| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 451008000 | With indicating | 86 |
| 20080227368 | DOCUMENT ABRADING DEVICE - The present invention provides a shredding device that has an elongated body that houses a motor. A brush may be rotatably secured to the body, at least partly outside of the body, and driven by the motor and configured to remove by abrasion at least a layer of a substrate having markings thereon. The shredding device may include a vacuum system for collecting particulate matter formed by abrading the substrate. | 09-18-2008 |
| 20080242196 | METHOD AND SYSTEM FOR CONTROLLING CHEMICAL MECHANICAL POLISHING BY TAKING ZONE SPECIFIC SUBSTRATE DATA INTO ACCOUNT - A system for chemical mechanical polishing (CMP) is disclosed which includes a polishing apparatus for polishing a surface of a substrate and a sensor for determining zone-specific substrate data respectively related to at least two zones of the substrate. A controller is provided for generating, in response to the zone-specific substrate data, at least one set-point value, e.g., a set-point window of values for at least one operating parameter of the polishing apparatus in a subsequent CMP process. The set-point value/set-point window of values may be displayed on a display device or automatically taken into account by the controller for controlling subsequent CMP processes. | 10-02-2008 |
| 20080242197 | Wafer polish monitoring method and device - The present invention aims to provide a wafer polish monitoring method and device for detecting the end point of the polishing of a conductive film with high precision and accuracy by monitoring the variation of the film thickness of the conductive film without adverse influence of slurry or the like after the film thickness of the conductive film decreases to an extremely small film thickness defined by the skin depth. To achieve this objective, the present invention provides a wafer polish monitoring method by which a high-frequency transmission path is formed in a portion facing the conductive film on the surface of the wafer, the polishing removal state of the conductive film is evaluated based at least on the transmitted electromagnetic waves passing through the high-frequency transmission path or the reflected electromagnetic waves that are reflected without passing through the high-frequency transmission path, and the end point of the polishing removal and the point equivalent to the end point of the polishing removal are detected. | 10-02-2008 |
| 20080268752 | SUBSTRATE GRINDING METHOD AND DEVICE - A grinding method wherein the correlation between the amount of inertial grinding occurring in performing spark-out by a grinding unit and the maximum load current in a motor of the grinding unit is grasped, and a correction value for the amount of inertial grinding corresponding to the maximum load current is preliminarily obtained. When the wafer thickness measured by a thickness measuring gauge has reached the sum of a desired value and the correction value (=the amount of inertial grinding) corresponding to the maximum load current, the spark-out is started. Accordingly, the wafer thickness becomes the desired value after the inertial grinding in performing the spark-out. | 10-30-2008 |
| 20080305715 | MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A polishing pad used in a CMP step in the manufacture of a semiconductor integrated circuit device is relatively expensive; thus, it is necessary to avoid a wasteful exchange of the pad. Accordingly, it is important to measure the abrasion amount of this pad precisely. However, in ordinary measurement thereof through light, the presence of a slurry hinders the measurement. In measurement thereof with a contact type sensor, a problem that pollutants elute out is caused. In a CMP step in the invention, the height position of a dresser is measured while the dresser operates, thereby detecting the abrasion amount or the thickness of a polishing pad indirectly. In this way, the time for exchanging the polishing pad is made appropriate. | 12-11-2008 |
| 20080305716 | HONING METHOD AND HONING CONTROL DEVICE - A honing method and honing control device suitable for the honing having a large processing area is provided. The honing control device includes a grinder and an expansion member for disposition in a processing hole of a workpiece. The amount of an expanding movement when the grinder contacts the inner surface of a gauge hole via the expansion member is stored as a target expansion amount by inserting a honing head into the gauge hole having the same size as a target processing diameter of a master gauge. Then, a honing of an inner surface of the processing hole is performed by inserting the honing head within a processing hole of a workpiece moving the grinder towards an outer side of a diametrical direction by the expansion member installed within the honing head to rotate the honing head. The honing is completed when the amount of the expanding movement of the grinder reaches a target expansion amount established by the master gauge. | 12-11-2008 |
| 20090036028 | Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof - A chemical mechanical polishing apparatus and a chemical mechanical polishing method thereof are provided. The chemical mechanical polishing method at least includes the following steps. In step a, a positive pressure is formed between a polishing pad and a wafer. In step b, the wafer is driven to revolve around a first central axis. In step c, a polishing slurry is injected between the polishing pad and the wafer. In step d, the positive pressure formed on the wafer by the polishing pad is adjusted for change the contacting modes of the polishing pad and the wafer as well as the wafer removal rate. | 02-05-2009 |
