| Entries |
| Document | Title | Date |
|---|
| 20080233842 | DRESSER AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF DRESSING POLISHING PAD - A dresser adapted to a chemical mechanical polishing apparatus is used to perform dressing on a polishing pad for polishing a semiconductor wafer such that a circular-shaped support surface thereof is positioned opposite to and in contact with the polishing surface of the polishing pad. In the dresser, at least three polish retainers having band-like shapes are formed and elongated in radial directions from substantially the center of the support surface so as to form a plurality of sectorial regions. A plurality of parallel portions are formed in parallel with the polish retainer in each sectorial region. A plurality of band-shaped non-polish retainers are formed between the polish retainer and its parallel portion in each sectorial region. The dresser ensures adequate fuzziness of the polishing pad by way of dressing; hence, it is possible to maintain desired polishing performance of the polishing pad for a long time. | 09-25-2008 |
| 20080299875 | Equal sized spherical beads - A method of producing equal-sized spherical shaped beads of a wide range of materials is described. These beads are produced by forming the parent bead material into a liquid solution and by filling equal volume cells in a sheet with the liquid solution. The sheet cells establish the volumes of each of the cell mixture volumes which are then ejected from the cells by an impinging fluid. Surface tension forces acting on the ejected equal sized solution entities form them into spherical beads. The ejected beads are then subjected to a solidification environment which solidifies the spherical beads. The beads can be solid or porous or hollow and can also have bead coatings of multiple material layers. | 12-04-2008 |
| 20090017732 | METHOD AND APPARATUS FOR MICRO-MACHINING A SURFACE - An apparatus and method for micro-machining a surface of a workpiece having a complex surface profile including desired profile features and finer undesired profile features to be removed, including shaping a formable polishing tool using either the workpiece itself or a replica of the workpiece to have at least said desired profile features, and using said formable polishing tool to micro-machine said surface to remove said finer undesired profile features while maintaining said desired profile features. The formable polishing tool can be shaped to have at least said desired profile features by pressing the formable polishing tool against either the workpiece itself or the replica of the workpiece when the formable polishing tool is in a formable state, and the formable polishing tool can be used for micro-machining when the formable polishing tool is in a solid state. | 01-15-2009 |
| 20090036035 | APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD - Apparatus and methods for conditioning a polishing pad include a base, an arm pivotally coupled to the base and adapted to support a conditioning disk, and an actuator coupled to the base and the arm. The actuator is adapted to cause the arm to press the conditioning disk against the polishing pad with a linearly variable amount of force. A first force is produced with the actuator. The first force is scaled by a linearly variable amount to a second force that is applied to the polishing pad by a conditioning disk. Numerous other aspects are disclosed. | 02-05-2009 |
| 20090036036 | APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD - Apparatus and methods for conditioning a polishing pad are provided. An apparatus includes a base, an arm adapted to support a conditioning disk; and a drive mechanism coupled between the arm and the conditioning disk, wherein the drive mechanism is adapted to directly rotate the conditioning disk relative to the arm. Numerous other aspects are disclosed. | 02-05-2009 |
| 20090036037 | APPARATUS FOR CONDITIONING PROCESSING PADS - Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface. | 02-05-2009 |
| 20090047876 | Chemical mechanical polishing pad with controlled wetting - Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is between 0.01 and 0.75. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates. | 02-19-2009 |
| 20090061741 | ECMP POLISHING SEQUENCE TO IMPROVE PLANARITY AND DEFECT PERFORMANCE - A method for processing a substrate having a conductive layer disposed thereon is provided. The substrate is coupled with a planarizing head. The planarizing head is moved to a position above a polishing pad assembly. The planarizing pad is positioned relative to the polishing pad assembly without applying a voltage to the substrate. A first voltage is applied to the substrate for a first time period. A second voltage is applied to the substrate for a second time period in order to remove a portion of the conductive layer, wherein the second voltage is greater than the first voltage. In certain embodiments, applying a first voltage to the substrate further comprises forming a uniform passivation layer on the conductive layer. | 03-05-2009 |
| 20090075567 | POLISHING PAD CONDITIONER AND METHOD FOR CONDITIONING POLISHING PAD - A polishing pad conditioner is provided. The polishing pad includes a substrate, at least one surface-conditioning unit, and at least one groove-cleaning unit. The surface-conditioning unit and the groove-cleaning unit are both disposed on a surface of the substrate. In addition, the surface-conditioning unit is integrally formed with the groove-cleaning unit form. | 03-19-2009 |
| 20090093195 | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods - A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another. | 04-09-2009 |
| 20090156101 | POLISHING APPARATUS, POLISHING HEAD AND POLISHING METHOD - A polishing apparatus comprises a polishing plate ( | 06-18-2009 |
| 20090163121 | GRINDING MACHINE WITH A DEVICE FOR CONDITIONING A GRINDING WHEEL AND A METHOD OF CONDITIONING A GRINDING WHEEL - A grinding machine for grinding a workpiece comprises a machine frame, a bearing device provided on the machine frame and movable along guides, in which a cup-shaped grinding wheel is rotatably drivable about a grinding wheel axis and electrically insulated. The grinding wheel is electrically connected to a generator. The device for profile dressing, sharpening and cleaning the grinding wheel consists of a single cup-shaped electrode, which is drivable about its central axis and is placed on a slide, which allows a working gap to exist between the machining surface of the cup-shaped electrode and the annular abrasive surface. A spark erosion discharge occurs in the gap when a voltage is applied. The grinding wheel can thereby be optimally conditioned by electric discharge machining. | 06-25-2009 |
| 20090170407 | Pad Conditioner Dresser - Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life. Additionally, a method may include dressing the chemical mechanical polishing pad with the dresser; vibrating, in a direction substantially parallel to a working surface of the pad, a member selected from the pad, the dresser, a wafer being polished by the pad, or any combination thereof, to minimize a mechanical stress on the pad, dresser, wafer, or combination thereof; and varying the pressure and RPM between the pad and the dresser, including gradually increasing the pressure and/or the RPM between the pad and the dresser in a non-linear manner over time as the dresser is used, such that the dresser life is extended, wherein the pressure and the RPM is increased when the chemical mechanical polishing pad surface exhibits wear. | 07-02-2009 |
| 20090186561 | CMP Pad Dresser with Oriented Particles and Associated Methods - CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear. | 07-23-2009 |
| 20090203296 | Device and method for truing a machining wheel by means of a rotating truing tool as well as machine tool with a device of this kind - The invention relates to a device ( | 08-13-2009 |
| 20090215363 | CMP Pads and Method of Creating Voids In-Situ Therein - A method of creating pores in a CMP pad in-situ includes impregnating a first material with a second material to form a CMP pad. The second material can have a resistance to frictional erosion that is less than that of the first material. The CMP pad thus has two materials with differing frictional erosion resistances. The working surface of the CMP pad can be contacted to a wafer to be polished wherein the second material can be frictionally eroded during polishing. | 08-27-2009 |
| 20090221216 | Pad dresser, polishing device, and pad dressing method - Elastic member bundled by pencil band is mounted to the lower edge of support part. Elastic member is composed with tungsten wires which are 25 mm in the length and 0.15 mm in diameter bundled with every 30 wires in one bundle. The tip part of each element wire of elastic member contacts polishing pad with the tip end cut round and performs dressing of polishing pad. The wire size of the tip part of each element wire of elastic member is made to be fine and the cutting width on polishing pad is made to be narrow, and at the same time, the rigidity of elastic member is made to be enhanced by bundling each element wire of elastic member with pencil band, and a large pressure is made to be pressed to the fine tip part of each element wire. Therefore, the tip part of elastic member can give an effective incision depth to polishing pad. | 09-03-2009 |
