Entries |
Document | Title | Date |
20080214026 | ELECTRONIC ASSEMBLY HAVING AN ELECTRICAL CONNECTOR ATTACHED TO A PRINTED CIRCUIT BOARD, AND A WIRE PASSING THROUGH A THROUGH-HOLE ON THE PRINTED CIRCUIT BOARD - An electronic assembly is provided that that includes a printed circuit board, an electrical connector attached to the printed circuit board, and a wire. A first end of the wire is attached to a signal pathway of one of the wafer modules of the electrical connector so as to electrically connect the wire and the signal pathway. The wire passes through a through-hole on the printed circuit board that corresponds to the signal pathway, and a second end of the wire is electrically connected to the printed circuit board or another of the wafer modules of the electrical connector. | 09-04-2008 |
20080220627 | IC package having improved structure - An electrical connector assembly comprises an insulative housing having a base, with a mating interface, and a mounting interface corresponding to the mating face. The base has peripheral walls extending upwardly from the mating face. A plurality of contacts arranged in the base of the insulative housing. At least a pair of cantilevered push fingers formed on two adjacent walls for pushing the integrated circuit module toward opposing walls. At least a support device formed on the bottom of the push finger. | 09-11-2008 |
20080248660 | HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR WITH SELECTIVE POSITIONING OF LOSSY REGIONS - An electrical interconnection system with high speed, high density electrical connectors. The connectors incorporate electrically lossy material, selectively positioned to reduce crosstalk without undesirably attenuating signals. The lossy material may be molded through ground conductors that separate adjacent differential pairs within columns of conductive elements in the connector. However, regions of lossy material may be set back from the edges of the ground conductors to avoid undesired attenuation of signals. Also, the lossy material may be positioned in multiple regions along the length of signal conductors. The regions may be separated by holes, notches, gaps or other openings in the lossy material, which can be simply formed as part of a molding operation. | 10-09-2008 |
20080299792 | Burn-in socket having loading plate with uneven seating surface - A burn-in socket for receiving an IC package includes a base defining an opening for loading the IC package. A loading plate is mounted within the base. The loading plate has a seating surface with a number of holes defined therein. A contact socket is located under the loading plate. A number of contacts are received in the contact socket. Each contact has one end extending into the hole in the seating surface of the loading plate for contact with a solder ball of the IC package. The seating surface comprises at least one lower plane and at least one upper plane. At least the upper plane is formed with the holes. | 12-04-2008 |
20080299793 | Burn-in socket having pick-up arrangement for quickly pick-up IC package after IC package is tested - A burn-in socket for receiving an IC package ( | 12-04-2008 |
20080299794 | Electrical card connector assembly - An electrical card connector assembly includes an electrical card connector ( | 12-04-2008 |
20080305655 | PIN GRID ARRAY PACKAGE SUBSTRATE INCLUDING PINS HAVING ANCHORING ELEMENTS - A microelectronic package substrate and an electrically conductive pin. The substrates includes: a die-side surface adapted to receive a die thereon; a PCB-side surface adapted to be mechanically and electrically bonded to a PCB; an array of land pads on the PCB-side surface, the land pads defining anchoring recesses therein; an array of electrically conductive pins electrically and mechanically bonded to respective ones of the land pads, the pins having anchoring elements thereon mated with corresponding ones of the anchoring recesses of the land pads, the anchoring elements and anchoring recesses being configured such that a mating thereof inhibits a tilting of the pins on the land pads; and a plurality of pin-attach solder joints mechanically and electrically bonding the pins to corresponding ones of the land pads. | 12-11-2008 |
20080305656 | ELECTRICAL CONNECTOR ASSEMBLY WITH FLOATABLY ARRANGED WAFER - Provided is an electrical connector assembly comprises a supporting frame defining different sections arranged adjacent to each other. Each has generally a rectangular configuration with supporting surfaces along inner peripheral. A plurality of wafers each is supportively received in the section along its bottom edges by the supporting surfaces. Each wafer includes a plurality of contact terminals each arranged in the wafer. Each contact terminal has a tail portion extending beyond the bottom surface. A pick-up cap is properly attached to the supporting frame to position the wafer. | 12-11-2008 |
20080311769 | Anistropic Conductive Connector, Conversion Adapter for Inspection Device Having the Anisotropic Conductive Connector, and Method for Manufacturing the Anistropic Conductive Connector - The anisotropically conductive connector | 12-18-2008 |
