| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 451011000 | With feeding of tool or work holder | 78 |
| 20080207090 | METHOD FOR GRINDING JOURNAL SECTION OF WORKPIECE - For grinding one of axially spaced journal sections of a workpiece each having a cylindrical surface and a pair of shoulder surfaces extending radially outward from the opposite end portions of the cylindrical surface, a rotating grinding wheel is advanced to grind the shoulder surfaces of one journal section and then to grind the cylindrical surface of the one journal section. At the end of the cylindrical surface grinding, the grinding wheel is retracted by a fixed distance at a slow feed rate and is further retracted at a rapid feed rate. A rest shoe provided on the side opposite to the grinding wheel with the workpiece therebetween is advanced to an advanced position where the rest shoe contacts with another journal section axially spaced from the one journal section to decrease the flection of the workpiece caused by grinding resistance and is retracted away from said another journal section when the fixed-distance retraction of the grinding wheel is completed. | 08-28-2008 |
| 20080220696 | HONING FEED SYSTEM HAVING FULL CONTROL OF FEED FORCE, RATE, AND POSITION AND METHOD OF OPERATION OF THE SAME - The feed system for a honing machine provides a capability to dynamically correct in real time errors in bore size inferred arising from variations in feed force, and a method of operation of the same. The system allows a user to select between rate and force controlled honing modes, which provides one or more of the advantages of both modes. The system provides capabilities for automatic rapid automatic bore wall detection, compensation for elasticity of elements of the feed system and honing tool, and automatic tool protection. The system is automatically operable using feed force, feed rate and positional information for honing a work piece to one or more target parameters, such as one or more in-process sizes and a final size. | 09-11-2008 |
| 20080254716 | Variable rate method of machining gears - A method of machining gears or other toothed articles wherein the workpiece feed rate and/or the tool shifting is varied so as to produce an irregular surface pattern on tooth surfaces with a resulting reduction in mesh noise. The method is particularly applicable to grinding spur and/or helical gears with a grinding worm. | 10-16-2008 |
| 20080305717 | PLATEN ASSEMBLY AND WORK PIECE CARRIER HEAD EMPLOYING FLEXIBLE CIRCUIT SENSOR - A platen assembly is provided for supporting a polish pad of the type utilized to planarize a wafer. The platen assembly comprises a sensor system and a polish platen having a first surface for supporting the polish pad. The sensor system comprises a flexible sensor and a flexible circuit operatively coupled to the sensor controller. The flexible circuit includes a first flexible sensor disposed proximate the first surface. | 12-11-2008 |
| 20080311824 | APPARATUS FOR SMOOTHING A PRODUCT, IN PARTICULAR A SEMI-FINISHED CERAMIC PRODUCT - An apparatus ( | 12-18-2008 |
| 20090042483 | Working System, Method for Detecting Contact, and Acoustic Emission Contact Detection Device - The object is to aim at the reduction in the influence of noises in an output of an AE sensor in a working machine. In a working system comprising a working device for working a work W by causing a tool | 02-12-2009 |
| 20090061735 | SYSTEMS AND METHODS FOR IN-SITU RECORDING HEAD BURNISHING - Systems and methods are provided for burnishing a recording head in-situ in a magnetic recording disk drive. The burnishing process generates a tribocurrent, which is electricity generated by the rubbing of dissimilar materials. Different materials exhibit widely different tribocurrent characteristics while in sliding contact. The tribocurrent thus acts as an indicator of the particular materials of the recording head making contact with the magnetic recording media during different stages of the burnishing process. The tribocurrent is thus monitored to determine when it reaches a threshold value. The threshold value indicates that the burnishing has exposed a particular material of the recording head. Thus, the burnishing process may be stopped upon the tribocurrent reaching the threshold value so that the read sensor of the recording head is not burnished and inadvertently damaged. | 03-05-2009 |
| 20090068928 | GRINDING WHEEL FOR ROLL GRINDING AND METHOD OF ROLL GRINDING - A method of grinding a ferrous roll may include: rotating a grinding wheel on a machine spindle to form a rotating grinding wheel; rotating a ferrous roll to form a rotating roll surface; bringing the rotating grinding wheel into contact with the rotating roll surface; traversing the rotating grinding wheel across an axial roll length of the rotating roll surface; and grinding the roll surface while varying at least one or both of a grinding wheel rotational speed and a said mill roll rotational speed at an amplitude of +/−1 to 40% with a period of 1 to 30 seconds. | 03-12-2009 |