| 20090258578 | POLISHING PAD AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad and method for making the same. In the invention, a liquid-state polymer material is directly formed on the surface of a base material, and then the liquid-state polymer material is solidified to form a flat grinding layer. Whereby, the polishing pad has high unity and flatness. The grinding layer has attenuated structures and a plurality of holes, thus increasing the storage ability of polishing particles distributed in a polishing liquid. In addition, the polishing pad has high compression ratio, so the polishing pad can compactly contact a polishing workpiece, and will not scratch the surface of the polishing workpiece scratched. Therefore, the polishing effect and quality will be improved. | 10-15-2009 |
| 20090280726 | TRUING DEVICE AND TRUING METHOD FOR GRINDING WHEEL - A truing apparatus for a grinding wheel is provided with a truing tool which is held so as to rotate, and the grinding wheel which is rotating is subjected to truing by the truing tool. The truing tool includes a peripheral surface truer having a truer surface formed on its rotating peripheral surface, and an end surface truer having a truer surface formed on its end surface in a direction of a rotation axis thereof. The rotation axis of the truing tool is arranged substantially perpendicularly to a rotation axis of the grinding wheel so that an end surface of the grinding wheel may be corrected with the peripheral surface truer, and a peripheral surface of the grinding wheel may be corrected with the end surface truer. | 11-12-2009 |
| 20100015894 | CMP by Controlling Polish Temperature - A method for manufacturing integrated circuits on a wafer includes providing a facility-supplied room temperature solution; controlling the temperature of the facility-supplied room temperature solution to a desired temperature set point to generate a rinse solution; and rinsing a polishing pad using the rinse solution. The wafer is then polished by means of a chemical mechanical polishing process. | 01-21-2010 |
| 20100035525 | IN-SITU PERFORMANCE PREDICTION OF PAD CONDITIONING DISK BY CLOSED LOOP TORQUE MONITORING - Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by controlling the rate of material removal from the polishing pad by the conditioning disk. The conditioning disk removes enough material so the polishing surface can properly process the wafers but does not remove any excess material. Preventing excess material removal extends the life of the polishing pad. During CMP processing, the controller receives data concerning the torque applied to the conditioning disk and the torque applied to the arm to sweep the conditioning disk across the polishing pad. Based upon the detected operating conditions, the system can predict the rate of material removal and adjust the forces applied to the conditioning disk so that the life of the polishing pad is optimized. | 02-11-2010 |
| 20100093263 | APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD - Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk to tilt while transmitting rotary motion from the drive mechanism to the conditioning disk. Numerous other aspects are disclosed. | 04-15-2010 |
| 20100105295 | POLISHING PAD SEASONING METHOD, SEASONING PLATE, AND SEMICONDUCTOR POLISHING DEVICE - A seasoning plate is placed on a polishing pad and performs seasoning of the polishing pad by abrading the polishing pad through the friction caused by rotation of the polishing pad. The seasoning plate includes: conditioners that abrade the polishing pad; a round flexible substrate that has the conditioners attached to the lower face thereof; an O-ring that is placed on the upper face of the flexible substrate, the O-ring forming a circle concentric with the flexible substrate; and a weight plate serving as a weight portion that is placed on the O-ring and applies weight for deforming the flexible substrate. | 04-29-2010 |
| 20100124871 | POLISH PAD CONDITIONING IN MECHANICAL POLISHING SYSTEMS - A mechanical polishing apparatus includes a polishing pad, at least one carrier head positioned over and off center relative to the polishing pad and configured for holding at least one substrate against the polishing pad within a first annular region of the polishing pad when the polishing pad is rotating. At least one conditioning head is positionable over and off center relative the polishing pad at a plurality of first positions and configured for applying a contacting surface of at least one conditioning pad against the polishing pad when the polishing pad is rotating, where the conditioning pad is applied to a second annular region of the polishing pad and moves between the plurality of first positions. In the apparatus, the diameter of the conditioning pad≦a difference between a radius of the polishing pad and a width of the first annular region. | 05-20-2010 |
| 20100130107 | METHOD AND APPARATUS FOR LINEAR PAD CONDITIONING - A method and apparatus for conditioning a polishing pad is described. The apparatus includes a base coupled to a platform, a first arm member having a first end coupled to the base, and a second arm member having a first end pivotably coupled to a second end of the first arm member and a conditioning disk coupled to a second end opposite the first end. The method includes rotating a polishing pad, urging a rotating conditioning disk against a polishing surface of the polishing pad, and moving the conditioning disk in a linear direction relative to the rotating polishing pad to perform a conditioning process. | 05-27-2010 |
| 20100159810 | High-rate polishing method - The invention provides a method for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The substrate is fixed within a carrier fixture having a channel-free surface. The method comprises securing the substrate in the carrier fixture with the channel-free surface adjacent and parallel to a polishing surface of the polishing pad. The polishing pad has multiple grooves with high-rate paths. The method includes applying polishing medium to the polishing pad adjacent the carrier fixture; and rotating the polishing pad and carrier fixture to polish the substrate with the polishing pad and the polishing medium wherein the channel-free surface of the carrier fixture presses against the polishing pad to impede flow of the polishing medium into the substrate and the high-rate groove paths traverse the carrier fixture to promote flow of the polishing medium to the substrate. | 06-24-2010 |
| 20100167630 | MULTI-AIR AQUA RESERVOIR MOIST SANDING SYSTEM - An abrasive disc includes a backing layer on a first major surface, a water-impermeable abrasive layer on a second major surface, and a water-absorbable, compressible, resilient, porous foam layer sandwiched in between the backing layer and the abrasive layer. The disc further includes a plurality of perforations. The disc is used to abrade a surface. Fluid is absorbed into the abrasive disc. The fluid is then released to the surface by compressing the abrasive disc against the surface in an abrading motion. The fluid is allowed to mix with and absorb surface swarf; and compression on the abrasive disc is released, reabsorbing the fluid and trapping swarf inside the disc. | 07-01-2010 |
| 20100190417 | APPARATUS FOR DRESSING A POLISHING PAD, CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD - An apparatus for dressing a polishing pad is described. The apparatus includes a dresser drive shaft which is rotatable and vertically movable, a dresser flange coupled to the dresser drive shaft and configured to secure a dressing member thereto, a spherical bearing provided in the dresser flange and configured to allow the dressing member to tilt with respect to the dresser drive shaft, and a spring mechanism configured to generate a force against a tilting motion of the dressing member. | 07-29-2010 |
| 20100190418 | LAPPING PLATE-CONDITIONING GRINDSTONE SEGMENT, LAPPING PLATE-CONDITIONING LAPPING MACHINE, AND METHOD FOR CONDITIONING LAPPING PLATE - In a lapping machine comprising a lapping plate and a conditioning carrier disposed thereon, the carrier being provided with bores for receiving conditioning grindstone segments, the lapping plate is polished and conditioned by cooperatively rotating the lapping plate and the carrier and feeding loose abrasive grains to the lapping plate. The conditioning grindstone segment of a shape of arcuated trapezoid having an included angle of 180°-90° is fitted in the carrier bore. | 07-29-2010 |
| 20100197204 | APPARATUSES AND METHODS FOR CONDITIONING POLISHING PADS USED IN POLISHING MICRO-DEVICE WORKPIECES - Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements projecting from the first surface. The member also includes a plurality of apertures configured to flow conditioning solution to the polishing pad. The apertures can extend from the first surface to a second surface opposite the first surface. The member can further include a manifold that is in fluid communication with the apertures. In another embodiment, a conditioner for conditioning the polishing pad includes an arm having at least one spray nozzle configured to spray conditioning solution onto the polishing pad and an end effector coupled to the arm. The end effector includes a first surface and a plurality of contact elements projecting from the first surface. | 08-05-2010 |
