the part and a spindle for rotatably mounting the grinding/polishing wheel. | 02-05-2015 |
20160023279 | MACHINING APPARATUS AND DEBURRING DEVICE - A pair of pinching members pinching a workpiece stem portion, and a deburring tool performing deburring onto the workpiece stem portion pinched by the pair of pinching members are disposed under a pair of guide rails. The deburring tool has a recess so that an opening of the recess faces the other end face of the workpiece stem portion, and is capable of a displacement motion in an axis extension direction of the recess while rotating around the recess axis, and a recess inner circumferential surface is formed so as to reduce its diameter as it goes from the recess opening side toward a recess internal side, and a blade portion is provided on the recess inner circumferential surface. Thereby, it is possible to perform deburring without increasing the machining line length, and prevent abnormal wear of a rubbing stone due to the deburring. | 01-28-2016 |
20160141200 | PROCESSING APPARATUS, NOZZLE, AND DICING APPARATUS - A processing apparatus of an embodiment includes a stage that can have a sample placed thereon, a rotation mechanism that rotates the stage, a nozzle that injects a substance onto the sample, a movement mechanism that moves the stage and the nozzle in a relative manner in a direction perpendicular to the rotation axis of the stage; and a control unit that controls the movement mechanism. | 05-19-2016 |
451072000 | Having means to refurbish abrading tool | 18 |
20080280543 | HARD FINISHING MACHINE - The invention relates to a hard finishing machine ( | 11-13-2008 |
20080287041 | System and Method for Removing Particles From a Polishing Pad - A system for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the system comprising a polishing pad; a fluid dispenser arranged to dispense a fluid on the polishing pad; and removal means, wherein the removal means include a heater for increasing the temperature of the fluid dispensed on the polishing pad, and/or voltage means for coupling the polishing pad to a voltage source for repelling charged particles from the polishing pad surface while the fluid dispenser is dispensing the fluid on the polishing pad. | 11-20-2008 |
20090258581 | DOUBLE CONCENTRIC SOLID WHEEL DIAMOND DRESSERS - A dresser for dressing a grind stone including two concentric solid wheel dressing elements. The dressing elements include an abrasive material within a matrix material. The grind stones dressed with the dressers of the invention operate at high removal rates thereby grinding substrates quickly and at low cost. The grind stones dressed with the dressers of the invention also produce favorable mechanical surface characteristics such as low waviness and flatness. | 10-15-2009 |
20100203811 | METHOD AND APPARATUS FOR ACCELERATED WEAR TESTING OF AGGRESSIVE DIAMONDS ON DIAMOND CONDITIONING DISCS IN CMP - The present invention is a method and apparatus for accelerated pulling and fracturing of aggressive diamonds on a CMP diamond conditioner disc wherein aggressive diamonds of known position are pulled or fractured by contacting the diamond conditioner disc to a plate or sheet of a hard material or a plate or sheet containing discrete structures of hard material relative to which the diamond disc is in motion at a determinable and reproducible rate for a determinable and reproducible period of time and the number and position of the pulled or fractured aggressive diamonds are determined following the completion of said contact. | 08-12-2010 |
20120058716 | GRINDING DEVICE - A grinding device is provided which includes a dressing mechanism for dressing the grinder which is simple in structure and low in manufacturing cost. The grinding device includes a dresser head ( | 03-08-2012 |
20130122789 | Dressing Device For A Grinding Wheel And Its Use In A Centreless Nuclear Fuel Pellet Grinder - The invention relates to a device for dressing a grinding wheel, comprising a sleeve to hold a corundum rod laterally and to guide it along its longitudinal axis, a ram to apply constant thrust force onto the corundum rod held in place and guided in the sleeve, to bring it into contact with the grinding wheel, means of rigidly connecting the ram shaft to the end of the corundum rod, and linear guide means for the sleeve for translating the corundum rod parallel to the axis of the grinding wheel while keeping the rod pressed against the grinding wheel with a constant force. | 05-16-2013 |
20130130601 | CHEMICAL MECHANICAL POLISHING MACHINE AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME - A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a “thickness” direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine. | 05-23-2013 |
