| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 451057000 | Combined abrading | 55 |
| 20080233843 | Two-sided surface grinding method and apparatus - In effecting two-sided surface grinding for surface-grinding the opposite surfaces of a workpiece simultaneously by a pair of oppositely disposed grinding wheels, infeed grinding is performed by oscillating the workpiece within the range where the surfaces to be ground of the workpiece do not protrude from the inner and outer peripheries of the grinding wheel surfaces of the grinding wheels, and then through-grinding is performed by feeding the workpiece to allow the surfaces to be ground to pass along the inner and outer peripheries of the grinding wheel surfaces. As an effect, worn wheel edges or the like can be prevented from being formed in the inner and outer peripheral edges, that grinding wheel surfaces can be maintained in proper shape for a prolonged time, that the grinding accuracy is better, and that dress interval can be prolonged, thus improving the life of grinding wheels. | 09-25-2008 |
| 20080274673 | Wafer polishing apparatus, wafer polishing system and wafer polishing method - It is possible to execute a one-step polishing or a plural-step polishing at a high throughput, and it is possible to achieve a reduction of an occupied area on the basis of a compact structure of a whole apparatus. Two platens are respectively provided with a first wafer retention head and a second wafer retention head, and a wafer transfer apparatus on which a wafer is mounted is arranged between two platens. The two wafer retention heads are moved between two platens and the wafer transfer apparatus respectively by a first moving means and a second moving means. Further, a two-step polishing is executed by whirl moving two wafer retention heads from one platen to the other platen at 180 degree respectively by a whirl moving means supporting two moving means. | 11-06-2008 |
| 20090011683 | Method For Grinding Semiconductor Wafers - Semiconductor wafers are processed so as to remove material on one or both sides by means of at least one grinding tool, with coolant supplied into a contact region between the semiconductor wafer and the at least one grinding tool, characterized in that the coolant flow rate is set as a function of a grinding tooth height of the at least one grinding tool and this coolant flow rate is reduced as the grinding tooth height decreases. | 01-08-2009 |
| 20090017733 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus ( | 01-15-2009 |
| 20090036038 | PROCESS FOR RESTORING THE LUSTER TO THE SURFACE OF FACTORY FINISHED WOODEN FLOORS - A floor abrading machine is used to abrade the surface of a factory finished wooden floor so the abraded surface may be recoated with a fresh coat of wooden floor finish. Abrasion of the surface provides anchor sites to achieve a strong bond between the pre-existing abraded finish and the fresh coat of wooden floor finish. The process requires abrading, not removing the factory finish down to bare wood, and recoating to restore the luster to a factory finished wooden floor. Conventional sanders remove the finish down to bare wood to refinish a wooden floor that has been installed and finished in place. | 02-05-2009 |
| 20090053978 | Double-Disc Grinding Machine, Static Pressure Pad, and Double-Disc Grinding Method Using the Same for Semiconductor Wafer - The present invention is a static pressure pad for supporting both sides of a raw wafer without contact by a static pressure of a fluid supplied to the both sides of the raw wafer in a double-disc grinding machine for a semiconductor wafer, wherein in patterns of lands to be banks of surrounding pockets formed on a surface side of supporting the raw wafer of the static pressure pad, an outer circumferential land pattern required to support the raw wafer is a concentric circle with respect to a rotation center of the raw wafer, and a land pattern inside the outer circumferential land pattern is a non-concentric circle with respect to the rotation center of the raw wafer and asymmetrical with respect to all the straight lines which bisect the static pressure pad. With this static pressure pad, there is provided the double-disc grinding machine and a double-disc grinding method for the semiconductor wafer, which can minimize a “middle ring” of average components obtained by averaging a nanotopography of the wafers after the double-disc grinding. | 02-26-2009 |
| 20090124175 | Double-Side Polishing Method for Wafer - There is provided a double-side polishing method for a wafer of sandwiching a wafer held in a carrier between upper and lower turn tables each having a polishing pad attached thereto and simultaneously polishing both surfaces of the wafer while supplying a slurry to a space between the upper and lower turn tables from a plurality of slurry supply holes provided in the upper turn table, wherein a polishing amount at an outer peripheral portion of the wafer to be polished is adjusted and outer peripheral sag of the wafer is suppressed by supplying the slurry in such a manner that an amount of the slurry supplied from the slurry supply holes provided on an outer side relative to the center of rotation of the upper turn table becomes larger than an amount of the slurry supplied from the slurry supply holes provided on an inner side relative to the same at the time of polishing both the surfaces of the wafer. As a result, the double-side polishing method which can suppress occurrence of the outer peripheral sag of the wafer when the wafer is subjected to double-side polishing can be provided. | 05-14-2009 |