| 20100233940 | SYSTEMS AND METHODS FOR POLISHING A MAGNETIC DISK - A polishing system and associated methods are described for polishing a magnetic disk used in a disk drive system. The polishing system includes a polishing film that is used to polish the magnetic disk. The polishing system also includes an actuator operable to move the polishing film across a surface of the magnetic disk to polish the magnetic disk. The polishing system also includes a pad having at least one protrusion extending from a surface of the pad. The protrusion is configured to contact the polishing film and press the polishing film against the magnetic disk. The protrusion is operable to compress to about the surface of the pad when in contact with the polishing film. Once polishing is complete, the pad retracts from the polishing film and the protrusion extends from the pad, reducing the adhesion force between the pad and the polishing film. | 09-16-2010 |
| 20100240285 | POLISHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A polishing apparatus includes: a wafer polishing unit including a polishing surface plate, an abrasive supply part supplying an abrasive to a polishing pad placed on the polishing surface plate, and a wafer holding part holding a semiconductor wafer; and a dressing unit including a dresser. The dresser has a pellet-shaped grindstone with abrasive particles fixed to a surface thereof. The pellet-shaped grindstone is divided into a first region along an outer peripheral portion thereof and a second region located inside the first region. A chipping preventing portion for the abrasive particles is provided in the first region. | 09-23-2010 |
| 20100248595 | ABRASIVE TOOL FOR USE AS A CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER - An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate. | 09-30-2010 |
| 20100248596 | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods - The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP pad and the cutting elements using control elements. The degree of contact is established through placement of the control elements relative to the cutting elements. | 09-30-2010 |
| 20100248597 | EQUIPMENT AND METHOD FOR CLEANING POLISHING CLOTH - The equipment for cleaning polishing cloth is capable of increasing pressure of washing water received by the polishing cloth, securely removing deposits from the polishing cloth and improving polishing efficiency. The equipment is used in a polishing apparatus, in which a work piece is pressed onto the polishing cloth adhered on a polishing plate and the work piece is relatively moved with respect to the polishing plate with supplying slurry to the polishing cloth so as to polish the work piece. The equipment comprises a nozzle unit having a nozzle capable of spraying high-pressure washing water toward the polishing cloth so as to clean the polishing cloth. The nozzle is a straight nozzle capable of linearly spraying the washing water and perpendicularly spraying the washing water with respect to the polishing cloth. | 09-30-2010 |
| 20100273401 | Polishing apparatus and polishing method - A polishing apparatus includes a polishing table with a polishing pad at an upper surface, and a conditioning disc carrying out conditioning of the polishing pad, and a moving mechanism (constructed, for example, from a swing arm) capable of moving the conditioning disc to a standby position above the polishing pad, and a spraying mechanism (constructed, for example, from a washing water nozzle) that sprays liquid to the conditioning disc positioned at the standby position so as to wash or wet the conditioning disc. | 10-28-2010 |
| 20100273402 | CMP conditioner and method of manufacturing the same - A chemical mechanical polishing (CMP) conditioner has diamond abrasive grits adhered to a conditioning surface which faces and makes contact with an abrasive pad of a CMP machine. The diamond abrasive grit is adhered to the CMP conditioner body by a metal plating layer, and the CMP conditioner body is formed of resin. | 10-28-2010 |
| 20100291840 | SYSTEM AND METHOD FOR CONDITIONING CHEMICAL MECHANICAL POLISHING APPARATUS USING MULTIPLE CONDITIONING DISKS - A chemical mechanical polishing (CMP) apparatus provides for polishing semiconductor wafers and for conditioning the polishing pad of the CMP apparatus using multiple conditioning disks at the same time. The conditioning disks may be moved together or independently along the surface of polishing pad to condition the entire surface of the rotating polishing pad. | 11-18-2010 |
| 20100291841 | Methods and Systems for Water Jet Assisted CMP Processing - Methods and systems for removing dirt and/or debris from a CMP pad surface during CMP pad processing are provided. In one aspect, a method for removing debris from a CMP pad surface during CMP processing can include rotating a CMP pad having a polishing surface, and pressing a CMP pad dresser into the polishing surface of the CMP pad, the CMP pad dresser having a plurality of superabrasive particles coupled thereto and oriented toward the CMP pad. The method can further include spraying a jet of liquid onto the polishing surface of the CMP pad with sufficient force to dislodge debris from the polishing surface of the CMP pad. | 11-18-2010 |
| 20100330886 | Corrosion-Resistant CMP Conditioning Tools and Methods for Making and Using Same - An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad. | 12-30-2010 |
| 20110003538 | Pad Conditioner Dresser - Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life. Additionally, a method may include dressing the chemical mechanical polishing pad with the dresser; vibrating, in a direction substantially parallel to a working surface of the pad, a member selected from the pad, the dresser, a wafer being polished by the pad, or any combination thereof, to minimize a mechanical stress on the pad, dresser, wafer, or combination thereof; and varying the pressure and RPM between the pad and the dresser, including gradually increasing the pressure and/or the RPM between the pad and the dresser in a non-linear manner over time as the dresser is used, such that the dresser life is extended, wherein the pressure and the RPM is increased when the chemical mechanical polishing pad surface exhibits wear. | 01-06-2011 |
| 20110034112 | POLISHING APPARATUS, POLISHING AUXILIARY APPARATUS AND POLISHING METHOD - A polishing apparatus, a polishing method and a polishing auxiliary apparatus which are able to suppress clogging of the rotating grindstone and polish the work while suppressing the damage thereof are provided. A polishing apparatus | 02-10-2011 |
| 20110039479 | DRESSING TOOL - A dressing tool ( | 02-17-2011 |
| 20110065365 | GRINDING METHOD AND GRINDING APPARATUS FOR POLISHING PAD FOR USE IN DOUBLE-SIDE POLISHING DEVICE - The present invention provides an apparatus capable of uniformly grinding an polishing pad. Further, the present invention provides a method of grinding an polishing pad by using the grinding apparatus. Specifically, the present invention provides a method of, in a double-side polishing device having a carrier for holding a work, a pair of upper and lower rotating surface plates disposed to face each other to sandwich the carrier therebetween, and the polishing pad provided on each of the facing surfaces of the rotating surface plates for polishing the work, grinding the polishing pad, the method comprising the steps of: separating the upper and the lower rotating surface plates away from each other when the polishing pads on the upper and the lower rotating surface plates are to be ground; inserting, between the separated upper and lower rotating surface plates, an arm having at a front end portion thereof a grinding plate of a diameter smaller than those of the rotating surface plates; and pressing the grinding plate against the polishing pad of each of the rotating surface plates and rotating the grinding plate, thereby grinding the polishing pad of each of the rotating surface plates. The present invention also provides an apparatus which enables the grinding method described above. | 03-17-2011 |
| 20110097977 | MULTIPLE-SIDED CMP PAD CONDITIONING DISK - A conditioning tool for restoring a used CMP polishing pad to an operable condition. The tool includes a base that attaches to a driven machine and has a surface from which a shoulder protrudes that receives a peripheral edge of a disk. The disk has two opposing surfaces, each of which is substantially planar and has abrasive mounted thereon. The disk's peripheral edge is held in place between the base shoulder and a ring that has a shoulder that is complementary to the disk's peripheral edge. The ring is fastened to the base with the abrasive of the first disk surface protruding through an aperture in the ring, and the opposing disk surface spaced from the base's surface. After the disk's first surface is worn, the disk can be turned around to expose the opposite surface's abrasive to a CMP pad. | 04-28-2011 |
| 20110143640 | PAD CONDITIONER AND METHOD - A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface. | 06-16-2011 |
| 20110159787 | GEAR GRINDING MACHINE AND METHOD OF DRESSING A GRINDING TOOL - A gear grinding machine, whose tool spindle ( | 06-30-2011 |