| 20090042481 | METHOD OF CALIBRATING OR COMPENSATING SENSOR FOR MEASURING PROPERTY OF A TARGET SURFACE - A method of calibrating or compensating a sensor for measuring property of target surface is provided. In one embodiment, a liquid reference surface is formed on a platen. A sensor is used to measure a feature property of the reference surface. The measured feature property of the reference surface may be used to calibrate the sensor. Further, the sensor is used to measure the feature property of a polishing pad. The measured feature property of the reference surface may be used to compensate the measured feature property of the polishing pad. | 02-12-2009 |
| 20090042482 | ROUGH POLISHING METHOD OF SEMICONDUCTOR WAFER AND POLISHING APPARATUS OF SEMICONDUCTOR WAFER - A rough-polishing method for conducting a rough polishing before mirror-finish polishing on a semiconductor wafer using a polishing apparatus includes a first polishing step for polishing the semiconductor wafer using slurry containing colloidal silica supplied by a slurry supplying unit and a second polishing step for polishing the semiconductor wafer using alkali solution provided by mixing deionized water supplied from a deionized-water supplying unit and alkali concentrate solution supplied by an alkali-concentrate-solution supplying unit. The pH value of the alkali solution and polishing time in the second polishing step are determined based on the load current value of the polishing table in the first polishing step. | 02-12-2009 |
| 20090047869 | Precision Machining Method - A precision machining method enabling grinding with high accuracy is provided. The method includes a first step of producing an intermediate ground workpiece by roughly grinding a workpiece (a) with a diamond grinding wheel (b), and a second step of producing a final ground workpiece by grinding the intermediate ground workpiece with a grinding wheel for CMG. In the first step, feed of the rotator ( | 02-19-2009 |
| 20090093193 | Chemical mechanical polishing apparatus - Disclosed herein is a chemical mechanical polishing apparatus. The apparatus comprises a carrier to hold a wafer and being capable of lifting, lowering and rotating, a polishing pad compressed onto the wafer through the lowering of the carrier to polish the wafer, a contact pressure sensor to detect contact pressure between the polishing pad and the wafer when the polishing pad is compressed onto the wafer, a support physical property controller to generate control signals corresponding to the contact pressure detected by the contact pressure sensor, a variable physical property support being adapted to come into close contact with the polishing pad and having physical properties varied in response to the control signals generated by the support physical property controller, and a rotational table to hold the variable physical property table. | 04-09-2009 |
| 20090137190 | Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method - The present invention provides a dressing method of dressing a polishing pad used in a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing process on the polishing pad, during the dressing process, measuring a height of an upper surface of the polishing pad at a predetermined point in one of plural zones on the polishing surface, and repeating the repetitive moving of the dresser and the measuring of the height of the upper surface of the polishing pad so as to measure the height of the upper surface of the polishing pad in all of the plural zones. | 05-28-2009 |
| 20090142991 | Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method - A silicon wafer grinding apparatus, a retaining assembly used for the same, and a silicon wafer flatness correcting method are provided. | 06-04-2009 |
| 20090176442 | EYEGLASS LENS PROCESSING APPARATUS - An eyeglass lens processing apparatus includes a processing control unit ( | 07-09-2009 |
| 20090186557 | Method of operating substrate processing apparatus and substrate processing apparatus - A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate. | 07-23-2009 |
| 20090209176 | Method and apparatus for polishing object - A method can effectively eliminate a surface level difference (irregularities) in a film formed on an object without producing scratches in a surface of the film, and can polish and remove the film into a flat surface with greatly increased productivity. The method comprises carrying out a first polishing step by pressing a polishing pad of a polishing device, having a diameter which is smaller than the radius of the object, against the surface of the object at a first pressure while moving the polishing pad and the object relative to each other at a first relative speed. The first polishing step is terminated at a point in time when a surface level difference in the object is eliminated to a targeted level. The method further comprises carrying out a second polishing step by pressing a polishing pad of a polishing device, having a diameter which is larger than the diameter of the object, against the surface of the object at a second pressure while moving the polishing pad and the object relative to each other at a second relative speed. | 08-20-2009 |
| 20090247052 | WAFER GRINDING METHOD AND WAFER GRINDING MACHINE - A wafer grinding method and a wafer grinding machine are disclosed for grinding a wafer by executing both the rough grinding process and the finish grinding process. After the rough grinding process before the finish grinding process, the wafer thickness is measured with a noncontact-type thickness gauge, and during the finish grinding process, the finish thickness is finely adjusted by use of a contact-type thickness gauge and referring to the measurement data of the noncontact-type thickness gauge. | 10-01-2009 |
| 20090286453 | Method and apparatus for chemical-mechanical polishing - In accordance with at least one example embodiment, a method of chemical-mechanical polishing includes re-polishing a polished layer on a wafer based on a measured thickness of the polished layer. In accordance with at least one example embodiment, an apparatus for chemical-mechanical polishing may include a thickness measuring unit configured to measure a thickness of a polished surface on a wafer and to determine a re-polishing time based on the measured thickness. In accordance with example embodiments, a thickness deviation between different lots, wafers, or chips inside a wafer is reduced regardless of the durability of a polishing pad, a polishing head, or a disk used in a polishing apparatus. | 11-19-2009 |