20130178136 | SYSTEM FOR MACHINING THE RUNNING SURFACE ON SKIS AND SNOWBOARDS - The system for machining the bottom of skis comprises a machine frame, in which a ski is stationary supported by roller carriers. The machining is performed by machining tools on a carriage, which extends throughout under the ski. During the machining, the carrier rollers that are alternately arranged behind each other, take over the support of the ski. There are always so many carrier rollers directly under the ski that its bottom remains in a stationary position. | 07-11-2013 |
20130210324 | POLISHING APPARATUS - The present invention relates to a polishing apparatus for polishing an object to be polished (substrate) such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table configured to support a polishing pad, a polishing head having a top ring configured to press an object to be polished against the polishing pad while the object to be polished is rotated, and a dresser head having a dresser configured to dress the polishing pad. The polishing apparatus has a head cover having a purge gas introducing unit configured to introduce a purge gas into the head cover and an exhausting unit configured to exhaust the interior of the head cover. The pressure in the head cover is set to a pressure level slightly higher than the pressure outside the head cover, and main components of the polishing head are housed in the head cover. | 08-15-2013 |
20130244549 | GEAR GRINDING MACHINE - Provided is a gear grinding machine which can dress a grinding stone while a gear is held attached to the machine regardless of the size of the gear. To this end, the gear grinding machine ( | 09-19-2013 |
20140094097 | DUAL-SPINDLE GRINDER - A machining apparatus has a frame carrying a headstock capable of gripping one end of an elongated workpiece and rotating the workpiece about a machining axis. A turntable support is spaced axially from the headstock on the frame. A tailstock carried on the support can be aligned with the machining axis in a machining position of the support. A machining drive is carried on the frame and itself carries a rotatable grinding disk engageable radially of the machining axis with the workpiece when the workpiece is engaged between the headstock and tailstock. A dressing tool carried on the support axially offset from the support axis and angularly offset about the support axis from the tailstock is engageable in a dressing position of the support with the grinding disk for dressing same in the dressing position with the workpiece engaged between the headstock and tailstock. | 04-03-2014 |
20140127978 | DEVICE FOR GRINDING SPHERICAL END FACE OF ROLLER-SHAPED WORKPIECE - An inner rotary retaining member has an annular outward rolling surface formed of part of a radially outward tapered surface centering on the central axis of a first rotary drive shaft. An outer rotary retaining member has an annular inward rolling surface formed of part of a radially inward tapered surface centering on the central axis of a second rotary drive shaft. The rolling surfaces are opposed to each other. A pocket that supports a workpiece such that the workpiece rotates and revolves as the retaining members rotate is formed at a portion of the carrier, the portion being positioned between the rolling surfaces. The central axis of the workpiece supported by the pocket is inclined relative to the central axis of the rotary drive shafts. | 05-08-2014 |
20140273767 | POLISHING PAD CONDITIONER PIVOT POINT - A polishing system includes a polishing pad having a polishing surface and a conditioner apparatus. The conditioner apparatus includes a conditioner head constructed to receive a conditioning disk for conditioning a surface of the polishing pad, an arm that supports the conditioner head, a base that supports the arm, the arm pivotally connected to the base such that the arm is pivotable about a pivot point to change an angle of inclination of the arm, wherein the pivot point is positioned below the polishing surface of the polishing pad. | 09-18-2014 |
20140295742 | METHOD AND APPARATUS FOR CMP CONDITIONING - A CMP system has a polishing table for supporting a CMP pad which a semiconductor wafer is polished. The CMP system has a laser source configured to regenerate the CMP pad through a conditioning process while the CMP pad is disposed on the polishing table. | 10-02-2014 |
20140323018 | POLISHING DEVICE FOR REMOVING POLISHING BYPRODUCTS - A method for removing polishing byproducts and a polishing device are provided. The method includes mounting a positive electrode on the center of a polishing platen and a negative electrode on an edge of the polishing platen, applying a voltage between the positive electrode and the negative electrode after a polishing process for metal is finished, and rotating the polishing platen and rinsing a polishing pad with deionized water or a chemical cleaning solution to remove polishing byproducts that are formed in the polishing process. The combination of the centrifugal force and the electromotive force increases the removal rate of the polishing byproducts. | 10-30-2014 |