| 20090163122 | SYSTEM AND METHOD FOR POLISHING SURFACE OF TAPE-LIKE METALLIC BASE MATERIAL - A polishing system and a method are presented for uniformly polishing efficiently at a fast rate the surface of a tape-like metallic base material of several hundred meters in length. The polishing system is provided not only with devices for causing the base material to travel continuously and applying a specified tension in the base material but also with a first polishing device for randomly polishing the target surface and a second polishing device for carrying out a final polishing on the target surface in the direction of travel of the base material. Polishing marks are formed in the direction of travel on the target surface by the final polishing. | 06-25-2009 |
| 20090186562 | METHOD OF GRINDING WAFER - A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer. | 07-23-2009 |
| 20090186563 | WAFER PROCESSING METHOD - In a wafer processing method, rough grinding using a first grinding stone is divided into first and second steps. In the first step, a wafer is processed into a concave shape at a first transfer rate with a reinforcing rib area slightly left. Thereafter, as primary rough grinding in the second step, the grinding stone is positioned slightly on the inner circumferential side and the wafer is further processed into the concave portion at a second transfer rate faster than the first transfer rate. Since the first transfer rate is suppressed to a rate not to cause a burst chipping, a burst chipping resulting from the second step fast in the processing rate to ensure productivity will occur at the stepped edge portion on the inside of the reinforcing rib area surface. Thus, the flatness of the reinforcing rib area can be ensured. | 07-23-2009 |
| 20090203297 | Semiconductor Wafer, Apparatus and Process For Producing The Semiconductor Wafer - The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides, first by rough-grinding and then by finish-grinding, using a grinding tool. The semiconductor wafer, between the rough-grinding and the finish-grinding, remains positioned in the grinding machine, and the grinding tool continues to apply a substantially constant load during the transition from rough-grinding to finish-grinding. The invention also relates to an apparatus for carrying out the process and to a semiconductor wafer having a local flatness value on a front surface of less than 16 nm in a measurement window of 2 mm×2 mm area and of less than 40 nm in a measurement window of 10 mm×10 mm area. | 08-13-2009 |
| 20090280727 | POLISHING SYSTEM WITH THREE HEADED CAROUSEL - Embodiments of the present invention provide a polishing module configured to use in a polishing system. The polishing module comprises a base member, two polishing stations disposed on the base member, one load cup, and a carousel having three polishing heads. | 11-12-2009 |
| 20090298396 | METHOD OF GRINDING SEMICONDUCTOR WAFERS, GRINDING SURFACE PLATE, AND GRINDING DEVICE - A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers by rotating the wafers between a pair of upper and lower rotating surface plates in a state where the wafers are held on a carrier so that centers of the wafers are positioned on a circumference of a single circle, wherein a ratio of an area of a circle passing through the centers of the wafers to an area of one of the wafers is greater than or equal to 1.33 but less than 2.0; surfaces of the fixed abrasive grains comprised in the surface plates are comprised of pellets disposed in a grid-like fashion, with the pellets provided in a center portion and pellets provided in a peripheral portion being larger in size than the pellets provided in an intermediate portion. | 12-03-2009 |
| 20090298397 | METHOD OF GRINDING SEMICONDUCTOR WAFERS AND DEVICE FOR GRINDING BOTH SURFACES OF SEMICONDUCTOR WAFERS - A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers being ground by rotating the multiple semiconductor wafers between a pair of upper and lower rotating surface plates in a state where the multiple wafers are held on a carrier so that centers of the multiple wafers are positioned on a circumference of a single circle, wherein a ratio of an area of a circle passing through the centers of the multiple wafers to an area of one of the multiple wafers is greater than or equal to 1.33 but less than 2.0; a rotational speed of the multiple wafers falls within a range of 5 to 80 rpm; and the grinding of the multiple wafers with the rotating surface plates are conducted with fixed abrasive grains in the presence of an alkali solution. | 12-03-2009 |