| 20090075564 | SUPERABRASIVE TOOL AND MACHINING METHODS - A tool for use in an abrasive machining process has a body extending along a central longitudinal axis from a first end to a tip end. An abrasive material is located on the tip end. The body has a tip end protuberance. An abrasive material is located on the protuberance. A body lateral surface has, over a radial span of at least 20% of a radius of the protuberance, a continuously concave longitudinal profile diverging tipward. | 03-19-2009 |
| 20090104849 | POLISHING PAD AND POLISHING METHOD - A polishing pad and a polishing method for polishing a substrate are described. The polishing pad includes a polishing layer and at least two grooves. The grooves form polishing tracks respectively. The polishing tracks collectively construct an even tracking zone. A better polishing uniformity of a substrate surface is achieved with the even tracking zone. | 04-23-2009 |
| 20090124170 | Bit sharpening apparatus and method of using - Disclosed in the present application is a sharpening apparatus and method for sharpening a cutting bit. The apparatus comprises a sharpening member and a laser for accurately positioning the cutting bit surface to be sharpened with respect to the sharpening member. The apparatus and method are particularly useful for sharpening a router or shaper bit. | 05-14-2009 |
| 20090170404 | APPARATUS AND METHOD FOR POLISHING MEDIA DISCS - Disclosed is an apparatus for polishing media discs by removing or reducing scratches or substances from the surface of damaged discs, including computer data CDs, DVDs, gaming discs and other media discs. The apparatus enables removal or reduction of scratches and materials that prevent the information or data contained on the disc from being read by a conventional disc reading device. The polishing pressure and time are uniformly controlled at predetermined and precision levels sufficient to remove or reduce scratches from the surface of the disc. Also disclosed is a method of removing or reducing scratches from the surface of media discs by using the apparatus of the present invention. The method can be repeated as many times as necessary or desired in order to obtain a finely polished disc from which data is obtainable by conventional disc reading devices. | 07-02-2009 |
| 20090170405 | ASSEMBLY FOR MANUALLY GRINDING A FACE OF A VEHICLE BODY PART - An assembly for manually grinding a face of a motor vehicle body part, including a grinding mechanism, a moving carriage supporting the grinding mechanism, a mechanism to guide the carriage moving along the face to be ground, and a support guide held in position with respect to the body part to be ground. The support guide includes at least one guide face configured to bear at least a first part of the mechanism to guide the moving carriage. | 07-02-2009 |
| 20090239449 | Automatic constant pressure polishing apparatus for improving surface accuracy of lens - Disclosed is an automatic constant pressure polishing apparatus. The automatic constant pressure polishing apparatus comprises a housing having a hollow section therein, a rubber pad installed in the housing and having superior expansion and contraction characteristics, a pressure fixture having a male screw section, which is formed on an outer peripheral surface thereof in order to press and fix the rubber pad, and a central hole formed at a central portion thereof, a slider screw-coupled into the housing to adjust pressure in the housing according to a rotational degree of the rotating shaft, and a polishing pad installed at a front end portion of the housing. | 09-24-2009 |
| 20090247053 | Substrate production apparatus for producing a substrate for a display device - A substrate production apparatus for producing a substrate for a display device is disclosed. The substrate production apparatus includes a first production apparatus including a first scriber to scribe a first mother substrate into at least one first model substrate and at least one second model substrate, a first grinder to grind the first model substrate, and a first cleaning unit to clean the ground first model substrate. The substrate production apparatus also includes a second production apparatus including a second scriber to scribe a second mother substrate into at least one first model substrate and at least one second model substrate, a second grinder to grind the second model substrate, and a second cleaning unit to clean the ground second model substrate. Additionally, the substrate production apparatus includes a common buffer unit to store the second model substrate from the first production apparatus and to store the first model substrate from the second production apparatus. The first model substrates have different dimensions from the second model substrates. | 10-01-2009 |
| 20090264048 | Machine and process for grinding dies - The invention relates to a machine and process for grinding dies, in which the work axis (CO) of the plate ( | 10-22-2009 |
| 20090305612 | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method - An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates. | 12-10-2009 |
| 20100009599 | APPARATUS AND METHOD FOR POLISHING SEMICONDUCTOR WAFERS USING ONE OR MORE POLISHING SURFACES - An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a pivoting manner. The load-and-unload cup may be configured to move to and from the wafer carriers in a linear reciprocating manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a pivoting manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a linear reciprocating manner. | 01-14-2010 |