| 20090291618 | TIRE GRINDING METHOD AND GRINDING DEVICE - In a grinding device, first, an eddy-current-sensor detects a distance from the eddy-current-sensor to an outer peripheral surface of a belt layer while a tire to be retreaded held by a pair of half rims is caused to rotate. Thus, an eccentricity amount and an eccentricity direction of the tire to be retreaded with respect to a device axial center, corresponding to the phase of the tire to be retreaded, can be respectively determined, so position control signals corresponding to the phase, eccentricity amount and eccentricity direction of the tire to be retreaded can be generated. Next, on the basis of the position control signal, a carriage causes a rasp to be moved in a radial direction with respect to the tire to be retreaded along the radial direction whose center is a device axial center, and the rasp grinds a tread surface of the rotating tire to be retreaded. | 11-26-2009 |
| 20090311945 | Planarization System - An embodiment of a planarization system for planarizing a substrate includes a planarizing surface and an encircling element formed to at least partially laterally enclose the substrate, wherein the planarizing system is configured to planarize the substrate with the substrate abutting the planarizing surface during a relative lateral movement between the substrate and the planarizing surface. The substrate is at least partially laterally enclosed by the encircling element. The encircling element abuts the planarizing surface. | 12-17-2009 |
| 20090318062 | Polishing pad and polishing device - The present invention provides a polishing pad with a pressure sensor and the polishing apparatus thereof. The polishing pad is used in the polishing process of semiconductor and other work piece, which includes at least one substrate, at least one pressure sensor and at least one signal transmitting module. The substrate has a polishing face, a bottom face opposite to the polishing face, and at least one cavity set on the bottom face of the substrate. The pressure sensor is set in the cavity and configured for providing a pressure signal. The signal transmitting module is set on the polishing pad and configured for transmitting a pressure signal. The pressure signal is a loading pressure value and/or loading pressure distribution on the polishing pad with a preset range. Thus, with the pressure signal, the polishing apparatus prevents the concerned work piece from being over polished to further improve polishing quality and yield. | 12-24-2009 |
| 20100029178 | SMART CONDITIONER RINSE STATION - A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station. | 02-04-2010 |
| 20100035520 | Polishing Apparatus, Method of Manufacturing Semiconductor Device Employing this Polishing Apparatus, and Semiconductor Device Manufactured by this Method of Manufacturing Semiconductor Device - While data that indicate a relationship between a dressing position P defined by a distance between a rotating shaft | 02-11-2010 |
| 20100105291 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE - Apparatus and methods are provided to polish a notch of a substrate. The invention includes a polishing head adapted to apply a polishing tape against the notch of the substrate, including: a plunger; and an actuator, wherein the actuator is adapted to move the plunger with respect to the polishing tape. Numerous other aspects are provided. | 04-29-2010 |
| 20100105292 | METHOD FOR MACHINING THAT COMBINES FINE BORING AND HONING AND MACHINING EQUIPMENT FOR THE EXECUTION OF THE METHOD - According to a method for the fine machining of internal surfaces of bore holes in tools by fine boring and subsequent honing, the following steps are executed: Fine boring of at least one bore hole ( | 04-29-2010 |
| 20100112903 | DISHING AND DEFECT CONTROL OF CHEMICAL MECHANICAL POLISHING USING REAL-TIME ADJUSTABLE ADDITIVE DELIVERY - A method and apparatus for polishing or planarzing a substrate by a chemical mechanical polishing process. In one embodiment a method of processing a semiconductor substrate is provided. The method comprises positioning a substrate on a polishing apparatus comprising a polishing pad assembly, delivering a polishing slurry to a surface of the polishing pad assembly, polishing the substrate with the surface of the polishing pad assembly, monitoring the removal rate of material from a plurality of regions on the surface of the substrate, determining whether the plurality of regions on the surface of the substrate are polishing uniformly, and selectively delivering a polishing slurry additive to at least one region of the plurality of regions to obtain a uniform removal rate of material from the plurality of regions on the surface of the substrate, wherein the removal rate of material from the at least one region is different than at least one other region of the plurality of regions. | 05-06-2010 |
| 20100130101 | TWO-LINE MIXING OF CHEMICAL AND ABRASIVE PARTICLES WITH ENDPOINT CONTROL FOR CHEMICAL MECHANICAL POLISHING - Embodiments described herein provide a method for polishing a substrate surface. The methods generally include storing processing components in multiple storage units during processing, and combining the processing components to create a slurry while flowing the processing components to a polishing pad. A substrate is polished using the slurry, and the thickness of a material layer disposed on the substrate is determined. The flow rate of one or more processing components is then adjusted to affect the rate of removal of the material layer disposed on the substrate. | 05-27-2010 |
