| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 451053000 | With critical temperature modification or control of work or abradant | 14 |
| 20090047875 | COOLANT NOZZLE POSITIONING FOR MACHINING WORK-PIECES - A method of determining a position of a coolant nozzle relative to a rotating grinding wheel removing material from a work-piece and an apparatus for practicing the method are disclosed. The method includes the step of disposing a coolant nozzle having a base and a distal end for adjustable movement relative to the grinding wheel and the work-piece. The distal end of the coolant nozzle can be moved in a first plane normal to an axis of the grinding wheel along a first arcuate path centered on a pivot axis at the base. The distal end can also be moved by moving the pivot axis in the first plane along an orbit centered on the grinding wheel axis. The method also includes the step of selecting a position of the distal end along the first arcuate path. The method also includes the step of projecting a second arcuate path in the first plane centered on the grinding wheel axis and having a radius extending to the position of the distal end along the first arcuate path. The method also includes the step of generating a third arcuate path in the first plane corresponding to a location of the work-piece that would be contacted first by the distal end during movement along the second arcuate path. The method also includes the step of limiting movement of the distal end along the second arcuate path by an intersection between the second arcuate path and the third arcuate path. | 02-19-2009 |
| 20090258576 | GRINDING MACHINE AND GRINDING METHOD - A grinding machine is provided with first and second grinding wheels selectively used in dependence on the steps of machining operations. The second grinding wheel is grooved so that at least one oblique groove vertically crosses a contact surface on which a grinding surface of the second grinding wheel contacts with a workpiece, and thus, is capable of releasing a dynamic pressure in coolant generated between the grinding surface and the workpiece since coolant supplied from over the contact surface flows out from both of the upper and lower sides of the contact surface through the at least one oblique groove. Since it does not occur that fluctuations in the dynamic pressure generated in coolant cause the distance between the second grinding wheel and the workpiece to be varied, the accuracy in grinding the workpiece with the second grinding wheel can be enhanced. | 10-15-2009 |
| 20090264052 | Polishing method and polishing apparatus, and program for controlling polishing apparatus - A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer or the like, before resuming polishing, thereby eliminating the cost of dummy wafer or the like. The polishing method comprises: carrying out a stand-by operation during a polishing-resting time period; carrying out a preparatory process to polishing, after completion of the stand-by operation, by dressing a polishing surface while supplying a polishing liquid to the polishing surface; and starting polishing of a workpiece after completion of the preparatory process to polishing. Determination as to whether to carry out the preparatory process to polishing after completion of the stand-by operation may be made based on the total operating time of the stand-by operation or the total effective number of the stand-by operations. | 10-22-2009 |
| 20100041321 | COOLANT DYNAMIC PRESSURE RELEASING METHOD IN GRINDING OPERATION, GRINDING METHOD USING THE RELEASING METHOD, AND GRINDING WHEEL FOR USE IN THE GRINDING METHOD - A dynamic pressure in the coolant supplied between a rotating grinding wheel and a rotating workpiece is released by making at least one of oblique grooves on the grinding wheel pass vertically through a contact surface on which a grinding surface of the grinding wheel contacts the workpiece. Where one and the other side intersection points are defined as intersection points at which both ends of each oblique groove respectively cross extension lines of one and the other side edges parallel to a grinding wheel circumferential direction of the contact surface, the other side intersection point of each oblique groove overlaps the one side intersection point of an oblique groove next to each such oblique groove by a predetermined overlap amount in the grinding wheel circumferential direction, and the length in the grinding wheel circumferential direction of the contact surface is made to be shorter than the overlap amount. | 02-18-2010 |
| 20100062691 | SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD - A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member | 03-11-2010 |
| 20100130106 | MACHINE TOOL WITH COOLING NOZZLE AND METHOD FOR APPLYING COOLING FLUID - Disclosed in one embodiment is a computer numerically controlled machine having a coolant nozzle that is mounted on a turret of the machine and that is rotatable relative to the turret under the control of a computer control system. The nozzle is fluidically connected to a source of a coolant. The machine includes a computer control system that is operatively coupled to the various components of the machine including the nozzle. In some embodiments, the nozzle may be moved to cause a constant contact angle with respect to one of said tool and said workpiece. In other embodiments, the nozzle may be moved to cause a constant coolant time to interface. Also disclosed are related methods. | 05-27-2010 |
| 20110045747 | Abrasive Article - An abrasive article is disclosed that is suitable for cleaning, sanding, scraping, or other such process of removing an outer layer or adherent matter. The abrasive article includes a plurality of abrasive particles at least partially embedded in a frozen liquid. | 02-24-2011 |
| 20110053468 | THERMAL MECHANICAL SKIVE FOR COMPOSITE MACHINING - An apparatus for thermal mechanical machining of composite materials includes a head, a drive, and a shaft. The head has an abrasive face. The drive is coupled to the apparatus to move the head to produce abrasion of the composite material by the abrasive face. The shaft includes a passageway that communicates a heated gas to an interface between the abrasive face and the composite material. The gas removes particles that result from the abrasion of the composite material by the abrasive face. The gas can be heated sufficiently to carbonize or vaporize organic constituents of the composite material. | 03-03-2011 |
| 20120040592 | APPARATUS AND METHOD FOR TEMPERATURE CONTROL DURING POLISHING - Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad. | 02-16-2012 |
| 20130072092 | MULTI-SPINDLE CHEMICAL MECHANICAL PLANARIZATION TOOL - An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles. | 03-21-2013 |
| 20130331004 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND CHEMICAL MECHANICAL POLISHING METHOD - According to one embodiment, a semiconductor device manufacturing method comprises forming a film to be polished on a semiconductor substrate, and performing a CMP method on the film to be polished. The CMP method includes polishing the film to be polished by bringing a surface of the film to be polished into contact with a surface of a polishing pad having a negative Rsk value. | 12-12-2013 |
| 20140038496 | ACTIVE COOLANT FLOW CONTROL FOR MACHINING PROCESSES - A method for operating a machining tool, comprising: setting a flow rate and a pressure of a flow of coolant to a target flow rate and a pressure target, respectively, the coolant flow being provided to the machining tool; machining a work-piece using the machining tool; measuring the flow rate and the pressure of the flow of coolant; and detecting an anomaly with respect to the coolant flow; and taking a corrective action depending on the type of the detected anomaly. | 02-06-2014 |
| 20150079881 | POLISHING METHOD AND POLISHING APPARATUS - A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad. | 03-19-2015 |
| 20180021917 | POLISHING METHOD AND POLISHING APPARATUS | 01-25-2018 |
