| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 451060000 | Abradant supplying | 29 |
| 20080274674 | STACKED POLISHING PAD FOR HIGH TEMPERATURE APPLICATIONS - The invention provides a polishing pad for chemical-mechanical polishing comprising a polishing layer, a bottom layer, and a hot-melt adhesive, the hot-melt adhesive joining together the polishing layer and the bottom layer. The hot-melt adhesive comprises between about 2 and about 18 wt. % EVA and is substantially resistant to delamination when the polishing layer attains a temperature of about 40° C. The invention also provides a method of polishing a substrate with the aforementioned polishing pad, as well as a method of preparing such a polishing pad. | 11-06-2008 |
| 20090029634 | Semiconductor wafer polishing machine - Embodiments of the invention comprise a machine adapted for polishing work pieces such as large silicon wafers. A wafer polishing machine in accord with the invention comprises a rotatable platen in a table base, above which is mounted a lid having a head moving assembly with four synchronously rotatable head assemblies. A motor and linkage connected to the head moving assembly imparts reciprocating linear motion to the head assemblies in a selected direction in a plane parallel to an upper surface of the platen. Embodiments of the invention produce a complex relative motion between a surface of a wafer to be polished and the platen. The complex relative motion, resulting from a combination of motions including rotation of the platen, rotation of the head assemblies, and translation of the head moving assembly, improves a uniformity of polish and a rate of polishing compared to wafer polishing machines known in the art. | 01-29-2009 |
| 20090111361 | METHOD OF SUPPLYING POLISHING LIQUID - The present invention relates to a method of supplying the polishing liquid by periodically interrupt the supply of the polishing liquid, thus avoid over-supply or wastage of the polishing liquid. Hence, the consumption of the polishing liquid can be decreased and the production cost can be lower. | 04-30-2009 |
| 20090142995 | Slurry supply system - A slurry supply system with multiple supply modules and a flushing module concurrently coupled to the multiple supply modules is provided. Each supply module includes a slurry reservoir and at least one delivery line connecting to the slurry reservoir, wherein each delivery line is oriented toward a chemical mechanical polishing apparatus. The flushing module includes a flushing liquid reservoir and multiple flushing lines connecting to the flushing liquid reservoir, wherein each flushing line is coupled to each delivery line thereby the flush module can selectively flush one of the delivery lines. | 06-04-2009 |
| 20090142996 | Polishing apparatus and method - A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a polishing head having at least one elastic membrane configured to form a plurality of pressure chambers for being supplied with a pressurized fluid, and a controller configured to control supply of the pressurized fluid to the pressure chambers. The controller controls supply of the pressurized fluid so that the pressurized fluid is supplied first to the pressure chamber located at a central portion of the substrate when the substrate is brought into contact with the polishing surface, and then the pressurized fluid is supplied to the pressure chamber located at a radially outer side of the pressure chamber located at the central portion of the substrate. | 06-04-2009 |
| 20090156102 | Pivoting hopper for particle blast apparatus - A particle blast apparatus has a pivoting hopper, allowing the hopper exit to move from or between a first position at which the exit is aligned with the feeder entrance to a second position where the hopper exit is not aligned as such. The hopper may emptied or cleared in this manner. The hopper may be provided with a device configured to impart energy to the hopper while the hopper exit is located at the second position. | 06-18-2009 |
| 20090258580 | AQUEOUS ABRASIVES DISPERSION MEDIUM COMPOSITION - [Problems to be Solved by the Invention] | 10-15-2009 |
| 20100048106 | CHEMICAL MECHANICAL POLISHER HAVING MOVABLE SLURRY DISPENSERS AND METHOD - A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, and first and second substrate carriers that are each capable of holding a substrate against the polishing pad. First and second slurry dispensers, each comprise (i) an arm comprising a pivoting end and a distal end, (ii) at least one slurry dispensing nozzle on the distal end, and (iii) a dispenser drive capable of rotating the arm about the pivoting end to swing the slurry dispensing nozzle at the distal end to dispense slurry across the polishing platen. | 02-25-2010 |