| 20090305615 | Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method - The present invention provides a carrier for double-side polishing apparatus which is set between upper and lower turn tables having polishing pads attached thereto and has a holding hole in which a semiconductor wafer sandwiched between the upper and lower turn tables is held at the time of polishing in a double-side polishing apparatus, wherein a material of the carrier is titanium, and surface roughness of the titanium carrier is 0.14 μm or above in terms of Ra. As a result, there can be provided the carrier for double-side polishing apparatus, a double-side polishing apparatus, and a double-side polishing method that can stably and efficiently produce a high-quality wafer having reduced wafer peripheral sag and a high flatness at the time of double-side polishing of a semiconductor wafer. | 12-10-2009 |
| 20100035526 | CHEMICAL MECHANICAL POLISHING SYSTEM HAVING MULTIPLE POLISHING STATIONS AND PROVIDING RELATIVE LINEAR POLISHING MOTION - A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis. | 02-11-2010 |
| 20100048105 | Lapping Carrier and Method - Provided is a double-sided lapping carrier comprising a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece, said aperture extending from the first major surface through the base carrier to the second major surface, wherein the base carrier comprises a first metal, the circumference of said aperture is defined by a third surface of the base carrier consisting of the first metal and, at least a portion of the first major surface or at least a portion of each of the first and the second major surfaces comprises a polymeric region, said polymeric region comprising a polymer having a work to failure of at least 10 Joules. Also provide are methods of lapping. | 02-25-2010 |
| 20100056027 | Method For Polishing A Semiconductor Wafer - Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side. | 03-04-2010 |
| 20100087124 | CD REPAIR APPARATUS - An apparatus for repairing a surface of a media storage disc is disclosed. The apparatus comprises an exterior housing having an upper lid rendered with an upper lid shaft and a base portion that includes a platform for holding the media storage disc. The disc is placed on the platform with the bottom surface facing upwards and secured by at least one locking mechanism. The apparatus further includes an abrasive pad system attached to the upper lid. The abrasive pad system includes an abrasive pad holder, at least three springs evenly arranged between a top side and a bottom side of the abrasive pad holder. The springs distribute an even amount of pressure on the media storage disc. A plurality of abrasive pads is fixed to the bottom side of the abrasive pad holder. The media storage disc is sanded, buffed, and waxed with a plurality of abrasive pads. | 04-08-2010 |
| 20100099337 | Device For The Double-Sided Processing Of Flat Workpieces and Method For The Simultaneous Double-Sided Material Removal Processing Of A Plurality Of Semiconductor Wafers - A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin ring, wherein the gear wheels or pin rings have a multiplicity of gear or pin arrangements which engage the teeth of the carrier discs during rolling, at least one of the pin arrangements having a guide which delimits movement of the margin of the carrier disc in at least one axial direction, the guide formed by a circumferential shoulder or a circumferential groove. | 04-22-2010 |
| 20100144248 | DOUBLE-SIDE GRINDING APPARATUS FOR WAFER AND DOUBLE-SIDE GRINDING METHOD - A double-side grinding apparatus is designed to be capable of minimizing thermal expansion of hydrostatic pad members and reducing nanotopography in performing wafer grinding. The double-side grinding apparatus is a double-side grinding apparatus for wafers that can simultaneously grind either surface of a wafer to be ground by pressing a grindstone against either surface of the wafer to be ground while hydrostatically supporting either surface of the wafer to be ground in a noncontact manner. Each hydrostatic supporting unit is formed with a hydrostatic pad member facing the wafer to be ground, and a base member placed on the back surface of the hydrostatic pad member. The hydrostatic pad member is made of a ceramic member, and the base member is made of a metal member. | 06-10-2010 |
| 20100311313 | WORKING OBJECT GRINDING METHOD - A working object grinding method capable of grinding a working object reliably is provided. A working object | 12-09-2010 |
| 20110028074 | POLISHING METHOD FOR A WORKPIECE AND POLISHING TOOL USED FOR THE POLISHING METHOD - Provided is a polishing tool capable of forming a high-quality surface of a workpiece for a short period of time. A polishing tool includes: a rotation shaft arranged parallel to a sending direction of moving the polishing tool relative to a workpiece; and at least two polishing bodies. The polishing body includes a foamed resin such as a foamed polyurethane resin, and has an outer peripheral surface having a porosity higher than that of the polishing body. The polishing body includes a non-foamed resin such as a non-foamed polyurethane resin being a material more rigid than that for the polishing body. When polishing-processing, the polishing body performs polishing removal on a surface of the workpiece, and the polishing body smoothes a waviness formed on the surface through the polishing removal. | 02-03-2011 |