20140335769 | GRINDING MACHINE - A grinding machine includes: a grinding wheel of which movement in an X direction and a Z direction is controlled and that grinds a workpiece; and a truing unit that is installed at a predetermined position and that trues a machining surface of the grinding wheel. The truing unit includes: a movable table that is installed to be movable in the X direction relative to a support member; a truer that is rotatably installed in the movable table and that trues the machining surface of the grinding wheel; and an X-direction pressing mechanism that presses the truer in the X direction along with the movable table. | 11-13-2014 |
20140342642 | METHOD OF OBTAINING A SLIDING DISTANCE DISTRIBUTION OF A DRESSER ON A POLISHING MEMBER, METHOD OF OBTAINING A SLIDING VECTOR DISTRIBUTION OF A DRESSER ON A POLISHING MEMBER, AND POLISHING APPARATUS - The method includes: calculating an increment of a sliding distance of a dresser by multiplying a relative speed between the dresser and a polishing member by a contact time between them; correcting the increment of the sliding distance by multiplying the calculated increment of the sliding distance by at least one correction coefficient; calculating the sliding distance by repeatedly adding the corrected increment of the sliding distance to the sliding distance according to elapse of time; and producing the sliding-distance distribution of the dresser from the obtained sliding distance and a position of a sliding-distance calculation point. The at least one correction coefficient includes an unevenness correction coefficient provided for the sliding-distance calculation point. The unevenness correction coefficient is a correction coefficient that allows a profile of the polishing member to reflect a difference between an amount of scraped material of the polishing member in its raised portion and an amount of scraped material of the polishing member in its recess portion. | 11-20-2014 |
20150111478 | POLISHING SYSTEM WITH LOCAL AREA RATE CONTROL - A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pads positioned about the perimeter of the chuck, wherein each of the one or more polishing pads are movable in a sweep pattern adjacent the substrate receiving surface of the chuck and are limited in radial movement to about less than one-half of the radius of the chuck measured from the perimeter of the chuck. | 04-23-2015 |
451073000 | Adjunct | 19 |
20100136890 | Riding Apparatus For Treating Floor Surfaces With A Power Cord Handling Swing Arm - A swing arm for managing a power cord to an electric vehicle has a proximate arm member with a pivotable connection about a vertical axis for connection to the vehicle in proximity to a longitudinal center line of the vehicle. A distal arm member is pivotably connected about a pivot vertical axis to the proximate arm member and resiliently biased to extend straight out with respect to the proximate arm member. The swing arm is dimensioned to extend the distal arm member beyond a side of the vehicle when the swing arm extends laterally with respect to the vehicle. A spring member is connected to the distal arm member for resiliently biasing the distal arm member to extend straight out with respect to the proximate arm member against a side force below a predetermined amount and yieldable to bending of the distal arm member upon exertion of a side force above the predetermined amount. | 06-03-2010 |
20120009851 | CAMSHAFT-GRINDING MACHINE - An apparatus for grinding a cam having an outer surface with outwardly convex and outwardly concave portions has a frame and a main drive on the frame for holding the cam and rotating it about a main axis. A pair of drive motors having respective output axes generally diametrally flank the main axis. Respective carriages carrying the drive motors are shiftable on the frame radially of the main axis. One of the motors is shiftable into an inner position in which the main axis extends through the one drive motor. Respective grinding wheels are rotatable by the motors about the respective axes, and the wheel of the one motor is of substantially smaller diameter than the wheel of the other motor. | 01-12-2012 |
20120156973 | SHARPENER FOR A SNOW TRAVEL MEMBER SUCH AS A SKI OR A SNOWBOARD - In one aspect, the invention is directed to a sharpener for sharpening a corner edge of a snow travel member, which may be, for example, a ski or a snowboard. The corner edge is between a bottom face and a side face of the snow travel member. The sharpener includes an angle adjustment mechanism to adjust the angle between surfaces on the sharpener that support the bottom face and side face of the snow travel member, in order to accommodate different snow travel members, that may have different angles between their bottom face and their side face. For example, the angle adjustment member may be capable of adjusting the angle between a bottom face orienting surface on the sharpener and a side face orienting surface on the sharpener between a range of angles. The range of angles may be, for example, a range from 85 degrees and 90 degrees. | 06-21-2012 |