| 20110171885 | METHOD FOR SHAPE MODIFICATION OF POLISHING PAD - A polishing pad shape measured by a polishing pad shape measuring apparatus is modified into a target shape of a polishing pad by using a dressing tool so that a wafer has a desired surface shape. The invention is a method for shape modification of a polishing pad | 07-14-2011 |
| 20110183584 | METHOD AND APPARATUS FOR CONDITIONING A CMP PAD - The present invention relates to a method and apparatus for conditioning a polishing pad used in chemical mechanical polishing in which a consistent pressing force can be provided between an abrasive conditioning member and the polishing pad. Specifically, a moveable weight member is provided that can be selectively moved along a length of a support arm in the conditioning apparatus. The position of the weight member relative to the position at which the abrasive conditioning member is mounted alters the resultant pressing force in view of the change in moment created. In a particular example, the positioning of the weight member can be automatically controlled using a drive mechanism controlled by a control unit, such as a computer. In a more particular example, the positioning of the weight member can be dynamically controlled if the control unit receives an external feedback upon which its control of the weight member position is based, such as a detected value of the pressing force exerted by the abrasive conditioning member. Finally, if the apparatus is appropriately arranged to permit the weight member to travel to an opposite side of the location at which the support arm is mounted from the abrasive conditioning member, then a “negative pressing force” can be generated, such that effective pressing forces less than the resting weight of the pad conditioning apparatus can be realized. | 07-28-2011 |
| 20110195640 | APPLYING DIFFERENT PRESSURES THROUGH SUB-PAD TO FIXED ABRASIVE CMP PAD - A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmission of the different pressures therethrough; a fixed abrasive pad positioned on the sub-pad; and a pressure-creating system sealingly coupled to the platen for creating a different pressure in the at least two pressure zones, wherein the different pressures create topography on the fixed abrasive pad. A sub-pad and related method are also provided. | 08-11-2011 |
| 20110201260 | Methods and Systems for Retaining Grinding Efficiency During Backgrinding of Through-Via Substrates - Methods and systems for retaining grinding efficiency during a backgrinding process such as, for example, backgrinding of a through-via substrate such as an embedded through silicon via wafer. A grinding fluid may include a chemical agent that is configured to remove accumulated materials from the grinding wheel. | 08-18-2011 |
| 20110212670 | METHODS OF BONDING SUPERABRASIVE PARTICLES IN AN ORGANIC MATRIX - Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The method may include securing a plurality of superabrasive particles in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to abrade a work piece. As an example, the arrangement of the plurality of superabrasive particles may be configured to uniformly distribute frictional forces across substantially each superabrasive particle. | 09-01-2011 |
| 20110244763 | SIDE PAD DESIGN FOR EDGE PEDESTAL - A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning device, the extension device includes a body that is movable relative to the polishing pad, and a sacrificial pad comprising a polishing material coupled to a mounting surface of the body. | 10-06-2011 |
| 20110244764 | CHEMICAL-MECHANICAL POLISHING PAD CONDITIONING SYSTEM - Polishing pad conditioning system. The system includes a first rotatable platen supporting a polishing pad containing asperities having a radius of curvature. A second rotatable platen supports a disk of bulk material having holes therethrough, the second rotatable platen supported for translation as well as rotation. Means are provided for pushing the polishing pad and bulk material into contact at an interface during rotation and translation and means are provided for passing a slurry through the holes in the bulk material to the interface whereby the radius of curvature of the pad asperities is increased. Water may be delivered to the bulk material for cooling. A process for conditioning a polishing pad is also disclosed. | 10-06-2011 |
| 20110256812 | CLOSED-LOOP CONTROL FOR IMPROVED POLISHING PAD PROFILES - Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs. | 10-20-2011 |
| 20110275288 | CMP PAD DRESSERS WITH HYBRIDIZED CONDITIONING AND RELATED METHODS - The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, for example, a CMP pad conditioner is provided. Such a conditioner can include a support matrix, and a plurality of smooth superabrasive particles disposed in the support matrix, where the smooth superabrasive particles are operable to cut large asperities in a CMP pad. The conditioner also includes a plurality of rough superabrasive particles disposed in the support matrix, where the rough superabrasive particles operable to cut slurry channels on the large asperities, and wherein the slurry channels are cut in such a way as to facilitate slurry movement across the large asperities during a CMP polishing process. | 11-10-2011 |
| 20110275289 | CONDITIONER OF CHEMICAL MECHANICAL POLISHING APPARATUS - Provided are a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof. The conditioner includes a disk holder, a piston rod, a housing, and a load sensor. The disk holder secures a conditioning disk that finely cuts a surface of the platen pad. The piston rod delivers a normal force to the disk holder. The housing covers at least a portion of the piston rod. The load sensor is installed to receive the normal force that the piston rod delivers to the piston rod and measuring the normal force. | 11-10-2011 |
| 20110275290 | INTERNAL GEAR GRINDING MACHINE AND DRESSING METHOD FOR BARREL-SHAPED THREADED TOOL - An object is to provide an internal gear grinding machine and a dressing method for a barrel-shaped threaded tool which make it possible to achieve space savings and reduce the size of a machine by simplifying dressing operation. To achieve the object, an internal gear grinding machine for use in grinding a workpiece (W) by synchronously rotating the workpiece (W) and a barrel-shaped threaded grinding wheel ( | 11-10-2011 |
| 20110294404 | Tunable Polish Rates By Varying Dissolved Oxygen Content - A method and system for tunable removal rates and selectivity of materials during chemical-mechanical polishing using a chemical slurry or solution with increased dissolved oxygen content. The slurry can optionally include additives to improve removal rate and/or selectivity. Further selectivity can be obtained by varying the concentration and type of abrasives in the slurry, using lower operating pressure, using different pads, or using other additives in the dispersion at specific pH values. | 12-01-2011 |
| 20110300782 | APPARATUSES AND METHODS FOR CONDITIONING POLISHING PADS USED IN POLISHING MICRO-DEVICE WORKPIECES - Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements projecting from the first surface. The member also includes a plurality of apertures configured to flow conditioning solution to the polishing pad. The apertures can extend from the first surface to a second surface opposite the first surface. The member can further include a manifold that is in fluid communication with the apertures. In another embodiment, a conditioner for conditioning the polishing pad includes an arm having at least one spray nozzle configured to spray conditioning solution onto the polishing pad and an end effector coupled to the arm. The end effector includes a first surface and a plurality of contact elements projecting from the first surface. | 12-08-2011 |
| 20110312254 | METHOD AND APPARATUS FOR DRESSING POLISHING PAD - The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has been used to polish a surface of a work by pressing the work onto the polishing pad fixed on a polishing plate with supplying slurry thereto, by using a grind stone, comprises the steps of: cleaning the polishing pad by supplying high-pressure cleaning water to the polishing pad; and dressing the polishing pad by moving a dressing grind stone, in the radial direction of the polishing pad, along a surface profile thereof, while performing the cleaning step. | 12-22-2011 |
| 20110318997 | APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD - Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk to tilt while transmitting rotary motion from the drive mechanism to the conditioning disk. Numerous other aspects are disclosed. | 12-29-2011 |
| 20120003903 | Method of Regenerating a Polishing Pad Using a Polishing Pad Sub Plate - A method for use of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered, makes possible the convenient, effective and practical regeneration of polishing pads using a reforming tool. | 01-05-2012 |
| 20120015589 | CATHODICALLY-PROTECTED PAD CONDITIONER AND METHOD OF USE - A cathodically-protected pad conditioner for chemical mechanical planarization includes: an abrasive member including a metallic substrate, a support carrier, and an anode affixed to the peripheral edge of the support carrier. A cathodic protection circuit is configured to provide a cathodic protection current from the anode to the abrasive member if contacted with an electrolyte solution. A method of using the cathodically-protected pad conditioner is also disclosed. | 01-19-2012 |