| 20100112911 | METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY - The present invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising a solid crescent shaped injector the concave trailing edge of which is fitted to the size and shape of the leading edge of the polishing head with a gap of up to 1 inch, the bottom surface of which faces the pad and rests on it with a light load, and through which CMP slurry or components thereof are introduced through one or more openings in the top of the injector and travel through a channel or reservoir the length of the device to the bottom where it or they exit multiple openings in the bottom of the injector, are spread into a thin film, and are introduced between the surface of the polishing pad and the wafer along the leading edge of the wafer in quantities such that all or most of the slurry is introduced between the wafer and the polishing pad and a method of use therefor. | 05-06-2010 |
| 20100112912 | Retainer Ring - A retainer ring and a method of using the retainer ring are provided. The retainer ring has openings along a bottom surface. Grooves encompass the openings and extend to an interior portion of the retainer ring wherein a semiconductor wafer may be held. In operation, a semiconductor wafer is placed inside the retainer ring. As the retainer ring and the semiconductor wafer are moved relative to an underlying polishing pad, slurry is dispensed through the openings in the retainer ring. The grooves in the retainer ring allow the slurry to flow from the openings to the interior portion of the retainer ring and the semiconductor wafer. | 05-06-2010 |
| 20100120336 | Polishing method and polishing apparatus - An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside of a pad efficiently to reduce scratches due to the polishing by-product, and can suppress consumption of slurry to the minimum to realize cost reduction during running for mass production. | 05-13-2010 |
| 20100210189 | SLURRY DISPENSER FOR CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD - A chemical mechanical polishing method and apparatus provides a deformable, telescoping slurry dispenser arm coupled to a dispenser head that may be arcuate in shape and may also be a bendable telescoping member that can be adjusted to vary the number of slurry dispenser ports and the degree of curvature of the dispenser head. The dispenser arm may additionally include slurry dispenser ports therein. The dispenser arm may advantageously be formed of a plurality of nested tubes that are slidable with respect to one another. The adjustable dispenser arm may pivot about a pivot point and can be variously positioned to accommodate different sized polishing pads used to polish substrates of different dimensions and the bendable, telescoping slurry dispenser arm and dispenser head provide uniform slurry distribution to any of various wafer polishing locations, effective slurry usage and uniform polishing profiles in each case. | 08-19-2010 |
| 20100221986 | Electron-Beam-Assisted EEM Method - To provide an electron beam assisted EEM method that can realize ultraprecision machining of workpieces, including glass ceramic materials, in which at least two component materials different from each other in machining speed in a machining process are present in a refined mixed state and the surface state is not even, to a surface roughness of 0.2 to 0.05 nm RMS. The EEM method comprises a working process in which a workpiece and chemically reactive fine particles are allowed to flow along the working face to remove atoms on the working face chemically bonded to the fine particles together with the fine particles through chemical interaction between the fine particles and the working face interface. The workpiece comprises at least two component materials present in a refined mixed state and different from each other in machining speed in the machining process. After the exposure of the workpiece in its working face to an electron beam to conduct modification so that the machining speed of the surface layer part in the working face is substantially even, ultraprecision smoothening is carried out by working process. | 09-02-2010 |
| 20100297920 | PRODUCING STRESS ON SURFACES - An apparatus for producing stress on a surface, comprising one or more service assembly and one or more cleaning assembly. The service assembly comprises one or more means for applying dirt to said surface, or one or more means for scuffing said surface, or one or more means for dragging a test material across said surface, or a combination thereof. The cleaning assembly comprises one or more scrubber, or one or more burnisher, or a combination thereof. | 11-25-2010 |