| 20100009600 | Grinding apparatus for a pin for use in power transmission chain and manufacture method of a pin for use - A disc-like grinding wheel | 01-14-2010 |
| 20100130102 | LOAD CUP SUBSTRATE SENSING - Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer. | 05-27-2010 |
| 20100173565 | GRINDING CENTER AND METHOD FOR THE SIMULTANEOUS GRINDING OF MULTIPLE CRANKSHAFT BEARINGS - The invention relates to a grinding center for the simultaneous grinding of multiple main bearings and rod bearings and/or central sections of crankshafts ( | 07-08-2010 |
| 20100203807 | Pressure control system of wafer polishing apparatus - A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure controlling devices. The air branch conduit is connected with the main input air pressure regulator. The first pipes are connected between the air branch conduit and the auxiliary air pressure regulators. The second pipes are connected between the auxiliary air pressure regulators and the air pressure controlling devices. Accordingly, the air pressure controlling devices can control the pressure outputted from a polishing head of the wafer polishing apparatus to a surface of a wafer. | 08-12-2010 |
| 20100330880 | Machine Tools and Methods of Operation Thereof - A machine tool is provided which comprises a machine base ( | 12-30-2010 |
| 20110053459 | SLOW SPEED SPINDLE FOR MICROPUNCH GRINDING - An apparatus has a motor, a shaft attached to the motor arranged to be turned by the motor when the motor operates, an attachment at an end of the shaft opposite the motor arranged to allow mounting of components to be ground, a loading block arranged under the end of the shaft having the attachment to support the components to be ground, and an interface to a grinding tool arranged adjacent to the loading block. An apparatus has a motor mounted on a slide, a shaft attached to the motor arranged to spin when the motor operates. an attachment on the end of the shaft to allow attachment of a component, a loading block at least partially supporting the shaft. an interface to a manufacturing tool, the motor and shaft arranged to insert the shaft into the interface when moved along the slide to an engaged position. | 03-03-2011 |
| 20110065361 | Device For Finish-Machining of Optically Effective Surfaces of, In Particular, Spectacle Lenses - A device for finish-machining of the optically effective surfaces of, in particular, spectacle lenses has a spindle shaft, which has a tool mount section and which is mounted in a spindle housing to be rotatable about a workpiece rotational axis (A). An electric rotary drive has a rotor and a stator by which the spindle shaft operatively connected with the rotor is drivable to rotate about the tool rotational axis. An adjusting device axially displaces the tool mount section with respect to the spindle housing in the direction of the tool rotational axis (linear movement Z). The rotor and the stator are arranged coaxially with the spindle shaft, wherein at least the rotor together with the spindle shaft is axially displaceable with respect to the spindle housing in the direction of the tool rotational axis by the adjusting device. | 03-17-2011 |
| 20110159783 | METHOD AND APPARATUS FOR POLISHING A SUBSTRATE - A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table ( | 06-30-2011 |
| 20120149282 | APPARATUS AND METHOD FOR PROCESSING PISTON - A piston processing apparatus includes a work attaching head capable of fixing a piston material, a work rotating device, a grinding wheel, a grinding wheel rotating device, first and second moving mechanisms for moving the grinding wheel, a rotational angle detector for detecting a rotational angle of the work attaching head, a first and second position detectors for detecting a position of a grinding surface of the grinding wheel, a controller controls the first and second moving mechanisms to grind the outer circumferential surface by the grinding wheel based on target-position information of the grinding surface corresponding to a position on the outer circumferential surface of the piston material. According to the piston processing apparatus, the outer circumferential surface of the piston material can be processed into a three-dimensional shape with high-accuracy, and a piston that can improve fuel efficiency. | 06-14-2012 |
| 20120164920 | MACHINE TOOL AND MACHINING METHOD - A control unit that relatively moves a headstock and tailstock and a tool to thereby machine a peripheral surface of a workpiece in a radial direction executes control such that a relative feed speed of the tool in the radial direction in a transitional state where an amount of warpage of the workpiece in the radial direction at a machining position increases is faster than a relative feed speed of the tool in the radial direction in a steady state where an amount of warpage of the workpiece in the radial direction at the machining position is constant. By so doing, it is possible to reduce a machining time at the time of the start of machining. | 06-28-2012 |