| 20120100787 | CMP Pad Dresser with Oriented Particles and Associated Methods - CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear. | 04-26-2012 |
| 20120122377 | Abrasive Tool with Flat and Consistent Surface Topography for Conditioning a CMP Pad and Method for Making - An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 μm/m-° C. to about 5.0 μm/m-° C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond. | 05-17-2012 |
| 20120142258 | Polishing Composition and Polishing Method Using The Same - A polishing composition contains at least abrasive grains and water and is used in polishing an object to be polished. The abrasive grains are selected so as to satisfy the relationship X1×Y1≦0 and the relationship X2×Y2>0, where X1 [mV] represents the zeta potential of the abrasive grains measured during polishing of the object by using the polishing composition, Y1 [mV] represents the zeta potential of the object measured during polishing of the object by using the polishing composition, X2 [mV] represents the zeta potential of the abrasive grains measured during washing of the object after polishing, and Y2 [mV] represents the zeta potential of the object measured during washing of the object after polishing. The abrasive grains are preferably of silicon oxide, aluminum oxide, cerium oxide, zirconium oxide, silicon carbide, or diamond. The object is preferably of a nickel-containing alloy, silicon oxide, or aluminum oxide. | 06-07-2012 |
| 20120164922 | METHOD FOR CLEANING A POLISHING PAD - A method for cleaning a polishing pad includes dispensing a first amount of deionized water on the polishing pad; cleaning the polishing pad with an acidity/alkalinity solution after dispensing the first amount of deionized water on the polishing pad; rinsing the polishing pad with a second amount of deionized water after cleaning the polishing pad with the acidity/alkalinity solution; removing the acidity/alkalinity solution from the polishing pad. In a subsequent CMP process, the method includes polishing a GST material device for obtaining an improved performance of the GST material device. | 06-28-2012 |
| 20120164923 | POLISHING METHOD - A polishing method is disclosed, which includes: conditioning a polishing pad, after polishing metal material of a previous wafer; spraying organic acid solution to the polishing pad; spraying deionized water to the polishing pad; performing a water-removing treatment on the polishing pad; and spraying polishing liquid to the polishing pad and polishing metal material of a next wafer. The method can prevent scratches on the surface of metal material of wafers and improve yield rate. | 06-28-2012 |
| 20120171935 | CMP PAD Conditioning Tool - The present disclosure provides a CMP pad conditioning tool with at least one integral abrasive protrusion. The present disclosure further provides a method for preparing this CMP pad conditioning tool, along with a method for using said tool to condition a CMP pad. | 07-05-2012 |
| 20120196514 | METHODS AND DEVICES FOR ENHANCING CHEMICAL MECHANICAL POLISHING PAD PROCESSES - The present invention discloses a CMP device and methods that are capable of improving CMP processing through incorporation of vibration sources which produce vibrations in a direction substantially parallel to the working surface of the CMP pad. The CMP device includes a CMP pad dresser. Such a method can include steps of vibrating a CMP pad, CMP pad dresser, or wafer in a direction substantially parallel to a working surface of the CMP pad and engaging the CMP pad dresser with a working surface of a CMP pad The results of vibrating the superabrasive particles can provide benefits to both the CMP pad and dresser, according to several aspects disclosed herein. | 08-02-2012 |
| 20120225611 | ABRASIVE WHEELS AND METHODS FOR MAKING AND USING SAME - Bonded abrasive articles and in particular organic bonded depressed center wheels with one or more reinforcements have reduced stiffness in comparison to conventional counterparts. Techniques for producing and using such wheels are described. In one example, a method for reducing the stiffness of an organically bonded abrasive wheel includes applying to a raised hub region of a reinforced depressed center wheel a force effective to irreversibly decrease the stiffness of said wheel. | 09-06-2012 |
| 20120225612 | Method of Manufacture of Constant Groove Depth Pads - Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad. | 09-06-2012 |
| 20120264356 | SYSTEMS AND METHODS FOR SHARPENING CUTTING BLADES - A method of sharpening blades of a hair cutting device includes providing a sharpening composition in substantially crystalline form, activating a hair cutting device, submerging a working end of the hair cutting device at least partially into the sharpening composition, and viewing the sharpening composition. Sharpening is complete when the sharpening composition is substantially transformed to powder form. | 10-18-2012 |
| 20120270477 | MEASUREMENT OF PAD THICKNESS AND CONTROL OF CONDITIONING - A conditioning process includes rotating a polishing pad about an axis of rotation, conditioning the polishing pad by sweeping an abrasive disk in a path across a surface of the polishing pad between an inner radial distance from the axis of rotation and an outer radial distance from the axis of rotation, sweeping a sensor across the polishing pad while conditioning the polishing pad, measuring a thickness of the polishing pad at a plurality of positions between the inner radial distance and the outer radial distance with the sensor, and adjusting at least one of a dwell time or a pressure of the abrasive disk against the polishing pad for a portion of the path based on measurements of the thickness by the sensor such that the polishing pad wears to a more uniform thickness than without such adjustment. | 10-25-2012 |
| 20120302141 | QUALITY MULTI-SPECTRAL ZINC SULFIDE - Low scatter water clear zinc sulfide with reduced metal contamination is prepared by coating a chuck which holds zinc sulfide and machining the zinc sulfide with uncoated particles. An inert foil is cleaned with an acid cleaning method and also cleaning the zinc sulfide. The zinc sulfide is wrapped in the inert foil and then treated by a HIP process to provide a low scatter water-clear zinc sulfide. The low scatter water-clear zinc sulfide may be used in articles such as windows and domes. | 11-29-2012 |
| 20120315829 | METHOD AND APPARATUS FOR CONDITIONING A POLISHING PAD - A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad. | 12-13-2012 |
| 20120329371 | SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND SUBSTRATE - The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains include a tetravalent metal element hydroxide, and produce a liquid phase with a nonvolatile content of 500 ppm or greater when an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass % has been centrifuged for 50 minutes at a centrifugal acceleration of 1.59×10 | 12-27-2012 |
| 20130059503 | METHOD OF AND APPARATUS FOR CMP PAD CONDITIONING - A chemical mechanical polishing (CMP) apparatus is provided that includes a conditioning disc for conditioning a polishing pad of the CMP apparatus. The conditioning disc includes a plurality of portions of subsystem discs. The portions may be regions of the disc that are concentric. Each portion of the disc is operable to rotate at a different angular velocity. In some embodiments, a different applied loading is provided to each of the portions of the disc in addition to or in lieu of the different angular velocities. | 03-07-2013 |
| 20130065492 | GRINDING WHEEL DRESSING SYSTEM - A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring about an offset axis, which is offset from the central axis. The dressing ring includes a contact surface generally normal to the offset axis and adapted to remove dull CBN particles from a substantially planar grinding surface of a grinding wheel that comes into contact with the contact surface. | 03-14-2013 |
| 20130130598 | METHOD FOR DRESSING THREADED GRINDING STONE FOR INTERNAL GEAR GRINDING - Disclosed is a method for dressing a threaded grinding stone for internal gear grinding, by which a threaded grinding stone for grinding an internal gear can be dressed with a high degree of accuracy by using a dressing gear that has been produced with a high degree of accuracy. In a state in which a barrel-shaped threaded grinding stone ( | 05-23-2013 |
| 20130165023 | DUAL DRESSING SYSTEM FOR CMP PADS AND ASSOCIATED METHODS - Dual dressing systems for conditioning CMP pads, including associated methods, are provided. In one aspect, for example, a method of dressing a CMP pad can include applying a deglazing dresser to a working surface of a CMP pad, deglazing the working surface of the CMP pad with the deglazing dresser, applying an asperity-forming dresser to the working surface of the CMP pad, and forming asperities in the working surface of the CMP pad with the asperity-forming dresser. | 06-27-2013 |
| 20130189906 | METHOD AND APPARATUS FOR CMP CONDITIONING - A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface. | 07-25-2013 |