| 20110070811 | POINT OF USE RECYCLING SYSTEM FOR CMP SLURRY - The present invention generally relates to apparatus and method for recycling both polishing slurry and rinse water from CMP processes. The present invention also relates to rheology measurements and agglomeration prevention using centrifugal pumps. | 03-24-2011 |
| 20110081840 | METHOD FOR POLISHING SEMICONDUCTOR WAFERS - A method for polishing a plurality of semiconductor wafers includes providing a polishing pad containing an abrasive substance bonded in the polishing pad; providing an alkaline polishing agent at a volumetric flowrate greater than or equal to 5 liters/min.; polishing the plurality of semiconductor wafers using the polishing pad; and circulating the polishing agent in a polishing agent circuit during the polishing. | 04-07-2011 |
| 20110207385 | Controlling Powder Delivery Rate in Air Abrasive Instruments - A micro-abrasive blasting device and method for perturbation control may use a plurality of delivery conduits of various lengths and/or apertures, or a single moveable delivery conduit. The user is able to individually open and close bypass conduit pinch valve(s) external to micro-abrasive blasting device to affect the perturbation intensity internal to the mixing chamber. By selectively opening and closing flow through delivery conduits it is possible to provide a more consistent perturbation rate and select the perturbation intensity internal to mixing chamber. | 08-25-2011 |
| 20120028548 | RETAINING RING WITH SHAPED PROFILE - Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring. | 02-02-2012 |
| 20120190278 | POLISHING METHOD AND POLISHING DEVICE - A polishing method includes: mounting a wafer on a fixed abrasive polishing pad located on a polishing platen; delivering a polishing slurry to the fixed abrasive polishing pad to polish the wafer; and adsorbing abrasive particles generated during the polishing process with an electrode. The electrode has a polarity opposite to a polarity of charges of the abrasive particles. A polishing device includes a polishing platen, a fixed abrasive polishing pad, a slurry pipeline and a polarity changer having an electrode. Therefore, the abrasive particles generated during the polishing process are removed, which prevents the wafer from being scratched, thereby increasing wafer yield and improving efficiency. | 07-26-2012 |
| 20120220200 | POLISHING METHOD AND POLISHING APPARATUS - To propose a method for realizing appropriate delivering of works to carriers in the conventional transfer process. Specifically, in a polishing method for polishing a work retained in a carrier, at least one carrier for retaining a work to be polished is placed between an upper plate and a lower plate; the work is fit in a hole of the carrier; the carrier and the work are inserted between the upper plate and the lower plate; and at least one of the upper plate and the lower plate is rotated while supplying a polishing agent to a space between the upper plate and the lower plate. In fitting the work in the hole of the carrier, an end portion of the work is held and the work is carried to a position above the lower plate; the work is positioned with respect to the hole of the carrier on the lower plate; and the work is released from the hold and guided by a guide to be slowly carried down toward the hole. | 08-30-2012 |
| 20120252325 | SYSTEMS AND METHODS FOR FLUIDIZING AN ABRASIVE MATERIAL - Systems and methods for fluidizing an abrasive particulate material for an abrasive water jet are disclosed herein. In one embodiment, the abrasive material is delivered to a metering orifice in a distributor. Pressurized pulses of air can be directed around a circumference of the distributor to at least partially fluidize the particulate material to facilitate the material passing through the metering orifice. From the metering orifice, the abrasive particulate material is entrained in a water jet for a cutting procedure or other suitable application. | 10-04-2012 |
| 20120252326 | PARTICLE-DELIVERY IN ABRASIVE-JET SYSTEMS - Particle-delivery devices, abrasive jet systems, and associated devices, systems, and methods are disclosed herein. In certain aspects, the particle-delivery devices can include an elongated fluidizing chamber and a metering assembly. The metering assembly can include a particle flow path extending from the fluidizing chamber. The metering assembly can also include a carrier-gas passage extending to an injection orifice proximate the fluidizing chamber. The metering assembly can be configured to inject carrier gas into the fluidizing chamber to fluidize particles within the fluidizing chamber. Fluidizing the particles at different carrier-gas pressures and/or flow rates can change the rate of particle delivery. For example, the metering assembly can include a metering opening and a regulator configured to change a steady-state pressure and/or flow rate of carrier gas entering the fluidizing chamber. Systems disclosed herein can include a controller configured to change a flow rate of particles through the metering opening. | 10-04-2012 |