| 20110021114 | ABRASIVE ARTICLE WITH PRECONDITIONING AND PERSISTENT INDICATORS - An abrasive article with a backing having a first major surface and a second major surface opposed to the first major surface. A three-dimensional abrasive layer attached to the first major surface, the three-dimensional abrasive layer comprising a plurality of shaped abrasive composites spaced apart by a plurality of land areas between the shaped abrasive composites, each of the shaped abrasive composites comprising a top surface and a sidewall, and the plurality of shaped abrasive composites and the plurality of land areas both formed from abrasive particles dispersed within an organic binder. A preconditioning indicator located on the top surface of at least some of the plurality of shaped abrasive composites and a persistent indicator located on at least some of the plurality of land areas. | 01-27-2011 |
| 20110076924 | METHOD OF DETERMINING THE LUBRICATION MECHANISM IN CMP - The present invention is a method for obtaining data easily, accurately and effectively that may be used in determination of Sommerfeld Numbers and COF for CMP polishing. Using the Sommerfeld Numbers and COF values thus obtained the lubrication mechanism of CMP polishing with particular materials and under particular conditions can easily and reliably be studied. The method of the present invention is accomplished by use of CMP polishing tools capable of simultaneously measuring shear force and normal force, and rendering a value for the COF while simultaneously enabling the operator to change pressure on and relative velocity of the CMP wafer and CMP polishing pad in real time. Using the said CMP tool, the pressure and relative velocity may be varied separately or together for the desired length of time according to the needs of the operator so that within one CMP process multiple measurements may be taken under the same process conditions. | 03-31-2011 |
| 20110076925 | System for Evaluating and/or Improving Performance of a CMP Pad Dresser - Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles. | 03-31-2011 |
| 20110097972 | METHOD FOR SHOT PEENING AND A MACHINE THEREFOR (AS AMENDED) - A method for shot peening wherein the work is processed by being hit by shot materials that are shot by compressed air, and a machine for carrying out the method are provided. By the present invention the status of a work can be measured while the work is being processed. The requirements for maintaining and calibrating the sensor that is used for the measurement are reduced because the wear of the sensor is prevented. The method for shot peening is to process a work by shooting the shot materials with compressed air from a shooting nozzle against the work. The shooting nozzle is equipped with a transducer that detects elastic waves and transduces them to high-frequency electrical signals. The elastic waves are generated when the shot materials pass through the shooting nozzle. The characteristic values of the shot materials, which pass through the shooting nozzle, are measured and monitored based on the signals. | 04-28-2011 |
| 20110136408 | METHOD FOR DETECTING AND/OR PREVENTING GRIND BURN - The present invention provides a method of detecting and preventing grind burn from developing on a gear. The method includes performing acoustic emission testing while the gear is being ground during a grinding operation. The grinding wheel is evaluated during an eddy current test to detect material buildup on the grinding wheel which could cause grind burn. In addition, the method includes collecting swarf from the gear during the grinding operation and inspecting the swarf for an indication of grind burn. | 06-09-2011 |
| 20110294403 | WAFER PROCESSING METHOD, WAFER POLISHING APPARATUS, AND INGOT SLICING APPARATUS - In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer. | 12-01-2011 |
| 20120088439 | DYNAMIC ACTION ABRASIVE LAPPING WORKHOLDER - A method and apparatus for quickly moving workpieces from having abrading contact with abrasive-surfaced rotatable platens using a dynamic-action workholder apparatus frame moving device that is activated by a sensor. Flat-surfaced workpieces are attached to flat-surfaced workholders to abrade one surface of the workpieces by abrasive coated platens. The force moving device can be a spring, an air cylinder, a screw-jack, an electric solenoid or a piezo-electric device. The sensor can be a vibration, shock, motion, force or sound sensor that can to sense abrading process events that could make it desirable to quickly activate moving of the workpieces away from the abrasive disk. The workpiece abrading event can be quickly interrupted by use of this device to avoid damage to workpieces, the abrasive disks or the platen or to quickly change an abrading process. After the workpieces are moved they can be returned to their original abrading position. | 04-12-2012 |
| 20120115398 | CHEMICAL-MECHANICAL POLISHING WAFER AND METHOD OF USE - The present invention is directed to systems and methods for assisting personnel in discerning which side of a dummy wafer has been polished more and for differentiating one side of a dummy wafer from the other. In a preferred embodiment, dummy wafers include a first plurality of depth indicia on a first surface and a second plurality of depth indicia on a second opposing surface. In one embodiment, each of the depth indicia of the first plurality of depth indicia extends a depth into the dummy wafer beyond the first surface, and each of the depth indicia of the second plurality of depth indicia extends a depth into the dummy wafer beyond the second surface. Other embodiments include depth indicia of the first plurality of depth indicia located at depths beyond the first surface that each have a corresponding depth indicia in the second plurality of depth indicia located at a substantially similar depth beyond the second surface. In other embodiments, each of the depth indicia of the first and second pluralities of depth indicia are located at different depths. | 05-10-2012 |
| 20120142254 | POLISHING APPARATUS AND EXCEPTION HANDLING METHOD THEREOF - A polishing apparatus and exception handling method thereof is disclosed, the exception handling method of polishing apparatus includes: sending an alarm signal when an alarm is generated because of an exception during polishing; and processing a wafer in the polishing apparatus with organic acid solution according to the received alarm signal. The method and apparatus prevent the metal material from corrosion which causes device failure, when there is an alarm generated because of an exception which stops the apparatus during polishing. | 06-07-2012 |