20080311770 | Socket having aligning keys for accommodating different sizes of integrated chips - A socket connector is provided for accommodating different sizes of chips and a printed circuit board and includes an insulative housing and a plurality of contacts embedded in the housing. The housing includes a conductive region and a margin region around the conductive region, and defines a supporting surface and a mounting surface opposite to the supporting surface. A number of passageways for accommodated the contacts extending through the isulative housing. Sidewalls extend upwardly from the margin region with a plurality of location blocks extending to the conductive region. The location blocks and the sidewalls are unitarily formed. A number of engaging grooves are defined in the margin region for assembling a number of aligning keys can be assembled to the respond engaging grooves for accommodating different sizes of chips. | 12-18-2008 |
20080318445 | Electrical connector with improved housing - An electrical connector for interconnecting integrated circuits (ICs) to a circuit board, includes a number of contacts ( | 12-25-2008 |
20090011621 | Reversibe universal serial bus connection interface for USB connectors and universal serial bus ports - A universal serial bus (USB) interface connection for one of a USB connector and a USB port of a device comprises an insulating substrate including a first side and a second side. First, second, third and fourth conductors are arranged adjacent to each other on the first side of the insulating substrate and have a port side and a second side. First, second, third and fourth conductors are arranged adjacent to each other on the second side of the insulating substrate and have a port side and a second side. The USB connector can be connected in first and second orientations. | 01-08-2009 |
20090029571 | SOCKET HAVING FASTENING MECHANISM FOR RECEIVING SENSOR - A socket connector for settling an integrated circuit module therein and connecting a sensor therewith comprises a base, a center plate mounted on the base, a plurality of contacts retained on the center plate and a retaining member. The base defines a slot for receiving the retaining member and a fastening hole for receiving the sensor, the retaining member comprises a blocking abutting against the sensor received in the fastening hole and a spring urging the blocking toward the sensor. | 01-29-2009 |
20090035960 | ELECTRICAL CONNECTING APPARATUS - The electrical connecting apparatus disclosed herein includes a frame member having a recess for receiving a device under test provided with a plurality of electrodes, a plurality of contacts provided in correspondence to the electrodes, a plurality of slots formed in the bottom portion of the recess of the frame member and arranged parallel to each other so as to receive the contacts such that the tip of each contact can abut the corresponding electrode, an elastic member disposed across the slots over the bottom portion within the recess to elastically hold the contacts, and a cap member mounted on the frame member and sandwiching the elastic body together with the frame member. | 02-05-2009 |
20090047807 | Land grid array connector - An LGA connector ( | 02-19-2009 |
20090047808 | Electrical connector - The present invention provides an electrical connector for electrical connecting an IC package having a plurality of pins to a PCB. The electrical connector comprises a base defining a plurality of passageways, a plurality of contacts received in the passageways, and a cover moveable relative to the base from a first position to a second position. The cover defines a plurality of through holes corresponding the passageway. The contacts each have a contacting portion disposed in the through hole. When the cover is at the first position, the pins of the con IC package do not contact with the contacting portions of the contacts; and when the cover is at the second position, the pins contact with the contacting portions in the through holes of the cove. | 02-19-2009 |
20090047809 | Electrical connector having stiffener fastened by groups of one-step screw post and mating sleeve - One-step screws ( | 02-19-2009 |
20090053910 | PRINTED BOARD WITH COMPONENT MOUNTING PIN - A printed circuit board according to the present invention is a printed circuit board ( | 02-26-2009 |
20090053911 | PRINTED BOARD WITH COMPONENT MOUNTING PIN - A printed circuit board according to the present invention is a printed circuit board ( | 02-26-2009 |
20090061654 | Socket with bolt - A socket, for electrically connecting an IC package and a printed circuit board, comprises a base received with a plurality of contacts, a stiffener surrounding the base and bolts mounting the socket to the printed circuit board. The stiffener has a horizontal plate, which has engaging holes by drawing, so the engaging hole has a sidewall extending beyond the horizontal plate to keep the bolt in the engaging hole of the stiffener. | 03-05-2009 |
20090068861 | Apparatus and method for adjusting position of electronic component - An apparatus, includes a plurality of pins which include a longitudinal axis, each of the pins to be respectively electronically contacted with each of a plurality of terminals of an electronic component by pressing each of the terminals onto each of the pins from a direction corresponding to the longitudinal axis, and an adjusting unit which adjusts a position of the electronic component so that each of the terminals corresponds to each of the pins respectively. | 03-12-2009 |
20090075499 | IC socket - An IC socket comprises an insulative housing having a plurality of periphery walls and a cover pivotally assembled to one end of the insulative housing and adapted to be locked to the insulative housing at the other end. The cover includes a plurality of peripheral edges. The cover also has a plurality of spring arms upwardly extending therefrom and disposed at the edges. | 03-19-2009 |