| 20130143474 | Slurry Sluppy System for CMP Process - The present disclosure relates to a slurry distribution system having a distribution tube connected between a mixing tank and a CMP tool. The mixing tank is configured to generate a polishing mixture comprising a diluted slurry having abrasive particles that enable mechanical polishing of a workpiece. The polishing mixture is transported between the mixing tank and a CMP tool by way of a transport piping. An energy source, in communication with the transport piping, transfers energy to the abrasive particles within the polishing mixture, thereby preventing accumulation of the abrasive particles within the transport piping. | 06-06-2013 |
| 20140011432 | METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY - In a certain embodiment, the invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising an injector the leading edge of which possess bays, depressions or notches that capture spent slurry and hold it long enough for it to transfer heat from the polishing reaction to the pad or through the injector to the new slurry before the said spent slurry is thrown from the polishing pad. The effect is to considerably improve the removal rate, reduce slurry consumption and reduce operating time. | 01-09-2014 |
| 20140179203 | ABRASIVE PARTICLES HAVING A UNIQUE MORPHOLOGY - An abrasive particle having an irregular surface, wherein the surface roughness of the particle is less than about 0.95. A method for producing modified abrasive particles, including providing a plurality of abrasive particles, providing a reactive coating on said particles, heating said coated particles; and recovering modified abrasive particles. | 06-26-2014 |
| 20140308880 | SUPPLYING SYSTEM OF ADDING GAS INTO POLISHING SLURRY AND METHOD THEREOF - A supplying system of adding gas into the polishing slurry and method thereof are described. The supplying system includes a slurry container, a gas-mixed container, an adjusting device, a first flow controller, and a second flow controller. The supplying system utilizes the adjusting device to mix the polishing slurry with gas for forming the gas-mixed polishing slurry. The supplying system of adding the gas into the polishing slurry and method thereof are capable of increasing the material removal rate of the surface of the substrate in order to improve the processing quality of the substrate. | 10-16-2014 |
| 20140335768 | APPARATUS AND METHOD FOR RECLAIMING ABRASIVE BLASTING MATERIAL AND SCREENING DEVICE FOR SEPARATING ABRASIVE BLASTING MATERIAL - An apparatus for reclaiming abrasive blasting material comprises a prime mover, a vacuum pump and a separator unit for separating the abrasive blasting material in the contaminated abrasive blasting material from contaminants. The vacuum pick-up draws the contaminated abrasive blasting material. The separator unit includes a screening device for separating and reclaiming the abrasive blasting material. The screening device comprises a support member having a longitudinal axis and a transverse axis, and an endless flexible screen belt mounted to the support member so as to be movable along an endless closed loop in the direction of the longitudinal axis. The screen belt has a plurality of openings being sized to allow particles of the abrasive blasting material of a desired size to fall therethrough by gravity and to prevent the contaminants larger than the abrasive blasting material from falling therethrough. | 11-13-2014 |
| 20150111477 | Polishing Head, Chemical-Mechanical Polishing System, and Method for Polishing Substrate - A polishing head for a chemical-mechanical polishing system includes a carrier head, at least one electromagnetism actuated pressure sector and a membrane. The electromagnetism actuated pressure sector is disposed on the carrier head. The membrane covers the electromagnetism actuated pressure sector. | 04-23-2015 |
| 20160136777 | METHOD FOR OPERATING A POLISHING HEAD AND METHOD FOR POLISHING A SUBSTRATE - A method for operating a polishing head is provided. The method includes keeping a stator of at least one electromagnetism actuated pressure sector stationary with respect to a carrier head, and electromagnetically and linearly moving an active cell of the electromagnetism actuated pressure sector with the stator to linearly move the active cell with respect to the carrier head. | 05-19-2016 |