20120315831 | CMP Polishing Method, CMP Polishing Apparatus, and Process for Producing Semiconductor Device - When the remaining slurry and polishing residue are removed by cleaning with a cleaning liquid (preferably a cleaning liquid containing a surfactant), organic matter in the cleaning liquid containing a surfactant seeps into the interlayer insulating film | 12-13-2012 |
20120322349 | GRINDING DEVICE FOR MACHINE BASED GRINDING OF ROTOR BLADES FOR WIND ENERGY SYSTEMS - Grinding device | 12-20-2012 |
20130012110 | MACHINE TOOL WITH ULTRASONIC DEVICE - A machine tool with an ultrasonic device includes a machine tool unit, a fastening unit, and an ultrasonic unit. The machine tool unit includes a working device and a worktable. The working device has a working member to process a workpiece. The fastening unit is disposed on the worktable to mount and fasten the workpiece. The ultrasonic unit is located between the worktable and the fastening unit. When the working member and the ultrasonic unit are activated, the workpiece is processed by the working member, and the ultrasonic unit generates ultrasonic vibrations to the fastening unit and the workpiece placed on the fastening unit to clear filings from the workpiece during operation to enhance the work efficiency greatly. | 01-10-2013 |
20130084784 | PRESSURE DETECTION DEVICE AND POLISHING APPARATUS - A pressure detection device includes a pressure detector, a bearing member, at least two guiding rods passing through the bearing member and connecting with the pressure detector, at least two elastic elements sleeving on the at least one guiding rod and resisting between the bearing member and the pressure detector for transferring forces from the bearing member to the pressure detector. | 04-04-2013 |
20140080385 | POLISHING APPARATUS - A polishing apparatus is used for polishing and planarizing a surface of a substrate such as a semiconductor wafer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate and press the substrate against the polishing surface. The top ring has an extendable and contractable connection sheet configured to cover a gap between a retainer ring guide fixed to a top ring body and a retainer ring guided by the retainer ring guide to move vertically. The polishing apparatus has a nozzle configured to eject a cleaning liquid in a horizontal direction toward the connection sheet and apply a flow of the cleaning liquid directly onto the connection sheet for cleaning the connection sheet. | 03-20-2014 |
20140213158 | POLISHING APPARATUS - A polishing apparatus is used for polishing a substrate such as a semiconductor. The polishing apparatus includes a polishing table configured to hold a polishing tool having a polishing surface, a polishing head having a top ring configured to press a substrate against the polishing surface, and a polishing head cover configured to cover the polishing head. The polishing apparatus further includes a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover, and a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover. | 07-31-2014 |
20140287660 | APPARATUS HAVING CUP ATTACHING UNIT - A system includes: a cup attaching unit configured to attach a cup to a surface of an eyeglass lens; a processing apparatus main body that includes a housing in which a lens processing mechanism with a processing tool configured to process the eyeglass lens held by a lens chuck shaft is arranged; a display which is arranged at the housing and is configured to display an operation step; a signal input unit configured to input a switching signal to switch a screen of the display from a screen for a current operation step to a screen for a next operation step; and a controller configured to control the display to switch displaying the screen of the display from the screen for the current operation step to the screen of the next operation step based on the switching signal input by the signal input unit. | 09-25-2014 |
20150017889 | POLISHING APPARATUS - A polishing apparatus which can remove slurry which has entered into a gap between an elastic membrane for pressing a substrate such as a wafer and a retaining ring is disclosed. The polishing apparatus includes a top ring which has an elastic membrane configured to form a pressure chamber for pressing the substrate against a polishing pad, and a retaining ring disposed around the elastic membrane and configured to press the polishing pad, a top ring rotating device configured to rotate the top ring about an axis of the top ring, and a cleaning brush configured to be brought into contact with a peripheral portion of a lower surface and an outer circumferential surface of the elastic membrane. | 01-15-2015 |