| 20120190274 | APPARATUS AND METHOD FOR MEASURING TOOTH SURFACE DEVIATION, APPARATUS AND METHOD FOR FORMING GRINDING TOOL, AND GEAR MESHING METHOD FOR GEAR GRINDING APPARATUS - A device for measuring tooth surface deviation includes a contact detector that measures the deviation at the tooth surface of a dresser with respect to a grinding tooth surface formed on a helical grinding tooth of a grinding tool when the grinding tool and a dresser toothed wheel are rotated synchronously in a state in which the grinding tooth surface and the dresser tooth surface of the dresser toothed wheel can be brought into contact, and detects contact between the grinding tooth surface and the dresser tooth surface; and a controller that changes the speed of rotation of the dresser toothed wheel in such a way that the detection result of the contact detector comes within the range of contact determination data, and also measures the amount by which the grinding tool and the dresser toothed wheel have been changed in one revolution of the dresser toothed wheel. | 07-26-2012 |
| 20120208438 | POLISHING SYSTEM HAVING A TRACK - Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track. | 08-16-2012 |
| 20120220197 | Device and Method for the Double-Sided Processing of Flat Work Pieces - The invention relates to a device for the double-sided processing of flat work pieces, comprising an upper working disc and a lower working disc, wherein the working discs between the working surfaces thereof facing each other, form a working gap for processing the work pieces, and wherein at least one of the working discs comprises a plurality of bores extending through the working surface for feeding a liquid working medium into the working gap, wherein the bores are combined in several groups, wherein each group of bores is connected to a separate pressurized supply line for the working medium, and at least one pressure control apparatus is provided, which makes it possible to control the pressure of the working medium in the supply lines separately from one another. | 08-30-2012 |
| 20120225609 | DEVICE FOR PHASING THREADED GRINDING STONE - A device for phasing a threaded grinding stone is phased with respect to a workpiece or a disk dresser prior to the engagement of the threaded grinding stone with the workpiece or with the disk dresser during grinding or dressing. In performing this phasing, it is detected, by means of an AE fluid sensor provided to a grinding stone head which rotatably supports the threaded grinding stone, whether the threaded grinding stone has had contact with the workpiece or the disk dresser. Subsequently, on the basis of the phase of the threaded grinding stone at the time when contact was detected, the threaded grinding stone is positioned in a phase where the aforementioned engagement is feasible. | 09-06-2012 |
| 20120231703 | METHOD OF OPERATING SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS - A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate. | 09-13-2012 |
| 20120270474 | POLISHING PAD WEAR DETECTING APPARATUS - A polishing pad wear detecting apparatus suitable for a chemical mechanical polishing (CMP) apparatus is provided. The polishing pad wear detecting apparatus includes an arm and a height detector. One end of the arm is fastened on the CMP apparatus. The height detector is disposed on the arm for detecting height variation of a polishing pad. | 10-25-2012 |
| 20120302138 | CONTINUOUS GRINDING MACHINE - In a continuous grinding machine for grinding the surface of flat workpieces ( | 11-29-2012 |
| 20130035020 | VERSATILE WORKPIECE REFINING - Versatile methods of refining a first and a second layer of a workpiece are discussed. New refining methods and refining apparatus are disclosed. The new refining methods can help improve yield and appreciably change the cost of manufacture for refining of workpieces. The methods can be applied to workpieces having extremely close tolerances such as semiconductor wafers. New methods of control are also discussed. Methods use controllers, processors, computers, and processor readable memory devices are discussed. Use of stored information is to make changes in process control are discussed. Use of process models are discussed for refining. Determining a changed process control with stored information from first and second layers of a workpiece is disclosed. A changed process control can make an appreciable changes to the cost of manufacture of a workpiece. | 02-07-2013 |
| 20130102227 | SYSTEMS AND METHODS OF WAFER GRINDING - Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle. | 04-25-2013 |
| 20130122783 | PAD CONDITIONING FORCE MODELING TO ACHIEVE CONSTANT REMOVAL RATE - A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change. | 05-16-2013 |
| 20130196572 | CONDITIONING A PAD IN A CLEANING MODULE - A particle cleaning module includes a housing, a substrate holder, a pad holder, an actuator and a pad conditioner. The substrate holder is disposed in the housing, is configured to retain a substrate in a substantially vertical orientation, and is rotatable on a first axis. The pad holder is disposed in the housing, has a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, and is rotatable on a second axis parallel to the first axis. The actuator is operable to move the pad holder relative to the substrate holder to change a distance defined between the pad retaining surface and the substrate. The pad conditioner is disposed in the housing and has a conditioning surface oriented parallel to the pad retaining surface. | 08-01-2013 |