| 20120208437 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position. | 08-16-2012 |
| 20120252319 | POLISHING METHOD, MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIO-CONTROLLED TIMEPIECE - Provided is a polishing method which can enhance thickness accuracy of a wafer at the time of polishing the wafer. In a polishing method of a crystal wafer (tuning fork substrate) which is held on a carrier between an upper platen and a lower platen, an AT cut wafer for thickness measurement is arranged on the carrier, the AT cut wafer is polished together with the crystal wafer (tuning fork substrate), resonance frequency of the AT cut wafer is detected, and a thickness of the crystal wafer (tuning fork substrate) is controlled based on a detection result. | 10-04-2012 |
| 20120276817 | EDDY CURRENT MONITORING OF METAL RESIDUE OR METAL PILLARS - A method of chemical mechanical polishing a substrate includes polishing a metal layer on the substrate at a polishing station, monitoring thickness of the metal layer during polishing at the polishing station with an eddy current monitoring system, and halting polishing when the eddy current monitoring system indicates that residue of the metal layer is removed from an underlying layer and a top surface of the underlying layer is exposed. | 11-01-2012 |
| 20120309267 | METHOD AND APPARATUS FOR MONITORING A POLISHING SURFACE OF A POLISHING PAD USED IN POLISHING APPARATUS - The present invention provides a method capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface. | 12-06-2012 |
| 20130052917 | POLISHING APPARATUS, POLISHING PAD, AND POLISHING INFORMATION MANAGEMENT SYSTEM - A polishing pad has structural parts embedded therein; sensors, a memory for storing detected information obtained by the sensors, and a communication unit driven by a power supply unit to communicate with outside in a non-contact manner. The polishing pad and a communication unit configured to communicate with the communication unit of the polishing pad in a non-contact manner constitute a polishing information management system. The polishing pad and a communication unit configured to transmit and receive the information to and from the communication unit of the polishing pad in a non-contact manner constitute a polishing apparatus. | 02-28-2013 |
| 20130065489 | PROCESS FOR CONTROLLING THE POLISHING PROCESS OF AN OPTICAL ELEMENT - The invention concerns a process for measuring and/or controlling a polishing process of an ophthalmic element ( | 03-14-2013 |
| 20130102226 | Slit blade polishing procedure - A procedure for polishing slit blades to ensure proper flatness and blade angle. This task is incredibly difficult. The number of strokes, series of and type of abrasive papers used, direction of polishing lapping strokes, as well as other practices to promote flatness and minimize human and manufacturing error in the final slit blade product have all been experimentally determined by ADC personnel over years of experience and study. A fixture for holding blades while polishing the blade angle side has been developed to accommodate precise blade angle polishing. | 04-25-2013 |
| 20130115856 | GEAR GRINDING METHOD - Provided is a gear grinding method wherein an initial cutting position by a grindstone is appropriately set, resulting in an improvement being able to be made in machining accuracy. For this purpose, the gear grinding method is such that rotation of a workpiece (W) about a workpiece rotation axis (C), cutting by a grindstone ( | 05-09-2013 |
| 20130115857 | TRANSLOCATION-SIMULATING LOADING APPARATUS FOR GEAR GRINDING MACHINE WITH SHAPED GRINDING WHEEL AND DETECTION METHOD FOR STIFFNESS DISTRIBUTION - A translocation-simulating loading apparatus for gear grinding machine with shaped grinding wheel is provided. The apparatus comprises a load-receiving test piece ( | 05-09-2013 |
| 20130122782 | SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT - Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed. | 05-16-2013 |
| 20130196571 | MULTI-SANDER - A tool for moving an abrasive media can include a tool body and a drive system housed in the tool body. The drive system can include an output member. A retaining member can be disposed on the tool body. A first platen having a first attachment hub can be selectively coupled with the retaining member in an installed position. The first platen can have a first rotatable member that selectively attaches to the output member in a first mode of operation. A second platen having a second attachment hub can selectively couple with the retaining member in an installed position. The second platen can have a second rotatable member that selectively attaches to the output member in a second mode of operation. | 08-01-2013 |
| 20130252513 | FEELER FOR WORKPIECES BEING MACHINED - It is provided a feeler ( | 09-26-2013 |
| 20130260645 | EDDY CURRENT SENSOR AND POLISHING METHOD - An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor is disposed near the metal film or the conductive film formed on the substrate to detect an eddy current generated in the metal film or the conductive film. The eddy current sensor includes a plurality of coils having different sizes formed by winding a wire or a conductive material. The plurality of coils includes an inner coil and an outer coil spaced from each other, and the outer coil is configured to surround the inner coil. The plurality of coils are configured to detect respective eddy currents generated in the metal film or the conductive film. | 10-03-2013 |
| 20130273815 | DEVICE, TOOL AND METHOD FOR MACHINING OF AN OPTICAL LENS - A device, a tool, and a method for machining, especially polishing, of an optical lens by means of a tool are proposed, an information medium on one working surface of the tool being optically acquired and removed as the lens is machined and thus the state of the tool being indicated. | 10-17-2013 |