| 20110081839 | METHOD AND APPARATUS FOR POLISHING A CURVED EDGE - A method and an apparatus for polishing a curved edge of a molded part. A surface of the curved edge is abraded by contacting a polishing surface of a first polishing wheel to the curved edge repeatedly in a first direction concurrent with a rotational spinning direction of the first polishing wheel. The abraded surface of the curved edge is polished by contacting a polishing surface of a second polishing wheel to the curved edge in the first direction and in a second direction opposite to the first direction. The polishing surfaces of the first and second polishing wheels are shaped to conform to a portion of the surface of the curved edge of the molded part. The polishing wheel is maintained at a constant rotational speed by a controller when contacting the curved edge. The polished surface of the curved edge is visually smoothly uniform in reflective appearance. | 04-07-2011 |
| 20110086580 | WAFER BACK SIDE GRINDING PROCESS - A wafer back side grinding process. A workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer is provided. A first back side of the first semiconductor wafer is grinded by using the second assembly as a carrier. Thereafter, a second back side of the second semiconductor wafer is grinded. | 04-14-2011 |
| 20110159788 | METHOD FOR PRODUCING PULLEY FOR BELT-TYPE CONTINUOUSLY VARIABLE TRANSMISSION - A method includes a grinding step of forming the shape of a contact surface, a grooving step of roughening the shaped contact surface to form grooves therein, and a contact surface lapping step of lapping the contact surface having the grooves with a lapping film to form oil grooves for holding a lubricant oil. The surface roughness of the contact surface is such that the maximum height roughness Rz is 4 μm or less, the mean length RSm of the roughness profile elements is 30 to 60 μm, the skewness Rsk of the roughness profile is −2.7 to −0.6 (no unit), the reduced peak height Rpk is 0.09 μm or less, and the reduced valley depth Rvk is 0.4 to 1.3 μm. | 06-30-2011 |
| 20110183585 | METHOD FOR THE GRINDING OF A PROFILE OF A WORKPIECE - The invention relates to a method for the grinding of a profile ( | 07-28-2011 |
| 20110237165 | SANDPAPER AND METHOD OF USE THEREOF - Disclosed herein is sandpaper that includes a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper. The sandpaper includes a second plurality of particles having a second grain size that is smaller than the first grain size, the second plurality of particles having a second sanding surface covering a second area of the sandpaper. Further, the sandpaper includes a bonding layer having a back surface located opposite the first sanding surface and second sanding surface and a buffer positioned to raise the second plurality of particles such that the first sanding surface and the second sanding surface of the sandpaper are substantially planar. | 09-29-2011 |
| 20110281506 | Method For Surface-Treating Mirror-Finish Stainless Steel Workpiece - The present invention discloses a method for surface-treating a mirror-finish stainless steel workpiece, which comprises steps: dividing the surface of a mirror-finish stainless steel workpiece into different grinding areas according to the depths of the scratches; selecting sand papers respectively having appropriate grit sizes for the grinding areas, and grinding the grinding areas to remove all the scratches; sequentially using three combinations of polishing agents and grinding materials to undertake polishing; and using an abrasive paste and a fourth grinding material to perform mirror-finishing. | 11-17-2011 |
| 20110312255 | METHOD FOR MULTIPLE CUTOFF MACHINING OF RARE EARTH MAGNET - A rare earth magnet block is cutoff machined into pieces by rotating a plurality of cutoff abrasive blades. Improvements are made by starting the machining operation from the upper surface of the magnet block downward, interrupting the machining operation, turning the magnet block upside down, placing the magnet block such that the cutoff grooves formed before and after the upside-down turning may be aligned with each other, and restarting the machining operation from the upper surface of the upside-down magnet block downward until the cutoff grooves formed before and after the upside-down turning merge with each other. | 12-22-2011 |
| 20120045974 | METHOD OF PRODUCING SUBSTRATE FOR MAGNETIC RECORDING MEDIA - There is provided a method of producing a substrate for magnetic recording media which is capable of efficiently removing alumina abrasive grains in the latter polishing step that have been stuck in the former polishing step during polishing of the substrate for magnetic recording media in which a NiP plating film has been formed on the surface of an Al alloy substrate,