20090111291 | Information storage card holding structure and electrical device using the same - An information storage card holding structure and an electric device using the same are provided. The electric device includes a circuit board and an information storage card holding structure. The holding structure, making an information storage card selectively electrically connected to several metallic points placed on a surface of the circuit board, includes a containing element, a crutch, a protrusion and a slide. The containing element contains the information storage card. The crutch supports the containing element. The slide is coupled to the protrusion. The protrusion is disposed on one of the containing element and the crutch. The slide is disposed on the other of the two. When the protrusion is located on a first regain track, the information storage card has a first gap to the surface. When the protrusion is located on a second regain track, the information storage card has a second gap to the surface. | 04-30-2009 |
20090163051 | Socket for semiconductor device - A socket for a semiconductor device which can be used in a multipurpose manner with plural semiconductor device having electrode terminals of varying shapes. The socket for a semiconductor device according to an embodiment of this invention has a contact terminal placing an electrode terminal of the semiconductor device in abutment and electrical connection, an IC mount mounting a substrate face forming an electrode terminal of the semiconductor device, and an adjustable IC mount shifting unit enabling adjustment of a separation distance of an upper surface of the contact terminal and an upper surface of the IC mount in order to maintain normal electrical connection between the contact terminal and an electrode terminal of the semiconductor device irrespective of the shape of an electrode terminal of the semiconductor device. | 06-25-2009 |
20090197437 | SOCKET, METHOD FOR MANUFACTURING SOCKET, AND SEMICONDUCTOR DEVICE - A socket includes an insulating elastomeric sheet having a penetration hole, metal circuits formed on at least one of the front and rear surfaces of the elastomeric sheet, and a through-hole having a metal film formed on an inner wall of the penetration hole. The metal circuit on the front surface of the elastomeric sheet is electrically connected to the metal circuit on the rear surface of the elastomeric sheet via the through-hole. With such a configuration of the socket, it is possible to provide a socket contact terminal and a semiconductor device having the same, which is suitable for low-resistance, large-current, and high-speed configurations. | 08-06-2009 |
20090246982 | Ic socket having detachable aligning element - An IC socket includes a socket body defining a first receiving cavity with a bottom wall, a cover attached pivotally on one end of the socket body and a locking member for locking the cover to the socket body. The IC socket further includes four detachable aligning elements mounted on four corners of the bottom wall. The four aligning elements have a plurality of positioning surfaces adapted for corporately defining a second receiving cavity for snugly accommodating an IC package therein. Different aligning elements with different dimensions can be replaced to mount on the socket body for different IC packages, thus a cost of manufacturing is reduced. | 10-01-2009 |
20090253276 | Burn-in socket - A burn-in socket for testing an integral circuit package includes a base defining a cavity, an adapter received in the cavity of the base, an alignment plate secured to the adapter, and a cover movable mounted to the base. The alignment plate is detachable assembled to the adapter so as to the burn-in socket can apply to different IC package when the alignment plate is replaced with another. | 10-08-2009 |
20090253277 | Test socket with discrete guiding posts defining side walls - A test socket, adapted for electrically connecting an IC package to a printed circuit board, comprises a bottom board ( | 10-08-2009 |
20090263987 | Burn-in socket having protecting device - A burn-in socket includes a base, a number of contacts received in the base, and a protecting device. The base has a first projection and a second projection. The protecting device is assembled to the base and moves from a first position to a second position relative to the base. The protecting device includes a planar bottom plate and a pair of spring arms extending upwardly from opposite sides of the bottom plate. Each spring arm has a first stopper for engaging with the first projection at the first position, and a second stopper for engaging with the second projection at the second position. | 10-22-2009 |
20090286409 | ELECTRICAL CONNECTOR HAVING A BOTTOM PLATE WITH TWO SEPARATED PARTS ASSEMBLED TO A BASE - An electrical connector ( | 11-19-2009 |
20090291573 | PROBE CARD ASSEMBLY AND KIT, AND METHODS OF MAKING SAME - A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described. | 11-26-2009 |
20090305524 | ELECTRICAL CONNECTOR ASSEMBLY WITH HEAT DISSIPATING DEVICE - An electrical connector assembly for electrically connecting an electrical package to a printed circular board, includes an electrical connector mounted on a printed circular board, and a heat dissipating device located upon the electrical package. The heat dissipating device includes a supporting body located upon the electrical connector, two latching pieces retaining the supporting body and heat pipes assembled on the supporting body. The latching piece rivets with the supporting body on a center part thereof, so when one end of the latching pieces is pressed downwardly, the opposite end will not be influenced. | 12-10-2009 |