20150087208 | APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR WAFER - In a semiconductor wafer manufacturing apparatus, a rotation module is provided to hold the semiconductor wafer at a plane. The semiconductor wafer is revolved by the rotation module around a first axis. The first axis is substantially perpendicular to the plane. A cleaning module is configured to revolve around a second axis when the cleaning module contacts the surface of the semiconductor wafer. A mechanism is further provided to enable the rotation module and/or the cleaning module to move along a direction substantially perpendicular to the first axis. Consequently, the relative velocities at the contact points between the semiconductor wafer and the cleaning module are changed. Moreover, no relative velocity at any contact point between the semiconductor wafer and the cleaning module is zero or close to zero. | 03-26-2015 |
20150099433 | SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS - A substrate cleaning apparatus for reducing a limitation of a layout of a chemical liquid nozzle and a rinsing liquid nozzle, while enabling a load cell to be installed at an optimal location and achieving a larger adjustment range, is disclosed. The substrate cleaning apparatus includes a roll assembly including at least a roll cleaning member to be brought into contact with a substrate and a roll arm that rotatably supports the roll cleaning member, a support arm for supporting the roll assembly; an adjustment screw extending through the support arm and screwed into the roll assembly; and a screw support that fixes a relative position of the adjustment screw in a vertical direction with respect to the support arm and rotatably supports the adjustment screw. | 04-09-2015 |
20150105004 | POLISHING APPARATUS - A polishing apparatus connected to a robot arm and used to polish a workpiece includes a bracket, a polishing assembly, and a positioning assembly. The polishing assembly is mounted on the bracket and includes a driver and a polishing plate connected to the driver. The driver is capable of driving the polishing plate to rotate, and defines an annular positioning groove around the spin axis. The positioning assembly includes a first positioning plate and a second positioning plate mounted on the bracket and opposite to the first positioning plate. The first positioning plate and the second positioning plate are clamped into two sides of the positioning groove, whereby the driver is clamped between the first positioning plate and the second positioning plate. | 04-16-2015 |
20150298276 | AUTOMATIC SHEET GRINDING APPARATUS - An automatic sheet grinding apparatus includes a stationary stage positioned at a lower portion of the automatic sheet grinding apparatus, a sheet holder positioned on the stationary stage to grip the sheet, and a grinding head part having a chuck assembly fixed to the grinding head part through a spindle, spaced apart from the sheet holder, positioned on the stationary stage, and having a grinding disc attached to the chuck assembly to grind the sheet provided in the sheet holder. The grinding head part includes a thickness measuring unit to measure a thickness of the sheet, and a hardness measuring unit to measure hardness of the sheet. The automatic sheet grinding apparatus further includes rails positioned on the stationary stage and extending in parallel to each other. In this case, the sheet holder is securely and movably provided on the rails positioned on the stationary stage to grip the sheet. | 10-22-2015 |
20150306735 | GRINDING MACHINE WITH LIQUID COOLANT INJECTION NOZZLE - A grinding machine for bearing rings, the machine includes a frame, a rotating grinding wheel movable in rotation around a first rotation axis and a nozzle adapted to inject a liquid coolant on a peripheral portion of the grinding wheel. The nozzle is mounted on a first slide movable in translation along a second axis perpendicular to the first rotation axis and the position of the slide along the second axis is controlled by a mechanical linkage connected to a movable part of the machine whose position depends on the outer diameter of the grinding wheel. | 10-29-2015 |
20150380283 | PROCESSING APPARATUS - A processing apparatus including a holding unit that holds a workpiece and a grinding unit that grinds the workpiece held by the holding unit is provided. The processing apparatus includes a gettering capability determining unit that determines whether or not grinding distortion generated by grinding the workpiece held by the holding unit by the grinding unit has sufficient gettering capability. | 12-31-2015 |
20160008948 | POLISHING APPARATUS | 01-14-2016 |
20160016275 | TIRE GRINDING DEVICE AND TIRE TESTING SYSTEM - A tire grinding device grinds a surface of a tire, and the tire grinding device includes: a grindstone holding portion which holds a grindstone which grinds the surface of the tire; a cover which is disposed with a gap with respect to the surface of the tire, and covers the grindstone held by the grindstone holding portion; and an air layer forming portion which forms an air layer which prevents ground chips of the ground tire from being discharged through the gap formed between an edge of the cover and the surface of the tire. | 01-21-2016 |