| 20130273816 | AUTOMATIC POLISHING DEVICE FOR SURFACE FINISHING OF COMPLEX-CURVED-PROFILE PARTS - The present invention discloses an automatic polishing device and the method of using the device for the surface finishing of a workpiece such as complex-curved-profile parts. Automatic polishing is performed by mounting the workpiece on an apparatus which enables different orientations along multiple axes and immerging the workpiece in a controlled flow of abrasive slurry. The device of the present invention provides a uniform finish on free form surface. It is also precise, low cost, non-destructive, and non-polluting. | 10-17-2013 |
| 20130316619 | REEL MOWER GRINDER WITH AUTO- INDEX MECHANISM - A grinder for sharpening the blades of reel mowers automatically to grind the underside of the blade of the reel mower. | 11-28-2013 |
| 20140030957 | METHOD FOR ADJUSTING HEIGHT POSITION OF POLISHING HEAD AND METHOD FOR POLISHING WORKPIECE - A method for adjusting a height position of a polishing head, comprising moving the polishing head to a height position at which the polishing head comes in noncontact with the polishing pad with the polishing head holding no workpiece, and then rotating at least one of the polishing head and the turn table; measuring the load torque current of the at least one of the polishing head and the turn table rotated with the torque-measuring mechanism while the height-adjusting mechanism moves the polishing head toward the polishing pad until the polishing head contacts the polishing pad, and recording the height position of the polishing head as a reference position when a variation in the measured load torque current exceeds a threshold; and adjusting the height position of the polishing head to the predetermined position on the basis of a distance from the reference position. | 01-30-2014 |
| 20140094092 | ENHANCED EXTERNAL CLEANING AND INSPECTION OF TUBULARS - Enhanced methods are disclosed for performing operations such as cleaning, inspection or data acquisition on an external surface of a hollow cylindrical tubular. Preferred embodiments include providing a fluid dispenser and an abrasion assembly on a buggy that travels up and down the length of the tubular as the tubular rotates. The fluid dispenser includes nozzles that dispense cleaning fluids onto the tubular's external surface. The abrasion assembly includes a swivel brush and a brush train providing different styles of abrasion cleaning of the tubular's external surface. Preferred embodiments of the buggy also carry a range finding laser and an optical camera generating samples that may be processed in real time into data regarding the surface contours and the diameter variations on the tubular's external surface. Cleaning and inspection variables such as tubular rotational speed, or buggy speed, may be adjusted responsive to measured surface contour data. | 04-03-2014 |
| 20140127973 | POLISHING METHOD AND POLISHING APPARATUS - A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad. | 05-08-2014 |
| 20140141695 | Multi-Platen Multi-Head Polishing Architecture - A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station. | 05-22-2014 |
| 20140141696 | Polishing System with In-Sequence Sensor - A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station. | 05-22-2014 |
| 20140154954 | AUTOMATED POLISHING SYSTEMS AND METHODS - Automated polishing systems include a polisher for polishing the coating on the article and a robotic positioner for moving the polisher relative to the article on an automated path, wherein the polisher polishes at least a part of the coating during movement, a force feedback sensor for determining a force of the polisher against the article during polishing, and a controller for maintaining the polisher within a predetermined force range against the article based at least in part on the force determined by the force feedback sensor. | 06-05-2014 |
| 20140194038 | DEBURRING MACHINE AND METHOD FOR DEBURRING - A method for deburring a ground metal part includes loading a ground metal part into a carrier, contacting a first planar surface of the ground metal part with a first grinding wheel, and contacting a second planar surface of the ground metal part with a second grinding wheel. The first grinding wheel is rotated in a first rotational direction. The second grinding wheel is rotated also in the first rotational direction. After the first grinding wheel is rotated in the first rotational direction, the first grinding wheel is then rotated in a second rotational direction, which is opposite to the first rotational direction. After the second grinding wheel is rotated in the first rotational direction, the second grinding wheel is also rotated in the second rotational direction. | 07-10-2014 |