20090317988 | BURN-IN SOCKET WITH ADAPTER FOR LOADING IC PACKAGE - A burn-in socket for receiving an IC package comprises a base defining a cavity for receiving the IC package and an adapter retained in the cavity. The adapter has two-pieces configuration and comprises a loading board for loading the IC package and a positioning board assembled upon the bottom plate of the loading board for positioning the IC package. | 12-24-2009 |
20100062621 | Horizontal Dual In-line Memory Modules - Horizontal dual in-line memory modules are disclosed. In one embodiment, the memory module includes a circuit board, a plurality of memory chips attached to a top surface of the circuit board, and a plurality of connector contacts disposed under a back surface of the circuit board and extending away from the memory chips, the connector contacts being electrically coupled to the memory chips, the back surface opposite the top surface of the circuit board. | 03-11-2010 |
20100099277 | ELECTRICAL CONNECTING APPARATUS - An embodiment of an electrical connecting apparatus comprises an electrical insulating plate, an elastic plate made of an electrical insulating material arranged on the electrical insulating plate, a sheet-like conductive plate arranged on the elastic plate, and first and second contacts. The conductive plate comprises a hole area having at least one first hole portion allowing the probe tip portion of the first contact to abut to the conductive plate and a plurality of second hole portions not allowing the probe tip portions of the second contacts to abut thereon regardless of whether or not overdriving acts on the contacts. | 04-22-2010 |
20100120268 | SOCKET WITH IMPROVED LOAD PLATE - A socket for electrically connecting an IC package to a printed circuit board, comprises an insulative housing, a stiffener surrounding the housing and having a front wall defining a hole; and a load plate pivotably mounted to the front wall of the stiffener. The load plate has a pivotal portion with a hook, the hook has a latching finger engaging with the latching hole of the stiffener, a protruding finger and a gap defined between the latching finger and the protruding finger. The protruding finger resists the stiffener when the load plate deflects on a top-to-bottom direction relative to the stiffener. The protruding finger also can engage with the stiffener to guide the load plate to rotate in a correct direction. | 05-13-2010 |
20100120269 | SOCKET FOR TESTING SEMICONDUCTOR PACKAGE - A socket adapted for electrically connecting a semiconductor package to a printed circuit board, includes a main body defining a number of contact passageways and a plurality of contacts received in the contact passageways of the main body. Each contact has a base portion, a first contacting portion and a second contacting portion upwardly extending from the base portion, and a spring arm bent from a bottom edge of the base portion. The spring arm extends substantially in a horizontal direction and is bent downwardly at a free end thereof to form a tail. The spring arm can deform to provide an elastic force for the tail to press against the printed circuit board. | 05-13-2010 |
20100130030 | IC SOCKET HAVING AN IMPROVED LOCKING ARRANGEMENT AND METHOD OF MAKING THE SAME - An IC socket ( | 05-27-2010 |
20100144167 | Electrical Connector System - High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz. | 06-10-2010 |
20100144168 | Electrical Connector System - High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz. | 06-10-2010 |
20100144169 | ELECTRICAL CONNECTOR SYSTEM - High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz. | 06-10-2010 |
20100151706 | Land Grid Array (LGA) Socket for Various Package Sizes - An LGA socket for receiving substrate packages of various sizes and a method of fabricating the socket. In an embodiment, the socket has a planar surface for seating a substrate package. Socket contacts are disposed on the planar surface in a layout common to the layout of interconnects formed on the bottom of substrate packages the socket is designed to receive. A plurality of socket locating features is formed on the socket body to prevent lateral displacement of a reference substrate package. A corresponding number of package locating features are formed on the substrate body of packages larger than the reference substrate package. Each of the socket locating features meshes with the corresponding package locating feature of the larger package. | 06-17-2010 |
20100330822 | ELECTRICAL CONNECTOR HAVING CONTACT WITH UPPER TERMINAL AND LOWER TERMINAL - An electrical connector includes an insulative housing and a plurality of contacts. The insulative housing have a top surface, a bottom surface, and a plurality of passageways extending through the top and the bottom surfaces. Each contact includes an upper terminal mounted into the passageway form the top surface and a lower terminal mounted into the passageway from the bottom surface. The upper terminal is configured with an upper retention portion and an upper spring arm extending beyond the top surface of the insulative housing. The lower terminal is configured with a lower retention portion, a lower spring arm extending beyond the bottom surface of the insulative housing, and a lower engaging portion extending upwardly from the lower retention portion to elastically contact with the upper terminal. | 12-30-2010 |