| 20140170935 | METHOD FOR MACHINING A SERIES OF WORKPIECES BY MEANS OF AT LEAST ONE MACHINING JET - The method for machining a series of workpieces ( | 06-19-2014 |
| 20140256227 | DOUBLE-SIDE POLISHING METHOD - The present invention is directed to a double-side polishing method including interposing a wafer held by a carrier between upper and lower turn tables to which respective polishing pads are attached, and rotating and revolving the carrier while supplying a polishing agent to polish both surfaces of the wafer at the same time, the method including the steps of: first polishing at a high polishing rate; second polishing at a low polishing rate; measuring flatness of the polished wafer; and determining polishing conditions of the second polishing in a next polishing batch on a basis of the measured flatness. The method can stably improve the flatness of a wafer without being affected by variations in carrier thickness over time. | 09-11-2014 |
| 20150072595 | SYSTEM FOR EVALUATING AND/OR IMPROVING PERFORMANCE OF A CMP PAD DRESSER - Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles. | 03-12-2015 |
| 20150087206 | TOOLS FOR LENS PROCESSING - A lens processing system used for removing a lens blank ( | 03-26-2015 |
| 20150298282 | Patterned Wafer Geometry Measurements for Semiconductor Process Controls - Wafer geometry measurement tools and methods for providing improved wafer geometry measurements are disclosed. Wafer front side, backside and flatness measurements are taken into consideration for semiconductor process control. The measurement tools and methods in accordance with embodiments of the present disclosure are suitable for handling any types of wafers, including patterned wafers, without the shortcomings of conventional metrology systems. | 10-22-2015 |
| 20160199960 | ABRASIVE TOOL INDICATOR SYSTEM, METHOD AND APPARATUS | 07-14-2016 |
| 20180021908 | SPINDLE DEVICE FOR A PROGRAM-CONTROLLED MACHINE TOOL | 01-25-2018 |
| 451009000 | Of tool or work holder position | 18 |
| 20080318492 | Substrate holding apparatus, polishing apparatus, and polishing method - A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member. | 12-25-2008 |
| 20090088048 | Machining Device Comprising a Measuring Device for a Model - The invention relates to a machining device ( | 04-02-2009 |
| 20090104848 | Calibration tool and a grinder machine including such a tool - The invention relates to a calibration tool ( | 04-23-2009 |
| 20090142992 | Polishing apparatus and polishing method - The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position. | 06-04-2009 |
| 20090142993 | EYEGLASS LENS PROCESSING APPARATUS - An eyeglass lens processing apparatus includes: a processing tool which processes a peripheral edge of the lens and includes a roughing tool, a beveling tool and a bevel-modifying tool; a selection unit which is used to select a high curve beveling mode for forming a bevel in the lens fitted into a high curve frame having a protrusion portion; a modifying portion data input unit inputs data of a portion to be modified so as to prevent an interference between the lens and the protrusion portion; a calculation unit which obtains bevel-modifying data on the basis of a bevel path and data of the modifying portion; and a processing control portion which performs the beveling to the lens by the beveling tool in accordance with the beveling data, and removes a part of the bevel shoulder and/or the bevel slope by the bevel-modifying tool in accordance with the bevel-modifying data. | 06-04-2009 |
| 20090191791 | Polishing method and polishing apparatus - A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device. | 07-30-2009 |
| 20090291619 | GRINDSTONE CONTACT SENSING METHOD AND ITS DEVICE, AND HONING METHOD AND HONING MACHINE - A grindstone contact sensing technology capable of sensing the contact position of the honing grindstone with the inner circumference of the work at high precision. A servo motor for driving the spindle rotation, and a servo motor for driving the depth of cut are provided and used respectively as spindle rotation drive source for rotating and driving the rotary spindle having the honing tool and depth-of-cut drive source for moving the honing grindstone at a specified depth of cut, and the contact position of the honing grindstone with the inner circumference of the work is sensed from various electrical information (rotating speed, torque, current value, stagnant pulses, etc.) obtained from the operations of both the servo motors. | 11-26-2009 |
| 20090305611 | DEVICE AND METHOD FOR IMPROVING ACCURACY OF A HIGH-PRESSURE FLUID JET APPARATUS - A calibration device provided for use with a high-pressure fluid jet apparatus includes a body configured to be coupled to the high-pressure fluid jet apparatus, and a light-emitting device positioned toward the first end of the body and configured to project light on a target element at a location substantially identical to a location at which the high-pressure fluid jet contacts the target element during operation with fluid, allowing calibration of the high-pressure fluid jet apparatus before operation with fluid. | 12-10-2009 |
| 20100029179 | HONING FEED SYSTEM AND METHOD EMPLOYING RAPID TOOL ADVANCEMENT AND FEED FORCE SIGNAL CONDITIONING - The honing feed system and method utilizes feedback from various sources during rapid feeding of the honing tool while rotating and stroking, to detect initial contact with a bore surface, to slow the feed to a normal honing rate, involving conditioning the feedback signals to eliminate noise factors such as the stroking movement and forces generated to rotate and feed the tool unopposed. | 02-04-2010 |
| 20100291838 | POLISHING HEAD AND POLISHING APPARATUS HAVING THE SAME - The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery. | 11-18-2010 |