| 20130210323 | CMP Pad Cleaning Apparatus - The present disclosure relates to a two-phase cleaning element that enhances polishing pad cleaning so as to prevent wafer scratches and contamination in chemical mechanical polishing (CMP) processes. In some embodiments, the two-phase pad cleaning element comprises a first cleaning element and a second cleaning element configured to successively operate upon a section of a CMP polishing pad. The first cleaning element comprises a megasonic cleaning jet configured to utilize cavitation energy to dislodge particles embedded in the CMP polishing pad without damaging the surface of the polishing pad. The second cleaning element is configured to apply a high pressure mist, comprising two fluids, to remove by-products from the CMP polishing pad. By using megasonic cleaning to dislodge embedded particles a two-fluid mist to flush away by-products (e.g., including the dislodged embedded particles), the two-phase pad cleaning element enhances polishing pad cleaning. | 08-15-2013 |
| 20130217308 | SELF-SHARPENING GRITS AND ASSOCIATED METHODS - Polycrystalline grits and methods of making grits which allow for self-sharpening are provided. In one aspect, for example, a method of sharpening a superabrasive cutting element during cutting can include abrading a self-sharpening superabrasive particle against a work piece to facilitate dulling of a cutting surface of the superabrasive particle, wherein the superabrasive particle includes a superabrasive material and a catalyst material, the catalyst material being located within inclusions in the superabrasive particle. The method can further include interacting the catalyst material and the superabrasive material to cause microfracturing of the superabrasive particle to expose a new cutting surface. | 08-22-2013 |
| 20130260651 | APPARATUS AND METHOD FOR POLISHING AN EDGE OF AN ARTICLE USING MAGNETORHEOLOGICAL (MR) FLUID - Disclosed is a method and apparatus for polishing an edge of an article involving providing at least one carrier including: first and second opposing surfaces defining a groove, the first and second opposing surfaces being spaced apart in a first direction to receive the edge; and magnetic field generator configured to provide a magnetic field in the groove to stiffen magnetorheological (MR) fluid disposed in the groove to provide at least one polishing zone; receiving the edge in the polishing zone; and driving relative motion between the at least one carrier and the edge in a second direction substantially transverse to the first direction. | 10-03-2013 |
| 20130295820 | GRINDING WHEEL DRESSING SYSTEM - A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring about an offset axis, which is offset from the central axis. The dressing ring includes a contact surface generally normal to the offset axis and adapted to remove dull CBN particles from a substantially planar grinding surface of a grinding wheel that comes into contact with the contact surface. | 11-07-2013 |
| 20130303056 | CMP PAD DRESSERS WITH HYBRIDIZED ABRASIVE SURFACE AND RELATED METHODS - A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another. | 11-14-2013 |
| 20130331005 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - According to one embodiment, a semiconductor device manufacturing method comprises conditioning a polishing pad by pressing a dresser against a surface of the polishing pad while keeping a surface temperature of the polishing pad at 40° C. or higher, and chemically mechanically polishing a polishing target film formed on a semiconductor substrate by pressing a surface of the polishing target film against the surface of the polishing pad having a negative Rsk value. | 12-12-2013 |
| 20140004775 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 01-02-2014 |
| 20140024297 | METHODS OF CONDITIONING A PLANARIZING PAD - Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad. | 01-23-2014 |
| 20140030961 | Method for chemical mechanical polishing layer pretexturing - A method for pretexturing a polishing surface of a chemical mechanical polishing layer is provided. | 01-30-2014 |
| 20140065931 | METHOD OF MONITORING A DRESSING PROCESS AND POLISHING APPARATUS - A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient. | 03-06-2014 |
| 20140099868 | CMP PAD DRESSER HAVING LEVELED TIPS AND ASSOCIATED METHODS - CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a method can include pressing a CMP pad dresser against a CMP pad, where the dresser includes a monolayer of a plurality of superabrasive particles protruding from a matrix layer. The difference in protrusion distance between the highest protruding tip and the second highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 10 microns and the difference in protrusion distance between the highest 10 protruding tips of the monolayer of superabrasive particles are within about 20 microns or less. The method can further include rotating the dresser against the CMP pad such that asperities are cut into the CMP pad having a maximum cutting depth of about 60 microns. | 04-10-2014 |
| 20140106650 | Apparatus and method for surface treatment of objects - An apparatus includes an injection part, a transfer part, a pressure supply part, a collision part and an emission part. An object is injected through the injection part. The transfer part is connected to the injection part, and bended at a plurality of points thereof. The object passes through the transfer part. The pressure supply part is connected to the transfer part and supplies a pressure into the transfer part to move the object. The collision part collides with the object moving in the transfer part to treat a surface of the object. The emission part is connected to the transfer part, and the object having the treated surface is emitted through the emission part. | 04-17-2014 |
| 20140120807 | CMP PAD CONDITIONERS WITH MOSAIC ABRASIVE SEGMENTS AND ASSOCIATED METHODS - A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another. | 05-01-2014 |
| 20140120808 | DRESSING METHOD, METHOD OF DETERMINING DRESSING CONDITIONS, PROGRAM FOR DETERMINING DRESSING CONDITIONS, AND POLISHING APPARATUS - A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member. | 05-01-2014 |
| 20140154956 | Pad Conditioning and Wafer Retaining Ring and Manufacturing Method Thereof - The present invention relates to a wafer retaining ring used in a chemical mechanical polishing process (CMP) for semiconductor device manufacturing, and in particular, to a pad conditioning and wafer retaining ring designed to prevent a wafer from slipping during the CMP process and, simultaneously condition a pad uniformly, and to a manufacturing method thereof. | 06-05-2014 |
| 20140162535 | SANDING DISK ALIGNMENT TOOL - A sanding disk alignment tool for aligning a sanding disk having a plurality of dust collection holes to a sander platen having a cooperative plurality of holes is disclosed with a method of use. The tool includes a base member having at least two pins sized and positioned for cooperative insertion into the pluralities of dust collection holes extending from a surface thereof. The method includes the steps of inserting the pins through two of the dust collection holes in the sanding disk from the abrasive side, bending the sanding disk around the tool, inserting the pins into through two of the plurality of dust collection holes in the sander platen and advancing the tool and disk to engage the platen. Once initially engaged to the platen, the bend in the disk is released and the sides of the disk are laid down onto the platen, after which the tool is removed. | 06-12-2014 |
| 20140162536 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position. | 06-12-2014 |
| 20140170939 | METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SIDE GRINDING APPARATUS - A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpiece includes providing at least one trimming apparatus including a trimming disk, a plurality of trimming bodies and an outer toothing. The upper and lower working disks are rotated. The trimming apparatus is moved between the rotating working disks using a rolling apparatus and the outer toothing on cycloidal paths relative to working layers of the working disks. The working layers and the trimming body are brought into contact so as to release abrasive substances from the trimming bodies and so as to effect material removal from the working layers. The direction of the drives of the grinding apparatus is changed at least twice during trimming. | 06-19-2014 |
| 20140179202 | GRINDING METHOD - A work surface is ground by moving a grinding wheel, on an outer periphery of which a helical dressed groove having no intersection is formed, in a first direction being tilted with respect to a forward direction. Then, the work surface is ground by moving the grinding wheel in a second direction which is tilted with respect to a backward direction. When the grinding wheel is virtually moved for grinding in the forward direction, an extending direction of a virtual grinding trace formed by the dressed groove transcribed and the first direction are tilted in mutually opposite directions with respect to the forward direction. An absolute value of a tilt angle of the first direction is smaller than that of the extending direction of the virtual grinding trace. Rotation directions from the forward direction to the first direction and from the backward direction to the second direction are opposite. | 06-26-2014 |