20110014802 | Vertically Stackable Sockets for Chip Modules - The socket system comprises a set of vertically-stackable sockets. A first socket mounts on a printed circuit board to receive a first chip module, and a second socket stacks on the first socket to receive a second chip module. The first socket includes a first set of embedded contacts to electrically connect the first chip module to the printed circuit board, and a second set of embedded contacts to electrically connect the second socket to the printed circuit board. The second socket includes a third set of embedded contacts to electrically connect the second chip module to the printed circuit board. System upgrades are enabled by replacing the chip modules. | 01-20-2011 |
20110034044 | ELECTRICAL CONNECTOR ASSEMBLY AND LOADING EQUIPMENT THEREOF - An electrical connector assembly, comprises a base ( | 02-10-2011 |
20110097909 | INTERCONNECT STRUCTURE WITH CAVITY HAVING ONE OR SEVERAL CONTACT RISES ON THE WALL OF THE CAVITY AND METHOD FOR PRODUCING SAME - The invention concerns an interconnect device comprising a support ( | 04-28-2011 |
20110104913 | Edge card connector having solder balls and related methods - An edge card connector includes: a substantially rigid, insulating housing having internal electrical contacts to engage the edge of a first circuit board inserted into the housing; solder balls arranged on an outer surface of the housing in a selected pattern to establish connections to corresponding conductive pads on a second circuit board when the solder balls are at least partially melted; and, electrical connections between the internal electrical contacts and the solder balls. The socket may contain additional features for added strength, ease of assembly, and other purposes. The system is assembled by placing the socket onto a circuit board, aligning the solder balls with respective contact pads, and fusing the solder balls to establish electrical connectivity. A standoff structure may be provided to avoid excessive compaction of the solder balls. | 05-05-2011 |
20110171840 | SEMICONDUCTOR DEVICE SOCKET - A contact terminal ( | 07-14-2011 |
20110275229 | ELECTRICAL CONNECTOR HAVING PASSAGEWAY WITH HARD STOP PREVENTING OVER-COMPRESSION DURING DOWNWARD OPERATION - An electrical connector including an insulative housing and a number of terminals. The insulative housing includes an upper substrate and a lower substrate. The upper substrate defines an array of upper holes and the lower substrate defines an array of lower holes corresponding to the upper holes. The terminals are received in the upper and lower holes and each comprises an upper contact, a lower contact electrically connecting with the upper contact and a spring located between the upper contact and the lower contact. The upper contact protrudes a restricting portion for restricting the spring. A diameter of the lower hole is less than that of the upper hole and a distance of the restricting portion. So a top surface of the lower substrate supports the restricting portion. | 11-10-2011 |
20110281445 | SOCKET CONNECTOR ASSEMBLY WITH COMPRESSIVE CONTACTS - A socket connector assembly includes a housing, signal terminals, and a power module subassembly. The housing is mounted to a circuit board and includes opposing walls having internal surfaces. The signal terminals are joined to the internal surfaces of the walls and engage conductive members disposed along side edges of an electronic package that is received into the housing between the walls. The power module subassembly is coupled to the circuit board between the walls of the housing. The power module subassembly includes a power contact configured to engage a current carrying conductor disposed on a surface of the electronic package that extends between the side edges of the electronic package. | 11-17-2011 |
20110287639 | INDEPENDENT LOADING MECHANISM FACILITATING INTERCONNECTIONS FOR BOTH CPU AND FLEXIBLE PRINTED CABLE - An electrical connector assembly comprises a central processing unit (CPU), a plurality of cable connectors soldered on the CPU and a CPU socket for electrical connecting the CPU to a printed circuit board (PCB). Each cable connector includes a base having a plurality of first terminals received therein, for contacting with conductive points of the cable. The CPU socket includes an insulating housing having a plurality of second terminals received therein and a loading mechanism attached to the insulating housing. The loading mechanism can simultaneously pressing the cables against the cable connectors and the CPU toward the CPU socket for electrically connecting the CPU with the cables and the PCB. | 11-24-2011 |
20120100730 | SOCKET FOR ELECTRICAL PART - A socket for electrical part mounted on the wiring substrate to accommodate an electrical part. The present invention comprises a socket body, a floating plate and a holding structure. The socket body has a contact pin unit comprising a unit body in which the plural contact pins are mounted. The floating plate is mounted on upper side of the unit body to accommodate the electrical part, and comprises through holes into which the upper side contact portions of contact pins are inserted. The holding structure holds the floating plate in a descended state when the socket for the electrical part is not yet mounted on the wiring substrate, and releases the holding state of floating plate and makes the floating plate to be capable of moving vertically under the state of being urged upward when the socket for the electrical part is mounted on the wiring substrate. | 04-26-2012 |