| 20110021115 | Substrate polishing apparatus and method of polishing substrate using the same - Provided is a substrate polishing apparatus that includes a polishing unit and a pad supporting member. The polishing unit includes a polishing pad polishing a substrate seated on a substrate supporting member, and a pad driving member moving the polishing pad. The pad supporting member is disposed at a side of the substrate supporting member to support a portion of a polishing surface the polishing pad without contacting the substrate when an edge of the substrate seated on the substrate supporting member is polished. Accordingly, the substrate polishing apparatus prevents the polishing pad from being inclined to the outer side of a substrate while an edge of the substrate is polished, thereby improving polishing efficiency and preventing the breakage of a substrate during a polishing process. | 01-27-2011 |
| 20120108145 | DEVICE AND METHOD FOR SHARPENING DENTAL CURETTES - A device for sharpening one or more cutting edges of a dental curette has a base support with a frame articulated thereon, and at least one sharpening guide. The frame supports a grinding wheel rotationally driven by a motor and a sharpening guide support intended to receive the sharpening guide(s). The guide includes at least one indicator in the form of a line marked on the guide, whose angle with the horizontal being between 10° and 50° but preferably equal to 10°, 20° or 30° and corresponding to the type of dental curette to be sharpened. The sharpening guide(s) can move with respect to the support, and the support and/or the guide include(s) indexing and positioning elements determining indexing positions of the guide on the support, each indexing position corresponding to a different indicator. A method of sharpening one or more cutting edges, and a sharpening guide are described. | 05-03-2012 |
| 20120164919 | Method for Machining Flat Workpieces - The invention relates to a method for machining flat workpieces in a double-sided machining tool, which has an upper and a lower work disk, wherein at least one of the work disks is rotatingly driven and the work disks each have an annular work surface, wherein the work surfaces amongst themselves limit an also annular work gap, in which at least one carrier is located, which guides at least one workpiece in the work gap, so that the at least one workpiece is machined in a double-sided manner between the work surfaces. The distance between the work disks is measured at least two radially spaced measurement locations of the work gap and in that, from the measured distances, a distance between the work disks is determined at a location of the work gap representing the thickness of the at least one workpiece machined in the work gap. | 06-28-2012 |
| 20130217306 | CMP Groove Depth and Conditioning Disk Monitoring - Some embodiments relate to a chemical mechanical polishing (CMP) system. The CMP system includes a polishing pad having a polishing surface, and a wafer carrier to retain a wafer proximate to the polishing surface during polishing. A motor assembly rotates the polishing pad and concurrently rotates the wafer during polishing of the wafer. A conditioning disk has a conditioning surface that is in frictional engagement with the polishing surface during polishing. A torque measurement element measures a torque exerted by the motor assembly during polishing. A condition surface analyzer determines a surface condition of the conditioning surface or the polishing surface based on the measured torque. Other systems and methods are also disclosed. | 08-22-2013 |
| 20140170936 | WORKING MACHINE - A working machine includes a work piece, at least one signal generator and a detector. The signal generator is disposed beside the work piece for transmitting a signal. The detector is disposed beside the work piece so as to detect the signal transmitted by the signal generator and get a location information of the work piece. | 06-19-2014 |
| 20140302750 | Valve Reseating - Some embodiments comprise an apparatus for reseating valves, where an eccentric, non-rotational motion is applied in a grinding or lapping process. Other embodiments comprise a micrometer that permits repeatable application of pressure against a plate when the apparatus is removed and reinstalled. In yet other embodiments, levered arms provide an expedient mechanism for positioning a reseating apparatus. | 10-09-2014 |
| 20150099426 | Lapping Device with Lapping Control Feature and Method - A head structure for a lapping assembly including a lapping control feature is disclosed. The lapping control feature includes a raised contact surface elevated from a front surface of the head structure of the lapping assembly. A relative position of the workpiece and raised contact surface are aligned to control workpiece thickness and other lapping parameters. In illustrated embodiments, the relative position of the workpiece and raised contact surface are aligned via an adjustment mechanism on the head structure. In illustrated embodiments, the adjustment mechanism is configured to adjust a position of the workpiece relative to the raised contact surface. | 04-09-2015 |
| 20160250735 | POLISHING APPARATUS | 09-01-2016 |
| 451010000 | And feeding of tool or work holder | 11 |
| 20080220694 | CENTERLESS FEED-THROUGH SUPER-FINISHING DEVICE HAVING A LAPPING SYSTEM CONTAINING A FREELY-DISPOSED ABRASIVE - A centerless feed-through super-finishing device including: first and second feed-through rollers having first and second longitudinal outer surfaces; a metallic part having a generally cylindrical section, disposed between the outer surfaces, wherein a longitudinal axis of the cylindrical section is generally aligned with the outer surfaces, the cylindrical section having a metal working surface, the outer surfaces disposed in a near-parallel fashion; a rotating mechanism for rotation of the rollers along respective longitudinal axes thereof, and for effecting thereby a rotation of the cylindrical section, wherein an angle between the rollers is selected such that rotation of the rollers propels the cylindrical section between the rollers; and a lapping system including: a lapping tool having a polymeric contact surface disposed to contact the working surface, and a lapping mechanism, associated with the lapping tool, adapted to exert a load on the contact and working surfaces; and abrasive particles, freely disposed between the contact and working surfaces, wherein the contact surface and the lapping mechanism are adapted, and the abrasive particles are selected, such that the relative motion under the load effects lapping of the working surface, and wherein the surfaces of the rollers are covered with a polymeric material. | 09-11-2008 |