| 20140199921 | METHOD FOR MANUFACTURING SCREW-SHAPED TOOL - A method for manufacturing a screw-shaped tool for grinding a face gear with high precision. The tool is formed in such a manner that the diameter thereof gradually increases from an axial end to an intermediate section in the axial direction, and is used for cutting a face gear. The method includes setting up, on the basis of a prescribed pinion which is to mesh with the face gear to be machined, a virtual gear that is to mesh with the prescribed pinion, and has a greater number of teeth than the prescribed pinion; setting up, on the basis of the virtual gear, a virtual inner gear which has the same number of teeth as the virtual gear, said teeth being on the inside; and setting up, on the basis of the virtual inner gear, a screw-shaped grindstone having various elements that are used for cutting the virtual inner gear. | 07-17-2014 |
| 20140206263 | METHODS AND APPARATUS FOR CONDITIONING OF CHEMICAL MECHANICAL POLISHING PADS - A method and apparatus for conditioning a polishing pad is provided. In one embodiment, a pad conditioning device for a substrate polishing process is provided. The pad conditioning device includes an optical device coupled to a portion of a polishing station adjacent a polishing pad, the optical device comprising a laser emitter adapted to emit a beam toward a polishing surface of the polishing pad, the beam having a wavelength range that is substantially non-reactive with a polishing fluid utilized in the polishing process, but is reactive with the polishing pad. | 07-24-2014 |
| 20140213157 | POLISHING METHOD AND APPARATUS - A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process. | 07-31-2014 |
| 20140235143 | METHOD FOR CONDITIONING POLISHING PADS FOR THE SIMULTANEOUS DOUBLE-SIDE POLISHING OF SEMICONDUCTOR WAFERS - A method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafer uses a double-side polishing device. The device has an annular lower polishing plate and an annular upper polishing plate, each covered with a polishing pad, as well as a rolling device for carrier disks. The method for conditioning polishing pads includes disposing at least one conditioning tool having external teeth and at least one spacer having external teeth in a working gap formed between the first and second polishing pad, where the thickness of at least one of the conditioning tools differs from the thickness of at least one of the spacers. At least one conditioning tool and one spacer are set, simultaneously, in a revolving movement about the axis of the rolling device and in rotation themselves so as to generate material abrasion of at least one of the polishing pads. | 08-21-2014 |
| 20140273762 | Polishing Pad with Secondary Window Seal - A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article. | 09-18-2014 |
| 20140273763 | POLISHING PAD CLEANING WITH VACUUM APPARATUS - In one embodiment, a method for cleaning a surface of a polishing pad includes conditioning the polishing pad surface and rotating the conditioned polishing pad surface. The method also includes spraying the polishing pad surface to lift debris from the conditioned polishing pad surface. The method further includes vacuuming the debris from the polishing pad surface downstream from where the condition occurs, wherein downstream is defined by a rotational direction of the polishing pad. In another embodiment, a processing station including a rotatable platen, a substrate carrier head, a polishing fluid delivery system, a conditioner, a spray nozzle, and a vacuum system is provided. The conditioner is disposed between the substrate carrier head and the spray nozzle. The vacuum system is configured to vacuum the polishing pad surface. The vacuum system is downstream from the conditioner, defined by a rotation of the platen. | 09-18-2014 |
| 20140315473 | MULTI-DISK CHEMICAL MECHANICAL POLISHING PAD CONDITIONERS AND METHODS - A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects. | 10-23-2014 |
| 20140323017 | METHODS AND APPARATUS USING ENERGIZED FLUIDS TO CLEAN CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS - Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the polishing pad on a platen; energizing a fluid within the energized fluid delivery assembly; applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and removing the dislodged slurry residue and debris using a vacuum suction unit. Systems and apparatus for carrying out the methods are provided, as are numerous additional aspects. | 10-30-2014 |
| 20140335766 | METHOD OF DRESSING AN ABRASIVE WHEEL USING A POLYCRYSTALLINE CVD SYNTHETIC DIAMOND DRESSER AND METHO DOF FABRICATING THE SAME - A method of dressing a wheel using a polycrystalline CVD synthetic diamond dresser, the method comprising: rotating the wheel; and contacting a working surface of the wheel with a working surface of the polycrystalline CVD synthetic diamond dresser, wherein the polycrystalline CVD synthetic diamond dresser is oriented such that a leading edge of the working surface of the polycrystalline CVD synthetic diamond dresser is formed of larger grains than a trailing edge of the working surface of the polycrystalline CVD synthetic diamond dresser. | 11-13-2014 |
| 20140357163 | Multilayer Chemical Mechanical Polishing Pad Stack With Soft And Conditionable Polishing Layer - A multilayer chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a density of greater than 0.6 g/cm | 12-04-2014 |
| 20150011142 | DOUBLE-SIDE DRESSER - The present disclosure relates to an apparatus and to a method for dressing generating grinding tools or profile grinding tools for the gear cutting processing of toothed workpieces using at least two disk-shaped dressing tools with which one or more tool regions and/or profile regions of the tool are provided with a defined dressing geometry. | 01-08-2015 |
| 20150017884 | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods - The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP pad and the cutting elements using control elements. The degree of contact is established through placement of the control elements relative to the cutting elements. | 01-15-2015 |
| 20150031273 | PAD CONDITIONER AND METHOD OF RECONDITIONING PLANARIZATION PAD - A planarization device includes a planarization pad and a pad conditioner over the planarization pad. The pad conditioner includes a rotatable plate having a lower surface separated from an upper surface of the planarization pad by a predetermined distance and at least one nozzle opening on the lower surface of the rotatable plate. | 01-29-2015 |
| 20150056894 | POLISHING PAD HAVING MICRO-GROOVES ON THE PAD SURFACE - A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed. | 02-26-2015 |
| 20150079883 | Abrasive Tool and a Method for Finishing Complex Shapes in Workpieces - An abrasive tool includes a bonded abrasive body having abrasive grains contained within a bonding material, wherein the bonded abrasive body comprises a complex shape having a form depth (FD) of at least about 0.3. The form depth is described by the equation [(R1−Rs)/R1], wherein Rs is a smallest radius (Rs) at a point along the longitudinal axis of the bonded abrasive body and R1 is a largest radius (R1) at a point along the longitudinal axis of the bonded abrasive body. The abrasive tool can be used to finish complex shapes in workpieces. | 03-19-2015 |
| 20150099431 | CMP Slurry Particle Breakup - A method for breaking up Chemical Mechanical Polishing (CMP) slurry particles includes receiving a CMP slurry comprising particles suspended in a solution, placing the slurry into a first agitation tank, and agitating the slurry at a first frequency. The first frequency is selected to break up particles having a size within a specified range. | 04-09-2015 |
| 20150099432 | CMP EQUIPMENT USING MAGNET RESPONSIVE COMPOSITES - Embodiments described herein generally relate to devices and methods for magnetic-responsive chemical mechanical polishing. In one embodiment, a device including a support with one or more magnetic field generators formed therein is provided. The magnetic field generators can produce at least one magnetic field. A magnetic-responsive composite is positioned in magnetic connection with the magnetic field generators. When the magnetic-responsive composite receives the magnetic field from the magnetic field generators, the magnetic-responsive composite changes shape. | 04-09-2015 |
| 20150105003 | MEDIA-BEARING POLISHER AND RESTORER - A media-bearing polisher and restorer removes surface and subsurface contaminants from a vehicle, household or other surface. The media-bearing polisher and restorer comprises an ovoid body with a planar bottom. The body comprises a resilient or rigid material and one or more flutes for receiving one or more user fingers. A permeable elastic medium is removably attached to the planar bottom of the body, which absorbs and extracts contaminants from the surface. A variety of media can be used with the media-bearing polisher and restorer. | 04-16-2015 |
| 20150133036 | CMP PAD DRESSERS HAVING LEVELED TIPS AND ASSOCIATED METHODS - CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a support substrate and a plurality of superabrasive particles secured to the support substrate with each superabrasive particle extending away from the support substrate to a protrusion distance, where a highest protruding tip of each of the plurality of superabrasive particles align along a designated profile with a tip variation of from about 5 microns to about 100 microns. | 05-14-2015 |