| 20140213148 | MACHINE TOOL AND METHOD FOR MEASURING A WORKPIECE - The present disclosure relates to a machine tool, in particular a grinding machine, and to a method for measuring a workpiece, in particular a workpiece diameter, in a machine tool, in particular a grinding machine, which comprises a workpiece mount, a tool unit, a measuring device and a control device which is connectable to the measuring device and the tool unit, wherein the measuring device is accommodated on the tool unit and comprises at least two measuring probes, wherein in a measuring configuration the at least two measuring probes are spaced apart by a basic spacing which defines a measurement region, wherein the basic spacing is selected to be greater than a known reference dimension, wherein the control device is configured for acquiring values detected by way of the at least two measuring probes, of detecting an actual position of the tool unit, and, on the basis of a displacement path of the tool unit when probing a workpiece which is moved into the measurement region, of determining an actual spacing, in particular an actual diameter, with consideration to the reference dimension and/or the basic spacing. | 07-31-2014 |
| 20140220863 | HIGH THROUGHPUT CMP PLATFORM - A chemical-mechanical polishing system has a first polishing apparatus configured to perform a first chemical-mechanical polish on a workpiece and a second polishing apparatus configured to perform a second chemical-mechanical polish on the workpiece. A rework polishing apparatus comprising a rework platen and a rework CMP head is configured to perform an auxiliary chemical-mechanical polish on the workpiece when the workpiece is positioned on the rework platen. A measurement apparatus measures one or more parameters of the workpiece, and a transport apparatus transports the workpiece between the first polishing apparatus, second polishing apparatus, rework polishing apparatus, and measurement apparatus. A controller determines a selective transport of the workpiece to the rework polishing apparatus by the transport apparatus only when the one or more parameters are unsatisfactory. | 08-07-2014 |
| 20140235142 | DEVICE FOR POLISHING OPTICAL LENSES - The device for polishing optical lenses includes a lens holder; a device for positioning the lens holder; and a device for rotating the lens holder about an axis. There is also a polishing tool; a tool holder; a device for positioning the tool holder; and a device for rotating the tool holder about an axis. The device for polishing also includes a ball joint arranged between a shaft secured to the tool holder and the device for positioning the tool holder, or between a shaft secured to the lens holder and the device for positioning the lens holder, so as to enable a spherical movement of the polishing tool and of the lens. The invention also relates to a method for polishing using the device according to the invention. | 08-21-2014 |
| 20140349552 | DRESSING APPARATUS, POLISHING APPARATUS HAVING THE DRESSING APPARATUS, AND POLISHING METHOD - A dressing apparatus capable of bringing an overall dressing surface of a dresser into uniform sliding contact with a polishing surface of a polishing pad and capable of uniformly dressing the overall polishing surface of the polishing pad is disclosed. The dressing apparatus includes a dresser configured to rub against a polishing surface to dress the polishing surface that is used for polishing a substrate, a dresser shaft that applies a load to the dresser, at least one load-applying device configured to apply a downward load to a part of a peripheral portion of the dresser, and an operation controller configured to control operation of the load-applying device. | 11-27-2014 |
| 20150065010 | APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING OF WORK - A double-side polishing apparatus for a work according to the present invention includes one or more work thickness measuring devices and a control unit. The double-side polishing method for a work includes the steps of: first polishing for polishing both surfaces of the work; first measurement for measuring the thickness of the work; in the first measurement step, when the thickness of the work is found to reach the predetermined thickness, terminating the orbital motion of the carrier plate; second polishing both surfaces of the work while the carrier plate performs only rotational motion; second measurement for measuring the thickness of the work at predetermined position(s); and determining a time for terminating polishing based on the result of the measurement of the thickness of the work in the second measurement step. | 03-05-2015 |
| 20150099427 | Slider Level Lapping Carrier - A carrier may be configured and operated to engage a lapping plate with a plurality of physically separated sliders attached to a common adhesive of the carrier. The carrier can be constructed to have at least one finger adjacent to and capable of translating a single slider of the plurality of physically separated sliders. | 04-09-2015 |
| 20150133033 | Platen Assembly, Chemical-Mechanical Polisher, and Method for Polishing Substrate - A platen assembly includes a platen body, a polishing pad, and a fountain slurry supplier. The platen body has an upper surface. The polishing pad is disposed on the upper surface of the platen body. The fountain slurry supplier is at least partially disposed on the upper surface of the platen body for supplying slurry up onto the polishing pad. | 05-14-2015 |