| 02-23-2012 |
| 20120202406 | APPARATUS AND METHOD FOR SURFACE GRINDING AND EDGE TRIMMING WORKPIECES - An apparatus for performing both edge trimming and surface grinding includes two spindles for holding two workpieces, a bridge element laterally movable relative to the spindles, and two grinding wheels coupled to the bridge element. The apparatus may be a surface grinding apparatus that includes a system for enabling the surface grinding apparatus to additionally perform edge trimming. A method for processing the workpieces entails placing the two workpieces on the two spindles of the apparatus, directing the bridge element to move laterally to an edge trimming position to trim the outer edge of one workpiece using one of the grinding wheels, to move laterally to another edge trimming position to trim the outer edge of the other workpiece using one of the grinding wheels, and to move laterally to surface grinding positions to perform surface grinding on both of the workpieces using one or both of the grinding wheels. | 08-09-2012 |
| 20120309273 | HAND-POWERED POLISHING APPARATUS AND KIT FOR STAINLESS STEEL SINKS - A manual scratch repair kit is provided for manually repairing scratches in stainless steel sinks and includes a handgrip having an underside with hook and loop fasteners and a sandpaper element attachable to the handgrip, the sandpaper element having an example grit of 800. Two soft pads are provided for holding and applying abrasive. Two containers of diamond abrasive compound of different grits are provided and the soft pads are color-keyed to the diamond abrasive compounds and/or the containers. The handgrip is sized to fit in the palm of the hand and preferably is relatively soft and pliable for comfort. While preferably the soft pads are color-keyed to the diamond abrasive compounds and/or the containers, other forms of optional identification can be employed as desired, such as printing a large “1” on the first pad and a corresponding “1” on the container of diamond abrasive compound. Optionally, the abrasive compounds are different colors and at least part of the soft pads are different colors and color-keyed to the different color compounds. | 12-06-2012 |
| 20130059504 | METHOD FOR SURFACE-TREATING MIRROR-FINISH STAINLESS STEEL WORKPIECE - The present invention discloses a method for surface-treating a mirror-finish stainless steel workpiece, which comprises steps: dividing the surface of a mirror-finish stainless steel workpiece into different grinding areas according to the depths of the scratches; selecting sand papers respectively having appropriate grit sizes for the grinding areas, and grinding the grinding areas to remove all the scratches; sequentially using three combinations of polishing agents and grinding materials to undertake polishing; and using an abrasive paste and a fourth grinding material to perform mirror-finishing. | 03-07-2013 |
| 20130072093 | METHOD FOR THE SIMULTANEOUS DOUBLE-SIDE MATERIAL-REMOVING PROCESSING OF AT LEAST THREE WORKPIECES - A method for simultaneous double-side material-removing processing of at least three workpieces includes disposing the workpieces in a working gap between rotating upper and lower working disks of a double-side processing apparatus. The workpieces lie in freely movable fashion in respective openings in a guide cage and are moved under pressure in the working gap using the guide cage. Upon attaining a preselected target thickness of the workpieces, a deceleration process is initiated that includes reducing an angular velocity ωi(t) of a respective drive i of each of the upper working disk, lower working disk and guide cage to a standstill. The reducing is carried out such that ratios of the angular velocities ω | 03-21-2013 |
| 20130183888 | Slot Machining - A method for cutting a blade root retention slot in a turbine engine disk element includes forming a precursor slot in the element. The precursor slot has first and second sidewalls and a base. A rotating bit is passed through the precursor slot to machine the base. The bit rotates about an axis off-normal to a direction of passing. A cutting performance of the rotating bit is modeled reflecting a chip trapping intensity parameter and a heat intensity parameter. At least one parameter of the bit and its passing is selected so as to avoid tool loading where removed chips/swafs stick onto the bit. | 07-18-2013 |
| 20130231030 | DEVICES, SYSTEMS, AND METHODS FOR RECOVERY AND RECYCLING OF CARPET COMPONENTS - Devices, systems and methods for the recycling and recovery of carpet are disclosed herein. Devices, systems and methods for disassembling carpet into the various components used for carpet construction by abrasive removal and separation of components are also disclosed herein. | 09-05-2013 |