| 20150140907 | POLISHING METHOD AND POLISHING APPARATUS - A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad. | 05-21-2015 |
| 20150290721 | APPARATUS AND METHOD FOR AN EXPANSION ARBOR - An expansion arbor adapted for use on a rotational arbor core comprising an arbor first end having an arbor first end opening, an arbor second end having an arbor second end opening and being spaced apart from the arbor first end, a substantially cylindrical body that defines a longitudinal axis, and a slit having a slit first end and a slit second end and extending along a portion of the substantially cylindrical body between the arbor first end and the arbor second end. A portion of the substantially cylindrical body adjacent to the slit is adapted to expand radially outward when the rotational arbor core is rotated so as to retain a sanding sleeve on the rotational arbor core. A method comprising placing the expansion arbor on the rotational arbor core, placing the sanding sleeve on the expansion arbor, and rotating the rotational arbor core. | 10-15-2015 |
| 20150290765 | SUBSTRATE PROCESSING METHOD - In a substrate processing method according to an embodiment, a surface of an object to be polished disposed on a substrate is polished on a polishing pad supplied with slurry. After the polishing process using the slurry, the surface of the object to be polished on the polishing pad is polished, while supplying water on the polishing pad where a residue including the slurry or a sludge of the polishing pad adhered. After the polishing process using the water, the surface of the object to be polished is cleaned on the polishing pad by supplying rinse liquid on the polishing pad. | 10-15-2015 |
| 20150306788 | Abrasive Regeneration Method - Technique to provide an abrasive regeneration method which, from a used abrasive, can recover an abrasive by an efficient method and can thereafter obtain a high-purity regenerated abrasive by a simple method. This abrasive regeneration method uses an abrasive comprising at least one type of abrasive selected from diamond, boron nitride, silicon carbide, alumina, alumina zirconia, zirconium oxide and cerium oxide. The abrasive regeneration involves a slurry recovery step (A) for recovering an abrasive slurry discharged from a polishing machine, a separation and concentration step (B) for adding an alkaline earth metal salt as an inorganic salt to the recovered abrasive slurry to aggregate the abrasive, and separating and concentrating the abrasive from a mother liquor, an abrasive recovery step (C) for recovering the separated and concentrated abrasive, and a second concentration step (D) for filter-treating the concentrated abrasive. | 10-29-2015 |
| 20150314417 | POLISHING PAD CONDITIONING SYSTEM INCLUDING SUCTION - A system for use in substrate polishing includes a conditioner system for conditioning a surface of a polishing pad and a vacuum system having a vacuum port. The conditioner system includes a conditioner head constructed to receive an abrasive conditioner component. The vacuum system is configured to apply suction through the vacuum port to the surface of the polishing pad in a direction away from the surface to remove material on the surface. | 11-05-2015 |
| 20150367478 | POLISHING PAD HAVING POROGENS WITH LIQUID FILLER - Polishing pads having porogens with liquid filler and methods of fabricating polishing pads having porogens with liquid filler are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a polymer matrix and a plurality of porogens dispersed throughout the polymer matrix. Each of the plurality of porogens has a shell with a liquid filler. The liquid filler has a boiling point less than 100 degrees Celsius at a pressure of 1 atm, a density less than water, or both. | 12-24-2015 |
| 20160008946 | Portable Modular Deburring Machine | 01-14-2016 |
| 20160016283 | VACUUM CLEANING SYSTEMS FOR POLISHING PADS, AND RELATED METHODS - Vacuum cleaning systems and related methods are disclosed. A polishing pad in combination with a fluid, such as a slurry, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system includes an enclosure body having an inlet opening which may be placed proximate to the polishing pad and an exit opening in communication with a vacuum source to remove the debris and the fluid from the polishing pad through a passageway connecting the inlet and exit openings. By including contact members secured to the enclosure body and configured to form an abutment against a working surface of the polishing pad, a Venturi effect zone between the enclosure body and the working surface of the polishing pad may be created to dislodge fluid and debris from the working surface. In this manner, scratches and contamination are avoided for later-polished substrates. | 01-21-2016 |
| 20160016284 | POLISHING SYSTEM WITH PAD CARRIER AND CONDITIONING STATION - A polishing system includes a support to hold a substrate having a substrate surface to be polished, a conditioning system for conditioning a polishing pad, the conditioning system comprising one or more conditioning heads, a movable support structure, and a carrier to hold a polishing pad. The carrier is suspended from the movable support structure, and the support structure is configured to move the carrier between the support to hold the substrate and the conditioning system. | 01-21-2016 |
| 20160059380 | SUBSTRATE PROCESSING APPARATUS - An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad. | 03-03-2016 |
| 20160059381 | GRINDING WHEEL TRUING METHOD AND GRINDING MACHINE FOR CARRYING OUT TRUING METHOD - In a grinding wheel truing method of an aspect of the present invention, an outer peripheral surface of a grinding wheel is trued while a position of a truer with respect to the grinding wheel is moved from one end side toward the other end side in the axial direction of the grinding wheel. In the truing, a relative movement speed of the truer when a position of the outer peripheral surface of the grinding wheel which grinds a large-diameter portion of a conical surface of a work is trued is lower than a relative movement speed of the truer when a position of the outer peripheral surface of the grinding wheel which grinds a small-diameter portion of the conical surface of the work is trued. | 03-03-2016 |
| 20160074999 | ABRASIVE TOOLS AND METHODS OF MAKING SAME - Abrasive tools of the disposable type applicable to many types of equipment to sand materials of various types are provided. In particular, the invention relates to devices using rotating abrasive discs for sanding machines, which include a plurality of flexible abrasive discs open at a radial cut and arranged in an overlapping and staggered configuration such as to define an abrasive, lamellar-like work surface with overlapping flaps, wherein each flap is formed of a protruding portion of an abrasive disc. Methods of making such abrasive tools are also provided. | 03-17-2016 |
| 20160151884 | FOREIGN OBJECT REMOVAL FOR ABRASIVE RECYCLING SYSTEM | 06-02-2016 |
| 20160158862 | METHOD, TOOL AND DEVICE FOR PROFILING A FINISHING TOOL - Method for profiling a finishing tool, in particular a grinding worm, having a first and a second finishing flank; the method providing the steps of: arranging a cutting portion of a profiling tool in contact with the first flank of the thread; causing the cutting portion to slide in contact with the first flank of the thread so as to profile it; removing the cutting portion from the thread; automatically rotating the profiling tool so as to arrange the cutting portion in contact with a second flank of the thread; and causing the cutting portion to slide in contact with the second flank of the thread so as to profile it. | 06-09-2016 |
| 20160158911 | METHOD AND APPARATUS FOR CONDITIONING A POLISHING PAD - A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad. | 06-09-2016 |
| 20160158913 | GRINDING WHEEL AND METHOD - A method for distributing a coolant to a grinding site of a grinding wheel, including rotating the grinding wheel, injecting the coolant in an inlet of the grinding wheel disposed proximate to an axis of rotation of the grinding wheel, moving the coolant fluid from the inlet along a plurality of internal grooves of the grinding wheel outwardly towards a plurality of outlets, and expelling the coolant outwardly from the plurality of outlets at an angle of at most 15 degrees with respect to a tangent to a circumference of the grinding wheel at the outlet. | 06-09-2016 |
| 20160176018 | DRESSING TOOL AND METHOD FOR THE PRODUCTION THEREOF | 06-23-2016 |
| 20160199964 | METHOD FOR DRESSING POLISHING PADS | 07-14-2016 |
| 20160375546 | POLISHING LAYER OF POLISHING PAD AND METHOD OF FORMING THE SAME AND POLISHING METHOD - A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections. | 12-29-2016 |
| 20170232576 | CMP PAD CONDITIONERS WITH MOSAIC ABRASIVE SEGMENTS AND ASSOCIATED METHODS | 08-17-2017 |
| 20180021910 | A SELF-SHARPENING POLISHING DEVICE WITH MAGNETORHEOLOGICAL FLEXIBLE POLISHING PAD FORMED BY DYNAMIC MAGNETIC FIELD AND POLISHING METHOD THEREOF | 01-25-2018 |
| 20180021920 | METHOD OF MONITORING A DRESSING PROCESS AND POLISHING APPARATUS | 01-25-2018 |