| 20150133034 | MACHINE TOOL COMPRISING A SPINDLE HEAD AND METHOD FOR POSITIONING A SPINDLE HEAD OF A MACHINE TOOL - The present disclosure relates to a machine tool for machining workpieces, particularly a grinding machine, and to a method for positioning a spindle head of such a machine tool. The machine tool comprises a workpiece holder for receiving a workpiece, and a spindle head for receiving a tool, particularly a grinding wheel, wherein the spindle head is movable by motor with respect to the workpiece holder, wherein a handle is arranged at the spindle head and comprises at least one detector that is arranged to detect an impact on the handle, and wherein a control device is provided that is arranged to move the spindle head in at least one operation mode by motor in a defined manner dependent on the detected impact on the handle. | 05-14-2015 |
| 20150140901 | METHOD FOR AUTOMATIC SHARPENING OF A BLADE - The method is for sharpening a blade. An automatic sharpening apparatus is provided that has a holder. A blade is placed into the holder. A grinding-wheel driving motor, in operative engagement with a wheel on a spindle, rotates a grinding wheel. A grinding assembly motor moves the grinding wheel in an x-direction towards the blade. A linear motor moves the grinding wheel from a first position to a second position in a z-direction without moving the grinding-wheel driving motor. The rotating grinding wheel engages the blade. The grinding wheel sharpens the blade. | 05-21-2015 |
| 20160016276 | Method for High-Precision Corner Contouring of Flat Glass Substrates in a Continuous Feed-Through Process - A method is provided for corner contouring of flat glass substrates in a continuous feed-through process by a contouring tool. The method includes the steps of: synchronization of the movement of the contouring tool to the continuous feed-through movement of the flat glass substrate, contouring of a corner of the flat glass substrate, wherein a relative movement between the contouring tool and the flat glass substrate is performed so as to overlap the continuous feed-through movement. | 01-21-2016 |
| 20160074984 | SURFACE TREATMENT APPARATUS, AND SURFACE TREATMENT METHOD - According to an embodiment, a surface treatment apparatus includes a surface treatment portion, a supporter, and a carrying portion. The surface treatment portion has a treatment surface. The supporter has a support surface facing a second surface opposite to the first surface of the work. A frictional coefficient of the second surface and the support surface is higher than a frictional coefficient of the first surface and the treatment surface. The carrying portion applies a load in a direction in which the support surface is relatively pressed on the treatment surface, moves the support surface in a carrying direction different from the direction of the load, and thereby moves the work in the carrying direction. | 03-17-2016 |
| 20160096250 | ADJUSTING A SUBSTRATE POLISHING CONDITION - A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad. | 04-07-2016 |
| 20160101497 | Multi-Platen Multi-Head Polishing Architecture - A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station. | 04-14-2016 |
| 20160129510 | MACHINE AND METHOD FOR THE FINISHING OF GEARS - A machine and method for the finishing of gears with a finishing tool, in particular a grinding wheel; the machine having a plurality of workpiece carrier slides, a plurality of workpiece carrier spindles, each of which is mounted on a respective workpiece carrier slide, and a plurality of loading-unloading stations; each workpiece carrier spindle is rotating and supports a gear; each workpiece carrier slide slides from a respective loading-unloading station to a working station and vice versa; in which the control unit synchronizes the rotation of each gear with the rotation of the finishing tool outside of the working station so that by entering the working station the gear meshes with the finishing tool without collisions. | 05-12-2016 |
| 20160176006 | DEVICES, SYSTEMS, AND METHODS FOR RECOVERY AND RECYCLING OF CARPET COMPONENTS | 06-23-2016 |
| 20180021911 | GRINDING APPARATUS | 01-25-2018 |
| 20190143480 | CUTTING APPARATUS | 05-16-2019 |
| 451021000 | Tool wear compensation | 6 |
| 20080220697 | Machine Including Grinding Wheel and Wheel Dresser - Disclosed are a machine with a grinding wheel and a dressing surface and related method. The dressing surface is movable in at least two axes of translation relative to the grinding wheel. The rotational speed of the grinding wheel and dressing surface preferably are under the control of a computer control system, whereby the speed of rotation of the dressing surface may be adjusted as the diameter of the dressing wheel and as the diameter of the grinding wheel is decreased during use. The machine may be used in continuous or intermittent dressing operations. | 09-11-2008 |