| 20140080382 | GRINDING APPARATUS AND METHOD FOR FABRICATION OF LIQUID CRYSTAL DISPLAY DEVICE - There is disclosed a grinding apparatus for fabrication of a liquid crystal display device that is adaptive for improving the adsorption defect of a substrate onto a substrate stage. A grinding apparatus for fabrication of a liquid crystal display device disclosed in the present invention includes a plurality of substrate stage configured to make a linearly bi-directional movement; first and second grinding parts disposed in a series at an area to which the substrate stage moves; first to third aligning parts disposed at both ends of the first and second grinding parts and therebetween; and first and second cleaning parts disposed between the first and second grinding parts and the first and second aligning parts so as to clean the substrate stage. | 03-20-2014 |
| 20140242885 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit. | 08-28-2014 |
| 20140273764 | LAPPING CARRIER HAVING HARD AND SOFT PROPERTIES, AND METHODS - A carrier for a slider row bar for a lapping process. The carrier has a mounting structure comprising a material configured to have a first modulus of at least 1,000,000 Pa at a first period of time and a second modulus of 500 Pa to 500,000 Pa at a second period of time subsequent to the first period. The change from the first modulus to the second modulus is due to an external stimulus on the material. | 09-18-2014 |
| 20140287659 | MACHINING METHOD AND MACHINING DEVICE OF COMPONENT - Machining of the present invention is machining of polishing work to be polished by movement of polishing sheet relative to work, in a state where polishing sheet is in contact with a surface of work to be polished. In the machining, work is arranged in contact with polishing sheet in a state where work is sandwiched between first simultaneous machining material with hardness lower than that of work, and second simultaneous machining material with hardness higher than that of work, and work is polished by relative movement of polishing sheet from first simultaneous machining material toward second simultaneous machining material. | 09-25-2014 |
| 20150017885 | METHOD FOR FORMING A WORKPIECE - A method of forming a workpiece having machinability rating not greater than a machinability rating of Inconel 718. The method may include removing material from the workpiece by moving at least one grinding tool relative to the workpiece and may be conducted at a specific grinding energy of not greater than about 7 Hp/in | 01-15-2015 |
| 20150298277 | APPARATUS AND METHOD FOR GRINDING COMPRESSION LINE SPRING - Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor ( | 10-22-2015 |
| 20150321308 | POLISHING APPARATUS AND METHOD THEREFOR - A polishing apparatus is provided with a machining head that is supported to freely move in two horizontal directions; driving devices that enables the machining head to move; a polishing jig that is supported by the machining head to freely move in a vertical direction; a polishing member that is mounted on a lower end portion of the polishing jig; an air cylinder polishing jig moving device that moves the polishing jig and is capable of pressing the polishing member against a tube support plate; and a drive motor that is capable of rotating the polishing jig, thus, simplification of the structure is made possible. | 11-12-2015 |
| 20150352413 | GOLF CLUB HEAD MANUFACTURING METHOD - A method for manufacturing golf club head includes: preparing a head blank for an iron type golf club head, the head blank having a recess serving as a measure of polishing or grinding at least in a portion of a sole part of the head blank; and polishing or grinding the head blank according to the recess. | 12-10-2015 |
| 20160096254 | SLOPED POLISHING PAD WITH HYBRID CLOTH AND FOAM SURFACE - Polishing pad for use with high-speed mechanical buffers or for use by hand. More specifically, a sloped polishing pad and methods of use for the polishing pad, the sloped polishing pad having a sloped foam pad, and having a cloth, a foam, or both attached to a top surface of the foam pad, with the cloth, the foam, or both covering part of the top surface of the sloped foam pad such that gaps in the coverage allow for the sloped foam pad and either the cloth, the foam, or both to touch a polishing surface at the same time. | 04-07-2016 |
| 20160137881 | POLISHING LIQUID FOR CMP, AND POLISHING METHOD - A polishing liquid for CMP, comprising: an abrasive grain including a cerium-based compound; a 4-pyrone-based compound; a polymer compound having an aromatic ring and a polyoxyalkylene chain; a cationic polymer; and water. | 05-19-2016 |
| 451058000 | Utilizing mounted rigid abrading tool only | 8 |
| 20090104855 | Method and apparatus for finishing a workpiece - A method for abrasive material removal that includes the steps of establishing an optimum force profile relating to the force or contact pressure applied by a processing tool on a workpiece. The actual force generated during the metal removal operation is monitored and compared to the optimum force profile. Based on the comparison of the actual force with the optimum force profile machine parameters are adjusted such that the actual force generated follows the established optimum force profile. | 04-23-2009 |