20120315774 | FLEX TO FLEX CONNECTION DEVICE - A mechanical device for electrically connecting a first flexible assembly to a second flexible assembly comprises a wafer and a housing. The wafer has an insulator core and a plurality of wafer electrical connectors. The core has a first base side and an opposed second base side. The wafer electrical connectors include a first set of wafer electrical connector contacts exposed on the first base side and a second set of wafer electrical connector contacts exposed on the second base side. The wafer electrical connector contacts are adapted to electrically connect with each of the flexible assembly electrical contacts. The housing retains the wafer, the first flexible assembly terminal, and the second flexible assembly terminal in such a way that each of the first flexible assembly electrical contacts is removably secured and electrically connected to one of the wafer electrical connector contacts. | 12-13-2012 |
20120315775 | INSULATED METAL SOCKET - A socket for use in a test system is provided, where the test system is configured to align at least a portion of an electronic device with a plurality of aligned connectors. The socket can include a metal structure having a plurality of openings, the plurality of openings spaced to accommodate the plurality of aligned connectors. At least one opening in the plurality of openings can extend through a thickness of the metal structure and can have an annular inner surface. The annular inner surface can be proximal to at least a portion of a conductive outer surface of at least one aligned connector of the plurality of aligned connectors in the test system. The socket can further include an insulation layer provided on the annular inner surface. | 12-13-2012 |
20130171842 | SOCKET FOR ELECTRIC PARTS - A socket for electric parts which is dawn sized. The socket of the present invention comprises a socket body to accommodate an electric part, plural contact pins disposed to a peripheral edge of the socket body, a latch rotatably located on the socket body so as to positioned above the contact pins, which presses an upper part of the electric part when the latch is closed and is in a state the electric part can be accommodated and taken out when the latch is opened, an operating member which is vertically movably disposed in the socket body and comprises an operating portion for opening constituted so as to press down an operation portion to be operated for opening formed to a central portion in a width direction of the latch and rotate the latch in an opening direction when the operating member moves downward. | 07-04-2013 |
20130224970 | INTEGRATED CIRCUIT SOCKET SYSTEM WITH CONFIGURABLE STRUCTURES AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit socket system includes: forming a retainer plate having a pinhole extending through the retainer plate; forming a base plate having a connector hole extending through the base plate, the connector hole aligned with the pinhole; inserting a compressible pin having a lower probe end through the connector hole and the pinhole below the connector hole, a portion of the compressible pin in the base plate; forming a device plate having a cavity hole extending through the device plate and aligned with the an upper probe end of the compressible pin exposed in the cavity hole; and mounting a removable fastener through the device plate, the base plate, and into the retainer plate, the device plate over the base plate directly on the retainer plate and attached to one another by the removable fastener. | 08-29-2013 |
20130267104 | ELECTRICAL CONNECTOR HAVING CONTACT FOR EITHER BGA OR LGA PACKAGE - An electrical connector for electrically connecting an IC package to a circuit board includes an insulating housing having a plurality of receiving holes and a plurality of contacts received in the receiving holes. Each of the contacts includes a retaining portion engaging with the insulating housing, and a spring arm deforming freely in a certain range, wherein the spring arm includes an elastic deformation portion, a recess portion protruding downwardly from the elastic deformation portion for contacting with a ball grid array (BGA) package and a protrusion portion protruding upwardly from the recess portion for contacting with a land gird array (LGA) package. | 10-10-2013 |
20130344713 | ELECTRICAL CONNECTOR - An electrical connector for electrically connecting an IC package with a substrate and includes an insulative housing with a plurality of contacts received therein, a stiffener located outside of the insulative housing, a holding member and a load plate pivotally assembled to the stiffener, the stiffener includes a first end and a second end opposite to the first end, the holding member is pivotally assembled to the first end of the stiffener for holding and assembling the IC package to the insulative housing, the load plate is configured to frame shape and is pivotally assembled to the second end of the stiffener. | 12-26-2013 |
20130344714 | CONTACT DEVICE, SOCKET DEVICE AND ELECTRONIC APPARATUS - A contact device that electrically connects a first substrate and a second substrate. The contact device includes: a contact that has electrical conductivity and elasticity, the contact including a first terminal that is contactable with a first pad provided on the first substrate and a second terminal that is contactable with a second pad provided on the second substrate, the first terminal and the second terminal being biased in a direction spreading a distance therebetween; and a sheet that has flexibility and heat dissipation, and holds the contact so that the first terminal is arranged opposite to one surface of the sheet and the second terminal is arranged opposite to another surface of the sheet. | 12-26-2013 |