| 20090186558 | GRINDING METHOD, GRINDING DEVICE AND ELECTRODE THEREFOR - A grinding device including a multi-wheel grindstone and an electrode arranged opposite to a grinding action surface of the multi-wheel grindstone with an interval, in which a work is ground and machined while the grinding action surface of the multi-wheel grindstone is electrolytic-dressed by supplying conductive machining fluid between an electrode action surface of the electrode and the grinding action surface of the multi-wheel grindstone, and applying a voltage between the multi-wheel grindstone and the electrode, wherein the electrode has a laminate body in which electrode plates whose electrode action surfaces are arranged so as to oppose the grinding action surface of each of the grinding wheels are alternately sandwiched by a plurality of insulating plates; and a flow passage for distributing the machining fluid supplied to between the grinding action surface and the electrode action surface is formed at the electrode plate and the insulating plate. | 07-23-2009 |
| 20120329368 | TRUING DEVICE OF GRINDING MACHINE - A truing device of a grinding machine includes: a truer that corrects a shape of a grinding wheel; a swivel table that supports the truer such that the truer is swivelable about a swivel axis Ac; detecting means for directly detecting a distance from a truing edge position of the truer, which contacts the grinding wheel during correction of the shape of the grinding wheel, to a swivel center O of the swivel table; and control means for controlling the truing edge position of the truer with respect to the grinding wheel based on the distance L detected by the detecting means to true the grinding wheel. | 12-27-2012 |
| 20130122784 | PAD CONDITIONER DRESSER - Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life. Additionally, a method may include dressing the chemical mechanical polishing pad with the dresser; vibrating, in a direction substantially parallel to a working surface of the pad, a member selected from the pad, the dresser, a wafer being polished by the pad, or any combination thereof, to minimize a mechanical stress on the pad, dresser, wafer, or combination thereof. | 05-16-2013 |
| 20130149939 | LARGE SCALE PLATE AND METHOD FOR UNIFORMLY POLISHING LARGE SCALE PLATE - Disclosed is a substrate polishing method capable of minimizing a difference of polishing amounts between a center portion and a rim portion of a large scale plate during a plate polishing process. | 06-13-2013 |
| 20140342639 | PATTERN SANDER DEVICE, SYSTEM AND METHOD - The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece. | 11-20-2014 |
| 451023000 | Cam actuated | 1 |
| 20080299871 | Methods and apparatus for polishing a semiconductor wafer - Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two of which are independently controllable, located with respect to the base and the moving belt such that a corresponding plurality of pressure zones are defined to provide pressure between the moving belt and the top surface of the substrate. | 12-04-2008 |
| 451024000 | Hydraulically driven | 3 |
| 20140220864 | POLISHING APPARATUS - An object of the present invention is to improve the capability of lifting a substrate with the polishing performance of the substrate maintained. A polishing apparatus | 08-07-2014 |
| 20140342640 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus including a membrane including a pressure chamber and being configured to hold a wafer; a polishing portion including a polish pad contacting a polish surface of the wafer when polishing the wafer; a monitoring portion monitoring a state of inflation of the pressure chamber; and a controller controlling polishing of the wafer by the polishing portion based on a result of monitoring by the monitoring portion. | 11-20-2014 |
| 451025000 | Sizing gauge controlled | 1 |
| 20080299872 | Independent Measuring Apparatus for Grinding Machines - Measuring apparatus ( | 12-04-2008 |
| 451027000 | Tool interior of workpiece | 3 |
| 20100197199 | Machine for Creating Non-Cylindrical Bore Surfaces - The invention relates to a machine for creating non-cylindrical bore surfaces having a machine spindle ( | 08-05-2010 |
| 20120184183 | INTERNAL GEAR MACHINING METHOD AND INTERNAL GEAR MACHINING DEVICE - An internal gear machining method and an internal gear machining device, are provided for grinding of a tooth profile of an internal gear using a barrel-shaped threaded grinding wheel. An NC device functions as a tooth profile error correction means and reduces a measured pressure angle error of a workpiece at a tooth face by correcting the radial position, the lateral position of the grinding wheel, the turning angle of the grinding wheel, and the helical motion; reduces a measured error in the direction of a tooth trace of the workpiece at a tooth face by correcting the helical motion; and reduces a measured tooth thickness error of the workpiece at a tooth face by correcting the radial position, the lateral position of the grinding wheel, and the helical motion. | 07-19-2012 |
| 20150147941 | METHOD FOR PRODUCING GOLF CLUB HEAD WITH ULTRA-THIN CROWN - The present invention discloses a method for producing a golf club head with an ultra-thin crown, relating to a method for processing a golf club head. A grinding rotor, with an abrasive ( | 05-28-2015 |