| 20080220695 | Apparatus on a flat card or roller card for grinding a fibre processing clothing disposed on a rotating cylinder or a card flat - In an apparatus on a carding machine for grinding a fibre processing clothing on a roller or a card flat, grinding equipment includes at least one grinding element and an infeed device serving to position the grinding element against the clothing. To permit reliable detection and monitoring of the contact between the at least one grinding element and the clothing in a simple manner, a structure-borne noise sensor is associated with the grinding equipment and an electronic evaluator is capable of determining from the structure-borne noise the intensity of the contact between the at least one grinding element and the clothing. | 09-11-2008 |
| 20080248724 | Grinding machine for grinding work pieces between centers and for centerless grinding, as well as grinding method - A grinding machine for grinding work pieces ( | 10-09-2008 |
| 20080254715 | Device grinding method - A device grinding method comprising the steps of holding the undersurface of a protective member which supports a plurality of devices by affixing their front surfaces onto the top surface of the protective member, on the chuck table of a grinding machine and grinding the rear surfaces of the plurality of devices held on the chuck table through the protective member by a grinding means while the chuck table is rotated, to form the thicknesses of the plurality of the devices to have a predetermined value, wherein the metering portion of a non-contact thickness metering equipment is brought to a position right above the rotating rotation locus of a predetermined device out of the plurality of devices supported on the chuck table through the protective member, the rear surfaces of the plurality of devices are ground by the grinding means while the thickness of the rotating predetermined device is measured with the non-contact thickness metering equipment, and the grinding by the grinding means is terminated when the thickness of the device measured with the non-contact thickness metering equipment reaches a predetermined value. | 10-16-2008 |
| 20090036029 | ADVANCED AUTOMATIC DEPOSITION PROFILE TARGETING AND CONTROL BY APPLYING ADVANCED POLISH ENDPOINT SYSTEM FEEDBACK - The present disclosure relates to automatic deposition profile targeting with a combined deposition/polishing apparatus which obtains matching deposition and subsequent polishing profiles by use of feedback data from an advanced polish endpoint system in an advanced process control system. | 02-05-2009 |
| 20100041314 | GEAR MATCHING DEVICE AND GEAR MACHINING APPARATUS - Provided is a gear matching device capable of shortening time taken for the gear matching, and also to provide a gear machining apparatus using the gear matching device. For this purpose, provided is a gear matching device which performs gear matching to establish a rotational phase relationship between a grindstone ( | 02-18-2010 |
| 20110014852 | PICK AND PLACE TOOL GRINDING - The present invention relates to a method and system ( | 01-20-2011 |
| 20110256806 | OPHTHALMIC MACHINE AND METHOD FOR MACHINING AND/OR POLISHING A LENS - The invention relates to an ophthalmic machining machine comprising machining means and means for supporting a blank. The invention is characterised in that the machine is capable of transferring marks to said blank that can be identified by monitoring means for repositioning the blank on said supporting means after machining the opposite surface. The invention also relates to a workholding tool. The invention is characterised in that said supporting means are mounted on a bearing surface, which is oblique in relation to a surface of a carriage, by depression of an opening surrounded by an O-ring seal and a fixed bearing. The invention also relates to a machining method according to which the markings are transferred to a blank, the position of said markings is assessed by monitoring means which position machining means for the machining process, and each surface of the resulting lens is polished with polishing means. | 10-20-2011 |
| 20120122375 | DEVICE FOR MEASURING THE FEED MOTION OF A FINISHING BELT - A device for measuring the feed motion of a finishing belt includes a movable contact section for contacting the finishing belt, wherein a movement of the finishing belt can be transferred to the contact section, and a sensor device including a sensor and a reference section cooperating with the sensor, wherein the reference section or the sensor is motionally coupled with the contact section. | 05-17-2012 |
| 20130225047 | HONING TOOL HOLDER WITH A FEED SYSTEM POWERED BY THROUGH-THE-SPINDLE COOLANT PRESSURE AND ACTUATED BY SPINDLE ROTATION - A honing tool holder utilizes pressure of a through-the-spindle coolant delivery system for automatically feeding the honing elements or stones of an attached honing tool when in the bore of a work piece, and for automatically stopping the feeding when a particular condition such as a bore size, is reached, so as to enable use of an in-process adjustable feed honing tool in a machine tool, machining center, or the like, lacking a feed mechanism or system but including a coolant delivery system. The holder can also include apparatus to automatically prevent feed past a limit. Both the feed force and feed limit can be adjustable, at least the latter by simple movements of the tool holder by the machine tool. | 08-29-2013 |
| 20130260646 | LOAD CUP SUBSTRATE SENSING - Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer. | 10-03-2013 |