20130344715 | ELECTICAL CONNECTOR ASSEMBLY HAVING A BLOCK FOR STOPING A CHIP MODULE COMING OFF - An electrical connector electrically connecting a chip module to a printed circuit board, and includes an insulative housing, a plurality of terminals received in the insulative housing and a block assembled to the insulative housing, the electrical connector comprises a bottom wall and a plurality of side walls, between the bottom wall and the side walls forms a receiving space to receive the chip module for assembling the chip module from top to bottom in vertical direction, the block is configured with frame shape and comprises a plurality of tabs, the insulative housing comprises a plurality of slots matched with the tabs, the block can prevent the chip module coming off from the insulative housing while the chip module received in the receiving space. | 12-26-2013 |
20140011376 | ELECTRICAL CONNECTOR AND CARRIER THEREOF FOR ASSEMBLING IC PACKAGE - An electrical connector ( | 01-09-2014 |
20140024231 | ELECTRICAL CONNECTOR WITH X-TYPE DUAL SPRING CONTACTS FOR LOWER PROFILE AND LATTICE SHIELDING THEREWITH - An electrical connector for connecting a package and a mother board includes an insulating sheet defining a top surface confronting with the package and a lower surface confronting with the mother board, and a plurality of contacts. The insulating sheet has a plurality of through holes through the top surface and the lower surface thereof and arranged in a matrix. The plurality of contacts is pressed in the corresponding through holes from the top surface of the insulating sheet. Each contact includes a main plate, a pair of first contacting arms from opposite edges of the main plates for contacting with the package and a pair of second contacting arm from another opposite edges of the main plate for contacting with the board. | 01-23-2014 |
20140051269 | ELECTRONIC DEVICE WITH TWO CIRCUIT BOARDS DEDICATED FOR IC CHIP AND CONNECTOR - An exemplary electronic device with integrated circuit chips being on one circuit board and required connector circuits being on another, connectable, circuit board provides modularization and interchangeability for ease of adaptation in manufacture of electronic products utilizing the electronic device. In particular, the IC chips are mounted on a first circuit board, and the connector circuits are mounted on a second circuit board. The first circuit board is mountable to the second circuit board and is electrically connected to the second circuit board. | 02-20-2014 |
20140080328 | ELECTRICAL CONNECTOR WITH A SLEEVE ASSEMBLED THEREON - An electrical connector for electrically connecting an IC package to a printed circuit board includes an insulating housing, a number of contacts received in the insulating housing and at least one sleeve assembled on the insulating housing. The insulating housing includes a bottom wall and a number of side walls extending upwardly from the bottom wall. The bottom wall and the side walls define a cavity for accommodating the IC package. The sleeve is assembled on the side wall and defines a supporting portion towards the cavity. The supporting portion includes a pair of abutting walls perpendicular to each other. | 03-20-2014 |
20140134853 | ELECTRICAL CONNECTOR HAVING A GROUNDING PLATE FOR SHIELDING - An electrical connector electrically connecting a chip module to a printed circuit board includes an insulative housing including a top insulative housing and a bottom insulative housing matched with the top insulative housing, a number of terminals received in the top insulative housing and the bottom insulative housing and at least one shielding plate fixed in the insulative housing and located beside the terminal, the electrical connector further employs a grounding plate assembled between the top insulative housing and the bottom insulative housing, the grounding plate electrically connects with the shielding plate and the shielding plate has a pair of clips fixed to the grounding plate. | 05-15-2014 |
20140162473 | MOBILE INDEPENDENT LOADING MECHANISM - A mobile device assembly comprising a land grid array (LGA) socket configured to couple with a board of a mobile device. The LGA socket may be configured to couple with a component of the mobile device. A mobile independent loading mechanism (ILM) may at least partially overlap the component and couple with the board of the mobile device via one or more fasteners. By coupling with the board of the mobile device, the mobile ILM may therefore apply pressure to the component, securely holding the component to the LGA socket. | 06-12-2014 |
20140162474 | CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN - An apparatus for coupling an integrated circuit to other electronics can include a housing having an exterior and an interior, the exterior having an exterior bottom surface, the interior defined by an interior bottom surface opposite the exterior bottom surface, and at least one sidewall extending away from the interior bottom surface to define an interior shape that is sized to receive the integrated circuit, with the integrated circuit disposed against the interior bottom surface and the at least one sidewall. The example can include a plurality of exterior contacts exposed along the exterior bottom surface in an exterior contact pattern that is generally circular in shape. | 06-12-2014 |