| 20090221217 | SOLAR PANEL EDGE DELETION MODULE - The present invention generally relates to an edge deletion module positioned within an automated solar cell fabrication line. The edge deletion module may include a grinding wheel device for removing material from edge regions of a solar cell device and cleaning the edge regions of the solar cell device after removing the material. The edge deletion module may also include an abrasive element, a portion of which is ground as it is periodically, laterally advanced toward the grinding wheel device. A controller is provided for controlling the operation and function of various facets of the module. | 09-03-2009 |
| 20090239451 | Automatic Shift Dual-Action Tool - Tools providing automatic, smooth shifting between random orbital and rotary motion by simply increasing or decreasing force applied are taught. Exemplar is a finishing tool switchable between grinding rotary action and random orbital sanding action without powering down and without any mechanical manipulation, made possible by having a clutch mechanism affixed directly to the spindle assembly, which also eliminates the need to dissemble the tool in order to change a backup pad, saving time and money. Direct relationship between the clutch and spindle eliminates need for a specialty pad allowing for use of a variety of backup pads, reducing the cost of replacement backup pads and increasing the functionality of the dual-function tool. An additional feature is that the drive head surface is circular and large enough to encompass the device's circular clutch plate, which means that the available friction surface area of the clutch plate is efficiently utilized. | 09-24-2009 |
| 20090291622 | ARRANGEMENT FOR GRINDING AND A METHOD THEREOF - T An improved grinding arrangement for grinding a required profile in a body is provided. The arrangement includes a body having at least one channel extending into the body and a grinding wheel adapted to grind the required profile in the side of the channel. In the setup the grinding wheel is arranged so that an axis of rotation of the grinding wheel forms an angle greater than 0° with a radial axis of the channel. A method of grinding a required profile in a body is also provided. | 11-26-2009 |
| 20150017886 | Method and Apparatus for Making V-Belt - The V-belt is produced with inwardly tapered sidewalls using an apparatus having at least one motorized cutting wheel having first axis of rotation and a moving anvil system with an anvil wheel having a second axis of rotation not parallel to the first axis. The anvil system is motorized and situated so the workpiece follows a U-shaped trajectory into the path of the cutting wheel. The circumferential gripping surface of the anvil wheel and circumferential cutting surface of the cutting wheel are geometrically arranged so that at the point of contact between workpiece and cutting wheel the respective surfaces define planes that intersect in an acute angle that defines the inwardly tapered sidewalls. | 01-15-2015 |
| 20150126096 | SYSTEM AND METHOD FOR CONTOURED PEEL GRINDING - A method for grinding out a contoured workpiece including providing a grinding wheel having a first abrasive work surface location and a second abrasive work surface location, the first abrasive work surface location having a first tangential radius and the second abrasive work surface location having a second tangential radius, the first and second tangential radii being different, grinding the workpiece at a first time with the first abrasive work surface location without the second abrasive work surface location performing grinding, and grinding the workpiece at a second time with the second abrasive work surface location without the first abrasive work surface location performing grinding. | 05-07-2015 |
| 20150147944 | DOUBLE-DISC GRINDING APPARATUS AND WORKPIECE DOUBLE-DISC GRINDING METHOD - The invention is directed to a double-disc grinding apparatus including: a rotatable ring holder configured to support a sheet workpiece along a circumferential direction from an outer circumference side of the workpiece; a pair of grinding wheels for grinding surfaces of the workpiece supported by the ring holder; and a hydrostatic bearing for supporting the ring holder without contact from both of a direction of a rotational axis of the ring holder and a direction perpendicular to the rotational axis by hydrostatic pressure of fluid supplied from both directions, wherein supply pressures at which the fluid is supplied from the direction of the rotational axis and from the direction perpendicular to the rotational axis can be independently controlled. The invention provides a double-disc grinding apparatus and a workpiece double-disc grinding method that can improve variation in nanotopography depending on the lot of workpieces or grinding wheels to obtain nanotopography stably. | 05-28-2015 |
| 20150352685 | COMPRESSION LINE SPRING GRINDING DEVICE AND GRINDING METHOD - Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor ( | 12-10-2015 |