20140242816 | SELECTIVE METALIZATION OF ELECTRICAL CONNECTOR OR SOCKET HOUSING - A electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB. The electrical interconnect includes a multi-layered substrate with a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings. The center openings include at least one cross-section greater than the first and second cross-sections. A plurality of spring probe contact members are located in the center openings. The contact members include first contact tips extending through the first opening and above the first surface, second contact tips extending through the second openings and above the second surface, and center portions located in the center openings. The center portions include a shape adapted to bias the first and second contact tips toward the IC device and PCB, respectively. A dielectric material different from the material of the substrate is located in at least one of the first opening, the second opening, or the center opening. | 08-28-2014 |
20150064941 | IC SOCKET AND CONNECTION TERMINAL - An IC socket includes: a socket main body having a flat plate section in which a plurality of through holes are provided; and a first connection terminal and a second connection terminal that are provided with the through holes of the socket main body, and protrude from an upper side and a lower side of the flat plate section, wherein a capacitor is provided within the first connection terminal. | 03-05-2015 |
20150072541 | CONNECTOR DEVICE FOR BUILDING INTEGRATED PHOTOVOLTAIC DEVICE - The present invention is premised upon a connector device and method that can more easily electrically connect a plurality of PV devices or photovoltaic system components and/or locate these devices/components upon a building structure. It also may optionally provide some additional sub-components (e.g. at least one bypass diode and/or an indicator means) and may enhance the serviceability of the device. | 03-12-2015 |
20150147896 | ELECTRICAL CONNECTOR - An electrical connector includes a circuit board, a chip module, an isolation portion, and at least one liquid metal conductor. Multiple first conducting portions are disposed on the circuit board, and multiple second conducting portions are disposed on the chip module. The second conducting portions correspond to the first conducting portions. The isolation portion is located between the circuit board and the chip module. An upper surface and a lower surface of the isolation portion urge against the chip module and the circuit board respectively. The isolation portion surrounds, joints, and seals the first conducting portion. The at least one liquid metal conductor is correspondingly disposed between the first conducting portion and the second conducting portion, and electrically conducting the circuit board and the chip module. The liquid metal conductor is gallium or gallium alloy. | 05-28-2015 |
20150349441 | ELECTRICAL CONNECTOR ASSEMBLY - An electrical connector assembly, comprises a first connector, and a second connector mounted onto the first connector, a frame surrounding the connectors, a locking member, an actuator, a first lever assemble the locking member to the frame, and a second lever assemble the actuator to the frame. The locking member locks the second lever, a user must firstly press the first lever to make the locking member release the second lever, and next press the second lever to bring the actuator rotate, and then the actuator upwardly push the second connector to apart the second connector from the first connector. | 12-03-2015 |
20150349442 | ELECTRICAL CONNECTOR ASSEMBLY WITH LOCKING MEMBER - An electrical connector assembly comprises a first connector, and a second connector mounted onto the first connector, a frame surrounding the connectors, a locking member, and a lever assemble the locking member to the frame. The locking member has a main body pivoting to the frame, a supporting portion being seated by the lever and a pushing portion. The main body locks the second connector, a user can press the lever to make the locking member to rotate, then to release the second connector, and upwardly push the second connector to apart the second connector from the first connector. | 12-03-2015 |
20150359122 | SOCKET FOR SEMICONDUCTOR COMPONENT, PRINTED CIRCUIT BOARD UNIT, AND INFORMATION PROCESSING APPARATUS - A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board. | 12-10-2015 |
20160006149 | LOOPED SOCKET PIN - Methods and apparatuses, wherein the method includes creating a surface mount socket pin for integrated circuit packaging. The method couples a first conductive element to a second conductive element, wherein the closed loop conductor is configured to provide two paths between the first conductive element and second conductive element, wherein a central region of the closed loop conductor is configured to engage with a plurality of symmetrical bumps in a mold to secure the closed loop conductor, wherein the closed loop conductor is elastic. | 01-07-2016 |
20160087358 | CARD CONNECTOR AND ELECTRONIC DEVICE INCLUDING THE SAME - A slim card connector is provided. The slim card connector includes a board in which a plurality of openings are arranged at an interval and a plurality of contact terminals provided in the board to be received in the openings, wherein the contact terminals are received in the openings, respectively, when the contact terminals are in contact with a card. | 03-24-2016 |
20160197421 | ELECTRICAL CONNECTOR ASSEMBLY WITH HOLDING MEMBER | 07-07-2016 |
20190148859 | SOCKET CONNECTOR ASSEMBLY FOR AN ELECTRONIC PACKAGE | 05-16-2019 |
20190148860 | SOCKET CONNECTOR FOR AN ELECTRONIC PACKAGE | 05-16-2019 |